US20100320367A1 - Method for making camera modules and camera module made thereby - Google Patents
Method for making camera modules and camera module made thereby Download PDFInfo
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- US20100320367A1 US20100320367A1 US12/854,328 US85432810A US2010320367A1 US 20100320367 A1 US20100320367 A1 US 20100320367A1 US 85432810 A US85432810 A US 85432810A US 2010320367 A1 US2010320367 A1 US 2010320367A1
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- sensor chip
- lens assemblies
- wafer
- barrel
- lens
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- 238000000034 method Methods 0.000 title abstract description 25
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000000712 assembly Effects 0.000 abstract description 32
- 238000000429 assembly Methods 0.000 abstract description 32
- 239000000758 substrate Substances 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 238000005520 cutting process Methods 0.000 abstract description 8
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Definitions
- the invention relates to a method for making camera modules, more particularly to a method for making camera modules in a manner of wafer level packaging.
- the invention also relates to a camera module made by the method.
- Taiwanese Utility Model No. M314431 discloses a camera module 1 including a substrate 11 , a sensor chip assembly 12 , and a lens assembly 13 .
- the sensor chip assembly 12 is mounted on the substrate 11 , and is electrically connected to the substrate 11 via solder balls 121 .
- the lens assembly 13 covers the sensor chip assembly 12 , and includes a barrel 131 and a lens 132 .
- the aforesaid camera module 1 is made individually. Therefore, the productivity is low and the production cost is relatively high.
- An object of the present invention is to provide a method for making camera modules in a manner of wafer level packaging so that the productivity can be increased and that the production cost and the size of the camera module can be reduced.
- Another object of the present invention is to provide a camera module made by the method of this invention.
- a method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies.
- a camera module in the second aspect of this invention, includes a sensor chip, a lens assembly, and a barrel.
- the sensor chip has a first surface and a second surface opposite to the first surface.
- the lens assembly is mounted on the first surface of the sensor chip and has a cross-section smaller than that of the sensor chip so that the first surface of the sensor chip has an excess surface portion around the lens assembly.
- the barrel is mounted on the excess surface portion of the first surface of the sensor chip and surrounds the lens assembly.
- the barrel has an outer lateral surface flush with a peripheral end of the sensor chip.
- FIG. 1 is a schematic sectional view of a conventional camera module
- FIGS. 2A to 2G are schematic views illustrating consecutive steps of a first preferred embodiment of a method for making camera modules according to this invention
- FIGS. 3A to 3H are schematic views illustrating consecutive steps of a second preferred embodiment of a method for making camera modules according to this invention.
- FIGS. 4A to 4I are schematic views illustrating consecutive steps of a third preferred embodiment of a method for making camera modules according to this invention.
- FIGS. 5A to 5J are schematic views illustrating consecutive steps of a fourth preferred embodiment of a method for making camera modules according to this invention.
- the first preferred embodiment of a method for making camera modules according to this invention includes the steps of:
- a wafer 220 which includes an array of sensor chips 22 , and has a first surface 221 and a second surface 222 opposite to the first surface 221 .
- a surrounding wall 3 is mounted on the first surface 221 of the wafer 220 .
- the surrounding wall 3 extends along the periphery of the wafer 220 .
- the surrounding wall 3 is connected to the first surface 221 of the wafer 220 in a gluing manner.
- a plurality of lens assemblies 24 are simultaneously mounted on the sensor chips 22 , respectively, using an automatic equipment (not shown), thereby defining a plurality of intersecting spacing grooves 4 among the lens assemblies 24 .
- the lens assemblies 24 and the spacing grooves 4 are surrounded by the surrounding wall 3 .
- the lens assemblies 24 are fixed on the first surface 221 of the wafer 220 in a gluing manner.
- Each of the lens assemblies 24 has a light-transmissive portion 241 on top thereof.
- a resin material is filled into the surrounding wall 3 and the spacing grooves 4 to form a substrate layer 210 .
- the substrate layer 210 is substantially flush with the lens assemblies 24 so as to prevent the light-transmissive portion 241 of each of the lens assemblies 24 from being covered with the resin material.
- the resin material is preferably filled into the surrounding wall 3 and the spacing grooves 4 at a plurality of filling spots so as to shorten the filling period.
- a plurality of conductive blocks 23 are mounted on bonding pads (not shown) on the second surface 222 of the wafer 220 using a surface mounting technology after the resin material is solidified.
- the conductive blocks 23 are solder balls.
- the conductive blocks 23 can be conductive bumps.
- the wafer 220 and the substrate layer 210 are cut along intersecting cutting lines 6 each extending along one of the spacing grooves 4 and each intervening the lens assemblies 24 .
- the substrate layer 210 is divided into a plurality of barrels 21 (best shown in FIG. 2G ) respectively surrounding the lens assemblies 24 .
- Each of the camera modules 2 includes the sensor chip 22 , the lens assembly 24 , the barrel 21 , and a plurality of the conductive blocks 23 .
- the sensor chip 22 has a first surface 221 ′ and a second surface 222 ′ opposite to the first surface 221 ′.
- the second surface 222 ′ is provided with a plurality of bonding pads (not shown) thereon.
- the lens assembly 24 is mounted on the first surface 221 ′ of the sensor chip 22 and has the light-transmissive portion 241 on top thereof.
- the lens assembly 24 has a cross-section smaller than that of the sensor chip 22 so that the first surface 221 ′ of the sensor chip 22 has an excess surface portion around the lens assembly 24 .
- the barrel 21 is mounted on the excess surface portion of the first surface 221 ′ of the sensor chip 22 and surrounds the lens assembly 24 .
- the barrel 21 has an outer lateral surface flush with a peripheral end of the sensor chip 22 .
- the barrel 21 is opaque.
- the barrel 21 is made of black epoxy resin.
- the conductive blocks 23 are mounted on the second surface 222 ′ of the sensor chip 22 .
- the conductive blocks 23 are solder balls.
- the conductive blocks 23 can be conductive bumps.
- the second preferred embodiment of a method for making camera modules according to this invention is substantially identical to the first preferred embodiment except for the following.
- a cover layer 250 is mounted on the lens assemblies 24 .
- the cover layer 250 is in the form of a thin circular plate having a diameter identical to an inner diameter of the surrounding wall 3 .
- the cover layer 250 includes a plurality of light-transmissive holes 252 corresponding to the light-transmissive portions 241 of the lens assemblies 24 , and a plurality of injecting holes 251 spaced apart from each other and communicated with the spacing grooves 4 .
- the resin material is filled into the surrounding wall 3 and the spacing grooves 4 via the injecting holes 251 of the cover layer 250 to form the substrate layer 210 .
- the substrate layer 210 has a thickness so that the top surface of the substrate layer 210 is substantially flush with the bottom surface of the cover layer 250 .
- each of the camera modules made by the second preferred embodiment is substantially similar to each of the camera modules 2 made by the first preferred embodiment except that each of the camera modules 2 made by the second preferred embodiment includes a cover 25 .
- the cover 25 is mounted on the barrel 21 and the lens assembly 24 , and has a light-transmissive through hole corresponding to the light-transmissive portion 241 of the lens assembly 24 .
- the cover 25 has an outer lateral surrounding surface substantially flush with the outer lateral surface of the barrel 21 and with the peripheral end of the sensor chip 22 .
- the barrel 21 is mounted between the cover 25 and the sensor chip 22 .
- the third preferred embodiment of a method for making camera modules according to this invention includes the steps of:
- a wafer 220 which includes an array of sensor chips 22 , and has a first surface 221 and a second surface 222 opposite to the first surface 221 .
- a plurality of lens assemblies 24 are simultaneously mounted on the sensor chips 22 , respectively, using an automatic equipment (not shown), thereby defining a plurality of intersecting spacing grooves 4 between the lens assemblies 24 .
- the lens assemblies 24 are fixed on the first surface 221 of the wafer 220 in a gluing manner.
- Each of the lens assemblies 24 has a light-transmissive portion 241 on top thereof.
- a mold 5 which includes an upper mold part 53 , a lower mold part 51 cooperating with the upper mold part 53 to define a mold cavity 55 , and a plurality of ejecting pins 220 opposite to the upper mold part 53 and inserted into the lower mold part 51 .
- the wafer 220 is mounted in the lower mold part 51 .
- the upper mold part 53 is then mounted on the lower mold part 51 so as to close the mold 5 and to receive the wafer 220 with the lens assemblies 24 in the mold cavity 55 .
- the upper mold part 53 includes an upper mold component 531 and a lower mold component 532 cooperating with the upper mold component 531 to define a runner 56 .
- the lower mold component 532 is provided with a plurality of openings 533 communicating with the spacing grooves 4 .
- a resin material is filled into the lower mold part 51 and the spacing grooves 4 through the runner 56 , and the openings 533 of the lower mold component 532 of the upper mold part 53 so as to form a substrate layer 210 by insert molding.
- the resin material is filled into the lower mold part 51 and the spacing grooves 4 through a plurality of the openings 533 so as to shorten the filling period.
- the upper mold part 53 is moved away from the lower mold part 51 , and the ejecting pins 220 are moved upward so as to eject and take the wafer 220 out of the lower mold part 51 .
- a plurality of conductive blocks 23 are mounted on bonding pads (not shown) on the second surface 222 of the wafer 220 using a surface mounting technology.
- the conductive blocks 23 are solder balls.
- the conductive blocks 23 can be conductive bumps.
- the wafer 220 and the substrate layer 210 are cut along intersecting cutting lines 6 each extending along one of the spacing grooves 4 and each intervening the lens assemblies 24 .
- the substrate layer 210 is divided into a plurality of barrels 21 (best shown in FIG. 41 ) respectively surrounding the lens assemblies 24 .
- a plurality of camera modules 2 are made simultaneously by the aforesaid method.
- Each of the camera modules 2 made by the third preferred embodiment of the method of this invention is identical to that made by the first preferred embodiment of the method of this invention.
- the fourth preferred embodiment of a method for making camera modules according to this invention is substantially identical to the third preferred embodiment except for the following.
- a cover layer 250 is mounted on the lens assemblies 24 .
- the cover layer 250 is in the form of a thin circular plate having a diameter identical to an inner diameter of the lower mold part 51 ,
- the cover layer 250 includes a plurality of light-transmissive holes 252 corresponding to the light-transmissive portions 241 of the lens assemblies 24 , and a plurality of injecting holes 251 spaced apart from each other and communicated with the spacing grooves 4 .
- the resin material is filled into the lower mold part 51 and the spacing grooves 4 through the runner 56 , the openings 533 of the lower mold component 532 of the upper mold part 53 , and the injecting holes 251 of the cover layer 250 so as to form a substrate layer 210 by insert molding.
- a plurality of camera modules 2 are made simultaneously by the aforesaid method.
- Each of the camera modules 2 made by the fourth preferred embodiment of the method of this invention is identical to that made by the second preferred embodiment of the method of this invention.
- a plurality of camera modules 2 each having a miniaturized size can be made by the method of this invention. Therefore, the yield is increased and the production cost is reduced.
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Transforming Light Signals Into Electric Signals (AREA)
Abstract
A method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A camera module made by the method is also disclosed.
Description
- This application is a Divisional patent application of co-pending application Ser. No. 12/292,184, filed on 13 Nov. 2008. The entire disclosure of the prior application, Ser. No. 12/292,184, from which an oath or declaration is supplied, is considered a part of the disclosure of the accompanying Divisional/Continuation application and is hereby incorporated by reference.
- This application claims priority of Chinese Application No. 200810029455.0, filed on Jul. 10, 2008.
- 1. Field of the Invention
- The invention relates to a method for making camera modules, more particularly to a method for making camera modules in a manner of wafer level packaging. The invention also relates to a camera module made by the method.
- 2. Description of the Related Art
- Referring to
FIG. 1 , Taiwanese Utility Model No. M314431 discloses a camera module 1 including asubstrate 11, asensor chip assembly 12, and alens assembly 13. Thesensor chip assembly 12 is mounted on thesubstrate 11, and is electrically connected to thesubstrate 11 viasolder balls 121. Thelens assembly 13 covers thesensor chip assembly 12, and includes abarrel 131 and alens 132. - Conventionally, the aforesaid camera module 1 is made individually. Therefore, the productivity is low and the production cost is relatively high.
- An object of the present invention is to provide a method for making camera modules in a manner of wafer level packaging so that the productivity can be increased and that the production cost and the size of the camera module can be reduced.
- Another object of the present invention is to provide a camera module made by the method of this invention.
- In the first aspect of this invention, a method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies.
- In the second aspect of this invention, a camera module includes a sensor chip, a lens assembly, and a barrel. The sensor chip has a first surface and a second surface opposite to the first surface. The lens assembly is mounted on the first surface of the sensor chip and has a cross-section smaller than that of the sensor chip so that the first surface of the sensor chip has an excess surface portion around the lens assembly. The barrel is mounted on the excess surface portion of the first surface of the sensor chip and surrounds the lens assembly. The barrel has an outer lateral surface flush with a peripheral end of the sensor chip.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
-
FIG. 1 is a schematic sectional view of a conventional camera module; -
FIGS. 2A to 2G are schematic views illustrating consecutive steps of a first preferred embodiment of a method for making camera modules according to this invention; -
FIGS. 3A to 3H are schematic views illustrating consecutive steps of a second preferred embodiment of a method for making camera modules according to this invention; -
FIGS. 4A to 4I are schematic views illustrating consecutive steps of a third preferred embodiment of a method for making camera modules according to this invention; and -
FIGS. 5A to 5J are schematic views illustrating consecutive steps of a fourth preferred embodiment of a method for making camera modules according to this invention. - Before the present invention is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.
- Referring to
FIGS. 2A to 2G , the first preferred embodiment of a method for making camera modules according to this invention includes the steps of: - A) providing a wafer:
- Referring to
FIG. 2A , awafer 220 is provided, which includes an array ofsensor chips 22, and has afirst surface 221 and asecond surface 222 opposite to thefirst surface 221. - B) mounting a surrounding wall:
- Referring to
FIG. 2B , a surroundingwall 3 is mounted on thefirst surface 221 of thewafer 220. The surroundingwall 3 extends along the periphery of thewafer 220. In the preferred embodiment, the surroundingwall 3 is connected to thefirst surface 221 of thewafer 220 in a gluing manner. - C) mounting a plurality of lens assemblies:
- Referring to
FIG. 20 , a plurality oflens assemblies 24 are simultaneously mounted on thesensor chips 22, respectively, using an automatic equipment (not shown), thereby defining a plurality of intersectingspacing grooves 4 among thelens assemblies 24. The lens assemblies 24 and thespacing grooves 4 are surrounded by the surroundingwall 3. Thelens assemblies 24 are fixed on thefirst surface 221 of thewafer 220 in a gluing manner. Each of thelens assemblies 24 has a light-transmissive portion 241 on top thereof. - D) filling a resin material:
- Referring to
FIG. 2D , a resin material is filled into the surroundingwall 3 and thespacing grooves 4 to form asubstrate layer 210. In the preferred embodiment, thesubstrate layer 210 is substantially flush with thelens assemblies 24 so as to prevent the light-transmissive portion 241 of each of the lens assemblies 24 from being covered with the resin material. The resin material is preferably filled into the surroundingwall 3 and thespacing grooves 4 at a plurality of filling spots so as to shorten the filling period. - E) mounting a plurality of conductive blocks:
- Referring to
FIG. 2E , a plurality ofconductive blocks 23 are mounted on bonding pads (not shown) on thesecond surface 222 of thewafer 220 using a surface mounting technology after the resin material is solidified. In the preferred embodiment, theconductive blocks 23 are solder balls. Alternatively, theconductive blocks 23 can be conductive bumps. - F) cutting the wafer and the substrate layer:
- Referring to
FIG. 2F , thewafer 220 and thesubstrate layer 210 are cut along intersecting cuttinglines 6 each extending along one of thespacing grooves 4 and each intervening thelens assemblies 24. Thesubstrate layer 210 is divided into a plurality of barrels 21 (best shown inFIG. 2G ) respectively surrounding thelens assemblies 24. - Referring to
FIG. 2G , a plurality ofcamera modules 2 are made simultaneously by the aforesaid method. Each of thecamera modules 2 includes thesensor chip 22, thelens assembly 24, thebarrel 21, and a plurality of the conductive blocks 23. - The
sensor chip 22 has afirst surface 221′ and asecond surface 222′ opposite to thefirst surface 221′. Thesecond surface 222′ is provided with a plurality of bonding pads (not shown) thereon. - The
lens assembly 24 is mounted on thefirst surface 221′ of thesensor chip 22 and has the light-transmissive portion 241 on top thereof. Thelens assembly 24 has a cross-section smaller than that of thesensor chip 22 so that thefirst surface 221′ of thesensor chip 22 has an excess surface portion around thelens assembly 24. - The
barrel 21 is mounted on the excess surface portion of thefirst surface 221′ of thesensor chip 22 and surrounds thelens assembly 24. Thebarrel 21 has an outer lateral surface flush with a peripheral end of thesensor chip 22. Thebarrel 21 is opaque. In the preferred embodiment, thebarrel 21 is made of black epoxy resin. - The conductive blocks 23 are mounted on the
second surface 222′ of thesensor chip 22. In the preferred embodiment, theconductive blocks 23 are solder balls. Alternatively, theconductive blocks 23 can be conductive bumps. - Referring to
FIGS. 3A to 3H , the second preferred embodiment of a method for making camera modules according to this invention is substantially identical to the first preferred embodiment except for the following. - Referring to
FIG. 3D , after thelens assemblies 24 are simultaneously mounted on the sensor chips 22, respectively, acover layer 250 is mounted on thelens assemblies 24. Thecover layer 250 is in the form of a thin circular plate having a diameter identical to an inner diameter of the surroundingwall 3. Thecover layer 250 includes a plurality of light-transmissive holes 252 corresponding to the light-transmissive portions 241 of thelens assemblies 24, and a plurality of injectingholes 251 spaced apart from each other and communicated with thespacing grooves 4. - Referring to
FIG. 3E , after thecover layer 250 is mounted on thelens assemblies 24, the resin material is filled into the surroundingwall 3 and thespacing grooves 4 via the injecting holes 251 of thecover layer 250 to form thesubstrate layer 210. In the preferred embodiment, thesubstrate layer 210 has a thickness so that the top surface of thesubstrate layer 210 is substantially flush with the bottom surface of thecover layer 250. - Referring to
FIG. 3H , each of the camera modules made by the second preferred embodiment is substantially similar to each of thecamera modules 2 made by the first preferred embodiment except that each of thecamera modules 2 made by the second preferred embodiment includes acover 25. Thecover 25 is mounted on thebarrel 21 and thelens assembly 24, and has a light-transmissive through hole corresponding to the light-transmissive portion 241 of thelens assembly 24. Thecover 25 has an outer lateral surrounding surface substantially flush with the outer lateral surface of thebarrel 21 and with the peripheral end of thesensor chip 22. Thebarrel 21 is mounted between thecover 25 and thesensor chip 22. - Referring to
FIGS. 4A to 4I , the third preferred embodiment of a method for making camera modules according to this invention includes the steps of: - I) providing a wafer:
- Referring to
FIG. 4A , awafer 220 is provided, which includes an array ofsensor chips 22, and has afirst surface 221 and asecond surface 222 opposite to thefirst surface 221. - II) mounting a plurality of lens assemblies:
- Referring to
FIG. 48 , a plurality oflens assemblies 24 are simultaneously mounted on the sensor chips 22, respectively, using an automatic equipment (not shown), thereby defining a plurality of intersectingspacing grooves 4 between thelens assemblies 24. Thelens assemblies 24 are fixed on thefirst surface 221 of thewafer 220 in a gluing manner. Each of thelens assemblies 24 has a light-transmissive portion 241 on top thereof. - III) mounting the wafer in a mold:
- Referring to
FIGS. 4C and 4D , amold 5 is provided, which includes anupper mold part 53, alower mold part 51 cooperating with theupper mold part 53 to define amold cavity 55, and a plurality of ejectingpins 220 opposite to theupper mold part 53 and inserted into thelower mold part 51. Thewafer 220 is mounted in thelower mold part 51. Theupper mold part 53 is then mounted on thelower mold part 51 so as to close themold 5 and to receive thewafer 220 with thelens assemblies 24 in themold cavity 55. Theupper mold part 53 includes anupper mold component 531 and alower mold component 532 cooperating with theupper mold component 531 to define arunner 56. Thelower mold component 532 is provided with a plurality ofopenings 533 communicating with thespacing grooves 4. - IV) filling a resin material:
- Referring to
FIG. 4E , a resin material is filled into thelower mold part 51 and thespacing grooves 4 through therunner 56, and theopenings 533 of thelower mold component 532 of theupper mold part 53 so as to form asubstrate layer 210 by insert molding. In the preferred embodiment, the resin material is filled into thelower mold part 51 and thespacing grooves 4 through a plurality of theopenings 533 so as to shorten the filling period. - V) taking the wafer out of the mold:
- Referring to
FIGS. 4E and 4F , after the resin material is solidified, theupper mold part 53 is moved away from thelower mold part 51, and the ejecting pins 220 are moved upward so as to eject and take thewafer 220 out of thelower mold part 51. - VI) mounting a plurality of conductive blocks:
- Referring to
FIG. 4G , a plurality ofconductive blocks 23 are mounted on bonding pads (not shown) on thesecond surface 222 of thewafer 220 using a surface mounting technology. In the preferred embodiment, theconductive blocks 23 are solder balls. Alternatively, theconductive blocks 23 can be conductive bumps. - VII) cutting the wafer and the substrate layer:
- Referring to
FIG. 4H , thewafer 220 and thesubstrate layer 210 are cut along intersecting cuttinglines 6 each extending along one of thespacing grooves 4 and each intervening thelens assemblies 24. Thesubstrate layer 210 is divided into a plurality of barrels 21 (best shown inFIG. 41 ) respectively surrounding thelens assemblies 24. - Referring to
FIG. 4I , a plurality ofcamera modules 2 are made simultaneously by the aforesaid method. Each of thecamera modules 2 made by the third preferred embodiment of the method of this invention is identical to that made by the first preferred embodiment of the method of this invention. - Referring to
FIGS. 5A to 5J , the fourth preferred embodiment of a method for making camera modules according to this invention is substantially identical to the third preferred embodiment except for the following. - Referring to
FIG. 5D , after thewafer 220 is mounted in thelower mold part 51, acover layer 250 is mounted on thelens assemblies 24. Thecover layer 250 is in the form of a thin circular plate having a diameter identical to an inner diameter of thelower mold part 51, Thecover layer 250 includes a plurality of light-transmissive holes 252 corresponding to the light-transmissive portions 241 of thelens assemblies 24, and a plurality of injectingholes 251 spaced apart from each other and communicated with thespacing grooves 4. - Referring to
FIGS. 5E and 5F , after themold 5 is closed, the resin material is filled into thelower mold part 51 and thespacing grooves 4 through therunner 56, theopenings 533 of thelower mold component 532 of theupper mold part 53, and the injectingholes 251 of thecover layer 250 so as to form asubstrate layer 210 by insert molding. - Referring to
FIG. 5J , a plurality ofcamera modules 2 are made simultaneously by the aforesaid method. Each of thecamera modules 2 made by the fourth preferred embodiment of the method of this invention is identical to that made by the second preferred embodiment of the method of this invention. - In view of the aforesaid, a plurality of
camera modules 2 each having a miniaturized size can be made by the method of this invention. Therefore, the yield is increased and the production cost is reduced. - While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (5)
1. A lens module, comprising:
a sensor chip having a first surface and a second surface opposite to said first surface;
a lens assembly mounted on said first surface of said sensor chip and having a cross-section smaller than that of said sensor chip so that said first surface of said sensor chip has an excess surface portion around said lens assembly; and
a barrel mounted on said excess surface portion of said first surface of said sensor chip and surrounding said lens assembly, said barrel having an outer lateral surface flush with a peripheral end of said sensor chip.
2. The lens module as claimed in claim 1 , further comprising a cover mounted on said barrel and said lens assembly, and having a light-transmissive throughhole.
3. The lens module as claimed in claim 2 , wherein said cover has an outer lateral surrounding surface substantially flush with the outer lateral surface of said barrel and with said peripheral end of said sensor chip, said barrel being mounted between said cover and said sensor chip.
4. The lens modules as claimed in claim 1 , further comprising a plurality of conductive blocks mounted on said second surface of said sensor chip.
5. lens module as claimed in claim 4 , wherein each of said conductive blocks is selected from the group consisting of a solder ball and a conductive bump.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/854,328 US20100320367A1 (en) | 2008-07-10 | 2010-08-11 | Method for making camera modules and camera module made thereby |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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CN200810029455.0 | 2008-07-10 | ||
CN2008100294550A CN101364568B (en) | 2008-07-10 | 2008-07-10 | Camera module manufacturing method and camera module manufactured thereby |
US12/292,184 US7795066B2 (en) | 2008-07-10 | 2008-11-13 | Method for making camera modules and camera module made thereby |
US12/854,328 US20100320367A1 (en) | 2008-07-10 | 2010-08-11 | Method for making camera modules and camera module made thereby |
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US12/292,184 Division US7795066B2 (en) | 2008-07-10 | 2008-11-13 | Method for making camera modules and camera module made thereby |
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US20100320367A1 true US20100320367A1 (en) | 2010-12-23 |
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US12/292,184 Active US7795066B2 (en) | 2008-07-10 | 2008-11-13 | Method for making camera modules and camera module made thereby |
US12/854,328 Abandoned US20100320367A1 (en) | 2008-07-10 | 2010-08-11 | Method for making camera modules and camera module made thereby |
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US12/292,184 Active US7795066B2 (en) | 2008-07-10 | 2008-11-13 | Method for making camera modules and camera module made thereby |
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US (2) | US7795066B2 (en) |
CN (1) | CN101364568B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120169907A1 (en) * | 2011-01-05 | 2012-07-05 | Jungyul Lee | Focus-free camera module |
US10979610B2 (en) | 2017-02-08 | 2021-04-13 | Ningbo Sunny Opotech Co., Ltd. | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device |
Families Citing this family (7)
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TWI466278B (en) * | 2010-04-06 | 2014-12-21 | Kingpak Tech Inc | Wafer level image sensor packaging structure and manufacturing method for the same |
TWI449162B (en) * | 2010-05-17 | 2014-08-11 | Kingpak Tech Inc | Manufacturing method for wafer level image sensor module with fixed focus |
CN102263113A (en) * | 2010-05-24 | 2011-11-30 | 胜开科技股份有限公司 | Wafer level image sensor module structure with specific focal length and manufacturing method thereof |
TWI437700B (en) | 2010-05-31 | 2014-05-11 | Kingpak Tech Inc | Manufacturing method forwafer level image sensor package structure |
CN102403323B (en) * | 2010-09-16 | 2014-01-29 | 胜开科技股份有限公司 | Wafer level image sensor packaging structure and manufacturing method thereof |
CN105530410B (en) * | 2014-09-30 | 2019-05-07 | 豪威光电子科技(上海)有限公司 | The forming method of camera lens encapsulated modules |
CN110505372B (en) * | 2018-05-18 | 2021-03-09 | 致伸科技股份有限公司 | Method for assembling camera module |
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US20080122055A1 (en) * | 2006-11-28 | 2008-05-29 | Micron Technology Inc. | Method and system for fabricating semiconductor components with lens structures and lens support structures |
US7847411B2 (en) * | 2003-11-07 | 2010-12-07 | Shinko Electric Industries Co., Ltd. | Electronic device and method of manufacturing the same |
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JP3553544B2 (en) * | 2001-12-25 | 2004-08-11 | 日精樹脂工業株式会社 | Composite molding method and injection molding machine for dissimilar materials resin |
JP2004134672A (en) * | 2002-10-11 | 2004-04-30 | Sony Corp | Method and apparatus for manufacturing super-thin semiconductor device and super-thin backlighting type solid-state imaging device |
US7221829B2 (en) * | 2003-02-24 | 2007-05-22 | Ngk Spark Plug Co., Ltd. | Substrate assembly for supporting optical component and method of producing the same |
US20070126912A1 (en) * | 2003-10-27 | 2007-06-07 | Koninklijke Philips Electronics N.V. | Camera module and manufacturing method for such a camera module |
EP1569276A1 (en) * | 2004-02-27 | 2005-08-31 | Heptagon OY | Micro-optics on optoelectronics |
KR100592368B1 (en) * | 2004-07-06 | 2006-06-22 | 삼성전자주식회사 | Ultra-thin module manufacturing method of semiconductor device |
TWM314431U (en) | 2007-01-10 | 2007-06-21 | Powergate Optical Inc | Packaging structure of CCM lens module |
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- 2008-07-10 CN CN2008100294550A patent/CN101364568B/en not_active Expired - Fee Related
- 2008-11-13 US US12/292,184 patent/US7795066B2/en active Active
-
2010
- 2010-08-11 US US12/854,328 patent/US20100320367A1/en not_active Abandoned
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US6154298A (en) * | 1996-04-19 | 2000-11-28 | Rohm Co., Ltd. | Optical communication device |
US7847411B2 (en) * | 2003-11-07 | 2010-12-07 | Shinko Electric Industries Co., Ltd. | Electronic device and method of manufacturing the same |
US20080122055A1 (en) * | 2006-11-28 | 2008-05-29 | Micron Technology Inc. | Method and system for fabricating semiconductor components with lens structures and lens support structures |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20120169907A1 (en) * | 2011-01-05 | 2012-07-05 | Jungyul Lee | Focus-free camera module |
US8792043B2 (en) * | 2011-01-05 | 2014-07-29 | Lg Innotek Co., Ltd. | Focus-fixed camera module |
US10979610B2 (en) | 2017-02-08 | 2021-04-13 | Ningbo Sunny Opotech Co., Ltd. | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device |
Also Published As
Publication number | Publication date |
---|---|
CN101364568A (en) | 2009-02-11 |
CN101364568B (en) | 2011-11-30 |
US7795066B2 (en) | 2010-09-14 |
US20100006966A1 (en) | 2010-01-14 |
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