US20100018690A1 - Thermal conduction principle and device for intercrossed structure having different thermal characteristics - Google Patents

Thermal conduction principle and device for intercrossed structure having different thermal characteristics Download PDF

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US20100018690A1
US20100018690A1 US12/219,475 US21947508A US2010018690A1 US 20100018690 A1 US20100018690 A1 US 20100018690A1 US 21947508 A US21947508 A US 21947508A US 2010018690 A1 US2010018690 A1 US 2010018690A1
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thermal
conductor
partially combined
relay
combined
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Tai-Her Yang
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Priority to US12/219,475 priority Critical patent/US20100018690A1/en
Priority to US12/232,278 priority patent/US20100021678A1/en
Priority to US12/607,396 priority patent/US9303928B2/en
Publication of US20100018690A1 publication Critical patent/US20100018690A1/en
Priority to US14/990,418 priority patent/US10702097B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Definitions

  • the present invention discloses that at least two layers of thermal energy conducting structures in particular intercrossed overlapping layers embodiment are commonly constituted by at least two thermal energy conductive material having at least one of different thermal conductivity coefficient, specific heat capacity, or thermal emissivity, thereby promoting the thermal conducting effect.
  • the cooling or heating source of the first thermal body of the conventional thermal conducting structure constituted by a single material is usually limited by the smaller thermally conducting area of the thermal conducting device, such as that if the heat source of first thermal body is the thermal energy of the heat loss in CPU of computer, or power semiconductor, or light emitting diode (LED), except for heat pipe or other cooling or heating device of the like having full area contact in the enclosed space, then if it is coupled with said thermal bodies for heat dissipating operation, if the thermal conducting structure is made of single material, and even if the thermal conductivity coefficient of the single material is better, its specific heat capacity is usually not the best, such as that if the heat dissipator of CPU, power semiconductor, or light emitting diodes being made of copper material is heavier and expensive, and although it has a better thermal conductivity coefficient and its specific heat capacity is lower than aluminum;
  • thermal conducting structure made of single material is more limited.
  • the present invention innovatively discloses a thermal conduction principle and device for intercrossed structure having different thermal characteristics, wherein the thermal conducting structure of the particular intercrossed overlapping layer construction is made of materials with different thermal conducting characteristics and is different from the conventional thermal conducting device being made of single material, wherein the relay thermal conductor of the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention being made of material with better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or surface thereof, and is coupled with interface thermal conductor at the other end or face thereof, and the other portion is for directly thermal conduct with the second thermal body, wherein said interface thermal conductor having the thermal conducting characteristics with all or at least one of the 1) higher specific heat capacity relative to relay thermal conductor, or 2) a better thermal conductivity coefficient to second thermal body relative to relay thermal conductor, or 3) a better thermal emissivity to second thermal body relative to relay thermal conductor being good is used as the thermal conducting carrier between the relay thermal conductor and the second thermal body; and is
  • FIG. 1 is a schematic view of the three-layer type layer by layer overlapping structure principle of prior art.
  • FIG. 2 is a schematic view of the structure principle showing that the thermal conductive interlayer ( 110 ) is additionally installed between the interface thermal conductor ( 103 ) and the relay thermal conductor ( 102 ) in FIG. 1 of prior art.
  • FIG. 3 is a schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 4 is the first schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 5 is the second schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 6 is the third schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 7 is the fourth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 8 is the fifth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 9 is the sixth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • the present invention innovatively discloses a thermal conduction principle and device for intercrossed structure having different thermal characteristics, wherein the thermal conducting structure of the particular intercrossed overlapping layer construction is made of materials with different thermal conducting characteristics and is different from the conventional thermal conducting device being made of single material, wherein the relay thermal conductor of the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention being made of material with better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or surface thereof, and is coupled with interface thermal conductor at the other end or surface thereof, wherein the relay thermal conductor directly perform thermal conduction with the second thermal body at another part thereof, wherein said interface thermal conductor having the thermal conducting characteristics with all or at least one of the 1) higher specific heat capacity relative to relay thermal conductor, or 2) a better thermal conductivity coefficient to second thermal body relative to relay thermal conductor, or 3) a better thermal emissivity to second thermal body relative to relay thermal conductor being good is used as the thermal conducting carrier between the relay thermal conductor and
  • the multi-layered structure can be partially cross-layered combined under this basis to be the composing structure for thermal transfer to further promote the thermal transfer function; wherein it is described in the following:
  • FIG. 1 is a schematic view of the three-layer type layer by layer overlapping structure principle of prior art.
  • FIG. 2 is a schematic view of the structure principle showing that the thermal conductive interlayer ( 110 ) is additionally installed between the interface thermal conductor ( 103 ) and the relay thermal conductor ( 102 ) in FIG. 1 of prior art.
  • FIG. 1 and FIG. 2 are the basic concept of the layer by layer overlapping multi-layer structure;
  • the heat source of the first thermal body ( 101 ) is the thermal energy of heat loss in CPU of the computer, or power semiconductor, or light emitting diode (LED) which is not directly combined with the interface thermal conductor ( 103 ); as shown in FIG.
  • the heat source of the first thermal body ( 101 ) is the thermal energy of heat loss in CPU of the computer, or power semiconductor, or light emitting diode (LED) which is not directly combined with the thermal conductive interlayer ( 110 ) or the interface thermal conductor ( 103 ), and the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ) also are not directly combined; hence, based on application requirements as well as manufacture and space considerations, the structure can be further promoted by partially cross-layered combining the multi-layered structure to be the composing structure for thermal transfer, i.e under the basis of FIG.
  • LED light emitting diode
  • the thermal conducting surface of first thermal body ( 101 ) is not only combined with the relay thermal conductor ( 102 ), but also partially combined with the interface thermal conductor ( 103 ), wherein the position of thermal conducting surfaces of the first thermal body ( 101 ) for combining with relay thermal conductor ( 102 ) and interface thermal conductor ( 103 ) can be selected according to thermal flow distribution of temperature difference and application conditions.
  • FIG. 3 is a schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 3 are the following:
  • first thermal body ( 101 ) The thermal conducting surface of first thermal body ( 101 ) is partially combined with relay thermal conductor ( 102 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of relay thermal conductor ( 102 ) is partially combined with first thermal body ( 101 ), and partially combined with interface thermal conductor ( 103 );
  • interface thermal conductor ( 103 ) is partially coupled with second thermal body ( 104 );
  • the conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • the first thermal body ( 101 ) can be the heat source or heat absorbing body
  • the second thermal body ( 104 ) can be the heat source or heat absorbing body.
  • FIG. 4 is the first schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 4 are the following:
  • first thermal body ( 101 ) is partially combined with relay thermal conductor ( 102 ), and partially combined with thermal conductive interlayer ( 110 );
  • the thermal conducting surface of relay thermal conductor ( 102 ) is partially combined with first thermal body ( 101 ), and partially combined with thermal conductive interlayer ( 110 );
  • thermal conducting surface of thermal conductive interlayer ( 110 ) is partially combined with interface thermal conductor ( 103 ), partially combined with relay thermal conductor ( 102 ), and partially combined with first thermal body ( 101 );
  • interface thermal conductor ( 103 ) The thermal conducting surface of interface thermal conductor ( 103 ) is partially combined with thermal conductive interlayer ( 110 ), and partially coupled with second thermal body ( 104 );
  • the conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • the first thermal body ( 101 ) can be the heat source or heat absorbing body
  • the second thermal body ( 104 ) can be the heat source or heat absorbing body.
  • FIG. 5 is the second schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 5 are the following:
  • first thermal body ( 101 ) The thermal conducting surface of first thermal body ( 101 ) is combined with relay thermal conductor ( 102 );
  • the thermal conducting surface of relay thermal conductor ( 102 ) is partially combined with first thermal body ( 101 ), partially combined with thermal conductive interlayer ( 110 ), and partially combined with interface thermal conductor ( 103 );
  • thermal conducting surface of thermal conductive interlayer ( 110 ) is partially combined with interface thermal conductor ( 103 ), and partially combined with relay thermal conductor ( 102 );
  • interface thermal conductor ( 103 ) The thermal conducting surface of interface thermal conductor ( 103 ) is partially combined with thermal conductive interlayer ( 110 ), partially combined with relay thermal conductor ( 102 ), and partially coupled with second thermal body ( 104 );
  • the first thermal body ( 101 ) can be the heat source or heat absorbing body
  • the second thermal body ( 104 ) can be the heat source or heat absorbing body.
  • FIG. 6 is the third schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 6 are the following:
  • the thermal conducting surface of first thermal body ( 101 ) is partially combined with relay thermal conductor ( 102 ), partially combined with thermal conductive interlayer ( 110 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of relay thermal conductor ( 102 ) is partially combined with first thermal body ( 101 ), and partially combined with thermal conductive interlayer ( 110 );
  • thermal conducting surface of thermal conductive interlayer ( 110 ) is partially combined with interface thermal conductor ( 103 ), partially combined with relay thermal conductor ( 102 ), and partially combined with first thermal body ( 101 );
  • thermal conducting surface of interface thermal conductor ( 103 ) is partially combined with thermal conductive interlayer ( 110 ), partially combined with first thermal body ( 101 ), and partially coupled with second thermal body ( 104 );
  • the conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • the first thermal body ( 101 ) can be the heat source or heat absorbing body
  • the second thermal body ( 104 ) can be the heat source or heat absorbing body.
  • FIG. 7 is the fourth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 7 are the following:
  • the thermal conducting surface of first thermal body ( 101 ) is partially combined with relay thermal conductor ( 102 ), partially combined with thermal conductive interlayer ( 110 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of relay thermal conductor ( 102 ) is partially combined with first thermal body ( 101 ), partially combined with thermal conductive interlayer ( 110 ), and partially combined with interface thermal conductor ( 103 );
  • thermal conducting surface of thermal conductive interlayer ( 110 ) is partially combined with first thermal body ( 101 ), partially combined with relay thermal conductor ( 102 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of interface thermal conductor ( 103 ) is partially combined with first thermal body ( 101 ), partially combined with relay thermal conductor ( 102 ), partially combined with thermal conductive interlayer ( 110 ), and partially coupled with second thermal body ( 104 );
  • the conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • the first thermal body ( 101 ) can be the heat source or heat absorbing body
  • the second thermal body ( 104 ) can be the heat source or heat absorbing body.
  • FIG. 8 is the fifth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 8 are the following:
  • first thermal body ( 101 ) The thermal conducting surface of first thermal body ( 101 ) is partially combined with relay thermal conductor ( 102 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of relay thermal conductor ( 102 ) is partially combined with first thermal body ( 101 ), partially combined with thermal conductive interlayer ( 110 ), and partially combined with interface thermal conductor ( 103 );
  • thermal conducting surface of thermal conductive interlayer ( 110 ) is partially combined with relay thermal conductor ( 102 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of interface thermal conductor ( 103 ) is partially combined with first thermal body ( 101 ), partially combined with relay thermal conductor ( 102 ), partially combined with thermal conductive interlayer ( 110 ), and partially coupled with second thermal body ( 104 );
  • the first thermal body ( 101 ) can be the heat source or heat absorbing body
  • the second thermal body ( 104 ) can be the heat source or heat absorbing body.
  • FIG. 9 is the sixth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 9 are the following:
  • first thermal body ( 101 ) The thermal conducting surface of first thermal body ( 101 ) is partially combined with relay thermal conductor ( 102 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of relay thermal conductor ( 102 ) is partially combined with first thermal body ( 101 ), partially combined with thermal conductive interlayer ( 110 ), and partially combined with interface thermal conductor ( 103 );
  • thermal conducting surface of thermal conductive interlayer ( 110 ) is partially combined with first thermal body ( 101 ), partially combined with relay thermal conductor ( 102 ), and partially combined with interface thermal conductor ( 103 );
  • the thermal conducting surface of interface thermal conductor ( 103 ) is partially combined with first thermal body ( 101 ), partially combined with relay thermal conductor ( 102 ), partially combined with thermal conductive interlayer ( 110 ), and partially coupled with second thermal body ( 104 );
  • the conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • the first thermal body ( 101 ) can be the heat source or heat absorbing body
  • the second thermal body ( 104 ) can be the heat source or heat absorbing body.
  • thermal conductive interlayer 110
  • the principle of cross-layer combination for the applications shown in FIGS. 3-9 can be similarly deduced.
  • applications of the layer by layer overlapping multi-layer structure or the applications of multi-layer structure being partially cross-layer combined can be made to various geometric shapes according to conditions of usage.
  • one or more than one auxiliary thermal conducting method can be optionally selected to be installed between first thermal body ( 101 ) and relay thermal conductor ( 102 ); or between relay thermal conductor ( 102 ) and interface thermal conductor ( 103 ); or between interface thermal conductor ( 103 ) and second thermal body ( 104 ); or between relay thermal conductor ( 102 ) and thermal conductive interlayer ( 110 ) if thermal conductive inter-layer ( 110 ) installed, or between thermal conductive interlayer ( 110 ) and thermal conductive interlayer ( 110 ) if multiple layered thermal conductive interlayer ( 110 ) is installed; or between thermal conductive interlayer ( 110 ) and interface thermal conductor ( 103 ), including:
  • the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention can be applied for various heat absorbing or dissipating, or cooling thermal conductive application devices, such as heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy conduction of information, audio or image devices, or heat dissipation of various lamp or LED devices, or the heat absorption or dissipation or thermal energy conduction of air conditioning devices, electrical machines or engine, or heat dissipation of thermal energy conduction from frictional heat loss of the mechanical devices, or heat dissipation or thermal energy conduction of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy conduction of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy conduction of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water
  • thermo energy conduction in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process.

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Abstract

The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between relay thermal conductor and second thermal body.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention
  • The present invention discloses that at least two layers of thermal energy conducting structures in particular intercrossed overlapping layers embodiment are commonly constituted by at least two thermal energy conductive material having at least one of different thermal conductivity coefficient, specific heat capacity, or thermal emissivity, thereby promoting the thermal conducting effect.
  • (b) Description of the Prior Art
  • The cooling or heating source of the first thermal body of the conventional thermal conducting structure constituted by a single material is usually limited by the smaller thermally conducting area of the thermal conducting device, such as that if the heat source of first thermal body is the thermal energy of the heat loss in CPU of computer, or power semiconductor, or light emitting diode (LED), except for heat pipe or other cooling or heating device of the like having full area contact in the enclosed space, then if it is coupled with said thermal bodies for heat dissipating operation, if the thermal conducting structure is made of single material, and even if the thermal conductivity coefficient of the single material is better, its specific heat capacity is usually not the best, such as that if the heat dissipator of CPU, power semiconductor, or light emitting diodes being made of copper material is heavier and expensive, and although it has a better thermal conductivity coefficient and its specific heat capacity is lower than aluminum;
  • If single material of better specific heat capacity with lighter weight and lower price is adopted, such as the heat dissipator of CPU, power semiconductor or light emitting diode being made of aluminum, though it has a higher specific heat capacity and thermal emissivity, its thermal conductivity coefficient is lower than that of copper material, therefore the thermal conducting effect for thermal conducting structure made of single material is more limited.
    • SUMMARY OF THE INVENTION
  • The present invention innovatively discloses a thermal conduction principle and device for intercrossed structure having different thermal characteristics, wherein the thermal conducting structure of the particular intercrossed overlapping layer construction is made of materials with different thermal conducting characteristics and is different from the conventional thermal conducting device being made of single material, wherein the relay thermal conductor of the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention being made of material with better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or surface thereof, and is coupled with interface thermal conductor at the other end or face thereof, and the other portion is for directly thermal conduct with the second thermal body, wherein said interface thermal conductor having the thermal conducting characteristics with all or at least one of the 1) higher specific heat capacity relative to relay thermal conductor, or 2) a better thermal conductivity coefficient to second thermal body relative to relay thermal conductor, or 3) a better thermal emissivity to second thermal body relative to relay thermal conductor being good is used as the thermal conducting carrier between the relay thermal conductor and the second thermal body; and is favorable for thermal energy conduction by the particular intercrossed overlapping layer construction having different thermal characteristics when there is temperature difference between the first thermal body and the second thermal body.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic view of the three-layer type layer by layer overlapping structure principle of prior art.
  • FIG. 2 is a schematic view of the structure principle showing that the thermal conductive interlayer (110) is additionally installed between the interface thermal conductor (103) and the relay thermal conductor (102) in FIG. 1 of prior art.
  • FIG. 3 is a schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 4 is the first schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 5 is the second schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 6 is the third schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 7 is the fourth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 8 is the fifth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • FIG. 9 is the sixth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
    •  DESCRIPTION OF MAIN COMPONENT SYMBOLS
    • 101: First thermal body
    • 102: Relay thermal conductor
    • 103: Interface thermal conductor
    • 104: Second thermal body
    • 110: Thermal conductive interlayer
    DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention innovatively discloses a thermal conduction principle and device for intercrossed structure having different thermal characteristics, wherein the thermal conducting structure of the particular intercrossed overlapping layer construction is made of materials with different thermal conducting characteristics and is different from the conventional thermal conducting device being made of single material, wherein the relay thermal conductor of the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention being made of material with better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or surface thereof, and is coupled with interface thermal conductor at the other end or surface thereof, wherein the relay thermal conductor directly perform thermal conduction with the second thermal body at another part thereof, wherein said interface thermal conductor having the thermal conducting characteristics with all or at least one of the 1) higher specific heat capacity relative to relay thermal conductor, or 2) a better thermal conductivity coefficient to second thermal body relative to relay thermal conductor, or 3) a better thermal emissivity to second thermal body relative to relay thermal conductor being good is used as the thermal conducting carrier between the relay thermal conductor and the second thermal body; and is favorable for thermal energy conduction by the particular intercrossed overlapping layer construction having different thermal characteristics when there is temperature difference between the first thermal body and the second thermal body.
  • For the thermal conduction principle and device for intercrossed structure having different thermal characteristics, beside of aforesaid layer by layer overlapping multi-layered structure, the multi-layered structure can be partially cross-layered combined under this basis to be the composing structure for thermal transfer to further promote the thermal transfer function; wherein it is described in the following:
  • FIG. 1 is a schematic view of the three-layer type layer by layer overlapping structure principle of prior art.
  • FIG. 2 is a schematic view of the structure principle showing that the thermal conductive interlayer (110) is additionally installed between the interface thermal conductor (103) and the relay thermal conductor (102) in FIG. 1 of prior art.
  • Aforementioned FIG. 1 and FIG. 2 are the basic concept of the layer by layer overlapping multi-layer structure; As shown in FIG. 1, the heat source of the first thermal body (101) is the thermal energy of heat loss in CPU of the computer, or power semiconductor, or light emitting diode (LED) which is not directly combined with the interface thermal conductor (103); as shown in FIG. 2, the heat source of the first thermal body (101) is the thermal energy of heat loss in CPU of the computer, or power semiconductor, or light emitting diode (LED) which is not directly combined with the thermal conductive interlayer (110) or the interface thermal conductor (103), and the relay thermal conductor (102) and the interface thermal conductor (103) also are not directly combined; hence, based on application requirements as well as manufacture and space considerations, the structure can be further promoted by partially cross-layered combining the multi-layered structure to be the composing structure for thermal transfer, i.e under the basis of FIG. 1, the thermal conducting surface of first thermal body (101) is not only combined with the relay thermal conductor (102), but also partially combined with the interface thermal conductor (103), wherein the position of thermal conducting surfaces of the first thermal body (101) for combining with relay thermal conductor (102) and interface thermal conductor (103) can be selected according to thermal flow distribution of temperature difference and application conditions.
  • FIG. 3 is a schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 3 are the following:
  • The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of interface thermal conductor (103) is partially coupled with second thermal body (104);
  • The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • The first thermal body (101) can be the heat source or heat absorbing body;
  • The second thermal body (104) can be the heat source or heat absorbing body.
  • FIG. 4 is the first schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 4 are the following:
  • The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with thermal conductive interlayer (110);
  • The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), and partially combined with thermal conductive interlayer (110);
  • The thermal conducting surface of thermal conductive interlayer (110) is partially combined with interface thermal conductor (103), partially combined with relay thermal conductor (102), and partially combined with first thermal body (101);
  • The thermal conducting surface of interface thermal conductor (103) is partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
  • The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • The first thermal body (101) can be the heat source or heat absorbing body;
  • The second thermal body (104) can be the heat source or heat absorbing body.
  • FIG. 5 is the second schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 5 are the following:
  • The thermal conducting surface of first thermal body (101) is combined with relay thermal conductor (102);
  • The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of thermal conductive interlayer (110) is partially combined with interface thermal conductor (103), and partially combined with relay thermal conductor (102);
  • The thermal conducting surface of interface thermal conductor (103) is partially combined with thermal conductive interlayer (110), partially combined with relay thermal conductor (102), and partially coupled with second thermal body (104);
      • The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • The first thermal body (101) can be the heat source or heat absorbing body;
  • The second thermal body (104) can be the heat source or heat absorbing body.
  • FIG. 6 is the third schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 6 are the following:
  • The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), and partially combined with thermal conductive interlayer (110);
  • The thermal conducting surface of thermal conductive interlayer (110) is partially combined with interface thermal conductor (103), partially combined with relay thermal conductor (102), and partially combined with first thermal body (101);
  • The thermal conducting surface of interface thermal conductor (103) is partially combined with thermal conductive interlayer (110), partially combined with first thermal body (101), and partially coupled with second thermal body (104);
  • The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • The first thermal body (101) can be the heat source or heat absorbing body;
  • The second thermal body (104) can be the heat source or heat absorbing body.
  • FIG. 7 is the fourth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 7 are the following:
  • The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of thermal conductive interlayer (110) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of interface thermal conductor (103) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
  • The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • The first thermal body (101) can be the heat source or heat absorbing body;
  • The second thermal body (104) can be the heat source or heat absorbing body.
  • FIG. 8 is the fifth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 8 are the following:
  • The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of thermal conductive interlayer (110) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of interface thermal conductor (103) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
  • The first thermal body (101) can be the heat source or heat absorbing body;
  • The second thermal body (104) can be the heat source or heat absorbing body.
  • FIG. 9 is the sixth schematic view showing that the multi-layered structure of the present invention is partially cross-layered combined to be thermal conductive composing structure.
  • Structure characteristics of cross layer combination as shown in FIG. 9 are the following:
  • The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of thermal conductive interlayer (110) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
  • The thermal conducting surface of interface thermal conductor (103) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
  • The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
  • The first thermal body (101) can be the heat source or heat absorbing body;
  • The second thermal body (104) can be the heat source or heat absorbing body.
  • In case of more than one layer of thermal conductive interlayer (110), the principle of cross-layer combination for the applications shown in FIGS. 3-9 can be similarly deduced.
  • For the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention, applications of the layer by layer overlapping multi-layer structure or the applications of multi-layer structure being partially cross-layer combined can be made to various geometric shapes according to conditions of usage.
  • For the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention, one or more than one auxiliary thermal conducting method can be optionally selected to be installed between first thermal body (101) and relay thermal conductor (102); or between relay thermal conductor (102) and interface thermal conductor (103); or between interface thermal conductor (103) and second thermal body (104); or between relay thermal conductor (102) and thermal conductive interlayer (110) if thermal conductive inter-layer (110) installed, or between thermal conductive interlayer (110) and thermal conductive interlayer (110) if multiple layered thermal conductive interlayer (110) is installed; or between thermal conductive interlayer (110) and interface thermal conductor (103), including:
      • 1. To be installed with electrically insulated heat conductive piece; or
      • 2. To be coated with thermally conductive grease; or
      • 3. To be installed with electrically insulated thermal conductive piece and coated with thermally conductive grease.
  • The thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention can be applied for various heat absorbing or dissipating, or cooling thermal conductive application devices, such as heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy conduction of information, audio or image devices, or heat dissipation of various lamp or LED devices, or the heat absorption or dissipation or thermal energy conduction of air conditioning devices, electrical machines or engine, or heat dissipation of thermal energy conduction from frictional heat loss of the mechanical devices, or heat dissipation or thermal energy conduction of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy conduction of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy conduction of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy conduction of batteries or fuel cells, etc;
  • Or it can be applied for thermal energy conduction in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process.

Claims (12)

1. A thermal conduction principle and device for intercrossed structure having different thermal characteristics, wherein the thermal conducting structure of the particular intercrossed overlapping layer construction is made of materials with different thermal conducting characteristics, wherein the relay thermal conductor of the thermal conduction principle and device for intercrossed structure having different thermal characteristics of the present invention being made of material with better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or surface thereof, and is coupled with interface thermal conductor at the other end or surface thereof, wherein the relay thermal conductor directly perform thermal conduction with the second thermal body at another part thereof, wherein said interface thermal conductor having the thermal conducting characteristics with all or at least one of the 1) higher specific heat capacity relative to relay thermal conductor, or 2) a better thermal conductivity coefficient to second thermal body relative to relay thermal conductor, or 3) a better thermal emissivity to second thermal body relative to relay thermal conductor being good is used as the thermal conducting carrier between the relay thermal conductor and the second thermal body; and is favorable for thermal energy conduction by the particular intercrossed overlapping layer construction having different thermal characteristics when there is temperature difference between the first thermal body and the second thermal body.
2. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein the structure characteristics of cross layer combination are the following:
The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), and partially combined with interface thermal conductor (103);
The thermal conducting surface of interface thermal conductor (103) is partially coupled with second thermal body (104);
The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
The first thermal body (101) can be the heat source or heat absorbing body;
The second thermal body (104) can be the heat source or heat absorbing body.
3. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein the structure characteristics of cross layer combination are the following:
The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with thermal conductive interlayer (110);
The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), and partially combined with thermal conductive interlayer (110);
The thermal conducting surface of thermal conductive interlayer (110) is partially combined with interface thermal conductor (103), partially combined with relay thermal conductor (102), and partially combined with first thermal body (101);
The thermal conducting surface of interface thermal conductor (103) is partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
The first thermal body (101) can be the heat source or heat absorbing body;
The second thermal body (104) can be the heat source or heat absorbing body.
4. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein the structure characteristics of cross layer combination are the following:
The thermal conducting surface of first thermal body (101) is combined with relay thermal conductor (102);
The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
The thermal conducting surface of thermal conductive interlayer (110) is partially combined with interface thermal conductor (103), and partially combined with relay thermal conductor (102);
The thermal conducting surface of interface thermal conductor (103) is partially combined with thermal conductive interlayer (110), partially combined with relay thermal conductor (102), and partially coupled with second thermal body (104);
The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
The first thermal body (101) can be the heat source or heat absorbing body;
The second thermal body (104) can be the heat source or heat absorbing body.
5. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein the structure characteristics of cross layer combination are the following:
The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), and partially combined with thermal conductive interlayer (110);
The thermal conducting surface of thermal conductive interlayer (110) is partially combined with interface thermal conductor (103), partially combined with relay thermal conductor (102), and partially combined with first thermal body (101);
The thermal conducting surface of interface thermal conductor (103) is partially combined with thermal conductive interlayer (110), partially combined with first thermal body (101), and partially coupled with second thermal body (104);
The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
The first thermal body (101) can be the heat source or heat absorbing body;
The second thermal body (104) can be the heat source or heat absorbing body.
6. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein the structure characteristics of cross layer combination are the following:
The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
The thermal conducting surface of thermal conductive interlayer (110) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
The thermal conducting surface of interface thermal conductor (103) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
The first thermal body (101) can be the heat source or heat absorbing body;
The second thermal body (104) can be the heat source or heat absorbing body.
7. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein the structure characteristics of cross layer combination are the following:
The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
The thermal conducting surface of thermal conductive interlayer (110) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
The thermal conducting surface of interface thermal conductor (103) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
The first thermal body (101) can be the heat source or heat absorbing body;
The second thermal body (104) can be the heat source or heat absorbing body.
8. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein the structure characteristics of cross layer combination are the following:
The thermal conducting surface of first thermal body (101) is partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
The thermal conducting surface of relay thermal conductor (102) is partially combined with first thermal body (101), partially combined with thermal conductive interlayer (110), and partially combined with interface thermal conductor (103);
The thermal conducting surface of thermal conductive interlayer (110) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), and partially combined with interface thermal conductor (103);
The thermal conducting surface of interface thermal conductor (103) is partially combined with first thermal body (101), partially combined with relay thermal conductor (102), partially combined with thermal conductive interlayer (110), and partially coupled with second thermal body (104);
The conductive area, thickness and thermal characteristics of thermal conductive material of each cross-layer combined surface and original multi-layer combined surface can be selected according to thermal flow distribution of temperature difference and application conditions;
The first thermal body (101) can be the heat source or heat absorbing body;
The second thermal body (104) can be the heat source or heat absorbing body.
9. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claims 2, 3, 4, 5, 6, 7 or 8, wherein in case of more than one layer of thermal conductive interlayer (110), the principle of cross-layer combination can be similarly deduced.
10. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1 can be made to various geometric shapes according to conditions of usage.
11. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein one or more than one auxiliary thermal conducting method can be optionally selected to be installed between first thermal body (101) and relay thermal conductor (102); or between relay thermal conductor (102) and interface thermal conductor (103); or between interface thermal conductor (103) and second thermal body (104); or between relay thermal conductor (102) and thermal conductive interlayer (110) if thermal conductive inter-layer (110) installed, or between thermal conductive interlayer (110) and thermal conductive interlayer (110) if multiple layered thermal conductive interlayer (110) is installed; or between thermal conductive interlayer (110) and interface thermal conductor (103), including:
1) To be installed with electrically insulated heat conductive piece; or
2) To be coated with thermally conductive grease; or
3) To be installed with electrically insulated thermal conductive piece and coated with thermally conductive grease.
12. A thermal conduction principle and device for intercrossed structure having different thermal characteristics as claimed in claim 1, wherein it can be applied for various heat absorbing or dissipating, or cooling thermal conductive application devices, such as heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy conduction of information, audio or image devices, or heat dissipation of various lamp or LED devices, or the heat absorption or dissipation or thermal energy conduction of air conditioning devices, electrical machines or engine, or heat dissipation of thermal energy conduction from frictional heat loss of the mechanical devices, or heat dissipation or thermal energy conduction of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy conduction of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy conduction of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy conduction of batteries or fuel cells, etc;
Or it can be applied for thermal energy conduction in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process.
US12/219,475 2008-07-23 2008-07-23 Thermal conduction principle and device for intercrossed structure having different thermal characteristics Abandoned US20100018690A1 (en)

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US12/219,475 US20100018690A1 (en) 2008-07-23 2008-07-23 Thermal conduction principle and device for intercrossed structure having different thermal characteristics
US12/232,278 US20100021678A1 (en) 2008-07-23 2008-09-15 Thermal conduction principle and device for intercrossed structure having different thermal characteristics
US12/607,396 US9303928B2 (en) 2008-07-23 2009-10-28 Thermal conduction principle and device for intercrossed structure having different thermal characteristics
US14/990,418 US10702097B2 (en) 2008-07-23 2016-02-02 Thermal conduction principle and device for intercrossed structure having different thermal characteristics

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2040102A (en) * 1935-01-22 1936-05-12 Peron Anthony Pot
US4596236A (en) * 1982-12-14 1986-06-24 Ardal Og Sunndal Verk A.S. Stainless steel cooking vessel suitable for all types of heat sources
US20050013119A1 (en) * 2003-07-17 2005-01-20 Sanjay Misra Thermal diffusion apparatus
US20060117539A1 (en) * 2003-08-20 2006-06-08 P.T. Maspion Multi clad cookware

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2040102A (en) * 1935-01-22 1936-05-12 Peron Anthony Pot
US4596236A (en) * 1982-12-14 1986-06-24 Ardal Og Sunndal Verk A.S. Stainless steel cooking vessel suitable for all types of heat sources
US20050013119A1 (en) * 2003-07-17 2005-01-20 Sanjay Misra Thermal diffusion apparatus
US20060117539A1 (en) * 2003-08-20 2006-06-08 P.T. Maspion Multi clad cookware

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