US20100008049A1 - Back plate assembly - Google Patents
Back plate assembly Download PDFInfo
- Publication number
- US20100008049A1 US20100008049A1 US12/211,045 US21104508A US2010008049A1 US 20100008049 A1 US20100008049 A1 US 20100008049A1 US 21104508 A US21104508 A US 21104508A US 2010008049 A1 US2010008049 A1 US 2010008049A1
- Authority
- US
- United States
- Prior art keywords
- back plate
- portions
- mounting holes
- mounting
- plate assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- a computer usually has a computer chassis that may hold a mainboard, a power supply and multiple printed circuit board (PCBs) such as graphic, sound cards and network cards.
- PCBs printed circuit board
- mainboards There are three specifications for mainboards: one is 775 specification, one is AM2 specification, and another is K8 specification.
- the mainboard mounted on the computer chassis usually has electric capacitors, slots for random access memory (RAM), and a socket for a central processing unit (CPU) mounted on the mainboard.
- RAM random access memory
- CPU central processing unit
- the CPU often generates large amounts of heat during operation, which can destabilize the electronic components and cause damage to the electronic components.
- a heat sink assembly including a heat sink and a back plate is mounted on the CPU to remove heat therefrom.
- the back plate of the heat sink assembly can not be compatible with the mainboards with different specifications, which means that different back plates having different configurations are required for fastening the heat sinks to the CPUs mounted on 775 mainboard, AM2 mainboard, and K8 mainboard. For manufacturing and managing such different back plates, cost is high.
- a back plate assembly is compatible with mainboards with different specification.
- the back plate assembly includes a back plate and a plurality of fasteners engaging with the back plate.
- the back plate defines a plurality of sets of mounting holes. Each set of mounting holes is aligned with through holes in a corresponding mianboard with a specific specification.
- the mounting holes each includes a first receiving hole and a second receiving hole located at a lower portion of the first receiving hole.
- the fasteners are interferentially fitted in the mounting holes of the back plate.
- Each fastener includes a baffling portion received in the first receiving hole of the mounting hole, and a connecting portion extending downwardly from the baffling portion of the fastener and received in the second receiving hole of the mounting hole.
- the fasteners are fitted in a specific set of mounting holes for a corresponding mainboard with a specific specification.
- FIG. 1 is an assembled view of a back plate assembly in accordance with a preferred embodiment of the present invention, wherein the back plate assembly is mounted to a mainboard with a first specification.
- FIG. 3 is an inverted view of FIG. 2 .
- FIG. 5 is an assembled view of the back plate assembly mounted to a mainboard with a third specification.
- a plurality of reinforce ribs 16 is formed on a bottom portion of the back plate 10 to reinforce the back plate 10 .
- a plurality of mounting holes 15 is defined in the back plate 10 to receive the fasteners 50 .
- the mounting holes 15 comprises a first set of mounting holes 15 which are defined in joints of the extending portions 12 and the linking portions 13 , a second set of mounting holes 15 which are defined in joints of the linking portions 13 and the mounting portions 14 , and a third set of mounting holes 15 which is defined in central portions of each of the mounting portions 14 .
- the fasteners 50 extend through a corresponding set of mounting holes 15 of the back plate 10 and engage with a corresponding mainboard to assemble the back plate 10 on the corresponding mainboard.
- Each mounting hole 15 is a counterbore and comprises a first receiving hole 151 and second receiving hole 153 located under and in communication with a lower portion of the first receiving hole 151 .
- a baffling plate 155 is located between the first and second receiving holes 151 , 153 of the mounting hole 15 .
- the baffling portion 51 and the connecting portion 53 of the fastener 50 engage in the first and second receiving holes 151 , 153 , respectively.
- the first receiving hole 151 is enclosed by a plurality of engaging plates 154 , which are angled with each other to engage with a periphery of the baffling portion 51 .
- a bore diameter of the first receiving hole 151 is slightly smaller than a diameter of the baffling portion 51 of the fastener 50 .
- a bore diameter of the second receiving hole 153 is slightly smaller than a diameter of the connecting portion 53 of the fastener 50 .
- the back plate 10 is located at a bottom surface of the first mainboard 20 to have the first set of mounting holes 15 in alignment with through holes 23 of the first mainboard 20 .
- the fasteners 50 extend through the first set of mounting holes 15 of the back plate 10 .
- the baffling portions 51 of the fasteners 50 are interferentially fitted in the first receiving holes 151 respectively, and the connecting portions 53 of the fasteners 50 are interferentially fitted in the second receiving holes 151 of the first set of mounting holes 15 , respectively.
- the bottom portion of the baffling portion 51 of the fasteners 50 abut against top surfaces of the baffling plates 155 , respectively.
- Bolts (not shown) are used to extend through the heat sink and the holes 23 of the first mainboard 20 to threadedly engage in the connecting portions 53 of the fasteners 50 , thereby to secure mount the heat sink to a CPU 21 mounted on the first mainboard 20 .
- heat generated by the CPU 21 can be effectively dissipated by the heat sink.
- the fasteners 50 extend through the second set of mounting holes 15 ( FIG. 4 ) or the third set of mounting holes 15 ( FIG. 5 ) to mount the back plate 10 on the second mainboard 30 ( FIG. 4 ) or the third mainboard 40 ( FIG. 5 ).
- the back plate 10 is compatible with the first, second and third mainboards 20 , 30 , 40 . Thus, the manufacturing and inventory cost for the back plate 10 can be lowered.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a back plate assembly, and more particularly to a back plate assembly compatible with different specifications of mainboards.
- 2. Description of Related Art
- A computer usually has a computer chassis that may hold a mainboard, a power supply and multiple printed circuit board (PCBs) such as graphic, sound cards and network cards.
- There are three specifications for mainboards: one is 775 specification, one is AM2 specification, and another is K8 specification. The mainboard mounted on the computer chassis usually has electric capacitors, slots for random access memory (RAM), and a socket for a central processing unit (CPU) mounted on the mainboard. The CPU often generates large amounts of heat during operation, which can destabilize the electronic components and cause damage to the electronic components. Typically, therefore, a heat sink assembly including a heat sink and a back plate is mounted on the CPU to remove heat therefrom.
- However, the back plate of the heat sink assembly can not be compatible with the mainboards with different specifications, which means that different back plates having different configurations are required for fastening the heat sinks to the CPUs mounted on 775 mainboard, AM2 mainboard, and K8 mainboard. For manufacturing and managing such different back plates, cost is high.
- What is needed, therefore, is a back plate assembly which is compatible with mainboards with different specifications.
- A back plate assembly is compatible with mainboards with different specification. The back plate assembly includes a back plate and a plurality of fasteners engaging with the back plate. The back plate defines a plurality of sets of mounting holes. Each set of mounting holes is aligned with through holes in a corresponding mianboard with a specific specification. The mounting holes each includes a first receiving hole and a second receiving hole located at a lower portion of the first receiving hole. The fasteners are interferentially fitted in the mounting holes of the back plate. Each fastener includes a baffling portion received in the first receiving hole of the mounting hole, and a connecting portion extending downwardly from the baffling portion of the fastener and received in the second receiving hole of the mounting hole. The fasteners are fitted in a specific set of mounting holes for a corresponding mainboard with a specific specification.
- Other advantages and novel features will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled view of a back plate assembly in accordance with a preferred embodiment of the present invention, wherein the back plate assembly is mounted to a mainboard with a first specification. -
FIG. 2 is an exploded view of the back plate assembly and the mainboard ofFIG. 1 . -
FIG. 3 is an inverted view ofFIG. 2 . -
FIG. 4 is an assembled view of the back plate assembly mounted to a mainboard with a second specification. -
FIG. 5 is an assembled view of the back plate assembly mounted to a mainboard with a third specification. - Referring to
FIGS. 1-3 , a back plate assembly (not labeled) comprises aback plate 10 and a plurality offasteners 50 engaging with theback plate 10. The back plate assembly is configured (i.e., structured and arranged) for mounting to a first mainboard 20 (shown inFIG. 2 ) having a first specification, for example, Intel Socket 775 Motherboard, a second mainboard 30 (shown inFIG. 4 ) having a second specification, for example, AMD AM2 Socket Motherboard, or a third mianboard 40 (shown inFIG. 5 ) having a third specification, for example, AMD K8 Socket Motherboard, to engage with a heat sink (not shown) to enable the heat sink to dissipate heat generated from a CPU mounted on the first, second, orthird mianboard - Each
fastener 50 comprises abaffling portion 51 and a connectingportion 53 extending perpendicularly and downwardly from a central portion of thebaffling portion 51. Thebaffling portion 51 has a hexagonal prism configuration. The connectingportion 53 is a cylindrical, hollow tube. An inner surface of the connectingportion 53 defines threads to cooperate with a bolt (not shown) to assemble a heat sink (not shown) to thefirst mainboard 20. - The
back plate 10 is made of elastic plastic and symmetrical about intercrossed central lines (not shown) thereof, which are longitudinally or transversely extended through a center of theback plate 10. Theback plate 10 is an annulus. Theback plate 10 comprises a pair of elongated, spaced connectingportions 11, a pair of extendingportions 12 extending slantwise and outwardly from opposite ends of each of theconnecting portions 11, a linkingportion 13 extending slantwise and inwardly from an end of each of the extendingportions 12, and a pair of arc-shaped mounting portions 14 connecting with ends of the linkingportions 13, respectively. The connectingportions 11 are parallel to each other. A plurality ofreinforce ribs 16 is formed on a bottom portion of theback plate 10 to reinforce theback plate 10. A plurality ofmounting holes 15 is defined in theback plate 10 to receive thefasteners 50. Themounting holes 15 comprises a first set ofmounting holes 15 which are defined in joints of the extendingportions 12 and the linkingportions 13, a second set ofmounting holes 15 which are defined in joints of the linkingportions 13 and the mountingportions 14, and a third set of mountingholes 15 which is defined in central portions of each of themounting portions 14. Thefasteners 50 extend through a corresponding set ofmounting holes 15 of theback plate 10 and engage with a corresponding mainboard to assemble theback plate 10 on the corresponding mainboard. Eachmounting hole 15 is a counterbore and comprises a first receivinghole 151 and second receivinghole 153 located under and in communication with a lower portion of thefirst receiving hole 151. Abaffling plate 155 is located between the first and second receivingholes mounting hole 15. Thebaffling portion 51 and the connectingportion 53 of thefastener 50 engage in the first andsecond receiving holes hole 151 is enclosed by a plurality ofengaging plates 154, which are angled with each other to engage with a periphery of thebaffling portion 51. A bore diameter of the first receivinghole 151 is slightly smaller than a diameter of thebaffling portion 51 of thefastener 50. A bore diameter of the second receivinghole 153 is slightly smaller than a diameter of the connectingportion 53 of thefastener 50. Thus, thefasteners 50 are forced to be interferentially fitted in the corresponding set ofmounting holes 15. - In assembly, the
back plate 10 is located at a bottom surface of thefirst mainboard 20 to have the first set of mountingholes 15 in alignment with throughholes 23 of thefirst mainboard 20. Thefasteners 50 extend through the first set of mountingholes 15 of theback plate 10. In this state, thebaffling portions 51 of thefasteners 50 are interferentially fitted in thefirst receiving holes 151 respectively, and the connectingportions 53 of thefasteners 50 are interferentially fitted in the second receivingholes 151 of the first set ofmounting holes 15, respectively. The bottom portion of thebaffling portion 51 of thefasteners 50 abut against top surfaces of thebaffling plates 155, respectively. Bolts (not shown) are used to extend through the heat sink and theholes 23 of thefirst mainboard 20 to threadedly engage in the connectingportions 53 of thefasteners 50, thereby to secure mount the heat sink to aCPU 21 mounted on thefirst mainboard 20. Thus, heat generated by theCPU 21 can be effectively dissipated by the heat sink. - Referring to
FIGS. 4-5 , thefasteners 50 extend through the second set of mounting holes 15 (FIG. 4 ) or the third set of mounting holes 15 (FIG. 5 ) to mount theback plate 10 on the second mainboard 30 (FIG. 4 ) or the third mainboard 40 (FIG. 5 ). - The
back plate 10 is compatible with the first, second andthird mainboards back plate 10 can be lowered. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810302647.4 | 2008-07-08 | ||
CN200810302647A CN101625579A (en) | 2008-07-08 | 2008-07-08 | Backplate assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
US7639512B1 US7639512B1 (en) | 2009-12-29 |
US20100008049A1 true US20100008049A1 (en) | 2010-01-14 |
Family
ID=41433035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/211,045 Expired - Fee Related US7639512B1 (en) | 2008-07-08 | 2008-09-15 | Back plate assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US7639512B1 (en) |
CN (1) | CN101625579A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160138652A1 (en) * | 2014-11-14 | 2016-05-19 | Saint-Gobain Performance Plastics Corporation | Device and method of anchoring a polymer to a substrate |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104102294A (en) * | 2013-04-10 | 2014-10-15 | 鸿富锦精密工业(深圳)有限公司 | Circuit board fixing mechanism |
CN106168840A (en) * | 2015-05-27 | 2016-11-30 | 中兴通讯股份有限公司 | Interconnection backboard |
US11910566B1 (en) * | 2021-03-18 | 2024-02-20 | Amazon Technologies, Inc. | Processor heat exchanger with separate mounting structure |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424918A (en) * | 1994-03-31 | 1995-06-13 | Hewlett-Packard Company | Universal hybrid mounting system |
US5684467A (en) * | 1995-09-07 | 1997-11-04 | Wheelock Inc. | Universal mounting plate for audible-visual alarms |
US6741477B2 (en) * | 2002-03-18 | 2004-05-25 | American Megatrends Inc | Rack-mount apparatus for mounting electronic components |
US6771516B1 (en) * | 1999-12-27 | 2004-08-03 | Micron Technology, Inc. | Method and apparatus for fastening circuit boards to computer chassis |
US7072176B2 (en) * | 2002-12-31 | 2006-07-04 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Mounting apparatus for circuit board |
US7184277B2 (en) * | 2002-11-13 | 2007-02-27 | Wms Gaming Inc. | Gaming machine with universal PC board mounting system |
US7339549B2 (en) * | 2006-07-13 | 2008-03-04 | Andrew Corporation | Universal mounting assembly |
-
2008
- 2008-07-08 CN CN200810302647A patent/CN101625579A/en active Pending
- 2008-09-15 US US12/211,045 patent/US7639512B1/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424918A (en) * | 1994-03-31 | 1995-06-13 | Hewlett-Packard Company | Universal hybrid mounting system |
US5684467A (en) * | 1995-09-07 | 1997-11-04 | Wheelock Inc. | Universal mounting plate for audible-visual alarms |
US6771516B1 (en) * | 1999-12-27 | 2004-08-03 | Micron Technology, Inc. | Method and apparatus for fastening circuit boards to computer chassis |
US6741477B2 (en) * | 2002-03-18 | 2004-05-25 | American Megatrends Inc | Rack-mount apparatus for mounting electronic components |
US7184277B2 (en) * | 2002-11-13 | 2007-02-27 | Wms Gaming Inc. | Gaming machine with universal PC board mounting system |
US7072176B2 (en) * | 2002-12-31 | 2006-07-04 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Mounting apparatus for circuit board |
US7339549B2 (en) * | 2006-07-13 | 2008-03-04 | Andrew Corporation | Universal mounting assembly |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160138652A1 (en) * | 2014-11-14 | 2016-05-19 | Saint-Gobain Performance Plastics Corporation | Device and method of anchoring a polymer to a substrate |
Also Published As
Publication number | Publication date |
---|---|
US7639512B1 (en) | 2009-12-29 |
CN101625579A (en) | 2010-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:XU, HONG-BO;REEL/FRAME:021540/0601 Effective date: 20080908 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:XU, HONG-BO;REEL/FRAME:021540/0601 Effective date: 20080908 |
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FPAY | Fee payment |
Year of fee payment: 4 |
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REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.) |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20171229 |