US20090274872A1 - Device and Method for Coating a Micro-and/or Nano-Structured Structural Substrate and Coated Structural Substrate - Google Patents
Device and Method for Coating a Micro-and/or Nano-Structured Structural Substrate and Coated Structural Substrate Download PDFInfo
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- US20090274872A1 US20090274872A1 US12/225,204 US22520407A US2009274872A1 US 20090274872 A1 US20090274872 A1 US 20090274872A1 US 22520407 A US22520407 A US 22520407A US 2009274872 A1 US2009274872 A1 US 2009274872A1
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- coating substance
- coating
- structured substrate
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- chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Definitions
- the present invention relates to a device and a method for coating a microstructured and/or nanostructured structured substrate and a structures substrate coated with such a device and/or such a method.
- MEMS micro electromechanical systems
- MOEMS microoptoelectromechanical systems
- NEMS nanoelectromechanical systems
- MEMS and NEMS may contain optical, chemical, and/or biological components.
- Photoresist is usually used for this purpose, in order to transfer lithographic structures in a further method step.
- microstructured and/or nanostructured structured substrates of this type has been shown to be difficult.
- the microstructured and/or nanostructured structured substrates of the MEMS/MOEMS and NEMS are comparatively thickly structured substrates.
- These deep structures are generated through wet or dry etching, embossing, or molding, and may have greatly varying shapes and greatly varying depths and flank formations.
- the structures of the structured substrate frequently have steep flanks and often even perpendicular side walls.
- depressions implemented pits and/or holes having a depth of approximately 300 ⁇ m and a width or a diameter of the upper opening of approximately 100 ⁇ m and an angle of inclination of the side walls of up to 70° are lacquered uniformly.
- the methods known from the semiconductor industry for surface coating, such as spin lacquering, application of photoresist films, or immersion lacquering, are not suitable, since the coating substance may not penetrate up to the floor of the depressions.
- the present invention is based on the object of suggesting a device and a method for coating a microstructured and/or nanostructured structured substrate, using which a uniform coating of the structured surface of the structured substrate with a coating substance is possible.
- the present invention is based on the idea of situating the structured substrate on a carrier unit in a vacuum chamber.
- the coating substance is introduced into the vacuum chamber before and/or while and/or after the chamber is evacuated.
- the air is suctioned off of the surface structure, i.e., out of the depressions of the structured substrate.
- the pressure level in the vacuum chamber is increased, preferably suddenly, even during and/or after the introduction of the coating substance into the vacuum chamber. In this way, the coating substance is conveyed/drawn into the depressions of the structured substrate, through which even very deep and narrow depressions are coated uniformly.
- Photoresist is preferably used as the coating substance.
- the structured substrate with other coating substances, such as surface activation agents, solvents, adhesion promoters, or other chemicals. Treating or coating the structured substrate multiple times in sequence, preferably using different coating substances, is within the scope of the present invention.
- structured substrate for example a substrate with a topography, the structured substrate consisting of a semiconductor material such as for example silicon or a composite semiconductor material.
- the substrate may also be made of ceramic, glass, plastic, or carbon.
- the present invention is particularly advantageous for depressions in the structured substrate, such as voids (vias), in which the diameter of the opening is significantly smaller in size than the depth of the depression. Typical dimensions of such depressions range from an opening diameter of 300 ⁇ m and a depth of 700 ⁇ m to a diameter of 5 ⁇ m and a depth of 100 ⁇ m.
- the side wall profiles of the depressions may extend vertically downward, but may also each be inclined inwardly or outwardly by up to 45°.
- a typical ratio of diameter to depth of the depressions is therefore 1 to 2 to 1 to 20, more preferably 1 to 4 to 1 to 20, most preferably 1 to 8 to 1 to 20.
- the coating substance is introduced into the vacuum chamber in the liquid state through an inlet line.
- misting the coating substance is more advantageous for achieving a uniform coating.
- spray nozzles, atomizer nozzles, and/or ultrasonic atomizers may be used. The finer the coating substance mist, the more uniform the resulting coating.
- Optimum results are achieved if the structured substrate is cooled down again before and/or while the coating substance is introduced, particularly using cooling elements of the carrier unit. In this way, the condensation of coating substance mist in the depressions of the structured substrate is supported. Different temperature profiles and curves may be implemented with the aid of the heating and/or cooling elements, through which the coating result may be influenced for different structured substrates or coating substances.
- the misting nozzle or the feed line may also be moved relative to the structured substrate. It is particularly advantageous to apply the coating substance to the structured substrate in a spiral fashion.
- the pressure elevation after the evacuation of the vacuum chamber is performed simultaneously with the introduction of coating substance and/or due to the introduction of coating substance.
- a misting chamber in addition to the vacuum chamber, a misting chamber is provided, which is connected via at least one connection line to the vacuum chamber.
- Misting means are provided within the misting chamber, particularly at least one nozzle and/or other suitable atomizer devices, for misting the coating substance. With the aid of the misting means, the coating substance is misted in the misting chamber.
- the pressure level in the misting chamber is higher in this case than the pressure level of the evacuated vacuum chamber.
- the at least one connection line between misting chamber and vacuum chamber is opened, through which the coating substance mist flows suddenly at excess pressure from the misting chamber into the vacuum chamber, through which in turn the coating substance mist is conveyed/drawn into the depressions of the structured substrate and adheres uniformly to the side walls and the floor.
- Optimum results are achieved if the coating substance or the coating substance mist is heated within the misting chamber before being introduced into the vacuum chamber.
- the at least one connection line is only opened after a desired coating substance concentration exists in the misting chamber. It is conceivable to monitor the coating substance concentration in the misting chamber, preferably through optical or chemical sensors. According to a simple embodiment, however, the misting chamber may be charged with coating substance over a predetermined time span before the connection to the vacuum chamber is produced.
- the misting chamber is implemented having a changeable volume.
- the misting chamber preferably has a floor plate which is connected via a folded bellows to the remaining misting chamber. In this way, it is possible to influence the concentration of the coating substance mist within the misting chamber and influence the pressure level within the misting chamber via the change of the volume of the misting chamber.
- the misting chamber advantageously also has a drain to be able to drain off excess coating substance.
- the introduction of the coating substance can take place without a change in pressure with respect to the surroundings, in particular at atmospheric pressure, the introduction occurring in liquid form, in particular as a liquid jet, and the coating substance having a solvent content of at least 25% by volume, in particular at least 40% by volume, preferably at least 60% by volume, most preferably at least 70% by volume.
- the liquid jet should preferably be applied continuously to the structured substrate in order to be able to continuously enter into the respective depressions. Hereby is achieved that no void spaces are formed in the depressions.
- the coating substance should preferably completely fill the depressions. Because of the high solvent content, which is later evaporated by heat exposure, an optimal, homogenous coating of the surface of the depressions and the surface of the structures substrate is achieved.
- FIG. 1 shows a first exemplary embodiment of a device for coating a microstructured and/or nanostructured structured substrate, in which the coating substance is misted directly in a vacuum chamber;
- FIG. 2 shows a second exemplary embodiment of a device according to the present invention having a misting chamber which is connected via closable connection lines to the vacuum chamber;
- FIG. 3 is an illustration of the device according to the invention in process step 1 (applying a partial vacuum);
- FIG. 4 is an illustration of the device according to the invention in process step 2 (applying the coating substance);
- FIG. 5 is an illustration of the device according to the invention in process step 3 (increasing the pressure level);
- FIG. 6 is an illustration of a further process step, in particular the heating of the structured substrate.
- FIG. 7 is an illustration of the process step of heating in a more progressed stage in comparison with the stage illustrated in FIG. 6 with parts of the depressions in the structured substrate enlarged.
- FIG. 1 shows a device 1 for coating a microstructured and/or nanostructured structured substrate 8 , a silicon wafer here.
- the structured substrate 8 has structuring having depressions on its surface pointing upward in the plane of the drawing, the depressions having a depth of approximately 100 ⁇ m to approximately 400 ⁇ m for MEMS.
- the width or the diameter of the upper openings of these depressions is in the range of 200 ⁇ m to 100 ⁇ m or less for MEMS. Therefore, in at least some of the depressions, the opening is dimensioned significantly smaller than its depth.
- the device 1 it is possible to coat the surface structure of the structured substrate 8 uniformly, particularly inside the depressions.
- the depressions have a width of 20 nm and a depth of 40 nm, for example.
- the structured substrate 8 is fixed on a carrier unit 9 (chuck) in a vacuum chamber 3 .
- Vacuum grooves 10 are provided for fixing the structured substrate 8 on the carrier unit 9 .
- a closable flap 7 is provided for charging the vacuum chamber 9 with the structured substrate 8 .
- the flap 7 may also be designed as a cap.
- the carrier unit 9 has a combined heating-cooling element 11 in order to heat and cool the carrier unit 9 and therefore the structured substrate 8 .
- a combined heating-cooling element 11 With the aid of the combined heating-cooling element 11 , greatly varying temperature profiles and/or curves may be implemented.
- the carrier unit 9 is rotatable using a motor 12 in the fixing plane of the structured substrate 8 , through which a uniform distribution of coating substance 24 may be achieved if it was not applied in atomized form.
- a misting nozzle 14 is provided for charging the vacuum chamber 3 with coating substance, any type of atomizer nozzle and/or feed line being able to be provided as a nozzle.
- This nozzle is situated directly above the surface of the structured substrate 8 to be coated and is preferably movably/slidingly disposed above the carrier unit 9 in order to optimally distribute coating substance 24 on structured substrate 8 .
- the vacuum chamber 3 is connected via a vacuum line 13 to a vacuum system (not shown).
- connection lines 5 each having a shutoff valve 6 , are provided in the floor of the vacuum chamber 3 .
- the connection lines 5 connect the vacuum chamber 3 to a higher pressure level than the pressure level of the evacuated vacuum chamber 3 , preferably to the atmosphere or to an excess pressure pressure means store.
- the structured substrate 8 is coated in the following way:
- a structured substrate 8 is laid on the carrier element 9 using a robot via the opened flap 7 .
- the vacuum chamber 3 is closed using the flap 7 .
- the shutoff valves 6 are also closed at this time.
- the structured substrate 8 is now sprayed with coating substance 24 by the misting nozzle 14 , preferably a surface activation agent, a solvent, or photoresist.
- the coating substance 24 used is process-specific depending on the surface composition of the structured substrate 8 , and the structure of the pits or holes.
- the carrier unit 9 may now be heated using the heating-cooling element 11 . Even during the heating of the carrier unit 9 and therefore the structured substrate 8 , the vacuum chamber 3 is evacuated via the vacuum line 13 .
- the carrier unit 9 is cooled down using the heating-cooling element 11 . Subsequently, the shutoff valves 6 are opened, through which excess pressure flows suddenly into the vacuum chamber 3 and pushes the misted coating substance 24 into the depressions 8 v of the structured substrate 8 and thus ensures uniform coating.
- the shutoff valves 6 may be opened already during or after the charging with coating substance 24 . Before opening the shutoff valves 6 , process-specific temperature profiles may be run through, through which a change of the consistency and/or rheological properties of the coating substance 24 is achieved.
- a misting chamber 2 is provided in addition to the vacuum chamber 3 .
- the construction of the vacuum chamber 3 having carrier unit 9 essentially corresponds to the construction shown in FIG. 1 .
- the misting nozzle 14 shown in FIG. 2 may also be dispensed with, so that the charging with coating substance 24 is performed exclusively via the misting chamber 2 .
- An intermediate wall is inserted between the floor of the vacuum chamber 3 and the structured substrate 8 , so that an intermediate chamber 4 is formed, in which the motor 12 of the carrier unit 9 is situated.
- the pressure level of the intermediate chamber 4 corresponds to the pressure level of the vacuum chamber 3 .
- the intermediate chamber 4 may also be operated at atmospheric pressure.
- the shaft of the motor 12 is then sealed in the transition area between vacuum chamber 3 and intermediate chamber 4 .
- connection lines 5 having their shutoff valves 6 do not connect the vacuum chamber 3 to the environment, but rather to the misting chamber 2 .
- Heating elements 15 are located in the upper area of the misting chamber 2 in order to be able to heat the misting chamber 2 .
- a peripheral step 16 is located below the heating elements 15 , which extends radially inward into the misting chamber 2 .
- a floor plate 18 of the misting chamber 2 is connected via a peripherally closed folded bellows 17 to the step 16 .
- the volume of the misting chamber 2 may be reduced or enlarged via an actuator 19 , the folded bellows 17 folding together or apart during the adjustment procedure.
- a spray nozzle 20 is situated in the floor plate 18 for charging the misting chamber 2 with coating substance 24 .
- Coating substance 24 preferably photoresist, solvent, or other chemicals, may be supplied to the misting chamber via a flexible connection line 21 and an adapter 22 .
- the spray nozzle 20 is used for atomizing the coating substance 24 , through which the volume of the misting chamber 2 is fillable with coating substance mist.
- an opening is provided inside the floor plate 18 , which is connected to a flexible drain line 23 . Via this, excess liquids, particularly coating substance 24 , which accumulates in the misting chamber 2 , may be removed.
- the coating of structured substrates 8 in the device 1 shown in FIG. 2 is performed in the following way:
- the structured substrate 8 may now optionally be sprayed with a chemical substance, preferably a coating substance 24 , by the nozzle 14 .
- the structured substrate 8 is sprayed with a surface activation substance, a solvent, or photoresist.
- the vacuum chamber 3 is evacuated.
- the structured substrate 8 is first heated using the heating-cooling element 11 and then cooled again, preferably before the vacuum chamber 3 is charged with coating substance 24 .
- the misting chamber 2 which is preferably heated via the heating elements 15 , is filled with a coating substance mist by the spray nozzle 20 .
- the pressure level within the misting chamber 2 preferably corresponds to atmospheric pressure, but is higher than the pressure level of the evacuated vacuum chamber 3 in any case.
- a precisely defined coating substance deposition on all vertical, deep geometric forms of the structured substrate 8 may be achieved. Equalization of the deposition is achieved through rotation of the carrier unit 9 . Possible excess liquid may also be thrown off.
- FIGS. 3 to 7 a further, possible process sequence is illustrated.
- a vacuum having an absolute pressure of less than 800 mbar, in particular less than 500 mbar, preferably 100 to 400 mbar absolute pressure is adjusted by means of a vacuum system connected to the vacuum line.
- Adjusting the vacuum to the predetermined pressure has the advantage that structured substrate 8 attached to carrier unit 9 by partial vacuum remains fixed on carrier unit 9 due to the lower partial vacuum in comparison to the absolute pressure present in vacuum chamber 3 .
- a further advantage of the absolute pressure range mentioned above is that the evaporation rate or speed of the solvent comprised in coating substance 24 is not too high, but takes place in a controlled and steady manner.
- coating substance 24 is applied to structured substrate 8 or distributed on same.
- the distribution occurs for example by rotating the structured substrate 8 at low speed of revolution, preferably between 8 and 40 revolutions per minute. While structured substrate 8 rotates, nozzle 14 is preferably moved parallel to the surface of the structured substrate and along the arm 14 a of nozzle 14 by linear motion, the coating substance 24 being preferably applied in a spiral fashion by the simultaneous rotation and reciprocating motion.
- the coating substance volume flow discharging from nozzle 14 is chosen in such a way that the surface of the structured substrate 8 is wetted as completely as possible, i.e. preferably with a continuous coating substance layer.
- the volume flow discharging from nozzle 14 can also be adjusted by means of a difference in pressure between the chamber 3 and a coating substance reservoir not depicted or by means of a controlled-volume pump.
- the vacuum in vacuum chamber 3 draws coating substance 24 into vacuum chamber 3 and onto structured substrate 8 .
- coating substance 24 normally does not (yet) flow completely into the depressions 8 v of structured substrate 8 or the topography of structured substrate 8 due to the surface tension of coating substance 24 .
- coating substance 24 to structured substrate 8 can alternatively also occur without rotation of structured substrate 8 solely by moving arm 14 a of nozzle 14 .
- a further alternative consists of disposing nozzle 14 above the center of structured substrate 8 and distributing coating substance 24 on same by rotating structured substrate 8 . Dosing of the coating substance volume discharging from nozzle 14 may also occur via a controlled-volume pump and thus be adjusted more precisely.
- coating substance 24 already at least partially enters into the topography or depressions 8 v of structured substrate 8 , which depends in particular on the surface tension of coating substance 24 and the geometry of depressions 8 v.
- a fluid containing in particular at least in part nitrogen and/or oxygen and/or an inert gas is admitted into vacuum chamber 3 .
- Air is preferably used as fluid.
- the inflow may occur because of a difference in pressure, application of external excess pressure also being possible.
- coating substance 24 located on structured substrate 8 is pressed into depressions 8 v or the topography of structured substrate 8 and fills same, preferably completely. This is schematically shown by means of the arrows in FIG. 5 .
- structured substrate 8 is unloaded from vacuum chamber 3 and disposed above a heating plate 11 . While structured substrate 8 approaches heating plate 11 , which preferably occurs slowly and with defined speed, structured substrate 8 and coating substance 24 located in depressions 8 v and coating substance 24 located on structured substrate 8 already heat up in a defined manner, whereby solvent and content matter of coating substance 24 to be evaporated are evaporated as slowly and defined as possible. Due to the comparatively high content of solvent in coating substance 24 , the coating substance volume decreases significantly and the coating 24 depicted in FIG. 7 that is homogeneously distributed on the topography or the surface of structured substrate 8 and the surface of depressions 8 v remains.
- Typical heating parameters are for example 70° C. for 1 to 10 minutes at a distance of 5 mm from heating plate 11 and, subsequently, 1 to 10 minutes at a distance of 0 to 3 mm from the heating plate.
- Typical coating substances 24 used in the coating system described above are: positive and negative photoresists, dielectric materials such as BCB and polyimides, protective coatings.
- the coating substance is usually diluted prior to coating, the dilution taking place using the following diluting agents: acetone, PGMEA, MEK, NMP, IPA, or mesitylenes, or any combination thereof.
- structured substrate 8 can also be placed directly on heating plate 11 and/or heated consecutively in a defined manner by means of different heating plates.
Abstract
The present invention relates to a device (1) and a method for coating a microstructured and/or nanostructured structured substrate (8). According to the present invention, the coating is performed in a vacuum chamber (3). The pressure level in the vacuum chamber (3) is elevated during or after the charging of the vacuum chamber (3) with coating substance.
Description
- The present invention relates to a device and a method for coating a microstructured and/or nanostructured structured substrate and a structures substrate coated with such a device and/or such a method.
- MEMS (micro electromechanical systems), MOEMS (microoptoelectromechanical systems), and NEMS (nanoelectromechanical systems) are a combination of mechanical and optical elements, sensors, actuators, and electronic circuits on a structured substrate. Furthermore, MEMS and NEMS may contain optical, chemical, and/or biological components. To manufacture MEMS and NEMS, it is usually necessary to provide the surface of the structured substrate, in particular a wafer, preferably made of semiconductor materials and/or moldable plastics, with a coating. Photoresist is usually used for this purpose, in order to transfer lithographic structures in a further method step.
- Coating microstructured and/or nanostructured structured substrates of this type has been shown to be difficult. In contrast to the semiconductor industry, where wafers having a comparatively even surface are used, the microstructured and/or nanostructured structured substrates of the MEMS/MOEMS and NEMS are comparatively thickly structured substrates. These deep structures are generated through wet or dry etching, embossing, or molding, and may have greatly varying shapes and greatly varying depths and flank formations. The structures of the structured substrate frequently have steep flanks and often even perpendicular side walls. Currently, it is typical that depressions implemented pits and/or holes having a depth of approximately 300 μm and a width or a diameter of the upper opening of approximately 100 μm and an angle of inclination of the side walls of up to 70° are lacquered uniformly. The methods known from the semiconductor industry for surface coating, such as spin lacquering, application of photoresist films, or immersion lacquering, are not suitable, since the coating substance may not penetrate up to the floor of the depressions. Currently, it is typical to coat the structured substrate in the spraying method. For this purpose, a fine coating substance mist is applied under standard atmospheric pressure to the surface of the structured substrate using an atomizer nozzle, the spray mist being deflected using air/oxygen or nitrogen (N2). The problem frequently arises in this case that the coating substance droplets close the narrow openings of the depressions because of surface tension and do not wet all of the side walls and the floor of the depressions. Furthermore, applying the spray mist through electrostatic charging, similarly to the powder coating method, to the structured substrate at standard pressure atmosphere is known. The high electrical voltage required in this case may destroy the sensitive structures and/or circuits of the structured substrate, however.
- The present invention is based on the object of suggesting a device and a method for coating a microstructured and/or nanostructured structured substrate, using which a uniform coating of the structured surface of the structured substrate with a coating substance is possible.
- This object is achieved according to the device by the features of
Claim 1 and according to the method by the features ofClaim 9. - Advantageous refinements of the present invention are specified in the subclaims.
- The present invention is based on the idea of situating the structured substrate on a carrier unit in a vacuum chamber. The coating substance is introduced into the vacuum chamber before and/or while and/or after the chamber is evacuated. By applying a partial vacuum to the vacuum chamber, the air is suctioned off of the surface structure, i.e., out of the depressions of the structured substrate. The pressure level in the vacuum chamber is increased, preferably suddenly, even during and/or after the introduction of the coating substance into the vacuum chamber. In this way, the coating substance is conveyed/drawn into the depressions of the structured substrate, through which even very deep and narrow depressions are coated uniformly. Photoresist is preferably used as the coating substance. However, it is also possible to coat the structured substrate with other coating substances, such as surface activation agents, solvents, adhesion promoters, or other chemicals. Treating or coating the structured substrate multiple times in sequence, preferably using different coating substances, is within the scope of the present invention.
- By structured substrate is meant for example a substrate with a topography, the structured substrate consisting of a semiconductor material such as for example silicon or a composite semiconductor material. In some applications, the substrate may also be made of ceramic, glass, plastic, or carbon. The present invention is particularly advantageous for depressions in the structured substrate, such as voids (vias), in which the diameter of the opening is significantly smaller in size than the depth of the depression. Typical dimensions of such depressions range from an opening diameter of 300 μm and a depth of 700 μm to a diameter of 5 μm and a depth of 100 μm. The side wall profiles of the depressions may extend vertically downward, but may also each be inclined inwardly or outwardly by up to 45°. A typical ratio of diameter to depth of the depressions is therefore 1 to 2 to 1 to 20, more preferably 1 to 4 to 1 to 20, most preferably 1 to 8 to 1 to 20.
- There are various possibilities for introducing the coating substance into the vacuum chamber. According to an especially simple variation, the coating substance is introduced into the vacuum chamber in the liquid state through an inlet line. However, misting the coating substance, for example, within the vacuum chamber, is more advantageous for achieving a uniform coating. For this purpose, spray nozzles, atomizer nozzles, and/or ultrasonic atomizers may be used. The finer the coating substance mist, the more uniform the resulting coating.
- It has been shown to be advantageous to heat the structured substrate before elevating the pressure level in the vacuum chamber, particularly with the aid of heating elements of the carrier unit.
- Optimum results are achieved if the structured substrate is cooled down again before and/or while the coating substance is introduced, particularly using cooling elements of the carrier unit. In this way, the condensation of coating substance mist in the depressions of the structured substrate is supported. Different temperature profiles and curves may be implemented with the aid of the heating and/or cooling elements, through which the coating result may be influenced for different structured substrates or coating substances.
- Additionally or alternatively, it is conceivable to set the structured substrate in rotation, preferably using the carrier unit, while or after coating substance is introduced, in order to ensure optimum distribution of the coating substance on the surface of the structured substrate. In the process, the misting nozzle or the feed line may also be moved relative to the structured substrate. It is particularly advantageous to apply the coating substance to the structured substrate in a spiral fashion.
- According to a preferred embodiment, the pressure elevation after the evacuation of the vacuum chamber is performed simultaneously with the introduction of coating substance and/or due to the introduction of coating substance.
- According to the preferred embodiment, in addition to the vacuum chamber, a misting chamber is provided, which is connected via at least one connection line to the vacuum chamber. Misting means are provided within the misting chamber, particularly at least one nozzle and/or other suitable atomizer devices, for misting the coating substance. With the aid of the misting means, the coating substance is misted in the misting chamber. The pressure level in the misting chamber is higher in this case than the pressure level of the evacuated vacuum chamber. Even during or after the misting process in the misting chamber, the at least one connection line between misting chamber and vacuum chamber is opened, through which the coating substance mist flows suddenly at excess pressure from the misting chamber into the vacuum chamber, through which in turn the coating substance mist is conveyed/drawn into the depressions of the structured substrate and adheres uniformly to the side walls and the floor.
- Optimum results are achieved if the coating substance or the coating substance mist is heated within the misting chamber before being introduced into the vacuum chamber.
- Preferably, the at least one connection line is only opened after a desired coating substance concentration exists in the misting chamber. It is conceivable to monitor the coating substance concentration in the misting chamber, preferably through optical or chemical sensors. According to a simple embodiment, however, the misting chamber may be charged with coating substance over a predetermined time span before the connection to the vacuum chamber is produced.
- In a refinement, the misting chamber is implemented having a changeable volume. The misting chamber preferably has a floor plate which is connected via a folded bellows to the remaining misting chamber. In this way, it is possible to influence the concentration of the coating substance mist within the misting chamber and influence the pressure level within the misting chamber via the change of the volume of the misting chamber.
- The misting chamber advantageously also has a drain to be able to drain off excess coating substance.
- It is conceivable to perform multiple coating procedures in sequence, particularly using different coating substances.
- With structures designed accordingly, the introduction of the coating substance can take place without a change in pressure with respect to the surroundings, in particular at atmospheric pressure, the introduction occurring in liquid form, in particular as a liquid jet, and the coating substance having a solvent content of at least 25% by volume, in particular at least 40% by volume, preferably at least 60% by volume, most preferably at least 70% by volume. The liquid jet should preferably be applied continuously to the structured substrate in order to be able to continuously enter into the respective depressions. Hereby is achieved that no void spaces are formed in the depressions. The coating substance should preferably completely fill the depressions. Because of the high solvent content, which is later evaporated by heat exposure, an optimal, homogenous coating of the surface of the depressions and the surface of the structures substrate is achieved.
- Further advantages and expedient embodiments may be inferred from the further claims, the description of the figures, and the drawing.
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FIG. 1 shows a first exemplary embodiment of a device for coating a microstructured and/or nanostructured structured substrate, in which the coating substance is misted directly in a vacuum chamber; -
FIG. 2 shows a second exemplary embodiment of a device according to the present invention having a misting chamber which is connected via closable connection lines to the vacuum chamber; -
FIG. 3 is an illustration of the device according to the invention in process step 1 (applying a partial vacuum); -
FIG. 4 is an illustration of the device according to the invention in process step 2 (applying the coating substance); -
FIG. 5 is an illustration of the device according to the invention in process step 3 (increasing the pressure level); -
FIG. 6 is an illustration of a further process step, in particular the heating of the structured substrate; and -
FIG. 7 is an illustration of the process step of heating in a more progressed stage in comparison with the stage illustrated inFIG. 6 with parts of the depressions in the structured substrate enlarged. - Identical components and components having identical function are provided with identical reference numbers in the figures.
-
FIG. 1 shows adevice 1 for coating a microstructured and/or nanostructuredstructured substrate 8, a silicon wafer here. Thestructured substrate 8 has structuring having depressions on its surface pointing upward in the plane of the drawing, the depressions having a depth of approximately 100 μm to approximately 400 μm for MEMS. The width or the diameter of the upper openings of these depressions is in the range of 200 μm to 100 μm or less for MEMS. Therefore, in at least some of the depressions, the opening is dimensioned significantly smaller than its depth. Using thedevice 1 it is possible to coat the surface structure of the structuredsubstrate 8 uniformly, particularly inside the depressions. For NEMS, the depressions have a width of 20 nm and a depth of 40 nm, for example. - The
structured substrate 8 is fixed on a carrier unit 9 (chuck) in avacuum chamber 3.Vacuum grooves 10 are provided for fixing thestructured substrate 8 on thecarrier unit 9. By applying a vacuum to thevacuum grooves 10, the bottom side of the structuredsubstrate 8 is suctioned in the direction of thecarrier unit 9. Aclosable flap 7 is provided for charging thevacuum chamber 9 with thestructured substrate 8. Theflap 7 may also be designed as a cap. - The
carrier unit 9 has a combined heating-cooling element 11 in order to heat and cool thecarrier unit 9 and therefore thestructured substrate 8. With the aid of the combined heating-cooling element 11, greatly varying temperature profiles and/or curves may be implemented. - The
carrier unit 9 is rotatable using amotor 12 in the fixing plane of the structuredsubstrate 8, through which a uniform distribution ofcoating substance 24 may be achieved if it was not applied in atomized form. - A misting
nozzle 14 is provided for charging thevacuum chamber 3 with coating substance, any type of atomizer nozzle and/or feed line being able to be provided as a nozzle. This nozzle is situated directly above the surface of the structuredsubstrate 8 to be coated and is preferably movably/slidingly disposed above thecarrier unit 9 in order to optimally distributecoating substance 24 on structuredsubstrate 8. - To apply a partial vacuum to the
vacuum chamber 3, i.e., to evacuate thevacuum chamber 3, thevacuum chamber 3 is connected via avacuum line 13 to a vacuum system (not shown). - Furthermore, two spaced
connection lines 5, each having ashutoff valve 6, are provided in the floor of thevacuum chamber 3. Whenshutoff valves 6 are opened, theconnection lines 5 connect thevacuum chamber 3 to a higher pressure level than the pressure level of the evacuatedvacuum chamber 3, preferably to the atmosphere or to an excess pressure pressure means store. - The
structured substrate 8 is coated in the following way: - A
structured substrate 8 is laid on thecarrier element 9 using a robot via the openedflap 7. After thestructured substrate 8 is fixed and vacuum is applied to thevacuum grooves 10, thevacuum chamber 3 is closed using theflap 7. Theshutoff valves 6 are also closed at this time. Thestructured substrate 8 is now sprayed with coatingsubstance 24 by the mistingnozzle 14, preferably a surface activation agent, a solvent, or photoresist. Thecoating substance 24 used is process-specific depending on the surface composition of the structuredsubstrate 8, and the structure of the pits or holes. In the further procedure, thecarrier unit 9 may now be heated using the heating-cooling element 11. Even during the heating of thecarrier unit 9 and therefore thestructured substrate 8, thevacuum chamber 3 is evacuated via thevacuum line 13. After a predetermined time, thecarrier unit 9 is cooled down using the heating-cooling element 11. Subsequently, theshutoff valves 6 are opened, through which excess pressure flows suddenly into thevacuum chamber 3 and pushes the mistedcoating substance 24 into thedepressions 8 v of the structuredsubstrate 8 and thus ensures uniform coating. - It is also executable/possible to charge the
vacuum chamber 3 withcoating substance 24 vianozzle 14 only after or even during the evacuation. The charging after the evacuation has the advantage that thecoating substance 24 is not suctioned through thevacuum line 13 during the charging. Theshutoff valves 6 may be opened already during or after the charging with coatingsubstance 24. Before opening theshutoff valves 6, process-specific temperature profiles may be run through, through which a change of the consistency and/or rheological properties of thecoating substance 24 is achieved. - In the exemplary embodiment shown in
FIG. 2 , a mistingchamber 2 is provided in addition to thevacuum chamber 3. The construction of thevacuum chamber 3 havingcarrier unit 9 essentially corresponds to the construction shown inFIG. 1 . In this embodiment, the mistingnozzle 14 shown inFIG. 2 may also be dispensed with, so that the charging with coatingsubstance 24 is performed exclusively via the mistingchamber 2. - An intermediate wall is inserted between the floor of the
vacuum chamber 3 and thestructured substrate 8, so that anintermediate chamber 4 is formed, in which themotor 12 of thecarrier unit 9 is situated. The pressure level of theintermediate chamber 4 corresponds to the pressure level of thevacuum chamber 3. Theintermediate chamber 4 may also be operated at atmospheric pressure. The shaft of themotor 12 is then sealed in the transition area betweenvacuum chamber 3 andintermediate chamber 4. - In contrast to the exemplary embodiment in
FIG. 1 , theconnection lines 5 having theirshutoff valves 6 do not connect thevacuum chamber 3 to the environment, but rather to the mistingchamber 2. -
Heating elements 15 are located in the upper area of the mistingchamber 2 in order to be able to heat the mistingchamber 2. Aperipheral step 16 is located below theheating elements 15, which extends radially inward into the mistingchamber 2. Afloor plate 18 of the mistingchamber 2 is connected via a peripherally closed folded bellows 17 to thestep 16. The volume of the mistingchamber 2 may be reduced or enlarged via anactuator 19, the folded bellows 17 folding together or apart during the adjustment procedure. Aspray nozzle 20 is situated in thefloor plate 18 for charging the mistingchamber 2 withcoating substance 24. Coatingsubstance 24, preferably photoresist, solvent, or other chemicals, may be supplied to the misting chamber via aflexible connection line 21 and anadapter 22. Thespray nozzle 20 is used for atomizing thecoating substance 24, through which the volume of the mistingchamber 2 is fillable with coating substance mist. - Furthermore, an opening is provided inside the
floor plate 18, which is connected to aflexible drain line 23. Via this, excess liquids, particularly coatingsubstance 24, which accumulates in the mistingchamber 2, may be removed. - The coating of
structured substrates 8 in thedevice 1 shown inFIG. 2 is performed in the following way: - A
structured substrate 8 made of semiconductor substrate or molded plastic or glass substrate, here a wafer made of silicon, is laid on thecarrier unit 9 via theflap 7 and fixed using thevacuum grooves 10. Thestructured substrate 8 may now optionally be sprayed with a chemical substance, preferably acoating substance 24, by thenozzle 14. Preferably, thestructured substrate 8 is sprayed with a surface activation substance, a solvent, or photoresist. After the optional spraying procedure, thevacuum chamber 3 is evacuated. Thestructured substrate 8 is first heated using the heating-cooling element 11 and then cooled again, preferably before thevacuum chamber 3 is charged with coatingsubstance 24. During or after this, the mistingchamber 2, which is preferably heated via theheating elements 15, is filled with a coating substance mist by thespray nozzle 20. The pressure level within the mistingchamber 2 preferably corresponds to atmospheric pressure, but is higher than the pressure level of the evacuatedvacuum chamber 3 in any case. After a sufficient filling of the mistingchamber 2 withcoating substance 24, whose concentration is monitored via optical or chemical sensors (not shown), thevalves 6 of theconnection lines 5 are opened, through which thevacuum chamber 3 suddenly fills with coating substance mist while simultaneously being supplied with pressure. Through the sudden pressure increase, in particular from vacuum to atmospheric pressure, and possibly due to different temperature profiles and/or curves of thecarrier unit 9, a uniform lining of approximately 300 μm deep and approximately 100 μm wide cavities, pits, or other topographic figures which have a small opening on top in comparison to their depth, with a homogeneous protective layer, preferably a photoresist layer, is obtained. - Depending on the surface composition of the structured substrate, via the variation of the dwell time in the evacuated
vacuum chamber 3 and via the flooding profile (liquid or mist) and via different temperature profiles of thecarrier unit 9 and any repetition of the evacuation and charging cycles, a precisely defined coating substance deposition on all vertical, deep geometric forms of the structuredsubstrate 8 may be achieved. Equalization of the deposition is achieved through rotation of thecarrier unit 9. Possible excess liquid may also be thrown off. - In
FIGS. 3 to 7 , a further, possible process sequence is illustrated. In the process step depicted inFIG. 3 , via a vacuum line not depicted in the graphic representation according toFIG. 3 (such asvacuum line 13 inFIG. 1 ), a vacuum having an absolute pressure of less than 800 mbar, in particular less than 500 mbar, preferably 100 to 400 mbar absolute pressure, is adjusted by means of a vacuum system connected to the vacuum line. Adjusting the vacuum to the predetermined pressure has the advantage that structuredsubstrate 8 attached tocarrier unit 9 by partial vacuum remains fixed oncarrier unit 9 due to the lower partial vacuum in comparison to the absolute pressure present invacuum chamber 3. A further advantage of the absolute pressure range mentioned above is that the evaporation rate or speed of the solvent comprised in coatingsubstance 24 is not too high, but takes place in a controlled and steady manner. - In the process step depicted in
FIG. 4 , coatingsubstance 24 is applied to structuredsubstrate 8 or distributed on same. The distribution occurs for example by rotating thestructured substrate 8 at low speed of revolution, preferably between 8 and 40 revolutions per minute. Whilestructured substrate 8 rotates,nozzle 14 is preferably moved parallel to the surface of the structured substrate and along thearm 14 a ofnozzle 14 by linear motion, thecoating substance 24 being preferably applied in a spiral fashion by the simultaneous rotation and reciprocating motion. The coating substance volume flow discharging fromnozzle 14 is chosen in such a way that the surface of the structuredsubstrate 8 is wetted as completely as possible, i.e. preferably with a continuous coating substance layer. The volume flow discharging fromnozzle 14 can also be adjusted by means of a difference in pressure between thechamber 3 and a coating substance reservoir not depicted or by means of a controlled-volume pump. The vacuum invacuum chamber 3 drawscoating substance 24 intovacuum chamber 3 and onto structuredsubstrate 8. At this point in time, coatingsubstance 24 normally does not (yet) flow completely into thedepressions 8 v of structuredsubstrate 8 or the topography of structuredsubstrate 8 due to the surface tension of coatingsubstance 24. - The application of
coating substance 24 to structuredsubstrate 8 can alternatively also occur without rotation ofstructured substrate 8 solely by movingarm 14 a ofnozzle 14. A further alternative consists of disposingnozzle 14 above the center of structuredsubstrate 8 and distributingcoating substance 24 on same by rotating structuredsubstrate 8. Dosing of the coating substance volume discharging fromnozzle 14 may also occur via a controlled-volume pump and thus be adjusted more precisely. - It is also possible that coating
substance 24 already at least partially enters into the topography ordepressions 8 v of structuredsubstrate 8, which depends in particular on the surface tension of coatingsubstance 24 and the geometry ofdepressions 8 v. - After completion of the distribution step depicted in
FIG. 4 and described just now, a fluid containing in particular at least in part nitrogen and/or oxygen and/or an inert gas is admitted intovacuum chamber 3. Air is preferably used as fluid. The inflow may occur because of a difference in pressure, application of external excess pressure also being possible. Through the increase of the absolute pressure invacuum chamber 3, coatingsubstance 24 located onstructured substrate 8 is pressed intodepressions 8 v or the topography of structuredsubstrate 8 and fills same, preferably completely. This is schematically shown by means of the arrows inFIG. 5 . - In a next step, structured
substrate 8 is unloaded fromvacuum chamber 3 and disposed above aheating plate 11. Whilestructured substrate 8 approachesheating plate 11, which preferably occurs slowly and with defined speed, structuredsubstrate 8 andcoating substance 24 located indepressions 8 v andcoating substance 24 located onstructured substrate 8 already heat up in a defined manner, whereby solvent and content matter of coatingsubstance 24 to be evaporated are evaporated as slowly and defined as possible. Due to the comparatively high content of solvent in coatingsubstance 24, the coating substance volume decreases significantly and thecoating 24 depicted inFIG. 7 that is homogeneously distributed on the topography or the surface of structuredsubstrate 8 and the surface ofdepressions 8 v remains. - Typical heating parameters are for example 70° C. for 1 to 10 minutes at a distance of 5 mm from
heating plate 11 and, subsequently, 1 to 10 minutes at a distance of 0 to 3 mm from the heating plate. -
Typical coating substances 24 used in the coating system described above are: positive and negative photoresists, dielectric materials such as BCB and polyimides, protective coatings. The coating substance is usually diluted prior to coating, the dilution taking place using the following diluting agents: acetone, PGMEA, MEK, NMP, IPA, or mesitylenes, or any combination thereof. - Instead of the defined and slow approach of
structured substrate 8 toheating plate 11, structuredsubstrate 8 can also be placed directly onheating plate 11 and/or heated consecutively in a defined manner by means of different heating plates. - A combination of the individual process steps and/or device features described is also conceivable.
-
- 1 device
- 2 misting chamber
- 3 vacuum chamber
- 4 intermediate chamber
- 5 connection lines
- 6 shutoff valves
- 7 flap
- 8 structured substrate
- 8 v depressions (vias)
- 9 carrier unit
- 10 vacuum grooves
- 11 heating-cooling element
- 12 motor
- 13 vacuum line
- 14 (misting) nozzle
- 14 a arm
- 15 heating elements
- 16 step
- 17 folded bellows
- 18 floor plate
- 19 actuator
- 20 spray nozzle
- 21 flexible connection line
- 22 connection
- 23 flexible drain line
- 24 coating substance
Claims (26)
1. A device for coating a microstructured and/or nanostructured structured substrate (8), having a carrier unit (9) situated in a vacuum chamber (3) for the structured substrate (8) and having introduction means (14, 5) for introducing coating substance from a coating substance reservoir into the vacuum chamber (3) and having means (5, 6, 2) for changing the pressure level in the vacuum chamber (3) characterized in that the coating substance can be introduced by adjusting the difference in pressure between the vacuum chamber (3) and the coating substance reservoir.
2. The device according to claim 1 ,
characterized in that the introduction means (14) are implemented as an inlet line and/or spray nozzle and/or atomizer nozzle and/or ultrasonic atomizer.
3. The device according to claim 1 ,
characterized in that the carrier unit (9) has heating and/or cooling elements (11) for heating and/or cooling the structured substrate (8).
4. The device according to claim 1 ,
characterized in that the structured substrate (8) is rotatable using the carrier unit (9).
5. The device according to claim 1 ,
characterized in that a misting chamber (2) having misting means (20) for misting the coating substance, which is connected via at least one connection line (5) having a shutoff valve (6) to the vacuum chamber (3), is provided as a combined introduction and pressure changing means.
6. The device according to claim 5 ,
characterized in that at least one heating element (15) is provided for heating the misting chamber (2).
7. The device according to claims 5 or 6 ,
characterized in that the misting chamber (2) is implemented as changeable in volume.
8. The device according to claims 5 or 6 ,
characterized in that at least one sensor is provided inside the misting chamber (2) for detecting the coating substance concentration.
9. A method for coating a microstructured and/or nanostructured structured substrate (8), particularly using a device (1) according to claim 1 , having the following method steps:
charging a vacuum chamber (3) with a structured substrate (8);
evacuating the vacuum chamber (3);
introducing a coating substance from a coating substance reservoir into the vacuum chamber (3) before and/or while and/or after it is evacuated by means of a difference in pressure between the vacuum chamber (3) and the coating substance reservoir;
elevating the pressure in the vacuum chamber (3) while and/or after the coating substance is introduced.
10. The method according to claim 9 ,
characterized in that the coating substance, particularly after the evacuation of the vacuum chamber (3), is introduced into the vacuum chamber in liquid form and/or is misted in the vacuum chamber (3).
11. The method according to claims 9 or 10 ,
characterized in that the structured substrate (8) is heated in the vacuum chamber (3), preferably over a predetermined time span.
12. The method according to claims 9 or 10 ,
characterized in that the structured substrate (8) is cooled, preferably before the coating substance is introduced, particularly after heating the structured substrate (8).
13. The method according to claims 9 or 10 ,
characterized in that the coating substance is misted in a misting chamber (2), and the coating substance is introduced into the vacuum chamber (3) by opening at least one shutoff valve (6) and at least one connection line (5) between misting chamber (2) and vacuum chamber (3), preferably after reaching a desired coating substance concentration in the misting chamber (3).
14. The method according to claim 13 ,
characterized in that the pressure level in the misting chamber (2) before the shutoff valve (6) is opened is higher than the pressure level of the evacuated vacuum chamber (3), and the pressure level in the misting chamber (2) preferably corresponds to atmospheric pressure.
15. The method according to claim 13 ,
characterized in that the misting chamber (2) is heated before and/or while the coating substance is misted.
16. The method according to claim 9 ,
characterized in that structured substrate (8) made of semiconductor substrate or embossed or molded plastic material or glass substrate, preferably a wafer, having depressions (8 v), preferably pits or holes, having a depth of approximately 10 nm to approximately 400 μm, is used.
17. The method according to claim 16 ,
characterized in that the width or the diameter of the depressions (8 v) is less than their depth.
18. The method according to claim 9 ,
characterized in that photoresist and/or surface activation agent and/or solvent and/or adhesion promoter is/are used as the coating substrate.
19. The method according to claim 9 ,
characterized in that the method steps after the charging of the vacuum chamber (3) with the structured substrate (8) are repeated multiple times, preferably using different coating substances.
20. A use of a device according to claim 1 for coating a microstructured and/or nanostructured structured substrate (8) with a coating substance.
21. A microstructured and/or nanostructured structured substrate with a coating applied by a method according to claim 9 .
22. A microstructured and/or nanostructured structured substrate with a coating applied by a device according to claim 1 .
23. A structured substrate (8) according to claim 21 , wherein the depressions (8 v) having a ratio of opening diameter of the depressions (8 v) to depth of the depressions (8 v) between 1 to 2 and 1 to 20, preferably between 1 to 4 and 1 to 20, are homogeneously coated with an almost uniform layer thickness, with a coating substance (24).
24. A device for coating a microstructured and/or nanostructured structured substrate (8) having a carrier unit (9) for the structured substrate (8) situated in a chamber and having introduction means (14, 5) for introducing coating substance (24) from a coating substance reservoir into the chamber in liquid form, preferably as liquid jet, the coating substance (24) having a solvent content of at least 25% by volume, in particular at least 40% by volume, preferably at least 60% by volume, most preferably at least 70% by volume and having means (5, 6, 2) for changing the pressure level in the vacuum chamber (3) characterized in that the coating substance can be introduced by adjusting the difference in pressure between the vacuum chamber (3) and the coating substance reservoir.
25. A method for coating a microstructured and/or nanostructured structured substrate (8), in particular by means of a device (1) according to claim 24 , with the following process steps:
charging a chamber with a structured substrate (8);
introducing a coating substance (24) into the chamber in liquid form, preferably as liquid jet, the coating substance (24) from a coating substance reservoir having a solvent content of at least 25% by volume, in particular at least 40% by volume, preferably at least 60% by volume, most preferably at least 70% by volume by means of a difference in pressure between the vacuum chamber (3) and the coating substance reservoir.
26. The use of a coating substance (24) having a solvent content of at least 60% by volume, in particular at least 70% by volume, for coating a microstructured and/or nanostructured structured substrate (8), in particular by applying the coating substance (24) in liquid form, preferably as liquid jet.
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EP06006328.6A EP1840940B8 (en) | 2006-03-28 | 2006-03-28 | Apparatus and process for coating micro or nanostructured substrates |
EP06006328.6 | 2006-03-28 | ||
PCT/EP2007/002206 WO2007112833A1 (en) | 2006-03-28 | 2007-03-13 | Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate |
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US13/367,663 Active US8586132B2 (en) | 2006-03-28 | 2012-02-07 | Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate |
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- 2006-03-28 EP EP06006328.6A patent/EP1840940B8/en active Active
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2007
- 2007-03-13 US US12/225,204 patent/US20090274872A1/en not_active Abandoned
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2012
- 2012-02-07 US US13/367,663 patent/US8586132B2/en active Active
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120108040A1 (en) * | 2010-11-01 | 2012-05-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Vaporizing polymer spray deposition system |
CN102468141A (en) * | 2010-11-01 | 2012-05-23 | 台湾积体电路制造股份有限公司 | Vaporizing polymer spray deposition system |
TWI551359B (en) * | 2010-11-01 | 2016-10-01 | 台灣積體電路製造股份有限公司 | Method of applying thin film to semiconductor wafer surface |
US9595440B2 (en) | 2010-11-01 | 2017-03-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of using a vaporizing spray system to perform a trimming process |
CN106345649A (en) * | 2016-11-22 | 2017-01-25 | 中国科学技术大学 | Method and device for applying micro-nano particles |
Also Published As
Publication number | Publication date |
---|---|
US8586132B2 (en) | 2013-11-19 |
EP1840940B8 (en) | 2014-11-26 |
US20120135143A1 (en) | 2012-05-31 |
EP1840940A1 (en) | 2007-10-03 |
EP1840940B1 (en) | 2014-09-10 |
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