US20090257194A1 - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
- Publication number
- US20090257194A1 US20090257194A1 US12/385,404 US38540409A US2009257194A1 US 20090257194 A1 US20090257194 A1 US 20090257194A1 US 38540409 A US38540409 A US 38540409A US 2009257194 A1 US2009257194 A1 US 2009257194A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- chassis
- electronic apparatus
- drop
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
- B60R11/02—Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
- B60R2011/0001—Arrangements for holding or mounting articles, not otherwise provided for characterised by position
- B60R2011/0003—Arrangements for holding or mounting articles, not otherwise provided for characterised by position inside the vehicle
- B60R2011/0005—Dashboard
Definitions
- This invention relates to an electronic apparatus.
- a heat sink is arranged closely to a side wall of a chassis. Therefore, the electronic apparatus cannot be reduced in size by a thickness of the side wall of the chassis.
- the heat sink may configure one of the side walls of the chassis. This is because one of the conventionally side walls of the chassis can be eliminated.
- drops of water generated by dew condensation or the like may be adhered to the heat sink and then may be infiltrated into the chassis by way of the heat sink.
- the infiltration of the drops of water into the chassis may cause a failure of the electronic apparatus.
- the present invention has been made in view of the above circumstances and provides an electronic apparatus which has a small size and a good waterproof property.
- an electronic apparatus including a chassis; and a heat sink configuring one of side walls of the chassis, the heat sink having inner and outer wall surfaces corresponding to inner and outer surfaces of the chassis, and the heat sink having a guide portion guiding a drop of water adhered to the heat sink to the outer wall side.
- the chassis can be reduced in size. Further, since the heat sink includes the guide portion guiding the drop of the water to the outer wall surface, the chassis is prevented from being infiltrated with the drops of water.
- FIG. 1 illustrates an exterior view of an in-vehicle system
- FIG. 2 illustrates an example of the installation of the in-vehicle system into a vehicle
- FIG. 3 is a perspective view of an in-vehicle apparatus when viewed from its rear side;
- FIG. 4 is a cross-sectional perspective view of the in-vehicle apparatus from which a frame plate is removed;
- FIG. 5 is an enlarged perspective view of a heat sink
- FIG. 6 is an enlarged perspective view of a heat sink according to a variation.
- an in-vehicle system 1 includes; an in-vehicle apparatus 100 (electronic apparatus) built in a vehicle; and a portable apparatus 10 having a navigation function.
- the portable apparatus 10 can be used with being attached to a front portion 120 of the in-vehicle apparatus 100 , and also can be used independently with being detached from the in-vehicle apparatus 100 .
- the in-vehicle apparatus 100 has functions of outputting radio broadcasting and regenerating audio data and dynamic picture image data written on a storage medium such as a CD (Compact Disk) and a DVD (Digital Versatile Disk). Further, the in-vehicle apparatus 100 includes: a main portion 110 having a player and a loading slot of the storage medium; and the front portion 120 having a display portion 131 and an operational portion 132 .
- the portable apparatus 10 has a navigation function for searching for a navigation path to a destination and displaying the searched navigation path to overlap on map.
- FIG. 2 illustrates an example of the installation of the in-vehicle system 1 into a vehicle.
- the in-vehicle system 1 is provided at a dashboard substantially located in the middle of a driver's seat 52 and a passenger's seat 51 , as illustrated in FIG. 2 .
- FIG. 3 is a perspective view of the in-vehicle apparatus 100 when viewed from its rear side.
- the chassis of the in-vehicle apparatus 100 is defined by a top plate 111 , a side plate 112 , a heat sink 200 , and the like.
- the heat sink 200 is configured as a rear side wall of the chassis of the in-vehicle apparatus 100 .
- the heat sink 200 is also served as a rear side plate, so that the chassis of the in-vehicle apparatus 100 is reduced in size.
- the heat sink 200 is connected to the top plate 111 by a frame plate 300 .
- the heat sink 200 is made of a thermally high-conductive material such as aluminum or copper.
- the frame plate 300 is made of a metal.
- FIG. 4 is a cross-sectional perspective view of the in-vehicle apparatus 100 from which the frame plate 300 is removed. Further, FIG. 4 simply illustrates an internal structure of the in-vehicle apparatus 100 .
- the heat sink 200 is mounted on a substrate 400 housed within the chassis.
- a heater element 500 is mounted on the substrate 400 .
- the heater element 500 is arranged to be closely contact with the heat sink 200 .
- the heat sink 200 dissipates heat of the heater element 500 .
- electronic components are mounted on the substrate 400 .
- the frame plate 300 is provided with plural holes 320 and 330 for improving the efficiency of dissipating heat of the heat sink 200 .
- the frame plate 300 connects the heat sink 200 with the top plate 111 and a bottom plate 113 with covering an outer edge of the heat sink 200 .
- the frame plate 300 corresponds to a plate member covering the heat sink 200 .
- an upper portion of the frame plate 300 has a substantially L-shaped cross section, and is provided with the plural holes 320 and 330 .
- the plural holes 320 are aligned in the lateral direction of the frame plate 300 .
- the holes 330 are aligned in the lateral direction of the frame plate 300 .
- the holes 320 and 330 will be described later.
- FIG. 5 is an enlarged perspective view of the heat sink 200 .
- the heat sink 200 includes: an inner wall surface 210 corresponding to an inner surface of the chassis; and an outer wall surface 220 corresponding to an outer surface of the chassis. Further, the upper portion of the heat sink 200 is provided with an inclined surface 230 . The inclined surface 230 is downwardly inclined toward the outside of the chassis. Additionally, the outer wall surface 220 is provided with plural channels 240 extending in a longitudinal direction.
- the inclined surface 230 when a drop of water is adhered to the inclined surface 230 due to dew condensation or the like, the inclined surface 230 is downwardly inclined toward the outside of the chassis, thereby moving down the drop of water on the outer wall surface 220 .
- the inclined surface 230 corresponds to a guide portion for guiding the drops of water adhered to the heat sink 200 to the outer wall surface 220 . This prevents the drops of water from moving down on the inner wall surface 210 and thus infiltrating into the chassis.
- the drop of water moved into the channels 240 is suppressed from coming out of the channels 240 , and thus moving downwardly within the channels 240 .
- Such channels 240 prevents the drop of water adhered to the heat sink 200 from moving to the inner wall surface 210 side. Additionally, the provision of the channels 240 allows increase in the surface area of the heat sink 200 , so that the efficiency of dissipating heat of the heat sink 200 is also improved.
- the holes 320 and 330 provided in the frame plate 300 .
- the holes 320 are located at an upper side of the inclined surface 230 and face the inclined surface 230 .
- the hole 330 is located at a front side of the inclined surface 230 and faces the inclined surface 230 .
- the plural holes 320 and 330 are provided in the frame plate 300 in order to improve the efficiency of dissipating heat of the heat sink 200 .
- the number of the holes 320 corresponds to that of the channels 240 .
- the number of the holes 330 corresponds to that of the channels 240 .
- the heat sink 200 is provided with the inclined surface 230 at its upper portion. This allows the drop of water adhered to the heat sink 200 to be guided to the outer wall surface 220 side via the holes 320 and 330 . Therefore, the waterproof property of the in-vehicle apparatus 100 is improved. In particular, when the vehicle runs up a slope, the in-vehicle apparatus 100 is inclined such that the rear side of the chassis is directed upwardly, so that the drop of water may be infiltrated into the chassis with ease. However, even when this state is kept, the infiltration of the drop of water is suppressed.
- FIG. 6 is an enlarged perspective view of a heat sink 200 a according to a variation.
- similar components as the above-described heat sink 200 are denoted by similar reference numerals to avoid a duplication explanation.
- FIG. 6 corresponds to FIG. 5 .
- the heat sink 200 a is provided with a recess portion 250 at its upper portion.
- the recess portion 250 has a channel shape extending on the upper portion of the heat sink 200 a.
- the recess portion 250 is provided for storing the drops of water.
- an outlet 260 is provided for discharging the drop of water stored in the recess portion 250 to the outer wall surface 220 side.
- the drop of water which has moved to the heat sink 200 a side via the holes 320 , is once stored in the recess portion 250 , and then discharged via the outlet 260 .
- the drop of water discharged via the outlet 260 moves down on channels 240 a.
- the recess portion 250 and the outlet 260 correspond to a guide portion. This prevents the drop of water adhered to the heat sink 200 a from being moved on the inner wall surface 210 side and being infiltrated into the chassis.
- the present invention may be arbitrarily employed in an apparatus, having a heat sink for dissipating heat, such as a personal computer or another electronic apparatus, in addition to an in-vehicle apparatus.
- the cross sectional shapes of the channels 240 and 240 a may be any one of a substantially U shape and substantially V shape.
- a bottom surface of the recess portion 250 may be inclined to the outlet 260 in order to aid in discharging the drop of water stored in the recess portion 250 via the outlet 260 .
- the present invention is not limited to the heat sink that configures the rear side wall of the chassis, and may configure a side wall.
Abstract
Description
- 1. Field of the Invention
- This invention relates to an electronic apparatus.
- 2. Description of the Related Art
- Conventionally, an electronic apparatus having a heat sink is known. Regarding such an electronic apparatus, a structure for ensuring waterproof property is proposed (see Japanese Laid-open Patent Publication No. 09-321458).
- In the structure disclosed in Japanese Laid-open Patent Publication No. 09-321458, a heat sink is arranged closely to a side wall of a chassis. Therefore, the electronic apparatus cannot be reduced in size by a thickness of the side wall of the chassis.
- In order to reduce the size of the electronic apparatus, the heat sink may configure one of the side walls of the chassis. This is because one of the conventionally side walls of the chassis can be eliminated.
- However, when the heat sink configures one of the side walls of the chassis, drops of water generated by dew condensation or the like may be adhered to the heat sink and then may be infiltrated into the chassis by way of the heat sink. The infiltration of the drops of water into the chassis may cause a failure of the electronic apparatus.
- The present invention has been made in view of the above circumstances and provides an electronic apparatus which has a small size and a good waterproof property.
- According to one aspect of the present invention, there is provided an electronic apparatus including a chassis; and a heat sink configuring one of side walls of the chassis, the heat sink having inner and outer wall surfaces corresponding to inner and outer surfaces of the chassis, and the heat sink having a guide portion guiding a drop of water adhered to the heat sink to the outer wall side.
- With such a configuration, since the heat sink configures one of the side walls of the chassis, the chassis can be reduced in size. Further, since the heat sink includes the guide portion guiding the drop of the water to the outer wall surface, the chassis is prevented from being infiltrated with the drops of water.
- Exemplary embodiments of the present invention will be described in detail with reference to the following drawings, wherein:
-
FIG. 1 illustrates an exterior view of an in-vehicle system; -
FIG. 2 illustrates an example of the installation of the in-vehicle system into a vehicle; -
FIG. 3 is a perspective view of an in-vehicle apparatus when viewed from its rear side; -
FIG. 4 is a cross-sectional perspective view of the in-vehicle apparatus from which a frame plate is removed; -
FIG. 5 is an enlarged perspective view of a heat sink; and -
FIG. 6 is an enlarged perspective view of a heat sink according to a variation. - A description will be given of an embodiment according to the present invention with reference to the drawings.
- As illustrated in
FIG. 1 , an in-vehicle system 1 includes; an in-vehicle apparatus 100 (electronic apparatus) built in a vehicle; and aportable apparatus 10 having a navigation function. Theportable apparatus 10 can be used with being attached to afront portion 120 of the in-vehicle apparatus 100, and also can be used independently with being detached from the in-vehicle apparatus 100. - The in-
vehicle apparatus 100 has functions of outputting radio broadcasting and regenerating audio data and dynamic picture image data written on a storage medium such as a CD (Compact Disk) and a DVD (Digital Versatile Disk). Further, the in-vehicle apparatus 100 includes: amain portion 110 having a player and a loading slot of the storage medium; and thefront portion 120 having adisplay portion 131 and anoperational portion 132. Theportable apparatus 10 has a navigation function for searching for a navigation path to a destination and displaying the searched navigation path to overlap on map. -
FIG. 2 illustrates an example of the installation of the in-vehicle system 1 into a vehicle. The in-vehicle system 1 is provided at a dashboard substantially located in the middle of a driver'sseat 52 and a passenger'sseat 51, as illustrated inFIG. 2 . - Next, a description will be given of the chassis of the in-
vehicle apparatus 100.FIG. 3 is a perspective view of the in-vehicle apparatus 100 when viewed from its rear side. Referring toFIG. 3 , the chassis of the in-vehicle apparatus 100 is defined by atop plate 111, aside plate 112, aheat sink 200, and the like. Theheat sink 200 is configured as a rear side wall of the chassis of the in-vehicle apparatus 100. Theheat sink 200 is also served as a rear side plate, so that the chassis of the in-vehicle apparatus 100 is reduced in size. Theheat sink 200 is connected to thetop plate 111 by aframe plate 300. Theheat sink 200 is made of a thermally high-conductive material such as aluminum or copper. Theframe plate 300 is made of a metal. -
FIG. 4 is a cross-sectional perspective view of the in-vehicle apparatus 100 from which theframe plate 300 is removed. Further,FIG. 4 simply illustrates an internal structure of the in-vehicle apparatus 100. As illustrated inFIG. 4 , theheat sink 200 is mounted on asubstrate 400 housed within the chassis. Further, aheater element 500 is mounted on thesubstrate 400. Theheater element 500 is arranged to be closely contact with theheat sink 200. The heat sink 200 dissipates heat of theheater element 500. In addition, electronic components, not illustrated, are mounted on thesubstrate 400. - The
frame plate 300 is provided withplural holes heat sink 200. Theframe plate 300 connects theheat sink 200 with thetop plate 111 and abottom plate 113 with covering an outer edge of theheat sink 200. Theframe plate 300 corresponds to a plate member covering theheat sink 200. Further, an upper portion of theframe plate 300 has a substantially L-shaped cross section, and is provided with theplural holes plural holes 320 are aligned in the lateral direction of theframe plate 300. Similarly, theholes 330 are aligned in the lateral direction of theframe plate 300. Theholes -
FIG. 5 is an enlarged perspective view of theheat sink 200. Theheat sink 200 includes: aninner wall surface 210 corresponding to an inner surface of the chassis; and anouter wall surface 220 corresponding to an outer surface of the chassis. Further, the upper portion of theheat sink 200 is provided with aninclined surface 230. Theinclined surface 230 is downwardly inclined toward the outside of the chassis. Additionally, theouter wall surface 220 is provided withplural channels 240 extending in a longitudinal direction. - For example, when a drop of water is adhered to the
inclined surface 230 due to dew condensation or the like, theinclined surface 230 is downwardly inclined toward the outside of the chassis, thereby moving down the drop of water on theouter wall surface 220. In this manner, theinclined surface 230 corresponds to a guide portion for guiding the drops of water adhered to theheat sink 200 to theouter wall surface 220. This prevents the drops of water from moving down on theinner wall surface 210 and thus infiltrating into the chassis. - Additionally, the drop of water moved into the
channels 240 is suppressed from coming out of thechannels 240, and thus moving downwardly within thechannels 240.Such channels 240 prevents the drop of water adhered to theheat sink 200 from moving to theinner wall surface 210 side. Additionally, the provision of thechannels 240 allows increase in the surface area of theheat sink 200, so that the efficiency of dissipating heat of theheat sink 200 is also improved. - Next, a description will be given of the
holes frame plate 300. As illustrated inFIG. 4 , when theframe plate 300 is attached to theheat sink 200, theholes 320 are located at an upper side of theinclined surface 230 and face theinclined surface 230. At this time, thehole 330 is located at a front side of theinclined surface 230 and faces theinclined surface 230. In this manner, theplural holes frame plate 300 in order to improve the efficiency of dissipating heat of theheat sink 200. Further, the number of theholes 320 corresponds to that of thechannels 240. Similarly, the number of theholes 330 corresponds to that of thechannels 240. - Regarding a conventional heat sink not provided with the
inclined surface 230 at its upper portion, if plural-holes are provided at the upper portion of the frame plate, a drop of water may be infiltrated into the chassis via the holes. However, theheat sink 200 according to the present embodiment is provided with theinclined surface 230 at its upper portion. This allows the drop of water adhered to theheat sink 200 to be guided to theouter wall surface 220 side via theholes vehicle apparatus 100 is improved. In particular, when the vehicle runs up a slope, the in-vehicle apparatus 100 is inclined such that the rear side of the chassis is directed upwardly, so that the drop of water may be infiltrated into the chassis with ease. However, even when this state is kept, the infiltration of the drop of water is suppressed. - Next, a description will be given of a variation of the heat sink.
FIG. 6 is an enlarged perspective view of aheat sink 200 a according to a variation. In addition, in theheat sink 200 a according to the variation, similar components as the above-describedheat sink 200 are denoted by similar reference numerals to avoid a duplication explanation. Further,FIG. 6 corresponds toFIG. 5 . - Referring now to
FIG. 6 , theheat sink 200 a is provided with arecess portion 250 at its upper portion. Therecess portion 250 has a channel shape extending on the upper portion of theheat sink 200 a. Therecess portion 250 is provided for storing the drops of water. Additionally, in the upper portion of theheat sink 200 a, anoutlet 260 is provided for discharging the drop of water stored in therecess portion 250 to theouter wall surface 220 side. For example, the drop of water, which has moved to theheat sink 200 a side via theholes 320, is once stored in therecess portion 250, and then discharged via theoutlet 260. The drop of water discharged via theoutlet 260 moves down onchannels 240 a. In this way, therecess portion 250 and theoutlet 260 correspond to a guide portion. This prevents the drop of water adhered to theheat sink 200 a from being moved on theinner wall surface 210 side and being infiltrated into the chassis. - Although a few specific exemplary embodiments employed in the present invention have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these exemplary embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents.
- The present invention may be arbitrarily employed in an apparatus, having a heat sink for dissipating heat, such as a personal computer or another electronic apparatus, in addition to an in-vehicle apparatus.
- The cross sectional shapes of the
channels recess portion 250 may be inclined to theoutlet 260 in order to aid in discharging the drop of water stored in therecess portion 250 via theoutlet 260. The present invention is not limited to the heat sink that configures the rear side wall of the chassis, and may configure a side wall. - The present invention is based on Japanese Patent Application No. 2008-102864 filed on Apr. 10, 2008, the entire disclosure of which is hereby incorporated by reference.
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008102864A JP2009253230A (en) | 2008-04-10 | 2008-04-10 | Electronic equipment |
JP2008-102864 | 2008-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20090257194A1 true US20090257194A1 (en) | 2009-10-15 |
US7944696B2 US7944696B2 (en) | 2011-05-17 |
Family
ID=41163810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/385,404 Expired - Fee Related US7944696B2 (en) | 2008-04-10 | 2009-04-07 | Electronic apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | US7944696B2 (en) |
JP (1) | JP2009253230A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013046261A1 (en) * | 2011-09-28 | 2013-04-04 | 三菱電機株式会社 | Electronic apparatus |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5381314A (en) * | 1993-06-11 | 1995-01-10 | The Whitaker Corporation | Heat dissipating EMI/RFI protective function box |
US6038129A (en) * | 1998-04-28 | 2000-03-14 | Lucent Technologies Inc. | Cooling electronic apparatus |
US6374912B1 (en) * | 1998-12-30 | 2002-04-23 | Lucent Technologies | Deep drawn enclosure with integrated heatsink and fastening details |
US20090059534A1 (en) * | 2007-08-28 | 2009-03-05 | Koji Hata | Electronic equipment |
US7679906B2 (en) * | 2007-11-05 | 2010-03-16 | Microsoft Corporation | Liquid resistant A/C adaptor |
US7733647B2 (en) * | 2008-01-31 | 2010-06-08 | Hipro Electronics Co., Ltd. | Waterproof casing for a power supply |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09321458A (en) | 1996-05-24 | 1997-12-12 | Kokusai Electric Co Ltd | Waterproof chassis structure |
JP2000179982A (en) | 1998-12-17 | 2000-06-30 | Daikin Ind Ltd | Heat sink arrangement structure |
JP2002353645A (en) | 2001-05-30 | 2002-12-06 | Sanyo Electric Co Ltd | Enclosure for electronic equipment |
JP4166648B2 (en) | 2003-08-29 | 2008-10-15 | シャープ株式会社 | Electronic equipment casing |
-
2008
- 2008-04-10 JP JP2008102864A patent/JP2009253230A/en not_active Withdrawn
-
2009
- 2009-04-07 US US12/385,404 patent/US7944696B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5381314A (en) * | 1993-06-11 | 1995-01-10 | The Whitaker Corporation | Heat dissipating EMI/RFI protective function box |
US6038129A (en) * | 1998-04-28 | 2000-03-14 | Lucent Technologies Inc. | Cooling electronic apparatus |
US6374912B1 (en) * | 1998-12-30 | 2002-04-23 | Lucent Technologies | Deep drawn enclosure with integrated heatsink and fastening details |
US20090059534A1 (en) * | 2007-08-28 | 2009-03-05 | Koji Hata | Electronic equipment |
US7782618B2 (en) * | 2007-08-28 | 2010-08-24 | Hitachi, Ltd. | Electronic equipment |
US7679906B2 (en) * | 2007-11-05 | 2010-03-16 | Microsoft Corporation | Liquid resistant A/C adaptor |
US7733647B2 (en) * | 2008-01-31 | 2010-06-08 | Hipro Electronics Co., Ltd. | Waterproof casing for a power supply |
Also Published As
Publication number | Publication date |
---|---|
US7944696B2 (en) | 2011-05-17 |
JP2009253230A (en) | 2009-10-29 |
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