US20090173713A1 - Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores - Google Patents

Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores Download PDF

Info

Publication number
US20090173713A1
US20090173713A1 US12/018,920 US1892008A US2009173713A1 US 20090173713 A1 US20090173713 A1 US 20090173713A1 US 1892008 A US1892008 A US 1892008A US 2009173713 A1 US2009173713 A1 US 2009173713A1
Authority
US
United States
Prior art keywords
light
metallic
micropores
thin plate
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/018,920
Inventor
Chang-Li LIU
Che-Tung WU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ichia Technologies Inc
Original Assignee
Ichia Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ichia Technologies Inc filed Critical Ichia Technologies Inc
Assigned to ICHIA TECHNOLOGIES, INC. reassignment ICHIA TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, Chang-li, WU, CHE-TUNG
Publication of US20090173713A1 publication Critical patent/US20090173713A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H01H13/705—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by construction, mounting or arrangement of operating parts, e.g. push-buttons or keys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/7006—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard comprising a separate movable contact element for each switch site, all other elements being integrated in layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2209/00—Layers
    • H01H2209/002—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2209/00—Layers
    • H01H2209/068—Properties of the membrane
    • H01H2209/07—Properties of the membrane metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/036—Light emitting elements
    • H01H2219/044—Edge lighting of layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/054—Optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/054—Optical elements
    • H01H2219/058—Optical grid, collimator or microlouver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/054—Optical elements
    • H01H2219/062—Light conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2221/00—Actuators
    • H01H2221/002—Actuators integral with membrane
    • H01H2221/004—U-shaped openings surrounding keys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2231/00—Applications
    • H01H2231/022—Telephone handset
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly

Definitions

  • the present invention relates to a panel, and in particular to a method for manufacturing a metallic key panel.
  • US Patent Publication No. 2007/0205986A1 discloses a metallic panel 10 a having an elastic layer 1 a .
  • One side surface of the elastic layer 1 a has a plurality of protrusions 11 a .
  • the other side surface of the elastic layer 1 a is arranged with a plurality of metallic keys 2 a to correspond to the protrusions 11 a .
  • the metallic key 2 a has a hollowed portion 21 a with a corresponding pattern.
  • a light transmittable resin layer 22 a is filled in the hollowed portion 21 a .
  • the metallic key panel 10 a When the metallic key panel 10 a is disposed in a base 20 a of an electronic device, the metallic key panel 10 a is located on a telecommunication module 30 a .
  • the telecommunication module 30 a has a printed circuit board 31 a .
  • the circuit board 31 a has a plurality of immovable contacting points 32 a .
  • a metallic sheet 33 a is disposed on the circuit board 31 a .
  • the metallic sheet 33 a has a plurality of convex metal domes 331 a .
  • the metal dome 331 a corresponds to each contacting point 32 a
  • the other side surface of the metal sheet 331 a corresponds to the protrusion 11 a .
  • the protrusion 11 a is caused to press the surface of the metal dome 331 a , so that the metal dome 331 a is deformed and brought into contact with the contacting point 32 a , thereby generating an electronic signal output. Further, when a backlight source is lighted up, the light of the backlight source can pass through the resin layer 22 a of the metallic key 2 a , so that the user can see the position of each key clearly.
  • the above-mentioned metallic key panel 10 a has been manufactured to a compact extent and can be mounted in a small-volume electronic device, during the manufacturing process, it is necessary to fill the individual hollowed portions 21 a on the metallic key 2 a with the resin layer 22 a , and each of the metallic keys 2 a has to be adhered onto one side surface of the elastic layer 1 a accurately. As a result, the manufacturing process takes a lot of time and labors and is not simple. After the metallic key panel 10 a is combined with the base 20 a , a gap is formed between the periphery of the metallic key 2 a and the base 20 a , and the gap may be filled by external dusts or penetrated by moisture easily.
  • the metallic key cannot be pressed smoothly or an internal short circuit may occur. Further, when the backlight source of the metallic panel 10 a is lighted up, the hollowed portion 21 a of the key 2 a merely displays single luster. Therefore, the external appearance and the overall visual effect of the metallic key panel are dull.
  • the present invention is to provide a metallic panel that is simple in structure and can be manufactured easily. Further, it has a multilayer backlight source, thereby increasing the whole external appearance and visual effect of the metallic key panel. Further, filler can be applied on the metallic panel, thereby protecting against the dust and the penetration of moisture.
  • the present invention is to provide a method for manufacturing a metallic panel having multilayer arrays of micropores, which includes the steps of: preparing a metallic thin plate first; performing an etching process to the metallic thin plate so as to form a plurality of micropores and hollowed portions on the metallic thin plate with each hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a first and a second light-guiding plate are adhered on one side surface of the metallic panel. The first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process.
  • the first and second light-guiding plates are pressed to form first and second light-guiding microstructures corresponding to the pattern of the key body.
  • the first and second light-guiding microstructures are arranged alternatively.
  • a first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively.
  • a first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively.
  • a telecommunication module is adhered on one side surface of the backlight module.
  • the telecommunication module has a flexible printed circuit board.
  • the circuit board is provided thereon with a plurality of contacting points. Each contacting point corresponds to a metal dome.
  • a film layer is arranged on one side surface of the circuit board and the metal dome.
  • a protrusion is provided on one side surface of the protruding portion of the film layer.
  • FIGS. 1( a ) and 1 ( b ) are schematic views showing a conventional metallic key panel
  • FIG. 2 is a schematic view showing the method for manufacturing the metallic panel of the present invention
  • FIGS. 3( a ) to 3 ( d ) are schematic views showing the respective structures generated by the method for manufacturing the metallic panel of the present invention.
  • FIG. 4 is an exploded view showing the metallic panel and the backlight module of the present invention.
  • FIG. 5 is a side view of FIG. 4 ;
  • FIG. 6( a ) is an assembled side view showing the metallic panel, the backlight module and the telecommunication module of the present invention
  • FIG. 6( b ) is a schematic view showing a pressing action of the present invention.
  • FIG. 7 is an assembled side view showing the metallic panel, the backlight module and another telecommunication module of the present invention.
  • FIG. 8 is a schematic view showing another embodiment of the present invention.
  • FIG. 9 is a schematic view showing the metallic panel of the present invention being used in a mobile phone.
  • FIG. 10 is a schematic view showing the metallic panel of the present invention being used in a personal digital assistant.
  • FIG. 11 is a schematic view showing the metallic panel of the present invention being used in an automobile stereo panel.
  • FIG. 2 it is a flow chart showing the method for manufacturing a metallic panel having multilayer arrays of micropores.
  • the method for manufacturing a metallic key panel having arrays of micropores includes the following steps.
  • a metallic thin plate 10 is prepared as shown in FIG. 3( a ).
  • the metallic thin plate 10 is any one of a stainless steel (SUS) or Al—Mg alloy.
  • an etching process is applied to the metallic thin plate 10 so as to form a plurality of micropores 11 and hollowed portions 12 on the metallic thin plate 10 .
  • the hollowed portion 12 is formed as a key body 13 .
  • the plurality of micropores 11 is arranged to form a pattern 14 on the surface of the key body 13 , as shown in FIG. 3( b ).
  • the above-mentioned pattern 14 is any one of numerals, characters, specific symbols (“#”, “*”, “.”) and direction symbols.
  • the metallic thin plate 10 is cut to form a metallic panel 1 of a predetermined shape, as shown in FIGS. 3( c ) and 3 ( d ).
  • a backlight module 2 is adhered, as shown in FIGS. 4 and 5 .
  • a plate-like first light-guiding plate 21 and a second light-guiding plate 22 are adhered on one side surface of the metallic panel 1 .
  • the first light-guiding plate 21 and the second light-guiding plate 22 can be formed on one side of the metallic panel 1 via a hot pressing or adhering process.
  • the first light-guiding plate 21 and the second light-guiding plate 22 are pressed to form first light-guiding microstructures 211 and second light-guiding microstructures 221 each corresponding to the pattern 14 of the key body 13 .
  • the first light-guiding microstructure 211 and the second light-guiding microstructure 221 are arranged alternatively on the key body 13 .
  • first set of light-emitting units 23 and a second set of light-emitting units 24 are arranged on one end of the first light-guiding plate 21 and a second light-guiding plate 22 , respectively.
  • a sheet-like first shielding unit 25 and a sheet-like second shielding unit 26 are arranged above the first set of light-emitting units 23 and the second set of light-emitting units 24 , respectively.
  • the first shielding unit 25 or the second shielding unit 26 shields the light generated by the first set of light-emitting units 23 or the second set of light-emitting units 24 , thereby avoiding the mutual interference of light.
  • the first set of light-emitting units 23 and the second set of light-emitting units 24 are constituted of a plurality of light-emitting diodes of the same or different colors.
  • the above-mentioned first and second light-guiding microstructures 211 , 221 are recessed in the first and second light-guiding plates 21 , 22 , or protrude from one side surfaces of the first and second light-guiding plates 21 , 22 , respectively.
  • a telecommunication module 3 is adhered, as shown in FIG. 6 .
  • a telecommunication module 3 is adhered on one side surface of the backlight module 2 .
  • the telecommunication module 3 has a flexible printed circuit board (FPCB) 31 .
  • the circuit board 31 is provided thereon with a plurality of contacting points 311 .
  • Each contacting point 311 corresponds to a metal dome 32 .
  • a film layer 33 is disposed on one side surface of the circuit board 31 and the metal dome 32 .
  • One side surface of the protruding portion of the film layer 33 is provided with a protrusion 34 .
  • the protrusion 34 corresponds to the first and second light-guiding microstructures 211 , 221 of the first and second light-guiding plates 21 , 22 .
  • FIG. 5 it is a schematic view showing the backlight module of the present invention after being lighted up.
  • the circuit not shown
  • the light generated by the first set of light-emitting units 23 or the second set of light-emitting units 24 enters one end of the first light-guiding plate 21 or the second light-guiding plate 22 .
  • the light 4 is reflected by the first light-guiding microstructure 211 or the second light-guiding microstructure 221 onto the key body 13 .
  • the light 4 passes through the plurality of micropores 11 to display the pattern 14 on the surface of the key body 13 .
  • one of the first set of light-emitting units 23 and the second set of light-emitting units 24 are lighted up, only the patterns 14 on several rows or lines of key bodies 13 on the metallic panel 1 can be displayed, thereby facilitating the user to operate a TV game or multimedia.
  • the patterns 14 on several rows or lines of key bodies 13 on the metallic panel 1 are displayed to have the same color, while some other rows or lines will display another color.
  • the lights generated by the first set of light-emitting units 23 and the second set of light-emitting units 24 are mixed to generate a light 4 of a third kind of color.
  • FIG. 6( a ) is an assembled side view showing the metallic panel, the backlight module and the telecommunication module of the present invention
  • FIG. 6( b ) is a schematic view showing a pressing action of the present invention.
  • the key body 13 of the metallic panel 1 is pressed, the key body 13 is deformed to cause the protrusion 34 to press on the film layer 33 .
  • the metal dome 32 is deformed and pressed to contact with the contacting point 311 , thereby generating a conductive signal output.
  • the metallic panel 1 When one side surface of the metallic key panel 1 is not pressed by an external force, due to the elasticity of the metallic panel 1 and the metal dome 32 , the metallic panel 1 may rise automatically to its original state.
  • FIG. 7 is an assembled side view showing the metallic panel, the backlight module and another telecommunication module of the present invention.
  • another telecommunication module 3 is arranged on one side surface of the backlight module.
  • the telecommunication module has a flexible printed circuit board (FPCB) 31 .
  • the circuit board 31 is provided thereon with a plurality of contacting points 311 .
  • Each contacting point 311 corresponds to a metal dome 32 .
  • a film layer 33 is arranged on one side surface of the circuit board 31 and the metal dome 32 .
  • the metal dome 33 corresponds to the first and second light-guiding microstructures 211 , 221 on the first and second light-guiding plates 21 , 22 .
  • the key body 13 on the metallic panel 1 When the surface of the key body 13 on the metallic panel 1 is pressed by an external force, the key body 13 is deformed to press the film layer 33 . As a result, the metal dome 32 is deformed and pressed to contact with the contacting point 311 , thereby generating a conductive signal output.
  • the metallic panel 1 When one side surface of the metallic key panel 1 is not pressed by an external force, due to the elasticity of the metallic panel 1 and the metal dome 32 , the metallic panel 1 may rise automatically to its original state.
  • FIG. 8 it is a schematic view showing another embodiment of the present invention.
  • the plurality of micropores 11 on the metallic panel 1 can be filled with filler 5 .
  • the filler can be applied on the surface of the metallic key panel 1 with the filler 5 penetrating into the micropores 11 , thereby avoiding the accumulation of dust and the penetration of moisture.
  • the filler 5 can be any one of UV glue, silicone, Vitro, epoxy or synthetic resin.
  • FIG. 9 it is a schematic view showing the metallic panel of the present invention being used in a mobile phone.
  • the metallic panel 1 of the present invention can be applied to a mobile phone 6 .
  • the metallic panel 1 When the light illuminates the metallic panel 1 , the metallic panel 1 generates a backlight of a luster, thereby increasing the aesthetic feeling of the mobile phone 6 .
  • FIG. 10 it is a schematic view showing the metallic panel of the present invention being used in a personal digital assistant.
  • the metallic panel 1 of the present invention is manufactured completely, in addition to the mobile phone 6 , it can be applied to a personal digital assistant (PDA) 7 .
  • PDA personal digital assistant
  • the light illuminates the metallic panel 1 it generates a backlight of a luster, thereby increasing the aesthetic feeling of the personal digital assistant (PDA) 7 .
  • FIG. 11 it is a schematic view showing the metallic panel of the present invention being used in an automobile stereo panel.
  • the metallic panel 1 of the present invention is manufactured completely, in addition to the mobile phone 6 and the personal digital assistant (PDA) 7 , it can be mounted in an automobile stereo panel 8 , thereby controlling the operations of an air conditioning system, audio-video system and satellite navigation system.
  • PDA personal digital assistant

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Push-Button Switches (AREA)
  • Planar Illumination Modules (AREA)

Abstract

A method for manufacturing a metallic panel having multilayer arrays of micropores includes the steps of: preparing a metallic thin plate first; forming a plurality of micropores and hollowed portions on the metallic thin plate with the hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a multilayer backlight module is arranged on one side surface of the metallic panel via a hot pressing or adhering process. Finally, a telecommunication module is adhered on one side surface of the backlight module. In this way, the metallic panel having multilayer arrays of micropores can be completed.

Description

    RELATED APPLICATIONS
  • U.S. patent application Ser. No. 11/560,962 filed on Nov. 17, 2006, Ser. No. 11/957,771 filed on Dec. 17, 2007 and Ser. No. 12/014,857 filed on Jan. 17, 2006 are submitted as related applications.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a panel, and in particular to a method for manufacturing a metallic key panel.
  • 2. Description of Prior Art
  • As shown in FIGS. 1( a) and 1(b), US Patent Publication No. 2007/0205986A1 discloses a metallic panel 10 a having an elastic layer 1 a. One side surface of the elastic layer 1 a has a plurality of protrusions 11 a. The other side surface of the elastic layer 1 a is arranged with a plurality of metallic keys 2 a to correspond to the protrusions 11 a. The metallic key 2 a has a hollowed portion 21 a with a corresponding pattern. A light transmittable resin layer 22 a is filled in the hollowed portion 21 a. When the metallic key panel 10 a is disposed in a base 20 a of an electronic device, the metallic key panel 10 a is located on a telecommunication module 30 a. The telecommunication module 30 a has a printed circuit board 31 a. The circuit board 31 a has a plurality of immovable contacting points 32 a. A metallic sheet 33 a is disposed on the circuit board 31 a. The metallic sheet 33 a has a plurality of convex metal domes 331 a. The metal dome 331 a corresponds to each contacting point 32 a, and the other side surface of the metal sheet 331 a corresponds to the protrusion 11 a. When the metallic key 2 a is pressed, the protrusion 11 a is caused to press the surface of the metal dome 331 a, so that the metal dome 331 a is deformed and brought into contact with the contacting point 32 a, thereby generating an electronic signal output. Further, when a backlight source is lighted up, the light of the backlight source can pass through the resin layer 22 a of the metallic key 2 a, so that the user can see the position of each key clearly.
  • Although the above-mentioned metallic key panel 10 a has been manufactured to a compact extent and can be mounted in a small-volume electronic device, during the manufacturing process, it is necessary to fill the individual hollowed portions 21 a on the metallic key 2 a with the resin layer 22 a, and each of the metallic keys 2 a has to be adhered onto one side surface of the elastic layer 1 a accurately. As a result, the manufacturing process takes a lot of time and labors and is not simple. After the metallic key panel 10 a is combined with the base 20 a, a gap is formed between the periphery of the metallic key 2 a and the base 20 a, and the gap may be filled by external dusts or penetrated by moisture easily. As a result, the metallic key cannot be pressed smoothly or an internal short circuit may occur. Further, when the backlight source of the metallic panel 10 a is lighted up, the hollowed portion 21 a of the key 2 a merely displays single luster. Therefore, the external appearance and the overall visual effect of the metallic key panel are dull.
    • SUMMARY OF THE INVENTION
  • In view of the above drawbacks, the present invention is to provide a metallic panel that is simple in structure and can be manufactured easily. Further, it has a multilayer backlight source, thereby increasing the whole external appearance and visual effect of the metallic key panel. Further, filler can be applied on the metallic panel, thereby protecting against the dust and the penetration of moisture.
  • The present invention is to provide a method for manufacturing a metallic panel having multilayer arrays of micropores, which includes the steps of: preparing a metallic thin plate first; performing an etching process to the metallic thin plate so as to form a plurality of micropores and hollowed portions on the metallic thin plate with each hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a first and a second light-guiding plate are adhered on one side surface of the metallic panel. The first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process. The first and second light-guiding plates are pressed to form first and second light-guiding microstructures corresponding to the pattern of the key body. The first and second light-guiding microstructures are arranged alternatively. A first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively. A first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively. Finally, a telecommunication module is adhered on one side surface of the backlight module. The telecommunication module has a flexible printed circuit board. The circuit board is provided thereon with a plurality of contacting points. Each contacting point corresponds to a metal dome. A film layer is arranged on one side surface of the circuit board and the metal dome. A protrusion is provided on one side surface of the protruding portion of the film layer.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1( a) and 1(b) are schematic views showing a conventional metallic key panel;
  • FIG. 2 is a schematic view showing the method for manufacturing the metallic panel of the present invention;
  • FIGS. 3( a) to 3(d) are schematic views showing the respective structures generated by the method for manufacturing the metallic panel of the present invention;
  • FIG. 4 is an exploded view showing the metallic panel and the backlight module of the present invention;
  • FIG. 5 is a side view of FIG. 4;
  • FIG. 6( a) is an assembled side view showing the metallic panel, the backlight module and the telecommunication module of the present invention;
  • FIG. 6( b) is a schematic view showing a pressing action of the present invention;
  • FIG. 7 is an assembled side view showing the metallic panel, the backlight module and another telecommunication module of the present invention;
  • FIG. 8 is a schematic view showing another embodiment of the present invention;
  • FIG. 9 is a schematic view showing the metallic panel of the present invention being used in a mobile phone;
  • FIG. 10 is a schematic view showing the metallic panel of the present invention being used in a personal digital assistant; and
  • FIG. 11 is a schematic view showing the metallic panel of the present invention being used in an automobile stereo panel.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The detailed description and technical contents of the present invention will be explained with reference to the accompanying drawings.
  • With reference to FIG. 2, it is a flow chart showing the method for manufacturing a metallic panel having multilayer arrays of micropores. As shown in this figure, according to the present invention, the method for manufacturing a metallic key panel having arrays of micropores includes the following steps. First, in the step 100, a metallic thin plate 10 is prepared as shown in FIG. 3( a). The metallic thin plate 10 is any one of a stainless steel (SUS) or Al—Mg alloy.
  • In the step 102, an etching process is applied to the metallic thin plate 10 so as to form a plurality of micropores 11 and hollowed portions 12 on the metallic thin plate 10. The hollowed portion 12 is formed as a key body 13. The plurality of micropores 11 is arranged to form a pattern 14 on the surface of the key body 13, as shown in FIG. 3( b). The above-mentioned pattern 14 is any one of numerals, characters, specific symbols (“#”, “*”, “.”) and direction symbols.
  • In the step 104, the metallic thin plate 10 is cut to form a metallic panel 1 of a predetermined shape, as shown in FIGS. 3( c) and 3(d).
  • In the step 106, a backlight module 2 is adhered, as shown in FIGS. 4 and 5. A plate-like first light-guiding plate 21 and a second light-guiding plate 22 are adhered on one side surface of the metallic panel 1. The first light-guiding plate 21 and the second light-guiding plate 22 can be formed on one side of the metallic panel 1 via a hot pressing or adhering process. The first light-guiding plate 21 and the second light-guiding plate 22 are pressed to form first light-guiding microstructures 211 and second light-guiding microstructures 221 each corresponding to the pattern 14 of the key body 13. The first light-guiding microstructure 211 and the second light-guiding microstructure 221 are arranged alternatively on the key body 13. Further, a first set of light-emitting units 23 and a second set of light-emitting units 24 are arranged on one end of the first light-guiding plate 21 and a second light-guiding plate 22, respectively. A sheet-like first shielding unit 25 and a sheet-like second shielding unit 26 are arranged above the first set of light-emitting units 23 and the second set of light-emitting units 24, respectively. The first shielding unit 25 or the second shielding unit 26 shields the light generated by the first set of light-emitting units 23 or the second set of light-emitting units 24, thereby avoiding the mutual interference of light. The first set of light-emitting units 23 and the second set of light-emitting units 24 are constituted of a plurality of light-emitting diodes of the same or different colors. The above-mentioned first and second light-guiding microstructures 211, 221 are recessed in the first and second light-guiding plates 21, 22, or protrude from one side surfaces of the first and second light-guiding plates 21, 22, respectively.
  • In the step 108, a telecommunication module 3 is adhered, as shown in FIG. 6. A telecommunication module 3 is adhered on one side surface of the backlight module 2. The telecommunication module 3 has a flexible printed circuit board (FPCB) 31. The circuit board 31 is provided thereon with a plurality of contacting points 311. Each contacting point 311 corresponds to a metal dome 32. A film layer 33 is disposed on one side surface of the circuit board 31 and the metal dome 32. One side surface of the protruding portion of the film layer 33 is provided with a protrusion 34. The protrusion 34 corresponds to the first and second light-guiding microstructures 211, 221 of the first and second light-guiding plates 21, 22.
  • With reference to FIG. 5, it is a schematic view showing the backlight module of the present invention after being lighted up. As shown in this figure, under the control of the circuit (not shown) of an associated electronic device, when one of the first set of light-emitting units 23 and the second set of light-emitting units 24 are lighted up, the light generated by the first set of light-emitting units 23 or the second set of light-emitting units 24 enters one end of the first light-guiding plate 21 or the second light-guiding plate 22. Then, the light 4 is reflected by the first light-guiding microstructure 211 or the second light-guiding microstructure 221 onto the key body 13. The light 4 passes through the plurality of micropores 11 to display the pattern 14 on the surface of the key body 13. When one of the first set of light-emitting units 23 and the second set of light-emitting units 24 are lighted up, only the patterns 14 on several rows or lines of key bodies 13 on the metallic panel 1 can be displayed, thereby facilitating the user to operate a TV game or multimedia.
  • When the first set of light-emitting units 23 and the second set of light-emitting units 24 are lighted up at the same time, the patterns 14 on several rows or lines of key bodies 13 on the metallic panel 1 are displayed to have the same color, while some other rows or lines will display another color. Alternatively, the lights generated by the first set of light-emitting units 23 and the second set of light-emitting units 24 are mixed to generate a light 4 of a third kind of color.
  • Please refer to FIGS. 6( a) and 6(b). FIG. 6( a) is an assembled side view showing the metallic panel, the backlight module and the telecommunication module of the present invention, and FIG. 6( b) is a schematic view showing a pressing action of the present invention. As shown in these figures, when the surface of the key body 13 of the metallic panel 1 is pressed, the key body 13 is deformed to cause the protrusion 34 to press on the film layer 33. As a result, the metal dome 32 is deformed and pressed to contact with the contacting point 311, thereby generating a conductive signal output.
  • When one side surface of the metallic key panel 1 is not pressed by an external force, due to the elasticity of the metallic panel 1 and the metal dome 32, the metallic panel 1 may rise automatically to its original state.
  • Please refer to FIG. 7, which is an assembled side view showing the metallic panel, the backlight module and another telecommunication module of the present invention. As shown in this figure, another telecommunication module 3 is arranged on one side surface of the backlight module. The telecommunication module has a flexible printed circuit board (FPCB) 31. The circuit board 31 is provided thereon with a plurality of contacting points 311. Each contacting point 311 corresponds to a metal dome 32. A film layer 33 is arranged on one side surface of the circuit board 31 and the metal dome 32. The metal dome 33 corresponds to the first and second light-guiding microstructures 211, 221 on the first and second light-guiding plates 21, 22.
  • When the surface of the key body 13 on the metallic panel 1 is pressed by an external force, the key body 13 is deformed to press the film layer 33. As a result, the metal dome 32 is deformed and pressed to contact with the contacting point 311, thereby generating a conductive signal output.
  • When one side surface of the metallic key panel 1 is not pressed by an external force, due to the elasticity of the metallic panel 1 and the metal dome 32, the metallic panel 1 may rise automatically to its original state.
  • Please refer to FIG. 8, it is a schematic view showing another embodiment of the present invention. As shown in this figure, the plurality of micropores 11 on the metallic panel 1 can be filled with filler 5. Alternatively, the filler can be applied on the surface of the metallic key panel 1 with the filler 5 penetrating into the micropores 11, thereby avoiding the accumulation of dust and the penetration of moisture. In this figure, the filler 5 can be any one of UV glue, silicone, Vitro, epoxy or synthetic resin.
  • With reference to FIG. 9, it is a schematic view showing the metallic panel of the present invention being used in a mobile phone. As shown in this figure, after the metallic panel 1 of the present invention is manufactured completely, it can be applied to a mobile phone 6. When the light illuminates the metallic panel 1, the metallic panel 1 generates a backlight of a luster, thereby increasing the aesthetic feeling of the mobile phone 6.
  • With reference to FIG. 10, it is a schematic view showing the metallic panel of the present invention being used in a personal digital assistant. As shown in this figure, after the metallic panel 1 of the present invention is manufactured completely, in addition to the mobile phone 6, it can be applied to a personal digital assistant (PDA) 7. When the light illuminates the metallic panel 1, it generates a backlight of a luster, thereby increasing the aesthetic feeling of the personal digital assistant (PDA) 7.
  • With reference to FIG. 11, it is a schematic view showing the metallic panel of the present invention being used in an automobile stereo panel. As shown in this figure, after the metallic panel 1 of the present invention is manufactured completely, in addition to the mobile phone 6 and the personal digital assistant (PDA) 7, it can be mounted in an automobile stereo panel 8, thereby controlling the operations of an air conditioning system, audio-video system and satellite navigation system.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (24)

1. A method for manufacturing a metallic panel having multilayer arrays of micropores, the metallic panel being disposed on a surface of an electronic device, the method comprising the steps of:
(a) preparing a metallic thin plate;
(b) forming arrays of micropores on the metallic thin plate, the arrays of micropores forming patterns;
(c) cutting the metallic thin plate to form a metallic panel of a predetermined shape; and
(d) adhering a multilayer backlight module on one side surface of the metallic panel.
2. The method according to claim 1, wherein the metallic thin plate prepared in the step (a) is any one of a stainless steel (SUS) or Al—Mg alloy.
3. The method according to claim 1, wherein the metallic thin plate prepared in the step (a) further comprises stripe-like hollowed portions, and each strip-like hollowed portion forms a key body.
4. The method according to claim 1, wherein the pattern formed in the step (b) is formed on a key body.
5. The method according to claim 1, wherein the pattern formed in the step (b) comprises any one of numerals, characters, special symbols and direction symbols.
6. The method according to claim 1, wherein filler is filled in the micropores prior to performing the step (c).
7. The method according to claim 6, wherein the filler is any one of UV glue, silicone, Vitro, epoxy or synthetic resin.
8. The method according to claim 1, wherein the multilayer backlight module of the step (d) is formed by adhering at least a first and second light-guiding plates on one side surface of the metallic panel, the first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process, the first and second light-guiding plates have first and second light-guiding microstructures respectively, and the first and second light-guiding microstructures are arranged alternatively on the key body.
9. The method according to claim 8, wherein a first set of light-emitting units and a second set of light-emitting units are arranged on the first and second light-guiding plates respectively, a first shielding unit and a second shielding unit are arranged above the first and second sets of light-emitting units and the first and second light-guiding plates respectively.
10. The method according to claim 8, wherein the first and second sets of light-emitting units are constituted of a plurality of light-emitting diodes having the same or different colors.
11. The method according to claim 8, wherein the first and second light-guiding microstructures on the first and second light-guiding plates are recessed in or protrude from one side surface of the first and second light-guiding plates.
12. A method for manufacturing a metallic panel having multilayer arrays of micropores, the metallic panel being disposed on a surface of an electronic device, the method comprising the steps of:
(a) preparing a metallic thin plate;
(b) forming arrays of micropores on the metallic thin plate, the arrays of micropores forming patterns;
(c) cutting the metallic thin plate to form a metallic panel of a predetermined shape;
(d) adhering a multilayer backlight module on one side surface of the metallic panel; and
(e) adhering a telecommunication module on one side surface of the multilayer backlight module.
13. The method according to claim 12, wherein the metallic thin plate prepared in the step (a) is any one of a stainless steel (SUS) or Al—Mg alloy.
14. The method according to claim 12, wherein the metallic thin plate prepared in the step (a) further comprises stripe-like hollowed portions, and each strip-like hollowed portion forms a key body.
15. The method according to claim 12, wherein the pattern formed in the step (b) is formed on a key body.
16. The method according to claim 12, wherein the pattern formed in the step (b) comprises any one of numerals, characters, special symbols and direction symbols.
17. The method according to claim 12, wherein a filler is filled in the micropores prior to performing the step (c).
18. The method according to claim 17, wherein the filler is any one of UV glue, silicone, Vitro, epoxy or synthetic resin.
19. The method according to claim 12, wherein the multilayer backlight module of the step (d) is formed by adhering at least a first and second light-guiding plates on one side surface of the metallic panel, the first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process, the first and second light-guiding plates have first and second light-guiding microstructures respectively, the first and second light-guiding microstructures are arranged alternatively on the key body.
20. The method according to claim 19, wherein a first set of light-emitting units and a second set of light-emitting units are arranged on the first and second light-guiding plates respectively, a first shielding unit and a second shielding unit are arranged above the first and second sets of light-emitting units and the first and second light-guiding plates respectively.
21. The method according to claim 20, wherein the first and second sets of light-emitting units are constituted of a plurality of light-emitting diodes having the same or different colors.
22. The method according to claim 19, wherein the light-guiding microstructures on the two light-guiding plates are recessed in or protrude from one side surface of the light-guiding plates.
23. The method according to claim 12, wherein the telecommunication module of the step (e) has a flexible printed circuit board, the circuit board has thereon a plurality of contacting points, each contacting point corresponds to a metal dome, a film layer is arranged on one side surface of the circuit board and the metal dome, a protrusion is provided on one side surface of a protruding portion of the film layer.
24. The method according to claim 13, wherein the telecommunication module of the step (e) has a flexible printed circuit board, the circuit board has thereon a plurality of contacting points, each contacting point corresponds to a metal dome, a film layer is arranged on one side surface of the circuit board and the metal dome.
US12/018,920 2008-01-03 2008-01-24 Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores Abandoned US20090173713A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097100206A TW200931294A (en) 2008-01-03 2008-01-03 A fabrication process for multiple-layer color metal panel with array micro-holes
TW097100206 2008-01-03

Publications (1)

Publication Number Publication Date
US20090173713A1 true US20090173713A1 (en) 2009-07-09

Family

ID=40843742

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/018,920 Abandoned US20090173713A1 (en) 2008-01-03 2008-01-24 Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores

Country Status (2)

Country Link
US (1) US20090173713A1 (en)
TW (1) TW200931294A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3048121A1 (en) * 2016-02-23 2017-08-25 Valeo Comfort & Driving Assistance PUSH BUTTON FOR IDENTIFIER FOR MOTOR VEHICLE
US10394340B2 (en) * 2015-02-02 2019-08-27 Microsoft Technology Licensing, Llc Backlit illumination of electronics

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600214B2 (en) * 2000-05-15 2003-07-29 Hitachi Aic Inc. Electronic component device and method of manufacturing the same
US20050030730A1 (en) * 2003-05-28 2005-02-10 Enplas Corporation Light guide plate, surface light source device and image display
US20070034978A1 (en) * 2004-06-17 2007-02-15 Pralle Martin U Photonic crystal emitter, detector and sensor
US20070205986A1 (en) * 2004-03-17 2007-09-06 Kim Hak W Metal Keypad Assembly for Mobile Phone and Manufacturing Method of Keypad
US20080073186A1 (en) * 2004-12-28 2008-03-27 Yoshio Kenmochi Thin Key Sheet and Thin Key Unit Incorporating the Thin Key Sheet
US20080117635A1 (en) * 2006-11-17 2008-05-22 Ko-Ju Chen Multi-Layer Light Guiding Structure And Method For Using The Same
US20080239696A1 (en) * 2005-10-17 2008-10-02 Sony Ericsson Mobile Communications Ab Information Presenting Device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600214B2 (en) * 2000-05-15 2003-07-29 Hitachi Aic Inc. Electronic component device and method of manufacturing the same
US20050030730A1 (en) * 2003-05-28 2005-02-10 Enplas Corporation Light guide plate, surface light source device and image display
US20070205986A1 (en) * 2004-03-17 2007-09-06 Kim Hak W Metal Keypad Assembly for Mobile Phone and Manufacturing Method of Keypad
US20070034978A1 (en) * 2004-06-17 2007-02-15 Pralle Martin U Photonic crystal emitter, detector and sensor
US20080073186A1 (en) * 2004-12-28 2008-03-27 Yoshio Kenmochi Thin Key Sheet and Thin Key Unit Incorporating the Thin Key Sheet
US20080239696A1 (en) * 2005-10-17 2008-10-02 Sony Ericsson Mobile Communications Ab Information Presenting Device
US20080117635A1 (en) * 2006-11-17 2008-05-22 Ko-Ju Chen Multi-Layer Light Guiding Structure And Method For Using The Same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10394340B2 (en) * 2015-02-02 2019-08-27 Microsoft Technology Licensing, Llc Backlit illumination of electronics
FR3048121A1 (en) * 2016-02-23 2017-08-25 Valeo Comfort & Driving Assistance PUSH BUTTON FOR IDENTIFIER FOR MOTOR VEHICLE

Also Published As

Publication number Publication date
TW200931294A (en) 2009-07-16

Similar Documents

Publication Publication Date Title
US7834285B2 (en) Keypad assembly
US8186866B2 (en) Metallic panel assembly having multilayer arrays of micropores
US7503683B2 (en) Light guide method of double-layer light guide plate and keypad structure using the double-layer light guide plate
US7455416B2 (en) Light guide structure and keypad having the same
US7800005B2 (en) Thin keypad assembly
US7893375B2 (en) Non-backlighted illuminating keypad
US20080218991A1 (en) Light-guiding method of light-guiding plate and key pad assembly using the light-guiding plate
US7866032B2 (en) Method of manufacturing metal keypad panel with micropore array
US7626133B2 (en) Metallic panel assembly having ripple luster
US7449642B1 (en) Metallic keypad panel assembly having ripple luster
US8056216B2 (en) Method of manufacturing non-backlighted illuminating keypad
US8085246B2 (en) Keypad panel assembly having laterally-illuminated keypad surface
US7777144B2 (en) Metal keypad panel structure with micropore array
TW200840700A (en) Manufacturing method for electronic device's panel and structure thereof
US20090178753A1 (en) Process for keypad panel having arrays of micropores
US20090178906A1 (en) Keypad panel assembly having arrays of micropores
US20090173713A1 (en) Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores
JP2001006479A (en) Switch button
US7735214B2 (en) Method for manufacturing metallic keypad panel having ripple luster
JP5136934B2 (en) Flexible printed wiring board, input module and portable device
CN101436476B (en) Preparation method for metal key-press panel with corrugated luster
CN201134371Y (en) Metallic panel structure with multiple groups of micropores
KR20060000264A (en) Keypad for electronic appliance and thereof manufacturing method
CN101447349A (en) Preparation method for metal keystroke panel with multi-group micropores
CN101567276B (en) Manufacturing method of non-backlit displayed illumination key panel

Legal Events

Date Code Title Description
AS Assignment

Owner name: ICHIA TECHNOLOGIES, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, CHANG-LI;WU, CHE-TUNG;REEL/FRAME:020407/0067

Effective date: 20080104

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION