US20090117835A1

US20090117835A1 - Expandable polishing platen device

Info

Publication number: US20090117835A1
Application number: US11/934,782
Authority: US
Inventors: Hui-Shen Shih
Original assignee: United Microelectronics Corp
Current assignee: United Microelectronics Corp
Priority date: 2007-11-04
Filing date: 2007-11-04
Publication date: 2009-05-07

Abstract

An expandable polishing platen device is disclosed, in which a polishing platen top includes a plurality of separate platen top sections. When the polishing platen device is not in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of a first group of platen top sections. When the polishing platen device is in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of the first group of platen top sections and a second group of platen top sections. Polishing pads are bonded to the surface of each of platen top sections respectively and may include various types. Therefore, the expandable polishing platen device of the present invention may have versatile polishing functions.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a polishing device, and particularly to a polishing platen device for chemical mechanical polishing (CMP) and electro chemical mechanical polishing (ECMP), in which the polishing platen top is expandable.
2. Description of the Prior Art
Chemical mechanical polishing is a planarization technique used to planarize the surface of integrated circuits formed on a semiconductor wafer so that high-density multi-layered interconnections can be formed on the planarized surface. Generally, CMP is mainly applied in the fabrication of inter-layer dielectric (ILD), plug, shallow trench isolation (STI), damascene structure, and the like.
Please refer to FIG. 1. FIG. 1 is a schematic diagram of a conventional CMP apparatus. As shown in FIG. 1, the CMP apparatus includes a rotatable platen 10, a polishing pad 12 bonded to the platen 10 and able to rotate with the platen 10, a slurry supply 14 for supplying slurry 16 to the polishing pad 12, and a CMP head 18 used to fix a wafer 20. During a CMP process, the wafer 20 is placed between the CMP head 18 and the polishing pad 12. The CMP head 18 brings pressure upon the wafer 20 and drives the wafer 20 to rotate so that mechanical polishing effect can be generated between the wafer 20 and the polishing pad 12. Meanwhile, the material layer to be planarized of the wafer 20 reacts with the slurry 16, thereby generating chemical polishing effect. The conventional CMP process is thus performed. The conventional rotatable platen 10 has an unalterable shape and size. The polishing pad 12 bonded thereto is used until being replaced.
U.S. Pat. Appl. Publication No. 20060079159A1 discloses a chemical mechanical polish (CMP) devices. Please refer to FIG. 2. A CMP device 22 includes a plurality of zones 24 and 26, with each zone having a matrix of fixed abrasive features disposed therein, for polishing the wafer 28. The abrasive-containing matrix within each zone has material removal properties that differ from the material removal properties of the abrasive-containing matrixes of the other zones. The material removal property differences of the abrasive-containing matrixes of the zones may achieved by using different abrasive materials, densities, heights, or shapes, or combinations thereof, of the fixed abrasive features within the zones, or by using physical or chemical conditioning. Briefly, the polishing platen top of the CMP device has a plurality of zones each having different polishing performance from the others.
U.S. Pat. No. 6,849,542 discloses a method for manufacturing a semiconductor device with reduced dishing and erosion. Please refer to FIG. 3. In this method, the polishing tool used is provided with a grindstone 30 having a plurality of polygonal segments 32 fixed on a base plate 33. The grindstone 30 comprises abrasive 34 that is bonded together with resin 36 and contains pores 38. The polygonal segments are arranged so that corners of three or more polygonal segments are not located near each other. Thus, the polishing platen top of the polishing tool also has a plurality of polishing zones each having own polishing performance.
The conventional polishing platen has a constant shape and size and is only provided with a certain polishing pad, and thus it is only suitably used to polishing a certain wafer. Accordingly, various polishing platens are needed for various polishing pads according to the demands of various wafers, and thus it is necessary to change the polishing platen or even polishing tool for one certain planarization; however it is not economical.
Therefore, a novel polishing tool is still needed for conveniently and economically using various polishing pads.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide an expandable polishing platen device, in which the size of the polishing platen top can be expanded in accordance with demand, as well as, various polishing pads may be provided at the same time for various types of polishing.
In one aspect of the present invention, the expandable polishing platen device according to the present invention includes a pedestal, an expandable polishing platen top, and a plurality of polishing pads. The expandable polishing platen top is disposed on the pedestal and includes a plurality of separate platen top sections including a first group of platen top sections having a shifting mechanism and a second group of platen top sections having a raising mechanism. When the polishing platen top is not expanded, the first group of platen top sections are arranged to abut each other compactly. The polishing platen top is expanded through shifting the first group of platen top sections and raising the second group of platen top sections to compactly arrange the first group of platen top sections and the second group of platen top sections. The polishing pads are bonded to the platen top sections respectively.
In another aspect of the present invention, the expandable polishing platen device according to the present invention includes a pedestal, a guide plate, an expandable polishing platen top, and a plurality of polishing pads. The guide plate is disposed on the pedestal. The expandable polishing platen top is disposed on the guide plate and includes a plurality of separate platen top sections including a first group of platen top sections and a second group of platen top sections. The first group of platen top sections are shiftable between positions defined by the guide plate and contiguously arranged in an unexpanded configuration. The second group of platen top sections are removably disposed on the guide plate when the first group of platen top sections are in an expanded configuration to form an expanded polishing platen top. The polishing pads are bonded to the platen top sections respectively.
In further another aspect of the present invention, the expandable polishing platen device according to the present invention includes a pedestal, an expandable polishing platen top, and a plurality of polishing pads. The expandable polishing platen top is disposed on the pedestal. The polishing platen top comprises a plurality of separate platen top sections comprising a first group of platen top sections and a second group of platen top sections. The second group of platen top sections is connected to the first group of platen top sections through a first connection element and located under the first group of platen top sections. The polishing platen top is expanded through drawing the second group of platen top sections to be compactly arranged with the first group of platen top sections by the first connection element. The polishing pads are bonded to the platen top sections respectively.
Compared with the conventional technology, the expandable polishing platen device according to the present invention has an expandable polishing platen which may be changed in size according to different size of wafers. Various polishing pads can be bonded thereon to form a polishing platen having a multi-function. Therefore, the number of polishing platen or polishing tool needed may be reduced and the space for accommodating the tools can be thus saved.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a schematic diagram of a conventional chemical mechanical polisher;

FIG. 2 illustrates a schematic diagram of a conventional chemical mechanical polishing device;

FIG. 3 illustrates a schematic diagram of a conventional chemical mechanical polishing device;

FIG. 4 illustrates a schematic cross-sectional view of an embodiment according to the present invention;

FIG. 5 illustrates a schematic plan view an embodiment according to the present invention, showing an unexpanded configuration and an expanded configuration;

FIG. 6 illustrates a schematic perspective view of an embodiment according to the present invention;

FIG. 7 illustrates a schematic diagram of a shape of an expanded polishing platen top of the embodiment shown in FIG. 6;

FIG. 8 illustrates a schematic perspective view of another embodiment according to the present invention;

FIGS. 9 and 10 illustrate respectively a schematic perspective view of the embodiment shown in FIG. 8, in which the polishing platen top, the polishing pads, and the guide plate are not shown;

FIGS. 11 and 12 illustrate a schematic plan view of another embodiment according to the present invention;

FIGS. 13 and 14 illustrate a schematic plan view of still another embodiment according to the present invention;

FIGS. 15 and 16 illustrate a schematic plan view of another embodiment according to the present invention, having a rectangular polishing platen top;

FIG. 17 illustrates a schematic perspective view of a central plate used in the present invention; and

FIGS. 18 through 22 illustrate a briefly schematic diagrams showing some embodiments according to the present invention.

DETAILED DESCRIPTION

The present invention relates to an expandable polishing platen device, in which, a polishing platen top includes a plurality of separate platen top sections. When the polishing platen device is not in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of a first group of platen top sections. When the polishing platen device is in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of the first group of platen top sections and a second group of platen top sections. Polishing pads are bonded to the surface of each of platen top sections respectively and may include various types. According to the spirit of the present invention, there are some embodiments which are described hereinafter.
FIG. 4 illustrates a schematic cross-sectional view of an embodiment according to the present invention. As shown in FIG. 4, the expandable polishing platen device 40 according to the present invention includes a pedestal 42, an expandable polishing platen top 44 and a plurality of polishing pads 46 and 48. The expandable polishing platen top 44 is disposed on the pedestal 42. The polishing platen top 44 includes a plurality of separate platen top sections. The separate platen top sections include a first group of platen top sections 44 a and a second group of platen top sections 44 b. The first group of platen top sections 44 a have a shifting mechanism and the second group of platen top sections have a raising mechanism. When the polishing platen device is not expanded, the second group of platen top sections 44 b is under the first group of platen top sections 44 a. A plurality of polishing pads 46 and 48 are bonded to the platen top sections 44 a and 44 b respectively.
The polishing pads 46 and 48 may comprise at least one polishing pad, that is, the types and the shapes of the polishing pads used may be identical or different. The example for using different polishing pads may be that the polishing pads 46 bonded to the first group of platen top sections 44 a are identical to each other, and the polishing pads 48 bonded to the second group of platen top sections 44 b are identical to each other, but the polishing pads 46 and the polishing pads 48 are different. Or, the polishing pads 46 and the polishing pads 48 both include a plurality of types.
FIG. 5 illustrates a schematic plan view of an embodiment according to the present invention, showing an unexpanded configuration and an expanded configuration. In the unexpanded polishing platen top, the first group of platen top sections 44 a are disposed above the second group of platen top sections 44 b. The first group of platen top sections 44 a are arranged in a contiguous position. At the same time, the polishing pads 46 (not shown) bonded to the first group of platen top sections 44 a include at least one type of polishing pads, that is, they may be the same or include different types of polishing pads. When the polishing platen top 44 is expanded, the first group of platen top sections 44 a are shifted to spare a space for the second group of platen top sections 44 b. The second group of platen top sections 44 b are raised, such that the first group of platen top sections 44 a and the second group of platen top sections 44 b are allowed to be arranged contiguously, and thus an expanded polishing platen device is obtained. When the polishing platen top 44 is restored to the unexpanded configuration, the second group of platen top sections 44 b are descended to allow the first group of platen top sections 44 a to shift to the position of unexpanded configuration. The shifting mechanism and the raising mechanism may be either a manual device or an automatic device.
A trench structure may be further formed between any two platen top sections, for isolation of various slurries, chemicals, or liquids used on the separate platen top sections to avoid cross contamination.
In another aspect of the present invention, the expanded polishing platen device includes a pedestal, an expandable polishing platen top disposed on a guide plate, and a plurality of polishing pads. The expandable polishing platen top includes a first group of platen top sections and a second group of platen top sections. The first group of platen top sections have a shifting mechanism. The shifting mechanism may be for example an automatically mechanical structure or a manual device. The second group of platen top sections are substantially a kind of platen top leaves and removable. When they are used, they are inset between two of the platen top sections for expanding the polishing platen top. When the polishing platen top is restored to the unexpanded configuration, the second group of platen top sections are removed to allow the first group of platen top sections to shift to the position of unexpanded configuration.
FIG. 6 illustrates a schematic perspective view of an embodiment according to the present invention. As shown in FIG. 6, the expandable polishing platen device 50 according to the present invention includes a pedestal 51, a guide plate 52, an expandable polishing platen top 53, and a plurality of polishing pads 54. The guide plate 52 is disposed on the pedestal 51 and has a plurality of guides 55. As shown in FIG. 6, the guide plate is circular, but not limited thereto. The guide plate may be in a shape of frame having openings to reduce weight or cost. The expandable polishing platen top 53 includes a plurality of separate platen top sections 56 as the first group of platen top sections. The first group of platen top sections 56 are disposed on the guide plate 52 through being mounted on the guides 55 to serve as an example of a shifting mechanism. Accordingly, the platen top sections 56 may be shifted between the positions defined by the guides 55 of the guide plate 52. A plurality of polishing pads 54 are bonded to the surface of the platen top sections 56 respectively. FIG. 6 illustrates the polishing platen top 53 mostly in an unexpanded configuration, in which two platen top sections 56 are removed for clearly showing the structure of the guide plate, and one platen top section 56 are drawn outwardly to exemplarily show the configuration when the platen top sections are drawn outwardly. After the platen top sections 56 are all drawn or slide outwardly to increase the space, the effective surface area of the polishing platen top 53 are enlarged. Please also refer to FIG. 7 showing a plurality of platen top leaves 57 serving as the second group of platen top sections. After the platen top sections 56 slide outwardly, the platen top leaves 57 are disposed on the guide plate 52, and the size of the polishing platen top is increased. The platen top leaves 57 are removable. Each platen top leaf 57 has a polishing pad bonded thereto. FIG. 7 illustrates a schematic diagram showing a circular polishing platen top shape with an enlarged size after the expansion by putting the platen top sections 56 and the platen top leaves 57 together. Polishing pads are not shown in FIG. 7.
The polishing platen top 53 is substantially circular, but its shape is not limited thereto and may be in other shape such as oval, rectangle, and the like.
FIG. 8 illustrates a schematic perspective view of another embodiment according to the present invention. As shown in FIG. 8, the expandable polishing platen device 60 according to the present invention a pedestal 51, a guide plate 58, an expandable polishing platen top 59, and a plurality of polishing pads 54. The guide plate 58 is disposed on the pedestal 51. The polishing platen top 59 is coupled to the guide plate 58 over a top surface of the guide plate. The polishing platen top 59 includes a plurality of separate platen top sections 56 serving as the first group of platen top sections. The platen top sections 56 are shiftable between positions defined by the guide plate 58. A central piece 61 is optionally mounted on the guide plate 58. It is an optional element to make the platen top sections 56 more contiguously arranged. The height of the central piece 61 is preferably the same as the surface height of the platen top sections 56. As shown in FIG. 17, the central piece 61 is substantially cylindrical and secured on the pedestal 51 through a counterbored hole 65. The central piece 61 includes receiving structures, such as one row of lower hole-receptacles 63 and one row of upper hole-receptacles 64, for receiving projecting structures provided on respective inner edges of the platen top sections 56 or the platen top leaves 57, so that the platen top sections 56 or the platen top leaves 57 are substantially arranged more contiguously. A plurality of polishing pads 54 are bonded to the platen top sections 56 and the platen top leaves 57 respectively. FIG. 8 shows that the polishing platen top 59 is in an unexpanded configuration and two platen top sections 56 are removed for clearly showing a part of the structure.
The platen top sections 56 slide outwardly simultaneously in response to a rotation of the polishing platen top 59 and outer edge structure 70 so as to spare the occupied space for the expansion of the effective surface area of the polishing platen top 59. After the platen top sections 56 slide outwardly, the platen top leaves 57 are disposed on the guide plate 58 to serve as the second group of platen top sections. The platen top leaves 57 are removable. Each platen top leaf 57 has a polishing pad bonded thereto. Such expanded polishing platen top 59 includes the platen top sections 56 and the platen top leaves 57 arranged together and can be also schematically shown in FIG. 7.
The polishing platen top 59 is substantially circular, but its shape is not limited thereto and may be in other shape such as oval, rectangle, and the like.
FIGS. 9 and 10 illustrate respectively a schematic perspective view of the embodiment shown in FIG. 8, in which the polishing platen top 59, the polishing pads 54, and the guide plate 58 are not shown to clearly show the detailed structure. A number of support arms 66 are connected with the pedestal 51 using dovetail joints. Although dovetail joints are used in this exemplary embodiment, any conventional joining process or structure may be used. Eight support arms 66 are provided, although more or less may be provided. The support arms 66 extend generally outwardly from the pedestal 51 and are generally co-planar, so as to provide a relatively level support for the polishing platen top 59. A central plate 67 may be further secured on the pedestal 51 for the guide plate 58 to rest thereon. Also, a plurality of rub blocks 69 may be provided and secured on the outer edge structure 70 for the outer edge of the guide plate 58 to rest thereon and reduce the friction force when the guide plate 58 rotates.
A support rim 68 extends around the circumference of the circle defined by the free ends of the support arms 66 and provides a continuous, fixed contact surface to secure the support arms 66. On an inner portion of each support arm 66, proximate to the pedestal 51, an arcuate rotating member 72 is mounted for rotation about a vertical rotational axis. One end of the rotating member 72 is mounted on the support arm 66 near the pedestal 51 and forms a hinged pin joint, although other mounting configurations could be used. As mounted on the support members 66 with one end, the arcuate rotating members 72 may rotate between “closed” or “unexpanded” positions, in which the free ends of the rotating members 72 are proximate to the pedestal 51, and “open” or “expanded” positions, in which the free ends of the rotating members 72 are proximate to the outer edge structure 70. FIG. 9 illustrates the “closed” or “unexpanded” positions of the rotating members 72, and FIG. 10 illustrates the “open” or “expanded” positions of the rotating members 72.
The guide plate 58 is substantially circular plate that has a number of linear slots 76 formed in it. Although the guide plate 58 is circular in this embodiment, it is not limited to only circular shapes. The linear slots 76 extend from an inner central portion of the guide plate 58 radially outward toward the edge of the guide plate 58. The linear slots 76 are formed corresponding to the rotating members 72. Each linear slot 76 is sized and adapted to receive a structure 74 of the free end of one of the rotating members 72 so as that the structure 74 can slide within the linear slot 76. The linear slots 76 are sized so that the positions of the ends of the slots 76 that are proximate to the pedestal 51 correspond to the positions of the free end of the rotating members 72 when they are in the “closed” position illustrated in FIG. 9.
By receiving the free end structure 74 of each rotating member 72 in a linear slot 76, the guide plate 58 constrains all of the rotating members 72 to move substantially simultaneously and coincidentally such that their free ends move between the ends of the linear slots 76. In general, the arrangement is such that a rotational movement of the guide plate 58 is translated into a radially inward or outward movement of the free ends of the rotating members 72.
Each linear slot 76 is provided with a guide 78. Each platen top sections 56 are mounted on each guide 78 respectively. There are openings 79 on the outer edge structure 70 for the guides 78 to slide in and out the linear slots 76. The overall arrangement being such that a clockwise rotational movement of the polishing platen top 59 causes the rotating members 72 to move outwardly along the linear slots 76 in the guide plate 58, which, in turn, causes the guides 78 and the platen top sections 56, which are mounted on the guides 78, to move outwardly. Conversely, a counter-clockwise rotation of the polishing platen top 59 causes the rotating members 72 and the platen top sections 56 to move inwardly. The direction of rotational movement that causes an inward or outward movement may be arbitrarily selected. For example, if the rotating members 72 are arranged in a reverse orientation from that illustrated in the figures, a counter-clockwise movement of the polishing platen top 59 may cause the platen top sections 56 to move outwardly. Therefore, the platen top sections 56 may spare the space for the platen top leaves when in the expanded position.
The aforesaid polishing platen top 59 in the embodiment is circular and keeps circular in the expanded configuration; however, it may be in other shape or size. For example, FIGS. 11 and 12 illustrate a schematic plan view of another embodiment according to the present invention. The polishing platen top 80 is circular in an unexpanded configuration, but the platen top sections 82 have a different size from that of the platen top sections 84. Accordingly, when the polishing platen top 80 is in an expanded configuration, the platen top leaves 86 and 88 with different sizes corresponding to the size of the gap between the platen top sections 82 and 84 are inset, resulting the polishing platen top 80 has an oval shape in an expanded configuration.
FIGS. 13 and 14 illustrate a schematic plan view of still another embodiment according to the present invention. The polishing platen top 90 is circular in an unexpanded configuration, and the platen top sections 62 are the same as the platen top sections 56 of the polishing platen top 59, but the platen top leaves 92 have straight, squared ends instead of rounded ends, giving the polishing platen top 90 a semi-round shape in its expanded configuration.
FIGS. 15 and 16 illustrate a schematic plan view of another embodiment according to the present invention, having a rectangular polishing platen top 94. Each of the platen top sections 96 and 98 is substantially triangular in shape. In the expanded configuration, the platen top leaves 99 are shaped to maintain the rectangular shape of the polishing platen top 94. Additionally, the platen top sections and platen top leaves may be shaped so as to form a square polishing platen top when the platen top leaves are in their closed position and a rectangular polishing platen top with the leaves inserted.
In another aspect of the present invention, the polishing platen top of the expandable polishing platen device includes two groups of platen top sections, for example, a first group of platen top sections and a second group of platen top sections, connected to each other by a connect element. The polishing platen top is expanded through drawing the second group of platen top sections to be coplanarly compactly arranged with the first group of platen top sections by the connection element. The way connection is not particularly limited and may be in a folding style or a drawer style.
FIG. 18 illustrates a briefly schematic diagram showing one embodiment according to the present invention. FIG. 18 shows a folding style connection and the way of expansion. The expandable polishing platen device 101 according to the present invention includes a pedestal, an expandable polishing platen top, and a plurality of polishing pads. The expandable polishing platen top is disposed on the pedestal. The polishing platen top comprises a plurality of separate platen top sections. The platen top sections include a first group of platen top sections 102 and a second group of platen top sections 103. The second group of platen top sections 103 is connected to the first group of platen top sections 102 through a connection element 104 and located under the first group of platen top sections 102 in a folding style. The polishing pads 105 are bonded to the platen top sections respectively. As shown in FIG. 18, the second group of platen top sections 103 can be drawn and extend out by the connection element 104 to be positioned on the same plane as the first platen top sections 103 and compactly arranged with the first group of platen top sections 102, to form an expanded polishing platen top, as shown by the expanded polishing platen device 106 on the right side of FIG. 18. The direction of the draw may be the arrow direction in FIG. 18.
A hinge or an oil hydraulic arm may be suitably used in the folding style connection element. FIG. 19 illustrates a briefly schematic diagram showing a portion of a polishing platen device of another embodiment according to the present invention. As shown in FIG. 19, the polishing platen device 111 has a group of platen top sections 112, a group of platen top sections 113, a group of platen top sections 114, and a group of platen top sections 115. Connection elements 116 are disposed between each group of platen top sections for connection. The polishing platen top is fully expanded in the polishing platen device 111, that is, all group of the platen top sections are drawn to be extend and compactly abut each other. The connection element is a hinge or an oil hydraulic arm. The polishing platen device 117 shows that the platen top sections 115 are folded to be under the platen top sections 114 through a connection element. The polishing platen device 118 further shows that the platen top sections 114 are folded to be under the platen top sections 113 through a connection element. The polishing platen device 119 further shows that the platen top sections 113 are folded to be under the platen top sections 112 through a connection element.
FIG. 20 illustrates a briefly schematic diagram partly showing an expandable polishing platen device of another embodiment according to the present invention. FIG. 20 shows a folding style connection and the way of expansion. The expandable polishing platen device 121 according to the present invention includes a pedestal, an expandable polishing platen top, and a plurality of polishing pads. The expandable polishing platen top is disposed on the pedestal. The polishing platen top comprises a plurality of separate platen top sections. These platen top sections include a first group of platen top sections 123 and a second group of platen top sections 124. The second group of platen top sections 124 is connected to the first group of platen top sections 123 through a lifting/connection element 125 and located under the first group of platen top sections 123 in a drawer style. The polishing pads 126 are bonded to the platen top sections respectively. The second group of platen top sections 124 can be drawn and extend out, by the lifting/connection element 125, to be positioned on the same plane as the first platen top sections 123 and thus to be compactly arranged with the first group of platen top sections 123, to form an expanded polishing platen top. The lifting/connection element 125 is support by the brace 127.
Furthermore, a third group of platen top sections 129 is shown on the right side of FIG. 20 and a multistage expanded polishing platen device 128 is obtained after the likewise connection and expansion. Likewise, in an unexpanded status, the third group of platen top sections 129 is connected to the second group of platen top sections 124 through a lifting/connection element and located under the second group of platen top sections 124 in a drawer style. The third group of platen top sections 129 can be drawn out through the lifting/connection element to be positioned on the same plane as the second platen top sections 124 and thus to be compactly arranged with the second group of platen top sections 124, to form a further expanded polishing platen top.
Further more the expandable polishing platen device according to the present invention may include a plurality of groups of platen top sections disposed in a stack style. The over group of platen top sections can be laterally shifted by a shifting mechanism, from top to bottom and one by one, to connect the under group of platen top sections with the sides, such that two groups of platen top sections are compactly arranged and the polishing platen top is expanded stage by stage.
Please refer to FIG. 21. FIG. 21 illustrates a briefly schematic diagram showing one embodiment according to the present invention. The expandable polishing platen device 131 includes a pedestal, an expandable polishing platen top, and a plurality of polishing pads. The expandable polishing platen top is disposed on the pedestal. The polishing platen top comprises a plurality of separate platen top sections. The platen top sections include a plurality of platen top sections, such as platen top sections 132, 133, 134, and 135 arranged in a stack style. The stack has a raising mechanism. Each of the platen top sections 132, 133, 134, and 135 is a group consisting of one or a plurality of platen top sections. The platen top sections 135 are the bottom ones, and the platen top sections 132, 133, and 134 are the over ones. The platen top sections 132, 133, and 134 each have a shifting mechanism. The polishing pads are bonded to the platen top sections respectively. The polishing platen device 131 shows that the platen top sections are arranged in a stack style. The polishing platen device 136, 137, and 138 show the expanded status stage by stage. In the order of top to bottom and stage by stage, the over platen top sections, that is, platen top sections 132, 133, and 134 are laterally shifted through a shifting mechanism thereof, and the under group of the platen top sections are raised through a raising mechanism, such that two groups of platen top sections connect to each other with the sides. Specifically, after the platen top section 132 is laterally shifted, the platen top section 133 (platen top sections 134 and 135 may be together with 133) are raised through the raising mechanism, such that the platen top section 132 and the platen top section 133 connect to each other with he sides, forming a compactly arrangement, that is, expanded polishing platen device 136. The arrow directions indicate the direction of the directions of shifting and the raising. Likewise, the platen top sections 134 and 135 can be shifted respectively and the under platen top sections be raised to form a further expanded polishing platen device.
In the present invention, the polishing pads may include one or more types, that is, they may be all identical or not identical. The example for using different polishing pads may be that the polishing pads bonded to the platen top sections (i.e. the first group of platen top sections) are identical to each other, and the polishing pads bonded to the platen top leaves (i.e. the second group of platen top sections) are identical to each other, but these two groups of polishing pads are different from each other. Furthermore, the polishing pads bonded to the same group of platen top sections may be different from each other, as demanded.
A trench structure may be further formed between any two platen top sections or leaves, to isolate various slurries, chemicals, or liquids used on the separate platen top sections or leaves for avoiding cross contamination.
Furthermore, the expandable polishing platen device according to the present invention may be a rotatable platen, and materials for the components, such as, the pedestal, the polishing platen top, the guide plate, and the like, may be anti-corrosive metal or ceramics as used by those skilled in the art, as well as polymers or other materials having a proper corrosion resistance and toughness. The expandable polishing platen device may be adapted to the slurry/chemical/liquid supply system, polish head, end point determination, metrology, and pad conditioner used in any CMP or ECMP process without particularly limitation. Moreover, one or more platen top sections may be transparent for equipping with an optical sensor.
Furthermore, one of platen top sections and a polishing pad thereon each may comprise a hole corresponding to each other for injection of slurry or equipping a sensor. FIG. 22 shows an embodiment. A polishing platen device 140 has a platen top section 141 and a platen top section 142 arranged in a stack style. The platen top section 141 is located under the platen top section 141. The platen top section 141 and the polishing pad thereon each have a plurality of holes corresponding to each other, for equipping slurry/deionized water tubes 143 and/or an optical sensor 144. Such that, in the expanded polishing platen device 145, the platen top sections 141 is raised to serve as a polishing surface, and the slurry/deionized water 146 can be injected on the polishing surface and the polishing status can be sensored.
All combinations and sub-combinations of the above-described features also belong to the present invention. Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention.

Claims

1. An expandable polishing platen device, comprising:

a pedestal;

an expandable polishing platen top disposed on the pedestal, wherein the polishing platen top comprises a plurality of separate platen top sections comprising a first group of platen top sections having a shifting mechanism and a second group of platen top sections having a raising mechanism, wherein, when the polishing platen top is not expanded, the first group of platen top sections are arranged to abut each other compactly, and the polishing platen top is expanded through shifting the first group of platen top sections and raising the second group of platen top sections to compactly arrange the first group of platen top sections and the second group of platen top sections; and

a plurality of polishing pads bonded to the platen top sections respectively.

2. The expandable polishing platen device of claim 1, wherein the polishing pads comprise at least one type.

3. The expandable polishing platen device of claim 1, wherein the polishing pads bonded to the first group of platen top sections are different from the polishing pads bonded to the second group of platen top sections.

4. The expandable polishing platen device of claim 1, further comprises a trench structure between any two of the platen top sections.

5. The expandable polishing platen device of claim 1, wherein one of the platen top sections is transparent for equipping an optical sensor.

6. The expandable polishing platen device of claim 1, wherein one of the second group of platen top sections and a polishing pad thereon each comprise a hole corresponding to each other for injection of slurry or equipping a sensor.

7. The expandable polishing platen device of claim 1, further comprising a plurality of groups of platen top sections arranged in a stack style under the second group of platen top sections, wherein, the polishing platen top is expanded stage by stage, from top to bottom through laterally shifting the over group of platen top sections by the shifting mechanism and raising the under group of platen top sections by the raising mechanism, to allow the over group of platen top sections and the under group of platen top sections to be compactly arranged.

8. An expandable polishing platen device, comprising:

a pedestal;

a guide plate disposed on the pedestal;

an expandable polishing platen top disposed on the guide plate, wherein the polishing platen top comprises a plurality of separate platen top sections comprising a first group of platen top sections and a second group of platen top sections, the first group of platen top sections are shiftable between positions defined by the guide plate and contiguously arranged in an unexpanded configuration, and the second group of platen top sections is removably disposed on the guide plate when the first group of platen top sections are shifted in an expanded configuration; and

a plurality of polishing pads bonded to the platen top sections respectively.

9. The expandable polishing platen device of claim 8, further comprises a central plate disposed on the guide plate, wherein the central plate comprises receiving structures constructed and arranged to receive projecting structures provided on respective inner edges of the platen top sections, so that the platen top sections are arranged to abut each other compactly.

10. The expandable polishing platen device of claim 8, wherein the polishing pads comprise at least one type.

11. The expandable polishing platen device of claim 8, wherein the polishing pads bonded to the first group of platen top sections are different from the polishing pads bonded to the second group of platen top sections.

12. The expandable polishing platen device of claim 8, further comprises a trench structure between any two of the platen top sections.

13. The expandable polishing platen device of claim 8, wherein one of the platen top sections is transparent for equipping an optical sensor.

14. The expandable polishing platen device of claim 8, wherein one of the second group of platen top sections and a polishing pad thereon each comprise a hole corresponding to each other for injection of slurry or equipping a sensor.

15. An expandable polishing platen device, comprising:

a pedestal;

an expandable polishing platen top disposed on the pedestal, wherein the polishing platen top comprises a plurality of separate platen top sections comprising a first group of platen top sections and a second group of platen top sections, the second group of platen top sections is connected to the first group of platen top sections through a first connection element and located under the first group of platen top sections, wherein, the polishing platen top is expanded through drawing the second group of platen top sections to be compactly arranged with the first group of platen top sections by the first connection element; and

a plurality of polishing pads bonded to the platen top sections respectively.

16. The expandable polishing platen device of claim 15, wherein the second group of platen top sections and the first group of platen top sections are connected to each other in a folding style through the first connection element, such that the second group of platen top sections is located under the first group of platen top sections.

17. The expandable polishing platen device of claim 15, wherein the first connection element comprises a hinge or an oil hydraulic arm.

18. The expandable polishing platen device of claim 16, further comprises a third group of platen top sections connected to the second group of platen top sections in a folding style through a second connection element, such that the third group of platen top sections is located under the second group of platen top sections, and the polishing platen top is expanded through drawing the third group of platen top sections to be compactly arranged with the second group of platen top sections by the second connection element.

19. The expandable polishing platen device of claim 15, wherein the second group of platen top sections and the first group of platen top sections are connected to each other in a drawer style through the first connection element, such that the second group of platen top sections is located under the first group of platen top sections, wherein the first connection element is a lifting/connection element.

20. The expandable polishing platen device of claim 19, further comprises a third group of platen top sections connected to the second group of platen top sections in a drawing style through a second connection element, such that the third group of platen top sections is located under the second group of platen top sections, and the polishing platen top is expanded through drawing the third group of platen top sections to be compactly arranged with the second group of platen top sections by the second connection element, wherein the second connection element is a lifting/connection element.