US20090109774A1 - Test method and semiconductor device - Google Patents
Test method and semiconductor device Download PDFInfo
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- US20090109774A1 US20090109774A1 US11/928,790 US92879007A US2009109774A1 US 20090109774 A1 US20090109774 A1 US 20090109774A1 US 92879007 A US92879007 A US 92879007A US 2009109774 A1 US2009109774 A1 US 2009109774A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31712—Input or output aspects
- G01R31/31717—Interconnect testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/3193—Tester hardware, i.e. output processing circuits with comparison between actual response and known fault free response
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/022—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in I/O circuitry
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/1201—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details comprising I/O circuitry
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C29/50012—Marginal testing, e.g. race, voltage or current testing of timing
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
Abstract
Description
- This Utility Patent Application claims priority to German Patent Application No. DE 10 2006 051 135.2 filed on Oct. 30, 2006, which is incorporated herein by reference.
- The invention relates to a test method, a test device, as well as to a semiconductor device, in one embodiment a data buffer device, and to a memory module.
- Semiconductor devices, e.g., corresponding, integrated (analog or digital) computing circuits, semiconductor memory devices such as, for instance, functional memory devices (PLAs, PALs, etc.) and table memory devices (e.g., ROMs or RAMs, in one embodiment SRAMs and DRAMs), etc. are subject to comprehensive tests during and after their manufacturing process.
- For the common manufacturing of a plurality of (in general identical) semiconductor devices, a wafer (i.e. a thin disc of monocrystalline silicon) is used. The wafer is processed appropriately (e.g., subject successively to a plurality of coating, exposure, etching, diffusion, and implantation process, etc.), and subsequently sawn apart (or e.g., scratched, and broken), so that the individual devices are then available.
- During the manufacturing of semiconductor devices (e.g., of DRAMs (Dynamic Random Access Memories or dynamic write-read memories)), in one embodiment of DDR-DRAMs (Double Data Rate-DRAMs)—even before all the desired, above-mentioned processing were performed on the wafer—(i.e. already in a semi-finished state of the semiconductor devices) the (semi-finished) devices (that are still available on the wafer) may be subject to appropriate test methods at one or a plurality of test stations by using one or a plurality of test devices (e.g., kerf measurements at the wafer kerf).
- After the finishing of the semiconductor devices (i.e. after the performing of all the above-mentioned wafer processing), the semiconductor devices are subject to further test methods at one or a plurality of (further) test stations—for instance, by using appropriate (further) test devices, the finished devices—that are still available on the wafer—may be tested appropriately (so-called “wafer tests”).
- Correspondingly, one or a plurality of further tests (at corresponding further test stations, and by using appropriate, further test devices) may be performed, for instance, after the incorporation of the semiconductor devices in the corresponding semiconductor device packages, and/or e.g., after the incorporation of the semiconductor device packages (along with the respectively included semiconductor devices) in corresponding electronic modules, e.g., memory modules (so-called “module tests”).
- In a plurality of applications—e.g., in server or workstation computers, etc.—memory modules with upstream data buffer devices (so-called buffers) may be used, e.g., “buffered” or “registered” DIMMs, FB-DIMMs (FB-DIMM=Fully Buffered DIMM), etc.
- Such memory modules include in general one or a plurality of semiconductor memory devices, in one embodiment DRAMs, and—upstream of the semiconductor memory devices—one or a plurality of data buffer devices (which may, for instance, be arranged on the same printed circuit board as the DRAMs).
- The memory modules are in one embodiment by interconnecting an appropriate memory controller (which is, for instance, positioned externally of the respective memory module)—connected with one or a plurality of microprocessors of the respective server or workstation computer, etc.
- Caused by the upstream arrangement of the data buffer devices (buffers), it is possible to perform the above-mentioned conventional module tests only in a very restricted scope in the above-mentioned “registered” DIMMs, FB-DIMMs, etc. One reason for this is that the signals exchanged between a respective buffer and the DRAMs are not accessible from outside. Therefore, the quality of the connections between the buffer and the DRAMs can, for instance, only be tested indirectly by using conventional test methods.
- For these and other reasons, there is a need for the present invention.
- The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain principles of embodiments. Other embodiments and many of the intended advantages of embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
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FIG. 1 illustrates a schematic representation of a memory module system in which a test method in accordance with one embodiment can be used. -
FIG. 2 illustrates a schematic representation of a memory module that can be used in the memory module system illustrated inFIG. 1 . -
FIG. 3 illustrates a schematic detailed representation of a section of the DRAM illustrated inFIG. 2 , of the buffer illustrated inFIG. 2 , and of a test device for performing the test method in accordance with one embodiment. -
FIG. 4 illustrates an exemplary progression of a jump response signal evaluated by the test device illustrated inFIG. 3 . - In the following Detailed Description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” “leading,” “trailing,” etc., is used with reference to the orientation of the Figure(s) being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
- It is to be understood that the features of the various exemplary embodiments described herein may be combined with each other, unless specifically noted otherwise.
- One or more embodiments provide a test method, a test device, as well as a semiconductor device, in one embodiment a data buffer device, and a memory module.
- In accordance with one embodiment there is provided a test method. The method includes:
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- (a) sending out a test signal by a semiconductor device, in one embodiment a data buffer device;
- (b) comparing a reflected signal generated in reaction to the test signal with a first threshold value; and
- (c) comparing the reflected signal with a second threshold value differing from the first threshold value.
- The test signal sent out by the semiconductor device, in one embodiment data buffer device, may include at least one test pulse, in one embodiment a plurality of test pulses.
- In one embodiment, the test method includes:
- comparing the reflected signal with the first threshold value at a first point in time after sending out a test pulse; and
- comparing the reflected signal with the first threshold value at a second point in time differing from the first point in time after sending out the test pulse or a further test pulse.
- In one or more embodiments, the test method may additionally include:
- comparing the reflected signal with the second threshold value at the first point in time; and
- comparing the reflected signal with the second threshold value at the second point in time differing from the first point in time.
- Thus, a “Time Domain Reflection” (TDR) method can in a simple manner be performed—in one embodiment with a data buffer element that has already been incorporated in a corresponding memory module—and thus, for instance, the quality of a connection between the data buffer device and a memory device provided on the memory module can be tested.
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FIG. 1 illustrates by way of example amemory module system 1 in which a test method in accordance with one embodiment can be used. - As results from
FIG. 1 , and as will be explained in more detail in the following, thememory module system 1 includes a plurality ofmemory modules - In the
system 1 illustrated inFIG. 1 , up to eight memory modules/FB-DIMMs memory controller 4, respectively. - Each memory module/FB-
DIMM DRAMs DRAM DIMM FIG. 1 ). - The FB-
DIMMs memory controller 4, respectively. - As results from
FIG. 1 , the CPU/memory controller 4 is connected to the first FB-DIMM 2 a (more exactly: itsbuffer 5 a) via afirst bus 6 a which includes a first channel (“south-bound channel” (SB channel)) and a second channel (“north-bound channel” (NB channel)). The SB channel of thebus 6 a is used to send corresponding address, control, and data signals from the CPU/memory controller 4 to the first FB-DIMM 2 a. Correspondingly similar, the NB channel of thebus 6 a is used to send corresponding signals from the first FB-DIMM 2 a to the CPU/memory controller 4. - As results further from
FIG. 1 , the first FB-DIMM 2 a (more exactly: itsbuffer 5 a) is connected to the second FB-DIMM 2 b (more exactly: itsbuffer 5 b) via asecond bus 6 b which includes, like thefirst bus 6 a, a first channel (“south-bound channel” (SB channel)) and a second channel (“north-bound channel” (NB channel)). Correspondingly similar, the second FB-DIMM 2 b (more exactly: itsbuffer 5 b) is connected to a third FB-DIMM (more exactly: its buffer) via athird bus 6 c (which also includes a first channel (“south-bound channel” (SB channel)) and a second channel (“north-bound channel” (NB channel)), etc. - The SB channel of the
bus 6 b is used to send corresponding address, control, and data signals from the first FB-DIMM 2 a to the second FB-DIMM 2 b. Correspondingly similar, the NB channel of thebus 6 b is used, to send corresponding signals from the second FB-DIMM 2 b to the first FB-DIMM 2 a, etc. - In normal operation of the
memory module system 1, the FB-DIMMs - The
buffer 5 a of the first FB-DIMM 2 a (i.e. the first link of the “daisy chain”) transmits corresponding data, address, and/or control signals sent from the CPU/memory controller 4 via the “south-bound channel” of thefirst bus 6 a to the first FB-DIMM 2 a—irrespective of whether the first FB-DIMM 2 a or another FB-DIMM is addressed with the signals—via the “south-bound channel” of thesecond bus 6 b to thebuffer 5 b of the second FB-DIMM 2 b (i.e. the second link of the “daisy chain”). - Correspondingly similar, the
buffer 5 b of the second FB-DIMM 2 b transmits the corresponding data, address, and/or control signals received from thebuffer 5 a of the first FB-DIMM 2 a—irrespective of whether the second FB-DIMM 2 b or another FB-DIMM is addressed with the signals—via the “south-bound channel” of thethird bus 6 c to the buffer of the third FB-DIMM (i.e. the third link of the daisy chain), etc. - Correspondingly vice versa, the
buffer 5 b of the second FB-DIMM 2 b transmits corresponding signals received from the buffer of the third FB-DIMM via the “north-bound channel” of thethird bus 6 c to thebuffer 5 a of the first FB-DIMM 2 a via the “north-bound channel” of thesecond bus 6 b. - The
buffer 5 a of the first FB-DIMM 2 a transmits—in a correspondingly similar manner—the corresponding signals received from thebuffer 5 b of the second FB-DIMM 2 b via the “north-bound channel” of thesecond bus 6 b to the CPU/memory controller 4 via the “north-bound channel” of thefirst bus 6 a. - As is further illustrated in
FIG. 1 , everyDRAM bus corresponding buffer DIMM - Every
buffer DIMMs memory controller 4, may be determined in therespective buffer corresponding buffer memory controller 4 via thebusses - The buffer of a respectively addressed FB-DIMM transmits the data, address, and/or control signals received via a corresponding “south-bound channel” of the
busses respective bus DRAMs DIMM corresponding buffer respective bus respective buffer busses buffer 5 a of the first FB-DIMM—to the CPU/memory controller 4). - For transmitting the above-mentioned data, address, and/or control signals to the
DRAMs buffers driver FIG. 2 . - Each
driver 11 a of a first group of driver is connected with a correspondingdata line 17 a of a plurality of data lines of thebus 7 a (for reasons of better presentability, only onesingle driver 11 a of the first group of driver and only onesingle data line 17 a are illustrated inFIG. 2 ). - Correspondingly similar, each driver 11 b of a second group of driver is connected with a
corresponding address line 17 b of a plurality of address lines of thebus 7 a (for reasons of better presentability, only one single driver 11 b of the second group of driver and only onesingle address line 17 b are illustrated inFIG. 2 ). - Furthermore, each
driver 11 c of a third group of driver is connected with acorresponding control line 17 c of a plurality of control lines of thebus 7 a (for reasons of better presentability, only onesingle driver 11 c of the third group of driver and only onesingle control line 17 b are illustrated inFIG. 2 ). - As results from
FIG. 2 , theDRAMs receiver respective buffer control lines - Each
receiver 12 a of a first group of receiver is connected with a correspondingdata line 17 a of the plurality of data lines of thebus 7 a. - Correspondingly similar, each
receiver 12 b of a second group of receiver is connected with acorresponding address line 17 b of the plurality of address lines of thebus 7 a, and eachreceiver 12 c of a third group of receiver is connected with acorresponding control line 17 c of the plurality of control lines of thebus 7 a. - As results from
FIG. 2 , the data lines 17 a of thebus 7 a are operated bidirectionally with the FB-DIMMs 2 a—like with conventional FB-DIMMs—(depending on whether the data are written in acorresponding DRAM 3 a or read out therefrom). - For this reason, in the
buffers buffer driver 11 a (“drivers”) connected with the above-mentioneddata lines 17 a—correspondingreceiver DRAMs DRAM receiver 12 a (“receivers”) connected with the above-mentioneddata lines 17 a—correspondingdriver 14 a (“drivers”)—which are also connected with the data lines 17 a). - As results further from
FIG. 2 , the address andcontrol lines bus 7 a are operated unidirectionally with the FB-DIMMs 2 a—like with conventional FB-DIMMs—in normal operation of the FB-DIMMs 2 a, but when the test method that is explained in more detail below is performed (i.e. in the test operation), they are operated bidirectionally—other than with conventional FB-DIMMs, and in the specific manner described in more detail in the following. - For this reason, in the
buffers FIG. 2 (and other than with conventional buffers of conventional FB-DIMMs)—parallel to the buffer driver 11 b (“drivers”) connected with the above-mentionedaddress lines 17 b—correspondingreceiver 13 b (“receivers”)—which are also connected with the address lines 17 b—are provided, and parallel to thebuffer driver 11 c (“drivers”) which are connected with the above-mentionedcontrol lines 17 c, correspondingreceiver 13 c (“receivers”)—which are also connected with thecontrol lines 17 c—are provided. -
FIG. 3 schematically illustrates atest device 100 for performing the test method in accordance with the embodiment of the invention, and a section of theDRAM 3 a illustrated inFIG. 2 , and a section of thebuffer 5 a illustrated inFIG. 2 (in one embodiment theDRAM receiver DRAM driver 14 a illustrated there, and thebuffer receiver buffer driver - The DRAM and
buffer receiver field effect transistor field effect transistor - The source of the first n-channel field effect transistor 102 may, via corresponding lines, be connected to a (direct or constant) current source that is connected with the ground potential. Correspondingly, the source of the second n-
channel field transistor 102 b may, via corresponding lines, also be connected to the (direct or constant) current source that is connected with the ground potential. - Furthermore, the gate of the first n-channel
field effect transistor 102 a may, via aline 110, be connected to the corresponding data, address, or control line (i.e. one of the above-mentionedlines field effect transistor 102 b, for instance, to aline 104 to which—as will be explained in more detail in the following—a (variably modifiable) reference voltage Vref may be applied. - The intensity of the level of the reference voltage Vref present at the
line 104 may be variably adjusted by a control signal present at acontrol line 113 and output by atest control device 116 of thetest device 100. - In one embodiment, the intensity of the level of the reference voltage Vref is left constant during the above-mentioned normal operation of the FB-
DIMM 2 a and is only modified in the manner explained in detail below during the test operation of the FB-DIMM 2 a—i.e. during the performing of the above-mentioned test method. - As results further from
FIG. 3 , the drain of the first n-channel field effect transistor 102 may, via corresponding lines, be connected to the gate of the first and second p-channelfield effect transistors field effect transistor 101 a. - Furthermore, the drain of the second n-channel
field effect transistors 102 b may be connected to the drain of the second p-channelfield effect transistor 101 b, and to aline 105, i.e. an output of the receiver (at which a corresponding—digital—output signal out may be tapped). - The source of the first and second p-channel
field effect transistors - By the
receiver line 110 is converted to the—digital—output signal 105 output at the line 105 (which is—depending on whether the signal level of the input level lies above or below a predetermined threshold value—“logic high” or “logic low”). - The predetermined threshold value depends on the respective level intensity of the reference voltage Vref present at the
line 104, i.e. may be modified variably. - As results further from
FIG. 3 , the DRAM andbuffer driver - The source of the n-channel
field effect transistor 107 may, via a corresponding line, be connected to the above-mentioned ground potential. The drain of the n-channelfield effect transistor 107 may be connected to the drain of the p-channelfield effect transistor 106, and, via aline 108, to the corresponding data, address, or control line (i.e. the above-mentionedline - As results further from
FIG. 3 , the source of the p-channelfield effect transistor 106 may be connected to the supply voltage. - The gates of the p-channel
field effect transistor 106 and of the n-channelfield effect transistor 107 may be connected with each other and be coupled to a line 109 (to which a corresponding input signal may be applied). - During the above-mentioned test operation of the FB-
DIMM 2 a, a discrete “Time Domain Reflection” (TDR) method is performed by using the above-mentioned test device 100: - In so doing—controlled by the
test device 100—thedriver buffer 5 a outputs a corresponding test pulse at theline driver line 109 suddenly changes its state, for instance, from “logic high” to “logic low” (or vice versa). Consequently, a signal output by thedriver line 108 that is connected with theline - The test pulse generated thereby is transmitted from the
driver line DRAM 3 a, and is reflected in one embodiment, for instance, at theDRAM 3 a or, for instance, in the case of adefective line - For minimizing the reflection at the
DRAM 3 a, theline line - The reflected pulse received by the
receiver buffer 5 a (“jump-response-signal”) is evaluated by thetest device 100 in the manner explained in more detail below. - By the evaluation of the jump-response-signal, the impedance profile of the
line buffer 5 a and theDRAM 3 a which is generated by theline -
FIG. 4 illustrates—by way of example—a possible progression of a jump-response-signal S which is to be evaluated by thetest device 100 illustrated inFIG. 3 and which is present at theline 110, i.e. at thereceiver buffer 5 a. - The relatively low voltage level of the jump-response-signal S between, for instance, a point in time t2,1 and a point in time t3,1 as illustrated in
FIG. 4 may, for instance, indicate a short-circuit on theline - As already explained above, the
receiver line 110—during the test operation of the FB-DIMM 2 a thus the above-mentioned jump-response-signal S—to the—digital—output signal out which is output at the line 105 (which is—depending on whether the signal level of the input signal lies above or below the above-mentioned predetermined, variably modifiable threshold value—“logic high” or “logic low”). - As results from
FIG. 3 , the digital output signal out which is output at theline 105 is supplied to a data input of a flip-flop 111. - A corresponding clock signal is supplied to the flip-
flop 111—more exactly: its clock input—via aclock line 112. - The state of the signal output at a
line 114, i.e. at an output of the flip-flop 111, depends on the state of the digital signal out present at theline 105 at the point in time of a clock edge of the clock signal supplied to the clock input of the flip-flop 111: If the state of the digital signal out present a theline 105 is “logic high” at the point in time of a clock edge of the clock signal (“signal scanning time”), a “logic high” signal, i.e. a “1” (or in another embodiment a “logic low” signal, i.e. a “0”) is output at theline 114, i.e. at the output of the flip-flop. If, contrary to this, the state of the digital signal out present at theline 105 is “logic low” at the point in time of a clock edge of the clock signal (“signal scanning time”), a “logic low” signal, i.e. a “0” (or a “logic high” signal, i.e. a “1”) is output at theline 114, i.e. at the output of the flip-flop. Up to the next clock edge, the state of the flip-flop, and thus the state of the signal output at theline 114, remain “frozen”. - For performing the above-mentioned test method (i.e. in the test operation of the FB-
DIMM 2 a), a plurality of the above-mentioned test pulses are successively—in respective equidistant time intervals—transmitted from thedriver line DRAM 3 a, and the reflected pulses (“jump-response-signals”) are evaluated by thereceiver buffer 5 a and the flip-flop 111 in the above-described manner. - For generating the above-mentioned test pulses, a corresponding (periodic) pulse sequence is generated by a
pulse generation 115 of thetest device 100, and is applied to theline 109 as input signal in thedriver - As is illustrated in
FIG. 4 , each of the reflected pulses (“jump-response-signals”) is evaluated by using a respectively other reference voltage Vref,1, Vref,2, Vref,3, Vref4, etc. present at theline 104, i.e. at thereceiver - For variation of the signal scanning time, the point in time of the occurrence of a clock edge of the clock signal supplied to the clock input of the flip-
flop 111 is varied (e.g., with respect to, for instance, the point in time of the beginning of the sending out of a test pulse). - To this end, a corresponding—periodic—clock signal may be output by the
test control 116 at aclock line 117, which is supplied to adelay 118, is impacted by same with a variably adjustable delay time, and is transmitted to theclock line 112, i.e. the clock input of the flip-flop 111. - The delay time of the
delay 118 may be variably adjusted by a control signal present at acontrol line 119 and output by thetest control 116. - As is illustrated in
FIG. 4 , a first one of the above-mentioned reflected pulses may, for instance, be evaluated by using a first reference voltage Vref,1 and at a first (scanning) point in time t1,1, a second reflected pulse, for instance, also by using the first reference voltage Vref,1 and at a second (scanning) point in time t2,1—that is later by a duration ΔT vis-à-vis the first (scanning) point in time t1,1—, a third reflected pulse, for instance, also by using the first reference voltage Vref,1 and at a third (scanning) point in time t3,1—that is later by a duration ΔT vis-à-vis the second (scanning) point in time (and by a duration 2ΔT vis-à-vis the first (scanning) point in time t1,1)), etc. - In the progression of the jump-response-signal S illustrated in FIG. 4—as a result of the evaluation for the first reflected pulse—a “0” is, for instance, output at the output of the flip-
flop 111, i.e. at theline 114, subsequently—as a result of the evaluation for the second reflected pulse—again a “0”, and then—as a result of the evaluation for the third reflected pulse—again a “0”, etc. - Subsequently, the intensity of the reference voltage present at the
line 104, i.e. at thereceiver - As is illustrated in
FIG. 4 , a further of the above-mentioned reflected pulses may then, for instance, by using the second reference voltage Vref,2, and at the above-mentioned first (scanning) point in time t1,1 be evaluated, a subsequent reflected pulse, for instance, also by using the second reference voltage Vref,2, and at the above-mentioned second (scanning) point in time t2,1—which is by the above-mentioned duration ΔT later vis-à-vis the first (scanning) point in time t1,1—, a next following reflected pulse, for instance, also by using the second reference voltage Vref,2, and at the above-mentioned third (scanning) point in time t3,1, etc. - In the progression of the jump-response-signal S illustrated in
FIG. 4 , a “1” is then output—as a result of the evaluation for the above-mentioned further reflected pulse—at the output of the flip-flop 111, subsequently—as a result of the evaluation for the subsequent reflected pulse—a “0”, and then—as a result of the evaluation for the next following reflected pulse—again a “0”, etc. - Next, the intensity of the reference voltage present at the
line 104, i.e. at thereceiver - As is illustrated in
FIG. 4 , a next following of the above-mentioned reflected pulses may, for instance, be evaluated by using the third reference voltage Vref,3, and at the above-mentioned first (scanning) point in time t1,1, a subsequent reflected pulse, for instance, also by using the third reference voltage Vref,3, and at the above-mentioned second (scanning) point in time t2,1—which is by the above-mentioned duration ΔT later vis-à-vis the first (scanning) point in time t1,1—, etc. - In the progression of the jump-response-signal S illustrated in
FIG. 4 , a “1” is then output—as a result of the evaluation for the above-mentioned next following reflected pulse—at the output of the flip-flop 111, i.e. at theline 114, subsequently—as a result of the evaluation for the subsequent reflected pulse—a “0”, etc. - In one or more embodiments, each of the reflected pulses may be evaluated, instead at a single scanning point in time, also at several scanning point in time, e.g., at two, three, or more than three different scanning points in time.
- A first reflected pulse may, for instance, be evaluated by using a first reference voltage Vref,1, and at a first (scanning) point in time t1,1 and, also by using the first reference voltage Vref,1, at a second (scanning) point in time t2,1—which is by a duration ΔT later vis-à-vis the first (scanning) point in time t1,1—, and at a third (scanning) point in time t3,1—which is by a duration ΔT later vis-à-vis the second (scanning) point in time t2,1 (and by a duration 2ΔT later vis-à-vis the first (scanning) point in time t1,1) (also by using the first reference voltage Vref,1), etc. Correspondingly, a second reflected pulse following the first reflected pulse may, for instance, be evaluated—by using the above-mentioned second reference voltage Vref,2—at the above-mentioned first (scanning) point in time t1,1 and at the second (scanning) point in time t2,1—which is by a duration ΔT later vis-à-vis the first (scanning) point in time t1,1—, and at the third (scanning) point in time t3,1—which is also by a duration ΔT later vis-à-vis the second (scanning) point in time t2,1, etc.
- The digital series of numbers output by the flip-
flop 111 at theline 114 may, for instance, be stored in a shift register provided on thebuffer buffer - The above-mentioned
test device 100—controlling the test method—, in one embodiment thepulse generation 115 and/or thetest control 116, may, for instance, be provided on thebuffer - In one embodiment, the
test device 100 may, for instance, also be provided on a test device that is provided externally of thebuffer test device 100 to thelines buffer test device 100 via corresponding pins of thebuffer buffer lines first bus 6 a or the above-mentioned “north-bound channel” of thesecond bus 6 b (and/or e.g., via pins through which, in normal operation, the above-mentioned signals are output via the above-mentioned “south-bound channel” of thesecond bus 6 b or the above-mentioned “north-bound channel” of thefirst bus 6 a, etc.)). - The test method explained above by way of example may, in a correspondingly identical or similar manner as explained above, also be used in any other electronic systems in addition to the above-mentioned FB-DIMM
memory module system 1, in one embodiment in electronic systems with hidden bidirectional signal paths, e.g., in memory module systems with registered DIMMs, or any other memory module systems, in flash cards, in microprocessor systems with microprocessor chip sets, etc. - Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof.
Claims (17)
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DE102006051135.2A DE102006051135B4 (en) | 2006-10-30 | 2006-10-30 | Test method, as well as semiconductor device, in particular data buffer device |
DE102006051135 | 2006-10-30 | ||
DE102006051135.2 | 2007-10-30 |
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US20090109774A1 true US20090109774A1 (en) | 2009-04-30 |
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US20190271964A1 (en) * | 2018-03-01 | 2019-09-05 | Fanuc Corporation | Numerical controller |
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US20090199058A1 (en) * | 2008-02-06 | 2009-08-06 | Christoph Seidl | Programmable memory with reliability testing of the stored data |
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2006
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US5977775A (en) * | 1993-08-31 | 1999-11-02 | Hewlett-Packard Company | System and method for detecting shorts, opens and connected pins on a printed circuit board using automatic equipment |
US5844913A (en) * | 1997-04-04 | 1998-12-01 | Hewlett-Packard Company | Current mode interface circuitry for an IC test device |
US6298465B1 (en) * | 1998-06-29 | 2001-10-02 | Process Intelligence Limited | Skew calibration means and a method of skew calibration |
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DE102006051135B4 (en) | 2016-11-17 |
US7715257B2 (en) | 2010-05-11 |
DE102006051135A1 (en) | 2008-05-08 |
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