US20090073660A1 - Cooling apparatus for electronic devices - Google Patents
Cooling apparatus for electronic devices Download PDFInfo
- Publication number
- US20090073660A1 US20090073660A1 US12/250,438 US25043808A US2009073660A1 US 20090073660 A1 US20090073660 A1 US 20090073660A1 US 25043808 A US25043808 A US 25043808A US 2009073660 A1 US2009073660 A1 US 2009073660A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- core
- fins
- mounting base
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the fluid in the porous material 352 in the evaporator section 354 near the mounting base 344 evaporates and travels upward as indicated by arrows 358 .
- the vapor condenses and collects in the porous material 352 due to the relatively lower temperature at the condenser section 356 versus the temperature at the evaporator section 354 .
- the condensed vapor then travels through the porous material 352 from the condenser section 356 back toward the evaporator section 354 , as indicated by arrows 360 .
- the cycle repeats as the condensed vapor becomes heated and evaporates. In this manner, the vapor carries heat from the evaporator section 354 to the condenser section 356 , thereby facilitating heat transfer away from the mounting base 344 of the heat sink 340 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core structure is at least partially elongated in the direction parallel to the mounting base toward outer extremities of the plurality of fins.
Description
- This is a divisional of co-pending application Ser. No. 10/993,194 filed on Nov. 22, 2004, which is hereby incorporated by reference in its entirety.
- Fans and heat sinks are often disposed in electronic devices to cool the various internal components. Heat sinks often have a plurality of fins or pins, which facilitate convective heat transfer away from the heat sink. Unfortunately, the primary conductive path to these fins or pins is generally long and unidirectional, i.e., either perpendicular or parallel to the heat source surface. In addition, a high contact resistance often exists between the primary conductive path and the fins or pins. The fins or pins are also generally limited in size due to the lack of structural support. Some heat sinks have larger fins or pins with supports or covers, which impedes the airflow through the heat sink.
- A fan's position also impedes the airflow through the heat sink. In a typical heat sink and fan configuration, the fan is mounted above the heat sink. In this configuration, the airflow does not pass straight through the heat sink, but rather the airflow turns between a perpendicular orientation and a parallel orientation with respect to the base of the heat sink. As a result, this configuration impedes the airflow through the heat sink, thereby reducing the forced convection from the heat sink into the airflow. If the fan blows air downwardly onto the heat sink, then the heat sink also causes the heated air to turn onto the surrounding components.
- In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core structure is at least partially elongated in the direction parallel to the mounting base toward outer extremities of the plurality of fins.
- Advantages of one or more disclosed embodiments will become apparent upon reading the following detailed description and upon reference to the drawings in which:
-
FIG. 1 is a diagrammatical view of a computer having a heat sink disposed over a component in accordance with embodiments of the present invention; -
FIG. 2 is a diagrammatical view of a rack system having a heat sink disposed over a component within a rack mounted device in accordance with embodiments of the present invention; -
FIG. 3 is a perspective view of a heat sink in accordance with embodiments of the present invention; -
FIG. 4 is a side view of the heat sink ofFIG. 3 ; -
FIGS. 5-11 are cross-sectional top views of the heat sink ofFIG. 4 ; -
FIG. 12 is a perspective view of an alternative heat sink in accordance with embodiments of the present invention; -
FIG. 13 is a side view of the heat sink ofFIG. 12 ; -
FIG. 14 is a cross-sectional top view of the heat sink ofFIG. 13 ; -
FIG. 15 is a perspective view of another alternative heat sink in accordance with embodiments of the present invention; -
FIG. 16 is a side view of the heat sink ofFIG. 15 ; -
FIGS. 17 and 18 are cross-sectional top views of the heat sink ofFIG. 16 ; -
FIG. 19 is a cross-sectional side view of the heat sink ofFIG. 15 ; and -
FIG. 20 is a cross-sectional side view of a heat sink having a heat pipe or vapor chamber in accordance with embodiments of the present invention. -
FIG. 1 is a diagrammatical view of an electronic device, such as acomputer 10, having aheat sink 12 disposed over acomponent 14 within ahousing 16 in accordance with embodiments of the present invention. For example, embodiments of thecomputer 10 include a desktop computer, a laptop or notebook computer, a tablet computer, a palm computer, a server, or another processor-based device. Moreover, embodiments of thecomponent 14 include a variety of heat-generating devices and electronics, such as processors and other integrated circuit devices. As discussed in further detail below, theheat sink 12 includes amounting base 18 that interfaces atop surface 20 of thecomponent 14, aconductive core 22 that is outwardly flared from themounting base 18, and multipleconvective members 24 extending from theconductive core 22 in a direction substantially parallel to or across themounting base 18. As defined in the present application, the word parallel includes exactly parallel, substantially parallel, or generally parallel. In other words, the parallel features in the present application are generally directed in the same direction as one another with some acceptable variance. These features of theheat sink 12 substantially increase the heat transfer away from thecomponent 14, while reducing undesirable heat transfer to surrounding components. - For example, the
conductive core 22 ofFIG. 1 becomes increasingly elongated the further it extends from themounting base 18, such that theconductive core 22 provides a shorter conductive path toouter extremities convective members 24. In operation, theconductive core 22 spreads heat in multiple directions relative to themounting base 18 and thecomponent 14. In other words, the heat conductively flows through theconductive core 22 in both an outward direction toward the top of theheat sink 12 and, also, a lateral direction toward theouter extremities convective members 24. These multiple directions of heat conduction through theconductive core 22 effectively reduce the primary heat conduction path to theconvective members 24. Thus, theconductive core 22 spreads the heat more uniformly throughout the central andouter extremities convective members 24. As a result, theconvective members 24 can more effectively dissipate the heat into the surrounding air or forced airflow. - In the illustrated embodiment of
FIG. 1 , theconductive core 22 curvilinearly expands from themounting base 18 to the top of theheat sink 12. In other embodiments, theconductive core 22 linearly expands from themounting base 18 to the top of theheat sink 12. As discussed below, some embodiments of theconductive core 22 have a substantially constant width, which extends to theouter extremities convective members 24. In these various embodiments, the elongated or flared nature of theconductive core 22 increases the heat spreading from themounting base 18 throughout the central portions andouter extremities convective members 24. Theconductive core 22 also provides greater structural support for theconvective members 24 at theouter extremities heat sink 12 has relatively largerconvective members 24 and, thus, a greater surface area for convective heat transfer. - As further illustrated in
FIG. 1 , theconvective members 24 are fins or panel-shaped structures, which are disposed one over the other in spaced relation above themounting base 18. In this manner, theconvective members 24 define boundaries of air passages or channels 30 that extend across or parallel to themounting base 18 and thetop surface 20 of thecomponent 14. In other words, the channels 30 guide airflows provided by one or more fans, such asfan 32, in a substantially straight direction through theconvective members 24 and around theconductive core 22, as indicated by arrows and 34 and 36. As a result, the airflow resistance is relatively low, because the air passes through theheat sink 12 without significant changes in flow direction. The airflow resistance is also reduced by the generally open nature of the channels 30 at theouter extremities convective members 24. In other words, theheat sink 12 and surrounding components do not force the airflow to turn between perpendicular and parallel directions relative to thecomponent 14. In addition, the illustratedcore 22 is elongated in the direction of theairflows core 22 provides relatively lower impedance to theairflows convective members 24. Altogether, the reduced airflow resistance of the illustratedheat sink 12 improves the forced convection away from theconvective members 24, thereby improving the heat dissipation from thecomponent 14. -
FIG. 2 is a diagrammatical view of arack system 60 having theheat sink 12 ofFIG. 1 in accordance with embodiments of the present invention. As illustrated, therack system 60 includes arack structure 62, a number of rack mounteddevices rack structure 62, and theheat sink 12 disposed over acomponent 76 on acircuit board 78. The illustratedrack system 60 is a rack mount computer system. Accordingly, the rack mounteddevices rack system 60 anddevices component 76 may include a variety of heat-generating devices and electronics, such as a processor or other integrated circuit devices. - As discussed in detail above, the
heat sink 12 improves both conductive and convective heat transfer away from thecomponent 76. Specifically, theconductive core 22 has a width or cross-sectional geometry, which grows or expands the further theconductive core 22 extends from the mountingbase 18. Thus, theconductive core 22 extends toward theouter extremities convective members 24, such that theconductive core 22 increases the heat spreading to theseouter extremities convective members 24 can more effectively dissipate the heat generated by thecomponent 76. In addition, theconvective members 24 are configured one over the other above the mountingbase 18, such that the mountingbase 18 and surrounding components do not restrictairflows convective members 24. This configuration of theconvective members 24 also enables the use offans outer extremities fan 84 pushes theairflow 80 into theconvective members 24, while theother fan 86 pulls theairflow 82 out from theconvective members 24. Thesefans heat sink 12. -
FIG. 3 is a perspective view of aheat sink 112 in accordance with embodiments of the present invention. As illustrated, theheat sink 112 includes a mountingbase 114 andmultiple fins 116, which are positioned one over the other in spaced relation above the mountingbase 114. Thus, themultiple fins 116 are substantially parallel with one another and with a component interface surface orunderside 118 of the mountingbase 114. In this manner, themultiple fins 116 channel air flow in a direction that is substantially parallel to theunderside 118 of the mountingbase 114. -
FIG. 4 is a side view of the heat sink ofFIG. 3 . As illustrated, themultiple fins 116 extends outwardly from a centralconductive core 120, which is generally perpendicular to the mountingbase 114. In other words, themultiple fins 116 are generally transverse or perpendicular to the centralconductive core 120. As defined in the present application, the word perpendicular includes exactly perpendicular, substantially perpendicular, or generally perpendicular. The illustratedcore 120 has a curved geometry, which progressively widens or becomes increasingly elongated from the mountingbase 114 to atop side 122 of theheat sink 112. In this manner, the centralconductive core 120 progressively approachesouter extremities multiple fins 116 the further thecore 120 extends from the mountingbase 114. In operation, the lateral extension of the illustratedcore 120 toward theouter extremities multiple fins 116. As a result, themultiple fins 116 can convectively transfer the heat away theheat sink 112 more effectively. -
FIGS. 5-11 are cross-sectional top views of the heat sink ofFIG. 4 in accordance with embodiments of the present invention. As illustrated, the centralconductive core 120 changes geometry from a circular cross-section inFIGS. 5 and 6 to a progressively elongated curved geometry inFIGS. 7-11 . For example, the centralconductive core 120 inFIGS. 7-11 haslateral extensions outer extremities multiple fins 116. The illustratedcore 120 also includes anintermediate portion 132 between thelateral extensions intermediate portion 132 decreases in size as thelateral extensions conductive core 120 becomes increasingly aerodynamic or less resistive to airflow from the mountingbase 114 to thetop side 122 of theheat sink 112. Accordingly, the unique geometry of theconductive core 120 improves airflow through theheat sink 112 inline with thelateral extensions outer extremity 124 to theouter extremity 126, and vice versa. The improved aerodynamics of theconductive core 120, in turn, improves the forced convective heat transfer away from theheat sink 112. -
FIGS. 12-14 illustrate analternative heat sink 212 in accordance with embodiments of the present invention.FIG. 12 is a perspective view illustrating theheat sink 212 having a mountingbase 214 and a plurality ofrectangular fins 216, which extend across the mountingbase 214 one over the other in spaced relation.FIG. 13 is a side view of the heat sink ofFIG. 12 illustrating air passageways orchannels 218, which are formed by the spaced relation of the plurality ofrectangular fins 216. As illustrated, thesechannels 218 extend betweenouter extremities fins 216, such that air can flow through thefins 216 to force convection of heat away from theheat sink 212. -
FIG. 14 is a cross-sectional top view of the heat sink ofFIG. 13 illustrating an elongatedconductive core 224, which has a central portion 226 andlateral extension portions lateral extension portions outer extremities conductive core 224 has a substantially uniform geometry from the mountingbase 214 to a top side 232 of theheat sink 212. In operation, thelateral extension portions outer extremities fins 216. This improved heat distribution or spreading, in turn, improves the convection of heat away from theheat sink 212 from thefins 216. The relatively elongated geometry of the illustratedcore 224 also improves airflow inline with thelateral extension portions outer extremities fins 216, thereby increasing the airflow through theheat sink 212 and providing redundancies to ensure continuous cooling of theheat sink 212. -
FIGS. 15-19 illustrate anotheralternative heat sink 312 in accordance with embodiments of the present invention.FIG. 15 is a perspective view illustrating theheat sink 312 having a mountingbase 314, a plurality offins 316 disposed one over the other in spaced relation above the mountingbase 314, and a hollowconductive core 318 extending from the mountingbase 314 to a top 320 of the plurality offins 316.FIG. 16 is a side view illustrating theheat sink 312 ofFIG. 15 having air passageways orchannels 322 disposed betweenadjacent fins 316. The illustratedchannels 322 extend between outer extremities oropposite sides fins 316, such that air can flow from theside 324 to theside 326, and vice versa. In other words, thechannels 322 are oriented in a generally parallel direction relative to the mountingbase 314. -
FIGS. 17 and 18 are cross-sectional top views of theheat sink 312 ofFIG. 16 illustrating elongated hollow geometries of the hollowconductive core 318 in accordance with some embodiments of the present invention. As illustrated, the hollowconductive core 318 includes acentral portion 328 andlateral extension portions central portion 328 outwardly to theouter extremities conductive core 318 has a constant exterior shape as thecore 318 progresses further away from the mountingbase 314. In other words, the size and shape of thecentral portion 328 and thelateral extension portions conductive core 318. Theselateral extension portions fins 316, including theouter extremities fins 316 are able to convect heat away from theheat sink 312 more effectively. In addition, the elongated geometry of the hollowconductive core 318 improves airflow through the plurality offins 316 from theouter extremity 324 to theouter extremity 326, and vice versa. In other words, thelateral extension portions central portion 328 increase the aerodynamics of the hollowconductive core 318. As a result,heat sink 312 more effectively dissipates heat from a component that interfaces the mountingbase 314. - As further illustrated in
FIGS. 17 , 18, and 19, thecentral portion 328 of the hollowconductive core 318 has aninterior chamber 334 in accordance with embodiments of the present invention. In the illustrated embodiment, theinterior chamber 334 includes a firstcylindrical passage 336 and a secondcylindrical passage 338, which has a larger diameter than the firstcylindrical passage 336. However, thepassages heat sink 312. Theinterior chamber 334 provides a number of benefits. For example, theinterior chamber 334 reduces the weight and material consumption of theheat sink 312. In some embodiments, theinterior chamber 334 includes a heat pipe or circulating vapor chamber, which facilitates heat transfer from the mountingbase 314 to the top 320 of theheat sink 312. Other heat transfer mechanisms also can be disposed within theinterior chamber 334 to increase the heat spreading to various portions of thetransfer fins 316. Thus, theinterior chamber 334 functions to improve the characteristics of theheat sink 312. - Turning now to
FIG. 20 , this figure illustrates aheat sink 340 having a heat pipe orvapor chamber 342 in accordance with embodiments of the present invention. As illustrated, theheat sink 340 includes a mountingbase 344, a thermally conductive core 346 that is substantially perpendicular to the mountingbase 344, and a plurality offins 348 that are substantially perpendicular to the core 346 and substantially parallel to the mountingbase 344. Thisexemplary heat sink 340 also has portions of the thermally conductive core 346 that extend toward outer extremities of thefins 348. For example, the thermally conductive core 346 may have a geometry similar to thecore 120 illustrated inFIGS. 4-11 , or similar to thecore 224 illustrated inFIG. 14 , or similar to thecore 318 illustrated inFIGS. 17-19 . Inside the thermally conductive core 346, the heat pipe orvapor chamber 342 facilitates heat transfer away from the mountingbase 344 along the length of the core 346. - In the illustrated embodiment of
FIG. 20 , the heat pipe orvapor chamber 342 includes a thermallyconductive enclosure 350 having aporous material 352 lining the interior surface of theenclosure 350. For example, embodiments of the thermallyconductive enclosure 350 include a closed copper pipe, and embodiments of theporous material 352 include a fabric material. The heat pipe orvapor chamber 342 also includes evaporator and condenser sections at opposite ends 354 and 356, respectively. The heat pipe orvapor chamber 342 also includes an amount of working fluid disposed in theporous material 352, such that the atmosphere inside the heat pipe orvapor chamber 342 has an equilibrium of liquid and vapor. In operation, as the mountingbase 344 becomes heated, the fluid in theporous material 352 in theevaporator section 354 near the mountingbase 344 evaporates and travels upward as indicated byarrows 358. Upon reaching thecondenser section 356, the vapor condenses and collects in theporous material 352 due to the relatively lower temperature at thecondenser section 356 versus the temperature at theevaporator section 354. The condensed vapor then travels through theporous material 352 from thecondenser section 356 back toward theevaporator section 354, as indicated byarrows 360. Upon reaching theevaporator section 354, the cycle repeats as the condensed vapor becomes heated and evaporates. In this manner, the vapor carries heat from theevaporator section 354 to thecondenser section 356, thereby facilitating heat transfer away from the mountingbase 344 of theheat sink 340.
Claims (21)
1. A heat sink, comprising:
a mounting base;
a core structure extending outwardly from the mounting base in a first direction; and
a plurality of fins extending outwardly from the core structure in a second direction along the mounting base and transverse to the first direction, wherein the core structure is at least partially elongated in the second direction toward outer extremities of the plurality of fins, and the second direction is oriented along a path of airflow into a first side, completely through the heat sink, and out through an opposite second side.
2. The heat sink of claim 1 , wherein the core structure becomes increasingly elongated in the second direction the farther the core structure extends from the mounting base in the first direction.
3. The heat sink of claim 1 , wherein the core structure comprises a longitudinal axis that is substantially perpendicular to the mounting base, and wherein the fins comprises a plurality of plates disposed one over the other in spaced relation above the mounting base and substantially parallel to a mounting surface of the mounting base.
4. The heat sink of claim 1 , wherein core structure has a curved geometry that becomes increasingly narrow in the second direction toward the outer extremities of the plurality of fins.
5. The heat sink of claim 1 , wherein the core structure comprises a hollow interior.
6. The heat sink claim 1 , wherein the core structure comprises an internal heat pipe or vapor chamber.
7. The heat sink of claim 1 , comprising a fan positioned to flow air through the plurality of fins in the second direction parallel to the mounting base.
8. A system, comprising:
a heat sink, comprising:
a mounting surface;
a plurality of fins parallel to the mounting surface, wherein the fins are stacked one over another in spaced relation above the mounting surface, wherein an airflow path extends through spaces between the fins in a direction parallel to the mounting surface, and the airflow path extends into a first side, completely through the heat sink, and out through an opposite second side; and
a core perpendicular to the mounting surface and the plurality of fins, wherein the core has a curved exterior that is elongated in the direction of the airflow path.
9. The system of claim 8 , wherein the core has an airfoil shape aligned with the direction of the airflow path.
10. The system of claim 8 , wherein the core becomes increasingly aerodynamic and less resistive to airflow from the mounting surface toward an opposite top side of the heat sink.
11. The system of claim 8 , wherein the core has a cylindrical shape adjacent the mounting surface, and the cylindrical shape gradually becomes more oblong away from the mounting surface.
12. The system of claim 8 , comprising a processor configured to mount with the mounting surface of the heat sink.
13. The system of claim 8 , comprising a circuit board configured to receive the heat sink.
14. The system of claim 8 , comprising a computer having the heat sink.
15. A system, comprising:
a heat sink, comprising:
a base;
a core extending outwardly from the base in a first direction; and
a plurality of fins extending outwardly from the core in a second direction that is transverse to the first direction, wherein the core has a curved geometry that becomes increasingly narrow in the second direction toward outer extremities of the plurality of fins, and the second direction is oriented along a path of airflow into a first side, completely through the heat sink, and out through an opposite second side.
16. The system of claim 15 , wherein the core becomes progressively more elongated in the second direction the further the core extends in the first direction away from the base.
17. The system of claim 15 , wherein the core progressively flares and thins away from the base.
18. The system of claim 15 , wherein the fins are positioned one over another in spaced relation above the base.
19. The system of claim 15 , comprising a processor, a circuit board, or a computer assembled with the heat sink.
20. A heat sink, comprising:
a core that thins and flares in a bell-shaped profile away from a mounting surface; and
a plurality of fins coupled to the core.
21. A heat sink, comprising:
a core that has an airfoil-shaped profile; and
a plurality of fins coupled to the core, wherein the fins define an airflow path about the airfoil-shaped profile in through a first side of the heat sink, completely through the heat sink, and out through an opposite second side of the heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/250,438 US20090073660A1 (en) | 2004-11-19 | 2008-10-13 | Cooling apparatus for electronic devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/993,194 US7443683B2 (en) | 2004-11-19 | 2004-11-19 | Cooling apparatus for electronic devices |
US12/250,438 US20090073660A1 (en) | 2004-11-19 | 2008-10-13 | Cooling apparatus for electronic devices |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/993,194 Division US7443683B2 (en) | 2004-11-19 | 2004-11-19 | Cooling apparatus for electronic devices |
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US20090073660A1 true US20090073660A1 (en) | 2009-03-19 |
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US10/993,194 Expired - Fee Related US7443683B2 (en) | 2004-11-19 | 2004-11-19 | Cooling apparatus for electronic devices |
US12/250,438 Abandoned US20090073660A1 (en) | 2004-11-19 | 2008-10-13 | Cooling apparatus for electronic devices |
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US10/993,194 Expired - Fee Related US7443683B2 (en) | 2004-11-19 | 2004-11-19 | Cooling apparatus for electronic devices |
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US20110007476A1 (en) * | 2009-07-10 | 2011-01-13 | Joshi Shailesh N | Systems and methods for providing heat transfer |
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TWI325046B (en) * | 2006-12-01 | 2010-05-21 | Delta Electronics Inc | Heat dissipation module and flat heat column and heat dissipation apparatus thereof |
US8462508B2 (en) | 2007-04-30 | 2013-06-11 | Hewlett-Packard Development Company, L.P. | Heat sink with surface-formed vapor chamber base |
US7845393B2 (en) * | 2007-11-06 | 2010-12-07 | Jiing Tung Tec. Metal Co., Ltd. | Thermal module |
CN101730451B (en) * | 2008-10-24 | 2013-02-20 | 富准精密工业(深圳)有限公司 | Heat radiation device |
CN109314092B (en) * | 2015-11-16 | 2022-10-18 | 英特尔公司 | Heat sink with interlocking inserts |
US20230320034A1 (en) * | 2022-03-22 | 2023-10-05 | Baidu Usa Llc | Thermal management device for high density processing unit |
US20230345669A1 (en) * | 2022-04-20 | 2023-10-26 | Quanta Computer Inc. | Heat-Absorbing Chassis For Fan-Less Electronic Component |
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US20110007476A1 (en) * | 2009-07-10 | 2011-01-13 | Joshi Shailesh N | Systems and methods for providing heat transfer |
US8315055B2 (en) | 2009-07-10 | 2012-11-20 | Hewlett-Packard Development Company, L.P. | Systems and methods for providing heat transfer |
Also Published As
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US20060109628A1 (en) | 2006-05-25 |
US7443683B2 (en) | 2008-10-28 |
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