US20080302514A1 - Plasma cooling heat sink - Google Patents

Plasma cooling heat sink Download PDF

Info

Publication number
US20080302514A1
US20080302514A1 US12/157,233 US15723308A US2008302514A1 US 20080302514 A1 US20080302514 A1 US 20080302514A1 US 15723308 A US15723308 A US 15723308A US 2008302514 A1 US2008302514 A1 US 2008302514A1
Authority
US
United States
Prior art keywords
heat sink
assembly
plasma
cooling
varied
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/157,233
Other languages
English (en)
Inventor
Chien Ouyang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US12/157,233 priority Critical patent/US20080302514A1/en
Publication of US20080302514A1 publication Critical patent/US20080302514A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium

Definitions

  • the present invention relates generally to electronic equipment, and more particularly, to apparatus and methods for cooling electronic devices using plasma-driven gas flow.
  • Electronic devices may generate significant heat during operation. High temperatures may reduce the lifespan of these devices, and, therefore, the generated heat may need to be dispersed to keep the operating temperature of the electronic devices within acceptable limits.
  • Heat sinks may be coupled to electronic devices to absorb heat through the heat sink base and disperse the heat through their fins.
  • Conventional methods to disperse the heat through the heat sink fins are natural convection and forced convection. Natural convection is to disperse the heat away from the surfaces of heat sink fins without the aid of external forced fluid pumping through heat sink fins.
  • the forced convection cooling is to pump the fluid to flow through heat sink fins, such as the fans to blow the air through the heat sink fins, and therefore enhance the heat transfer between fins and outside ambient.
  • the pitch or the distance between heat sink fins is becoming smaller, which means more surface area may be used to transport the heat away.
  • the pressure drop between inlet and outlet of the heat sink fins may become very high, which may results the difficulties to pump the fluid flowing through fins, and as a result, more powerful fans, which consume higher electricity may be needed for the cooling.
  • the invention utilizes plasma-driven gas flow to conduct the convective heat transfer along the heat sink fins and therefore will resolve these issues.
  • the invention utilizes the plasma-driven gas flow to generate the forced convective heat transfer on the heat sink fins, and hence, is able to improve the heat transfer efficiency and to minimize the required space because some cooling components are assembled inside heat sink fins.
  • Another aspect of using the invention is to lower the required power of the system fans of electronic devices.
  • the plasma driven gas flow on the heat sink fins will induce the local turbulence on the heat sink surfaces. Higher momentum of the fluid is obtained and the cooling is achieved. Therefore, in this way, the system fan doesn't need to be very powerful in order to cool down heat source.
  • Plasma-driven gas flow has been used either to cool articles or to control and modify the fluid dynamics boundary layer on the wings surfaces of the aerodynamic vehicles.
  • U.S. Pat. No. 3,938,345 used the phenomenon of corona discharge, which is one type of plasma, to do the local cooling of an article.
  • U.S. Pat. No. 4,210,847 designed an apparatus for generating an air jet for cooling application.
  • U.S. Pat. No. 5,554,344 had a gas ionization device to do the cooling of zone producing chamber.
  • U.S. Pat. No. 6,796,532 B2 used a plasma discharge to manipulate the boundary layer and the angular locations of its separation points in cross flow planes to control the symmetry or asymmetry of the vortex pattern.
  • One embodiment of the present invention provides a plasma-driven cooling device couple to heat sink fins to induce the gas flow along the heat sink fins.
  • the induced gas flow will remove the heat away from heat sink fin surface and therefore the heat source is cool down.
  • the plasma-driven cooling device includes heat sink fin assembly, magnetic circuit assembly, and plasma actuator assembly.
  • the heat sink fin assembly includes a plurality of heat sink fins.
  • the magnetic circuit assembly includes ferromagnetic yokes and magnets.
  • the plasma actuator assembly includes electrodes and dielectric pieces.
  • each plasma actuator in the plasma actuator assembly may be separately controlled and powered, such as, by a controller and a power supplier, to provide different convective cooling rates at different locations on the heat sink fins.
  • plasma-driven gas may flow in varied directions and the flow patterns may vary.
  • the electrodes, heat sink fins, and dielectric pieces may have varied configurations and geometry.
  • varied voltages may be applied to the electrodes to induce the gas flow to cool down the heat source.
  • the applied voltages may have varied waveforms, frequencies, amplitude, phase shifts, and time period.
  • the magnetic circuit assembly may have different configurations to provide magnetic field.
  • the magnetic field will interact with electrical field and plasma to induce turbulent flow, and therefore, the heat source is cooled down.
  • the electrodes may be populated in between heat sink fins, and when the voltages are applied to these electrodes, the induced ions gas flow may cool down the heat sink assembly.
  • the sharp electrodes may be made along out-of-plane or in-plane direction.
  • the plasma actuators may be populated in between heat sink fins, at the entrance of the heat sink fins, or at any locations to couple with heat sink fins assembly.
  • the electrode traces may be layout with varied configurations and the sharp electrodes may be populated on the electrode traces.
  • FIG. 1 illustrates a plasma-driven cooling device coupled to heat transferring pipes and heat source, according to an embodiment
  • FIG. 2 illustrates a plasma-driven cooling device, according to an embodiment
  • FIG. 3 illustrates a plasma actuator assembly, according to an embodiment
  • FIG. 4 illustrates the detailed view of a plasma actuator assembly, according to an embodiment
  • FIG. 5 illustrates cross sectional view of a plasma actuator, according to an embodiment
  • FIG. 6 illustrates a cross sectional view of plasma actuator, according to an embodiment
  • FIG. 7 illustrates a cross sectional view of plasma actuator, according to an embodiment
  • FIG. 8 illustrates cross sectional view of magnetic circuit assembly, according to an embodiment.
  • FIG. 9 illustrates a heat sink cooling using corona wind
  • FIG. 10 illustrates a heat sink cooling using corona wind
  • FIG. 11 illustrates a heat sink cooling using corona wind
  • FIG. 12 illustrates a cross sectional view of the electrode on the heat sink cooling.
  • the invention generally relates to apparatus for cooling microelectronic devices or packages, such as microprocessors, and ASIC.
  • Such systems and methods may be used in a variety of applications.
  • a non-exhaustive list of such applications includes the cooling of: a microprocessor chip, a graphics processor chip, an ASIC chip, a video processor chip, a DSP chip, a memory chip, a hard disk drive, a graphic card, a portable testing electronics, a personal computer system.
  • plasma is an ionized gas, a gas into which sufficient energy is provided to free electrons from atoms or molecules and to allow both species, ions and electrons, to coexist. Plasma is even common here on earth.
  • a plasma is a gas that has been energized to the point that some of the electrons break free from, but travel with, their nucleus. Gases can become plasmas in several ways, but all include pumping the gas with energy.
  • a spark in a gas will create a plasma.
  • a hot gas passing through a big spark will turn the gas stream into a plasma that can be useful.
  • Plasma torches like like that are used in industry to cut metals.
  • electrode is an electrical conductor used to make contact with a metallic part of a circuit.
  • dielectric piece is a substance that is a poor conductor of electricity, but an efficient supporter of electrostatic fields. In practice, most dielectric materials are solid. An important property of a dielectric is its ability to support an electrostatic field while dissipating minimal energy in the form of heat. The lower the dielectric loss (the proportion of energy lost as heat), the more effective is a dielectric material. Another consideration is the dielectric constant, the extent to which a substance concentrates the electrostatic lines of flux. Substances with a low dielectric constant include a perfect vacuum, dry air, and most pure, dry gases such as helium and nitrogen. Materials with moderate dielectric constants include ceramics, distilled water, paper, mica, polyethylene, and glass. Metal oxides, in general, have high dielectric constants.
  • FIG. 1 illustrates a configuration of an electronic cooling device.
  • Heat source 100 generates heat and the heat is transferred to the heat sink fin assembly 104 , through an attachment component 101 , heat transfer pipes 102 , and heat sink base 103 .
  • the attachment component 101 couples with heat source 100 and heat transferring pipes 102 .
  • the heat transfer pipes 102 may be heat pipes, liquid cooling pipes, refrigeration pipes, and other heat transferring pipes.
  • the heat sink fins assembly 104 is coupled to magnetic circuit assembly 105 and plasma actuator assembly 106 . When the plasma actuator assembly 106 , coupled with magnetic circuit assembly 105 , is operating, the heat sink fins assembly 104 is cooled down, and therefore, the heat sink source 100 is cooled down.
  • the heat source 100 may directly couple to heat sink base 103 and heat sink fins assembly 104 , without the need of attachment component 101 and heat transferring pipes 102 .
  • FIG.2 is a closer look of the heat sink fins assembly 104 and plasma actuator assembly 106 .
  • heat sink fins assembly 104 is composed by a plurality of heat sink fins 109 , and two plasma actuator assemblies 106 are couple to heat sink fins assembly 104 at its two ends.
  • the plasma actuator assembly 106 can be at any location in the system, such as in the middle of the heat sink fin assembly 104 , and varied numbers of the plasma actuator assembly 106 may be used.
  • FIG. 3 illustrates a plasma actuator assembly 106 is coupled to heat sink fin assembly 104 , and lead wires 107 are coupled to plasma actuator assembly 106 .
  • the power supplier and controller may power and control the plasma actuators on the plasma actuator assembly 106 through lead wires 107 .
  • the lead wires 107 are on top of the plasma actuator assembly 106 .
  • Lead wires 107 may be at any locations inside the plasma actuator assembly 106 .
  • FIG. 4 illustrates plasma actuators assembly 106 is composed by electrodes 108 and dielectric pieces 110 .
  • the electrodes 108 may be coupled to dielectric pieces 110 on its two sides.
  • a plasma-driven gas flow is induced and the gas flow will pump into heat sink fins and therefore remove the heat from the heat sink fins surfaces.
  • the plasma-driven gas flow is in y direction as shown in the figure.
  • all plasma actuators may be powered together, or each plasma actuator may be powered and controlled individually.
  • FIG. 5 a illustrates a cross sectional view of a plasma actuator assembly 106 .
  • the plasma actuator assembly 106 contains two line electrodes 108 , and the line electrodes 108 have triangular patterns on the edges. Plasma may be occurred between the patterns when appropriate voltages are applied to the electrodes 108 .
  • FIG. 5 b illustrates another cross sectional view of the assembly. In the figure, viewing from z direction, the plasma is occurred between electrodes 108 , and the magnetic field direction 111 is going into paper. The interactions of plasma field, electrical field, and magnetic field, may induce a gas flow in y direction, as the arrows shown in the figure to cool down heat sink fins 109 .
  • the shapes of the patterns on the edges of electrodes 108 may vary, such as the patterns may be flat shape, square shape, round shape, or other shapes, and the relative locations of the patterns may vary.
  • FIG. 6 illustrates several configurations of the electrodes 108 on the plasma actuator assembly 106 .
  • the shapes of the patterns can be varied in y-z plane, the figure shows that the patterns may have different shape in x direction. Therefore the patterns on the electrodes 108 may have 3D geometry.
  • varied number of electrodes may be coupled to plasma actuator assembly 106 to induce the gas flow and the relative locations among electrodes 108 may be varied.
  • the applied voltages to the electrodes may be DC or AC, may be steady or transient, may be constant or varied amplitude, may have varied waveforms, and may have varied frequencies and phase shifts. In one application, as shown in FIG.
  • three pairs of electrodes may be powered, at time t, t+ ⁇ t, and t+2 ⁇ t to drive the gas flow, in sequential, into heat sink fin assembly 104 .
  • three pairs of electrodes may be powered simultaneously, with an AC and with a phase shift difference between each other, to induce a traveling plasma wave to drive the gas flow into heat sink fin assembly 104 .
  • a mixed combination of voltages may be used.
  • the plasma actuator assembly 106 and heat sink fin assembly 104 may have varied configurations.
  • FIG. 7 a illustrates a cross sectional view of plasma actuator assembly 106 whose gap is convergent, and the heat sink fins assembly 104 whose gap is divergent, toward +y direction.
  • the heat sink fin assembly 104 has a fixed gap. Therefore, the gas flow is pushed into the heat sink fin assembly 104 .
  • the gas is pushed out from heat sink fin assembly 106 .
  • the heat will be transferred away.
  • the magnetic field strength at different locations may be varied, and the applied voltages to different electrodes 108 may be varied as well.
  • varied configurations of plasma actuator assembly 106 and heat sink fin assembly 104 may be used, such as, aerodynamically streamlined configurations. However, all these variations shall be considered within the scope of the embodiments here.
  • FIG. 8 a illustrates a simple magnetic circuit, which has a yoke 112 and two permanent magnets 113 .
  • the yoke 112 is typically made of ferromagnetic materials, which have property of high magnetic permeability.
  • the magnetic field between two permanent magnets may be used to interact with plasma and electrical field, and therefore drive the gas to flow into, or to flow out of heat sink fin assembly 104 .
  • a big bulk magnetic circuit 105 for example like the one shown in FIG. 8 a , may be used to drive the all plasma actuators inside plasma actuator assembly 106 .
  • each plasma actuator may have its own magnetic circuit. Several small magnets may be used for plasma actuators.
  • FIG. 8 b and FIG. 8 c illustrate two possible arrangements.
  • FIG. 8 a to FIG. 8 c are a non-exhaustive list of magnetic circuits. Therefore, any variations of magnetic circuits, such as, magnet geometry, magnet grade, magnet magnetization orientation, relative locations of magnets, and yoke geometry and material, should be considered within the scope of the embodiments here.
  • FIG. 9 a illustrates a simple heat sink device, which is composed by a heat sink base 200 and many heat sink fins 201 .
  • a layer of dielectric layer 202 may be attached, or deposited, or assembled on the top surface of heat sink base 200 .
  • the electrode traces 203 may be populated on the top surface of the dielectric layer 202 .
  • local sharp electrodes 204 may be populated at some spots on the electrode traces 203 .
  • the sharp electrodes 204 may be needle-like configuration, which will result a high electric field at the tip when a voltage is applied to the electrode traces 2003 .
  • FIG. 9 c illustrates the coupling of the heat sink base 200 , heat sink fins 201 , dielectric layer 202 , electrodes traces 203 , and sharp electrodes 204 .
  • the ions flow generated at the sharp electrodes may be attracted to heat sink fins because the heat sink fins are generally electrically grounded.
  • each electrode trace 203 may be applied with one voltage or all electrode traces 203 may be connected together and applied with one voltage. By applying different voltages to electrode traces 203 can provide controlled cooling at different locations.
  • the electrode traces 203 are parallel to heat sink fins 201 .
  • the electrode traces 203 may be with an angle with respect to heat sink fins.
  • FIG. 10 a illustrates that the heat sink fins are segmented and
  • FIG. 10 b illustrates the segmented heat sink fins 201 are coupled to dielectric layer 202 and electrode traces 203 .
  • the electrode traces 203 are perpendicular to heat sink fins.
  • the ions flow direction will depend on the relative distance between sharp electrodes 204 and heat sink fins. In on embodiment, the ions flow may flow in out-of-plan direction and also in in-plan direction.
  • the magnitude, phase, and frequency of the applied voltages to each electrode traces 203 may be controlled to manipulate the ions flow direction in order to achieve the desired flow field.
  • the dielectric layer 202 and electrode traces 203 may be located outside but near the heat sink fins assembly, as shown in FIG. 10 c and FIG. 10 d .
  • the big black arrows shows the ions induced gas flowing into the heat sink assembly, the heat sink fins are bounded by heat sink base 200 and heat sink cover 205 .
  • FIG. 11 a illustrates the heat sink fins 201 may be configured to be long cylinder populated on a heat sink base 200 .
  • FIG. 11 b shows a top view of the cylindrical heat sink fins 201 and sharp electrodes 204 .
  • the relative distance among sharp electrodes 204 and cylindrical heat sink fins 201 may be manipulated to obtain desired flow field.
  • the routing 206 of the electrode traces 203 may be configured to any patterns, and not necessary to be straight lines.
  • FIG. 12 a illustrates a cross sectional view of the assembly.
  • the cross section is in X-Z plane.
  • the tip of the sharp electrode 204 may be made of a combination of copper, nickel-iron, chromium, or precious metals, such as yttrium, iridium, platinum, tungsten, or palladium, as well as the relatively prosaic silver or gold.
  • the sharp tip may be extruding in out-of-plan direction as shown in FIG. 12 a , or may be in in-plane direction as shown in FIG. 12 b , which is in X-Y plane.
  • the in-plane electrode traces 203 are easier for manufacturing.
  • the dielectric layer 202 may cover the electrode traces 203 , as shown in FIG. 12 c.
  • the method and apparatus includes a plurality of heat sink fins forming a heat sink fin assembly, a magnetic circuit assembly and a plasma actuator assembly.
  • the magnetic circuit assembly and plasma actuator are coupled to heat sink fin assembly, and the magnetic circuit assembly and plasma actuator assembly may be at the inlet, outlet, or any locations of the heat sink fin assembly.
  • the plasma actuator assembly includes a plurality of plasma actuators, and plasma actuators include electrodes and dielectric pieces.
  • appropriate voltages can be applied to the electrodes on the plasma actuators to induce a gas to flow into or to flow out of heat sink fin assembly, and therefore remove the heat from heat sink fins surface.
  • the applied voltages to electrodes can be DC or AC, steady or transient, fixed or varied amplitude, fixed or varied frequency, with or without phase shift difference, and may have different waveforms.
  • the plasma actuator assembly may be powered and controlled by power suppliers and controllers, and all plasma actuators on the plasma actuator assembly may be powered all together, or each plasma actuator on the plasma actuator assembly may be powered and controlled individually, to cool down the heat sink fin assembly.
  • the electrodes may have varied patterns, and the patterns may have varied geometry, and the relative relocations among electrodes and patterns may be varied.
  • the heat sink fin assembly and plasma actuator assembly may have varied configurations; and the configurations may be used, to push the gas into heat sink fin assembly.
  • the applied voltages on the electrodes may be arranged to induce a traveling plasma wave, and the traveling plasma wave may be used to push the gas into heat sink fin assembly, and to push the gas out from heat sink fin assembly.
  • the magnetic circuit assembly includes yokes and magnets, and the yokes and magnets may have varied configurations.
  • the yokes and magnets may have varied geometry, varied grade, varied materials compositions, varied magnetization orientation, and varied relative locations.
  • the cooling apparatus may couple to heat source directly, or couple to heat source through heat transferring pipes and attachment components.
  • the transferring pipe may be heat pipe, liquid cooling pipe, refrigeration cooling pipe, or other heat-transferring pipe.
  • the apparatus further comprises thermal sensors coupled to heat sink fin assembly, wherein the thermal sensors are operable to measure the temperatures on heat sink fin assembly, and based on the measured temperatures, the power supplier and controller can command plasma actuators to adjust the cooling rate accordingly.
  • the magnetic circuit assembly is to provide a magnetic field, and wherein the magnetic circuit can be made of permanent magnets or electromagnets.
  • the heat source can include a microprocessor chip package; a graphics processor chip package; an ASIC chip package; a video processor chip package; a DSP chip package; a memory chip package; a hard disk drive; a power supply; or a graphic card; and any other heat sources within the electronic system.
  • the gas can include plasma, air, nitrogen, oxygen, and other fluids.
  • the dielectric material can include air, vacuum, Teflon, Kapton, and other materials.
  • the electrodes material can include gold, copper, nickel, tungsten, and other electrically conductive materials.
  • the heat sink fin assembly and plasma actuator assembly may be manufactured with different scale, such as, a bulk scale, a micro-scale, or a nano-micrometer scale.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/157,233 2007-06-09 2008-06-08 Plasma cooling heat sink Abandoned US20080302514A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/157,233 US20080302514A1 (en) 2007-06-09 2008-06-08 Plasma cooling heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93404707P 2007-06-09 2007-06-09
US12/157,233 US20080302514A1 (en) 2007-06-09 2008-06-08 Plasma cooling heat sink

Publications (1)

Publication Number Publication Date
US20080302514A1 true US20080302514A1 (en) 2008-12-11

Family

ID=40094779

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/157,233 Abandoned US20080302514A1 (en) 2007-06-09 2008-06-08 Plasma cooling heat sink

Country Status (3)

Country Link
US (1) US20080302514A1 (zh)
TW (1) TW200951391A (zh)
WO (1) WO2008153988A1 (zh)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100116469A1 (en) * 2008-11-10 2010-05-13 Tessera, Inc. Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode
US20100149719A1 (en) * 2007-12-31 2010-06-17 Ploeg Johan F Thermal device with ionized air flow
US20100155025A1 (en) * 2008-12-19 2010-06-24 Tessera, Inc. Collector electrodes and ion collecting surfaces for electrohydrodynamic fluid accelerators
US20100307724A1 (en) * 2008-02-21 2010-12-09 Yoshio Ichii Heat exchanger
US20110108249A1 (en) * 2009-11-09 2011-05-12 Tadashi Iwamatsu Heat exchanger
US20110137152A1 (en) * 2009-12-03 2011-06-09 General Electric Company System and method for cooling components of a surgical navigation system
US20110139408A1 (en) * 2009-12-10 2011-06-16 Tessera, Inc. Collector-radiator structure for an electrohydrodynamic cooling system
US20110206533A1 (en) * 2010-02-25 2011-08-25 United Technologies Corporation Repair of a coating on a turbine component
US20120048529A1 (en) * 2010-08-31 2012-03-01 International Business Machines Corporation Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
US20130153199A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Performance and noise control for a heat sink air mover
US20150114608A1 (en) * 2013-10-30 2015-04-30 Forcecon Technology Co., Ltd. Electrostatic air-cooled heat sink
US9408287B2 (en) 2012-11-27 2016-08-02 General Electric Company System and method for controlling plasma induced flow
CN106020398A (zh) * 2016-06-17 2016-10-12 广东工业大学 一种cpu散热装置
CN109310461A (zh) * 2016-07-18 2019-02-05 智像控股有限责任公司 非热等离子体发射器和用于控制的设备
CN112805826A (zh) * 2018-10-05 2021-05-14 日产自动车株式会社 冷却装置
US20220141997A1 (en) * 2019-03-11 2022-05-05 Apr Technologies Ab Cooling of electronic components with an electrohydrodynamic flow unit
US11510336B2 (en) * 2019-09-10 2022-11-22 Lg Electronics Inc. Electronic device having heat dissipation function
US12069793B2 (en) 2020-04-09 2024-08-20 Chiscan Holdings Pte. Ltd. Treatment of infectious diseases using non-thermal plasma

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2524130A4 (en) * 2010-01-13 2015-08-12 Clearsign Comb Corp METHOD AND APPARATUS FOR ELECTRICAL CONTROL OF THERMAL TRANSFER
TWI418972B (zh) * 2010-04-14 2013-12-11 Acer Inc 散熱系統與散熱方法
CN102238856A (zh) * 2010-04-28 2011-11-09 宏碁股份有限公司 散热系统与散热方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794111A (en) * 1971-04-08 1974-02-26 Inter Probe Cooling apparatus for heat exchangers
US4231766A (en) * 1978-12-11 1980-11-04 United Air Specialists, Inc. Two stage electrostatic precipitator with electric field induced airflow
US6659172B1 (en) * 1998-04-03 2003-12-09 Alliedsignal Inc. Electro-hydrodynamic heat exchanger
US20040112568A1 (en) * 2002-12-12 2004-06-17 Min-Sheng Liu Enhanced heat transfer device with electrodes
US20050007726A1 (en) * 2003-01-10 2005-01-13 Schlitz Daniel J. Ion-driven air pump device and method
US20060169441A1 (en) * 2005-01-24 2006-08-03 Schlitz Daniel J Electro-hydrodynamic gas flow cooling system
US20060226787A1 (en) * 2005-04-04 2006-10-12 Krichtafovitch Igor A Electrostatic fluid accelerator for and method of controlling a fluid flow
US20060250746A1 (en) * 2005-05-06 2006-11-09 Cool Shield, Inc. Ionic flow generator for thermal management
US20070002534A1 (en) * 2005-06-29 2007-01-04 Intel Corporation Cooling apparatus and method
US20080060794A1 (en) * 2006-09-12 2008-03-13 Neng Tyi Precision Industries Co., Ltd. Heat sink device generating an ionic wind
US7408778B2 (en) * 2006-09-11 2008-08-05 International Business Machines Corporation Heat sinks for dissipating a thermal load
US7545640B2 (en) * 2007-02-16 2009-06-09 Intel Corporation Various methods, apparatuses, and systems that use ionic wind to affect heat transfer
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3095163A (en) * 1959-10-13 1963-06-25 Petroleum Res Corp Ionized boundary layer fluid pumping system
DE3705666A1 (de) * 1987-02-21 1988-09-01 Leybold Ag Einrichtung zum herstellen eines plasmas und zur behandlung von substraten darin
JP2829221B2 (ja) * 1993-06-30 1998-11-25 財団法人国際超電導産業技術研究センター 熱プラズマ蒸発法による金属基板上への酸化物の成膜方法
US6522536B2 (en) * 2001-01-12 2003-02-18 Dell Products L.P. Electrostatic cooling of a computer
DE10147961A1 (de) * 2001-09-28 2003-04-10 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Dielektrische Barriere-Entladungslampe und Verfahren sowie Schaltunggsanordnung zum Zünden und Betreiben dieser Lampe
US7703479B2 (en) * 2005-10-17 2010-04-27 The University Of Kentucky Research Foundation Plasma actuator

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794111A (en) * 1971-04-08 1974-02-26 Inter Probe Cooling apparatus for heat exchangers
US4231766A (en) * 1978-12-11 1980-11-04 United Air Specialists, Inc. Two stage electrostatic precipitator with electric field induced airflow
US6659172B1 (en) * 1998-04-03 2003-12-09 Alliedsignal Inc. Electro-hydrodynamic heat exchanger
US20040112568A1 (en) * 2002-12-12 2004-06-17 Min-Sheng Liu Enhanced heat transfer device with electrodes
US20050007726A1 (en) * 2003-01-10 2005-01-13 Schlitz Daniel J. Ion-driven air pump device and method
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US20060169441A1 (en) * 2005-01-24 2006-08-03 Schlitz Daniel J Electro-hydrodynamic gas flow cooling system
US20060226787A1 (en) * 2005-04-04 2006-10-12 Krichtafovitch Igor A Electrostatic fluid accelerator for and method of controlling a fluid flow
US20060250746A1 (en) * 2005-05-06 2006-11-09 Cool Shield, Inc. Ionic flow generator for thermal management
US20070002534A1 (en) * 2005-06-29 2007-01-04 Intel Corporation Cooling apparatus and method
US7408778B2 (en) * 2006-09-11 2008-08-05 International Business Machines Corporation Heat sinks for dissipating a thermal load
US20080060794A1 (en) * 2006-09-12 2008-03-13 Neng Tyi Precision Industries Co., Ltd. Heat sink device generating an ionic wind
US7545640B2 (en) * 2007-02-16 2009-06-09 Intel Corporation Various methods, apparatuses, and systems that use ionic wind to affect heat transfer

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100149719A1 (en) * 2007-12-31 2010-06-17 Ploeg Johan F Thermal device with ionized air flow
US20100307724A1 (en) * 2008-02-21 2010-12-09 Yoshio Ichii Heat exchanger
US8411435B2 (en) * 2008-11-10 2013-04-02 Tessera, Inc. Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode
US20100116469A1 (en) * 2008-11-10 2010-05-13 Tessera, Inc. Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode
US20100155025A1 (en) * 2008-12-19 2010-06-24 Tessera, Inc. Collector electrodes and ion collecting surfaces for electrohydrodynamic fluid accelerators
US20110108249A1 (en) * 2009-11-09 2011-05-12 Tadashi Iwamatsu Heat exchanger
US20110137152A1 (en) * 2009-12-03 2011-06-09 General Electric Company System and method for cooling components of a surgical navigation system
US20110139408A1 (en) * 2009-12-10 2011-06-16 Tessera, Inc. Collector-radiator structure for an electrohydrodynamic cooling system
WO2011072036A3 (en) * 2009-12-10 2011-11-17 Tessera, Inc. Collector-radiator structure for electrohydrodynamic cooling system
CN102918350A (zh) * 2009-12-10 2013-02-06 德塞拉股份有限公司 电动流体冷却系统的集电极-散热器结构
US8624503B2 (en) 2009-12-10 2014-01-07 Panasonic Precision Devices Co., Ltd. Collector-radiator structure for an electrohydrodynamic cooling system
US20110206533A1 (en) * 2010-02-25 2011-08-25 United Technologies Corporation Repair of a coating on a turbine component
US20120048529A1 (en) * 2010-08-31 2012-03-01 International Business Machines Corporation Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
US20140230234A1 (en) * 2010-08-31 2014-08-21 International Business Machines Corporation Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
US8807204B2 (en) * 2010-08-31 2014-08-19 International Business Machines Corporation Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
US20130153199A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Performance and noise control for a heat sink air mover
US9408287B2 (en) 2012-11-27 2016-08-02 General Electric Company System and method for controlling plasma induced flow
US20150114608A1 (en) * 2013-10-30 2015-04-30 Forcecon Technology Co., Ltd. Electrostatic air-cooled heat sink
CN106020398A (zh) * 2016-06-17 2016-10-12 广东工业大学 一种cpu散热装置
CN109310461A (zh) * 2016-07-18 2019-02-05 智像控股有限责任公司 非热等离子体发射器和用于控制的设备
CN112805826A (zh) * 2018-10-05 2021-05-14 日产自动车株式会社 冷却装置
US20220141997A1 (en) * 2019-03-11 2022-05-05 Apr Technologies Ab Cooling of electronic components with an electrohydrodynamic flow unit
US11510336B2 (en) * 2019-09-10 2022-11-22 Lg Electronics Inc. Electronic device having heat dissipation function
US12069793B2 (en) 2020-04-09 2024-08-20 Chiscan Holdings Pte. Ltd. Treatment of infectious diseases using non-thermal plasma

Also Published As

Publication number Publication date
WO2008153988A1 (en) 2008-12-18
TW200951391A (en) 2009-12-16

Similar Documents

Publication Publication Date Title
US20080302514A1 (en) Plasma cooling heat sink
US8342234B2 (en) Plasma-driven cooling heat sink
US7839634B2 (en) Micro thrust cooling
US20090065177A1 (en) Cooling with microwave excited micro-plasma and ions
US20090321056A1 (en) Multi-stage electrohydrodynamic fluid accelerator apparatus
US7661468B2 (en) Electro-hydrodynamic gas flow cooling system
US8411435B2 (en) Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode
Wang et al. Electrically-induced ionic wind flow distribution and its application for LED cooling
WO2009131980A2 (en) Ionic fluid flow accelerator
EP0601516A1 (en) Cooling device
Chang et al. Narrow-flow-channel-driven EHD gas pump for an advanced thermal management of microelectronics
Sharbaugh et al. The design and evaluation of an ion-drag dielectric pump to enhance cooling in a small oil-filled transformer
US20100230087A1 (en) Cooling using micro-plasma excited on transmission lines structure
Massoudi et al. Free convection and thermal radiation of a nanofluid inside an inclined L‐shaped microelectronic module under the Lorentz forces' impact
Wang et al. Magnetic field enhanced ionic wind for environment-friendly improvement and thermal management application
US20100194278A1 (en) Flow manipulation with micro plasma
Azadi et al. Enhancement of heat transfer in heat sink under the effect of a magnetic field and an impingement jet
JP2008218853A (ja) 針−リング電極を使用したイオン風送風装置
Venkatesh et al. Ionic wind review-2020: advancement and application in thermal management
Kim et al. Comparison of turbulence models for a free-burning high-intensity argon arc
Schlitz et al. An electro-aerodynamic solid-state fan and cooling system
JP2014175476A (ja) 冷却装置
Kumar et al. Effects of external magnetic field arrangements on thermomagnetic convection in ferrofluid around heated Micro-wire
US7269007B2 (en) Magneto-hydrodynamic heat sink
Cai et al. Improving the Flow Distribution in Ionic Wind Blowers by Using Auxiliary Electrodes

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION