US20080079202A1 - Dryer Of Metal Molding System, Amongst Other Things - Google Patents
Dryer Of Metal Molding System, Amongst Other Things Download PDFInfo
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- US20080079202A1 US20080079202A1 US11/538,160 US53816006A US2008079202A1 US 20080079202 A1 US20080079202 A1 US 20080079202A1 US 53816006 A US53816006 A US 53816006A US 2008079202 A1 US2008079202 A1 US 2008079202A1
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- United States
- Prior art keywords
- metal
- metal chips
- chips
- molding system
- dryer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/007—Semi-solid pressure die casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/2015—Means for forcing the molten metal into the die
- B22D17/2061—Means for forcing the molten metal into the die using screws
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/30—Accessories for supplying molten metal, e.g. in rations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/003—Apparatus, e.g. furnaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
Definitions
- the present invention generally relates to, but is not limited to, molding systems, and more specifically the present invention relates to, but is not limited to: (i) a sub-system of a metal molding system, including (amongst other things) a conditioner, (ii) a metal molding system, including a conditioner, (iii) a metallic molded article manufactured by the use of a metal molding system having a conditioner, (iv) a method of a metal molding system, comprising conditioning, at least in part, metal chips, (v) a metallic molded article manufactured by the use of a method of a metal molding system, including conditioning, at least in part, metal chips, (vi) a molding material, including metal chips being conditioned, at least in part, (vii) a molten molding material, including a molten metallic melt being made from metal chips being conditioned, at least in part, and/or (viii) a metallic molded article, including a solidified molding material having been made from metal chips being conditioned, at least in part, amongs
- Examples of known molding systems are (amongst others): (i) the HyPETTMMolding System, (ii) the QuadlocTM Molding System, (iii) the HylectricTM Molding System, and (iv) the HyMetTM Molding System, all manufactured by Husky Injection Molding Systems Limited (Location: Bolton, Ontario, Canada; www.husky.ca).
- recovery time of an extruder of a metal molding system may vary depending on efficiency and/or effectiveness of heating apparatus coupled to the extruder, especially at a feed location of the extruder where metal chips enter the extruder.
- the recovery time (that is, time to build up a shot of a metallic molding material in the extruder) may be decreased by increasing the amount of heat applied to the extruder, and thereby throughput rate of the metal molding system may be increased but at the expense of using the heating apparatus and thus potentially shortening the life of the heating apparatus and/or the extruder.
- PCT Patent Number WO 97/21509 discloses an apparatus for processing material into a semisolid material thixotropic state and subsequently die casting the materials.
- the apparatus includes a shearing mechanism and a shot sleeve and also includes a barrel which is adapted to receive either solid or liquid material thereinto at one end.
- As the material that is, metal chips
- shearing and heating or cooling to bring the material to a temperature which permits the presence of both liquid and solid particles therein (that is, the metal chips are processed into a metal molding material).
- the shearing action promotes the formation of non-dendritic spherical particles and, accordingly, a semisolid thixotropic slurry is formed. From the shearing mechanism the slurry is metered into a shot sleeve and once a single shot or charge of the slurry is received therein, a ram is advanced to force the slurry into a casting die cavity where it solidifies in the form of the desired article. It appears that the metal chips are heated to form the metal molding material.
- U.S. Pat. No. 7,028,746 discloses an apparatus for molding a metal material.
- the apparatus includes a vessel with portions defining a passageway through the vessel.
- An inlet is located toward one end and a member or agitation means is located within the passageway.
- a plurality of heaters are located a length of the vessel. The first of the heaters is located immediately downstream of the inlet and is a low frequency induction coil heater whereby the temperature gradient through the vessel's sidewall is minimized. It appears that the metal chips are heated to form the metal molding material.
- a sub-system of a metal molding system including (amongst other things) a conditioner positionable relative to the metal molding system, the conditioner configured to condition, at least in part, metal chips before the metal molding system processes the metal chips.
- a metal molding system including (amongst other things) a conditioner positionable relative to the metal molding system, the conditioner configured to condition, at least in part, metal chips before the metal molding system processes the metal chips.
- a metallic molded article manufactured by the use of a metal molding system, including (amongst other things) a conditioner positionable relative to the metal molding system, the conditioner configured to condition, at least in part, metal chips before the metal molding system processes the metal chips.
- a method of a metal molding system including (amongst other things) conditioning, at least in part, metal chips before the metal molding system processes the metal chips.
- a metallic molded article manufactured by the use of a method of a metal molding system, including (amongst other things) conditioning, at least in part, metal chips before the metal molding system processes the metal chips.
- a molding material including (amongst other things) metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.
- a molten molding material including (amongst other things) a molten metallic melt being made from metal chips, the metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.
- a metallic molded article including (amongst other things) a solidified molding material having been made from metal chips, the metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.
- a technical effect, amongst other technical effects, of the aspects of the present invention is improved manufacturing of metallic molded articles.
- FIG. 1 is a schematic representation of a molding system according to a first exemplary embodiment
- FIG. 2 is a schematic representation of a molding system according to a second exemplary embodiment.
- FIG. 1 is a schematic representation of a metal molding system 1 (hereafter referred to as the “system ”) according to the first exemplary embodiment.
- the system 1 includes, amongst other things, a sub-system 100 .
- the sub-system 100 includes, amongst other things, a conditioner 107 that is positionable relative to the system 1 , and the conditioner 107 is configured to condition, at least in part, metal chips 2 before the system 1 processes the metal chips 2 .
- the sub-system 100 includes, amongst other things, a dryer 108 that is positionable relative to the system 1 , and the dryer 108 is configured to dry, at least in part, metal chips 2 such as chips of magnesium, aluminum and/or zinc, etc.
- the metal chips 2 are receivable by the system 1 .
- the sub-system 100 and the system 1 may be sold separately or together.
- a metallic molded article 90 is manufactured or molded by the system 1 .
- the metallic molded article 90 includes, amongst other things, a solidified molding material 91 having been made from metal chips 2 , the metal chips 2 being receivable by the system 1 , and the metal chips 2 were dried, at least in part, by the dryer 108 .
- a technical effect is that, since trapped gas porosity degrades quality of the article 90 , by removing moisture and driving wet gases away from the metal chips 2 , a reduction of and/or entrapment of such gases, at least in part, in the melt (that is, a metallic molding material manufactured by the system 1 ) when the system 1 processes the metal chips 2 . Removal of moisture and/or driving of wet gases away from the metal chips 2 may be accomplished, for example, by applying or directing relatively dry air toward the metal chips 2 or by heating the metal chips 2 .
- a technical effect of conditioning the metal chips 2 is reduction of water vapor and/or wet gases in the metal chips 2 so that the extruder of the system 1 is not subjected to premature corrosion from such gases.
- the conditioning of the metal chips 2 is, preferably, performed in-line (the conditioning is performed proximate of a feed throat of the extruder); alternatively, the conditioning may be performed off-line (that is, the metal chips 2 are conditioned at a location remote of the system 1 , and then the metal chips 2 are delivered to and feed into the system 1 ).
- a molding material 91 of the system 1 includes, amongst other things, the metal chips 2 receivable by the system 1 , and the metal chips 2 were dried, at least in part, by the dryer 108 positionable relative to the system 1 .
- a molten molding material 92 of the system 1 includes, amongst other things, a molten metallic melt 93 being made from metal chips 2 , and the metal chips 2 are receivable by the system 1 , and the metal chips 2 were dried, at least in part, by the dryer 108 .
- the dryer 108 includes, amongst other things, a blower 110 that is configured to blow air toward, at least in part, the metal chips 2 .
- the blower 110 includes a pipe 112 that is positionable, at least in part, at (or “in”) the metal chips 2 .
- the air dries, at least in part, the metal chips 2 (that is, the air removes moister contained in the metal chips 2 ).
- the pipe 112 has a perforation configured to pass the air toward, at least in part, to the metal chips 2 .
- the pipe 112 is configured to direct the air upwardly toward, at least in part, through the metal chips 2 .
- the blower 110 also includes an aerating bubbler 114 (also called a diffuser) that is attached to the pipe 112 .
- the blower 110 is configured to blow, at least in part, relatively dehumidified air (the air is dehumidified at least in part), toward the metal chips 2 .
- the dehumidified air By blowing the dehumidified air toward the metal chips 2 , the following technical effects may be obtained: (i) final part quality of the article 90 may be improved, and/or (ii) molding process of the system 1 may be improved (the molding process may be more repeatable and more independent of ambient humidity conditions as may be experienced in different countries or at different times of the day or year, etc).
- the blower 110 is configured to blow, at least in part, heated air (the air is heated at least in part), toward the metal chips 2 .
- heated air the air is heated at least in part
- the following technical effects may be obtained: (i) throughput rate of the system 1 may be increased or improved since the chips are preheated at least in part, (ii) duty cycle of extruder heaters (not depicted) that are coupled to the extruder 3 may be decreased thereby extending the life of the extruder 3 and of the extruder heaters, (iii) noise pollution may be reduced by providing preheated metal chips 2 that reduce friction between screw flights of a processing screw 4 and the extruder 3 , and/or (iv) increased throughput rate of the system 1 by allowing faster screw recovery (of the screw 4 ).
- Feeding preheated and/or dry metal chips 2 (to the extruder 3 ) increases repeatability of the screw 4 (and hence recovery rate as well) from shot to shot (that is, shot weight repeatability).
- preheating the metal chips 2 may prevent slugging by preventing freezing of the metallic molding material near a feed throat 7 of the extruder 3 .
- the feed throat 7 is sometimes called a throat connection. Slugging is the inadvertent (that is, unwanted) freezing of metallic molding material in the barrel of the extruder 3 .
- the metal chips 2 are receivable in a hopper 102 of the system 1 .
- the hopper 102 includes, amongst other things: (i) an inlet 104 that is configured to receive the metal chips 2 , and (ii) an outlet 106 that is configured to expel the metal chips 2 to the extruder 3 of the system 1 (that is, after the metal chips 2 have been dried at least in part).
- the hopper 102 is thermally insulated.
- the extruder 3 includes, amongst other things: (i) the screw 4 that is driven by a drive unit 5 , and (ii) a barrel 6 that receives the screw 4 in which the barrel 6 is coupled to the hopper 102 via the feed throat 7 .
- a material-delivery assembly 95 delivers the metal chips 2 , such as by venturi action or vacuum to the hopper 102 (that is, a chip-receiving compartment, etc).
- the heating, dehumidifying and gas expulsion is accomplished by air flowing from the dryer 108 through the pipe 112 (that is, a conduit) with a perforation (or more than one perforation) of the pipe 112 .
- the perforation of the pipe is positioned near a bottom of the hopper 102 , after which the air flows upwardly toward, at least in part, through the metal chips 2 .
- the dryer 108 may be mounted above the feed throat 7 of the extruder 3 so that loss of heat may be avoided to the surrounding environment before the metal chips 2 enter the extruder 3 .
- drying of the metal chips 2 is achieved by conduction heating and/or radiation heating, induction heating, etc.
- the dryer 108 improves the throughput rate of the system 1 , amongst other things, by providing dry (at least in part) metal chips 2 .
- Gas or vapor or gas-producing liquid water is driven away, at least in part (but preferably substantially) from the metal chips 2 by air flow.
- the treated metal chips 2 have an elevated temperature.
- the system 1 also includes, amongst other things, (i) a machine nozzle 8 , (ii) a stationary platen 9 and (iii) a movable platen 10 .
- a mold 12 includes: (i) a stationary mold portion 13 (that is mounted to the stationary platen 9 ), and (ii) a movable mold portion 14 (that is mounted to the movable platen 10 ).
- the system 1 further includes, amongst other things, tangible subsystems, components, sub-assemblies, etc, that are known to persons skilled in the art. These items are not depicted and not described in detail since they are known.
- These other things may include (for example): (i) tie bars (not depicted) that operatively couple the platens 9 , 10 together, and/or (ii) a clamping mechanism (not depicted) coupled to the tie bars and used to generate a clamping force that is transmitted to the platens 9 , 10 via the tie bars (so that the mold 12 may be forced to remain together while a molding material is being injected in to the mold 12 ).
- a mold break force actuator (not depicted) coupled to the tie bars and used to generate a mold break force that is transmitted to the platens 9 , 10 via the tie bars (so as to break apart the mold 12 once the molded article 90 has been molded in the mold 12 ), and/or (iv) a platen stroking actuator (not depicted) coupled to the movable platen 10 and is used to move the movable platen 10 away from the stationary platen 9 so that the molded article 90 may be removed from the mold 12 , and (vi) hydraulic and/or electrical control equipment, etc.
- a controller may be coupled to the dryer 108 , and the controller is used to automatically adjust the dryer 108 under an open loop and/or closed loop feedback control scheme, etc.
- the conditioner 107 includes the dryer 108 and the hopper 102 includes a mixer 111 configured to mix the metal chips 2 received in the hopper 102 .
- the metal chips 2 include, for example, chips of a magnesium alloy and/or chips of a zinc alloy and/or chips of an aluminum alloy, and/or other alloys, and/or impurities, and/or reinforcements (such as ceramic particles), etc.
- FIG. 2 is the schematic representation of the system 1 of FIG. 1 according to the second exemplary embodiment.
- the sub-system 100 includes, amongst other things, a conditioner 107 that is positionable relative to the system 1 , and the conditioner 107 is configured to condition, at least in part, metal chips 2 before the system 1 processes the metal chips 2 .
- the conditioner 107 includes a heater 109 that is positionable relative to the system 1 , and the heater 109 is configured to heat, at least in part, the metal chips 2 .
- the heater 109 is, preferably, operatively couplable to the hopper 102 .
- the hopper 102 includes a mixer 111 that is configured to mix the metal chips 2 received in or by the hopper 102 .
- the conditioner 107 includes: (i) the heater 109 , and (ii) the dryer 108 .
- the hopper 102 is operatively couplable to an auxiliary hopper 103 , such as for introducing another metallic alloy (or reinforcement, or colorant, etc, generally known as additive) to the metal chips 2 . This arrangement permits improved homogeneous mixing, which cannot be achieved by using a die-casting approach.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Powder Metallurgy (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
- The present invention generally relates to, but is not limited to, molding systems, and more specifically the present invention relates to, but is not limited to: (i) a sub-system of a metal molding system, including (amongst other things) a conditioner, (ii) a metal molding system, including a conditioner, (iii) a metallic molded article manufactured by the use of a metal molding system having a conditioner, (iv) a method of a metal molding system, comprising conditioning, at least in part, metal chips, (v) a metallic molded article manufactured by the use of a method of a metal molding system, including conditioning, at least in part, metal chips, (vi) a molding material, including metal chips being conditioned, at least in part, (vii) a molten molding material, including a molten metallic melt being made from metal chips being conditioned, at least in part, and/or (viii) a metallic molded article, including a solidified molding material having been made from metal chips being conditioned, at least in part, amongst other things.
- Examples of known molding systems are (amongst others): (i) the HyPET™Molding System, (ii) the Quadloc™ Molding System, (iii) the Hylectric™ Molding System, and (iv) the HyMet™ Molding System, all manufactured by Husky Injection Molding Systems Limited (Location: Bolton, Ontario, Canada; www.husky.ca).
- When molding metallic alloys, recovery time of an extruder of a metal molding system may vary depending on efficiency and/or effectiveness of heating apparatus coupled to the extruder, especially at a feed location of the extruder where metal chips enter the extruder. The recovery time (that is, time to build up a shot of a metallic molding material in the extruder) may be decreased by increasing the amount of heat applied to the extruder, and thereby throughput rate of the metal molding system may be increased but at the expense of using the heating apparatus and thus potentially shortening the life of the heating apparatus and/or the extruder.
- PCT Patent Number WO 97/21509 (Inventor: Carnahan; Published: 1997-06-19) discloses an apparatus for processing material into a semisolid material thixotropic state and subsequently die casting the materials. The apparatus includes a shearing mechanism and a shot sleeve and also includes a barrel which is adapted to receive either solid or liquid material thereinto at one end. As the material (that is, metal chips) is passed through the barrel it is subjected to shearing and heating or cooling to bring the material to a temperature which permits the presence of both liquid and solid particles therein (that is, the metal chips are processed into a metal molding material). The shearing action promotes the formation of non-dendritic spherical particles and, accordingly, a semisolid thixotropic slurry is formed. From the shearing mechanism the slurry is metered into a shot sleeve and once a single shot or charge of the slurry is received therein, a ram is advanced to force the slurry into a casting die cavity where it solidifies in the form of the desired article. It appears that the metal chips are heated to form the metal molding material.
- U.S. Pat. No. 7,028,746 (Inventor: Akers et al. Published: 2006-04-18) discloses an apparatus for molding a metal material. The apparatus includes a vessel with portions defining a passageway through the vessel. An inlet is located toward one end and a member or agitation means is located within the passageway. A plurality of heaters are located a length of the vessel. The first of the heaters is located immediately downstream of the inlet and is a low frequency induction coil heater whereby the temperature gradient through the vessel's sidewall is minimized. It appears that the metal chips are heated to form the metal molding material.
- According to a first aspect of the present invention, there is provided a sub-system of a metal molding system, including (amongst other things) a conditioner positionable relative to the metal molding system, the conditioner configured to condition, at least in part, metal chips before the metal molding system processes the metal chips.
- According to a second aspect of the present invention, there is provided a metal molding system, including (amongst other things) a conditioner positionable relative to the metal molding system, the conditioner configured to condition, at least in part, metal chips before the metal molding system processes the metal chips.
- According to a third aspect of the present invention, there is provided a metallic molded article manufactured by the use of a metal molding system, including (amongst other things) a conditioner positionable relative to the metal molding system, the conditioner configured to condition, at least in part, metal chips before the metal molding system processes the metal chips.
- According to a fourth aspect of the present invention, there is provided a method of a metal molding system, including (amongst other things) conditioning, at least in part, metal chips before the metal molding system processes the metal chips.
- According to a fifth aspect of the present invention, there is provided a metallic molded article manufactured by the use of a method of a metal molding system, including (amongst other things) conditioning, at least in part, metal chips before the metal molding system processes the metal chips.
- According to a sixth aspect of the present invention, there is provided a molding material, including (amongst other things) metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.
- According to a seventh aspect of the present invention, there is provided a molten molding material, including (amongst other things) a molten metallic melt being made from metal chips, the metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.
- According to an eight aspect of the present invention, there is provided a metallic molded article, including (amongst other things) a solidified molding material having been made from metal chips, the metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.
- A technical effect, amongst other technical effects, of the aspects of the present invention is improved manufacturing of metallic molded articles.
- A better understanding of the exemplary embodiments of the present invention (including alternatives and/or variations thereof) may be obtained with reference to the detailed description of the exemplary embodiments of the present invention along with the following drawings, in which:
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FIG. 1 is a schematic representation of a molding system according to a first exemplary embodiment; and -
FIG. 2 is a schematic representation of a molding system according to a second exemplary embodiment. - The drawings are not necessarily to scale and are sometimes illustrated by phantom lines, diagrammatic representations and fragmentary views. In certain instances, details that are not necessary for an understanding of the embodiments or that render other details difficult to perceive may have been omitted.
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FIG. 1 is a schematic representation of a metal molding system 1 (hereafter referred to as the “system ”) according to the first exemplary embodiment. Thesystem 1 includes, amongst other things, asub-system 100. Generally, thesub-system 100 includes, amongst other things, aconditioner 107 that is positionable relative to thesystem 1, and theconditioner 107 is configured to condition, at least in part,metal chips 2 before thesystem 1 processes themetal chips 2. - Preferably, the
sub-system 100 includes, amongst other things, adryer 108 that is positionable relative to thesystem 1, and thedryer 108 is configured to dry, at least in part,metal chips 2 such as chips of magnesium, aluminum and/or zinc, etc. Themetal chips 2 are receivable by thesystem 1. Thesub-system 100 and thesystem 1 may be sold separately or together. A metallic moldedarticle 90 is manufactured or molded by thesystem 1. The metallic moldedarticle 90, includes, amongst other things, asolidified molding material 91 having been made frommetal chips 2, themetal chips 2 being receivable by thesystem 1, and themetal chips 2 were dried, at least in part, by thedryer 108. - A technical effect, amongst other technical effects, is that, since trapped gas porosity degrades quality of the
article 90, by removing moisture and driving wet gases away from themetal chips 2, a reduction of and/or entrapment of such gases, at least in part, in the melt (that is, a metallic molding material manufactured by the system 1) when thesystem 1 processes themetal chips 2. Removal of moisture and/or driving of wet gases away from themetal chips 2 may be accomplished, for example, by applying or directing relatively dry air toward themetal chips 2 or by heating themetal chips 2. A technical effect of conditioning themetal chips 2 is reduction of water vapor and/or wet gases in themetal chips 2 so that the extruder of thesystem 1 is not subjected to premature corrosion from such gases. The conditioning of themetal chips 2 is, preferably, performed in-line (the conditioning is performed proximate of a feed throat of the extruder); alternatively, the conditioning may be performed off-line (that is, themetal chips 2 are conditioned at a location remote of thesystem 1, and then themetal chips 2 are delivered to and feed into the system 1). - A
molding material 91 of thesystem 1, includes, amongst other things, themetal chips 2 receivable by thesystem 1, and themetal chips 2 were dried, at least in part, by thedryer 108 positionable relative to thesystem 1. Amolten molding material 92 of thesystem 1, includes, amongst other things, a moltenmetallic melt 93 being made frommetal chips 2, and themetal chips 2 are receivable by thesystem 1, and themetal chips 2 were dried, at least in part, by thedryer 108. - Preferably, the
dryer 108 includes, amongst other things, ablower 110 that is configured to blow air toward, at least in part, themetal chips 2. Theblower 110 includes apipe 112 that is positionable, at least in part, at (or “in”) themetal chips 2. The air dries, at least in part, the metal chips 2 (that is, the air removes moister contained in the metal chips 2). Thepipe 112 has a perforation configured to pass the air toward, at least in part, to themetal chips 2. Thepipe 112 is configured to direct the air upwardly toward, at least in part, through themetal chips 2. Theblower 110 also includes an aerating bubbler 114 (also called a diffuser) that is attached to thepipe 112. - According to a variant, the
blower 110 is configured to blow, at least in part, relatively dehumidified air (the air is dehumidified at least in part), toward themetal chips 2. By blowing the dehumidified air toward themetal chips 2, the following technical effects may be obtained: (i) final part quality of thearticle 90 may be improved, and/or (ii) molding process of thesystem 1 may be improved (the molding process may be more repeatable and more independent of ambient humidity conditions as may be experienced in different countries or at different times of the day or year, etc). - According to another variant, the
blower 110 is configured to blow, at least in part, heated air (the air is heated at least in part), toward themetal chips 2. By blowing heated air toward the metal chips 2 (that is, before themetal chips 2 enter the extruder 3), the following technical effects may be obtained: (i) throughput rate of thesystem 1 may be increased or improved since the chips are preheated at least in part, (ii) duty cycle of extruder heaters (not depicted) that are coupled to theextruder 3 may be decreased thereby extending the life of theextruder 3 and of the extruder heaters, (iii) noise pollution may be reduced by providingpreheated metal chips 2 that reduce friction between screw flights of aprocessing screw 4 and theextruder 3, and/or (iv) increased throughput rate of thesystem 1 by allowing faster screw recovery (of the screw 4). Feeding preheated and/or dry metal chips 2 (to the extruder 3) increases repeatability of the screw 4 (and hence recovery rate as well) from shot to shot (that is, shot weight repeatability). Moreover, when the (metallic) molding material is required to be maintained at a high temperature and melted relatively quickly (that is, quicker than the extruder heaters may provide), preheating themetal chips 2 may prevent slugging by preventing freezing of the metallic molding material near afeed throat 7 of theextruder 3. Thefeed throat 7 is sometimes called a throat connection. Slugging is the inadvertent (that is, unwanted) freezing of metallic molding material in the barrel of theextruder 3. - Preferably, the
metal chips 2 are receivable in ahopper 102 of thesystem 1. Thehopper 102 includes, amongst other things: (i) aninlet 104 that is configured to receive themetal chips 2, and (ii) anoutlet 106 that is configured to expel themetal chips 2 to theextruder 3 of the system 1 (that is, after themetal chips 2 have been dried at least in part). Preferably, thehopper 102 is thermally insulated. Theextruder 3 includes, amongst other things: (i) thescrew 4 that is driven by adrive unit 5, and (ii) abarrel 6 that receives thescrew 4 in which thebarrel 6 is coupled to thehopper 102 via thefeed throat 7. A material-delivery assembly 95 delivers themetal chips 2, such as by venturi action or vacuum to the hopper 102 (that is, a chip-receiving compartment, etc). - The heating, dehumidifying and gas expulsion is accomplished by air flowing from the
dryer 108 through the pipe 112 (that is, a conduit) with a perforation (or more than one perforation) of thepipe 112. Preferably, the perforation of the pipe is positioned near a bottom of thehopper 102, after which the air flows upwardly toward, at least in part, through themetal chips 2. Thedryer 108 may be mounted above thefeed throat 7 of theextruder 3 so that loss of heat may be avoided to the surrounding environment before themetal chips 2 enter theextruder 3. According to other variants, drying of themetal chips 2 is achieved by conduction heating and/or radiation heating, induction heating, etc. Thedryer 108 improves the throughput rate of thesystem 1, amongst other things, by providing dry (at least in part)metal chips 2. Gas or vapor or gas-producing liquid water is driven away, at least in part (but preferably substantially) from themetal chips 2 by air flow. Preferably, the treatedmetal chips 2 have an elevated temperature. - The
system 1 also includes, amongst other things, (i) amachine nozzle 8, (ii) astationary platen 9 and (iii) amovable platen 10. Amold 12 includes: (i) a stationary mold portion 13 (that is mounted to the stationary platen 9), and (ii) a movable mold portion 14 (that is mounted to the movable platen 10). Thesystem 1 further includes, amongst other things, tangible subsystems, components, sub-assemblies, etc, that are known to persons skilled in the art. These items are not depicted and not described in detail since they are known. These other things may include (for example): (i) tie bars (not depicted) that operatively couple theplatens platens mold 12 may be forced to remain together while a molding material is being injected in to the mold 12). These other things may include: (iii) a mold break force actuator (not depicted) coupled to the tie bars and used to generate a mold break force that is transmitted to theplatens mold 12 once the moldedarticle 90 has been molded in the mold 12), and/or (iv) a platen stroking actuator (not depicted) coupled to themovable platen 10 and is used to move themovable platen 10 away from thestationary platen 9 so that the moldedarticle 90 may be removed from themold 12, and (vi) hydraulic and/or electrical control equipment, etc. - A controller (not depicted) may be coupled to the
dryer 108, and the controller is used to automatically adjust thedryer 108 under an open loop and/or closed loop feedback control scheme, etc. - According to a variant, the
conditioner 107 includes thedryer 108 and thehopper 102 includes amixer 111 configured to mix themetal chips 2 received in thehopper 102. - The
metal chips 2 include, for example, chips of a magnesium alloy and/or chips of a zinc alloy and/or chips of an aluminum alloy, and/or other alloys, and/or impurities, and/or reinforcements (such as ceramic particles), etc. -
FIG. 2 is the schematic representation of thesystem 1 ofFIG. 1 according to the second exemplary embodiment. Generally, thesub-system 100 includes, amongst other things, aconditioner 107 that is positionable relative to thesystem 1, and theconditioner 107 is configured to condition, at least in part,metal chips 2 before thesystem 1 processes themetal chips 2. According to the second exemplary embodiment, and more preferably, theconditioner 107 includes aheater 109 that is positionable relative to thesystem 1, and theheater 109 is configured to heat, at least in part, themetal chips 2. Theheater 109 is, preferably, operatively couplable to thehopper 102. According to a variant, thehopper 102 includes amixer 111 that is configured to mix themetal chips 2 received in or by thehopper 102. According to another variant, theconditioner 107 includes: (i) theheater 109, and (ii) thedryer 108. According to another variant, thehopper 102 is operatively couplable to anauxiliary hopper 103, such as for introducing another metallic alloy (or reinforcement, or colorant, etc, generally known as additive) to themetal chips 2. This arrangement permits improved homogeneous mixing, which cannot be achieved by using a die-casting approach. - The description of the exemplary embodiments provides examples of the present invention, and these examples do not limit the scope of the present invention. It is understood that the scope of the present invention is limited by the claims. The exemplary embodiments described above may be adapted for specific conditions and/or functions, and may be further extended to a variety of other applications that are within the scope of the present invention. Having thus described the exemplary embodiments, it will be apparent that modifications and enhancements are possible without departing from the concepts as described. It is to be understood that the exemplary embodiments illustrate the aspects of the invention. Reference herein to details of the illustrated embodiments is not intended to limit the scope of the claims. The claims themselves recite those features regarded as essential to the present invention. Preferable embodiments of the present invention are subject of the dependent claims. Therefore, what is to be protected by way of letters patent are limited only by the scope of the following claims:
Claims (41)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/538,160 US20080079202A1 (en) | 2006-10-03 | 2006-10-03 | Dryer Of Metal Molding System, Amongst Other Things |
CA002662370A CA2662370A1 (en) | 2006-10-03 | 2007-09-13 | Dryer of metal molding system, amongst other things |
PCT/CA2007/001603 WO2008040115A1 (en) | 2006-10-03 | 2007-09-13 | Apparatus and method for drying metal chips before processing in molding system |
EP07815807A EP2076343A4 (en) | 2006-10-03 | 2007-09-13 | Apparatus and method for drying metal chips before processing in molding system |
TW096136482A TW200824816A (en) | 2006-10-03 | 2007-09-28 | Dryer of metal molding system, amongst other things |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/538,160 US20080079202A1 (en) | 2006-10-03 | 2006-10-03 | Dryer Of Metal Molding System, Amongst Other Things |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080079202A1 true US20080079202A1 (en) | 2008-04-03 |
Family
ID=39260360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/538,160 Abandoned US20080079202A1 (en) | 2006-10-03 | 2006-10-03 | Dryer Of Metal Molding System, Amongst Other Things |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080079202A1 (en) |
EP (1) | EP2076343A4 (en) |
CA (1) | CA2662370A1 (en) |
TW (1) | TW200824816A (en) |
WO (1) | WO2008040115A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023079027A1 (en) * | 2021-11-03 | 2023-05-11 | Lighter Geometries Gmbh | Mixing conveyor for an injection moulding system, injection moulding system, method for producing a moulded article, and moulded article |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112059187A (en) * | 2020-09-02 | 2020-12-11 | 莱芜职业技术学院 | Automatic injection molding device of stainless steel powder |
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US3597850A (en) * | 1970-03-11 | 1971-08-10 | Nat Service Ind Inc | Continuous vacuum drier |
US4876043A (en) * | 1988-08-23 | 1989-10-24 | Hall Sr Richard A | Hopper transport for injection molding |
US20030154624A1 (en) * | 2002-02-19 | 2003-08-21 | Sears Charles F. | Drying hopper |
US6669900B2 (en) * | 2000-12-07 | 2003-12-30 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing magnesium alloy molded product, painted structure thereof, method of painting the same, and casings using the same |
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JPS5536024A (en) * | 1978-09-04 | 1980-03-13 | Yuasa Battery Co Ltd | Casting method of low melting metal part |
US5040589A (en) * | 1989-02-10 | 1991-08-20 | The Dow Chemical Company | Method and apparatus for the injection molding of metal alloys |
JP3013226B2 (en) * | 1994-04-28 | 2000-02-28 | 株式会社日本製鋼所 | Manufacturing method of metal molded products |
AU1287597A (en) * | 1995-12-12 | 1997-07-03 | Thixomat, Inc. | Apparatus for processing semisolid thixotropic metallic slurries |
JPH11104801A (en) * | 1997-09-29 | 1999-04-20 | Mazda Motor Corp | Semi-molten injection molding method of light metal alloy and semi-molten injection molding apparatus |
US5983978A (en) * | 1997-09-30 | 1999-11-16 | Thixomat, Inc. | Thermal shock resistant apparatus for molding thixotropic materials |
JP2000334773A (en) * | 1999-05-27 | 2000-12-05 | Sato Kasei Kogyosho:Kk | Method for injection molding polyethylene terephthalate |
JP2000334774A (en) * | 1999-05-27 | 2000-12-05 | Sato Kasei Kogyosho:Kk | Method for injection molding polyethylene terephthalate and its injection molding system apparatus |
JP3477414B2 (en) * | 2000-01-18 | 2003-12-10 | 株式会社日本製鋼所 | Injection molding method and apparatus |
US20020170696A1 (en) * | 2001-05-18 | 2002-11-21 | Ron Akers | Apparatus for molding metals |
KR100535915B1 (en) * | 2004-03-19 | 2005-12-12 | 신상오 | Dryer for plastic raw material for hopper injection machine |
JP2006168083A (en) * | 2004-12-15 | 2006-06-29 | Dai Ichi Kasei Kk | Molding system and hopper for supplying molding material |
-
2006
- 2006-10-03 US US11/538,160 patent/US20080079202A1/en not_active Abandoned
-
2007
- 2007-09-13 WO PCT/CA2007/001603 patent/WO2008040115A1/en active Application Filing
- 2007-09-13 CA CA002662370A patent/CA2662370A1/en not_active Abandoned
- 2007-09-13 EP EP07815807A patent/EP2076343A4/en not_active Withdrawn
- 2007-09-28 TW TW096136482A patent/TW200824816A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US3597850A (en) * | 1970-03-11 | 1971-08-10 | Nat Service Ind Inc | Continuous vacuum drier |
US4876043A (en) * | 1988-08-23 | 1989-10-24 | Hall Sr Richard A | Hopper transport for injection molding |
US6669900B2 (en) * | 2000-12-07 | 2003-12-30 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing magnesium alloy molded product, painted structure thereof, method of painting the same, and casings using the same |
US20030154624A1 (en) * | 2002-02-19 | 2003-08-21 | Sears Charles F. | Drying hopper |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023079027A1 (en) * | 2021-11-03 | 2023-05-11 | Lighter Geometries Gmbh | Mixing conveyor for an injection moulding system, injection moulding system, method for producing a moulded article, and moulded article |
WO2023078544A1 (en) * | 2021-11-03 | 2023-05-11 | Lighter Geometries Gmbh | Mixing conveyor for an injection molding system, injection molding system, method for producing a molded object, and molded object |
Also Published As
Publication number | Publication date |
---|---|
CA2662370A1 (en) | 2008-04-10 |
EP2076343A1 (en) | 2009-07-08 |
EP2076343A4 (en) | 2009-12-23 |
TW200824816A (en) | 2008-06-16 |
WO2008040115A1 (en) | 2008-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HUSKY INJECTTION MOLDING SYSTEMS LTD., ONTARIO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DOMODOSSOLA, ROBERT, MR.;REEL/FRAME:018339/0384 Effective date: 20061003 |
|
AS | Assignment |
Owner name: ROYAL BANK OF CANADA, CANADA Free format text: SECURITY AGREEMENT;ASSIGNOR:HUSKY INJECTION MOLDING SYSTEMS LTD.;REEL/FRAME:020431/0495 Effective date: 20071213 Owner name: ROYAL BANK OF CANADA,CANADA Free format text: SECURITY AGREEMENT;ASSIGNOR:HUSKY INJECTION MOLDING SYSTEMS LTD.;REEL/FRAME:020431/0495 Effective date: 20071213 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
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AS | Assignment |
Owner name: HUSKY INJECTION MOLDING SYSTEMS LTD., CANADA Free format text: RELEASE OF SECURITY AGREEMENT;ASSIGNOR:ROYAL BANK OF CANADA;REEL/FRAME:026647/0595 Effective date: 20110630 |