US20080061404A1 - Electronic circuit package and fabricating method thereof - Google Patents

Electronic circuit package and fabricating method thereof Download PDF

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Publication number
US20080061404A1
US20080061404A1 US11/895,430 US89543007A US2008061404A1 US 20080061404 A1 US20080061404 A1 US 20080061404A1 US 89543007 A US89543007 A US 89543007A US 2008061404 A1 US2008061404 A1 US 2008061404A1
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US
United States
Prior art keywords
molding
radio frequency
circuit board
printed circuit
bumper pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/895,430
Inventor
Shi-yun Cho
Young-Min Lee
Youn-Ho Choi
Ho-Seong Seo
Sang-Hyun Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, SHI-YUN, CHOI, YOUN-HO, KIM, SANG-HYUN, LEE, YOUNG-MIN, SEO, HO-SEONG
Publication of US20080061404A1 publication Critical patent/US20080061404A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to a package in which a plurality of electric devices is integrated, and more particularly, to an electronic circuit package including electromagnetic wave shielding means.
  • a conventional electronic circuit package includes one or more radio frequency integrated circuits and peripheral circuits thereof.
  • a structure in which a module is entirely mounted in a metal can has been proposed to electrically and magnetically shield an electronic circuit package or SIP, which are provided with element having electrically or magnetically sensitive characteristic.
  • FIG. 1 is a schematic sectional view showing the conventional electronic circuit package, and its configuration.
  • the conventional electronic circuit package 100 includes a printed circuit board 120 having a multilayered integration structure; a bump chip 101 arranged on the printed circuit board 120 ; a plurality of electric elements 102 , 103 , and 104 ; a radio frequency integrated circuit 105 arranged on a lower portion of the printed circuit board 120 ; and a metal can 110 that covers the printed circuit board 120 , while enclosing the bump chip 101 and the plurality of electric elements 102 , 103 , and 104 .
  • the conventional electronic circuit package 100 has several problems.
  • the structure of the electromagnetic wave shield applied between circuits is complex.
  • the present invention has been made to solve the above-mentioned problems occurring in the prior art and provides additional advantages, by providing an electronic circuit package having a plurality of integrated circuits is integrated thereon and capable of shielding electromagnetic waves between the integrated circuits.
  • a method for fabricating an electronic circuit package comprising integrating at least one radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad made of metal material on the printed circuit board so as to enclose a circumference of the radio frequency circuit device; forming a molding on the printed circuit board including the radio frequency circuit device and the semiconductor die; and forming grooves on a portion of the molding and inserting a can with an open lower portion into the grooves.
  • an electronic circuit package comprising: a printed circuit board; at least one radio frequency circuit device and semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board so as to include the radio frequency circuit device and the semiconductor die; grooves formed in the molding to enclose the circumference of the radio frequency circuit device; and a can inserted into the grooves.
  • FIG. 1 is a view showing the conventional electronic circuit package
  • FIGS. 2 to 5 are sectional views showing an electronic circuit package according to the present invention, in which the structure of the electronic circuit package is shown according to fabrication steps.
  • FIGS. 2 to 5 are sectional views showing an electronic circuit package according to one aspect of the present invention, in which the structure of the electronic circuit package is shown according to fabricating steps.
  • the electronic circuit package 200 according to one aspect of the present invention includes a printed circuit board 210 ; at least one radio frequency circuit device 201 and semiconductor die 202 integrated on the printed circuit board 210 ; a molding 220 formed on the printed circuit board 210 so as to include the frequency circuit device 201 and the semiconductor die 202 therein; grooves 220 a and 220 b formed in the molding to enclose the radio frequency circuit device 201 and a can 230 inserted in the grooves 220 a and 220 b .
  • the electronic circuit package 200 can be fabricated by the following method.
  • the method for fabricating the electronic circuit package 200 includes a first step of integrating at least one radio frequency circuit device 201 and a semiconductor die 202 on a printed circuit board 210 ; a second step of forming a bumper pad 203 of metal material on the printed circuit board 210 so that the bumper pad 203 encloses the radio frequency circuit device 201 ; a third step of forming a molding 220 on the printed circuit board 210 so that the molding 220 includes the radio frequency circuit device 201 and the semiconductor die 202 therein; and a fourth step of forming grooves 220 a and 220 b on a portion of the molding 220 and inserting a can 230 having an opened lower portion into the grooves 220 a and 220 b.
  • the integration of the radio frequency circuit device 201 and the semiconductor die 202 is accomplished by various integration methods including wire bonding and solder bumping.
  • the semiconductor die 202 is partitioned into several segments by dicing after a semiconductor pattern is formed on a silicon wafer.
  • the second step is a process for forming the bumper pad 203 .
  • the bumper pad 203 comes into contact with the can 230 , to secure the can 230 and to provide an electric ground.
  • the bumper pad 203 may have a structure in which a ground pattern of a metal material is formed on the printed circuit board 210 , such that a reflow process may be performed, and then a metal, such as lead, having a relatively low melting temperature is grown on the ground pattern.
  • the bumper pad 203 may be formed around a device which the electronic shield means, such as the can 230 , is intended to enclose.
  • the electromagnetic wave shielding means is to enclose the radio frequency integrated circuit 201 , which is illustrated as an example of the device.
  • FIG. 2-5 illustrate the bumper pad 203 being formed around the radio frequency integrated circuit 201 .
  • the bumper pad 203 may be formed around the semiconductor die 202 .
  • the third step is a process of forming a molding 220 that covers the upper portion 210 of the printed circuit board such that the radio frequency circuit device 201 , the semiconductor die 202 , and the bumper pad 203 are included within the molding 220 .
  • the molding 220 is accomplished by coating and curing a material capable of shielding electromagnetic wave.
  • the fourth step is a process of forming the grooves 220 a and 220 b on a portion of the molding 220 and inserting the can 230 into the grooves 220 a and 220 b .
  • the grooves 220 a and 220 b are formed such that the bumper pad 203 is exposed.
  • the can 230 may be secured to the bumper pad 203 using a reflowing method.
  • the can 230 is made of metal or any electrically conductive material, and the can 230 is electrically connected to the bumper pad 203 .
  • an electronic circuit package requiring electromagnetic shield it is possible to provide an electronic circuit package having a structure capable of individually shielding electromagnetic waves of the radio frequency circuit devices.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An electronic circuit package and fabricating method thereof. The method includes: integrating a radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad of metal on the printed circuit board around the radio frequency circuit device; forming a molding on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; and forming one or more grooves on a portion of the molding and inserting a can into the grooves. The electronic circuit package includes: a printed circuit board; a radio frequency circuit device and a semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; one or more grooves formed in the molding to enclose the radio frequency circuit device; and a can inserted into the grooves.

Description

    CLAIM OF PRIORITY
  • This application claims priority an application entitled “Electronic Circuit Package and Fabricating Method Thereof,” filed in the Korean Intellectual Property Office on Sep. 12, 2006 and assigned Serial No. 2006-88070, the contents of which are hereby incorporated by reference.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a package in which a plurality of electric devices is integrated, and more particularly, to an electronic circuit package including electromagnetic wave shielding means.
  • 2. Description of the Related Art
  • A conventional electronic circuit package includes one or more radio frequency integrated circuits and peripheral circuits thereof. A structure in which a module is entirely mounted in a metal can has been proposed to electrically and magnetically shield an electronic circuit package or SIP, which are provided with element having electrically or magnetically sensitive characteristic.
  • FIG. 1 is a schematic sectional view showing the conventional electronic circuit package, and its configuration. Referring to FIG. 1, the conventional electronic circuit package 100 includes a printed circuit board 120 having a multilayered integration structure; a bump chip 101 arranged on the printed circuit board 120; a plurality of electric elements 102, 103, and 104; a radio frequency integrated circuit 105 arranged on a lower portion of the printed circuit board 120; and a metal can 110 that covers the printed circuit board 120, while enclosing the bump chip 101 and the plurality of electric elements 102, 103, and 104.
  • Where a plurality of integrated circuits is mounted on a single package and where high-performance and multifunctional micro electronic devices are required, the conventional electronic circuit package 100 has several problems. In conventional electronic circuit package 100, the structure of the electromagnetic wave shield applied between circuits is complex. In addition, in the conventional electronic circuit package, it is impossible to shield only a specific element using a metal can.
    • SUMMARY OF THE INVENTION
  • Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art and provides additional advantages, by providing an electronic circuit package having a plurality of integrated circuits is integrated thereon and capable of shielding electromagnetic waves between the integrated circuits.
  • According to an aspect of the present invention, there is provided a method for fabricating an electronic circuit package comprising integrating at least one radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad made of metal material on the printed circuit board so as to enclose a circumference of the radio frequency circuit device; forming a molding on the printed circuit board including the radio frequency circuit device and the semiconductor die; and forming grooves on a portion of the molding and inserting a can with an open lower portion into the grooves.
  • According to another aspect of the present invention, there is provided an electronic circuit package comprising: a printed circuit board; at least one radio frequency circuit device and semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board so as to include the radio frequency circuit device and the semiconductor die; grooves formed in the molding to enclose the circumference of the radio frequency circuit device; and a can inserted into the grooves.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The above features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
  • FIG. 1 is a view showing the conventional electronic circuit package; and
  • FIGS. 2 to 5 are sectional views showing an electronic circuit package according to the present invention, in which the structure of the electronic circuit package is shown according to fabrication steps.
    •  DETAILED DESCRIPTION OF THE PRESENT INVENTION
  • Hereinafter, the exemplary aspects of the present invention will be described in detail with reference to the accompanying drawings. For purposes of clarity and simplicity, a detailed description of known functions and configurations incorporated herein is omitted to avoid making the subject matter of the present invention unclear.
  • FIGS. 2 to 5 are sectional views showing an electronic circuit package according to one aspect of the present invention, in which the structure of the electronic circuit package is shown according to fabricating steps. Referring to FIGS. 2 to 5, the electronic circuit package 200 according to one aspect of the present invention includes a printed circuit board 210; at least one radio frequency circuit device 201 and semiconductor die 202 integrated on the printed circuit board 210; a molding 220 formed on the printed circuit board 210 so as to include the frequency circuit device 201 and the semiconductor die 202 therein; grooves 220 a and 220 b formed in the molding to enclose the radio frequency circuit device 201 and a can 230 inserted in the grooves 220 a and 220 b. The electronic circuit package 200 can be fabricated by the following method.
  • The method for fabricating the electronic circuit package 200 according to the present invention includes a first step of integrating at least one radio frequency circuit device 201 and a semiconductor die 202 on a printed circuit board 210; a second step of forming a bumper pad 203 of metal material on the printed circuit board 210 so that the bumper pad 203 encloses the radio frequency circuit device 201; a third step of forming a molding 220 on the printed circuit board 210 so that the molding 220 includes the radio frequency circuit device 201 and the semiconductor die 202 therein; and a fourth step of forming grooves 220 a and 220 b on a portion of the molding 220 and inserting a can 230 having an opened lower portion into the grooves 220 a and 220 b.
  • In the first step, the integration of the radio frequency circuit device 201 and the semiconductor die 202 is accomplished by various integration methods including wire bonding and solder bumping.
  • The semiconductor die 202 is partitioned into several segments by dicing after a semiconductor pattern is formed on a silicon wafer.
  • The second step is a process for forming the bumper pad 203. The bumper pad 203 comes into contact with the can 230, to secure the can 230 and to provide an electric ground. The bumper pad 203 may have a structure in which a ground pattern of a metal material is formed on the printed circuit board 210, such that a reflow process may be performed, and then a metal, such as lead, having a relatively low melting temperature is grown on the ground pattern.
  • The bumper pad 203 may be formed around a device which the electronic shield means, such as the can 230, is intended to enclose. In the present aspect of the invention, the electromagnetic wave shielding means is to enclose the radio frequency integrated circuit 201, which is illustrated as an example of the device. As such, FIG. 2-5 illustrate the bumper pad 203 being formed around the radio frequency integrated circuit 201. However, if necessary, the bumper pad 203 may be formed around the semiconductor die 202.
  • The third step is a process of forming a molding 220 that covers the upper portion 210 of the printed circuit board such that the radio frequency circuit device 201, the semiconductor die 202, and the bumper pad 203 are included within the molding 220. The molding 220 is accomplished by coating and curing a material capable of shielding electromagnetic wave.
  • The fourth step is a process of forming the grooves 220 a and 220 b on a portion of the molding 220 and inserting the can 230 into the grooves 220 a and 220 b. The grooves 220 a and 220 b are formed such that the bumper pad 203 is exposed. The can 230 may be secured to the bumper pad 203 using a reflowing method.
  • The can 230 is made of metal or any electrically conductive material, and the can 230 is electrically connected to the bumper pad 203.
  • In an electronic circuit package requiring electromagnetic shield, according to the present invention, it is possible to provide an electronic circuit package having a structure capable of individually shielding electromagnetic waves of the radio frequency circuit devices.
  • While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (14)

1. A method for fabricating an electronic circuit package, the method comprising:
integrating at least one radio frequency circuit device and at least one semiconductor die on a printed circuit board;
forming a bumper pad made of metal material on the printed circuit board and around the radio frequency circuit device;
forming a molding on the printed circuit board to include the radio frequency circuit device and the semiconductor die within the molding; and
forming one or more grooves on a portion of the molding and inserting a can with an open lower portion into the groove.
2. The method as claimed in claim 1, wherein the grooves are formed such that the bumper pad is exposed.
3. The method as claimed in claim 1, wherein the can is electrically grounded to the bumper pad by a reflow process.
4. The method as claimed in claim 1, wherein the can is made of an electrically conductive material.
5. The method as claimed in claim 1, wherein the grooves are formed around a device requiring electromagnetic wave shield.
6. The method as claimed in claim 1, further comprising:
forming the bumper pad with a metal having a low melting temperature.
7. The method as claimed in claim 1, further comprising:
forming the bumper pad with lead.
8. The method as claimed in claim 1, further comprising:
forming the bumper pad by a reflow process.
9. The method as claimed in claim 1, further comprising:
forming the molding with a material capable of shielding electromagnetic waves.
10. An electronic circuit package comprising:
a printed circuit board;
at least one radio frequency circuit device and at least one semiconductor die that are integrated on the printed circuit board;
a molding formed on the printed circuit board so as to include the radio frequency circuit device and the semiconductor die within the molding;
a groove formed in the molding to enclose the circumference of the radio frequency circuit device; and
a can inserted into the groove.
11. The electronic circuit package as claimed in claim 10, further comprising a bumper pad made of metal material on the printed circuit board, the bumper pad providing an electrical ground connection for the can.
12. The electronic circuit package as claimed in claim 11, wherein the bumper pad is made of a metal having a low melting temperature.
13. The electronic circuit package as claimed in claim 11, where the bumper pad is made of lead.
14. The electronic circuit package as claimed in claim 10, wherein the molding is made of a material capable of shielding electromagnetic waves.
US11/895,430 2006-09-12 2007-08-24 Electronic circuit package and fabricating method thereof Abandoned US20080061404A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060088070A KR100754716B1 (en) 2006-09-12 2006-09-12 Electronic circuit package and fabricating method thereof
KR2006-88070 2006-09-12

Publications (1)

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US20080061404A1 true US20080061404A1 (en) 2008-03-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017172119A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Integrated circuit package having integrated emi shield

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112362A (en) * 1992-09-25 1994-04-22 Mitsubishi Electric Corp Package for high frequency element and board for mounting high frequency element
JP2002134679A (en) 2000-10-25 2002-05-10 Sony Corp Integrated circuit
JP2006041930A (en) 2004-07-27 2006-02-09 Mitsumi Electric Co Ltd High-frequency module
KR20060100169A (en) * 2005-03-16 2006-09-20 엘지이노텍 주식회사 Structure and method for mounting circuit board surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017172119A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Integrated circuit package having integrated emi shield

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