US20080055787A1 - High track density recording head - Google Patents
High track density recording head Download PDFInfo
- Publication number
- US20080055787A1 US20080055787A1 US11/975,955 US97595507A US2008055787A1 US 20080055787 A1 US20080055787 A1 US 20080055787A1 US 97595507 A US97595507 A US 97595507A US 2008055787 A1 US2008055787 A1 US 2008055787A1
- Authority
- US
- United States
- Prior art keywords
- write
- magnetic
- layer
- write head
- pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/1272—Assembling or shaping of elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49041—Fabricating head structure or component thereof including measuring or testing with significant slider/housing shaping or treating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
- Y10T29/49044—Plural magnetic deposition layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
For high track density recording, tighter reader and writer track width control are essential. This has been achieved by using the write gap layer as the plating seed on which the upper pole was electro-formed so that the width of the GMR pedestal serves to define the device's write track width.
Description
- This is a divisional application of U.S. patent application Ser. No. 10/886,888, filed on Jul. 8, 2004, which is herein incorporated by reference in its entirety, and assigned to a common assignee.
- The invention relates to the general field of magnetic write heads with particular reference to an improved top pole piece.
- For high track density recording, tighter reader and writer track width control is the key ingredient for obtaining high yield. How to continue improving the writer track width by using a pole trim process together with a narrow pole width is a challenging task. The basic principle to having tighter pole width control is to have a thinner pole resist process so that photo CD (critical dimension) control can be further improved. Reducing the amount of material consumed during the pole trim process, without impacting performance, is the key factor associated with using a thinner pole resist.
- The magnetic track width delta between reader and writer must be significantly reduced in high track density recording. Therefore, it becomes necessary to have better within-wafer reader and writer uniformity in order to meet performance requirements and provide a better yield. However, a pole trim process is required if one is to have a well defined track profile that facilitates the writing operation.
- On the other hand, said pole trim process introduces new problems such as track width uniformity control which needs to be improved. To achieve this, one must either remove less material during trimming or an improved trimming method must be substituted. The present invention discloses a novel process that allows less material to be removed during trimming while continuing to maintain the same performance level as the standard pole trim process
- There have been several proposals to utilize a plated S2 (writer lower shield), a plated write gap, and a plated P2 (top pole) in a single photo process thereby minimizing the extent of pole trim consumption. However, with this scheme the throat height definition is rather poor so this type of design creates magnetic flux leakage between pole and shield. So poor overwrite is a consequence of this type of design.
- Referring now to
FIG. 1 , the structure associated with our earlier process is illustrated. Seen there are upper and lowermagnetic shields reader assembly 14. High magneticmoment seed layer 21 lies atoplayer 13 with non-magneticwrite gap layer 51 being on it. Coveringlayer 51 isP2 seed layer 31 on whichP2 pole 52 is formed through electroplating inside a mold (not shown). - In
FIG. 2 we illustrate the end product of the pole trimming process during which part of P2 is etched away together with the exposed portions oflayers - A routine search of the prior art was performed with the following references of interest being found:
- U.S. Pat. No. 6,469,868 (Yanamoto et al) teaches that a seed layer may be made of a nonmagnetic and a conductive material. U.S. Pat. No. 6,636,460 (Akiyama et al) discloses a Ni or NiFe sputtering film as a plating seed layer. U.S. Pat. No. 5,559,654 (Das) teaches plating on a previously sputtered seed layer.
- It has been an object of at least one embodiment of the present invention to reduce the amount of pole material consumed during pole trimming.
- Another object of at least one embodiment of the present invention has been to facilitate use of thinner photoresist during formation of the top pole.
- A further object of at least one embodiment of the present invention has been to achieve more precise control of the write gap thickness.
- A still further object of at least one embodiment of the present invention has been to eliminate re-deposition of pole material during the pole trim process.
- These objects have been achieved by using the write gap layer as the plating seed on which the upper pole is electro-formed. This allows the write gap layer to be deposited through a precisely controllable process such as sputtering. Since less material needs to be removed during pole trimming, a thinner layer of photoresist may be used. This, in turn, makes possible a lower CD for the structure.
-
FIG. 1 shows, for our earlier process, the series of layers on which the upper magnetic pole is laid down. -
FIG. 2 shows the structure ofFIG. 1 at the conclusion of pole trimming. -
FIG. 3 illustrates how, in the present invention, a relatively small amount of material is laid down prior to pole trimming. -
FIG. 4 shows the structure ofFIG. 3 at the conclusion of pole trimming. - We will disclose the present invention through a description of the process used for its manufacture. This description will also serve to make clear the structure of the present invention.
- Referring now to
FIG. 3 , the process begins with the provision of lowermagnetic shield layer 15 and formingmagnetic read head 14 above it. This is followed by the deposition of uppermagnetic shield layer 13, as shown, onto which is deposited high magneticmoment seed layer 21. The lower magnetic shield has a thickness between about 1 and 3 microns, the upper magnetic shield has a thickness between about 4 and 7 microns, and they are separated by between about 400 and 1,000 Angstroms. - High magnetic
moment seed layer 21 is selected from the group consisting of CoFe and CoFeN and has a magnetic moment of at least 24 kilogauss. It is deposited to a thickness between about 1,000 and 4,000 Angstroms. - Now follows a key feature of the invention namely the deposition, through sputtering, of non-magnetic
write gap layer 51 onto high magneticmoment seed layer 21. Once sputtering is chosen as the deposition means for the write gap layer it becomes possible to control its thickness very precisely (typically to within 50 Angstroms). The write gap layer material is any one of Ru, Rh, or NiCr and it is deposited to a thickness between about 700 and 1,200 Angstroms. - With
layer 51 in place, pedestal shapedupper write pole 52 is formed, most commonly through electroplating inside a suitable photoresist mold (not shown). It is important to note thatlayer 51 acts as an effective seed for this electroplating process. The upper write pole is any one of CoFe or CoNiFe. Its initial height is between about 2.5 and 3.5 microns. - Referring now to
FIG. 4 ,upper write pole 52 is used as a self aligning mask during an etching process wherein a portion of the write pole, as well as all areas of the structure that are not protected by photoresist (or by pole 52), are removed down to the level oflayer 13. As a consequence, the width ofwrite gap layer 51 becomes equal to that ofupper write pole 52, said width now defining the write track width of the final writer (typically between about 0.1 and 0.2 microns). Additionally, the height of the upper write pole will have been reduced to between about 1 and 1.5 microns. For the etching process we have preferred using ion beam etching (IBE), low angle IBE to control trim depth followed by high angle IBE for etching to the final track width, but the invention is not limited to any particular etch process. - Because the process of the invention limits the material that needs to be removed during the etching process to
layers pedestal 52 will be removed relative to earlier methods. Also, since a significant amount of photoresist is consumed during this etch process, the reduced etching time associated with the present invention allows a thinner layer of photoresist to be used. Typically, the photoresist layer will be between about 3.5 and 4 microns thick when etching starts and will be fully consumes when it is terminated. Use of this thinner-than-usual photoresist layer enables the associated photolithographic processes to be more precise so that the CD (critical dimension) of the structure is reduced to about 0.25 microns. - Another important advantage of the reduced pole trim etch time is that the amount of redeposition during etching is reduced so that better control of pedestal width variations is achieved. Said redeposition occurs because material sputtered from vertical surfaces during the high angle IBE may land on nearby horizontal surfaces and vice versa.
- We conclude by noting that the present invention, as disclosed above, offers the following advantages:
- 1. Less P2 consumption required during pole trimming due to less material between P2 and the lower shield.
- 2. Thinner P2 resist can be used and tighter control, both within a single wafer and from wafer to wafer can be expected. A thinner resist allows greater photo-processing latitude (depth of focus, for example) which in turn leads to better P2 CD (critical dimension) control.
- 3. Heat dissipation by the writer is improved by replacing alumina with nonmagnetic metal materials, leading to less pole tip protrusion.
- 4. Better writer track width control.
- 5. A simplified writer process.
Claims (14)
1. A magnetic write head for high track density applications, comprising:
a magnetic shield layer;
on said magnetic shield layer, a pedestal having a height and a width, said pedestal comprising:
a high magnetic moment seed layer on said magnetic shield layer;
a sputtered non-magnetic write gap layer on said a high magnetic moment seed layer; and
an upper write pole on said sputtered non-magnetic write gap layer;
whereby said pedestal width defines a write track width for said read write head.
2. The write head described in claim 1 wherein said high magnetic moment seed layer is selected from the group consisting of CoFe and CoFeN.
3. The write head described in claim 1 wherein said high magnetic moment seed layer has a thickness between about 1,000 and 4,000 Angstroms.
4. The write head described in claim 1 wherein said high magnetic moment seed layer has a magnetic moment of at least 24 kilogauss.
5. The write head described in claim 1 wherein said write gap layer is selected from the group consisting of Ru, Rh, and NiCr.
6. The write head described in claim 1 wherein said write gap layer has a thickness between about 700 and 1,200 Angstroms, said thickness being controlled to within 50 Angstroms.
7. The write head described in claim 1 wherein said upper write pole is selected from the group consisting of CoNiFe and CoFe.
8. The write head described in claim 1 wherein said pedestal height is between about 2.5 and 3.5 microns.
9. The write head described in claim 1 wherein said pedestal width is between about 0.1 and 0.2 microns.
10. A magnetic read-write head, comprising:
a lower magnetic shield layer;
a magnetic read head over said lower magnetic shield;
an upper magnetic shield layer over said magnetic read head;
on said upper magnetic shield layer, a pedestal having a height and a width, said pedestal comprising:
a high magnetic moment seed layer on said upper magnetic shield layer;
a sputtered non-magnetic write gap layer on said a high magnetic moment seed layer; and
an upper write pole on said sputtered non-magnetic write gap layer, whereby said pedestal width defines a write track width for said read write head.
11. The read-write head described in claim 10 wherein said lower magnetic shield has a thickness between about 1 and 3 microns.
12. The read-write head described in claim 10 wherein said upper magnetic shield has a thickness between about 4 and 7 microns.
13. The read-write head described in claim 10 wherein said upper and lower magnetic shields are separated by between about 400 and 1,000 Angstroms.
14. The read-write head described in claim 10 wherein said write gap layer has a thickness between about 700 and 1,200 Angstroms Å 50 Angstroms.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/975,955 US20080055787A1 (en) | 2004-07-08 | 2007-10-23 | High track density recording head |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/886,888 US7293344B2 (en) | 2004-07-08 | 2004-07-08 | Process of making CD uniformity in high track density recording head |
US11/975,955 US20080055787A1 (en) | 2004-07-08 | 2007-10-23 | High track density recording head |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/886,888 Division US7293344B2 (en) | 2004-07-08 | 2004-07-08 | Process of making CD uniformity in high track density recording head |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080055787A1 true US20080055787A1 (en) | 2008-03-06 |
Family
ID=35541103
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/886,888 Expired - Fee Related US7293344B2 (en) | 2004-07-08 | 2004-07-08 | Process of making CD uniformity in high track density recording head |
US11/975,955 Abandoned US20080055787A1 (en) | 2004-07-08 | 2007-10-23 | High track density recording head |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/886,888 Expired - Fee Related US7293344B2 (en) | 2004-07-08 | 2004-07-08 | Process of making CD uniformity in high track density recording head |
Country Status (1)
Country | Link |
---|---|
US (2) | US7293344B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8861316B2 (en) * | 2012-12-18 | 2014-10-14 | Seagate Technology Llc | Write pole for recording head |
US9343091B1 (en) * | 2014-09-15 | 2016-05-17 | Seagate Technology Llc | Sensor structure having layer with high magnetic moment |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7193814B2 (en) * | 2004-02-17 | 2007-03-20 | Headway Technologies, Inc. | Pole piece for high track density recording |
JP2006309846A (en) * | 2005-04-27 | 2006-11-09 | Tdk Corp | Thin film magnetic head, its manufacturing method, and magnetic recording apparatus |
US7652853B2 (en) * | 2005-07-28 | 2010-01-26 | Hitachi Global Storage Technologies Netherlands B.V. | Thin shield structure for reduced protrusion in a magnetoresistive head |
US8056213B2 (en) * | 2007-10-03 | 2011-11-15 | Headway Technologies, Inc. | Method to make PMR head with integrated side shield (ISS) |
US9412398B2 (en) | 2013-08-21 | 2016-08-09 | HGST Netherlands B.V. | Shield with uniform magnetic properties for a perpendicular magnetic recording head |
US9443541B1 (en) * | 2015-03-24 | 2016-09-13 | Western Digital (Fremont), Llc | Magnetic writer having a gradient in saturation magnetization of the shields and return pole |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5559654A (en) * | 1992-05-21 | 1996-09-24 | Das; Shyam C. | Narrow track thin film head for high track density recording |
US6469868B2 (en) * | 1998-09-10 | 2002-10-22 | Tdk Corporation | Thin film magnetic head having a nonmagnetic conductive layer and method of manufacturing same |
US20030179497A1 (en) * | 2002-03-19 | 2003-09-25 | Harris Tom King | Magnetic head having a bilayer pole tip and method of making the same |
US6636460B2 (en) * | 1999-12-28 | 2003-10-21 | Kabushiki Kaisha Toshiba | Thermally-assisted magnetic recording method and thermally-assisted magnetic recorder |
US20040012884A1 (en) * | 2002-07-17 | 2004-01-22 | Alps Electric Co., Ltd. | Thin film magnetic head and method of manufacturing the same |
US6778357B2 (en) * | 2000-11-10 | 2004-08-17 | Seagate Technology Llc | Electrodeposited high-magnetic-moment material at writer gap pole |
US20040201920A1 (en) * | 2003-04-14 | 2004-10-14 | Tdk Corporation | Thin-film magnetic head, head gimbal assembly, and hard disk drive |
US6912106B1 (en) * | 2002-08-06 | 2005-06-28 | Western Digital (Fremont), Inc. | Writer with a hot seed zero throat and substantially flat top pole |
US7085099B2 (en) * | 2004-01-20 | 2006-08-01 | Headway Technologies, Inc. | Thin film magnetic head having spiral coils and manufacturing method thereof |
US7086139B2 (en) * | 2004-04-30 | 2006-08-08 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of making magnetic write heads using electron beam lithography |
US7143505B2 (en) * | 1999-10-06 | 2006-12-05 | Alps Electric Co., Ltd. | Manufacturing method for a thin film magnetic head |
US7170712B2 (en) * | 2003-03-12 | 2007-01-30 | Alps Electric Co., Ltd. | Magnetic head including a gap-depth defining layer on protruding layer and method for manufacturing the same |
US7343666B2 (en) * | 2004-06-30 | 2008-03-18 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of making magnetic write heads with use of linewidth shrinkage techniques |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62149024A (en) * | 1985-12-23 | 1987-07-03 | Fuji Electric Co Ltd | Magnetic recording medium |
JPH08279117A (en) * | 1995-04-03 | 1996-10-22 | Alps Electric Co Ltd | Gigantic magnetoresistance effect material film and its production and magnetic head using the same |
US5875542A (en) * | 1997-04-18 | 1999-03-02 | Read-Rite Corporation | Method of making thin film merged magnetoresistive heads |
-
2004
- 2004-07-08 US US10/886,888 patent/US7293344B2/en not_active Expired - Fee Related
-
2007
- 2007-10-23 US US11/975,955 patent/US20080055787A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5559654A (en) * | 1992-05-21 | 1996-09-24 | Das; Shyam C. | Narrow track thin film head for high track density recording |
US6469868B2 (en) * | 1998-09-10 | 2002-10-22 | Tdk Corporation | Thin film magnetic head having a nonmagnetic conductive layer and method of manufacturing same |
US7143505B2 (en) * | 1999-10-06 | 2006-12-05 | Alps Electric Co., Ltd. | Manufacturing method for a thin film magnetic head |
US6636460B2 (en) * | 1999-12-28 | 2003-10-21 | Kabushiki Kaisha Toshiba | Thermally-assisted magnetic recording method and thermally-assisted magnetic recorder |
US6778357B2 (en) * | 2000-11-10 | 2004-08-17 | Seagate Technology Llc | Electrodeposited high-magnetic-moment material at writer gap pole |
US20030179497A1 (en) * | 2002-03-19 | 2003-09-25 | Harris Tom King | Magnetic head having a bilayer pole tip and method of making the same |
US20040012884A1 (en) * | 2002-07-17 | 2004-01-22 | Alps Electric Co., Ltd. | Thin film magnetic head and method of manufacturing the same |
US6912106B1 (en) * | 2002-08-06 | 2005-06-28 | Western Digital (Fremont), Inc. | Writer with a hot seed zero throat and substantially flat top pole |
US7170712B2 (en) * | 2003-03-12 | 2007-01-30 | Alps Electric Co., Ltd. | Magnetic head including a gap-depth defining layer on protruding layer and method for manufacturing the same |
US20040201920A1 (en) * | 2003-04-14 | 2004-10-14 | Tdk Corporation | Thin-film magnetic head, head gimbal assembly, and hard disk drive |
US7085099B2 (en) * | 2004-01-20 | 2006-08-01 | Headway Technologies, Inc. | Thin film magnetic head having spiral coils and manufacturing method thereof |
US7086139B2 (en) * | 2004-04-30 | 2006-08-08 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of making magnetic write heads using electron beam lithography |
US7343666B2 (en) * | 2004-06-30 | 2008-03-18 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of making magnetic write heads with use of linewidth shrinkage techniques |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8861316B2 (en) * | 2012-12-18 | 2014-10-14 | Seagate Technology Llc | Write pole for recording head |
US9343091B1 (en) * | 2014-09-15 | 2016-05-17 | Seagate Technology Llc | Sensor structure having layer with high magnetic moment |
Also Published As
Publication number | Publication date |
---|---|
US20060007602A1 (en) | 2006-01-12 |
US7293344B2 (en) | 2007-11-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8797685B2 (en) | Perpendicular write head having a stepped flare structure and method of manufacture thereof | |
US7911735B1 (en) | Perpendicular magnetic recording head utilizing a nonmagnetic underlayer layer | |
US7248431B1 (en) | Method of fabricating a perpendicular recording write head having a gap with two portions | |
US20080055787A1 (en) | High track density recording head | |
US5901432A (en) | Method for making a thin film inductive write head having a pedestal pole tip and an electroplated gap | |
US7748103B2 (en) | Method of manufacturing a perpendicular magnetic recording write head with notched trailing shield | |
US8614860B2 (en) | PMR head with integrated side shield (ISS) | |
US8793866B1 (en) | Method for providing a perpendicular magnetic recording head | |
US6560853B1 (en) | Method of making inductive head with reduced height insulation stack due to partial coverage zero throat height defining insulation layer | |
US8174790B2 (en) | Thin-film magnetic head having remnant coating and remnant insulating film, head gimbal assembly and hard disk drive | |
US7382577B2 (en) | Magnetic write head having a wider trailing edge pole structure | |
US20110097601A1 (en) | Wrap-around shielded writer with highly homogeneous shield material | |
US6081408A (en) | Magnetoresistive read/write head having reduced write fringing and method for manufacturing same | |
US6524491B1 (en) | Double plate-up process for fabrication of composite magnetoresistive shared poles | |
US6393692B1 (en) | Method of manufacture of a composite shared pole design for magnetoresistive merged heads | |
JP2003085709A (en) | Thin-film magnetic head, its manufacturing method, and magnetic disk device | |
US7029376B1 (en) | Process of fabricating write pole in magnetic recording head using rhodium CMP stop layer | |
US20100110585A1 (en) | Perpendicular magnetic recording write head with a trailing shield | |
US7359150B2 (en) | Self-aligned trimmed pole | |
US6597534B1 (en) | Thin-film magnetic head suitable for narrower tracks and preventing write fringing and method for making the same | |
US7193814B2 (en) | Pole piece for high track density recording | |
US7770283B2 (en) | Method of fabricating a magnetic head | |
JP3455140B2 (en) | Thin film magnetic head and method of manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |