US20080049299A1 - Packaging of frequency-doubled, extended-cavity, surface-emitting laser components on a common substrate - Google Patents
Packaging of frequency-doubled, extended-cavity, surface-emitting laser components on a common substrate Download PDFInfo
- Publication number
- US20080049299A1 US20080049299A1 US11/507,784 US50778406A US2008049299A1 US 20080049299 A1 US20080049299 A1 US 20080049299A1 US 50778406 A US50778406 A US 50778406A US 2008049299 A1 US2008049299 A1 US 2008049299A1
- Authority
- US
- United States
- Prior art keywords
- emitter
- optical element
- frequency converter
- laser module
- selective reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/37—Non-linear optics for second-harmonic generation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08059—Constructional details of the reflector, e.g. shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/0813—Configuration of resonator
- H01S3/0815—Configuration of resonator having 3 reflectors, e.g. V-shaped resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
- H01S3/108—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using non-linear optical devices, e.g. exhibiting Brillouin or Raman scattering
- H01S3/109—Frequency multiplication, e.g. harmonic generation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
Definitions
- This invention relates in general to lasers, and, in particular, to an improved method of packaging the same.
- VECSELs vertical external cavity surface-emitting lasers
- a laser module comprising an optical element, a frequency converter, a selective reflector, and one or more surface-emitters, each coupled to a common substrate, wherein the emitters, the optical element, the frequency converter, and the selective reflector are positioned with respect to each other such that at least a portion of the light emitted from the surface-emitters travels through the optical element, through the frequency converter and through the selective reflector.
- a method for frequency converting light generated by a surface-emitter wherein the light passes through an optical element, a frequency converter, and a selective reflector, each coupled to a common substrate.
- particular embodiments of the present invention may exhibit some, none, or all of the following technical advantages.
- Various embodiments may be capable of aligning within tight tolerances using precision semiconductor-type equipment.
- various embodiments may have temperature control components integrated into the common substrate.
- Other technical advantages will be readily apparent to one skilled in the art from the following figures, description and claims.
- specific advantages have been enumerated, various embodiments may include all, some or none of the enumerated advantages.
- FIG. 1A is a perspective view illustrating a method of forming a portion of a laser module
- FIG. 1B is one example of a cross sectional view illustrating one embodiment of a portion of a laser module
- FIG. 2A is a perspective view illustrating a method of forming a portion of a laser module
- FIG. 2B is one example of a cross sectional view illustrating one embodiment of a portion of a laser module
- FIGS. 3A and 3B are cross sectional views illustrating alternative examples of a method of forming a portion of a laser module.
- FIG. 4 is a cross section view of one embodiment of a portion of laser module 400 comprising a single output.
- FIG. 1A is a perspective view of one embodiment of a portion of a laser module 100 .
- a laser module 100 comprises a system of components attached to a common substrate 102 and is capable of producing sufficient visible light for display applications.
- Substrate 102 may comprise, for example, silicon or a multi-layer co-fired ceramic header.
- a surface-emitter 104 and substrate 102 are attached in substantially parallel planes.
- Surface-emitter 104 may comprise, for example, a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used.
- IR infrared
- an optical element 106 is capable of reflecting, polarizing, and beam-splitting light.
- Optical element 106 comprises, in this embodiment, two right triangle-shaped total internal reflection (TIR) prisms 106 a and 106 b bonded together and separated by a beam-splitting and polarizing surface as indicated by reference number 10 .
- a surface indicated by reference number 120 of prism 106 a is attached substantially parallel to substrate 102 and outwardly from surface-emitter 104 .
- prism 106 b is disposed outwardly from prism 106 a .
- other embodiments may not include prism 106 b .
- this example uses TIR prisms, other selectively reflective elements may be used without departing from the scope of the present disclosure.
- Frequency converter 108 is attached to substrate 102 .
- Frequency converter 108 may comprise, for example, crystals capable of harmonic generation such as, for example, periodically poled lithium niobate (PPLN) crystals or Lithium Triborate LiB305 (LBO) crystals.
- PPLN periodically poled lithium niobate
- LBO Lithium Triborate LiB305
- a selective reflector 112 is attached to substrate 102 and is substantially parallel to surface-emitter 104 .
- Selective reflector 112 may comprise, for example, one or more selective mirrors, each mirror transmitting specific frequencies of visible light while reflecting IR.
- the various conventional optical components do not have practical mounting surfaces that are on a common plane, or even mutually parallel planes. This complicates aligning the components within tight tolerance requirements.
- the laser emitter generates a significant amount of heat that must be efficiently removed from the module, while the frequency-doubling crystal must be maintained at a very specific temperature and therefore must be thermally isolated from the laser emitter.
- surface-emitter 104 , optical element 106 , and frequency converter 108 are attached to a common substrate, where they may be aligned within tight tolerances using precision semiconductor-type die attach equipment.
- selective reflector 112 may be aligned to the remainder of laser module 100 based on the optical output from laser module 100 .
- Each component may be held in place by, for example, solder or a very stable adhesive.
- frequency converter 108 and surface-emitter 104 are attached to a common substrate comprising temperature-controlling components.
- frequency converter 108 may be thermally isolated from surface-emitter 104 by means of an insulative substrate material, such as alumina for example.
- frequency converter 108 may be heated to a controlled temperature, as measured by thermistor 110 , by a heater 114 integrated into substrate 102 .
- a heat sink 116 may be brazed or otherwise attached to substrate 102 .
- Heat sink 116 may comprise, for example, a highly conductive metal such as copper-tungsten or a thermally conductive ceramic such as aluminum-nitride.
- FIG. 1B is a cross section view of one embodiment of a portion of laser module 100 .
- surface-emitter 104 comprises a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used.
- IR infrared
- the IR output from surface-emitter 104 is folded 90 degrees and polarized by optical element 106 as indicated by reference number 122 .
- the IR output from optical element 106 as indicated by reference number 124 passes through a frequency converter 108 , which converts at least a portion of the IR beam into visible light.
- this example uses TIR prisms, other reflective elements may be used without departing from the scope of the present disclosure.
- selective reflector 112 is capable of transmitting specific frequencies of visible light converted within frequency converter 108 , while reflecting other frequencies of light.
- Laser module 100 outputs the visible light transmitted through selective reflector 112 as indicated by reference number 126 .
- light reflected from selective reflector 112 returns back through frequency converter 108 as indicated by reference number 128 .
- frequency converter 108 As the IR reflected from selective reflector 112 returns through frequency converter 108 , at least a portion of the IR beam converts to visible light.
- the beam-splitting surface 118 within optical element 106 reflects a range of visible light 90 degrees, as indicated by reference number 130 , while transmitting other frequencies, including IR.
- the transmitted IR folds 90 degrees by a surface of 106 a as indicated by reference number 122 , reflects off surface-emitter 104 and combines with the output from surface-emitter 104 .
- FIGS. 2A and 2B illustrate an alternative coupling for surface-emitter 104 and the corresponding optical components that direct the light path.
- FIGS. 3A and 3B illustrate examples of alternative components that may make up the optical element 106 .
- FIG. 4 illustrates an example of an alternative embodiment of a laser module that that produces a single output.
- FIG. 2A is a perspective view of an alternative embodiment of a portion of a laser module 200 .
- laser module 200 comprises a system of components attached to a common substrate 202 and is capable of producing multiple Watts of visible light.
- Substrate 202 may comprise, for example, silicon or a multi-layer co-fired ceramic header.
- surface-emitter 204 is attached to a surface of a right-angle block 216 disposed outwardly from substrate 202 .
- Right-angle block 216 and substrate 202 are attached in substantially parallel planes.
- Right-angle block 216 may comprise, for example, a highly conductive metal such as copper-tungsten or a thermally conductive ceramic such as aluminum-nitride.
- Surface-emitter 204 may comprise, for example, a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used.
- IR infrared
- an optical element 206 is capable of polarizing and beam-splitting the optical output from surface-emitter 204 .
- optical element 206 comprises two right triangle-shaped total internal reflection (TIR) prisms 206 a and 206 b bonded together and separated by a beam-splitting and polarizing surface, in this example, as indicated by reference number 218 .
- a surface indicated by reference number 220 of prism 206 a is attached substantially parallel to substrate 202 while another surface of 202 a is substantially parallel to surface-emitter 204 .
- TIR prism 206 b is disposed outwardly from TIR prism 206 a .
- other embodiments may not include prism TIR 206 b .
- this example uses TIR prisms, other reflective elements may be used without departing from the scope of the present disclosure.
- Frequency converter 208 is attached to substrate 202 .
- Frequency converter 208 may comprise, for example, crystals capable of harmonic generation such as, for example, periodically poled lithium niobate (PPLN) crystals or Lithium Triborate LiB305 (LBO) crystals.
- PPLN periodically poled lithium niobate
- LBO Lithium Triborate LiB305
- a selective reflector 212 is attached to substrate 202 and is substantially perpendicular to the surface-emitter 204 surface; however, other configurations may be used, involving those in which the reflector is closer to parallel than perpendicular to the surface-emitter 204 surface.
- Selective reflector 212 may comprise, for example, one or more selective mirrors, each mirror transmitting specific frequencies of visible light while reflecting IR.
- right-angle block 216 , optical element 206 , and frequency converter 208 are attached to a common substrate, wherein they may be aligned within tight tolerances using precision semiconductor-type die attach equipment.
- the selective reflector 212 may be aligned to the remainder of laser module 200 based on the optical output from laser module 200 .
- Each component may be held in place by, for example, solder or a very stable adhesive.
- frequency converter 208 and surface-emitter 204 are attached to a common substrate comprising temperature-controlling components.
- frequency converter 208 may be thermally isolated from surface-emitter 204 by means of an insulative substrate material, such as alumina for example.
- frequency converter 208 may be heated to a controlled temperature, as measured by thermistor 210 , by a heater 214 integrated into substrate 202 .
- Right-angle block 216 is capable of removing from substrate 202 the heat generated by surface-emitter 204 .
- FIG. 2B is a cross section view of one embodiment of a portion of laser module 200 .
- surface-emitter 204 comprises a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used.
- IR infrared
- the IR output from surface-emitter 204 is polarized as it passes through optical element 206 in a direction substantially parallel to the surface of substrate 202 , as indicated by reference number 230 .
- other embodiments may not include prism TIR 206 b .
- this example uses TIR prisms, other selectively reflective elements may be used without departing from the scope of the present disclosure.
- the IR output from optical element 206 passes through a frequency converter 208 , which converts at least a portion of the IR beam into visible light.
- selective reflector 212 is capable of transmitting specific frequencies of visible light converted within frequency converter 208 , while reflecting other frequencies of light.
- Laser module 200 outputs the visible light transmitted through selective reflector 212 , as indicated by reference number 226 .
- light reflected from selective reflector 212 returns back through frequency converter 208 .
- frequency converter 208 As the IR reflected from selective reflector 212 returns through frequency converter 208 , as indicated by reference number 228 , at least a portion of the IR beam converts to visible light.
- the beam-splitting surface within optical element 206 reflects a range of visible light 90 degrees, as indicated by reference numeral 230 , while transmitting other frequencies, including IR.
- the transmitted IR reflects off surface-emitter 204 and combines with the output from surface-emitter 204 .
- optical element 206 may not reflect light within optical element 206 .
- Such embodiments may comprise an optical element 206 that performs the function of polarizing without reflecting or redirecting light.
- FIG. 3A shows an alternative embodiment of a portion of a laser module 300 .
- Optical element 306 comprises a plurality of mirrors 306 a and 306 b disposed outwardly from a substrate 302 .
- optical element 306 is capable of reflecting, polarizing, and beam-splitting light.
- Mirror 306 a and 306 b are positioned at right angles, in this embodiment.
- a beam-splitting and polarizing surface of mirror 306 b reflects visible light while transmitting polarized IR.
- Mirror 306 a reflects visible light and IR.
- Surface-emitter 304 is attached to substrate 302 inwardly from optical element 306 .
- FIG. 3B shows an alternative embodiment of a portion of a laser module 300 .
- optical element 306 is capable of reflecting, polarizing, and beam-splitting light.
- Optical element 306 comprises one or more mirrors 306 a attached to one or more total internal reflection (TIR) prisms 306 b disposed outwardly from a common substrate.
- TIR total internal reflection
- a beam-splitting and polarizing surface of prism 306 b reflects visible light while transmitting polarized IR.
- Mirror 306 a reflects visible light and IR.
- Surface-emitter 304 is attached to a common substrate inwardly from optical element 306 .
- FIG. 4 is a cross section view of one embodiment of a portion of laser module 400 comprising optical components attached to a common substrate.
- laser module 400 generates a single output.
- surface-emitter 404 comprises a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used.
- IR infrared
- IR output from surface-emitter 404 is folded 90 degrees, as indicated by reference number 422 , and polarized by optical element 406 .
- Optical element 406 comprises a total internal reflection (TIR) prism.
- TIR total internal reflection
- the IR output from optical element 406 passes through a frequency converter 408 , which converts at least a portion of the IR beam into visible light.
- selective reflector 412 is capable of transmitting specific frequencies of visible light converted within frequency converter 408 , while reflecting other frequencies of light.
- Laser module 400 outputs the visible light transmitted through selective reflector 412 , as indicated by reference number 426 .
- the light returning from frequency converter 408 folds 90 degrees within optical element 406 reflects off surface-emitter 404 and follows the same path as the output from surface-emitter 404 .
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
- This invention relates in general to lasers, and, in particular, to an improved method of packaging the same.
- Within the optics industry, numerous applications require a light source capable of producing multiple Watts of visible light. For example, DLP® high definition televisions (HDTV) incorporate high-power lamps or light-emitting diodes (LED). More recently, vertical external cavity surface-emitting lasers (VECSELs) have been developed which, when combined with a frequency-doubling crystal, form a laser module capable of producing sufficient visible light to power video displays. Conventional packaging of the optical components that make up the laser module is expensive and difficult to manufacture for a variety of reasons.
- In one embodiment, a laser module comprising an optical element, a frequency converter, a selective reflector, and one or more surface-emitters, each coupled to a common substrate, wherein the emitters, the optical element, the frequency converter, and the selective reflector are positioned with respect to each other such that at least a portion of the light emitted from the surface-emitters travels through the optical element, through the frequency converter and through the selective reflector.
- In a method embodiment, a method for frequency converting light generated by a surface-emitter, wherein the light passes through an optical element, a frequency converter, and a selective reflector, each coupled to a common substrate.
- Depending on the specific features implemented, particular embodiments of the present invention may exhibit some, none, or all of the following technical advantages. Various embodiments may be capable of aligning within tight tolerances using precision semiconductor-type equipment. In addition, various embodiments may have temperature control components integrated into the common substrate. Other technical advantages will be readily apparent to one skilled in the art from the following figures, description and claims. Moreover, while specific advantages have been enumerated, various embodiments may include all, some or none of the enumerated advantages.
- For a more complete understanding of the present invention, and for further features and advantages thereof, reference is now made to the following description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1A is a perspective view illustrating a method of forming a portion of a laser module; -
FIG. 1B is one example of a cross sectional view illustrating one embodiment of a portion of a laser module; -
FIG. 2A is a perspective view illustrating a method of forming a portion of a laser module; -
FIG. 2B is one example of a cross sectional view illustrating one embodiment of a portion of a laser module; -
FIGS. 3A and 3B are cross sectional views illustrating alternative examples of a method of forming a portion of a laser module. -
FIG. 4 is a cross section view of one embodiment of a portion oflaser module 400 comprising a single output. - Particular examples specified throughout this document are intended for example purposes only, and are not intended to limit the scope of the present disclosure. In particular, this document is not intended to be limited to a particular application, such as, video display. Moreover, the illustrations in
FIGS. 1A through 4 are not intended to be to scale. -
FIG. 1A is a perspective view of one embodiment of a portion of alaser module 100. In this example, alaser module 100 comprises a system of components attached to acommon substrate 102 and is capable of producing sufficient visible light for display applications.Substrate 102 may comprise, for example, silicon or a multi-layer co-fired ceramic header. - In this particular example, a surface-
emitter 104 andsubstrate 102 are attached in substantially parallel planes. Surface-emitter 104 may comprise, for example, a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used. - In this particular example, an optical element 106 is capable of reflecting, polarizing, and beam-splitting light. Optical element 106 comprises, in this embodiment, two right triangle-shaped total internal reflection (TIR)
prisms prism 106 a is attached substantially parallel tosubstrate 102 and outwardly from surface-emitter 104. In this example,prism 106 b is disposed outwardly fromprism 106 a. Depending on the desired optical output fromlaser module 100, other embodiments may not includeprism 106 b. Although this example uses TIR prisms, other selectively reflective elements may be used without departing from the scope of the present disclosure. - In this example, a
frequency converter 108 is attached tosubstrate 102.Frequency converter 108 may comprise, for example, crystals capable of harmonic generation such as, for example, periodically poled lithium niobate (PPLN) crystals or Lithium Triborate LiB305 (LBO) crystals. - In this example, a
selective reflector 112 is attached tosubstrate 102 and is substantially parallel to surface-emitter 104.Selective reflector 112 may comprise, for example, one or more selective mirrors, each mirror transmitting specific frequencies of visible light while reflecting IR. - Conventional packaging of the optical components that make up visible laser modules is expensive and difficult to manufacture for a variety of reasons. For example, as recognized by the teachings of the invention, the various conventional optical components do not have practical mounting surfaces that are on a common plane, or even mutually parallel planes. This complicates aligning the components within tight tolerance requirements. In addition, the laser emitter generates a significant amount of heat that must be efficiently removed from the module, while the frequency-doubling crystal must be maintained at a very specific temperature and therefore must be thermally isolated from the laser emitter.
- Unlike conventional laser modules described in the background, surface-
emitter 104, optical element 106, andfrequency converter 108 are attached to a common substrate, where they may be aligned within tight tolerances using precision semiconductor-type die attach equipment. In addition,selective reflector 112 may be aligned to the remainder oflaser module 100 based on the optical output fromlaser module 100. Each component may be held in place by, for example, solder or a very stable adhesive. - Unlike conventional laser modules described in the background,
frequency converter 108 and surface-emitter 104 are attached to a common substrate comprising temperature-controlling components. For example,frequency converter 108 may be thermally isolated from surface-emitter 104 by means of an insulative substrate material, such as alumina for example. In addition,frequency converter 108 may be heated to a controlled temperature, as measured bythermistor 110, by aheater 114 integrated intosubstrate 102. To remove the heat generated by surface-emitter 104, aheat sink 116 may be brazed or otherwise attached tosubstrate 102.Heat sink 116 may comprise, for example, a highly conductive metal such as copper-tungsten or a thermally conductive ceramic such as aluminum-nitride. -
FIG. 1B is a cross section view of one embodiment of a portion oflaser module 100. In this example, surface-emitter 104 comprises a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used. - In this particular example, the IR output from surface-
emitter 104 is folded 90 degrees and polarized by optical element 106 as indicated byreference number 122. The IR output from optical element 106 as indicated byreference number 124 passes through afrequency converter 108, which converts at least a portion of the IR beam into visible light. Although this example uses TIR prisms, other reflective elements may be used without departing from the scope of the present disclosure. - In this example,
selective reflector 112 is capable of transmitting specific frequencies of visible light converted withinfrequency converter 108, while reflecting other frequencies of light.Laser module 100 outputs the visible light transmitted throughselective reflector 112 as indicated byreference number 126. - In this example, light reflected from
selective reflector 112 returns back throughfrequency converter 108 as indicated byreference number 128. As the IR reflected fromselective reflector 112 returns throughfrequency converter 108, at least a portion of the IR beam converts to visible light. - In this example, the beam-splitting
surface 118 within optical element 106 reflects a range of visible light 90 degrees, as indicated byreference number 130, while transmitting other frequencies, including IR. The reflected visible light folds another 90 degrees, as indicated byreference number 132, by a surface of 106 b and outputs fromlaser module 200 in direction parallel to the light transmitted throughselective reflector 112, as indicated byreference number 134. The transmitted IR folds 90 degrees by a surface of 106 a, as indicated byreference number 122, reflects off surface-emitter 104 and combines with the output from surface-emitter 104. - Thus, by packaging the
laser module 100 components on a common substrate each component may be aligned in a single active alignment using precision equipment. This greatly facilitates the manufacturability oflaser module 100 while possibly shrinking the package size. Other embodiments may comprise alternative components or alternative component placements without departing from the scope of the present disclosure. For example,FIGS. 2A and 2B illustrate an alternative coupling for surface-emitter 104 and the corresponding optical components that direct the light path. However, the embodiment inFIG. 1 may be preferable since it can be implemented with fewer component alignment steps.FIGS. 3A and 3B illustrate examples of alternative components that may make up the optical element 106.FIG. 4 illustrates an example of an alternative embodiment of a laser module that that produces a single output. -
FIG. 2A is a perspective view of an alternative embodiment of a portion of alaser module 200. In this example,laser module 200 comprises a system of components attached to acommon substrate 202 and is capable of producing multiple Watts of visible light.Substrate 202 may comprise, for example, silicon or a multi-layer co-fired ceramic header. - In this particular example, surface-
emitter 204 is attached to a surface of a right-angle block 216 disposed outwardly fromsubstrate 202. Right-angle block 216 andsubstrate 202 are attached in substantially parallel planes. Right-angle block 216 may comprise, for example, a highly conductive metal such as copper-tungsten or a thermally conductive ceramic such as aluminum-nitride. Surface-emitter 204 may comprise, for example, a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used. - In this particular example, an
optical element 206 is capable of polarizing and beam-splitting the optical output from surface-emitter 204. In addition,optical element 206 comprises two right triangle-shaped total internal reflection (TIR)prisms reference number 218. A surface indicated byreference number 220 ofprism 206 a is attached substantially parallel tosubstrate 202 while another surface of 202 a is substantially parallel to surface-emitter 204. In this example,TIR prism 206 b is disposed outwardly fromTIR prism 206 a. Depending on the desired optical output fromlaser module 200, other embodiments may not includeprism TIR 206 b. Although this example uses TIR prisms, other reflective elements may be used without departing from the scope of the present disclosure. - In this example, a
frequency converter 208 is attached tosubstrate 202.Frequency converter 208 may comprise, for example, crystals capable of harmonic generation such as, for example, periodically poled lithium niobate (PPLN) crystals or Lithium Triborate LiB305 (LBO) crystals. - In this example, a
selective reflector 212 is attached tosubstrate 202 and is substantially perpendicular to the surface-emitter 204 surface; however, other configurations may be used, involving those in which the reflector is closer to parallel than perpendicular to the surface-emitter 204 surface.Selective reflector 212 may comprise, for example, one or more selective mirrors, each mirror transmitting specific frequencies of visible light while reflecting IR. - Unlike conventional laser modules described in the background, right-
angle block 216,optical element 206, andfrequency converter 208 are attached to a common substrate, wherein they may be aligned within tight tolerances using precision semiconductor-type die attach equipment. In addition, theselective reflector 212 may be aligned to the remainder oflaser module 200 based on the optical output fromlaser module 200. Each component may be held in place by, for example, solder or a very stable adhesive. - Unlike conventional laser modules described in the background,
frequency converter 208 and surface-emitter 204 are attached to a common substrate comprising temperature-controlling components. For example,frequency converter 208 may be thermally isolated from surface-emitter 204 by means of an insulative substrate material, such as alumina for example. In addition,frequency converter 208 may be heated to a controlled temperature, as measured bythermistor 210, by aheater 214 integrated intosubstrate 202. Right-angle block 216 is capable of removing fromsubstrate 202 the heat generated by surface-emitter 204. -
FIG. 2B is a cross section view of one embodiment of a portion oflaser module 200. In this example, surface-emitter 204 comprises a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used. - In this example, the IR output from surface-
emitter 204 is polarized as it passes throughoptical element 206 in a direction substantially parallel to the surface ofsubstrate 202, as indicated byreference number 230. Depending on the desired optical output fromlaser module 200, other embodiments may not includeprism TIR 206 b. Although this example uses TIR prisms, other selectively reflective elements may be used without departing from the scope of the present disclosure. - The IR output from
optical element 206 passes through afrequency converter 208, which converts at least a portion of the IR beam into visible light. - In this example,
selective reflector 212 is capable of transmitting specific frequencies of visible light converted withinfrequency converter 208, while reflecting other frequencies of light.Laser module 200 outputs the visible light transmitted throughselective reflector 212, as indicated byreference number 226. - In this example, light reflected from
selective reflector 212 returns back throughfrequency converter 208. As the IR reflected fromselective reflector 212 returns throughfrequency converter 208, as indicated byreference number 228, at least a portion of the IR beam converts to visible light. - In this example, the beam-splitting surface within
optical element 206, as indicated byreference number 218, reflects a range of visible light 90 degrees, as indicated byreference numeral 230, while transmitting other frequencies, including IR. The reflected visible light folds 90 degrees, as indicated byreference number 232, by a surface of 206 b and outputs fromlaser module 200 in a direction parallel to the light transmitted throughselective reflector 212, as indicated byreference number 234. The transmitted IR reflects off surface-emitter 204 and combines with the output from surface-emitter 204. - Other embodiments that require only a single output from
laser module 200 may not reflect light withinoptical element 206. Such embodiments may comprise anoptical element 206 that performs the function of polarizing without reflecting or redirecting light. -
FIG. 3A shows an alternative embodiment of a portion of alaser module 300. Optical element 306 comprises a plurality ofmirrors substrate 302. In this example, optical element 306 is capable of reflecting, polarizing, and beam-splitting light.Mirror mirror 306 b reflects visible light while transmitting polarized IR.Mirror 306 a reflects visible light and IR. Surface-emitter 304 is attached tosubstrate 302 inwardly from optical element 306. -
FIG. 3B shows an alternative embodiment of a portion of alaser module 300. In this example, optical element 306 is capable of reflecting, polarizing, and beam-splitting light. Optical element 306 comprises one ormore mirrors 306 a attached to one or more total internal reflection (TIR)prisms 306 b disposed outwardly from a common substrate. In this example, a beam-splitting and polarizing surface ofprism 306 b reflects visible light while transmitting polarized IR.Mirror 306 a reflects visible light and IR. Surface-emitter 304 is attached to a common substrate inwardly from optical element 306. -
FIG. 4 is a cross section view of one embodiment of a portion oflaser module 400 comprising optical components attached to a common substrate. In this particular example,laser module 400 generates a single output. - In this example, surface-
emitter 404 comprises a plurality of vertical-cavity surface-emitters that produce diffraction-limited Gaussian beams of infrared (IR) light; however, any suitable device that emits light that may be used directly or indirectly by a light modulator may be used. - In this example, the IR output from surface-
emitter 404 is folded 90 degrees, as indicated byreference number 422, and polarized byoptical element 406.Optical element 406 comprises a total internal reflection (TIR) prism. Although this example uses a TIR prism, other reflective elements may be used without departing from the scope of the present disclosure. - In this example, the IR output from
optical element 406 passes through afrequency converter 408, which converts at least a portion of the IR beam into visible light. In this example,selective reflector 412 is capable of transmitting specific frequencies of visible light converted withinfrequency converter 408, while reflecting other frequencies of light.Laser module 400 outputs the visible light transmitted throughselective reflector 412, as indicated byreference number 426. - In this example, light reflected from
selective reflector 412 returns back throughfrequency converter 408. As the IR reflected fromselective reflector 112 returns throughfrequency converter 408, as indicated byreference number 428, at least a portion of the IR beam converts to visible light. - In this example, the light returning from
frequency converter 408 folds 90 degrees withinoptical element 406, as indicated byreference number 422, reflects off surface-emitter 404 and follows the same path as the output from surface-emitter 404. - Although the present invention has been described in several embodiments, a myriad of changes, variations, alterations, transformations, and modifications may be suggested to one skilled in the art, and it is intended that the present invention encompass such changes, variations, alterations, transformations, and modifications as falling within the spirit and scope of the appended claims.
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/507,784 US7339719B1 (en) | 2006-08-22 | 2006-08-22 | Packaging of frequency-doubled, extended-cavity, surface-emitting laser components on a common substrate |
PCT/US2007/076516 WO2008108875A2 (en) | 2006-08-22 | 2007-08-22 | Packaging of frequency-doubled, extended-cavity, surface-emitting laser components on a common substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/507,784 US7339719B1 (en) | 2006-08-22 | 2006-08-22 | Packaging of frequency-doubled, extended-cavity, surface-emitting laser components on a common substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080049299A1 true US20080049299A1 (en) | 2008-02-28 |
US7339719B1 US7339719B1 (en) | 2008-03-04 |
Family
ID=39113129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/507,784 Active US7339719B1 (en) | 2006-08-22 | 2006-08-22 | Packaging of frequency-doubled, extended-cavity, surface-emitting laser components on a common substrate |
Country Status (2)
Country | Link |
---|---|
US (1) | US7339719B1 (en) |
WO (1) | WO2008108875A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080151949A1 (en) * | 2006-12-26 | 2008-06-26 | Seiko Epson Corporation | External-cavity laser light source apparatus and laser light emission module |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7852885B2 (en) * | 2006-11-27 | 2010-12-14 | Seiko Epson Corporation | Light source device and image display apparatus |
JP2008198980A (en) * | 2007-01-15 | 2008-08-28 | Seiko Epson Corp | Laser light source apparatus, illuminating apparatus, image displaying apparatus, and monitoring apparatus |
US8237892B1 (en) | 2007-11-30 | 2012-08-07 | Sipix Imaging, Inc. | Display device with a brightness enhancement structure |
JP5161605B2 (en) * | 2008-02-19 | 2013-03-13 | パナソニック株式会社 | Wavelength converter |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6839365B1 (en) * | 1999-10-28 | 2005-01-04 | Fuji Photo Film Co., Ltd. | Light wavelength converting system |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4809291A (en) * | 1984-11-26 | 1989-02-28 | Board Of Trustees, Of Leland Stanford Jr U. | Diode pumped laser and doubling to obtain blue light |
WO2005031926A2 (en) * | 2003-09-22 | 2005-04-07 | Insight Technologies, Inc. | Diode-pumped microlasers including resonator microchips and methods for producing same |
-
2006
- 2006-08-22 US US11/507,784 patent/US7339719B1/en active Active
-
2007
- 2007-08-22 WO PCT/US2007/076516 patent/WO2008108875A2/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6839365B1 (en) * | 1999-10-28 | 2005-01-04 | Fuji Photo Film Co., Ltd. | Light wavelength converting system |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080151949A1 (en) * | 2006-12-26 | 2008-06-26 | Seiko Epson Corporation | External-cavity laser light source apparatus and laser light emission module |
US7586971B2 (en) * | 2006-12-26 | 2009-09-08 | Seiko Epson Corporation | External-cavity laser light source apparatus and laser light emission module |
Also Published As
Publication number | Publication date |
---|---|
WO2008108875A3 (en) | 2009-01-29 |
US7339719B1 (en) | 2008-03-04 |
WO2008108875A2 (en) | 2008-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102617183B1 (en) | Multi kW Class Blue Laser System | |
US7397829B2 (en) | Vertical external cavity surface emitting laser | |
US7729046B2 (en) | Solid-state laser device with a crystal array | |
US7339719B1 (en) | Packaging of frequency-doubled, extended-cavity, surface-emitting laser components on a common substrate | |
US20120044693A1 (en) | Laser light source apparatus | |
US20200081334A1 (en) | Light source device and projector | |
CA2717476C (en) | Optical module | |
JPH0396906A (en) | Multi-fiber alignment type package for optoelectronics part | |
JP2011523198A (en) | Green light source generation device and portable electronic device provided with laser projection display using the same | |
US20080112455A1 (en) | System and method for packaging optical elements between substrates | |
JP4186058B2 (en) | Laser light source device | |
JP7440492B2 (en) | semiconductor laser equipment | |
Sahm et al. | 4.5 W hybrid integrated master-oscillator power-amplifier at 976 nm on micro-optical bench | |
JP2024058271A (en) | Laser Module | |
KR20140129162A (en) | Laser architectures | |
JP2017219625A (en) | Light source device and projector | |
JP2017220529A (en) | Method for manufacturing light source device, light source device, and projector | |
US20130266032A1 (en) | Laser architectures | |
JP3133097B2 (en) | Harmonic generator | |
JP2021064736A (en) | Semiconductor laser device | |
EP2834890A1 (en) | Laser architectures | |
JPH1154836A (en) | Semiconductor laser equipment | |
CN117477343A (en) | Light emitting device | |
JPH055919A (en) | Higher harmonic generator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: TEXAS INSTRUMENTS INCORPORATED, TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HASKETT, BRADLEY M.;PENN, STEVEN M.;BARTLETT, TERRY A.;REEL/FRAME:018222/0442;SIGNING DATES FROM 20060811 TO 20060814 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 12 |