US20080030719A1 - Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask - Google Patents
Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask Download PDFInfo
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- US20080030719A1 US20080030719A1 US11/896,146 US89614607A US2008030719A1 US 20080030719 A1 US20080030719 A1 US 20080030719A1 US 89614607 A US89614607 A US 89614607A US 2008030719 A1 US2008030719 A1 US 2008030719A1
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- sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
Abstract
A photolithography mask inspection apparatus has at least two sensors. One sensor is configured to sense light transmitted through an object to be inspected, and the other sensor senses light reflected off the object. A first optical system is arranged to expose a first portion of the object with a first light beam, and a second optical system is arranged to expose a second portion of the object, spaced form the first portion, with a second light beam. A third optical system focuses the transmitted light on to the first sensor, as well as the reflected light on to the second sensor. A defect detecting circuit is also provided to detect a defect of the object, based upon image data associated with the reflected and transmitted light.
Description
- This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2003-149336 filed on May 27, 2003, the entire contents of which are incorporated herein by reference.
- The present invention relates to an inspection apparatus having a first sensor to sense a transmitted image of an object to be inspected and a second sensor to sense a reflected image of the object. The present invention is also directed toward a method for inspecting an object, and a method for manufacturing a mask.
- Conventional inspection systems detect defects in an object, such as a semiconductor device or photo-mask (e.g., a photolithography mask) by comparing an image of the object corresponding to light transmitted through the transmitted image of the object with a reference pattern. However, certain defects, such as thin film on a residue on a half-tone film or a minimum pin hole defect, are difficult to detect with such systems. Accordingly, alternative inspection systems having improved performance have been developed which compare a transmitted image of the object with an image of the object corresponding to light reflected off the object.
FIG. 10 is a schematic diagram of an optical system includinginspection apparatus 10 having a first sensor that senses a light transmitted through the object and a second sensor that detects light reflected from the object.Apparatus 10 includes anoptical source 11, which outputs light that passes throughcollector lens 12,half mirror 13 and condenser/objective lens 14 to mask M. Some of the light impinging on mask M is transmitted through the mask, and some is reflected. The transmitted light constitutes an image of mask M that passes through an additionalobjective lens 15, which focuses the light ontosensor 16. In addition, light reflected off mask M (the reflected image) passes back throughlens 14, and is further reflected offmirror 13 tosecond sensor 17.Lens 14 is configured to focus the reflected light ontosensor 17. Defects are then detected based on the outputs ofsensors FIG. 10 , mask M is positioned betweenlenses -
FIG. 11 illustrates a schematic diagram of an alternative conventionalmask inspection apparatus 20 having atransmission light source 21 and areflection light source 29. Light emitted fromsource 21 passes throughlens 22 and is reflected offmirror 23, which directs the light to mask M throughcondenser lens 24. Light passing through mask M also passes throughobjective lens 25 andhalf mirror 26, and is focused by image-forminglens 27 ontosensor 28. - Light emitted by
reflection source 29 passes throughlens 30, and is reflected offmirror 26 to mask M throughobjective lens 25. Light reflected off mask M passes back throughlens 25, and is transmitted throughhalf mirror 26, and then focused ontosensor 28 with image-forminglens 27. As further shown inFIG. 11 , mask M, under inspection, is arranged betweencondenser lens 24 andobjective lens 25. - In addition, both the transmitted image and the reflected image of mask M are sensed by
single sensor 28. Defects are detected based on an output ofsensor 28.FIG. 12 illustrates a schematic diagram of another conventional optical system including amask inspection apparatus 40, which exposes the mask to laser light having a relatively short wavelength, and identifies defects based on sensing both reflected and transmitted images of an object.Apparatus 40 includes alaser light source 41, beam expander 42, a conventionalspeckles reduction system 43, acollector lens 44, and ahalf mirror 45.Speckles reduction system 43 minimizes speckles, as described in which is disclosed in Japanese Patent Disclosure (kokai) No. 10-178300.Half mirror 45 separates laser light output fromsource 41 into a first laser beam which propagates along an optical path R, and a second laser beam which propagates along an optical path Q. The first laser beam travels along an optical path R includingcollector lens 46,mirror 47,condenser 48,objective lens 49 and ahalf mirror 50, and the second laser beam is reflected bymirror 51 tocondenser lens 52 provided along optical path Q. The second laser beam is then reflected bymirror 50 toward mask M throughlens 49. - In operation, the transmitted image of mask M, corresponding to a portion of the first laser beam transmitted through mask M, passes through lens 9 and
half mirror 50. The transmitted image is next focused bylens 53 onto sensor 54, which are provided on a transmission surface side ofhalf mirror 50. In addition, the second beam is reflected off mask M back throughlens 49,half mirror 50 andlens 53. The reflected second beam off mask M constitutes a reflected image of the mask, which is focused bylens 53 onto sensor 54. Defects are then located based on the sensed transmitted and reflected images. -
FIG. 13 illustrates an additional conventional optical system including inspectingapparatus 60 having a laser light source 61.Apparatus 60 can also sense both reflected and transmitted images of an object. Inapparatus 60, however, a polarization plane of a light beam transmitted through the mask is rotated by 90 degrees relative to light beam reflected by the mask. - As further shown in
FIG. 13 ,mask inspecting apparatus 60 is provided with a laser light source 61, a beam expander 62, aspeckles reducing system 63, acollector lens 64, and ahalf mirror 65. Speckles, which are caused by optical interference in the S-polarized laser beam are reduced byspeckles reducing system 63 after being expanded in diameter by beam expander 62. -
Half mirror 65 separates a laser beam from laser light source 61 into a first S-polarized laser beam propagating along an optical path R, and a second P-polarized laser beam traveling along an optical path Q. Optical path R includes λ/4wavelength plate 66,collector lens 67,mirror 68,condenser lens 69,objective lens 70, an additional λ/4wavelength plate 71 andhalf mirror 72, and optical path Q includes λ/2wavelength plate 73,mirror 74,condenser lens 75. A laser beam propagating along optical path Q enters a reflection surface ofhalf mirror 72 and is reflected to mask M through λ/4plate 71 throughlens 70. The first laser beam, after passing through mask M along path R, constitutes a transmitted image of the mask, which is focused ontomirror 72 via λ/4plate 71. Moreover, the second beam forms a reflected image of mask M after reflection off mask M. The reflected image is also focused ontomirror 72 through λ/4plate 71 bylens 70. - Both the reflected and transmitted images pass through half-
mirror 72, and then to polarization beam splitter (PBS) 76, which separates and reflects the P-polarized second beam tosensor 80 through image-forminglens 79. In addition, PBS 76 directs the S-polarized first laser beam tosensor 78 vialens 77. - Accordingly,
sensor 78 senses the transmitted image, andsensor 80 receives the reflected image of mask M, which is provided betweencondenser lens 69 andobjective lens 70. Defects are then determined based on the sensed transmitted and reflected images of mask M. - A further inspecting system is disclosed in Japanese Patent Disclosure (kokai) No. 6-294750, which also simultaneously generates transmitted and reflected images, but uses a beam scanning method. Japanese Patent Disclosure (kokai) No. 10-123059, obtains a reflected and transmitted images of an object by switching at a high speed between two light sources, one being a transmission light source, and the other a reflection light source.
- The mask inspection systems described above, however, suffer from various shortcomings, as discussed below.
Inspection systems 20 and 40 (FIGS. 11 and 12 ) have a single sensor, which detects both transmitted and reflected images. These systems can be configured to alternately sense the transmitted and reflected images with sensor 28 (FIG. 11 ) or sensor 54 (FIG. 12 ), but typically require twice as much time to detect defects in mask M than the system shown inFIG. 10 having only one sensor. -
Inspection systems FIG. 10 illustrating an inspection system that only senses the transmitted image). However, simultaneous detection of the reflected and transmitted images requires that the two images be combined or added to one another to form a composite image. When combined, the transmitted and reflected images can interfere and cancel the defect signal with one another, thereby creating so-called “dead zones” in the composite image where defects many not be detected. - The mask inspecting systems shown in
FIGS. 10 and 13 overcome the above-described drawbacks of single sensor-based detection. These systems, however, require complex optics for focusing the transmitted and reflected image optics on to corresponding sensors. In addition, simultaneous sensing of reflected and transmitted images is further complicated by different optical systems i.e., the transmitted and reflected optics include different components, which create different distortions in the sensed transmitted and reflected images. In addition, these differences may cause the reflected and transmitted images to be magnified differently. - Beam scanning inspection techniques have also been developed whereby a laser beam is scanned across a photolithography mask, and light reflected from exposed portions of the mask is detected. In order to finely resolve narrow mask patterns, however, relatively short wavelengths of laser light are required. Such light, however, is more energetic than lower wavelength light, and can damage the photolithography mask, especially if the laser light wavelength is less 250 nm.
- In addition, in the system shown in
FIG. 11 , transmission andreflection light sources sources - One aspect of the present invention is an apparatus. The apparatus has a first optical system configured to expose a first portion of the object with a first light beam, and a second optical system configured to expose a second portion of the object with a second light beam. The second portion of the object being substantially spaced from the first portion. The apparatus comprises a first sensor configured to sense a transmitted image of the first portion of the object. The transmitted image corresponds to a portion of the first light beam passing through the first portion of the object, and the first sensor generates first image data in response to the transmitted image. The apparatus also comprises a second sensor configured to sense a reflected image of the second portion of the object, the reflected image corresponding to a portion of the second light beam reflected off the second portion of the object. The second sensor generates second image data in response to the reflected image. A third optical system is provided which is configured to focus the transmitted image on to the first sensor, and focus the reflected image on to the second sensor. In addition a defect detecting circuit is provided which is configured to detect a defect of the object based upon the first and second image data.
- Another aspect of the present invention is a method for inspecting an object. The method includes steps of exposing a first portion of the object with a first light beam, and exposing a second portion of the object with a second light beam the second portion being spaced from the first portion. In a further step, the transmitted image of the mask is sensed with a first sensor , the transmitted image corresponding to a portion of the first light beam passing through the object. The method also includes a step sensing a reflected image of the mask with a second sensor, the reflected image corresponding to a portion of the second light beam reflected off the object, and a step of identifying defects associated with the object based upon the transmitted and reflected images.
- In accordance with a further aspect of the present invention, a method of manufacturing a mask is provided Comprising steps of fabricating a mask by forming a pattern on a substrate, and inspecting the mask. The inspection step comprises the object inspection steps described above.
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FIG. 1 is a schematic diagram of amask inspection apparatus 100 consistent with an aspect of the present invention; -
FIG. 2A shows an optical path of a light beam emitted from alight source 111 when afirst aperture 114 is removed from firstoptical system 110 consistent with a further aspect of the present invention. -
FIG. 2B shows an optical path of a light beam emitted from alight source 111 when afirst aperture 114 is arranged along the optical path, in accordance with an aspect of the present invention; -
FIG. 3 shows an optical path formed by formingoptics 130; -
FIG. 4A is a side view showing a mask M, formingoptics 130 and asensor device 140, in accordance with an additional aspect of the present invention; -
FIG. 4B is a rear view ofsensor device 140 consistent with an aspect of the present invention; -
FIG. 5 shows a relationship between a moving direction E of mask M and a first andsecond sensors -
FIGS. 6A and 6B shows a pattern “A” of mask M, which is sensed by both the first andsecond sensors -
FIG. 7 shows a schematic view of anexemplary processor 150 and adefect detecting circuit 160 in connection with the apparatus shown inFIG. 1 ; -
FIG. 8A shows image data output fromfirst sensor 142 consistent with an aspect of the present invention; -
FIG. 8B shows image data output fromsecond sensor 143 consistent with an aspect of the present invention; -
FIG. 9 is a diagram of amask inspection apparatus 200, consistent with a further aspect of the present invention; -
FIG. 10 shows a schematic view of a conventional inspectingapparatus 10 having two sensors; -
FIG. 11 shows a schematic diagram of a conventional inspectingapparatus 20 having two light sources; -
FIG. 12 shows a schematic diagram of a conventional inspectingapparatus 40 having a laser light sources. -
FIG. 13 shows a schematic diagram of a conventional inspectingapparatus 60 having laser light sources and two sensors. - Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
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FIG. 1 shows a schematic diagram of amask inspection apparatus 100 for inspecting a mask M.Mask inspection apparatus 100 includes a first and secondoptical systems Optical system 120 includesimaging optics 130, asensor device 140 for sensing both transmitted and a reflected images, aprocessor 150 for processing image data output fromsensor device 140, and defect detectingcircuit 160 for detecting a defect in mask M. -
Optical system 110 includes a transmission light source (first light source) 111, which emits a light beam T. A pair ofcollector lenses first aperture 114 provided there between. Light beam T first passes throughcollector lens 112 and a portion of the beam (typically about half) is blocked. A remaining portion of light beam T next passes throughcollector lens 113.System 110 also includes amirror 115 for directing light beam T toward mask M, and acondenser lens 116 for projecting light beam T onto a portion of mask M. Since half of beam T is blocked byaperture 114, approximately half of the area which would have been exposed by beam T withoutaperture 114, is exposed by the remaining portion of beam T. A portion of beam T passing through mask M constitutes a partial transmitted image of the mask. - Second
optical system 120 includes a reflection light source (second light source) 121 that outputs light beam H. A pair ofcollector lenses second aperture 124 provided there between. After passing throughcollector lens 122, a portion, typically about half, of beam H is blocked by asecond aperture 124. Accordingly, as discussed below, about half of the area which would have been exposed by light T withoutaperture 124, is exposed by beam H on a side of mask M opposite the side exposed by beam T. - Imaging optics (third optical system) 130 is provided with an
objective lens 131, ahalf mirror 132 and an image-forminglens 133.Objective lens 131, functioning as a condenser lens, projects the unblocked portion of beam H onto mask M.Objective lens 131 also enlarges an optical image of mask M by refracting a portion of light beam H reflected off mask M, and a portion of light beam T which passes through mask M. -
Half mirror 132 directs the remaining portion of light beam H toward mask M, where a further portion of the beam is reflected off mask M. Light reflected off mask M constitutes a partial reflected image of the mask corresponding to a reflected partial image of the mask. - Next,
objective lens 131 enlarges the partial reflected and transmitted images of mask M by refracting both portions of light beam H reflected off mask M and light beam T which passes through mask M, and the partial reflected and transmitted images next pass throughhalf mirror 132, and the partial reflected and transmitted images of mask M are focused ontosensor device 140, including first andsecond sensors lens 133. - As shown in
FIGS. 6A and 6B ,sensor device 140 includesbase 141, andfirst sensor 142 secured to base 141 for sensing the transmitted partial image corresponding to a portion of light beam T. Asecond sensor 143 is also secured to base 141 for sensing the partial reflected image corresponding to a portion of light beam H. The sensors typically include conventional time delay integration (TDI) sensors, but other known sensors can be used, such as area or line -sensors(e.g., an one-dimensional sensor), can be used as well instead of the TDI sensor. - First and
second sensors Sensor device 140 can be assembled by manufacturingsensors base 141. Optionally, one sensor may be provided ontobase 141, and the second sensor may be positioned ontobase 141 at a location relative to the first sensor. Alternatively, the two sensors may be integrally manufactured adjacent one another on the same wafer, integrally cut by a dicing cutter, and mounted onbase 141. -
FIG. 7 illustratesprocessor circuit 150 in greater detail.Processor 150 is electrically connected to both a first drive/AD-conversion circuit 151 and a second drive/AD-conversion circuit 152.First circuit 151 drivesfirst sensor 142, and converts an analog image signal fromsensor 142 into digital image data.Second circuit 154 drivessecond sensor 143, and converts an analog image signal fromsensor 143 into digital image data. -
Processor 150 includes afirst compensation circuit 152, asecond compensation circuit 155 and adelay circuit 153.First compensation circuit 152 compensates output characteristics of image data fromcircuit 151 by adjusting gain, offset and other suitable parameters associated with the output of first drive/AD conversion circuit 151. In addition,second compensation circuit 155 compensates output characteristics of image data fromcircuit 154 by adjusting gain, offset and other suitable parameters associated with the output of second drive/AD conversion circuit 154.Delay circuit 153 delays image data obtained bysensor 142 so as to output the image data at substantially the same time as with image data obtained bysecond sensor 143. - The operation of
mask inspection apparatus 100 will next be explained. - First, mask M to be inspected is set in a predetermined position. Transmission and reflection
light sources - In the example above, about half of light beam T is blocked by
aperture 114, resulting in about half of the area which would have been exposed in the absence ofaperture 114, being exposed. Such partial exposure will next be described in greater detail with reference toFIGS. 2A and 2B . -
FIG. 2A shows an optical path of a light beam emitted fromlight source 111 withoutaperture 114, whereby mask M is exposed through Koehler illumination.FIG. 2B shows an optical path of a light beam emitted fromlight source 111 in whichaperture 114 is provided betweenlenses FIG. 1 . - As further seen in
FIG. 2A ,light source 111 emits a light beam, which is focused withcollector lenses condenser lens 116.Light source 111 can be considered as a collection of individual point source emitters, each of which outputting a corresponding light beam. Light beams emitted from each emission point of one single light source expose the same area on mask M under Koehler illumination. Therefore, it is possible to reduce an exposed area on mask M by arranging an aperture at a conjugated position of the projection plane. -
FIG. 2B illustrates emission fromlight source 111 whenfirst aperture 114 is provided along an optical path betweenlenses FIG. 2B , half of the area which would have been exposed under noaperture 114, is exposed by arrangingaperture 114 to shield or block half the emitted light at the conjugated position of the projection plane. In a similar fashion, light beam H is blocked byaperture 124 to result in exposure of half of the area which would have been exposed under noaperture 114. The exposed area is opposite the surface exposed by a portion of beam T. - Accordingly, both partial transmitted and reflected images of mask M are enlarged by a single
objective lens 131 since the area (first portion) exposed by firstoptical system 110, is spaced from the area (second portion) exposed by secondoptical system 120. The partial transmitted image of mask M (propagating along a path represented by a solid line inFIG. 3 ) is focused ontofirst sensor 142 byimage forming lens 133, which also focuses the partial reflected image (propagating along a path represented by a dashed line inFIG. 3 )ontosecond sensor 143. As further shown inFIG. 3 , the partial transmitted and reflected images are spatially close to one another in plane X wherelens 131 is located and may overlap. -
FIGS. 4A and 4B show a relationship between locations ofsensors -
FIG. 4A is a side view showing mask M, formingoptics 130 andsensor device 140, rotated counterclockwise from the view shown in figure ofFIG. 3 by 90 degrees, andFIG. 4B is a rear view ofsensor device 140 from a perspective ofsensor 140 receiving portions of beams T and H. - When a right portion of mask M is exposed by light beam T, the partial transmitted image which is enlarged by
objective lens 13 is focused onfirst sensor 142. At the same time, a left portion of mask M exposed by light beam H, is focused onsecond sensor 143. Each of the exposed areas of mask M is spaced apart from one another by a relatively small amount, or may overlap, andsensors imaging optics 130 can focus both images on each of the sensors. - Accordingly,
apertures Sensor device 140 andsensors -
FIG. 5 shows a relationship between a moving direction of mask M, represented by arrow E inFIG. 5 , andsensor device 140. First andsecond sensors first sensor 142, and then a reflected image of the same portion of mask M is sensed bysecond sensor 143. - For example, as shown in
FIG. 6A , a transmittedimage 610 of a pattern “A” in mask M is first sensed byfirst sensor 142 as shown inFIG. 6A . Then, areflected image 620 of the pattern “A” is sensed bysecond sensor 143, as shown inFIG. 6B . In a similar fashion, all the patterns contained in mask M are scanned with light beams H and T by moving mask M in horizontal directions. - Returning to
FIG. 7 , image signals output from first andsecond sensors circuits circuit -
Delay circuit 153 delays an output of image data of a transmitted image to coincide with the image data of a corresponding reflected image. As a result, the delay time depends on the distance betweensensors circuit 160 at substantially the same time. - Moreover, since first and
second sensors sensors imaging optics 130. -
FIG. 8A shows image data output fromfirst sensor 142, andFIG. 8B shows an image data output fromsecond sensor 143. Even though both image data correspond to the same mask pattern, the image data is different, because signal intensity is reversed between a transmitted and reflected images. - A transmitted image of a minimum pin hole defect may not have a sufficient signal level or intensity to be detected. However, a reflected image of the minimum pin hole defect has an adequate signal level, and is thus detectable based on the partial reflected image of mask M.
- As discussed above, detection based on both transmitted and reflected images is more accurate than detection based on either image alone. In the first embodiment explained above,
imaging optics 130 focuses both a partial transmitted image onfirst sensor 142 and a partial reflected image onsecond sensor 143. Accordingly, mask M can be inspected based on detection of both reflected and transmitted images at the same time after sensor output delays image data output fromfirst compensation circuit 152 corresponding tosensor 142, for example. In addition, both reflected and transmitted images are subject to the same distortions and defects ofcommon imaging optics 130, thereby minimizing variations between the images that would otherwise occur if the images were sensed by separate optics. In view of the foregoing, defects can be detected and a high quality mask can be manufactured by inspecting the mask with theapparatus 100 following mask fabrication. -
FIG. 9 illustrates a schematic diagram of amask inspection apparatus 200 consistent with a second embodiment of the present invention. The same reference characters are used to label the same or similar features of in bothinspection apparatus 100 andinspection apparatus 200. -
Mask inspection apparatus 200 is provided with alaser source 201 to expose an object, such as mask M instead of transmission and reflectionlight sources FIG. 1 .Apparatus 200 also includes abeam expander 202 and aspeckles reducing system 203. In addition,apparatus 200 includes anoptical system 210 instead of secondoptical system 120. Further,optical system 210 includeshalf mirror 211,second aperture 212, a pair ofcollector lenses mirror 215. -
Half mirror 211 separates a laser beam emitted fromlight source 201 into laser beams for generating the transmitted and reflected images.Half mirror 132 directs laser beam H toward mask M, after laser beam H passes throughcollector 214. - Operation of
mask inspection apparatus 200 will next be explained. - A laser beam passes through
beam expander 202 andspeckles reducing system 203 is separated into laser beam T and laser beam H byhalf mirror 211. Transmitted image of mask M is formed with laser beam T, and an exposed area of light beam H is reduced bysecond aperture 212. After passing throughsecond aperture 212, light beam H exposes mask M to form a reflected image of mask M. - A transmitted image and a reflected image of mask M are sensed by
sense device 140 viaimage optics 130, as inapparatus 100. A defect contained in mask M is detected byprocessor 150 and defect detectingcircuit 160. - In
mask inspection apparatus 200, a singlelight source 201 can be used to inspect mask M and has substantially the same advantages asapparatus 100 discussed above. - In addition to photolithography masks, other objects may be inspected. For example, any optical pattern or a flat display panel can be inspected with either
apparatus - As described above, apertures are used to block beams portions T and H to partially expose regions of mask M. The present invention, however, also contemplates exposing portions of a mask or other object with beams which have not been blocked by an aperture or other opaque device.
- In addition, an area irradiated or exposed by light beam T and an area irradiated or exposed by light beam H, may have a small amount of overlap. In this invention, “spaced from” means separated or spaced from, as well as minimal overlap. Accordingly, images associated with beams T and H can be spaced from one another and minimally overlap one another as well. In addition the areas exposed by these beams may be separated or spaced from one another, and can also minimally overlap.
- Numerous modifications of the present invention are possible in light of the above teachings. It is therefore to be understood that, within the scope of the appended claims, the present invention can be practiced in a manner other than as specifically described herein.
Claims (20)
1. An apparatus configured to inspect an object, said apparatus comprising:
a first optical system configured to expose a first portion of the object with a first light beam;
a second optical system configured to expose a second portion of the object with a second light beam, the second portion of said object being substantially spaced from said first portion;
a first sensor configured to sense a transmitted image of said first portion of said object, said transmitted image corresponding to a portion of said first light beam passing through said first portion of said object, and generate first image data in response to said transmitted image;
a second sensor configured to sense a reflected image of said second portion of said object, said reflected image corresponding to a portion of said second light beam reflected off said second portion of said object, and generate second image data in response to said reflected image;
a third optical system configured to focus said transmitted image on to said first sensor, and focus the reflected image on to the second sensor; and
a defect detecting circuit configured to detect a defect of said object based upon said first and second image data.
2. (canceled)
3. An apparatus according to claim 1 , wherein the first sensor and the second sensor include time delayed integration sensors.
4. An apparatus according to claim 1 , wherein the first sensor and the second sensor include one-dimensional sensors.
5. An apparatus according to claim 1 , wherein the first sensor and the second sensor include area-sensors.
6. (canceled)
7. An apparatus according to claim 1 , wherein the first sensor and the second sensor are positioned relative to one another.
8. (canceled)
9. (canceled)
10. An apparatus according to claim 1 , further comprising a light source configured to supply first optical energy corresponding to said first light beam, and second optical energy corresponding to said second light beam.
11. A method for inspecting an object, comprising:
exposing a first portion of said object with a first light beam;
exposing a second portion of said object with a second light beam, the second portion being spaced from the first portion;
sensing a transmitted image of a mask with a first sensor, said transmitted image corresponding to a portion of said first light beam passing through said object;
sensing a reflected image of the mask with a second sensor, said reflected image corresponding to a portion of said second light beam reflected off said object; and
outputting signals representing data of the transmitted and reflected images so as to detect defects associated with said object based upon said transmitted and reflected images.
12. (canceled)
13. A method for inspecting an object according to claim 11 , wherein the first sensor and the second sensor include time delay integration sensors.
14. A method for inspecting an object according to claim 11 , wherein said first sensor and said second sensor include one-dimensional sensors.
15. A method for inspecting an object according to claim 11 , wherein the first sensor and the second sensor include area-sensors.
16. (canceled)
17. A method for inspecting an object according to claim 11 , wherein the first sensor and the second sensor are positioned relative to one another.
18. (canceled)
19. (canceled)
20. A method of manufacturing a mask comprising:
fabricating the mask by forming a pattern on a substrate;
inspecting the mask, said inspecting comprising:
exposing a first portion of the mask with a first light beam;
exposing a second portion of the mask with a second light beam, the second portion being spaced from the first portion;
sensing a transmitted image of the mask with a first sensor, said transmitted image corresponding to a portion of said first light beam passing through said mask;
sensing a reflected image of the mask with a second sensor, said reflected image corresponding to a portion of said second light beam reflected off said mask; and
outputting signals representing data of the transmitted and reflected images so as to detect defects in said mask based on said transmitted and reflected images.
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US11/896,146 US20080030719A1 (en) | 2003-05-27 | 2007-08-30 | Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask |
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JPJP2003-149336 | 2003-05-27 | ||
JP2003149336A JP2004354088A (en) | 2003-05-27 | 2003-05-27 | Inspection device and mask manufacturing method |
US10/852,434 US7304730B2 (en) | 2003-05-27 | 2004-05-25 | Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask |
US11/896,146 US20080030719A1 (en) | 2003-05-27 | 2007-08-30 | Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask |
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US10/852,434 Division US7304730B2 (en) | 2003-05-27 | 2004-05-25 | Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask |
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US10/852,434 Active 2025-04-01 US7304730B2 (en) | 2003-05-27 | 2004-05-25 | Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask |
US11/896,146 Abandoned US20080030719A1 (en) | 2003-05-27 | 2007-08-30 | Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask |
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US10/852,434 Active 2025-04-01 US7304730B2 (en) | 2003-05-27 | 2004-05-25 | Inspection apparatus having two sensors, method for inspecting an object, and a method for manufacturing a photolithography mask |
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US20110050884A1 (en) * | 2009-08-28 | 2011-03-03 | Krones Ag | Apparatus and method for inspecting labeled containers |
CN102004108A (en) * | 2009-08-28 | 2011-04-06 | 克朗斯股份公司 | Device and method for inspecting labelled containers |
US8581977B2 (en) | 2009-08-28 | 2013-11-12 | Krones Ag | Apparatus and method for inspecting labeled containers |
Also Published As
Publication number | Publication date |
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JP2004354088A (en) | 2004-12-16 |
US20050002020A1 (en) | 2005-01-06 |
US7304730B2 (en) | 2007-12-04 |
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