US20070272590A1 - Packaging structure - Google Patents
Packaging structure Download PDFInfo
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- US20070272590A1 US20070272590A1 US11/583,167 US58316706A US2007272590A1 US 20070272590 A1 US20070272590 A1 US 20070272590A1 US 58316706 A US58316706 A US 58316706A US 2007272590 A1 US2007272590 A1 US 2007272590A1
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- United States
- Prior art keywords
- packaging structure
- semiconductor elements
- flexible film
- container
- contacting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Definitions
- the invention relates in general to a packaging structure, and more particularly to a packaging structure capable of packaging display panels of various sizes.
- the invention achieves the above-identified object by providing a packaging structure used for packaging at least two semiconductor elements.
- the packaging structure includes a flexible film.
- the flexible film has a contacting surface.
- the at least two semiconductor elements are placed on the contacting surface.
- the contacting surface has slight stickiness, such that the positions of the at least two semiconductor elements relative to the positions of the contacting surface are held.
- the invention achieves the above-identified object by providing a packaging structure used for packaging semiconductor elements.
- the packaging structure includes a first container, a second container, a first flexible film, a buffer material and a second flexible film.
- the first container and the second container are assembled together to form an accommodation space.
- the first flexible film is positioned inside the accommodation space.
- the first flexible film has a first contacting surface.
- the at least two first semiconductor elements are placed on the first contacting surface.
- the first contacting surface has slight stickiness, such that the positions of the at least two first semiconductor elements relative to the positions of the first contacting surface are held.
- the buffer material is positioned on the at least two first semiconductor elements.
- the second flexible film is positioned on the buffer material.
- the second flexible film has a second contacting surface.
- the at least two second semiconductor elements are placed on the second contacting surface.
- the second contacting surface has slight stickiness, such that the positions of the at least two second semiconductor elements relative to the positions of the second contacting surface are
- the invention achieves the above-identified object by providing a packing structure for accommodating a number of electronic components.
- the packaging structure includes a first container and a first flexible film disposed in the first container.
- the first film has a number of first sticky portions for contacting with the electronic components.
- FIG. 1 is an exploded diagram of a packaging structure of the invention
- FIG. 2 is an assembly diagram of the packaging structure of the invention
- FIG. 3 is an enlarged diagram of the packaging structure of the invention assembled with a semiconductor element
- FIG. 4 is an exploded diagram of another packaging structure of the invention.
- the packaging structure 100 includes a first container 110 , a second container 160 , a first flexible film 120 , two buffer, such as buffer materials 130 and 150 , and a second flexible film 140 .
- the first container 110 and the second container 160 are assembled together to form an accommodation space.
- the first flexible film 120 is positioned inside the accommodation space.
- the first container 110 and the second container 160 are made of materials such as EPP, hard plastic and metal that have supporting strength and cannot be over-deformed.
- the connecting mechanism between the first container 110 and the second container 160 is preferably a mountable structure such that the first container 110 and the second container 160 are firmly coupled.
- the first flexible film 120 has a first contacting surface 122 with a plurality of first sticky portions 124 formed thereon.
- a plurality of electronic components, such as first semiconductor elements 10 (striped blocks) contact with the first sticky portions 124 .
- the first sticky portions 124 have slight stickiness and fixes the plurality of first semiconductor elements 10 on the first contacting surface 122 , so that the number of first semiconductor elements 10 are prevented from colliding with each other during horizontal shift or vibration.
- the first semiconductor elements 10 are fixed on the first contacting surface 122 . That is say the number of first elements 10 are held relative to each other because the number of first semiconductor elements 10 are held by the stickiness of the first sticky portions 124 .
- first sticky portions 124 of the flexible film 120 have slight stickiness, once the first semiconductor elements 10 are placed on the first sticky portions 124 of the flexible film 120 , and under normal packaging process without any particular force being applied to the number of first semiconductor elements 10 , the relative positions between the number of first semiconductor elements 10 and the first contacting surface 122 of the flexible film 120 are held. When a force is applied or the gravity gravitational direction of the first semiconductor element 10 realative to the flexible film 120 changes so that departing force occurs between the number of first semiconductor elements 10 and the first sticky portions 124 of the flexible film 120 , the number of first semiconductor elements 10 is separated from the first contacting surface 122 of the flexible film 120 .
- the first sticky portions 124 have slight stickiness.
- the buffer material 130 is positioned on the number of first semiconductor elements 10
- the second flexible film 140 is positioned on the buffer material 130 .
- the buffer material 130 evenly spreads the stress coming from top lest the stress might be concentrated at a particular position and cause damage to the number of first semiconductor elements 10 .
- the materials of the buffer material include expandable polyethylene (EPE).
- the second flexible film 140 has a second contacting surface 142 with a number of second sticky portion 144 formed thereon, a number of second semiconductor elements 20 are placed on the second sticky portion 144 , and then the number of electronic components, such as second semiconductor elements 20 (striped blocks) are covered by a buffer layer 150 .
- the second sticky portion 144 also have slight stickiness, so that the number of second semiconductor elements 20 are fixed on the second contacting surface 142 and will not collide with each other during horizontal shift.
- the standard of the slight stickiness requested of the second sticky portion 144 is similar to the standard of the slight stickiness requested of the first sticky portion 124 .
- the number of first semiconductor element 10 and the number of second semiconductor element 20 are display panels, and more particularly are small-sized liquid crystal display (LCD) panels or organic light emitting diode (OLED) display panels.
- the packaging structure can be used to protect other fragile structures such as glass substrate, silicon wafer or chip.
- FIG. 2 an assembly diagram of the packaging structure of the invention is shown.
- the flexible film 120 , the number of first semiconductor elements 10 , the buffer material 130 , the second flexible film 140 , the number of second semiconductor elements 20 and the buffer material 150 are sequentially positioned inside the accommodation space formed by the first container 110 and the second container 160 .
- the stacked structure of the semiconductor elements in FIG. 2 is exemplified by two layers.
- the stacked structure is not limited to two layers of semiconductor elements.
- the semiconductor elements can be stacked to as many layers as the safety range of vertical stress permits.
- the stacking of semiconductor elements can be adjusted to further enhance the protection of the semiconductor elements by either adjusting the size of the accommodation space formed by the first container 110 and the second container 160 or by providing a suitable buffer material.
- the number of first semiconductor elements 10 and the number of second semiconductor elements 20 are respectively placed on the contacting surface 122 and the contacting surface 142 , the number of first semiconductor elements 10 and the number of second semiconductor elements 20 , as shown in FIG. 1 , can be arranged correspondingly, interlacingly or partially overlapped in the normal direction of the contacting surface 122 or the contacting surface 142 .
- the first semiconductor element 10 and the second semiconductor element 20 are arragned partially overlapped in vertical direction.
- the packaging structure 100 may include the first container 110 , the first flexible film 120 , the second flexible film 140 , the buffer material 150 , and the second container 160 arranged in the same order. In another case, the packaging structure 100 may only include the first container 110 , the first flexible film 120 with the buffer material 130 formed thereon, and the second container 160 arranged in the same order.
- the semiconductor elements placed on the same contacting surface can have the same or different sizes.
- the semiconductor elements packaged on the same or different layers can have different structures. Examples of the semiconductor elements include display panel, glass substrate, silicon wafer or chip.
- the packaging structure can also be used to protect other fragile structures.
- FIG. 3 an enlarged diagram of the packaging structure of the invention assembled with a semiconductor element is shown.
- a semiconductor element 1 is placed on the contacting surface 122 of the flexible film 120 .
- the first sticky portion 124 of the contacting surface 122 have slight stickiness, so the semiconductor element 1 is fixed on the contacting surface 122 and will not collide with other semiconductor elements during horizontal shift.
- the semiconductor element 1 creates a recess on the flexible film 120 by the weight of the semiconductor element 1 and forms a wrapping structure with the buffer material 130 . Thus, the semiconductor element 1 is protected and wrapped within.
- the flexible film 120 and the buffer material 130 may contact or non-contact each other.
- the thickness of the flexible film when the thickness of the semiconductor element ranges from 0.6 mm to 1.2 mm, the thickness of the flexible film can range from 0.1 mm to 0.5 mm, the thickness of the buffer material can be larger than 0.5 mm or range from 0.5 mm to 2.0 mm, and the stickiness of the flexible film can range from 1 N/20 mm to 10 N/20 mm.
- the thickness of the flexible film can be increased to be ranging from 0.5 mm to 2.0 mm, and under such circumstance, the buffer material can be dispensed with.
- the thickness disclosed above is only for the purpose of exemplification. In practical application, the thickness can be adjusted according to the characteristics of the packaging materials, the size, the fragility and other factors of the structure to be packaged. If the overall thickness is not limited, the thickness of the packaging materials can be further increased.
- FIG. 4 an exploded diagram of another packaging structure of the invention is shown.
- the main difference between the packaging structure 200 and the packaging structure 100 is the first flexible film 220 and the second flexible film 240 .
- flexible films 120 , 140 , 220 and 240 may be replaced with each other.
- the whole first contacting surface 222 and the whole second contacting surface 242 have stickiness, not only in particular portions of the first flexible film 220 and the second flexible film 240 .
- Such the first semiconductor elements 10 and the second semiconductor elements 20 can be arranged more freely.
- a wrapping structure formed by a flexible film with slight stickiness and a buffer material is used to fix and protect multiple semiconductor elements, and more particularly is applicable to the package of small-sized display panels.
- the packaging structure being flexible and having temporary shapes is applicable to semiconductor elements of various sizes.
- the packaging material can fit semiconductor elements of various sizes without having to be manufactured according to the size of a semiconductor element.
- the container for accommodating the semiconductor elements is recyclable, environmentally friendly and economically.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packaging Frangible Articles (AREA)
- Buffer Packaging (AREA)
- Packages (AREA)
Abstract
A packaging structure is provided. The packaging structure is used to package at least two semiconductor elements. The packaging structure includes a flexible film. The flexible film has a contacting surface. The at least two semiconductor elements are placed on the contacting surface. The contacting surface has slight stickiness such that the positions of the at least two semiconductor elements relative to the contacting surface can be held.
Description
- This application claims the benefit of Taiwan Patent Application No. 95118840, filed May 26, 2006, the subject matter of which is incorporated herein by reference.
- 1. Field of the Invention
- The invention relates in general to a packaging structure, and more particularly to a packaging structure capable of packaging display panels of various sizes.
- 2. Description of the Related Art
- Along with the advance in the manufacturing technology of display devices, large scaled production for display panels of various sizes has been realized. During the process of delivery or transport, a large amount of packaging materials are needed to protect the display panels. Therefore, a considerable portion of costs in the assembly and delivery of the display panels are dedicated to packaging materials and packaging method.
- It is therefore an object of the invention to provide a packaging structure not only capable of fixing display panels of various sizes simply by adhering but also can be stacked together. Thus, there is no need for the mass production and storage of packaging material, and relevant costs can be reduced.
- The invention achieves the above-identified object by providing a packaging structure used for packaging at least two semiconductor elements. The packaging structure includes a flexible film. The flexible film has a contacting surface. The at least two semiconductor elements are placed on the contacting surface. The contacting surface has slight stickiness, such that the positions of the at least two semiconductor elements relative to the positions of the contacting surface are held.
- The invention achieves the above-identified object by providing a packaging structure used for packaging semiconductor elements. The packaging structure includes a first container, a second container, a first flexible film, a buffer material and a second flexible film. The first container and the second container are assembled together to form an accommodation space. The first flexible film is positioned inside the accommodation space. The first flexible film has a first contacting surface. The at least two first semiconductor elements are placed on the first contacting surface. The first contacting surface has slight stickiness, such that the positions of the at least two first semiconductor elements relative to the positions of the first contacting surface are held. The buffer material is positioned on the at least two first semiconductor elements. The second flexible film is positioned on the buffer material. The second flexible film has a second contacting surface. The at least two second semiconductor elements are placed on the second contacting surface. The second contacting surface has slight stickiness, such that the positions of the at least two second semiconductor elements relative to the positions of the second contacting surface are held.
- The invention achieves the above-identified object by providing a packing structure for accommodating a number of electronic components. The packaging structure includes a first container and a first flexible film disposed in the first container. The first film has a number of first sticky portions for contacting with the electronic components.
- Other objects, features, and advantages of the invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The following description is made with reference to the accompanying drawings.
-
FIG. 1 is an exploded diagram of a packaging structure of the invention; -
FIG. 2 is an assembly diagram of the packaging structure of the invention; -
FIG. 3 is an enlarged diagram of the packaging structure of the invention assembled with a semiconductor element; and -
FIG. 4 is an exploded diagram of another packaging structure of the invention. - Conventionally, most of the packaging structures used for packaging small-sized display panels are placed in a fix-sized container made of plastic such as polystyrene (PS) or expandable polypropylene (EPP). However, as the size of the display panel diversifies, the size of the packaging structure also may need to diversify, not only wasting resources and costs but also requiring a large amount of storage space. Meanwhile, the waste of resources is environmentally unfriendly.
- Referring to
FIG. 1 , an exploded diagram of a packaging structure of the invention is shown. Thepackaging structure 100 includes afirst container 110, asecond container 160, a firstflexible film 120, two buffer, such asbuffer materials flexible film 140. Thefirst container 110 and thesecond container 160 are assembled together to form an accommodation space. The firstflexible film 120 is positioned inside the accommodation space. Thefirst container 110 and thesecond container 160 are made of materials such as EPP, hard plastic and metal that have supporting strength and cannot be over-deformed. The connecting mechanism between thefirst container 110 and thesecond container 160 is preferably a mountable structure such that thefirst container 110 and thesecond container 160 are firmly coupled. The firstflexible film 120 has a first contactingsurface 122 with a plurality of firststicky portions 124 formed thereon. A plurality of electronic components, such as first semiconductor elements 10 (striped blocks) contact with the firststicky portions 124. The firststicky portions 124 have slight stickiness and fixes the plurality offirst semiconductor elements 10 on the first contactingsurface 122, so that the number offirst semiconductor elements 10 are prevented from colliding with each other during horizontal shift or vibration. In the invention, thefirst semiconductor elements 10 are fixed on the first contactingsurface 122. That is say the number offirst elements 10 are held relative to each other because the number offirst semiconductor elements 10 are held by the stickiness of the firststicky portions 124. Since the firststicky portions 124 of theflexible film 120 have slight stickiness, once thefirst semiconductor elements 10 are placed on the firststicky portions 124 of theflexible film 120, and under normal packaging process without any particular force being applied to the number offirst semiconductor elements 10, the relative positions between the number offirst semiconductor elements 10 and the first contactingsurface 122 of theflexible film 120 are held. When a force is applied or the gravity gravitational direction of thefirst semiconductor element 10 realative to theflexible film 120 changes so that departing force occurs between the number offirst semiconductor elements 10 and the firststicky portions 124 of theflexible film 120, the number offirst semiconductor elements 10 is separated from the first contactingsurface 122 of theflexible film 120. The firststicky portions 124 have slight stickiness. After the number offirst semiconductor elements 10 are placed on the firststicky portions 124, it is better to ascertain that when the first contactingsurface 122 is perpendicular to the ground, the number offirst semiconductor elements 10 adhered onto the first contactingsurface 122 will not come off due to their own weight. Thebuffer material 130 is positioned on the number offirst semiconductor elements 10, and the secondflexible film 140 is positioned on thebuffer material 130. Thebuffer material 130 evenly spreads the stress coming from top lest the stress might be concentrated at a particular position and cause damage to the number offirst semiconductor elements 10. In the present embodiment of the invention, the materials of the buffer material include expandable polyethylene (EPE). The secondflexible film 140 has a second contactingsurface 142 with a number of secondsticky portion 144 formed thereon, a number ofsecond semiconductor elements 20 are placed on the secondsticky portion 144, and then the number of electronic components, such as second semiconductor elements 20 (striped blocks) are covered by abuffer layer 150. The secondsticky portion 144 also have slight stickiness, so that the number ofsecond semiconductor elements 20 are fixed on the second contactingsurface 142 and will not collide with each other during horizontal shift. The standard of the slight stickiness requested of the secondsticky portion 144 is similar to the standard of the slight stickiness requested of the firststicky portion 124. In the present embodiment of the invention, the number offirst semiconductor element 10 and the number ofsecond semiconductor element 20 are display panels, and more particularly are small-sized liquid crystal display (LCD) panels or organic light emitting diode (OLED) display panels. The packaging structure can be used to protect other fragile structures such as glass substrate, silicon wafer or chip. - Referring to
FIG. 2 , an assembly diagram of the packaging structure of the invention is shown. As shown inFIG. 2 , theflexible film 120, the number offirst semiconductor elements 10, thebuffer material 130, the secondflexible film 140, the number ofsecond semiconductor elements 20 and thebuffer material 150 are sequentially positioned inside the accommodation space formed by thefirst container 110 and thesecond container 160. For the purpose of elaboration, the stacked structure of the semiconductor elements inFIG. 2 is exemplified by two layers. However, in practical application, the stacked structure is not limited to two layers of semiconductor elements. The semiconductor elements can be stacked to as many layers as the safety range of vertical stress permits. The stacking of semiconductor elements can be adjusted to further enhance the protection of the semiconductor elements by either adjusting the size of the accommodation space formed by thefirst container 110 and thesecond container 160 or by providing a suitable buffer material. - When the number of
first semiconductor elements 10 and the number ofsecond semiconductor elements 20 are respectively placed on the contactingsurface 122 and the contactingsurface 142, the number offirst semiconductor elements 10 and the number ofsecond semiconductor elements 20, as shown inFIG. 1 , can be arranged correspondingly, interlacingly or partially overlapped in the normal direction of the contactingsurface 122 or the contactingsurface 142. When at least part of one of the firststicky portions 124 and at least part of one of the secondsticky portions 144 are overlapped, thefirst semiconductor element 10 and thesecond semiconductor element 20 are arragned partially overlapped in vertical direction. When at least one of the firststicky portions 124 and at least one of the secondsticky portions 144 are overlapped, thefirst semiconductor element 10 and thesecond semiconductor element 20 are arragned correpondinly in vertical direction. When the firststicky portions 124 and the secondsticky portions 144 are non-overlapped, thefirst semiconductor elements 10 and thesecond semiconductor elements 20 are arragned interlacingly in vertical direction. Thefirst semiconductor element 10 and thesecond semiconductor element 20 can have same or different sizes. Meanwhile, thebuffer material 130 is not necessary in the embodiment. It means that thepackaging structure 100 may include thefirst container 110, the firstflexible film 120, the secondflexible film 140, thebuffer material 150, and thesecond container 160 arranged in the same order. In another case, thepackaging structure 100 may only include thefirst container 110, the firstflexible film 120 with thebuffer material 130 formed thereon, and thesecond container 160 arranged in the same order. - Similarly, the semiconductor elements placed on the same contacting surface can have the same or different sizes. The semiconductor elements packaged on the same or different layers can have different structures. Examples of the semiconductor elements include display panel, glass substrate, silicon wafer or chip. The packaging structure can also be used to protect other fragile structures. When packaging the semiconductor elements, the relative positions between the number of
first semiconductor elements 10 and the number ofsecond semiconductor elements 20 placed on different layers can be adjusted according to the size and the weight of the semiconductor elements. - Referring to
FIG. 3 , an enlarged diagram of the packaging structure of the invention assembled with a semiconductor element is shown. As shown inFIG. 3 , a semiconductor element 1 is placed on the contactingsurface 122 of theflexible film 120. The firststicky portion 124 of the contactingsurface 122 have slight stickiness, so the semiconductor element 1 is fixed on the contactingsurface 122 and will not collide with other semiconductor elements during horizontal shift. The semiconductor element 1 creates a recess on theflexible film 120 by the weight of the semiconductor element 1 and forms a wrapping structure with thebuffer material 130. Thus, the semiconductor element 1 is protected and wrapped within. Theflexible film 120 and thebuffer material 130 may contact or non-contact each other. - In the invention, when the thickness of the semiconductor element ranges from 0.6 mm to 1.2 mm, the thickness of the flexible film can range from 0.1 mm to 0.5 mm, the thickness of the buffer material can be larger than 0.5 mm or range from 0.5 mm to 2.0 mm, and the stickiness of the flexible film can range from 1 N/20 mm to 10 N/20 mm. In a variation of the present embodiment of the invention, the thickness of the flexible film can be increased to be ranging from 0.5 mm to 2.0 mm, and under such circumstance, the buffer material can be dispensed with. However, the thickness disclosed above is only for the purpose of exemplification. In practical application, the thickness can be adjusted according to the characteristics of the packaging materials, the size, the fragility and other factors of the structure to be packaged. If the overall thickness is not limited, the thickness of the packaging materials can be further increased.
- Referring to
FIG. 4 , an exploded diagram of another packaging structure of the invention is shown. The main difference between thepackaging structure 200 and thepackaging structure 100 is the firstflexible film 220 and the secondflexible film 240. For sure,flexible films surface 222 and the whole second contactingsurface 242 have stickiness, not only in particular portions of the firstflexible film 220 and the secondflexible film 240. Such thefirst semiconductor elements 10 and thesecond semiconductor elements 20 can be arranged more freely. - According to the packaging structure disclosed in the above embodiment of the invention, a wrapping structure formed by a flexible film with slight stickiness and a buffer material is used to fix and protect multiple semiconductor elements, and more particularly is applicable to the package of small-sized display panels. The packaging structure being flexible and having temporary shapes is applicable to semiconductor elements of various sizes. The packaging material can fit semiconductor elements of various sizes without having to be manufactured according to the size of a semiconductor element. Besides, the container for accommodating the semiconductor elements is recyclable, environmentally friendly and economically.
- While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims (12)
1. A packaging structure for accommodating a plurality of electronic components, comprising:
a first container; and
a first flexible film, disposed in the first container, having a plurality of first sticky portions for contacting with the electronic components.
2. The packaging structure according to claim 1 , further comprising a second flexible film disposed over the first flexible film, wherein the second flexible film has a plurality of second sticky portions for contacting with the electronic components.
3. The packaging structure according to claim 2 , further comprising a buffer disposed between the first and the second flexible films.
4. The packaging structure according to claim 3 , wherein at least part of one of the first sticky portions and at least part of one of the second sticky portions are overlapped.
5. The packaging structure according to claim 3 , wherein the first sticky portions and the second sticky portions are non-overlapped.
6. The packaging structure according to claim 3 , further comprising a second container disposed over the first container.
7. The packaging structure according to claim 2 , wherein at least part of one of the first sticky portions and at least part of one of the second sticky portions are overlapped.
8. The packaging structure according to claim 2 , wherein the first sticky portions and the second sticky portions are non-overlapped.
9. The packaging structure according to claim 2 , further comprising a second container disposed over the first container.
10. The packaging structure according to claim 9 , further comprising a buffer disposed on the second flexible film.
11. The packaging structure according to claim 1 , further comprising a buffer disposed on the first flexible film.
12. The packaging structure according to claim 11 , wherein the buffer is comprised of expandable polyethylene (EPE).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW95118840 | 2006-05-26 | ||
TW095118840A TWI297320B (en) | 2006-05-26 | 2006-05-26 | Packaging structure |
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US20070272590A1 true US20070272590A1 (en) | 2007-11-29 |
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ID=38748541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/583,167 Abandoned US20070272590A1 (en) | 2006-05-26 | 2006-10-19 | Packaging structure |
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US (1) | US20070272590A1 (en) |
TW (1) | TWI297320B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10217655B2 (en) * | 2014-12-18 | 2019-02-26 | Entegris, Inc. | Wafer container with shock condition protection |
US20220250784A1 (en) * | 2021-02-09 | 2022-08-11 | Chongqing Boe Optoelectronics Technology Co., Ltd. | Tray and loading device for display product |
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-
2006
- 2006-05-26 TW TW095118840A patent/TWI297320B/en not_active IP Right Cessation
- 2006-10-19 US US11/583,167 patent/US20070272590A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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US5033615A (en) * | 1988-02-15 | 1991-07-23 | Tomoegawa Paper Co., Ltd. | Wrapped glass cap article |
US5168996A (en) * | 1991-05-15 | 1992-12-08 | Pathfinder Services, Inc. | Package |
US5270901A (en) * | 1991-11-08 | 1993-12-14 | Presstek, Incorporated | Charge-dissipating packaging system |
US6107680A (en) * | 1995-01-04 | 2000-08-22 | Micron Technology, Inc. | Packaging for bare dice employing EMR-sensitive adhesives |
US5769237A (en) * | 1996-07-15 | 1998-06-23 | Vichem Corporation | Tape carrier for electronic and electrical parts |
US6564944B2 (en) * | 1997-02-05 | 2003-05-20 | Southpac Trust Inc'ln Inc. | Shipping device with bondable cushion layer |
US20010027933A1 (en) * | 1998-11-26 | 2001-10-11 | Keiichi Sasamura | Accommodation container, accommodation container for accommodating semiconductor devices and method of carrying semiconductor devices |
US20030129389A1 (en) * | 2001-12-20 | 2003-07-10 | Nitto Denko Corporation | Cover tape for the electronic part conveyance, process for its production and electronic part conveying member |
US6926937B2 (en) * | 2002-09-11 | 2005-08-09 | Entegris, Inc. | Matrix tray with tacky surfaces |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10217655B2 (en) * | 2014-12-18 | 2019-02-26 | Entegris, Inc. | Wafer container with shock condition protection |
US20220250784A1 (en) * | 2021-02-09 | 2022-08-11 | Chongqing Boe Optoelectronics Technology Co., Ltd. | Tray and loading device for display product |
Also Published As
Publication number | Publication date |
---|---|
TWI297320B (en) | 2008-06-01 |
TW200743625A (en) | 2007-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: AU OPTRONICS CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TSENG, TE-HAI;HUANG, JIN-SHR;REEL/FRAME:018443/0001 Effective date: 20061005 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |