US20070244245A1 - Carbon nanotube composite material and method for manufacturing the same - Google Patents
Carbon nanotube composite material and method for manufacturing the same Download PDFInfo
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- US20070244245A1 US20070244245A1 US11/309,822 US30982206A US2007244245A1 US 20070244245 A1 US20070244245 A1 US 20070244245A1 US 30982206 A US30982206 A US 30982206A US 2007244245 A1 US2007244245 A1 US 2007244245A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Definitions
- the present invention relates to composite materials and manufacturing methods thereof and, more particularly, to a carbon nanotube composite material and a manufacturing method thereof.
- CNTs Carbon NanoTubes
- CNTs are tube-shaped structures composed of graphite.
- CNTs have a high Young's modulus, high thermal conductivity, and high electrical conductivity, among other properties. Due to these and the other properties, it has been suggested that CNTs can play an important role in fields such as microelectronics, material science, biology, and chemistry.
- thermally conductive material that conducts heat by using CNTs.
- the thermally conductive material is formed by injection molding and has numerous CNTs incorporated in a matrix material.
- a first surface of the thermally conductive material engages with an electronic device, and a second surface of the thermally conductive material engages with a heat sink.
- the second surface has a larger area than the first one, so that heat can be uniformly spread out to the larger second surface.
- the thermally conductive material formed by injection molding is relatively thick. This increases a bulk of the thermally conductive material and reduces its flexibility.
- CNTs are disposed in the matrix material randomly and are multidirectional in orientation. This random disposition means that heat tends to spread uniformly through the thermally conductive material, retaining much of the heat within the heat transfer material. Accordingly, the heat does not spread efficiently from the first surface engaged with the electronic device to the second surface engaged with the heat sink.
- a thin carbon nanotube composite material with controlled nanotube orientation within one or more selective patterns and, thus, with good thermal/electrical conductivity, and a method for manufacturing such a material is desired.
- a carbon nanotube composite material includes a matrix material having two opposite surfaces, a number of CNTs each having two opposite end portions embedded in the matrix material. The two opposite end portions of CNTs respectively extend out of the two opposite surfaces of the matrix material.
- a method for manufacturing the carbon nanotube composite material includes the steps of: providing a substrate and forming a carbon nanotube array in a selective pattern thereon, each carbon nanotube (CNT) in the carbon nanotube array having respective first and second end portions; forming a first protective layer on the respective first end portion of the CNTs; forming a second protective layer on the respective second end portion of the CNTs; filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material; and removing the first protective layer and the second protective layer from the carbon nanotube array.
- CNT carbon nanotube
- FIG. 1 is a schematic, isometric view of a carbon nanotube composite material according to a preferred embodiment
- FIG. 2 is a schematic, side view of the carbon nanotube composite material of FIG. 1 ;
- FIG. 3 is a top view of the carbon nanotube composite material, in which several carbon nanotube array patterns are provided, according to a preferred embodiment
- FIG. 4 is a flow chart of a method for manufacturing the carbon nanotube composite material of FIG. 1 ;
- FIG. 5 to FIG. 9 are schematic views illustrating the manufacturing steps 1 - 5 in FIG. 4 ;
- a carbon nanotube composite material 10 includes a matrix material 12 and a carbon nanotube array 14 .
- the matrix material 12 has a first surface 102 and a second surface 104 opposite to the first surface 102 .
- the carbon nanotube array 14 is embedded in the matrix material 12 , the CNTs of the carbon nanotube array 14 being uniformly dispersed in a desired pattern.
- Each CNT of the carbon nanotube array 14 has a first end portion 112 and a second end portion 114 opposite to the first end portion 112 .
- the two opposite end portions 112 and 114 advantageously extend at least to the two opposite surfaces 102 , 104 , respectively, and, in order to facilitate a connection with other components, are, further advantageously, exposed. If not exposed, however, the end portions 112 and 114 are beneficially offered protection by the surrounding matrix material 12 but do have the drawback of not being able to be as intimately connected to adjoining components as may be possible if exposed.
- the matrix material 12 is, advantageously, selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic.
- the two opposite surfaces 102 and 104 are substantially parallel to each other.
- the carbon nanotube array 14 is beneficially in a form of an aligned carbon nanotube array.
- Each CNT of the carbon nanotube array 14 is substantially parallel to one another and further substantially perpendicular to the two opposite surfaces 102 and 104 .
- each CNT of the carbon nanotube array 14 can provide a direct, shortest-distance thermal conduction path and/or electrical transmission path from one surface to another of the matrix material 12 .
- a patterned carbon nanotube composite material 20 includes a matrix material 22 having two opposite surfaces and a number of patterned carbon nanotube arrays 24 embedded therein.
- Each CNT of the carbon nanotube arrays 24 includes two opposite end portion that respectively extend from two opposite surfaces of the matrix material 22 .
- the carbon nanotube arrays 24 can be patterned in a desired position, e.g., of an Integrated Circuit (IC) chip and/or can be formed into a geometrical figure, such as a circle, rectangle, ellipse, square, or any combination thereof.
- the carbon nanotube array 24 is sandwiched between the IC chip and a printed circuit board (PCB) for improving electrical connection therebetween and/or thermal conduction from the IC chip to ambient and/or a heat sink.
- PCB printed circuit board
- a method for manufacturing the carbon nanotube composite material 10 employs an in-situ injection molding process, which comprises the steps of:
- Step 1 providing a substrate and forming a patterned carbon nanotube array thereon, each carbon nanotube having a first end portion and an opposite second end portion;
- Step 2 forming a first protective layer on the first end portions of the CNTs
- Step 3 removing the substrate and forming a second protective layer on the second end portion of the CNTs;
- Step 4 filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material
- Step 5 removing the protective layers from the CNTs.
- a substrate 16 is provided and a patterned carbon nanotube array 14 is formed thereon.
- Each CNT of the carbon nanotube array 14 has a first end portion 112 and an opposite second end portion 114 , and a number of clearances 116 are defined among the adjacent CNTs.
- the carbon nanotube array 14 can be formed, for example, by a chemical vapor deposition method.
- a silicon wafer is used as the substrate 16 , iron as the catalyst film, and ethylene as the carbon source gas.
- An iron film pattern having a thickness of about 5 nanometers (nm) is formed on the substrate 16 and is annealed in air at 300° C. Then, the substrate 16 with the iron film deposited thereon is placed into a chemical vapor deposition chamber (not labeled), an ethylene gas is provided therein at 700° C., and then the carbon nanotube array 14 is produced.
- the carbon nanotube array 14 grown is about 0.3 millimeters (mm) high and substantially perpendicularly to the substrate 16 .
- the first protective layer 18 may only include the polyester film 124 .
- the polyester film 124 can be directly attached to the carbon nanotube array 14 as follows: placing the polyester film 124 on the carbon nanotube array 14 ; and pressing the first end portions 112 of the carbon nanotube array 14 into the polyester film 124 , thereby attaching the polyester film 124 to the carbon nanotube array 14 .
- step 3 as shown in FIG. 7 , the substrate 16 is removed from the second end portions 114 , and the second protective layer 18 ′ is attached to the second end portions 114 .
- the second protective layer 18 ′ includes a pressure sensitive adhesive layer 122 ′ and a polyester film 124 ′.
- the step of attaching the second protective layer 18 ′ to the second end portions 114 is similar to that of the first protective layer 18 in the step 3 .
- the carbon nanotube array 14 along with the two protective layers 18 and 18 ′ attached on the two opposite end portions 112 and 114 thereof constitute an injection mold.
- step 3 is an optional step.
- the carbon nanotube array 14 can form an injection mold along with the first protective layer 18 attached to the first end portions 112 and the substrate 16 attached to the second end portions 114 .
- the substrate 16 could be permitted to remain instead of being replaced with the second protective layer 18 ′ and to thereby act as part of the injection mold.
- step 4 the clearances 116 among the carbon nanotube array 14 are filled with the matrix material 12 .
- This step can be performed in the following manner: immersing the carbon nanotube array 14 with two attached protective layers 18 and 18 ′ into a melt or solution of the matrix material 12 ; taking the carbon nanotube array 14 , now having the matrix material 12 filled among the clearances 116 , out of the melted or solution of the matrix material 12 ; and curing the matrix material 12 among the clearances 116 in vacuum at room temperature for 24 hours, thereby causing the matrix material 12 to become soft and elastic.
- the matrix material 12 is advantageously selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic.
- the matrix material 12 is made from the Sylgard 160, a type of a 2-part silicone elastomer, which is available from Dow Corning.
- Sylgard 160 is supplied, as two separate liquid components comprised of part A and part B to be mixed in a 1:1 ratio by weight or volume.
- a mass percent of the CNTs in the carbon nanotube composite material is about 5 wt %.
- both protective layers 18 and 18 ′ are removed from the carbon nanotube array 14 .
- the protective layers 18 and 18 ′ can be removed, for example, by directly stripping off the protective layers 18 and 18 ′ and sequentially dissolving away any of the remaining pressure sensitive adhesive layers 122 and 122 ′, by using an organic solution.
- the organic solvent is xylene.
- the method for manufacturing the carbon nanotube composite material 10 can further include a reactive ion etching (RIE) step or another selective material removal step to ensure the both end portions 112 and 114 (i.e., both end portions of the respective CNTs) of the carbon nanotube array 14 be sufficiently exposed.
- RIE reactive ion etching
- the RIE process is carried out using O2 plasma at a pressure of 6 pascals (Pa) and with a power of 150 watts (W) for 15 minutes (min) at each of the surfaces 102 and 104 of the matrix material 12 .
- RIE reactive ion etching
- the resulted carbon nanotube composite 10 can be further trimmed into any desired geometrical figure for used as, e.g., electrical and/or thermal conductive component.
- the CNTs of the carbon nanotube composite 10 are bounded tightly within the matrix material 12 , a stability and reliability of the carbon nanotube composite 10 is improved.
- electrical conductivities of the carbon nanotube composite material 10 are measured.
- the solid line represents axial conductivity along a direction parallel to longitudinal axes of the CNTs
- the dashed line represents lateral conductivity along a direction perpendicular to the longitudinal axes of the carbon nanotubes.
- the axial conductivity over the entire voltage range, is markedly higher than the lateral conductivity.
- the maximum performance of thermal and/or electrical conduction and relative thereto along the axial direction can be expected.
- the two end portions 112 , 114 of the CNTs of the carbon nanotube array 14 are protruded out of two surfaces 102 , 104 .
- the two end portions 12 , 114 of CNTs form thermal contact surfaces or electrical connection surfaces directly in the axial direction, and the overall electrical conductivity/thermal conductivity of the carbon nanotube composite material 10 is improved.
- the carbon nanotube composite material 10 can be formed in a desired pattern, according to the application requirement, and can, e.g., be in a film form that makes them portable and integral.
- the thickness and other dimensions of the carbon nanotube composite material 10 can be chosen by the designer based on the use requirements and, thus, are not limited to thin film applications.
- the carbon nanotube composite material 10 can, e.g., be applied in a large-scaled IC and furthermore in any large-scaled electronic component. Additional uses for the carbon nanotube composite material 10 beyond the electronics area (e.g., thermal transfer devices) are readily conceivable and are considered to be within the scope of the present composite material.
Abstract
Description
- This application is related to commonly-assigned, co-pending applications: entitled, “THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME”, filed * * * (Atty. Docket No. US7491); “THERMAL INTERFACE MATERIAL AND METHOD FOR MANUFACTURING SAME”, filed * * * (Atty. Docket No. US7258); and “THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME”, filed * * * (Atty. Docket No. US7257). The disclosures of the above-identified applications are incorporated herein by reference.
- The present invention relates to composite materials and manufacturing methods thereof and, more particularly, to a carbon nanotube composite material and a manufacturing method thereof.
- CNTs (Carbon NanoTubes) are tube-shaped structures composed of graphite. CNTs have a high Young's modulus, high thermal conductivity, and high electrical conductivity, among other properties. Due to these and the other properties, it has been suggested that CNTs can play an important role in fields such as microelectronics, material science, biology, and chemistry.
- A kind of thermally conductive material that conducts heat by using CNTs has been developed. The thermally conductive material is formed by injection molding and has numerous CNTs incorporated in a matrix material. A first surface of the thermally conductive material engages with an electronic device, and a second surface of the thermally conductive material engages with a heat sink. The second surface has a larger area than the first one, so that heat can be uniformly spread out to the larger second surface. However, the thermally conductive material formed by injection molding is relatively thick. This increases a bulk of the thermally conductive material and reduces its flexibility. Furthermore, CNTs are disposed in the matrix material randomly and are multidirectional in orientation. This random disposition means that heat tends to spread uniformly through the thermally conductive material, retaining much of the heat within the heat transfer material. Accordingly, the heat does not spread efficiently from the first surface engaged with the electronic device to the second surface engaged with the heat sink.
- Therefore, a thin carbon nanotube composite material, with controlled nanotube orientation within one or more selective patterns and, thus, with good thermal/electrical conductivity, and a method for manufacturing such a material is desired.
- A carbon nanotube composite material includes a matrix material having two opposite surfaces, a number of CNTs each having two opposite end portions embedded in the matrix material. The two opposite end portions of CNTs respectively extend out of the two opposite surfaces of the matrix material.
- A method for manufacturing the carbon nanotube composite material includes the steps of: providing a substrate and forming a carbon nanotube array in a selective pattern thereon, each carbon nanotube (CNT) in the carbon nanotube array having respective first and second end portions; forming a first protective layer on the respective first end portion of the CNTs; forming a second protective layer on the respective second end portion of the CNTs; filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material; and removing the first protective layer and the second protective layer from the carbon nanotube array.
- Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
- Many aspects of the carbon nanotube composite material can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present carbon nanotube composite material. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a schematic, isometric view of a carbon nanotube composite material according to a preferred embodiment; -
FIG. 2 is a schematic, side view of the carbon nanotube composite material ofFIG. 1 ; -
FIG. 3 is a top view of the carbon nanotube composite material, in which several carbon nanotube array patterns are provided, according to a preferred embodiment; -
FIG. 4 is a flow chart of a method for manufacturing the carbon nanotube composite material ofFIG. 1 ; -
FIG. 5 toFIG. 9 are schematic views illustrating the manufacturing steps 1-5 inFIG. 4 ; and -
FIG. 10 is a diagram showing an electrical property of the carbon nanotube composite material according to a preferred embodiment. - The exemplifications set out herein illustrate at least one preferred embodiment of the present carbon nanotube composite material and the method for manufacturing the same, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.
- Referring to
FIG. 1 andFIG. 2 , a carbon nanotubecomposite material 10, according to a preferred embodiment, includes amatrix material 12 and acarbon nanotube array 14. Thematrix material 12 has afirst surface 102 and asecond surface 104 opposite to thefirst surface 102. Thecarbon nanotube array 14 is embedded in thematrix material 12, the CNTs of thecarbon nanotube array 14 being uniformly dispersed in a desired pattern. Each CNT of thecarbon nanotube array 14 has afirst end portion 112 and asecond end portion 114 opposite to thefirst end portion 112. The twoopposite end portions opposite surfaces end portions matrix material 12 but do have the drawback of not being able to be as intimately connected to adjoining components as may be possible if exposed. Thematrix material 12 is, advantageously, selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic. - The two
opposite surfaces carbon nanotube array 14 is beneficially in a form of an aligned carbon nanotube array. Each CNT of thecarbon nanotube array 14 is substantially parallel to one another and further substantially perpendicular to the twoopposite surfaces carbon nanotube array 14 can provide a direct, shortest-distance thermal conduction path and/or electrical transmission path from one surface to another of thematrix material 12. - Referring to
FIG. 3 , a patterned carbonnanotube composite material 20 includes amatrix material 22 having two opposite surfaces and a number of patternedcarbon nanotube arrays 24 embedded therein. Each CNT of thecarbon nanotube arrays 24 includes two opposite end portion that respectively extend from two opposite surfaces of thematrix material 22. Thecarbon nanotube arrays 24 can be patterned in a desired position, e.g., of an Integrated Circuit (IC) chip and/or can be formed into a geometrical figure, such as a circle, rectangle, ellipse, square, or any combination thereof. Thecarbon nanotube array 24 is sandwiched between the IC chip and a printed circuit board (PCB) for improving electrical connection therebetween and/or thermal conduction from the IC chip to ambient and/or a heat sink. - As shown in
FIG. 4 , a method for manufacturing the carbonnanotube composite material 10 is provided. The method employs an in-situ injection molding process, which comprises the steps of: -
Step 1, providing a substrate and forming a patterned carbon nanotube array thereon, each carbon nanotube having a first end portion and an opposite second end portion; -
Step 2, forming a first protective layer on the first end portions of the CNTs; -
Step 3, removing the substrate and forming a second protective layer on the second end portion of the CNTs; -
Step 4, filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material; and -
Step 5, removing the protective layers from the CNTs. - Referring to
FIGS. 5 through 9 , the method for manufacturing the carbon nanotubecomposite material 10, in accordance with the preferred embodiment, is described below, in detail. - In
step 1, as shown inFIG. 5 , asubstrate 16 is provided and a patternedcarbon nanotube array 14 is formed thereon. Each CNT of thecarbon nanotube array 14 has afirst end portion 112 and an oppositesecond end portion 114, and a number ofclearances 116 are defined among the adjacent CNTs. Thecarbon nanotube array 14 can be formed, for example, by a chemical vapor deposition method. - The chemical vapor deposition method for manufacturing the
carbon nanotube array 14 generally includes steps of: firstly, forming a catalyst film (not labeled) on thesubstrate 16 and then growingcarbon nanotube array 14 thereon by providing a carbon source gas at high temperature. Thesubstrate 16 is beneficially made from a material selected from the group consisting of glass, silicon, metal, and metal oxide. The catalyst film can, usefully, be made from material selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), and an alloy thereof. The carbon source gas can be, e.g., methane, ethylene, propylene, acetylene, methanol, ethanol, or some mixtures thereof. In the preferred embodiment, a silicon wafer is used as thesubstrate 16, iron as the catalyst film, and ethylene as the carbon source gas. An iron film pattern having a thickness of about 5 nanometers (nm) is formed on thesubstrate 16 and is annealed in air at 300° C. Then, thesubstrate 16 with the iron film deposited thereon is placed into a chemical vapor deposition chamber (not labeled), an ethylene gas is provided therein at 700° C., and then thecarbon nanotube array 14 is produced. Thecarbon nanotube array 14 grown is about 0.3 millimeters (mm) high and substantially perpendicularly to thesubstrate 16. - In
step 2, as shown inFIG. 6 , a firstprotective layer 18 is formed on thefirst end portions 112 of thecarbon nanotube array 14. The firstprotective layer 18 includes apolyester film 124 and a pressure sensitiveadhesive layer 122 thereon. In the preferred embodiment, the pressure sensitiveadhesive layer 122 is about 0.05 mm thick and is coated on a side of thepolyester film 124. More specifically, the firstprotective layer 18 can be attached to thecarbon nanotube array 14 as follows: placing the firstprotective layer 18 on thecarbon nanotube array 14 with the pressuresensitive adhesive 122 facing towards thefirst end portions 112; pressing thefirst end portions 112 of thecarbon nanotube array 14 into the pressure sensitiveadhesive layer 122, thereby directly attaching thefirst protecting layer 18 to thecarbon nanotube array 14. The pressure sensitiveadhesive layer 122 is a soft and adhesive material, which allows thefirst end portions 112 to be inserted thereinto when an external force is applied. The pressure sensitiveadhesive layer 122 used in this exemplary embodiment is YM881 (produced by Light Industry Institute, Fushun, China). The pressure sensitiveadhesive layer 122 can, alternatively, be made of other adhesive materials with high viscosity, such as glue. Moreover, thepolyester film 124 may be made of other polymers, such as polyethylene. - In another embodiment, the first
protective layer 18 may only include thepolyester film 124. Thepolyester film 124 can be directly attached to thecarbon nanotube array 14 as follows: placing thepolyester film 124 on thecarbon nanotube array 14; and pressing thefirst end portions 112 of thecarbon nanotube array 14 into thepolyester film 124, thereby attaching thepolyester film 124 to thecarbon nanotube array 14. - In
step 3, as shown inFIG. 7 , thesubstrate 16 is removed from thesecond end portions 114, and the secondprotective layer 18′ is attached to thesecond end portions 114. The secondprotective layer 18′ includes a pressure sensitiveadhesive layer 122′ and apolyester film 124′. The step of attaching the secondprotective layer 18′ to thesecond end portions 114 is similar to that of the firstprotective layer 18 in thestep 3. Thereby, thecarbon nanotube array 14 along with the twoprotective layers opposite end portions - It is noted that
step 3 is an optional step. Thecarbon nanotube array 14 can form an injection mold along with the firstprotective layer 18 attached to thefirst end portions 112 and thesubstrate 16 attached to thesecond end portions 114. As a further alternative, thesubstrate 16 could be permitted to remain instead of being replaced with the secondprotective layer 18′ and to thereby act as part of the injection mold. - In
step 4, as shown inFIG. 8 , theclearances 116 among thecarbon nanotube array 14 are filled with thematrix material 12. This step can be performed in the following manner: immersing thecarbon nanotube array 14 with two attachedprotective layers matrix material 12; taking thecarbon nanotube array 14, now having thematrix material 12 filled among theclearances 116, out of the melted or solution of thematrix material 12; and curing thematrix material 12 among theclearances 116 in vacuum at room temperature for 24 hours, thereby causing thematrix material 12 to become soft and elastic. Thematrix material 12 is advantageously selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic. In the preferred embodiment, thematrix material 12 is made from the Sylgard 160, a type of a 2-part silicone elastomer, which is available from Dow Corning. The Sylgard 160 is supplied, as two separate liquid components comprised of part A and part B to be mixed in a 1:1 ratio by weight or volume. A mass percent of the CNTs in the carbon nanotube composite material is about 5 wt %. - In
step 5, as shown inFIG. 2 , bothprotective layers carbon nanotube array 14. The protective layers 18 and 18′ can be removed, for example, by directly stripping off theprotective layers adhesive layers nanotube composite material 10 is obtained, which has twoend portions carbon nanotube array 14 extending from the twosurfaces matrix material 12. - Preferably, the method for manufacturing the carbon
nanotube composite material 10 can further include a reactive ion etching (RIE) step or another selective material removal step to ensure the bothend portions 112 and 114 (i.e., both end portions of the respective CNTs) of thecarbon nanotube array 14 be sufficiently exposed. In the preferred embodiment, the RIE process is carried out using O2 plasma at a pressure of 6 pascals (Pa) and with a power of 150 watts (W) for 15 minutes (min) at each of thesurfaces matrix material 12. Finally, a carbonnanotube composite material 10 having the bothend portions - The resulted
carbon nanotube composite 10 can be further trimmed into any desired geometrical figure for used as, e.g., electrical and/or thermal conductive component. In addition, since the CNTs of thecarbon nanotube composite 10 are bounded tightly within thematrix material 12, a stability and reliability of thecarbon nanotube composite 10 is improved. - Referring to
FIG. 9 , electrical conductivities of the carbonnanotube composite material 10 are measured. The solid line represents axial conductivity along a direction parallel to longitudinal axes of the CNTs, and the dashed line represents lateral conductivity along a direction perpendicular to the longitudinal axes of the carbon nanotubes. As be expected to given the alignment of the CNTs, the axial conductivity, over the entire voltage range, is markedly higher than the lateral conductivity. As a result, when the carbonnanotube composite material 10 is aligned, the maximum performance of thermal and/or electrical conduction and relative thereto along the axial direction can be expected. - The two
end portions carbon nanotube array 14 are protruded out of twosurfaces end portions nanotube composite material 10 is improved. The carbonnanotube composite material 10 can be formed in a desired pattern, according to the application requirement, and can, e.g., be in a film form that makes them portable and integral. Moreover, the thickness and other dimensions of the carbonnanotube composite material 10 can be chosen by the designer based on the use requirements and, thus, are not limited to thin film applications. For these reasons, the carbonnanotube composite material 10 can, e.g., be applied in a large-scaled IC and furthermore in any large-scaled electronic component. Additional uses for the carbonnanotube composite material 10 beyond the electronics area (e.g., thermal transfer devices) are readily conceivable and are considered to be within the scope of the present composite material. - Finally, it is to be understood that the embodiments mentioned above are intended to illustrate rather than limit the invention. Variations may be made to the embodiments without departing from the spirit of the invention as claimed. The above-described embodiments illustrate the scope of the invention but do not restrict the scope of the invention.
Claims (17)
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US20100021736A1 (en) * | 2008-07-25 | 2010-01-28 | Slinker Keith A | Interface-infused nanotube interconnect |
US20100027221A1 (en) * | 2007-10-22 | 2010-02-04 | Fujitsu Limited | Sheet structure and method of manufacturing the same |
US20100061063A1 (en) * | 2007-02-22 | 2010-03-11 | Carl Fairbank | Process for Preparing Conductive Films and Articles Prepared Using the Process |
US20100065190A1 (en) * | 2008-09-12 | 2010-03-18 | Tsinghua University | Method for making composite material having carbon nanotube array |
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Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7454295B2 (en) | 1998-12-17 | 2008-11-18 | The Watereye Corporation | Anti-terrorism water quality monitoring system |
US20110125412A1 (en) * | 1998-12-17 | 2011-05-26 | Hach Company | Remote monitoring of carbon nanotube sensor |
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CN112358855B (en) * | 2020-10-26 | 2021-12-28 | 深圳烯湾科技有限公司 | Carbon nano tube heat conducting sheet and preparation method thereof |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6407922B1 (en) * | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
US20040266065A1 (en) * | 2003-06-25 | 2004-12-30 | Yuegang Zhang | Method of fabricating a composite carbon nanotube thermal interface device |
US20040265489A1 (en) * | 2003-06-25 | 2004-12-30 | Dubin Valery M. | Methods of fabricating a composite carbon nanotube thermal interface device |
US6921462B2 (en) * | 2001-12-17 | 2005-07-26 | Intel Corporation | Method and apparatus for producing aligned carbon nanotube thermal interface structure |
US6924335B2 (en) * | 2002-11-14 | 2005-08-02 | Hon Hai Precision Ind. Co., Ltd. | Thermal interface material and method for making same |
US20050167647A1 (en) * | 2004-02-04 | 2005-08-04 | Tsinghua University | Thermal interface material and method for manufacturing same |
US7148512B2 (en) * | 2004-03-12 | 2006-12-12 | Hon Hai Precision Industry Co., Ltd. | Thermal interface with silver-filled carbon nanotubes |
US7160620B2 (en) * | 2004-04-10 | 2007-01-09 | Tsinghua University | Thermal interface material and method for manufacturing same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09298260A (en) * | 1996-05-01 | 1997-11-18 | Tonen Corp | Heat radiation plate |
JP3850956B2 (en) * | 1997-07-31 | 2006-11-29 | 鈴木総業株式会社 | Heat dissipation carbon composite board |
JP2001294676A (en) * | 2000-04-13 | 2001-10-23 | Jsr Corp | Heat-conductive sheet, method for producing heat- conductive sheet and radiating structure using heat- conductive sheet |
JP4833398B2 (en) * | 2000-09-18 | 2011-12-07 | ポリマテック株式会社 | Method for producing thermally conductive molded body |
JP4697829B2 (en) * | 2001-03-15 | 2011-06-08 | ポリマテック株式会社 | Carbon nanotube composite molded body and method for producing the same |
US6965513B2 (en) * | 2001-12-20 | 2005-11-15 | Intel Corporation | Carbon nanotube thermal interface structures |
AT412265B (en) * | 2002-11-12 | 2004-12-27 | Electrovac | HEAT EXTRACTION COMPONENT |
US7398477B2 (en) * | 2003-10-31 | 2008-07-08 | International Business Machines Corporation | Spiral scrollbar |
CN100356556C (en) * | 2004-03-13 | 2007-12-19 | 鸿富锦精密工业(深圳)有限公司 | Thermal interfacial material and method of manufacture |
CN1290764C (en) * | 2004-05-13 | 2006-12-20 | 清华大学 | Method for producing Nano carbon tubes in even length in large quantities |
JP2006147801A (en) * | 2004-11-18 | 2006-06-08 | Seiko Precision Inc | Heat dissipating sheet, interface, electronic parts, and manufacturing method of heat dissipating sheet |
CN100337981C (en) * | 2005-03-24 | 2007-09-19 | 清华大学 | Thermal interface material and its production method |
CN100404242C (en) * | 2005-04-14 | 2008-07-23 | 清华大学 | Heat interface material and its making process |
CN100454526C (en) * | 2005-06-30 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | Thermo-interface material producing method |
CN1891780B (en) * | 2005-07-01 | 2013-04-24 | 清华大学 | Thermal interface material, and its preparing method |
JP2007168263A (en) * | 2005-12-22 | 2007-07-05 | Seiko Precision Inc | Resin-made case for electronic equipment and manufacturing method of resin molding |
-
2006
- 2006-04-14 CN CN200610060309A patent/CN101054467B/en active Active
- 2006-10-03 US US11/309,822 patent/US20070244245A1/en not_active Abandoned
-
2007
- 2007-04-12 JP JP2007105172A patent/JP4723529B2/en active Active
- 2007-11-21 US US11/986,365 patent/US7641938B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6407922B1 (en) * | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
US6921462B2 (en) * | 2001-12-17 | 2005-07-26 | Intel Corporation | Method and apparatus for producing aligned carbon nanotube thermal interface structure |
US20060054490A1 (en) * | 2001-12-17 | 2006-03-16 | Intel Corporation | Method and apparatus for producing aligned carbon nanotube thermal interface structure |
US6924335B2 (en) * | 2002-11-14 | 2005-08-02 | Hon Hai Precision Ind. Co., Ltd. | Thermal interface material and method for making same |
US20040266065A1 (en) * | 2003-06-25 | 2004-12-30 | Yuegang Zhang | Method of fabricating a composite carbon nanotube thermal interface device |
US20040265489A1 (en) * | 2003-06-25 | 2004-12-30 | Dubin Valery M. | Methods of fabricating a composite carbon nanotube thermal interface device |
US20050167647A1 (en) * | 2004-02-04 | 2005-08-04 | Tsinghua University | Thermal interface material and method for manufacturing same |
US7148512B2 (en) * | 2004-03-12 | 2006-12-12 | Hon Hai Precision Industry Co., Ltd. | Thermal interface with silver-filled carbon nanotubes |
US7160620B2 (en) * | 2004-04-10 | 2007-01-09 | Tsinghua University | Thermal interface material and method for manufacturing same |
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US20120034418A1 (en) * | 2007-02-22 | 2012-02-09 | Dow Corning Corporation | Process for Preparing Conductive Films and Articles Prepared Using the Process |
US8064203B2 (en) * | 2007-02-22 | 2011-11-22 | Dow Corning Corporation | Process for preparing conductive films and articles prepared using the process |
US20100061063A1 (en) * | 2007-02-22 | 2010-03-11 | Carl Fairbank | Process for Preparing Conductive Films and Articles Prepared Using the Process |
US20120034422A1 (en) * | 2007-02-22 | 2012-02-09 | Dow Corning Corporation | Process for Preparing Conductive Films and Articles Prepared Using the Process |
US9484543B2 (en) * | 2007-07-10 | 2016-11-01 | California Institute Of Technology | Fabrication of anchored carbon nanotube array devices for integrated light collection and energy conversion |
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US20110236619A1 (en) * | 2007-07-10 | 2011-09-29 | Elijah Bodhi Sansom | Fabrication of anchored carbon nanotube array devices for integrated light collection and energy conversion |
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US8743546B2 (en) | 2007-10-22 | 2014-06-03 | Fujitsu Limited | Sheet structure and method of manufacturing the same |
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US20100021736A1 (en) * | 2008-07-25 | 2010-01-28 | Slinker Keith A | Interface-infused nanotube interconnect |
EP2149538A3 (en) * | 2008-07-25 | 2010-12-15 | Lockheed Martin Corporation | Interface-infused nanotube interconnect |
US8435606B1 (en) * | 2008-08-01 | 2013-05-07 | Hrl Laboratories, Llc | Polymer-infused carbon nanotube array and method |
US8052825B2 (en) * | 2008-09-12 | 2011-11-08 | Tsinghua University | Method for making composite material having carbon nanotube array |
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US8227080B2 (en) | 2008-09-18 | 2012-07-24 | Nitto Denko Corporation | Carbon nanotube aggregate |
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Also Published As
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US20080087646A1 (en) | 2008-04-17 |
CN101054467B (en) | 2010-05-26 |
US7641938B2 (en) | 2010-01-05 |
JP4723529B2 (en) | 2011-07-13 |
JP2007284679A (en) | 2007-11-01 |
CN101054467A (en) | 2007-10-17 |
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