US20070244245A1 - Carbon nanotube composite material and method for manufacturing the same - Google Patents

Carbon nanotube composite material and method for manufacturing the same Download PDF

Info

Publication number
US20070244245A1
US20070244245A1 US11/309,822 US30982206A US2007244245A1 US 20070244245 A1 US20070244245 A1 US 20070244245A1 US 30982206 A US30982206 A US 30982206A US 2007244245 A1 US2007244245 A1 US 2007244245A1
Authority
US
United States
Prior art keywords
carbon nanotube
end portion
protective layer
matrix material
nanotube array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/309,822
Inventor
Chang-Hong Liu
Yuan Yao
Shou-Shan Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tsinghua University
Hon Hai Precision Industry Co Ltd
Original Assignee
Tsinghua University
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsinghua University, Hon Hai Precision Industry Co Ltd filed Critical Tsinghua University
Assigned to TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD. reassignment TSINGHUA UNIVERSITY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FAN, SHOU-SHAN, LIU, CHANG-HONG, YAO, YUAN
Publication of US20070244245A1 publication Critical patent/US20070244245A1/en
Priority to US11/986,365 priority Critical patent/US7641938B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • C08K7/24Expanded, porous or hollow particles inorganic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/30Self-sustaining carbon mass or layer with impregnant or other layer

Definitions

  • the present invention relates to composite materials and manufacturing methods thereof and, more particularly, to a carbon nanotube composite material and a manufacturing method thereof.
  • CNTs Carbon NanoTubes
  • CNTs are tube-shaped structures composed of graphite.
  • CNTs have a high Young's modulus, high thermal conductivity, and high electrical conductivity, among other properties. Due to these and the other properties, it has been suggested that CNTs can play an important role in fields such as microelectronics, material science, biology, and chemistry.
  • thermally conductive material that conducts heat by using CNTs.
  • the thermally conductive material is formed by injection molding and has numerous CNTs incorporated in a matrix material.
  • a first surface of the thermally conductive material engages with an electronic device, and a second surface of the thermally conductive material engages with a heat sink.
  • the second surface has a larger area than the first one, so that heat can be uniformly spread out to the larger second surface.
  • the thermally conductive material formed by injection molding is relatively thick. This increases a bulk of the thermally conductive material and reduces its flexibility.
  • CNTs are disposed in the matrix material randomly and are multidirectional in orientation. This random disposition means that heat tends to spread uniformly through the thermally conductive material, retaining much of the heat within the heat transfer material. Accordingly, the heat does not spread efficiently from the first surface engaged with the electronic device to the second surface engaged with the heat sink.
  • a thin carbon nanotube composite material with controlled nanotube orientation within one or more selective patterns and, thus, with good thermal/electrical conductivity, and a method for manufacturing such a material is desired.
  • a carbon nanotube composite material includes a matrix material having two opposite surfaces, a number of CNTs each having two opposite end portions embedded in the matrix material. The two opposite end portions of CNTs respectively extend out of the two opposite surfaces of the matrix material.
  • a method for manufacturing the carbon nanotube composite material includes the steps of: providing a substrate and forming a carbon nanotube array in a selective pattern thereon, each carbon nanotube (CNT) in the carbon nanotube array having respective first and second end portions; forming a first protective layer on the respective first end portion of the CNTs; forming a second protective layer on the respective second end portion of the CNTs; filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material; and removing the first protective layer and the second protective layer from the carbon nanotube array.
  • CNT carbon nanotube
  • FIG. 1 is a schematic, isometric view of a carbon nanotube composite material according to a preferred embodiment
  • FIG. 2 is a schematic, side view of the carbon nanotube composite material of FIG. 1 ;
  • FIG. 3 is a top view of the carbon nanotube composite material, in which several carbon nanotube array patterns are provided, according to a preferred embodiment
  • FIG. 4 is a flow chart of a method for manufacturing the carbon nanotube composite material of FIG. 1 ;
  • FIG. 5 to FIG. 9 are schematic views illustrating the manufacturing steps 1 - 5 in FIG. 4 ;
  • a carbon nanotube composite material 10 includes a matrix material 12 and a carbon nanotube array 14 .
  • the matrix material 12 has a first surface 102 and a second surface 104 opposite to the first surface 102 .
  • the carbon nanotube array 14 is embedded in the matrix material 12 , the CNTs of the carbon nanotube array 14 being uniformly dispersed in a desired pattern.
  • Each CNT of the carbon nanotube array 14 has a first end portion 112 and a second end portion 114 opposite to the first end portion 112 .
  • the two opposite end portions 112 and 114 advantageously extend at least to the two opposite surfaces 102 , 104 , respectively, and, in order to facilitate a connection with other components, are, further advantageously, exposed. If not exposed, however, the end portions 112 and 114 are beneficially offered protection by the surrounding matrix material 12 but do have the drawback of not being able to be as intimately connected to adjoining components as may be possible if exposed.
  • the matrix material 12 is, advantageously, selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic.
  • the two opposite surfaces 102 and 104 are substantially parallel to each other.
  • the carbon nanotube array 14 is beneficially in a form of an aligned carbon nanotube array.
  • Each CNT of the carbon nanotube array 14 is substantially parallel to one another and further substantially perpendicular to the two opposite surfaces 102 and 104 .
  • each CNT of the carbon nanotube array 14 can provide a direct, shortest-distance thermal conduction path and/or electrical transmission path from one surface to another of the matrix material 12 .
  • a patterned carbon nanotube composite material 20 includes a matrix material 22 having two opposite surfaces and a number of patterned carbon nanotube arrays 24 embedded therein.
  • Each CNT of the carbon nanotube arrays 24 includes two opposite end portion that respectively extend from two opposite surfaces of the matrix material 22 .
  • the carbon nanotube arrays 24 can be patterned in a desired position, e.g., of an Integrated Circuit (IC) chip and/or can be formed into a geometrical figure, such as a circle, rectangle, ellipse, square, or any combination thereof.
  • the carbon nanotube array 24 is sandwiched between the IC chip and a printed circuit board (PCB) for improving electrical connection therebetween and/or thermal conduction from the IC chip to ambient and/or a heat sink.
  • PCB printed circuit board
  • a method for manufacturing the carbon nanotube composite material 10 employs an in-situ injection molding process, which comprises the steps of:
  • Step 1 providing a substrate and forming a patterned carbon nanotube array thereon, each carbon nanotube having a first end portion and an opposite second end portion;
  • Step 2 forming a first protective layer on the first end portions of the CNTs
  • Step 3 removing the substrate and forming a second protective layer on the second end portion of the CNTs;
  • Step 4 filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material
  • Step 5 removing the protective layers from the CNTs.
  • a substrate 16 is provided and a patterned carbon nanotube array 14 is formed thereon.
  • Each CNT of the carbon nanotube array 14 has a first end portion 112 and an opposite second end portion 114 , and a number of clearances 116 are defined among the adjacent CNTs.
  • the carbon nanotube array 14 can be formed, for example, by a chemical vapor deposition method.
  • a silicon wafer is used as the substrate 16 , iron as the catalyst film, and ethylene as the carbon source gas.
  • An iron film pattern having a thickness of about 5 nanometers (nm) is formed on the substrate 16 and is annealed in air at 300° C. Then, the substrate 16 with the iron film deposited thereon is placed into a chemical vapor deposition chamber (not labeled), an ethylene gas is provided therein at 700° C., and then the carbon nanotube array 14 is produced.
  • the carbon nanotube array 14 grown is about 0.3 millimeters (mm) high and substantially perpendicularly to the substrate 16 .
  • the first protective layer 18 may only include the polyester film 124 .
  • the polyester film 124 can be directly attached to the carbon nanotube array 14 as follows: placing the polyester film 124 on the carbon nanotube array 14 ; and pressing the first end portions 112 of the carbon nanotube array 14 into the polyester film 124 , thereby attaching the polyester film 124 to the carbon nanotube array 14 .
  • step 3 as shown in FIG. 7 , the substrate 16 is removed from the second end portions 114 , and the second protective layer 18 ′ is attached to the second end portions 114 .
  • the second protective layer 18 ′ includes a pressure sensitive adhesive layer 122 ′ and a polyester film 124 ′.
  • the step of attaching the second protective layer 18 ′ to the second end portions 114 is similar to that of the first protective layer 18 in the step 3 .
  • the carbon nanotube array 14 along with the two protective layers 18 and 18 ′ attached on the two opposite end portions 112 and 114 thereof constitute an injection mold.
  • step 3 is an optional step.
  • the carbon nanotube array 14 can form an injection mold along with the first protective layer 18 attached to the first end portions 112 and the substrate 16 attached to the second end portions 114 .
  • the substrate 16 could be permitted to remain instead of being replaced with the second protective layer 18 ′ and to thereby act as part of the injection mold.
  • step 4 the clearances 116 among the carbon nanotube array 14 are filled with the matrix material 12 .
  • This step can be performed in the following manner: immersing the carbon nanotube array 14 with two attached protective layers 18 and 18 ′ into a melt or solution of the matrix material 12 ; taking the carbon nanotube array 14 , now having the matrix material 12 filled among the clearances 116 , out of the melted or solution of the matrix material 12 ; and curing the matrix material 12 among the clearances 116 in vacuum at room temperature for 24 hours, thereby causing the matrix material 12 to become soft and elastic.
  • the matrix material 12 is advantageously selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic.
  • the matrix material 12 is made from the Sylgard 160, a type of a 2-part silicone elastomer, which is available from Dow Corning.
  • Sylgard 160 is supplied, as two separate liquid components comprised of part A and part B to be mixed in a 1:1 ratio by weight or volume.
  • a mass percent of the CNTs in the carbon nanotube composite material is about 5 wt %.
  • both protective layers 18 and 18 ′ are removed from the carbon nanotube array 14 .
  • the protective layers 18 and 18 ′ can be removed, for example, by directly stripping off the protective layers 18 and 18 ′ and sequentially dissolving away any of the remaining pressure sensitive adhesive layers 122 and 122 ′, by using an organic solution.
  • the organic solvent is xylene.
  • the method for manufacturing the carbon nanotube composite material 10 can further include a reactive ion etching (RIE) step or another selective material removal step to ensure the both end portions 112 and 114 (i.e., both end portions of the respective CNTs) of the carbon nanotube array 14 be sufficiently exposed.
  • RIE reactive ion etching
  • the RIE process is carried out using O2 plasma at a pressure of 6 pascals (Pa) and with a power of 150 watts (W) for 15 minutes (min) at each of the surfaces 102 and 104 of the matrix material 12 .
  • RIE reactive ion etching
  • the resulted carbon nanotube composite 10 can be further trimmed into any desired geometrical figure for used as, e.g., electrical and/or thermal conductive component.
  • the CNTs of the carbon nanotube composite 10 are bounded tightly within the matrix material 12 , a stability and reliability of the carbon nanotube composite 10 is improved.
  • electrical conductivities of the carbon nanotube composite material 10 are measured.
  • the solid line represents axial conductivity along a direction parallel to longitudinal axes of the CNTs
  • the dashed line represents lateral conductivity along a direction perpendicular to the longitudinal axes of the carbon nanotubes.
  • the axial conductivity over the entire voltage range, is markedly higher than the lateral conductivity.
  • the maximum performance of thermal and/or electrical conduction and relative thereto along the axial direction can be expected.
  • the two end portions 112 , 114 of the CNTs of the carbon nanotube array 14 are protruded out of two surfaces 102 , 104 .
  • the two end portions 12 , 114 of CNTs form thermal contact surfaces or electrical connection surfaces directly in the axial direction, and the overall electrical conductivity/thermal conductivity of the carbon nanotube composite material 10 is improved.
  • the carbon nanotube composite material 10 can be formed in a desired pattern, according to the application requirement, and can, e.g., be in a film form that makes them portable and integral.
  • the thickness and other dimensions of the carbon nanotube composite material 10 can be chosen by the designer based on the use requirements and, thus, are not limited to thin film applications.
  • the carbon nanotube composite material 10 can, e.g., be applied in a large-scaled IC and furthermore in any large-scaled electronic component. Additional uses for the carbon nanotube composite material 10 beyond the electronics area (e.g., thermal transfer devices) are readily conceivable and are considered to be within the scope of the present composite material.

Abstract

A carbon nanotube composite material (10) includes a matrix material (12) having two opposite surfaces (102) and (104), a number of CNTs (14) each having two opposite end portions (112) and (114) embedded in the matrix material. The two opposite end portions of each CNT extend to and, potentially, out of the respective two opposite surfaces of the matrix material. A method for manufacturing the carbon nanotube composite material includes the steps of: providing a substrate and forming a carbon nanotube array in a selective pattern thereon; providing a pair of protective layers, a respective protective layer being attached on a corresponding portion of ends of CNTs; filling clearances existing among CNTs and between the two protective layers with a matrix material; and removing the protective layers from CNTs.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is related to commonly-assigned, co-pending applications: entitled, “THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME”, filed * * * (Atty. Docket No. US7491); “THERMAL INTERFACE MATERIAL AND METHOD FOR MANUFACTURING SAME”, filed * * * (Atty. Docket No. US7258); and “THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME”, filed * * * (Atty. Docket No. US7257). The disclosures of the above-identified applications are incorporated herein by reference.
  • FIELD OF THE INVENTION
  • The present invention relates to composite materials and manufacturing methods thereof and, more particularly, to a carbon nanotube composite material and a manufacturing method thereof.
  • DESCRIPTION OF RELATED ART
  • CNTs (Carbon NanoTubes) are tube-shaped structures composed of graphite. CNTs have a high Young's modulus, high thermal conductivity, and high electrical conductivity, among other properties. Due to these and the other properties, it has been suggested that CNTs can play an important role in fields such as microelectronics, material science, biology, and chemistry.
  • A kind of thermally conductive material that conducts heat by using CNTs has been developed. The thermally conductive material is formed by injection molding and has numerous CNTs incorporated in a matrix material. A first surface of the thermally conductive material engages with an electronic device, and a second surface of the thermally conductive material engages with a heat sink. The second surface has a larger area than the first one, so that heat can be uniformly spread out to the larger second surface. However, the thermally conductive material formed by injection molding is relatively thick. This increases a bulk of the thermally conductive material and reduces its flexibility. Furthermore, CNTs are disposed in the matrix material randomly and are multidirectional in orientation. This random disposition means that heat tends to spread uniformly through the thermally conductive material, retaining much of the heat within the heat transfer material. Accordingly, the heat does not spread efficiently from the first surface engaged with the electronic device to the second surface engaged with the heat sink.
  • Therefore, a thin carbon nanotube composite material, with controlled nanotube orientation within one or more selective patterns and, thus, with good thermal/electrical conductivity, and a method for manufacturing such a material is desired.
  • SUMMARY OF THE INVENTION
  • A carbon nanotube composite material includes a matrix material having two opposite surfaces, a number of CNTs each having two opposite end portions embedded in the matrix material. The two opposite end portions of CNTs respectively extend out of the two opposite surfaces of the matrix material.
  • A method for manufacturing the carbon nanotube composite material includes the steps of: providing a substrate and forming a carbon nanotube array in a selective pattern thereon, each carbon nanotube (CNT) in the carbon nanotube array having respective first and second end portions; forming a first protective layer on the respective first end portion of the CNTs; forming a second protective layer on the respective second end portion of the CNTs; filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material; and removing the first protective layer and the second protective layer from the carbon nanotube array.
  • Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the carbon nanotube composite material can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present carbon nanotube composite material. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is a schematic, isometric view of a carbon nanotube composite material according to a preferred embodiment;
  • FIG. 2 is a schematic, side view of the carbon nanotube composite material of FIG. 1;
  • FIG. 3 is a top view of the carbon nanotube composite material, in which several carbon nanotube array patterns are provided, according to a preferred embodiment;
  • FIG. 4 is a flow chart of a method for manufacturing the carbon nanotube composite material of FIG. 1;
  • FIG. 5 to FIG. 9 are schematic views illustrating the manufacturing steps 1-5 in FIG. 4; and
  • FIG. 10 is a diagram showing an electrical property of the carbon nanotube composite material according to a preferred embodiment.
  • The exemplifications set out herein illustrate at least one preferred embodiment of the present carbon nanotube composite material and the method for manufacturing the same, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1 and FIG. 2, a carbon nanotube composite material 10, according to a preferred embodiment, includes a matrix material 12 and a carbon nanotube array 14. The matrix material 12 has a first surface 102 and a second surface 104 opposite to the first surface 102. The carbon nanotube array 14 is embedded in the matrix material 12, the CNTs of the carbon nanotube array 14 being uniformly dispersed in a desired pattern. Each CNT of the carbon nanotube array 14 has a first end portion 112 and a second end portion 114 opposite to the first end portion 112. The two opposite end portions 112 and 114 advantageously extend at least to the two opposite surfaces 102, 104, respectively, and, in order to facilitate a connection with other components, are, further advantageously, exposed. If not exposed, however, the end portions 112 and 114 are beneficially offered protection by the surrounding matrix material 12 but do have the drawback of not being able to be as intimately connected to adjoining components as may be possible if exposed. The matrix material 12 is, advantageously, selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic.
  • The two opposite surfaces 102 and 104 are substantially parallel to each other. The carbon nanotube array 14 is beneficially in a form of an aligned carbon nanotube array. Each CNT of the carbon nanotube array 14 is substantially parallel to one another and further substantially perpendicular to the two opposite surfaces 102 and 104. Thus, each CNT of the carbon nanotube array 14 can provide a direct, shortest-distance thermal conduction path and/or electrical transmission path from one surface to another of the matrix material 12.
  • Referring to FIG. 3, a patterned carbon nanotube composite material 20 includes a matrix material 22 having two opposite surfaces and a number of patterned carbon nanotube arrays 24 embedded therein. Each CNT of the carbon nanotube arrays 24 includes two opposite end portion that respectively extend from two opposite surfaces of the matrix material 22. The carbon nanotube arrays 24 can be patterned in a desired position, e.g., of an Integrated Circuit (IC) chip and/or can be formed into a geometrical figure, such as a circle, rectangle, ellipse, square, or any combination thereof. The carbon nanotube array 24 is sandwiched between the IC chip and a printed circuit board (PCB) for improving electrical connection therebetween and/or thermal conduction from the IC chip to ambient and/or a heat sink.
  • As shown in FIG. 4, a method for manufacturing the carbon nanotube composite material 10 is provided. The method employs an in-situ injection molding process, which comprises the steps of:
  • Step 1, providing a substrate and forming a patterned carbon nanotube array thereon, each carbon nanotube having a first end portion and an opposite second end portion;
  • Step 2, forming a first protective layer on the first end portions of the CNTs;
  • Step 3, removing the substrate and forming a second protective layer on the second end portion of the CNTs;
  • Step 4, filling clearances among the CNTs between the first protective layer and the second protective layer with a matrix material; and
  • Step 5, removing the protective layers from the CNTs.
  • Referring to FIGS. 5 through 9, the method for manufacturing the carbon nanotube composite material 10, in accordance with the preferred embodiment, is described below, in detail.
  • In step 1, as shown in FIG. 5, a substrate 16 is provided and a patterned carbon nanotube array 14 is formed thereon. Each CNT of the carbon nanotube array 14 has a first end portion 112 and an opposite second end portion 114, and a number of clearances 116 are defined among the adjacent CNTs. The carbon nanotube array 14 can be formed, for example, by a chemical vapor deposition method.
  • The chemical vapor deposition method for manufacturing the carbon nanotube array 14 generally includes steps of: firstly, forming a catalyst film (not labeled) on the substrate 16 and then growing carbon nanotube array 14 thereon by providing a carbon source gas at high temperature. The substrate 16 is beneficially made from a material selected from the group consisting of glass, silicon, metal, and metal oxide. The catalyst film can, usefully, be made from material selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), and an alloy thereof. The carbon source gas can be, e.g., methane, ethylene, propylene, acetylene, methanol, ethanol, or some mixtures thereof. In the preferred embodiment, a silicon wafer is used as the substrate 16, iron as the catalyst film, and ethylene as the carbon source gas. An iron film pattern having a thickness of about 5 nanometers (nm) is formed on the substrate 16 and is annealed in air at 300° C. Then, the substrate 16 with the iron film deposited thereon is placed into a chemical vapor deposition chamber (not labeled), an ethylene gas is provided therein at 700° C., and then the carbon nanotube array 14 is produced. The carbon nanotube array 14 grown is about 0.3 millimeters (mm) high and substantially perpendicularly to the substrate 16.
  • In step 2, as shown in FIG. 6, a first protective layer 18 is formed on the first end portions 112 of the carbon nanotube array 14. The first protective layer 18 includes a polyester film 124 and a pressure sensitive adhesive layer 122 thereon. In the preferred embodiment, the pressure sensitive adhesive layer 122 is about 0.05 mm thick and is coated on a side of the polyester film 124. More specifically, the first protective layer 18 can be attached to the carbon nanotube array 14 as follows: placing the first protective layer 18 on the carbon nanotube array 14 with the pressure sensitive adhesive 122 facing towards the first end portions 112; pressing the first end portions 112 of the carbon nanotube array 14 into the pressure sensitive adhesive layer 122, thereby directly attaching the first protecting layer 18 to the carbon nanotube array 14. The pressure sensitive adhesive layer 122 is a soft and adhesive material, which allows the first end portions 112 to be inserted thereinto when an external force is applied. The pressure sensitive adhesive layer 122 used in this exemplary embodiment is YM881 (produced by Light Industry Institute, Fushun, China). The pressure sensitive adhesive layer 122 can, alternatively, be made of other adhesive materials with high viscosity, such as glue. Moreover, the polyester film 124 may be made of other polymers, such as polyethylene.
  • In another embodiment, the first protective layer 18 may only include the polyester film 124. The polyester film 124 can be directly attached to the carbon nanotube array 14 as follows: placing the polyester film 124 on the carbon nanotube array 14; and pressing the first end portions 112 of the carbon nanotube array 14 into the polyester film 124, thereby attaching the polyester film 124 to the carbon nanotube array 14.
  • In step 3, as shown in FIG. 7, the substrate 16 is removed from the second end portions 114, and the second protective layer 18′ is attached to the second end portions 114. The second protective layer 18′ includes a pressure sensitive adhesive layer 122′ and a polyester film 124′. The step of attaching the second protective layer 18′ to the second end portions 114 is similar to that of the first protective layer 18 in the step 3. Thereby, the carbon nanotube array 14 along with the two protective layers 18 and 18′ attached on the two opposite end portions 112 and 114 thereof constitute an injection mold.
  • It is noted that step 3 is an optional step. The carbon nanotube array 14 can form an injection mold along with the first protective layer 18 attached to the first end portions 112 and the substrate 16 attached to the second end portions 114. As a further alternative, the substrate 16 could be permitted to remain instead of being replaced with the second protective layer 18′ and to thereby act as part of the injection mold.
  • In step 4, as shown in FIG. 8, the clearances 116 among the carbon nanotube array 14 are filled with the matrix material 12. This step can be performed in the following manner: immersing the carbon nanotube array 14 with two attached protective layers 18 and 18′ into a melt or solution of the matrix material 12; taking the carbon nanotube array 14, now having the matrix material 12 filled among the clearances 116, out of the melted or solution of the matrix material 12; and curing the matrix material 12 among the clearances 116 in vacuum at room temperature for 24 hours, thereby causing the matrix material 12 to become soft and elastic. The matrix material 12 is advantageously selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic. In the preferred embodiment, the matrix material 12 is made from the Sylgard 160, a type of a 2-part silicone elastomer, which is available from Dow Corning. The Sylgard 160 is supplied, as two separate liquid components comprised of part A and part B to be mixed in a 1:1 ratio by weight or volume. A mass percent of the CNTs in the carbon nanotube composite material is about 5 wt %.
  • In step 5, as shown in FIG. 2, both protective layers 18 and 18′ are removed from the carbon nanotube array 14. The protective layers 18 and 18′ can be removed, for example, by directly stripping off the protective layers 18 and 18′ and sequentially dissolving away any of the remaining pressure sensitive adhesive layers 122 and 122′, by using an organic solution. In the preferred embodiment, the organic solvent is xylene. Thus, the carbon nanotube composite material 10 is obtained, which has two end portions 12, 114 of the carbon nanotube array 14 extending from the two surfaces 102 and 104 of the matrix material 12.
  • Preferably, the method for manufacturing the carbon nanotube composite material 10 can further include a reactive ion etching (RIE) step or another selective material removal step to ensure the both end portions 112 and 114 (i.e., both end portions of the respective CNTs) of the carbon nanotube array 14 be sufficiently exposed. In the preferred embodiment, the RIE process is carried out using O2 plasma at a pressure of 6 pascals (Pa) and with a power of 150 watts (W) for 15 minutes (min) at each of the surfaces 102 and 104 of the matrix material 12. Finally, a carbon nanotube composite material 10 having the both end portions 112 and 114 fully protruding out thereof is obtained.
  • The resulted carbon nanotube composite 10 can be further trimmed into any desired geometrical figure for used as, e.g., electrical and/or thermal conductive component. In addition, since the CNTs of the carbon nanotube composite 10 are bounded tightly within the matrix material 12, a stability and reliability of the carbon nanotube composite 10 is improved.
  • Referring to FIG. 9, electrical conductivities of the carbon nanotube composite material 10 are measured. The solid line represents axial conductivity along a direction parallel to longitudinal axes of the CNTs, and the dashed line represents lateral conductivity along a direction perpendicular to the longitudinal axes of the carbon nanotubes. As be expected to given the alignment of the CNTs, the axial conductivity, over the entire voltage range, is markedly higher than the lateral conductivity. As a result, when the carbon nanotube composite material 10 is aligned, the maximum performance of thermal and/or electrical conduction and relative thereto along the axial direction can be expected.
  • The two end portions 112, 114 of the CNTs of the carbon nanotube array 14 are protruded out of two surfaces 102, 104. Thus, the two end portions 12, 114 of CNTs form thermal contact surfaces or electrical connection surfaces directly in the axial direction, and the overall electrical conductivity/thermal conductivity of the carbon nanotube composite material 10 is improved. The carbon nanotube composite material 10 can be formed in a desired pattern, according to the application requirement, and can, e.g., be in a film form that makes them portable and integral. Moreover, the thickness and other dimensions of the carbon nanotube composite material 10 can be chosen by the designer based on the use requirements and, thus, are not limited to thin film applications. For these reasons, the carbon nanotube composite material 10 can, e.g., be applied in a large-scaled IC and furthermore in any large-scaled electronic component. Additional uses for the carbon nanotube composite material 10 beyond the electronics area (e.g., thermal transfer devices) are readily conceivable and are considered to be within the scope of the present composite material.
  • Finally, it is to be understood that the embodiments mentioned above are intended to illustrate rather than limit the invention. Variations may be made to the embodiments without departing from the spirit of the invention as claimed. The above-described embodiments illustrate the scope of the invention but do not restrict the scope of the invention.

Claims (17)

1. A carbon nanotube composite material comprising:
a matrix material having a first surface and an opposite second surface; and
a plurality of carbon nanotubes embedded in the matrix material, the carbon nanotubes being uniformly distributed therein in a desired pattern, each of the carbon nanotubes having a first end portion and an opposite second end portion, the two opposite end portions of the carbon nanotubes respectively extending at least to the corresponding surfaces of the matrix material.
2. The carbon nanotube composite material as claimed in claim 1, wherein the two opposite end portions of the carbon nanotubes respectively extend out of the corresponding surfaces of the matrix material.
3. The carbon nanotube composite material as claimed in claim 1, wherein two opposite surfaces of the matrix material are substantially parallel to each other.
4. The carbon nanotube composite material as claimed in claim 1, wherein each of the carbon nanotubes is substantially parallel to one another.
5. The carbon nanotube composite material as claimed in claim 1, wherein the carbon nanotubes are substantially perpendicular to the two opposite surfaces of the matrix material.
6. The carbon nanotube composite material as claimed in claim 1, wherein the matrix material is comprised of a material selected from the group consisting of silica gel, polyethylene glycol, polyester, epoxy resin, and acrylic.
7. A method for manufacturing a carbon nanotube composite material, comprising the steps of:
providing a substrate and forming a carbon nanotube array in a desired pattern thereon, the carbon nanotube array defining a top end portion and a bottom end portion, the bottom end portion being attached to the substrate, the carbon nanotube array having a plurality of clearances among neighboring carbon nanotubes of the carbon nanotube array;
attaching a protective layer on the top end portion of the carbon nanotube array;
filling clearances among the carbon nanotubes with a matrix material; and
removing the first protective layer and the substrate from the carbon nanotube array so as to exposing the top end portion and the bottom end portion of the carbon nanotube array.
8. The method as claimed in claim 7, further comprising the step of etching the matrix material adjacent the top end portion and the bottom end portion of the carbon nanotube array for further exposing the two end portions.
9. The method as claimed in claim 7, wherein the first protective layer comprises a polyester film.
10. The method as claimed in claim 9, wherein the first protective layer further comprises a pressure sensitive adhesive layer.
11. The method as claimed in claim 7, wherein the step of attaching the first protective layer comprises the steps of: placing the first protective layer on the top end portion of the carbon nanotube array; and pressing the first protective layer into the top end portion of the carbon nanotube array.
12. The method for as claimed in claim 7, wherein the clearances are further defined as being between the substrate and the first protective layer.
13. The method as claimed in claim 7, wherein matrix material is selected from the group comprising of silica gel, polyethylene glycol, polyester, epoxy resin, and an acrylic.
14. The method as claimed in claim 7, prior to the step of filling, further comprising the steps of:
removing the substrate from the bottom end portion of the carbon nanotube array; and
forming a second protective layer on the bottom end portion of the carbon nanotube array.
15. The method as claimed in claim 14, wherein the second protective layer comprises a polyester film.
16. The method as claimed in claim 15, wherein the second protective layer further comprises a pressure sensitive adhesive layer.
17. The method as claimed in claim 7, wherein the filling of clearances is achieved by an injection molding process.
US11/309,822 2006-04-14 2006-10-03 Carbon nanotube composite material and method for manufacturing the same Abandoned US20070244245A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/986,365 US7641938B2 (en) 2006-04-14 2007-11-21 Method for manufacturing carbon nanotube composite material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200610060309.5 2006-04-14
CN200610060309A CN101054467B (en) 2006-04-14 2006-04-14 Carbon nano-tube composite material and preparation method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/986,365 Division US7641938B2 (en) 2006-04-14 2007-11-21 Method for manufacturing carbon nanotube composite material

Publications (1)

Publication Number Publication Date
US20070244245A1 true US20070244245A1 (en) 2007-10-18

Family

ID=38605639

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/309,822 Abandoned US20070244245A1 (en) 2006-04-14 2006-10-03 Carbon nanotube composite material and method for manufacturing the same
US11/986,365 Active US7641938B2 (en) 2006-04-14 2007-11-21 Method for manufacturing carbon nanotube composite material

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/986,365 Active US7641938B2 (en) 2006-04-14 2007-11-21 Method for manufacturing carbon nanotube composite material

Country Status (3)

Country Link
US (2) US20070244245A1 (en)
JP (1) JP4723529B2 (en)
CN (1) CN101054467B (en)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090032496A1 (en) * 2007-07-13 2009-02-05 Tsinghua University Method for manufacturing thermal interface material having carbon nanotubes
US20090032290A1 (en) * 2007-08-03 2009-02-05 Foxconn Advanced Technology Inc. Flexible printed circuit board base film, flexible laminates and flexible printed circuit boards including same
US20090237886A1 (en) * 2008-03-18 2009-09-24 Fujitsu Limited Sheet structure and method of manufacturing sheet structure
US20100021736A1 (en) * 2008-07-25 2010-01-28 Slinker Keith A Interface-infused nanotube interconnect
US20100027221A1 (en) * 2007-10-22 2010-02-04 Fujitsu Limited Sheet structure and method of manufacturing the same
US20100061063A1 (en) * 2007-02-22 2010-03-11 Carl Fairbank Process for Preparing Conductive Films and Articles Prepared Using the Process
US20100065190A1 (en) * 2008-09-12 2010-03-18 Tsinghua University Method for making composite material having carbon nanotube array
US20100219550A1 (en) * 2009-03-02 2010-09-02 Tsinghua University Method for making thermal interface material
US20110030938A1 (en) * 2009-08-05 2011-02-10 Tsinghua University Heat dissipation structure and heat dissipation system adopting the same
US20110133135A1 (en) * 2008-09-18 2011-06-09 Nitto Denko Corporation Carbon nanotube aggregate
WO2011096861A1 (en) * 2010-02-04 2011-08-11 Saab Ab A smooth surface forming tool and manufacture thereof
US20110236619A1 (en) * 2007-07-10 2011-09-29 Elijah Bodhi Sansom Fabrication of anchored carbon nanotube array devices for integrated light collection and energy conversion
US20120218713A1 (en) * 2008-11-14 2012-08-30 Fujitsu Limited Heat radiation material, electronic device and method of manufacturing electronic device
US8323607B2 (en) 2010-06-29 2012-12-04 Tsinghua University Carbon nanotube structure
US8435606B1 (en) * 2008-08-01 2013-05-07 Hrl Laboratories, Llc Polymer-infused carbon nanotube array and method
EP2709948A2 (en) * 2011-05-18 2014-03-26 California Institute of Technology Method for selectively anchoring and exposing large numbers of nanoscale structures
US20140102687A1 (en) * 2009-05-27 2014-04-17 Hon Hai Precision Industry Co., Ltd. Thermal interface material
US20140124186A1 (en) * 2012-11-08 2014-05-08 Shinshu University Radiation member
US8976507B2 (en) 2011-03-29 2015-03-10 California Institute Of Technology Method to increase the capacitance of electrochemical carbon nanotube capacitors by conformal deposition of nanoparticles
EP2727881A4 (en) * 2011-07-01 2015-03-18 Nitto Denko Corp Aggregation of fibrous columnar structures
US20150136360A1 (en) * 2013-07-10 2015-05-21 Huawei Technologies Co., Ltd. Thermal interface pad and production method thereof, and heat dissipating system
US9050444B2 (en) 2007-07-10 2015-06-09 California Institute Of Technology Drug delivery and substance transfer facilitated by nano-enhanced device having aligned carbon nanotubes protruding from device surface
US9115424B2 (en) 2010-04-07 2015-08-25 California Institute Of Technology Simple method for producing superhydrophobic carbon nanotube array
US9349543B2 (en) 2012-07-30 2016-05-24 California Institute Of Technology Nano tri-carbon composite systems and manufacture
US9449816B2 (en) 2010-12-10 2016-09-20 California Institute Of Technology Method for producing graphene oxide with tunable gap
JP2017507809A (en) * 2014-02-04 2017-03-23 エヌ12 テクノロジーズ, インク.N12 Technologies, Inc. Articles of nanostructure-reinforced composite and manufacturing method
US10350837B2 (en) 2016-05-31 2019-07-16 Massachusetts Institute Of Technology Composite articles comprising non-linear elongated nanostructures and associated methods
US10595440B2 (en) * 2018-03-02 2020-03-17 Northrop Grumman Systems Corporation Thermal gasket with high transverse thermal conductivity
US10766232B2 (en) 2012-10-23 2020-09-08 Saab Ab Smooth surface forming tool and manufacture thereof
US10906285B2 (en) 2006-05-19 2021-02-02 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
US11031657B2 (en) 2017-11-28 2021-06-08 Massachusetts Institute Of Technology Separators comprising elongated nanostructures and associated devices and methods, including devices and methods for energy storage and/or use
US11760848B2 (en) 2017-09-15 2023-09-19 Massachusetts Institute Of Technology Low-defect fabrication of composite materials
US11787691B2 (en) 2006-05-19 2023-10-17 Massachusetts Institute Of Technology Continuous process for the production of nanostructures including nanotubes

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7454295B2 (en) 1998-12-17 2008-11-18 The Watereye Corporation Anti-terrorism water quality monitoring system
US20110125412A1 (en) * 1998-12-17 2011-05-26 Hach Company Remote monitoring of carbon nanotube sensor
US9056783B2 (en) * 1998-12-17 2015-06-16 Hach Company System for monitoring discharges into a waste water collection system
US8958917B2 (en) * 1998-12-17 2015-02-17 Hach Company Method and system for remote monitoring of fluid quality and treatment
US8920619B2 (en) 2003-03-19 2014-12-30 Hach Company Carbon nanotube sensor
WO2007015710A2 (en) 2004-11-09 2007-02-08 Board Of Regents, The University Of Texas System The fabrication and application of nanofiber ribbons and sheets and twisted and non-twisted nanofiber yarns
US7494910B2 (en) 2006-03-06 2009-02-24 Micron Technology, Inc. Methods of forming semiconductor package
CN101353164B (en) * 2007-07-25 2011-03-30 鸿富锦精密工业(深圳)有限公司 High-density carbon nano-tube array preparation
US7900690B2 (en) * 2008-01-07 2011-03-08 King Fahd University Of Petroleum And Minerals Moving carbon nanotube heat sink
CN101582302B (en) * 2008-05-14 2011-12-21 清华大学 Carbon nano tube/conductive polymer composite material
JP2010073843A (en) * 2008-09-18 2010-04-02 Nitto Denko Corp Microprocessor structure
JP2010073842A (en) * 2008-09-18 2010-04-02 Nitto Denko Corp Microprocessor structure
TWI395708B (en) * 2008-11-28 2013-05-11 Hon Hai Prec Ind Co Ltd Method for stretching carbon nanotube film
CN101768427B (en) * 2009-01-07 2012-06-20 清华大学 Thermal interface material and preparation method thereof
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
JP6245805B2 (en) * 2009-08-07 2017-12-13 スマーター アロイズ インコーポレーテッド Shape memory material processing method and shape memory material processing apparatus
JP5447117B2 (en) * 2010-04-09 2014-03-19 富士通株式会社 Manufacturing method of electronic equipment
CN102372266B (en) 2010-08-23 2013-11-06 清华大学 Carbon nanotube composite structure and preparation method thereof
CN102092670B (en) * 2010-12-27 2013-04-17 清华大学 Carbon nano-tube composite structure and preparation method thereof
JP6016339B2 (en) * 2011-08-12 2016-10-26 東京エレクトロン株式会社 Carbon nanotube processing method and processing apparatus
US9903350B2 (en) 2012-08-01 2018-02-27 The Board Of Regents, The University Of Texas System Coiled and non-coiled twisted polymer fiber torsional and tensile actuators
KR101928980B1 (en) 2012-10-24 2018-12-14 한국과학기술원 Carbon Nanotube Membrane Having Regular Pores and Method for Manufacturing the Same
JP6261352B2 (en) * 2014-01-23 2018-01-17 新光電気工業株式会社 Carbon nanotube sheet, semiconductor device, method of manufacturing carbon nanotube sheet, and method of manufacturing semiconductor device
CN104260514B (en) * 2014-09-12 2017-01-25 哈尔滨工业大学 Preparation method of high-conductivity carbon nano tube paper composite material with infrared stealth and lightning protection performance and application of high-conductivity carbon nano tube paper composite material
JP6589124B2 (en) * 2015-04-09 2019-10-16 パナソニックIpマネジメント株式会社 Resin structure and electronic components and electronic equipment using the structure
TW201821585A (en) * 2016-11-30 2018-06-16 國立成功大學 High efficiency thermal conductivity structure
CN109428009B (en) * 2017-08-30 2020-05-15 清华大学 Preparation method of organic light emitting diode
CN109427983B (en) * 2017-08-30 2020-08-11 清华大学 Organic light emitting diode
CN108933068A (en) * 2018-07-02 2018-12-04 东南大学 A kind of nano material field-transmitting cathode patterning preparation method
US11189588B2 (en) 2018-12-31 2021-11-30 Micron Technology, Inc. Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods
US10854549B2 (en) 2018-12-31 2020-12-01 Micron Technology, Inc. Redistribution layers with carbon-based conductive elements, methods of fabrication and related semiconductor device packages and systems
CN109817829A (en) * 2019-01-31 2019-05-28 武汉华星光电半导体显示技术有限公司 Heat dissipation film and display panel
CN109749107B (en) * 2019-02-26 2021-07-30 中国人民解放军国防科技大学 Oriented carbon nanotube/resin film and preparation method thereof
CN112235999B (en) * 2020-09-11 2022-04-29 深圳烯湾科技有限公司 Preparation method of carbon nano tube heat conducting fin
CN112358855B (en) * 2020-10-26 2021-12-28 深圳烯湾科技有限公司 Carbon nano tube heat conducting sheet and preparation method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US20040266065A1 (en) * 2003-06-25 2004-12-30 Yuegang Zhang Method of fabricating a composite carbon nanotube thermal interface device
US20040265489A1 (en) * 2003-06-25 2004-12-30 Dubin Valery M. Methods of fabricating a composite carbon nanotube thermal interface device
US6921462B2 (en) * 2001-12-17 2005-07-26 Intel Corporation Method and apparatus for producing aligned carbon nanotube thermal interface structure
US6924335B2 (en) * 2002-11-14 2005-08-02 Hon Hai Precision Ind. Co., Ltd. Thermal interface material and method for making same
US20050167647A1 (en) * 2004-02-04 2005-08-04 Tsinghua University Thermal interface material and method for manufacturing same
US7148512B2 (en) * 2004-03-12 2006-12-12 Hon Hai Precision Industry Co., Ltd. Thermal interface with silver-filled carbon nanotubes
US7160620B2 (en) * 2004-04-10 2007-01-09 Tsinghua University Thermal interface material and method for manufacturing same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09298260A (en) * 1996-05-01 1997-11-18 Tonen Corp Heat radiation plate
JP3850956B2 (en) * 1997-07-31 2006-11-29 鈴木総業株式会社 Heat dissipation carbon composite board
JP2001294676A (en) * 2000-04-13 2001-10-23 Jsr Corp Heat-conductive sheet, method for producing heat- conductive sheet and radiating structure using heat- conductive sheet
JP4833398B2 (en) * 2000-09-18 2011-12-07 ポリマテック株式会社 Method for producing thermally conductive molded body
JP4697829B2 (en) * 2001-03-15 2011-06-08 ポリマテック株式会社 Carbon nanotube composite molded body and method for producing the same
US6965513B2 (en) * 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures
AT412265B (en) * 2002-11-12 2004-12-27 Electrovac HEAT EXTRACTION COMPONENT
US7398477B2 (en) * 2003-10-31 2008-07-08 International Business Machines Corporation Spiral scrollbar
CN100356556C (en) * 2004-03-13 2007-12-19 鸿富锦精密工业(深圳)有限公司 Thermal interfacial material and method of manufacture
CN1290764C (en) * 2004-05-13 2006-12-20 清华大学 Method for producing Nano carbon tubes in even length in large quantities
JP2006147801A (en) * 2004-11-18 2006-06-08 Seiko Precision Inc Heat dissipating sheet, interface, electronic parts, and manufacturing method of heat dissipating sheet
CN100337981C (en) * 2005-03-24 2007-09-19 清华大学 Thermal interface material and its production method
CN100404242C (en) * 2005-04-14 2008-07-23 清华大学 Heat interface material and its making process
CN100454526C (en) * 2005-06-30 2009-01-21 鸿富锦精密工业(深圳)有限公司 Thermo-interface material producing method
CN1891780B (en) * 2005-07-01 2013-04-24 清华大学 Thermal interface material, and its preparing method
JP2007168263A (en) * 2005-12-22 2007-07-05 Seiko Precision Inc Resin-made case for electronic equipment and manufacturing method of resin molding

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US6921462B2 (en) * 2001-12-17 2005-07-26 Intel Corporation Method and apparatus for producing aligned carbon nanotube thermal interface structure
US20060054490A1 (en) * 2001-12-17 2006-03-16 Intel Corporation Method and apparatus for producing aligned carbon nanotube thermal interface structure
US6924335B2 (en) * 2002-11-14 2005-08-02 Hon Hai Precision Ind. Co., Ltd. Thermal interface material and method for making same
US20040266065A1 (en) * 2003-06-25 2004-12-30 Yuegang Zhang Method of fabricating a composite carbon nanotube thermal interface device
US20040265489A1 (en) * 2003-06-25 2004-12-30 Dubin Valery M. Methods of fabricating a composite carbon nanotube thermal interface device
US20050167647A1 (en) * 2004-02-04 2005-08-04 Tsinghua University Thermal interface material and method for manufacturing same
US7148512B2 (en) * 2004-03-12 2006-12-12 Hon Hai Precision Industry Co., Ltd. Thermal interface with silver-filled carbon nanotubes
US7160620B2 (en) * 2004-04-10 2007-01-09 Tsinghua University Thermal interface material and method for manufacturing same

Cited By (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11458718B2 (en) 2006-05-19 2022-10-04 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
US11787691B2 (en) 2006-05-19 2023-10-17 Massachusetts Institute Of Technology Continuous process for the production of nanostructures including nanotubes
US10906285B2 (en) 2006-05-19 2021-02-02 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
US20120034418A1 (en) * 2007-02-22 2012-02-09 Dow Corning Corporation Process for Preparing Conductive Films and Articles Prepared Using the Process
US8064203B2 (en) * 2007-02-22 2011-11-22 Dow Corning Corporation Process for preparing conductive films and articles prepared using the process
US20100061063A1 (en) * 2007-02-22 2010-03-11 Carl Fairbank Process for Preparing Conductive Films and Articles Prepared Using the Process
US20120034422A1 (en) * 2007-02-22 2012-02-09 Dow Corning Corporation Process for Preparing Conductive Films and Articles Prepared Using the Process
US9484543B2 (en) * 2007-07-10 2016-11-01 California Institute Of Technology Fabrication of anchored carbon nanotube array devices for integrated light collection and energy conversion
US9050444B2 (en) 2007-07-10 2015-06-09 California Institute Of Technology Drug delivery and substance transfer facilitated by nano-enhanced device having aligned carbon nanotubes protruding from device surface
US9352136B2 (en) 2007-07-10 2016-05-31 California Institute Of Technology Drug delivery and substance transfer facilitated by nano-enhanced device having aligned carbon nanotubes protruding from device surface
US20110236619A1 (en) * 2007-07-10 2011-09-29 Elijah Bodhi Sansom Fabrication of anchored carbon nanotube array devices for integrated light collection and energy conversion
US8048322B2 (en) * 2007-07-13 2011-11-01 Tsinghua University Method for manufacturing thermal interface material having carbon nanotubes
US20090032496A1 (en) * 2007-07-13 2009-02-05 Tsinghua University Method for manufacturing thermal interface material having carbon nanotubes
US8164000B2 (en) * 2007-08-03 2012-04-24 Zhen Ding Technology Co., Ltd. Flexible printed circuit boards including carbon nanotube bundles
US20090032290A1 (en) * 2007-08-03 2009-02-05 Foxconn Advanced Technology Inc. Flexible printed circuit board base film, flexible laminates and flexible printed circuit boards including same
US8743546B2 (en) 2007-10-22 2014-06-03 Fujitsu Limited Sheet structure and method of manufacturing the same
US20100027221A1 (en) * 2007-10-22 2010-02-04 Fujitsu Limited Sheet structure and method of manufacturing the same
US8749979B2 (en) * 2008-03-18 2014-06-10 Fujitsu Limited Sheet structure and method of manufacturing sheet structure
US20090237886A1 (en) * 2008-03-18 2009-09-24 Fujitsu Limited Sheet structure and method of manufacturing sheet structure
US20100021736A1 (en) * 2008-07-25 2010-01-28 Slinker Keith A Interface-infused nanotube interconnect
EP2149538A3 (en) * 2008-07-25 2010-12-15 Lockheed Martin Corporation Interface-infused nanotube interconnect
US8435606B1 (en) * 2008-08-01 2013-05-07 Hrl Laboratories, Llc Polymer-infused carbon nanotube array and method
US8052825B2 (en) * 2008-09-12 2011-11-08 Tsinghua University Method for making composite material having carbon nanotube array
US20100065190A1 (en) * 2008-09-12 2010-03-18 Tsinghua University Method for making composite material having carbon nanotube array
EP2330077A4 (en) * 2008-09-18 2015-08-05 Nitto Denko Corp Carbon nanotube aggregate
US8227080B2 (en) 2008-09-18 2012-07-24 Nitto Denko Corporation Carbon nanotube aggregate
US20110133135A1 (en) * 2008-09-18 2011-06-09 Nitto Denko Corporation Carbon nanotube aggregate
US20120218713A1 (en) * 2008-11-14 2012-08-30 Fujitsu Limited Heat radiation material, electronic device and method of manufacturing electronic device
US8958207B2 (en) * 2008-11-14 2015-02-17 Fujitsu Limited Heat radiation material, electronic device and method of manufacturing electronic device
US8221667B2 (en) 2009-03-02 2012-07-17 Tsinghua University Method for making thermal interface material
US20100219550A1 (en) * 2009-03-02 2010-09-02 Tsinghua University Method for making thermal interface material
US20140102687A1 (en) * 2009-05-27 2014-04-17 Hon Hai Precision Industry Co., Ltd. Thermal interface material
US20110030938A1 (en) * 2009-08-05 2011-02-10 Tsinghua University Heat dissipation structure and heat dissipation system adopting the same
US20150362266A1 (en) * 2009-08-05 2015-12-17 Tsinghua University Heat dissipation structure and heat dissipation system adopting the same
US10184734B2 (en) * 2009-08-05 2019-01-22 Tsinghua University Heat dissipation structure and heat dissipation system adopting the same
WO2011096861A1 (en) * 2010-02-04 2011-08-11 Saab Ab A smooth surface forming tool and manufacture thereof
US9180979B2 (en) 2010-02-04 2015-11-10 Saab Ab Smooth surface forming tool and manufacture thereof
US9115424B2 (en) 2010-04-07 2015-08-25 California Institute Of Technology Simple method for producing superhydrophobic carbon nanotube array
US8323607B2 (en) 2010-06-29 2012-12-04 Tsinghua University Carbon nanotube structure
US9449816B2 (en) 2010-12-10 2016-09-20 California Institute Of Technology Method for producing graphene oxide with tunable gap
US8976507B2 (en) 2011-03-29 2015-03-10 California Institute Of Technology Method to increase the capacitance of electrochemical carbon nanotube capacitors by conformal deposition of nanoparticles
EP2709948A2 (en) * 2011-05-18 2014-03-26 California Institute of Technology Method for selectively anchoring and exposing large numbers of nanoscale structures
EP2709948A4 (en) * 2011-05-18 2014-12-17 California Inst Of Techn Method for selectively anchoring and exposing large numbers of nanoscale structures
EP2727881A4 (en) * 2011-07-01 2015-03-18 Nitto Denko Corp Aggregation of fibrous columnar structures
US9349543B2 (en) 2012-07-30 2016-05-24 California Institute Of Technology Nano tri-carbon composite systems and manufacture
US10766232B2 (en) 2012-10-23 2020-09-08 Saab Ab Smooth surface forming tool and manufacture thereof
US9513070B2 (en) * 2012-11-08 2016-12-06 Shinko Electric Industries Co., Ltd. Radiation member
US20140124186A1 (en) * 2012-11-08 2014-05-08 Shinshu University Radiation member
US20150136360A1 (en) * 2013-07-10 2015-05-21 Huawei Technologies Co., Ltd. Thermal interface pad and production method thereof, and heat dissipating system
JP2017507809A (en) * 2014-02-04 2017-03-23 エヌ12 テクノロジーズ, インク.N12 Technologies, Inc. Articles of nanostructure-reinforced composite and manufacturing method
US10350837B2 (en) 2016-05-31 2019-07-16 Massachusetts Institute Of Technology Composite articles comprising non-linear elongated nanostructures and associated methods
US11760848B2 (en) 2017-09-15 2023-09-19 Massachusetts Institute Of Technology Low-defect fabrication of composite materials
US11031657B2 (en) 2017-11-28 2021-06-08 Massachusetts Institute Of Technology Separators comprising elongated nanostructures and associated devices and methods, including devices and methods for energy storage and/or use
US10595440B2 (en) * 2018-03-02 2020-03-17 Northrop Grumman Systems Corporation Thermal gasket with high transverse thermal conductivity

Also Published As

Publication number Publication date
US20080087646A1 (en) 2008-04-17
CN101054467B (en) 2010-05-26
US7641938B2 (en) 2010-01-05
JP4723529B2 (en) 2011-07-13
JP2007284679A (en) 2007-11-01
CN101054467A (en) 2007-10-17

Similar Documents

Publication Publication Date Title
US7641938B2 (en) Method for manufacturing carbon nanotube composite material
US7393428B2 (en) Method for making a thermal interface material
US7438844B2 (en) Thermal interface material and method for manufacturing same
Hong et al. Anisotropic thermal conductive composite by the guided assembly of boron nitride nanosheets for flexible and stretchable electronics
JP5355423B2 (en) Process for preparing a conductive film and article prepared using the process
US8194407B2 (en) Heat radiation material, electronic device and method of manufacturing electronic device
US7569425B2 (en) Method for manufacturing thermal interface material with carbon nanotubes
US20180158753A1 (en) Heat dissipating structure and manufacture
US7633148B2 (en) Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
US20070004081A1 (en) Method for manufacturing a thermal interface material
US20100006278A1 (en) Heat dissipation device and method for manufacturing the same
US20100172101A1 (en) Thermal interface material and method for manufacturing the same
TWI661026B (en) Thermally conductive adhesive sheet, manufacturing method thereof, and electronic device using the same
JP2006290736A (en) Thermal interface material and method of manufacturing the same
EP2496732A2 (en) Materials and methods for thermal and electrical conductivity
US20100051331A1 (en) Circuit substrate for mounting electronic component and circuit substrate assembly having same
Sim et al. Highly Sensitive Flexible Tactile Sensors in Wide Sensing Range Enabled by Hierarchical Topography of Biaxially Strained and Capillary‐Densified Carbon Nanotube Bundles
Song et al. Highly Stretchable High‐Performance Silicon Nanowire Field Effect Transistors Integrated on Elastomer Substrates
US20200118906A1 (en) Gap fillers with independently tunable mechanical and thermal properties
KR101429514B1 (en) Circuit board
JP2010199367A (en) Heat radiating material and method for manufacturing the same, and electronic device and method for manufacturing the same
US8808857B1 (en) Carbon nanotube array interface material and methods
Shin et al. Effect on plasma treatment on adhesive bonding strength
JP2023060542A (en) Holding device and composite member
Rehman Optimization of Spiral Based Structures for Stretchable Electronics

Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, CHANG-HONG;YAO, YUAN;FAN, SHOU-SHAN;REEL/FRAME:018342/0840

Effective date: 20060921

Owner name: TSINGHUA UNIVERSITY, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, CHANG-HONG;YAO, YUAN;FAN, SHOU-SHAN;REEL/FRAME:018342/0840

Effective date: 20060921

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION