US20070217155A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20070217155A1 US20070217155A1 US11/308,280 US30828006A US2007217155A1 US 20070217155 A1 US20070217155 A1 US 20070217155A1 US 30828006 A US30828006 A US 30828006A US 2007217155 A1 US2007217155 A1 US 2007217155A1
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- United States
- Prior art keywords
- base plate
- fins
- heat
- lower base
- dissipation device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention generally relates to a heat dissipation device, and more particularly to a heat dissipation device having a high heat dissipating capacity.
- a conventional heat dissipation device attached to the CPU comprises a heat sink, and at least a pair of heat pipes which have evaporating sections located close to the CPU for absorbing heat generated by the CPU and condensing sections for transferring the heat away from the CPU.
- the heat pipes are used to enhance the heat transfer speed of the heat dissipation device from a place near the CPU to a place far from the CPU.
- the conventional heat dissipation device can not satisfy the demand of the heat dissipation of the CPU which produces more and more heat than before.
- the heat dissipating capacity of the conventional heat dissipation device needs improvement greatly.
- a factor that can determine the heat dissipating capacity of the heat dissipation device is the heat dissipating ability of condensing sections of the heat pipes. Working liquid in the heat pipes absorbs the heat from the CPU and evaporates into vapor at evaporating sections of the heat pipes. The vapor releases the heat at the condensing sections whereby the vapor is condensed into liquid.
- the speed of the heat release of the vapor affects the performance of the heat pipes and accordingly the performance of the heat dissipation device incorporating the heat pipes.
- the heat dissipating ability of the condensing sections affects the heat release of the vapor.
- the condensing sections are fitted with fins to enhance the heat dissipating ability thereof.
- there is a relatively small temperature gradient between the evaporating sections and the condensing such that a design of the conventional heat dissipation device is not effective enough to meet the more and more demanding heat dissipation requirement of modern electronic devices.
- a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a heat spreader for contacting with an electronic element, a conducting member having a lower base plate thermally contacting with the heat spreader and an upper base plate with a plurality of first fins extending downwardly from the upper base plate towards the lower base plate and a connecting portion interconnecting the lower and upper base plates.
- a plurality of second fins is mounted on the conducting member.
- a plurality of heat pipes thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins.
- a fan is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages. Heat carried by vapor in the heat pipes is able to be quickly released at condensing portions of the heat pipes. Therefore, the heat dissipating capability of the heat pipes and the heat dissipation device is enormously improved.
- FIG. 1 is an isometric view of a heat dissipation device in accordance with a preferred embodiment of the present invention
- FIG. 2 is a front elevational view of FIG. 1 ;
- FIG. 3 is an exploded view of FIG. 1 .
- the heat dissipation device is for being mounted to a heat-generating electronic element, such an IC package (not shown), to dissipate heat therefrom.
- the heat dissipation device comprises a heat sink 10 having a cubical configuration, and a fan 20 mounted to a lateral side of the heat sink 10 .
- the heat sink 10 comprises a heat spreader 12 and a conducting member 30 mounted on the heat spreader 12 .
- a plurality of first fins 36 is integrally formed with the conducting member 30 .
- a plurality of second fins 38 is vertically provided on the conducting member 30 .
- Three U-shaped heat pipes 40 thermally connect the heat spreader 12 , a top of the conducting member 30 and the second fins 38 .
- the heat spreader 12 has a bottom face 120 for contacting the electronic element to absorb the heat therefrom, and a top face 122 with three grooves 124 .
- the heat spreader 12 forms four ears 126 at four corners thereof.
- Each ear 126 defines a mounting hole (not labeled) for receiving a screw 50 with a spring 60 to fix the heat dissipation device to a supporting member (not shown), for example, a printed circuit board on which the electronic element is mounted.
- the conducting member 30 is mounted on the heat spreader 12 and comprises a lower base plate 32 , an upper base plate 34 parallel to the lower base plate 32 and spaced from the lower base plate 32 , and a connecting portion 33 connecting middle portions of the upper base plate 34 and the lower base plate 32 .
- the conducting member 30 is formed by metal extrusion, such as aluminum extrusion.
- the upper base plate 34 has a length longer than that of the lower base plate 32 .
- the upper base plate 34 defines a pair of grooves 342 in a top thereof.
- the lower base plate 32 defines three grooves (not shown) in a bottom thereof, corresponding to the grooves 124 of the heat spreader 12 .
- the first fins 36 extend downwardly from a bottom surface of the upper base plate 34 of the conducting member 30 , pointed to the lower base plate 32 .
- the first fins 36 are arrayed as two groups at two opposite sides of the connecting portion 33 of the conducting member 30 , respectively. There is a space between a bottom of the first fins 36 and the lower base plate 32 .
- the first fins 36 define a plurality of first air passages (not labeled) therebetween.
- the second fins 38 are perpendicularly mounted on the top of the upper base plate 34 of the conducting member 30 and located above the first fins 36 .
- the second fins 38 define a plurality of second air passages (not labeled) therebetween, parallel to the first air passages of the first fins 36 .
- the second fins 38 define a through hole 380 perpendicularly extending therethrough.
- a bottom of the second fins 38 define a pair of grooves 382 corresponding to the grooves 342 of the upper base plate 34 of the conducting member 30 .
- the through hole 380 is defined above the groove 382 .
- Each of the first fins 36 is parallel to each of the second fins 38 , and perpendicular to the upper base plate 34 of the conducting member 30 .
- the heat pipes 40 comprise a pair of first heat pipes 42 and a second heat pipe 44 .
- the first and second heat pipes 42 , 44 comprise evaporating portions 420 , 440 , condensing portions 422 , 442 parallel to the evaporating portion 420 , 440 , and adiabatic portions 423 , 443 interconnecting the evaporating portions 420 , 440 and the condensing portions 422 , 442 .
- the evaporating portions 420 , 440 are received in channels cooperatively formed by the grooves 124 of the heat spreader 12 and the grooves defined in the bottom of the lower base plate 32 of the conducting member 30 . Thus, the heat spreader 12 and the bottom of the conducting member 30 are thermally coupled together.
- the condensing portions 422 of the first heat pipes 42 are received in channels cooperatively formed by the grooves 342 of the upper base plate 34 of the conducting member 30 and the grooves 382 defined in the bottom of the second fins 38 .
- the condensing portion 442 of the second heat pipe 44 is received in the through hole 380 defined in the second fins 38 .
- the fan 20 is mounted adjacent to openings of the first and second air passages of the first and the second fins 36 , 38 so as to provide a forced airflow through the first fins 36 and the second fins 38 for facilitating heat dissipation of the fins 36 , 38 .
- the forced airflow By the forced airflow, the heat dissipation effectiveness of the heat dissipation device can be further promoted.
- the bottom surface 120 of the heat spreader 12 contacts the electronic element and draws heat therefrom.
- the heat fast spreads on the heat spreader 12 .
- one part of the heat on the heat spreader 12 is conducted to the evaporating portions 420 , 440 of the heat pipes 40 .
- Another part of the heat on the heat spreader 12 is transferred to the lower base plate 32 of the conducting member 30 , and then transferred to the upper base plate 34 via the connecting portion 33 of the conducting member 30 and then conducted to the first and second fins 36 , 38 for dissipation to an environment directly through the first and second fins 36 , 38 .
- the heat absorbed by the evaporating portions 420 of the first heat pipes 42 is directly transferred to the top of the conducting member 30 and the bottom of the second fins 38 which are thermally connected to the condensing portions 422 of the first heat pipes 42 .
- the heat transferred to the top of the conducting member 30 is then conducted to the first and second fins 36 , 38 .
- the heat is dissipated to the environment through the first and second fins 36 , 38 .
- the heat absorbed by the evaporating portion 440 of the second heat pipe 44 is directly transferred to the second fins 38 via the condensing portion 442 to be dissipated to the environment.
- the heat can be quickly transferred to the top of the conducting member 30 via the connecting portion 33 of the conducting member 30 and the first heat pipes 42 and to the second fins 38 via the first and second heat pipes 42 , 44 .
- the top of the conducting member 30 and the condensing portions 422 , 442 of the heat pipes 40 can be quickly cooled via the first and second fins 36 , 38 .
- a large temperature gradient is thus achieved between the top and the bottom of the conducting member 30 and the condensing portions 422 , 442 and the evaporating portions 420 , 440 of the heat pipes 40 .
- a result of the large temperature gradient is that the heat pipes 40 are sufficiently used to transfer the heat from the heat spreader 12 where the highest temperature exists to the top of the conducting member 30 where the lowest temperature exists, to efficiently dissipate the heat of the heat-generating electronic component. Therefore, the heat of the heat-generating electronic component is continuously transferred to the top of the conducting member 30 and the condensing portions 422 , 442 of the heat pipes 40 via the evaporating portions 420 , 440 of the heat pipes 40 and dissipated by the fins 36 , 38 to ambient air. The heat dissipation efficiency of the heat sink 10 can thus be improved.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- The present invention generally relates to a heat dissipation device, and more particularly to a heat dissipation device having a high heat dissipating capacity.
- As computer technology continues to advance, electronic components such as central processing units (CPUs) of computers are being made to provide faster operational speeds and greater functional capabilities. When a CPU operates at high speed in a computer enclosure, its temperature can increase greatly. It is desired to dissipate the heat quickly, for example by using a heat dissipation device attached to the CPU in the enclosure. This allows the CPU and other electronic components in the enclosure to function within their normal operating temperature ranges, thereby assuring the quality of data management, storage and transfer. A conventional heat dissipation device attached to the CPU comprises a heat sink, and at least a pair of heat pipes which have evaporating sections located close to the CPU for absorbing heat generated by the CPU and condensing sections for transferring the heat away from the CPU. The heat pipes are used to enhance the heat transfer speed of the heat dissipation device from a place near the CPU to a place far from the CPU. By the provision of the heat pipes, heat dissipation efficiency of the heat dissipation device is improved.
- However, as computer technology becomes more and more complicated, the conventional heat dissipation device can not satisfy the demand of the heat dissipation of the CPU which produces more and more heat than before. The heat dissipating capacity of the conventional heat dissipation device needs improvement greatly. A factor that can determine the heat dissipating capacity of the heat dissipation device is the heat dissipating ability of condensing sections of the heat pipes. Working liquid in the heat pipes absorbs the heat from the CPU and evaporates into vapor at evaporating sections of the heat pipes. The vapor releases the heat at the condensing sections whereby the vapor is condensed into liquid. The speed of the heat release of the vapor affects the performance of the heat pipes and accordingly the performance of the heat dissipation device incorporating the heat pipes. The heat dissipating ability of the condensing sections affects the heat release of the vapor. Generally the condensing sections are fitted with fins to enhance the heat dissipating ability thereof. However, there is a relatively small temperature gradient between the evaporating sections and the condensing such that a design of the conventional heat dissipation device is not effective enough to meet the more and more demanding heat dissipation requirement of modern electronic devices.
- A heat dissipation device in accordance with a preferred embodiment of the present invention comprises a heat spreader for contacting with an electronic element, a conducting member having a lower base plate thermally contacting with the heat spreader and an upper base plate with a plurality of first fins extending downwardly from the upper base plate towards the lower base plate and a connecting portion interconnecting the lower and upper base plates. A plurality of second fins is mounted on the conducting member. A plurality of heat pipes thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages. Heat carried by vapor in the heat pipes is able to be quickly released at condensing portions of the heat pipes. Therefore, the heat dissipating capability of the heat pipes and the heat dissipation device is enormously improved.
- Other advantages and novel features will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is an isometric view of a heat dissipation device in accordance with a preferred embodiment of the present invention; -
FIG. 2 is a front elevational view ofFIG. 1 ; and -
FIG. 3 is an exploded view ofFIG. 1 . - Reference will now be made to the drawing figures to describe a heat dissipation device in accordance with a preferred embodiment of the present invention.
- Referring to
FIGS. 1-2 , the heat dissipation device is for being mounted to a heat-generating electronic element, such an IC package (not shown), to dissipate heat therefrom. The heat dissipation device comprises aheat sink 10 having a cubical configuration, and afan 20 mounted to a lateral side of theheat sink 10. - The
heat sink 10 comprises aheat spreader 12 and a conductingmember 30 mounted on theheat spreader 12. A plurality offirst fins 36 is integrally formed with the conductingmember 30. A plurality ofsecond fins 38 is vertically provided on the conductingmember 30. Three U-shapedheat pipes 40 thermally connect theheat spreader 12, a top of the conductingmember 30 and thesecond fins 38. - Referring to
FIG. 3 , theheat spreader 12 has abottom face 120 for contacting the electronic element to absorb the heat therefrom, and atop face 122 with threegrooves 124. The heat spreader 12 forms fourears 126 at four corners thereof. Eachear 126 defines a mounting hole (not labeled) for receiving ascrew 50 with aspring 60 to fix the heat dissipation device to a supporting member (not shown), for example, a printed circuit board on which the electronic element is mounted. - The conducting
member 30 is mounted on theheat spreader 12 and comprises alower base plate 32, anupper base plate 34 parallel to thelower base plate 32 and spaced from thelower base plate 32, and a connectingportion 33 connecting middle portions of theupper base plate 34 and thelower base plate 32. The conductingmember 30 is formed by metal extrusion, such as aluminum extrusion. Theupper base plate 34 has a length longer than that of thelower base plate 32. Theupper base plate 34 defines a pair ofgrooves 342 in a top thereof. Thelower base plate 32 defines three grooves (not shown) in a bottom thereof, corresponding to thegrooves 124 of theheat spreader 12. Thefirst fins 36 extend downwardly from a bottom surface of theupper base plate 34 of the conductingmember 30, pointed to thelower base plate 32. Thefirst fins 36 are arrayed as two groups at two opposite sides of the connectingportion 33 of the conductingmember 30, respectively. There is a space between a bottom of thefirst fins 36 and thelower base plate 32. Thefirst fins 36 define a plurality of first air passages (not labeled) therebetween. Thesecond fins 38 are perpendicularly mounted on the top of theupper base plate 34 of the conductingmember 30 and located above thefirst fins 36. Thesecond fins 38 define a plurality of second air passages (not labeled) therebetween, parallel to the first air passages of thefirst fins 36. Thesecond fins 38 define a throughhole 380 perpendicularly extending therethrough. A bottom of thesecond fins 38 define a pair ofgrooves 382 corresponding to thegrooves 342 of theupper base plate 34 of the conductingmember 30. The throughhole 380 is defined above thegroove 382. Each of thefirst fins 36 is parallel to each of thesecond fins 38, and perpendicular to theupper base plate 34 of the conductingmember 30. - The
heat pipes 40 comprise a pair offirst heat pipes 42 and asecond heat pipe 44. The first andsecond heat pipes portions condensing portions portion adiabatic portions portions condensing portions portions grooves 124 of theheat spreader 12 and the grooves defined in the bottom of thelower base plate 32 of the conductingmember 30. Thus, the heat spreader 12 and the bottom of the conductingmember 30 are thermally coupled together. Thecondensing portions 422 of thefirst heat pipes 42 are received in channels cooperatively formed by thegrooves 342 of theupper base plate 34 of the conductingmember 30 and thegrooves 382 defined in the bottom of thesecond fins 38. The condensingportion 442 of thesecond heat pipe 44 is received in the throughhole 380 defined in thesecond fins 38. - The
fan 20 is mounted adjacent to openings of the first and second air passages of the first and thesecond fins first fins 36 and thesecond fins 38 for facilitating heat dissipation of thefins - When the heat dissipation device is applied to the heat-generating electronic element, the
bottom surface 120 of theheat spreader 12 contacts the electronic element and draws heat therefrom. The heat fast spreads on theheat spreader 12. Then, one part of the heat on theheat spreader 12 is conducted to the evaporatingportions heat pipes 40. Another part of the heat on theheat spreader 12 is transferred to thelower base plate 32 of the conductingmember 30, and then transferred to theupper base plate 34 via the connectingportion 33 of the conductingmember 30 and then conducted to the first andsecond fins second fins portions 420 of thefirst heat pipes 42 is directly transferred to the top of the conductingmember 30 and the bottom of thesecond fins 38 which are thermally connected to the condensingportions 422 of thefirst heat pipes 42. The heat transferred to the top of the conductingmember 30 is then conducted to the first andsecond fins second fins portion 440 of thesecond heat pipe 44 is directly transferred to thesecond fins 38 via the condensingportion 442 to be dissipated to the environment. Thus, the heat can be quickly transferred to the top of the conductingmember 30 via the connectingportion 33 of the conductingmember 30 and thefirst heat pipes 42 and to thesecond fins 38 via the first andsecond heat pipes member 30 and the condensingportions heat pipes 40 can be quickly cooled via the first andsecond fins member 30 and the condensingportions portions heat pipes 40. A result of the large temperature gradient is that theheat pipes 40 are sufficiently used to transfer the heat from theheat spreader 12 where the highest temperature exists to the top of the conductingmember 30 where the lowest temperature exists, to efficiently dissipate the heat of the heat-generating electronic component. Therefore, the heat of the heat-generating electronic component is continuously transferred to the top of the conductingmember 30 and the condensingportions heat pipes 40 via the evaporatingportions heat pipes 40 and dissipated by thefins heat sink 10 can thus be improved. - It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (18)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/308,280 US7269014B1 (en) | 2006-03-15 | 2006-03-15 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US11/308,280 US7269014B1 (en) | 2006-03-15 | 2006-03-15 | Heat dissipation device |
Publications (2)
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US7269014B1 US7269014B1 (en) | 2007-09-11 |
US20070217155A1 true US20070217155A1 (en) | 2007-09-20 |
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US11/308,280 Expired - Fee Related US7269014B1 (en) | 2006-03-15 | 2006-03-15 | Heat dissipation device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20080137301A1 (en) * | 2006-12-09 | 2008-06-12 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US20080224019A1 (en) * | 2007-03-14 | 2008-09-18 | Shi-Ping Luo | Support device for heat dissipation module |
US20100020492A1 (en) * | 2008-07-24 | 2010-01-28 | Chin-Kuang Luo | Heat-dissipating device |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101039566A (en) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat abstractor and electronic device using the same |
KR101110434B1 (en) * | 2006-05-02 | 2012-02-24 | 엘지전자 주식회사 | Computer cooling device |
US7965511B2 (en) * | 2006-08-17 | 2011-06-21 | Ati Technologies Ulc | Cross-flow thermal management device and method of manufacture thereof |
US7447035B2 (en) * | 2006-12-01 | 2008-11-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device assembly |
US7495920B2 (en) * | 2006-12-21 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
CA2573941A1 (en) * | 2007-01-15 | 2008-07-15 | Coolit Systems Inc. | Computer cooling system |
US20090040721A1 (en) * | 2007-08-07 | 2009-02-12 | Coolit Systems Inc. | Computer cooling system and method |
US7595989B2 (en) * | 2007-12-12 | 2009-09-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7489510B1 (en) * | 2007-12-27 | 2009-02-10 | Foxconn Technology Co., Ltd. | Fastening device for mounting thermal module to electronic component |
US8002019B2 (en) * | 2008-03-20 | 2011-08-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8047266B2 (en) * | 2008-06-13 | 2011-11-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100014251A1 (en) * | 2008-07-15 | 2010-01-21 | Advanced Micro Devices, Inc. | Multidimensional Thermal Management Device for an Integrated Circuit Chip |
TW201005253A (en) | 2008-07-31 | 2010-02-01 | Golden Sun News Tech Co Ltd | Manufacturing method for levelly combining evaporation ends of aligned heat pipes to fastening seat and structure thereof |
US7697293B1 (en) * | 2008-09-26 | 2010-04-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100103619A1 (en) * | 2008-10-23 | 2010-04-29 | Gamal Refai-Ahmed | Interchangeable Heat Exchanger for a Circuit Board |
US20100302726A1 (en) * | 2009-06-02 | 2010-12-02 | Chin-Peng Chen | Active thermal module |
US8295050B2 (en) * | 2010-11-05 | 2012-10-23 | Portwell Inc. | Dual CPU and heat dissipating structure thereof |
CN103167780B (en) * | 2011-12-16 | 2016-06-08 | 台达电子企业管理(上海)有限公司 | Power model combined radiator assembly |
US9773718B2 (en) * | 2013-08-07 | 2017-09-26 | Oracle International Corporation | Winged heat sink |
US10721838B1 (en) * | 2018-11-21 | 2020-07-21 | Cisco Technology, Inc. | Stacked base heat sink with heat pipes in-line with airflow |
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US20080137301A1 (en) * | 2006-12-09 | 2008-06-12 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US7394656B1 (en) * | 2006-12-09 | 2008-07-01 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US20080224019A1 (en) * | 2007-03-14 | 2008-09-18 | Shi-Ping Luo | Support device for heat dissipation module |
US7808782B2 (en) * | 2007-03-14 | 2010-10-05 | Asia Vital Components Co., Ltd. | Support device for heat dissipation module |
US20100020492A1 (en) * | 2008-07-24 | 2010-01-28 | Chin-Kuang Luo | Heat-dissipating device |
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AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO.,LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHAO, LIANG-HUI;WU, YI-QIANG;REEL/FRAME:017304/0830 Effective date: 20051202 |
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