US20070137141A1 - Integration of functional layers in or on transparent plastic parts for vehicle manufacture - Google Patents

Integration of functional layers in or on transparent plastic parts for vehicle manufacture Download PDF

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Publication number
US20070137141A1
US20070137141A1 US11/605,208 US60520806A US2007137141A1 US 20070137141 A1 US20070137141 A1 US 20070137141A1 US 60520806 A US60520806 A US 60520806A US 2007137141 A1 US2007137141 A1 US 2007137141A1
Authority
US
United States
Prior art keywords
transparent plastic
plastic part
conductive structures
electrically conductive
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/605,208
Other languages
English (en)
Inventor
Ingmar Petersen
Bernd Schwarz
Markus Pfletschinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirschmann Car Communication GmbH
Original Assignee
Hirschmann Car Communication GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirschmann Car Communication GmbH filed Critical Hirschmann Car Communication GmbH
Assigned to HIRSCHMAN CAR COMMUNICATION GMBH reassignment HIRSCHMAN CAR COMMUNICATION GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PETERSEN, INGMAR, PFLETSCHINGER, MARKUS, SCHWARZ, BERND
Publication of US20070137141A1 publication Critical patent/US20070137141A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/1271—Supports; Mounting means for mounting on windscreens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Definitions

  • the invention relates to the integration of functional layers, in particular electrically conductive structures such as antennas, heating elements, and photovoltaic elements, in or on transparent plastic parts used in automobile manufacture.
  • transparent plastic parts are becoming more widespread in automobile manufacture. Compared to glass, transparent plastic parts have a number of advantages. The savings in weight is directly reflected in reduced fuel consumption. In addition, more favorable aerodynamic characteristics may be obtained due to the greater freedom in design resulting from diverse and virtually unlimited shapes in the injection-molding and injection-stamping processes, which also reduces energy consumption. Use of these plastics as side and rear windows or as roofs in automobiles, for example, lowers the vehicle's center of gravity, thereby positively influencing the stability of the vehicle.
  • An object of the invention is to provide a transparent plastic part made of an electrically nonconductive material, on or in which electrically conductive structures are integrated, and that is designed for use in a vehicle, by means of which the above-described disadvantages are avoided and/or by which the above-described advantages may be retained, and by means of which conductor structures for current conduction or signal transmission, as antennas, or for photovoltaic elements may be mounted.
  • Polycarbonate (PC) and polymethlymethacrylate (PMMA) are preferably used in window panes. Their characteristics are essentially comparable to glass. Polycarbonate does not shatter, and is impact-resistant, tintable, and dimensionally stable. When these materials are not scratch-resistant, this characteristic can be imparted by additionally applying-an anti-scratch coating (for example, using ceramic nanoparticles in a silicon layer).
  • -an anti-scratch coating for example, using ceramic nanoparticles in a silicon layer.
  • the possibility for working the plastic by drilling, sawing, milling, welding, and gluing, for example, represents further advantages compared to the conventional use of glass.
  • the integration of additional functions such as antennas, antenna systems, heating elements, and photovoltaic elements, for example, desired by automobile manufacturers or customers promotes the use of transparent plastic as an alternative to glass, and is the object of the present invention.
  • the electrically conductive structures applied by means of a printing process are located on the exterior of the transparent plastic part.
  • FIG. 1 shows the transparent plastic component directly imprinted
  • FIG. 2 shows the transparent plastic component directly imprinted. A protective film is then laminated thereon. This protective film may also be an applied silicon layer (anti-scratch coating);
  • FIG. 3 shows a transparent film imprinted and subsequently joined to the transparent component.
  • the conductive structures may be imbedded. Two shapes are shown.
  • FIG. 4 shows a transparent film imprinted and then insert-molded with the transparent plastic. As illustrated, an additional protective layer may be applied.
  • FIG. 5 shows a transparent film imprinted and used for the insert molding process as a transfer medium that transfers the conductive structures into the transparent target component.
  • a protective layer is possible as in FIG. 4 .
  • FIG. 1 shows a detailed illustration of a transparent plastic part 1 having electrically conductive structures 2 printed thereon.
  • the transparent plastic part 1 preferably is made of polycarbonate (PC) or polymethlymethacrylate (PMMA), the electrically conductive structures being applied by means of a printing process, preferably a screen-printing process.
  • electrically conductive pastes are preferably used which may be formed into any desired shape for the electrically conductive structures 2 .
  • other methods including but not limited to spraying, painting, ink jet, airbrush, or spattering are also possible.
  • FIG. 2 shows an illustrated embodiment in which a protective layer 3 is applied over the transparent plastic part 1 and the conductive structures 2 , so that the electrically conductive structures 2 are imbedded.
  • This protective layer 3 may be a protective film which is laminated, for example.
  • the protective film could also be an applied silicon layer for protecting the conductive structures 2 from damage (in particular interruptions) and protecting the transparent plastic part 1 from scratches (anti-scratch layer).
  • FIG. 3 shows that a transparent film 4 is imprinted with the electrically conductive structures 2 , and this film 4 is applied to the plastic part, in particular glued or laminated thereon.
  • the upper part of FIG. 3 shows that the plastic film 4 is applied to the plastic part 1 at the surface opposite from the electrically conductive structures 2 .
  • the lower part of FIG. 3 shows the reverse situation in which the plastic film 4 is applied to the surface of the plastic part 1 at the side on which the conductive structures 2 have been printed.
  • the film 4 may be attached to the plastic part 1 over a part or most of its surface, in particular over the entire surface.
  • FIG. 4 shows that a transparent plastic part 7 is imprinted and is then oversprayed with a transparent plastic 6 .
  • the upper illustration of FIG. 4 shows that the electrically conductive structures are printed on the transparent plastic film 7 (alternatively, on the rigid transparent plastic part 1 ), and by use of an appropriate method (insert molding, for example), a transparent plastic is injection-molded or insert-molded to the plastic film 7 (or to the plastic part 1 ).
  • the injection-molded plastic may be molded over the surfaces of the electrically conductive structures that project from the plastic film 7 .
  • FIG. 4 shows that both the injection-molded or insert-molded transparent plastic 6 and the electrically conductive structures 2 are enclosed by an additional protective layer 8 , in particular an anti-scratch layer.
  • FIG. 5 shows that a transfer medium 9 has been provided before actually carrying out an injection molding process with the conductive structures 2 , this premanufactured transfer medium 9 being attached to the transparent plastic part 1 , or alternatively, to the transparent plastic film 7 .
  • the electrically conductive structures 2 are then transferred via a transfer film 10 to the target component, namely, a transparent plastic part 11 having conductive structures.
  • the finished transparent plastic part 11 may also be provided with an additional coating, in particular the anti-scratch coating 3 .
  • the plastic parts 1 and 11 shown in FIGS. 1 through 5 are used according to the invention for vehicular panes in applications such as window panes (windshield, rear or side windows) or in the vehicle roof (transparent and therefore light-permeable sliding roof).
  • the electrically conductive structures 2 are designed according to their function.
  • the electrically conductive structures 2 may be antenna structures, for example, for receiving or transmitting high-frequency signals.
  • multiple linear electrically conductive structures 2 are configured in parallel or at right angles on a vehicle window pane, but are separated by a minimum distance to prevent mutual interference of the reception and transmission characteristics.
  • the electrically conductive structures 2 are used for rear window heating, for example, it is possible for two electrically conductive structures 2 to be aligned perpendicular to the sides of the rear window, and for numerous additional, closely spaced electrically conductive structures 2 of extremely thin cross section to be provided therebetween, to prevent the optical characteristics of the transparent plastic part 1 in the form of a rear window from being adversely affected.
  • the electrically conductive structures 2 may also be designed for signal transmission, current conduction, or the like, or also preferably as solar cells.
  • the latter embodiment offers the advantage that solar cells in the form of electrically conductive structures 2 may be printed on transparent plastic parts such as vehicular panes, for example, and the energy from the solar cells is supplied via additional electrically conductive structures 2 to a plug-in connection or an electronic device, so that, for example, a fan is driven by the solar energy for ventilating or cooling the interior of the vehicle at high temperatures.
  • solar cells in the form of electrically conductive structures 2 may also be printed on the transparent plastic part 1 to provide energy for other equipment.
  • Protective layer film, silicon layer, or other
  • Joining material adhesive, for example

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
US11/605,208 2005-11-30 2006-11-28 Integration of functional layers in or on transparent plastic parts for vehicle manufacture Abandoned US20070137141A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005057027 2005-11-30
DE102005057027.5 2006-11-30

Publications (1)

Publication Number Publication Date
US20070137141A1 true US20070137141A1 (en) 2007-06-21

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Application Number Title Priority Date Filing Date
US11/605,208 Abandoned US20070137141A1 (en) 2005-11-30 2006-11-28 Integration of functional layers in or on transparent plastic parts for vehicle manufacture

Country Status (2)

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US (1) US20070137141A1 (fr)
EP (1) EP1793447A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110174796A1 (en) * 2010-01-21 2011-07-21 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicles Including Rear Defroster Assemblies with Protective Barriers
CN101469117B (zh) * 2007-12-25 2012-07-04 上海普利特复合材料股份有限公司 一种耐水解、高韧性、抗紫外聚碳酸酯组合物
CN104835557A (zh) * 2014-12-19 2015-08-12 北汽福田汽车股份有限公司 车辆线束、车辆和车辆线束的加工方法
JP2016072410A (ja) * 2014-09-30 2016-05-09 株式会社フジクラ プリント配線板
US20230023061A1 (en) * 2015-08-11 2023-01-26 State Farm Mutual Automobile Insurance Company Systems and methods for impact resistant and photovoltaic windows
WO2023133021A1 (fr) * 2022-01-10 2023-07-13 Dupont Safety & Construction Procédé de production de circuits électriques sur polymères organiques chargés

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013016325A1 (de) * 2013-10-04 2015-04-09 Webasto SE Verfahren zum Herstellen eines Fahrzeugaußenflächenbauteils und Fahrzeugaußenflächenbauteil

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526327A (en) * 1944-09-25 1950-10-17 Lockheed Aircraft Corp Windshield deicer
US3089801A (en) * 1957-05-27 1963-05-14 Minnesota Mining & Mfg Ultra-thin glass sheet
US3414713A (en) * 1966-09-23 1968-12-03 Umc Ind Electrically heated glass closure
US3745309A (en) * 1972-10-31 1973-07-10 Gen Electric Electrically heated transparent panel
US3792232A (en) * 1971-09-28 1974-02-12 Saint Gobain Electrically heated window
US3947618A (en) * 1972-10-31 1976-03-30 General Electric Company Electrically heated transparent panel
US4861666A (en) * 1984-08-13 1989-08-29 General Electric Company Asymmetric impact resistant laminates
US5589272A (en) * 1994-02-25 1996-12-31 Dornier Gmbh Glazing
US5861606A (en) * 1994-12-22 1999-01-19 Pilkington Glass Limited Electrically heated window having busbar with curved corner piece
US20010015700A1 (en) * 1999-11-30 2001-08-23 Kenichi Kashiwagi Sheet antenna
US20040263405A1 (en) * 2003-05-14 2004-12-30 Kansai Paint Co., Ltd. Method for forming automotive antenna
US20060099354A1 (en) * 2002-09-12 2006-05-11 Daimler Chrysler Ag Plastic vehicle parts with integrated antenna elements and method for the production thereof
US7265322B2 (en) * 2001-09-26 2007-09-04 Freeglass Gmbh & Co. Kg Method for making a plastic pane with electrical conductor structure and plastic pane with embedded wires
US7297902B2 (en) * 2004-05-17 2007-11-20 Exatec, Llc High performance defrosters for transparent panels

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10301352B3 (de) * 2003-01-16 2004-07-15 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Lötanschlusselement sowie Verfahren zum Herstellen eines Lötanschlusses

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526327A (en) * 1944-09-25 1950-10-17 Lockheed Aircraft Corp Windshield deicer
US3089801A (en) * 1957-05-27 1963-05-14 Minnesota Mining & Mfg Ultra-thin glass sheet
US3414713A (en) * 1966-09-23 1968-12-03 Umc Ind Electrically heated glass closure
US3792232A (en) * 1971-09-28 1974-02-12 Saint Gobain Electrically heated window
US3745309A (en) * 1972-10-31 1973-07-10 Gen Electric Electrically heated transparent panel
US3947618A (en) * 1972-10-31 1976-03-30 General Electric Company Electrically heated transparent panel
US4861666A (en) * 1984-08-13 1989-08-29 General Electric Company Asymmetric impact resistant laminates
US5589272A (en) * 1994-02-25 1996-12-31 Dornier Gmbh Glazing
US5861606A (en) * 1994-12-22 1999-01-19 Pilkington Glass Limited Electrically heated window having busbar with curved corner piece
US20010015700A1 (en) * 1999-11-30 2001-08-23 Kenichi Kashiwagi Sheet antenna
US7265322B2 (en) * 2001-09-26 2007-09-04 Freeglass Gmbh & Co. Kg Method for making a plastic pane with electrical conductor structure and plastic pane with embedded wires
US20060099354A1 (en) * 2002-09-12 2006-05-11 Daimler Chrysler Ag Plastic vehicle parts with integrated antenna elements and method for the production thereof
US20040263405A1 (en) * 2003-05-14 2004-12-30 Kansai Paint Co., Ltd. Method for forming automotive antenna
US7297902B2 (en) * 2004-05-17 2007-11-20 Exatec, Llc High performance defrosters for transparent panels

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101469117B (zh) * 2007-12-25 2012-07-04 上海普利特复合材料股份有限公司 一种耐水解、高韧性、抗紫外聚碳酸酯组合物
US20110174796A1 (en) * 2010-01-21 2011-07-21 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicles Including Rear Defroster Assemblies with Protective Barriers
US8324532B2 (en) 2010-01-21 2012-12-04 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicles including rear defroster assemblies with protective barriers
JP2016072410A (ja) * 2014-09-30 2016-05-09 株式会社フジクラ プリント配線板
US10123411B2 (en) 2014-09-30 2018-11-06 Fujikura Ltd. Printed wiring board
CN104835557A (zh) * 2014-12-19 2015-08-12 北汽福田汽车股份有限公司 车辆线束、车辆和车辆线束的加工方法
US20230023061A1 (en) * 2015-08-11 2023-01-26 State Farm Mutual Automobile Insurance Company Systems and methods for impact resistant and photovoltaic windows
US11983779B2 (en) * 2015-08-11 2024-05-14 State Farm Mutual Automobile Insurance Company Systems and methods for impact resistant and photovoltaic windows
WO2023133021A1 (fr) * 2022-01-10 2023-07-13 Dupont Safety & Construction Procédé de production de circuits électriques sur polymères organiques chargés

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Publication number Publication date
EP1793447A1 (fr) 2007-06-06

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Legal Events

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AS Assignment

Owner name: HIRSCHMAN CAR COMMUNICATION GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PETERSEN, INGMAR;SCHWARZ, BERND;PFLETSCHINGER, MARKUS;REEL/FRAME:018894/0552

Effective date: 20070109

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION