US20070128844A1 - Non-polar (a1,b,in,ga)n quantum wells - Google Patents

Non-polar (a1,b,in,ga)n quantum wells Download PDF

Info

Publication number
US20070128844A1
US20070128844A1 US10/582,390 US58239003A US2007128844A1 US 20070128844 A1 US20070128844 A1 US 20070128844A1 US 58239003 A US58239003 A US 58239003A US 2007128844 A1 US2007128844 A1 US 2007128844A1
Authority
US
United States
Prior art keywords
gan
plane
layers
polar
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/582,390
Other languages
English (en)
Inventor
Michael Craven
Steven Denbaars
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/413,913 external-priority patent/US6900070B2/en
Application filed by Individual filed Critical Individual
Assigned to REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE reassignment REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DENBAARS, STEVEN P., CRAVEN, MICHAEL D.
Assigned to THE JAPAN SCIENCE AND TECHNOLOGY AGENCY reassignment THE JAPAN SCIENCE AND TECHNOLOGY AGENCY ASSIGNMENT OF 50% INTEREST Assignors: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Assigned to REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE reassignment REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DENBAARS, STEVEN P., CRAVEN, MICHAEL D.
Publication of US20070128844A1 publication Critical patent/US20070128844A1/en
Priority to US14/921,734 priority Critical patent/US9893236B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/04Pattern deposit, e.g. by using masks
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/10Heating of the reaction chamber or the substrate
    • C30B25/105Heating of the reaction chamber or the substrate by irradiation or electric discharge
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/605Products containing multiple oriented crystallites, e.g. columnar crystallites
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/0242Crystalline insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02516Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/15Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
    • H01L29/151Compositional structures
    • H01L29/152Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
    • H01L29/155Comprising only semiconductor materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/002Devices characterised by their operation having heterojunctions or graded gap
    • H01L33/0025Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H01L33/325Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen characterised by the doping materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds

Definitions

  • the invention is related to semiconductor materials, methods, and devices, and more particularly, to non-polar (Al,B,In,Ga)N quantum wells.
  • Nitride crystal growth along non-polar directions provides an efficient means of producing nitride-based quantum structures that are unaffected by these strong polarization-induced electric fields since the polar axis lies within the growth plane of the film.
  • m-plane GaN/AlGaN multiple quantum well (MQW) structures were first demonstrated by plasma-assisted molecular beam epitaxy (MBE) using lithium aluminate substrates [3]. Since this first demonstration, free-standing m-plane GaN substrates grown by hydride vapor phase epitaxy (HVPE) were employed for subsequent epitaxial GaN/AlGaN MQW growths by both MBE [4] and metalorganic chemical vapor deposition (MOCVD) [5].
  • HVPE hydride vapor phase epitaxy
  • the present invention describes the dependence of a-plane GaN/AlGaN MQW emission on the GaN quantum well width. Moreover, an investigation of a range of GaN well widths for MOCVD-grown a-plane and c-plane MQWs provides an indication of the emission characteristics that are unique to non-polar orientations.
  • the present invention describes a method of fabricating non-polar a-plane GaN/(Al,B,In,Ga)N multiple quantum wells (MQWs).
  • a-plane MQWs were grown on the appropriate GaN/sapphire template layers via metalorganic chemical vapor deposition (MOCVD) with well widths ranging from 20 ⁇ to 70 ⁇ .
  • MOCVD metalorganic chemical vapor deposition
  • the room temperature photoluminescence (PL) emission energy from the a-plane MQWs followed a square well trend modeled using self-consistent Poisson-Schrodinger (SCPS) calculations.
  • Optimal PL emission intensity is obtained at a quantum well width of 52 ⁇ for the a-plane MQWs.
  • FIG. 1 is a flowchart that illustrates the steps of a method for forming non-polar a-plane GaN/(Al,B,In,Ga)N quantum wells according to a preferred embodiment of the present invention.
  • FIG. 2 is a graph of high-resolution x-ray diffraction (HRXRD) scans of simultaneously regrown a-plane (69 ⁇ GaN)/(96 ⁇ Al 0.16 Ga 0.84 N) and c-plane (72 ⁇ GaN)/(98 ⁇ Al 0.16 Ga 0.84 N) MQW stacks.
  • HRXRD high-resolution x-ray diffraction
  • FIGS. 3 ( a ) and ( b ) are graphs of room temperature PL spectra of the (a) a-plane and (b) c-plane GaN/(100 ⁇ Al 0.16 Ga 0.84 N) MQWs with well widths ranging from 20 ⁇ -70 ⁇ .
  • the vertical gray line on each plot denotes a band edge of the bulk GaN layers.
  • FIG. 4 is a graph of the well width dependence of the room temperature PL emission energy of the a-plane and c-plane MQWs.
  • the dotted line is the result of self-consistent Poisson-Schrodinger (SCPS) calculations for a flat-band GaN/(100 ⁇ Al 0.16 Ga 0.84 N) MQW.
  • SCPS Poisson-Schrodinger
  • FIG. 5 is a graph of the normalized room temperature PL intensity plotted as a function of GaN quantum well width for both a-plane and c-plane growth orientations. The data for each orientation is normalized separately, hence direct comparisons between the relative intensities of a-plane and c-plane MQWs are not possible.
  • Non-polar nitride-based semiconductor crystals do not experience the effects of polarization-induced electric fields that dominate the behavior of polar nitride-based quantum structures. Since the polarization axis of a wurtzite nitride unit cell is aligned parallel to the growth direction of polar nitride crystals, internal electric fields are present in polar nitride heterostructures. These “built-in” fields have a detrimental effect on the performance of state-of-the-art optoelectronic and electronic devices. By growing nitride crystals along non-polar directions, quantum structures not influenced by polarization-induced electric fields are realized. Since the energy band profiles of a given quantum well change depending upon the growth orientation, different scientific principles must be applied in order to design high performance non-polar quantum wells. This invention describes the design principles used to produce optimized non-polar quantum wells.
  • FIG. 1 is a flowchart that illustrates the steps of a method for forming quantum wells according to a preferred embodiment of the present invention. The steps of this method grow non-polar a-plane GaN/AlGaN MQWs on a-plane GaN/r-plane sapphire template layers.
  • Block 100 represents loading of a sapphire substrate into a vertical, close-spaced, showerhead MOCVD reactor.
  • epi-ready sapphire substrates with surfaces crystallographically oriented within ⁇ 2° of the sapphire r-plane may be obtained from commercial vendors. No ex-situ preparations need be performed prior to loading the sapphire substrate into the MOCVD reactor, although ex-situ cleaning of the sapphire substrate could be used as a precautionary measure.
  • Block 102 represents annealing the sapphire substrate in-situ at a high temperature (>1000° C.), which improves the quality of the substrate surface on the atomic scale. After annealing, the substrate temperature is reduced for the subsequent low temperature nucleation layer deposition.
  • Block 104 represents depositing a thin, low temperature, low pressure, nitride-based nucleation layer as a buffer layer on the sapphire substrate.
  • nitride-based nucleation layer is comprised of, but is not limited to, 1-100 nanometers (nm) of GaN deposited at approximately 400-900° C. and 1 atm.
  • Block 106 represents one or more growing unintentionally doped (UID) a-plane GaN layers to a thickness of approximately 1.5 ⁇ m on the nucleation layer deposited on the substrate.
  • the high temperature growth conditions include, but are not limited to, approximately 1100° C. growth temperature, 0.2 atm or less growth pressure, 30 ⁇ mol per minute Ga flow, and 40,000 ⁇ mol per minute N flow, thereby providing a V/III ratio of approximately 1300).
  • the precursors used as the group III and V sources are trimethylgallium, ammonia and disilane, although alternative precursors could be used as well.
  • growth conditions may be varied to produce different growth rates, e.g., between 5 and 9 ⁇ per second, without departing from the scope of the present invention.
  • Block 108 represents cooling the epitaxial a-plane GaN layers down under a nitrogen overpressure.
  • Block 110 represents one or more (Al,B,In,Ga)N layers being grown on the a-plane GaN layers.
  • these grown layers comprise ⁇ 100 ⁇ Al 0.16 Ga 0.84 N barriers doped with an Si concentration of ⁇ 2 ⁇ 10 18 cm ⁇ 3 .
  • the above Blocks may be repeated as necessary. In one example, Block 110 was repeated 10 times to form UID GaN wells ranging in width from approximately 20 ⁇ to approximately 70 ⁇ .
  • non-polar nitride quantum wells flat energy band profiles exist and the QCSE is not present. Consequently, non-polar quantum well emission is expected to follow different trends as compared to polar quantum wells. Primarily, non-polar quantum wells exhibit improved recombination efficiency, and intense emission from thicker quantum wells is possible. Moreover, the quantum well width required for optimal non-polar quantum well emission is larger than for polar quantum wells.
  • the following describes the room temperature PL characteristics of non-polar GaN/( ⁇ 100 ⁇ Al 0.16 Ga 0.84 N) MQWs in comparison to c-plane structures as a function of quantum well width.
  • 10-period a-plane and c-plane MQWs structures were simultaneously regrown on the appropriate GaN/sapphire template layers via MOCVD with well widths ranging from approximately 20 ⁇ to 70 ⁇ .
  • FIG. 2 is a graph of HRXRD scans of simultaneously regrown a-plane 69 ⁇ GaN/96 ⁇ Al 0.16 Ga 0.84 N and c-plane 72 ⁇ GaN/98 ⁇ Al 0.16 Ga 0.84 N MQW stacks.
  • the HRXRD profiles provide a qualitative comparison of the MQW interface quality through the FWHM of the satellite peaks.
  • the on-axis 2 ⁇ - ⁇ scans of the a-plane and c-plane structures were taken about the GaN (11 2 0) and (0004) reflections, respectively.
  • Analysis of the x-ray profiles yields both the aluminum composition x of the Al x Ga 1-x N barriers and the quantum well dimensions (well and barrier thickness), which agree within 7% for the simultaneously grown a-plane and c-plane samples indicating a mass transport limited MOCVD growth regime.
  • Both HRXRD profiles reveal superlattice (SL) peaks out to the second order in addition to strong reflections from the GaN layers.
  • the FWHMs of the SL peaks provide a qualitative metric of the quantum well interface quality [10]; therefore, from the scans shown in FIG.
  • FIGS. 3 ( a ) and ( b ) are graphs of room temperature PL spectra of the (a) a-plane and (b) c-plane GaN/(100 ⁇ Al 0.16 Ga 0.84 N) MQWs with well widths ranging from ⁇ 20 ⁇ to ⁇ 70 ⁇ .
  • the vertical gray line on each plot denotes the bulk GaN band edge.
  • the MQW PL emission shifts to longer wavelengths (equivalently, the PL emission decreases) with increasing quantum well width as the quantum confinement is reduced.
  • the c-plane MQW emission energy red-shifts below the GaN band edge when the GaN quantum well width is increased from 38 ⁇ to 50 ⁇ .
  • the appearance of c-GaN buffer emission implies that the c-plane template has a lower native point defect density than the a-plane template.
  • yellow band emission was observed for both the non-polar and polar MQWs; therefore, the origin of deep trap levels is most likely the growth conditions required to maintain the a-plane morphology and not a characteristic of the non-polar orientation.
  • the two primary features of the PL emission spectra, the emission energy and the emission intensity, are summarized in FIGS. 4 and 5 , respectively, as functions of quantum well width.
  • the emission energy decreases with increasing well width due to quantum confinement effects.
  • FIG. 4 is a graph of the well width dependence of the room temperature PL emission energy of the a-plane and c-plane MQWs.
  • the a-plane MQW emission is blue-shifted with respect to the bulk GaN band edge and the blue-shift increases with decreasing well width as quantum confinement raises the quantum well's ground-state energy.
  • the a-plane MQW emission energy trend is modeled accurately using square well SCPS calculations [11] shown as the dotted line in FIG. 4 .
  • the agreement between theory and experiment confirms that emission from non-polar MQWs is not influenced by polarization-induced electric fields. Despite this agreement, the theoretical model increasingly over-estimates the experimental data with decreasing quantum well width by 15 to 35 meV.
  • FIG. 4 shows the dramatic red-shift in c-plane MQW emission with increasing well width, a widely observed trend dictated by the QCSE [14-18].
  • the experimental c-plane MQW emission energy trend agrees with the model of the polar QW ground state proposed by Grandjean et al. [13]. Interpolating the experimental data, the emission from c-plane MQWs with GaN well widths greater than ⁇ 43 ⁇ is below the bulk GaN band edge.
  • FIG. 5 is a graph of the normalized room temperature PL emission intensity plotted as a function of GaN quantum well width for both a-plane and c-plane growth orientations.
  • the data for each orientation is normalized separately, hence direct comparisons between the relative intensities of a-plane MQWs and c-plane MQWs are not possible. Since the microstructural quality of the template layers is substantially different, a direct comparison between a-and c-plane MQW emission intensity would be inconclusive.
  • a maximum a-plane MQW emission intensity is associated with an optimal quantum well width of 52 ⁇ , while the maximum c-plane emission intensity is observed for 28 ⁇ -wide wells.
  • optimal emission intensity is obtained from relatively thin polar GaN quantum wells (20 ⁇ -35 ⁇ ) depending on the thickness and composition of the AlGaN barrier layers [13]. The balance between reduced recombination efficiency in thick wells and the reduced recombination due to increased nonradiative transitions at heterointerfaces and extension of electron wavefunctions outside of thin wells [19] determines the optimal c-plane well width.
  • the optimal well width is determined by material quality, interface roughness, and the excitonic Bohr radius. Although the interface roughness of the a-plane structures is greater than the c-plane, the advantageous effects of a non-polar orientation are apparent. Also note that, with improved non-polar surface and interface quality, the optimal well width will most likely shift from the optimal width observed for these samples.
  • non-polar (Al,In,Ga)N quantum wells and heterostructures design and MOCVD growth conditions may be used in alternative embodiments.
  • specific thickness and composition of the layers, in addition to the number of quantum wells grown, are variables inherent to quantum well structure design and may be used in alternative embodiments of the present invention.
  • MOCVD growth conditions determine the dimensions and compositions of the quantum well structure layers.
  • MOCVD growth conditions are reactor dependent and may vary between specific reactor designs. Many variations of this process are possible with the variety of reactor designs currently being using in industry and academia.
  • the growth method could also be molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), hydride vapor phase epitaxy (HVPE), sublimation, or plasma-enhanced chemical vapor deposition (PECVD).
  • MBE molecular beam epitaxy
  • LPE liquid phase epitaxy
  • HVPE hydride vapor phase epitaxy
  • PECVD plasma-enhanced chemical vapor deposition
  • substrates other than sapphire could be employed. These substrates include silicon carbide, gallium nitride, silicon, zinc oxide, boron nitride, lithium aluminate, lithium niobate, germanium, aluminum nitride, and lithium gallate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Recrystallisation Techniques (AREA)
US10/582,390 2002-04-15 2003-12-11 Non-polar (a1,b,in,ga)n quantum wells Abandoned US20070128844A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/921,734 US9893236B2 (en) 2002-04-15 2015-10-23 Non-polar (Al,B,In,Ga)N quantum wells

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/413,913 US6900070B2 (en) 2002-04-15 2003-04-15 Dislocation reduction in non-polar gallium nitride thin films
US10/413,691 US20030198837A1 (en) 2002-04-15 2003-04-15 Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
US10/413,690 US7091514B2 (en) 2002-04-15 2003-04-15 Non-polar (Al,B,In,Ga)N quantum well and heterostructure materials and devices
PCT/US2003/039355 WO2005064643A1 (fr) 2003-04-15 2003-12-11 Puits quantiques (al, b, in, ga)n non polaires

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2003/021918 Continuation-In-Part WO2004061909A1 (fr) 2002-04-15 2003-07-15 Croissance de nitrure de gallium non polaire a densite des dislocations reduite par epitaxie en phase vapeur
PCT/US2003/039355 A-371-Of-International WO2005064643A1 (fr) 2002-04-15 2003-12-11 Puits quantiques (al, b, in, ga)n non polaires

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/921,734 Continuation US9893236B2 (en) 2002-04-15 2015-10-23 Non-polar (Al,B,In,Ga)N quantum wells

Publications (1)

Publication Number Publication Date
US20070128844A1 true US20070128844A1 (en) 2007-06-07

Family

ID=38984062

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/582,390 Abandoned US20070128844A1 (en) 2002-04-15 2003-12-11 Non-polar (a1,b,in,ga)n quantum wells
US14/921,734 Expired - Lifetime US9893236B2 (en) 2002-04-15 2015-10-23 Non-polar (Al,B,In,Ga)N quantum wells

Family Applications After (1)

Application Number Title Priority Date Filing Date
US14/921,734 Expired - Lifetime US9893236B2 (en) 2002-04-15 2015-10-23 Non-polar (Al,B,In,Ga)N quantum wells

Country Status (6)

Country Link
US (2) US20070128844A1 (fr)
EP (1) EP1697965A4 (fr)
JP (1) JP5096677B2 (fr)
CN (1) CN1894771B (fr)
AU (1) AU2003293497A1 (fr)
WO (1) WO2005064643A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080164489A1 (en) * 2006-12-11 2008-07-10 The Regents Of The University Of California Metalorganic chemical vapor deposittion (MOCVD) growth of high performance non-polar III-nitride optical devices
US20080179607A1 (en) * 2006-12-11 2008-07-31 The Regents Of The University Of California Non-polar and semi-polar light emitting devices

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8809867B2 (en) 2002-04-15 2014-08-19 The Regents Of The University Of California Dislocation reduction in non-polar III-nitride thin films
US7208393B2 (en) 2002-04-15 2007-04-24 The Regents Of The University Of California Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy
JP5254521B2 (ja) 2002-04-15 2013-08-07 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 非極性窒化ガリウム薄膜における転位の低減
US7186302B2 (en) 2002-12-16 2007-03-06 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
US7427555B2 (en) 2002-12-16 2008-09-23 The Regents Of The University Of California Growth of planar, non-polar gallium nitride by hydride vapor phase epitaxy
KR101086155B1 (ko) 2002-12-16 2011-11-25 독립행정법인 과학기술진흥기구 수소화합물 기상 성장법에 의한 평면, 비극성 질화 갈륨의 성장
US7504274B2 (en) 2004-05-10 2009-03-17 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
US7956360B2 (en) 2004-06-03 2011-06-07 The Regents Of The University Of California Growth of planar reduced dislocation density M-plane gallium nitride by hydride vapor phase epitaxy
US8193020B2 (en) 2006-11-15 2012-06-05 The Regents Of The University Of California Method for heteroepitaxial growth of high-quality N-face GaN, InN, and AlN and their alloys by metal organic chemical vapor deposition
EP2087507A4 (fr) 2006-11-15 2010-07-07 Univ California Procédé pour une croissance hétéroépitaxiale de gan, inn, et ain à face n de haute qualité et pour leurs alliages par un dépôt chimique en phase vapeur organique de métal
KR20100067114A (ko) * 2007-09-19 2010-06-18 더 리전츠 오브 더 유니버시티 오브 캘리포니아 비극성 및 반극성 질화물 기판들의 면적을 증가하기 위한 방법
TWI380368B (en) * 2009-02-04 2012-12-21 Univ Nat Chiao Tung Manufacture method of a multilayer structure having non-polar a-plane {11-20} iii-nitride layer
CN102146585A (zh) * 2011-01-04 2011-08-10 武汉华炬光电有限公司 非极性面GaN外延片及其制备方法
CN102931315A (zh) * 2011-08-09 2013-02-13 叶哲良 半导体结构与制作方法
CN106299041A (zh) * 2016-08-29 2017-01-04 华南理工大学 生长在r面蓝宝石衬底上的非极性LED外延片的制备方法及应用
CN109802020B (zh) * 2018-12-26 2020-05-19 华灿光电(浙江)有限公司 一种GaN基发光二极管外延片及其制备方法
CN110571311B (zh) * 2019-07-30 2021-12-14 中国科学技术大学 一种多量子阱结构、光电器件外延片及光电器件
CN116581217B (zh) * 2023-07-13 2023-09-12 江西兆驰半导体有限公司 发光二极管外延片及其制备方法、发光二极管

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926726A (en) * 1997-09-12 1999-07-20 Sdl, Inc. In-situ acceptor activation in group III-v nitride compound semiconductors
US6072197A (en) * 1996-02-23 2000-06-06 Fujitsu Limited Semiconductor light emitting device with an active layer made of semiconductor having uniaxial anisotropy
US6156581A (en) * 1994-01-27 2000-12-05 Advanced Technology Materials, Inc. GaN-based devices using (Ga, AL, In)N base layers
US6177057B1 (en) * 1999-02-09 2001-01-23 The United States Of America As Represented By The Secretary Of The Navy Process for preparing bulk cubic gallium nitride
US6229151B1 (en) * 1997-09-30 2001-05-08 Agilent Technologies, Inc. Group III-V semiconductor light emitting devices with reduced piezoelectric fields and increased efficiency
US20010024312A1 (en) * 2000-03-23 2001-09-27 Samsung Electronic Co., Ltd. Electro-absorption typed optical modulator
US6298079B1 (en) * 1994-09-16 2001-10-02 Rohm Co., Ltd. Gallium nitride type laser for emitting blue light
US20010029086A1 (en) * 2000-02-24 2001-10-11 Masahiro Ogawa Semiconductor device, method for fabricating the same and method for fabricating semiconductor substrate
US20020098641A1 (en) * 1998-04-10 2002-07-25 Yuhzoh Tsuda Semiconductor substrate, light-emitting device, and method for producing the same
US6440823B1 (en) * 1994-01-27 2002-08-27 Advanced Technology Materials, Inc. Low defect density (Ga, Al, In)N and HVPE process for making same
US6468882B2 (en) * 2000-07-10 2002-10-22 Sumitomo Electric Industries, Ltd. Method of producing a single crystal gallium nitride substrate and single crystal gallium nitride substrate
US6590336B1 (en) * 1999-08-31 2003-07-08 Murata Manufacturing Co., Ltd. Light emitting device having a polar plane piezoelectric film and manufacture thereof
US20030198837A1 (en) * 2002-04-15 2003-10-23 Craven Michael D. Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
WO2003098757A1 (fr) * 2002-05-17 2003-11-27 Ammono Sp.Zo.O. Structure d'element electroluminescent comprenant une couche de monocristaux de nitrure en vrac
US6677619B1 (en) * 1997-01-09 2004-01-13 Nichia Chemical Industries, Ltd. Nitride semiconductor device
US20040108513A1 (en) * 2002-12-09 2004-06-10 Yukio Narukawa Nitride semiconductor device and a process of manufacturing the same
US20040135222A1 (en) * 2002-12-05 2004-07-15 Research Foundation Of City University Of New York Photodetectors and optically pumped emitters based on III-nitride multiple-quantum-well structures
US20040251471A1 (en) * 2001-10-26 2004-12-16 Robert Dwilinski Light emitting element structure using nitride bulk single crystal layer
US20040261692A1 (en) * 2001-10-26 2004-12-30 Robert Dwilinski Substrate for epitaxy
US6849472B2 (en) * 1997-09-30 2005-02-01 Lumileds Lighting U.S., Llc Nitride semiconductor device with reduced polarization fields
US6882051B2 (en) * 2001-03-30 2005-04-19 The Regents Of The University Of California Nanowires, nanostructures and devices fabricated therefrom
US20050205884A1 (en) * 2004-03-19 2005-09-22 Lumileds Lighting U.S., Llc Semiconductor light emitting devices including in-plane light emitting layers
US6951695B2 (en) * 2001-06-08 2005-10-04 Cree, Inc. High surface quality GaN wafer and method of fabricating same
US6977953B2 (en) * 2001-07-27 2005-12-20 Sanyo Electric Co., Ltd. Nitride-based semiconductor light-emitting device and method of fabricating the same
US20060138431A1 (en) * 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
US7208096B2 (en) * 2002-06-26 2007-04-24 Agency For Science, Technology And Research Method of cleaving GaN/sapphire for forming laser mirror facets

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3946427B2 (ja) 2000-03-29 2007-07-18 株式会社東芝 エピタキシャル成長用基板の製造方法及びこのエピタキシャル成長用基板を用いた半導体装置の製造方法
US6576932B2 (en) * 2001-03-01 2003-06-10 Lumileds Lighting, U.S., Llc Increasing the brightness of III-nitride light emitting devices
JP4201541B2 (ja) 2002-07-19 2008-12-24 豊田合成株式会社 半導体結晶の製造方法及びiii族窒化物系化合物半導体発光素子の製造方法

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156581A (en) * 1994-01-27 2000-12-05 Advanced Technology Materials, Inc. GaN-based devices using (Ga, AL, In)N base layers
US6440823B1 (en) * 1994-01-27 2002-08-27 Advanced Technology Materials, Inc. Low defect density (Ga, Al, In)N and HVPE process for making same
US6298079B1 (en) * 1994-09-16 2001-10-02 Rohm Co., Ltd. Gallium nitride type laser for emitting blue light
US6072197A (en) * 1996-02-23 2000-06-06 Fujitsu Limited Semiconductor light emitting device with an active layer made of semiconductor having uniaxial anisotropy
US6677619B1 (en) * 1997-01-09 2004-01-13 Nichia Chemical Industries, Ltd. Nitride semiconductor device
US5926726A (en) * 1997-09-12 1999-07-20 Sdl, Inc. In-situ acceptor activation in group III-v nitride compound semiconductors
US6229151B1 (en) * 1997-09-30 2001-05-08 Agilent Technologies, Inc. Group III-V semiconductor light emitting devices with reduced piezoelectric fields and increased efficiency
US6569704B1 (en) * 1997-09-30 2003-05-27 Lumileds Lighting U.S., Llc Group III-V semiconductor light emitting devices with reduced piezoelectric fields and increased efficiency
US6849472B2 (en) * 1997-09-30 2005-02-01 Lumileds Lighting U.S., Llc Nitride semiconductor device with reduced polarization fields
US20020098641A1 (en) * 1998-04-10 2002-07-25 Yuhzoh Tsuda Semiconductor substrate, light-emitting device, and method for producing the same
US6177057B1 (en) * 1999-02-09 2001-01-23 The United States Of America As Represented By The Secretary Of The Navy Process for preparing bulk cubic gallium nitride
US6590336B1 (en) * 1999-08-31 2003-07-08 Murata Manufacturing Co., Ltd. Light emitting device having a polar plane piezoelectric film and manufacture thereof
US20010029086A1 (en) * 2000-02-24 2001-10-11 Masahiro Ogawa Semiconductor device, method for fabricating the same and method for fabricating semiconductor substrate
US20010024312A1 (en) * 2000-03-23 2001-09-27 Samsung Electronic Co., Ltd. Electro-absorption typed optical modulator
US6468882B2 (en) * 2000-07-10 2002-10-22 Sumitomo Electric Industries, Ltd. Method of producing a single crystal gallium nitride substrate and single crystal gallium nitride substrate
US6882051B2 (en) * 2001-03-30 2005-04-19 The Regents Of The University Of California Nanowires, nanostructures and devices fabricated therefrom
US6996147B2 (en) * 2001-03-30 2006-02-07 The Regents Of The University Of California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
US6951695B2 (en) * 2001-06-08 2005-10-04 Cree, Inc. High surface quality GaN wafer and method of fabricating same
US6977953B2 (en) * 2001-07-27 2005-12-20 Sanyo Electric Co., Ltd. Nitride-based semiconductor light-emitting device and method of fabricating the same
US20040261692A1 (en) * 2001-10-26 2004-12-30 Robert Dwilinski Substrate for epitaxy
US20040251471A1 (en) * 2001-10-26 2004-12-16 Robert Dwilinski Light emitting element structure using nitride bulk single crystal layer
US7057211B2 (en) * 2001-10-26 2006-06-06 Ammono Sp. Zo.O Nitride semiconductor laser device and manufacturing method thereof
US7132730B2 (en) * 2001-10-26 2006-11-07 Ammono Sp. Z.O.O. Bulk nitride mono-crystal including substrate for epitaxy
US20030198837A1 (en) * 2002-04-15 2003-10-23 Craven Michael D. Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
WO2003098757A1 (fr) * 2002-05-17 2003-11-27 Ammono Sp.Zo.O. Structure d'element electroluminescent comprenant une couche de monocristaux de nitrure en vrac
US20060138431A1 (en) * 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
US7208096B2 (en) * 2002-06-26 2007-04-24 Agency For Science, Technology And Research Method of cleaving GaN/sapphire for forming laser mirror facets
US20040135222A1 (en) * 2002-12-05 2004-07-15 Research Foundation Of City University Of New York Photodetectors and optically pumped emitters based on III-nitride multiple-quantum-well structures
US20040108513A1 (en) * 2002-12-09 2004-06-10 Yukio Narukawa Nitride semiconductor device and a process of manufacturing the same
US20050205884A1 (en) * 2004-03-19 2005-09-22 Lumileds Lighting U.S., Llc Semiconductor light emitting devices including in-plane light emitting layers

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080164489A1 (en) * 2006-12-11 2008-07-10 The Regents Of The University Of California Metalorganic chemical vapor deposittion (MOCVD) growth of high performance non-polar III-nitride optical devices
US20080179607A1 (en) * 2006-12-11 2008-07-31 The Regents Of The University Of California Non-polar and semi-polar light emitting devices
US7842527B2 (en) 2006-12-11 2010-11-30 The Regents Of The University Of California Metalorganic chemical vapor deposition (MOCVD) growth of high performance non-polar III-nitride optical devices
US20110037052A1 (en) * 2006-12-11 2011-02-17 The Regents Of The University Of California Metalorganic chemical vapor deposition (mocvd) growth of high performance non-polar iii-nitride optical devices
US8178373B2 (en) 2006-12-11 2012-05-15 The Regents Of The University Of California Metalorganic chemical vapor deposition (MOCVD) growth of high performance non-polar III-nitride optical devices
US8956896B2 (en) 2006-12-11 2015-02-17 The Regents Of The University Of California Metalorganic chemical vapor deposition (MOCVD) growth of high performance non-polar III-nitride optical devices
US9130119B2 (en) 2006-12-11 2015-09-08 The Regents Of The University Of California Non-polar and semi-polar light emitting devices

Also Published As

Publication number Publication date
WO2005064643A1 (fr) 2005-07-14
JP2007524983A (ja) 2007-08-30
EP1697965A1 (fr) 2006-09-06
CN1894771B (zh) 2012-07-04
US9893236B2 (en) 2018-02-13
AU2003293497A1 (en) 2005-07-21
CN1894771A (zh) 2007-01-10
EP1697965A4 (fr) 2011-02-09
JP5096677B2 (ja) 2012-12-12
US20160043278A1 (en) 2016-02-11

Similar Documents

Publication Publication Date Title
US9893236B2 (en) Non-polar (Al,B,In,Ga)N quantum wells
US7091514B2 (en) Non-polar (Al,B,In,Ga)N quantum well and heterostructure materials and devices
Craven et al. Well-width dependence of photoluminescence emission from a-plane GaN/AlGaN multiple quantum wells
US8450192B2 (en) Growth of planar, non-polar, group-III nitride films
JP5838523B2 (ja) 半極性(Al,In,Ga,B)NまたはIII族窒化物の結晶
US20020069817A1 (en) Method to reduce the dislocation density in group III-nitride films
CA2669228A1 (fr) Procede pour une croissance heteroepitaxiale de gan, inn, et ain a face n de haute qualite et pour leurs alliages par un depot chimique en phase vapeur organique de metal
EP1576671A1 (fr) Croissance de nitrure de gallium a plan a non polaires et a geometrie planaire par epitaxie en phase vapeur de l'hydrure
Orlova et al. Influence of Growth Parameters on a‐Plane InGaN/GaN Heterostructures on r‐Sapphire
Keller et al. Dislocation reduction in GaN films through selective island growth of InGaN
KR101074852B1 (ko) 무극성 (Al,B,In,Ga)N 양자 우물
LI MOCVD GROWTH OF GAN ON 200MM SI AND ADDRESSING FOUNDRY COMPATIBILITY ISSUES
Dai et al. High quality a-plane GaN layers grown by pulsed atomic-layer epitaxy on r-plane sapphire substrates

Legal Events

Date Code Title Description
AS Assignment

Owner name: REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE, CALI

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CRAVEN, MICHAEL D.;DENBAARS, STEVEN P.;REEL/FRAME:014383/0993;SIGNING DATES FROM 20031216 TO 20040113

AS Assignment

Owner name: THE JAPAN SCIENCE AND TECHNOLOGY AGENCY, JAPAN

Free format text: ASSIGNMENT OF 50% INTEREST;ASSIGNOR:THE REGENTS OF THE UNIVERSITY OF CALIFORNIA;REEL/FRAME:015609/0872

Effective date: 20050119

AS Assignment

Owner name: REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE, CALI

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CRAVEN, MICHAEL D.;DENBAARS, STEVEN P.;REEL/FRAME:018002/0641;SIGNING DATES FROM 20031216 TO 20040113

STCB Information on status: application discontinuation

Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION