US20070006996A1 - Cooler for electronic equipment - Google Patents

Cooler for electronic equipment Download PDF

Info

Publication number
US20070006996A1
US20070006996A1 US10/562,362 US56236205A US2007006996A1 US 20070006996 A1 US20070006996 A1 US 20070006996A1 US 56236205 A US56236205 A US 56236205A US 2007006996 A1 US2007006996 A1 US 2007006996A1
Authority
US
United States
Prior art keywords
cooling
passage
cooling panel
electronic equipment
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/562,362
Other languages
English (en)
Inventor
Kazuyuki Mikubo
Sakae Kitajo
Atsushi Ochi
Mitsuru Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Assigned to NEC CORPORATION reassignment NEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KITAJO, SAKAE, MIKUBO, KAZUYUKI, OCHI, ATSUSHI, YAMAMOTO, MITSURU
Publication of US20070006996A1 publication Critical patent/US20070006996A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to a cooling device for an electronic equipment and, more particularly, to a cooling device for an electronic equipment, suitable to cooling a heating part, such as a CPU, mounted on a notebook personal computer.
  • heating parts having a larger power dissipation such as a CPU
  • the recent electronic equipment such as a personal computer
  • the amount of heat generated by the heating parts is more and more increasing.
  • the variety of electronic parts used therein generally have an operating temperature limit due to the temperature dependency of the heat-resistance reliability and operating characteristic.
  • the electronic equipment such as a personal computer, includes a metal heat sink or so-called heat pipe etc. attached to the CPU etc. as a heat absorbing part, which diffuses the heat across the entirety of the electronic equipment by heat conduction, or an electromagnetic cooling fan attached onto the housing for radiating the heat from inside to outside of the electronic equipment.
  • an electronic equipment such as a notebook personal computer, on which electronic parts are densely mounted, has a small heat radiation space within the electronic equipment, and is capable of cooling a CPU having a power consumption of up to 300 watts by using a conventional cooling fan alone or a combination of the cooling fan and heat pipe. It is difficult, however, to sufficiently radiate the internal heat from a CPU having a power consumption above that value.
  • JP-A-2003-67087 describes a liquid-type cooling device, wherein a personal computer body is provided with a heat-receiving head which receives heat from the heating parts of the personal computer body.
  • a housing is also disposed which is provided with a connecting head, to which the heat from the heating parts is transferred through the heat-receiving head, a tube connected to the connecting head and filled with refrigerant, and a pump for circulating the refrigerant, which are disposed on the bottom of the personal computer body.
  • the conventional technique described in the above publication has the configuration wherein the refrigerant is circulated through the tube disposed on the bottom of the personal computer body, an thus a sufficient heat radiation area cannot be secured therein. Accordingly, there is a problem in that it only achieves a lower cooling efficient and it is difficult to achieve a smaller thickness for the cooling device.
  • the present invention is devised in view of the above problems, and it is an object of the present invention to provide a cooling device for an electronic equipment, which is capable of assuring a sufficient heat radiation area to improve the cooling efficiency and capable of being reduced in the thickness thereof.
  • the present invention provides a cooling device for an electronic equipment, including: a first cooling panel wherein a first passage through which refrigerant circulates is formed; a second cooling panel wherein a second passage through which the refrigerant circulates is formed, the second cooling panel being disposed to oppose the first cooling panel; and a circulation pump for circulating the refrigerant through the first passage and the second passage to thereby diffuse heat transferred to the first cooling panel and the second cooling panel.
  • the present invention provides an electronic equipment mounting thereon the above cooling device for electronic equipment.
  • arrangement of the first cooling panel and the second cooling panel opposing each other and circulation of the refrigerant by the circulation pump within the passage in these cooling panels provide a cooling device having a sufficient heat radiation area and a higher cooling efficiency.
  • the cooling device for electronic equipment of the present invention include a coupling member bearing the first cooling panel and the second cooling panel for opening and closing with respect to each other.
  • a compact-shaped cooling device can be obtained.
  • At least one of the first cooling panel and the second cooling panel include a micro-channel structure within the passage, the micro-channel structure including a plurality of narrow passages having a width smaller than the width of the passage.
  • the at least one of the first cooling panel and the second cooling panel include an area in which an air-cooled fin is formed on a surface thereof, the area being disposed downstream of the micro-channel structure.
  • the passage in the area be wobbled.
  • a cooling fan be disposed corresponding to the air-cooled fin.
  • the circulation pump be fixed onto the surface of the second cooling panel. It is also preferable that a reservoir communicated with the second passage be disposed on a surface of the second cooling panel. In an alternative, a reservoir communicated with the second passage be formed within the second cooling panel. It is also preferable that one or both of the first cooling panel and the second cooling panel be formed by bonding together a top heat radiation panel and a bottom heat radiation panel, in at least one of which is formed a groove. It is preferable that the first cooling panel have an area smaller than the area of the second cooling panel. Moreover, it is preferable that the first passage have a width smaller than the width of the second passage and that the first passage have a depth larger than the depth of the second passage.
  • FIG. 1 ] ( a ) is a top plan view of a cooling device for an electronic equipment according to a first embodiment of the present invention, and (b) and (c) are a side view and a front view, respectively, thereof.
  • FIG. 2 A top plan view showing the configuration of the passage underlying the air-cooled fin shown in FIG. 1 .
  • FIG. 3 ( a ) is top plan view of the bottom heat radiation plate of the first cooling panel configuring the first cooling panel member shown in FIG. 1 , and (b) is a side view thereof.
  • FIG. 4 ] ( a ) is a top plan view of the top heat radiation plate of the first cooling panel configuring the first cooling panel member shown in FIG. 1 , and (b) is a side view thereof.
  • FIG. 5 A top plan view showing the configuration of the introduction portion for the micro-channel structure shown in FIG. 1 .
  • FIG. 6 ] ( a ) is a top plan view of the second cooling panel shown in FIG. 1 , and (b) and (c) are a side view and a front view, respectively, thereof.
  • FIG. 7 ] ( a ) is a top plan view of the bottom heat radiation plate of the second cooling panel configuring the second cooling panel member shown in FIG. 6 , and (b) is a sectional view taken along line Y-Y′ shown in (a).
  • FIG. 8 A top plan view showing the configuration of the top heat radiation plate of the second cooling panel configuring the second cooling panel member shown in FIG. 6 .
  • FIG. 9 A graph showing the relationship between the width and depth of the passage shown in FIG. 6 and the cooling performance.
  • FIG. 10 A graph showing the relationship between the width and plate thickness of the passage shown in FIG. 6 and the resistance performance to pressure.
  • FIG. 11 ] ( a ) is an exploded perspective view of a first example of the circulation pump shown in FIG. 1 , and (b) is a side view in section thereof.
  • FIG. 12 ] ( a ) and ( b ) are side views in section showing a mounting technique for the circulation pump shown in FIG. 11 .
  • FIG. 13 ] ( a ) is an exploded perspective view of a second example of the circulation pump shown in FIG. 1 , and (b) is a side view in section thereof.
  • FIG. 14 ] ( a ) to ( d ) are side views in section showing a mounting technique for the circulation pump shown in FIG. 13 .
  • FIG. 15 ] ( a ) and ( b ) are side views in section showing a mounting technique for the circulation pump shown in FIG. 13 .
  • FIG. 16 ] ( a ) is an exploded perspective view of a third example of the circulation pump shown in FIG. 1 , and (b) is a side view in section thereof.
  • FIG. 17 ] ( a ) to ( d ) are side views in section showing a mounting technique for the circulation pump shown in FIG. 16 .
  • FIG. 18 A perspective view showing the configuration of the reservoir shown in FIG. 1 .
  • FIG. 19 ] ( a ) and ( b ) are sectional views taken along line Z-Z′ in FIG. 18 .
  • FIG. 20 ] ( a ) to ( d ) are explanatory views for showing the air storage function of the reservoir shown in FIG. 18 .
  • FIG. 21 ] ( a ) is a perspective view showing a first example of assembling the cooling device for an electronic equipment according to the present invention into the electronic equipment, and (b) is a sectional view taken along line Z-Z′ in (a).
  • FIG. 22 ] ( a ) is a perspective view showing a second example for assembling the cooling device for an electronic equipment according to the present invention into the electronic equipment, and (b) is a sectional view taken along line Z-Z′ in (a).
  • FIG. 23 ] ( a ) is a perspective view showing a third example for assembling the cooling device for an electronic equipment according to the present invention into the electronic equipment, and (b) is a sectional view taken along line Z-Z′ in (a).
  • FIG. 24 A top plan view showing an example of experiment for the cooling effect depending on the change of air-flow on the bottom surface of the second cooling panel shown in FIG. 1 .
  • FIG. 25 A graph showing the relationship between the change of air-flow on the bottom surface of the second cooling panel shown in FIG. 1 and the cooling effect.
  • FIG. 26 A top plan view of the second cooling panel in a cooling device for an electronic equipment according to a second embodiment of the present invention.
  • FIG. 27 ] ( a ) to ( d ) are top plan views showing the structure of the standing-rest-type reservoir used in the second embodiment.
  • a cooling device for an electronic equipment includes a first cooling panel 1 , a second cooling panel 2 , and coupling members 61 , 62 , which couple together the first cooling panel 1 and second cooling panel 2 , and bear the first cooling panel 1 for allowing opening and closing movement thereof with respect to the second cooling panel 2 in the direction of arrows shown in FIG. 1 ( c ).
  • the cooling device has a function of cooling the heating parts 7 , such as CPU or other heating bodies generating heat, by circulating refrigerant such as water and antifreeze liquid through the passage, which is formed in the first cooling panel 1 and second cooling panel 2 .
  • the numeral 84 shown in FIG. 1 denotes a battery which is located there upon mounting the cooling device on the electronic equipment, and the second cooling panel 2 has a shape that does not overlap the area for the battery 84 .
  • the shape of the first cooling panel 1 and second cooling panel 2 shown in FIG. 1 is suitably determined based on a variety of constraints, upon mounting the same on an electronic equipment.
  • a metallic material, such as copper (Cu) and aluminum (Al), having a superior heat conductivity is used for the first cooling panel 1 , in which the passage 11 and a micro-channel structure 12 are formed, as shown in FIG. 1 .
  • the top and bottom surfaces of the first cooling panel 1 are provided with respective air-cooled fins 13 , and the passage 11 within the area 13 A, in which the air-cooled fins 13 are formed, is configured as a wobbled passage 111 for improving the cooling effect, as shown in FIG. 2 .
  • the numeral 5 shown in FIG. 1 ( a ) denotes a cooling fan 5 , which forms an air-flow in the air-cooled fin provided on the first cooling panel 1 , for improvement of air-cooling effect.
  • the first cooling panel 1 is manufactured by bonding the bottom heat radiation plate 17 and the top heat radiation plate 18 shown in FIGS. 3 and 4 , respectively, by using a bonding technique such as diffusion bonding, braze bonding or laser bonding.
  • the groove 171 and the narrow grooves 172 in the micro-channel structure 12 which are formed on the bottom heat radiation plate 17 of the first cooling panel, are covered by the top heat radiation plate 18 of the first cooling panel, thereby forming the passage 11 and the micro-channel structure 12 .
  • the formation of the groove 171 and the narrow grooves 172 of the micro-channel structure on the bottom heat radiation plate 17 of the first cooling panel may be performed by pressing to form these grooves, by molding in the state of having the grooves, or by grinding.
  • the opening B and opening C are coupled to metallic tube 14 and metallic tube 15 , respectively.
  • Flexible metallic tubes are used for the metallic tubes 14 , 15 , to thereby incur no obstacle against the opening and closing movement of the first cooling panel 1 with respect to the second cooling panel 2 .
  • the heat generated by the heating parts 7 is transferred to the refrigerant flowing within the micro-channel structure 12 via the bottom heat radiation plate 17 of the first cooling panel.
  • the micro-channel structure 12 includes a plurality of narrow-width channels having a width of 1 mm or smaller, which is smaller than the width of the passage 11 formed in the first cooling panel 1 .
  • the micro-channel structure 12 is formed in the area in which the bottom heat radiation plate 17 of the first cooling panel contacts the heating parts 7 , and has a dimension larger than this area.
  • the passage 11 formed in the first cooling panel 1 was 6 mm wide and 1.5 mm deep, and 38 channels having a width of 0.5 mm and a depth of 1.5 mm were formed in the micro-channel structure 12 .
  • the inlet through which the refrigerant flows into the micro-channel structure 12 is such that the width of the passage 11 is gradually widened toward the micro-channel structure 12 to be equal to the width of the micro-channel structure 12 at the end thereof, as shown in FIG. 5 .
  • the inlet of the micro-channel structure is provided with guide plates 16 for diffusing the refrigerant flowing from the passage 11 to flow in the width of the micro-channel structure 12 .
  • the guide plates 16 includes first guides plates 161 , second guide plates 162 and third guide plates 163 , which are arranged consecutively from the upstream of the refrigerant and each forms a pair located on left and right sides.
  • the relationship between the lengths of the guide plates is such that a guide plate located at the upstream side is longer than another, i.e., the first guide plates 161 are longer than the second guide plates 162 , which are longer than the third guide plates 163 .
  • the relationship between angles ⁇ of guide plates, shown in FIG. 5 , with respect to the flow direction of the refrigerant is such that the angle of a guide plate located at the upstream side is larger than the angle of another, i.e., angle of the first guide plates 161 is larger than the angle of the second guide plates 162 , which is larger than the angle of the third guide plates 163 .
  • a metallic material such as copper (Cu) and aluminum (Al), having a superior heat conductivity is used for the second cooling panel 2 , which is provided with a passage 21 therein, and provided with a circulation pump 3 and a reservoir 4 attached on the top surface thereof, as shown in FIG. 6 .
  • the second cooling panel 2 is such that a bottom heat radiation plate 23 and a top heat radiation plate 24 shown in FIGS. 7 and 8 , respectively, are bonded together by using a bonding technique such as diffusion bonding, braze bonding or laser bonding.
  • a groove 231 formed on the bottom heat radiation plate 23 of the second cooling panel is covered by the top heat radiation plate 24 , to thereby form the passage 21 .
  • the formation of the groove 231 on the bottom heat radiation plate 23 of the second cooling panel 2 may be performed by pressing to form the groove 231 , by molding in the state of having the groove 231 , or by grinding to form the groove 231 .
  • the groove may be formed on the top heat radiation plate 24 , or may be formed on both the top heat radiation plate 23 and bottom heat radiation plate 24 .
  • the central portion of the passage 21 of the second cooling panel 2 i.e., the central portion of the groove 231 formed on the bottom heat radiation plate 23 of the second cooling panel is provided with a plurality of struts 22 arranged at a constant pitch.
  • the struts 22 assure the strength during bonding together the bottom heat radiation plate 23 and top heat radiation plate of the second cooling panel 2 .
  • the relationship between the width and depth of the passage 21 and the cooling performance is such that a larger width or a smaller depth of the passage improves the cooling performance as shown in FIG. 9 . However, a smaller width of the passage or a smaller plate thickness reduces the withstand-pressure performance, as shown in FIG. 10 .
  • the passage 21 is required to have a larger width and a smaller depth in the view point of the cooling performance, which reduces the withstand-pressure performance however.
  • the object of the struts 22 is to improve the withstand-pressure performance.
  • the struts 22 are formed at the central portion of the passage 21 in the first embodiment, the location of the struts 22 is not limited to the central portion, and the struts may be arranged in a lattice or zigzag fashion, for example.
  • the passage 21 formed in the second cooling panel 2 was 20 mm wide and 0.8 mm deep, and the struts 22 having a width of 0.5 mm and a length of 2 mm were formed at a 20 mm pitch in the central portion of the passage 21 .
  • the top heat radiation plate 24 of the second cooling panel is provided with an opening (branch hole) 25 communicated with the reservoir 4 , a refrigerant outlet port 26 through which the refrigerant flows out of the passage 21 toward the circulation pump 3 , a refrigerant inlet port 27 through which the refrigerant flows in from the circulation pump 3 toward the passage 21 , an opening A configuring an outlet port through which the refrigerant flows out of the passage 21 , and an opening D configuring an inlet port through which the refrigerant flows into the passage 21 .
  • the opening A and opening D are coupled to metallic tube 14 and metallic tube 15 , respectively.
  • a micro-channel structure may be formed in the second cooling panel 2 .
  • the refrigerant discharged from the circular pump 3 provided on the top surface of the second cooling panel 2 passes through the refrigerant inlet port 27 to the passage 21 formed in the second cooling panel 2 , and flows into the first cooling panel 1 via the opening A, metallic tube 14 and opening B.
  • the refrigerant flowing into the first cooling panel 1 passes through the passage 11 formed in the first cooling panel 1 to flow into the micro-channel structure 12 .
  • the refrigerant flowing into the micro-channel structure 12 absorbs the heat generated by the heating parts 7 , passes through the wobbled passage 111 formed in the area in which the air-cooled fins 13 are provided, to flow into the second cooling panel 2 via the opening C, metallic tube 15 and opening D.
  • the refrigerant flowing into the second cooling panel 2 passes through the passage 21 formed in the second cooling panel 2 , reaches the refrigerant outlet port 26 after passing underneath the opening 25 communicated with the reservoir 4 , and again flows into the circulation pump 3 .
  • the heat generated by the heating parts 7 is diffused by heat conduction over the entirety of the first cooling panel 1 and second cooling panel 2 , thereby improving the heat radiation effect.
  • FIG. 11 illustrates the first configuration example of the circulation pump shown in FIG. 1 , wherein (a) is an exploded perspective view, and (b) is a side view in section thereof.
  • FIG. 12 is a side view in section showing the mounting process for the circulation pump illustrated in FIG. 11 .
  • the first configuration example of the circular pump 3 includes a pump housing 311 , an O-ring 312 made of rubber resin, a piezoelectric vibration plate 313 , a top plate 314 for pressing the piezoelectric vibration plate 313 .
  • the pump housing 311 is provided with a suction port 315 and a discharge port 316 which oppose the refrigerant outlet port 26 and refrigerant inlet port 27 , respectively, formed on the top heat radiation plate 24 of the second cooling panel, and defines therein a space configuring a pump chamber 319 .
  • the suction port 315 is provided with an inlet check valve 317 which prevents a back-flow from the pump chamber 319 to the passage 21
  • the discharge port 316 is provided with an outlet check valve 318 which prevents a back-flow from the passage 21 to the pump chamber 319 .
  • the inlet check valve 317 and outlet check valve 318 are configured each by a thin metallic reed valve, and coupled to the bottom surface of the pump housing 311 by using spot welding or screws.
  • the piezoelectric vibration plate 313 is a piezoelectric-bended vibration plate used as a driving source of the circulation pump 3 , is configured by bonding together a piezoelectric element and an elastic plate, and is subjected to liquid-tight molding so that the piezoelectric element does not directly contact the refrigerant liquid.
  • Piezoelectric ceramic or piezoelectric single crystal may be used for the piezoelectric element.
  • a thin metallic plate such as made of copper alloy e.g., bronze phosphate or stainless alloy, or a thin carbon fiber plate or resin plate such as PET plate may be used as the elastic plate.
  • the detailed structure of the piezoelectric vibration plate 313 may be a uni-morph, bimorph etc., or otherwise a layered structure including layered piezoelectric elements.
  • the mounting process for the circulation pump shown in FIG. 11 includes the first step of bonding the pump housing 311 onto the top heat radiation plate 24 of the second cooling panel to form an integral body for fixing together, by using a bonding technique such as diffusion bonding, braze bonding or laser bonding.
  • a bonding technique such as diffusion bonding, braze bonding or laser bonding.
  • the suction port 315 , discharge port 316 , space for the pump chamber 319 , inlet check valve 317 and outlet check valve 318 are formed and bonded in/to the pump housing 311 .
  • the O-ring 312 is inserted, and the piezoelectric vibration plate 313 is mounted thereon, to thereby configure the pump chamber 319 .
  • the O-ring 312 is firmly compressed and closely contacted by using the top plate 314 for assuring the liquid-tight and for allowing the piezoelectric vibration plate 313 to be fixed at the periphery thereof.
  • the top plate 314 may be fixed with screws from the top or may be fastened after providing the periphery of the top plate 314 with screws.
  • the circulation pump 3 and the second cooling panel 2 are coupled together using a metallic bonding technique to form a perfect integral body, thereby preventing the pressure loss, leakage of liquid etc.
  • the structure of the integral body of the circulation pump 3 and second cooling panel 2 allows smaller thickness and lower cost thereof. Use of this structure for the circulation pump 3 achieves a smaller-thickness cooling device having a height as small as 7 mm or smaller at the maximum portion at which the circulation pump 3 is arranged.
  • FIG. 13 shows the second configuration example of the circulation pump shown in FIG. 1 , wherein (a) is an exploded perspective view, and (b) is a side view in section thereof.
  • FIGS. 14 and 15 are side view in section showing the mounting process for the circulation pump illustrated in FIG. 13 .
  • the second configuration example of the circulation pump 3 is comprised of a pump housing 231 , a check-valve-formed circular plate 322 , an O-ring made 312 of rubber resin, a piezoelectric vibration plate 313 , and a top plate 314 for pressing the piezoelectric vibration plate 313 .
  • the check-valve-formed circular plate 322 is provided with a suction port 315 and a discharge port 316 formed so as to oppose the refrigerant outlet port 26 and refrigerant inlet port 27 , respectively, formed in the top heat radiation plate 24 of the second cooling panel.
  • the suction port 315 is provided with an inlet check valve 317 for preventing the back-flow from the pump chamber 319 to the passage 21
  • the discharge port 316 is provided with an inlet check valve 318 for preventing the back-flow from the passage 21 to the pump chamber 319 .
  • the inlet check valve 317 and outlet check valve 318 are configured each by a thin metallic reed valve, and coupled to the check-valve-formed circular plate 322 by using spot welding or screws.
  • the mounting process for the circular pump 3 shown in FIG. 13 includes the first step of bonding the pump housing 321 onto the top heat radiation plate 24 of the second cooling panel by using a bonding technique, such as diffusion bonding, braze boding or laser welding, to form an integral body.
  • a bonding technique such as diffusion bonding, braze boding or laser welding, to form an integral body.
  • a portion to be configured as the pump chamber 319 may be formed prior to or subsequent to this step.
  • the O-ring 312 is inserted, and the piezoelectric vibration plate 313 is mounted thereon, as shown in FIG. 15 ( b ), thereby configuring the pump chamber 319 .
  • the O-ring 312 is firmly compressed and closely contacted by using the top plate 314 for assuring the liquid-tight and for allowing the piezoelectric vibration plate 313 to be fixed at the periphery thereof.
  • the top plate 314 may be fixed with screws from the top, or may be fastened after providing the periphery of the top plate with screws.
  • the suction port 315 , discharge port 316 , inlet check valve 317 and outlet check valve 318 are formed in and bonded onto the check-valve-formed circular plate 322 in advance, whereby the check-valve-formed circular plate 322 can be replaced as a whole.
  • the pump performance is degraded due to the clogging of the suction port 315 or discharge port 316 or due to plastic deformation of the inlet check valve 317 or outlet check valve 318 after a long-term service, it is sufficient that the check-valve-formed circular plate 322 be replaced to recover the pump performance, thereby allowing an easy maintenance.
  • FIG. 16 illustrates the third configuration example of the circular pump 3 shown in FIG. 1 , wherein (a) is an exploded perspective view and (b) is a side view in section thereof.
  • FIG. 17 is a side view in section showing a mounting process for the circulation pump illustrated in FIG. 16 .
  • the third configuration example of the circulation pump 3 is comprised of a pump housing 331 , a check-valve-formed circular plate 322 , an O-ring 312 made of rubber resin, a piezoelectric vibration plate 313 and a top plate 314 for pressing the piezoelectric vibration plate 313 .
  • the bottom surface of the pump housing 331 is provided with a pump-bottom-surface inlet port 333 and a pump-bottom-surface outlet port 334 , which are formed so as to oppose the refrigerant outlet port 26 and refrigerant inlet port 27 , respectively, formed in the top heat radiation plate 24 of the second cooling panel.
  • the pump-bottom-surface inlet port 333 and pump-bottom-surface outlet port 334 are coupled to the suction port 315 and discharge port 316 , respectively, of the check-valve-formed circular plate 322 .
  • the suction port 315 is provided with an inlet check valve 317 for preventing the back-flow from the pump chamber 319 to the passage 21
  • the discharge port 316 is provided with an outlet check valve 318 for preventing the back-flow from the passage 21 to the pump chamber 319 .
  • the inlet check valve 317 and outlet check valve 318 are configured each by a thin metallic reed valve, and coupled to the check-valve-formed circular plate 322 by using spot welding or screws.
  • the mounting process for the circulation pump 3 shown in FIG. 16 includes the first step of bonding together the second-cooling-panel top heat radiation plate 24 and the second-cooling-panel bottom heat radiation plate by using a metallic bonding technique, such as diffusion bonding, braze bonding or laser bonding, to thereby form an integral body.
  • a metallic bonding technique such as diffusion bonding, braze bonding or laser bonding
  • the check-valve-formed circular plate 322 in/to which the suction port 315 , discharge port 316 , inlet check valve 317 and outlet check valve 318 are formed and bonded is inserted within the pump housing 331 .
  • the O-ring 312 is inserted, the piezoelectric vibration plate 313 is mounted thereon, and the O-ring 312 is firmly compressed and closely contacted by using the top plate 314 for assuring the liquid-tight and for fixing the piezoelectric vibration plate 313 at the periphery thereof, thereby installing the circulation pump 3 in advance.
  • the top plate 314 may be fixed with screws from the top, or may be fastened after providing the periphery of the top plate with screws.
  • O-rings 332 are inserted in O-ring grooves 335 formed on the bottom surface of the pump so as to isolate the pump-bottom-surface inlet port 333 from the pump-bottom-surface outlet port 334 , followed by fastening together the circulation pump 3 and the second cooling panel 2 with screws to finish the mounting.
  • the third configuration example of the circulation pump 3 an easy maintenance such as by replacement of the circulation pump 3 for dealing with degradation in the performance of the circular pump 3 can be obtained, while achieving a lower cost.
  • the bonding of the circular pump 3 and the second cooling panel 2 assures the liquid-tight to a sufficient extent, although not so high extent as achieved by the metallic bonding used in the first and second configuration examples.
  • FIG. 18 is a perspective view showing the configuration of the reservoir shown in FIG. 1
  • FIG. 19 is a sectional view taken along line Z-Z′ in FIG. 18
  • FIG. 20 is an explanatory view for describing the air storage function of the reservoir shown in FIG. 18 .
  • the reservoir 4 is a laid-down-type reservoir of a hollow disk, as shown in FIG. 6 , and fixed onto the top heat radiation plate 24 to overlie the passage 21 at the upstream side of the circulation pump 3 (upstream of the inlet of the refrigerant into the circulation pump 3 ).
  • the reservoir is arranged so that the branch hole 43 provided in the bottom surface of the reservoir 4 is aligned with the opening 25 formed in the top heat radiation plate 24 of the second cooling panel.
  • the branch hole 43 communicated with the reservoir 4 has a smaller cross-sectional area compared to the passage 21 to thereby increase the acoustic impedance and thus minimizes the inlet flow rate of the refrigerant into the reservoir 4 without impeding the flow of the refrigerant through the passage 21 .
  • a protrusion 42 is formed on the cap of the reservoir 4 at a position overlying the exit of the branch hole 43 so as not to allow the air to stop at the vicinity of the exit of the branch hole 43 .
  • the protrusion 42 diffuses the air 45 exiting through the exit of the branch hole 43 toward the periphery thereof.
  • the protrusion 42 if formed as a conical shape, can effectively prevent the detention of air.
  • the air 45 trapped in the reservoir 4 acts for alleviating the pressure change in the passage 21 caused by expansion and compression of the liquid due to a temperature change, thereby contributing an improvement in the decay endurance of the cooling device.
  • the air 45 trapped enters the passage 21 to flow into the circulation pump, there arises a possibility that the discharge pressure of the circulation pump 3 is reduced to degrade the performance of the circulation pump 3 , whereby the flow rate of the refrigerant is considerably reduced.
  • the bottom surface of the reservoir 4 is provided with a taper portion 41 of a truncated conical shape having an apex at the exit of the branch hole 43 , as shown in FIGS. 18 and 19 .
  • the taper portion 41 allows the air 45 trapped in the reservoir 4 to stay therein as much as possible, even if the cooling device is turned upside down. For the air trapped in the reservoir 4 not to return to the passage, it is necessary that the exit of the branch hole 43 be immersed in the refrigerant at any time.
  • the boundary surface A-A′ at which the exit of the branch hole 43 is located is configured so that the volume of the reservoir 4 below the boundary surface A-A′ is smaller than the volume of the reservoir above the boundary surface A-A′, whereby the reservoir 4 is filled with the refrigerant 44 so that the liquid level of the refrigerant 44 is located in the reservoir 4 above the boundary surface A-A′, as shown in FIG. 19 ( b ).
  • the normal state in which the cooling device of the first embodiment is used is such that shown in FIG. 20 ( a ), wherein the air 45 stays in the upward position because the air 45 has a lower specific density than the refrigerant 44 .
  • the refrigerant 44 is filled in the reservoir 4 so that the exit of the branch hole 43 (the apex of the taper of the taper portion 41 ) is located within the liquid.
  • the volume of the reservoir 4 is designed to have a sufficient volume for endurance in consideration of the amount of heat expansion of the refrigerant 44 as well as the heat expansion and withstand pressure of the reservoir 4 .
  • the reservoir 4 assumes the posture shown in FIG. 20 ( b ), wherein the air 45 in the reservoir 4 stays to be deviated in a specific direction. In this state either, the exit of the branch hole 43 does not stay away from the liquid, whereby the air 45 in the reservoir 4 does not enter the branch hole 43 .
  • the reservoir 4 assumes the posture shown in FIG. 20 ( c ).
  • the refrigerant 44 is filled at above the boundary surface A-A′, due to the configuration wherein the bottom surface of the reservoir 4 is provided with the taper portion 41 and thus the volume of the reservoir 4 below the boundary surface A-A′ shown in FIG. 20 is larger than that above the boundary surface.
  • the exit of the branch hole 43 is immersed in the refrigerant 44 at any time so that the air 45 remains to stay in the reservoir 4 and does not enter the branch hole 43 .
  • the reservoir 4 shifts from the posture shown in FIG. 20 ( c ) to the posture shown in FIG. 20 ( d ), whereby the air 45 in the reservoir 4 rises on the taper surface of the taper portion 41 . After the air 45 reaches the vicinity of the exit of the branch hole 43 , it stays in the opposite location. In this state, the cross-sectional area of the branch hole 43 is extremely small so that the air 45 passes over the branch hole 43 to thereby stay in the opposite location.
  • a prototype cooling device including a branch hole having a 2-mm diameter and a reservoir 4 having a 50-mm diameter and a 7-mm height (taper portion 41 having a 4-mm vertical interval) was manufactured.
  • This cooling device was coupled to a commercially available high-pressure pump for conducting a withstand-pressure test, wherein a pressure having an amplitude of 0 to 1 MPa and a frequency of 10 Hz was applied in an assumption of a steep temperature change being applied to the electronic equipment.
  • the reservoir 4 in the first embodiment has an advantage in that the reservoir can be arranged two-dimensionally for a portion or the entirety of the passage 21 extending in a two-dimensional plane, whereby a small thickness can be achieved. It is to be noted that this type of the reservoir 4 can be provided in a plurality thereof for achieving a larger advantage over a single one. If the reservoir 4 is detachably provided, there is a larger advantage in that the refrigerant is replenished if the amount of refrigerant should be reduced in the cooling device.
  • FIG. 21 illustrates a first example of assembly into the electronic equipment, wherein (a) is a perspective view thereof and (b) is a sectional view taken along line Z-Z′ shown in (a).
  • FIG. 22 illustrates a second example of assembly into the electronic equipment, wherein (a) is a perspective view thereof and (b) is a sectional view taken along line Z-Z′ shown in (a).
  • FIG. 23 illustrates a third example of assembly into the electronic equipment, wherein (a) is a perspective view thereof and (b) is a sectional view taken along line Z-Z′ shown in (a).
  • FIG. 24 illustrates an example of the test for assuring the cooling effect during the change in the amount of air flow on the bottom surface of the second cooling panel shown in FIG. 1 .
  • FIG. 25 shows the relationship between the change in the amount of air flow on the bottom surface of the second cooling panel shown in FIG. 1 and the cooling effect.
  • the housing 80 of a notebook personal computer having a typical thickness of around 3-4 cm is provided therein with main electric components having relatively large sizes and different thicknesses, such as DVD-RAM 81 , FD-RAM 82 , HDD 83 , battery 84 and memory card 85 , and a mother board 86 on which a heating part 7 such as CPU is provided.
  • the second cooling panel 2 is mounted to underlie the mother board 86 .
  • the micro-channel structure 12 is formed in the second cooling panel 2 , and the heating part 7 mounted on the top surface of the mother board 86 is in contact with the top surface of the second cooling panel 2 in the area in which the micro-channel structure 12 is formed.
  • the second assembly example has a higher cooling efficiency over the first assembly example.
  • the first cooling panel 1 is mounted overlying the mother board 86 on which the heating part 7 such as CPU is mounted, and the second cooling panel 2 is mounted underlying the mother board 86 .
  • the heating part 7 mounted on the top surface of the mother board 86 is in contact with the bottom surface of the first cooling panel 1 in the area in which the micro-channel structure 12 is formed.
  • the first cooling panel 1 can be opened and closed, as described before. In the second assembly example, the opening movement of the first cooling panel 1 allows an easy maintenance such as replacement of the heating part 7 mounted on the top surface of the mother board 86 .
  • the third assembly example has a higher cooling efficiency over the second assembly example.
  • the first cooling panel 1 is mounted overlying the mother board 86 on which the heating part 7 such as CPU is mounted, and the second cooling panel 2 is mounted underlying the mother board 86 .
  • the heating part 7 mounted on the top surface of the mother board 86 is in contact with the bottom surface of the first cooling panel 1 in the area in which the micro-channel structure 12 is formed.
  • the first cooling panel 1 is provided with an air-cooled fin 13 .
  • the heat resistance was also measured while changing the number of fans 51 to 55 , for another example wherein the air-cooled fin is formed on the bottom surface of the second cooling panel 2 .
  • the results are such that, as shown in FIG. 25 , there was substantially no difference in the cooling effect between the case where the air-cooled fin was formed on the bottom of the second cooling panel 2 and the other case where there was no air-cooled fin.
  • the first embodiment is configured such that the second cooling panel 2 , wherein the passage 21 is formed by covering the groove 213 formed on the bottom heat radiation plate 23 with the top radiation plate 24 , is mounted on the bottom of the electronic equipment.
  • the first embodiment employs the configuration wherein the struts for reinforcing the bonding between the bottom heat radiation plate 23 and the top heat radiation plate 24 are formed in the passage 21 of the second cooling panel 2 mounted on the bottom of the electronic equipment. This allows a larger width for the passage 21 of the second cooling panel 2 and a smaller thickness for the bottom heat radiation plate 23 and top heat radiation plate 24 , thereby assuring a sufficient heat radiation area to improve the cooling efficiency and allowing a smaller thickness for the cooling device.
  • the configuration wherein the circulation pump 3 is fixed onto the top surface of the second cooling panel 2 mounted on the bottom of the electronic equipment in the first embodiment provides an effective prevention of the leakage of the refrigerant.
  • the configuration wherein the branch hole is provided which branches upward from the passage 21 of the second cooling panel 2 mounted on the bottom of the electronic equipment in the first embodiment and wherein the reservoir 4 is provided overlying the branch hole, allows the air bubbles generated due to the temperature change within the electronic equipment or the pressure change in the passage to be trapped in the reservoir 4 . This allows prevention of reduction in the amount of outlet flow from the circulation pump 3 caused by mixing of air bubbles.
  • the configuration wherein the branch hole is provided which branches upward from the passage 21 of the second cooling panel 2 mounted on the bottom of the electronic equipment in the first embodiment and wherein the reservoir 4 is provided overlying the branch hole, allows the air 45 in the reservoir 4 to alleviate the pressure change in the passage caused by the temperature change within the electronic equipment. This allows prevention of damage due to the stress generating locally due to the pressure change in the passage.
  • the first embodiment is such that the metallic material having a superior heat conductivity is used for the bottom heat radiation plate 23 and top heat radiation plate 24 of the second cooling panel 2 configuring the passage 21 through which the refrigerant circulates and that the top heat radiation plate 24 and the circulation pump 3 are coupled together by a metallic bonding technique.
  • This provides an integral body for the circulation pump 3 and the passage 11 , and allows the entirety of the passage 11 to be covered with the metallic material, thereby achieving the advantage of occurring of no evaporation or leakage of the refrigerant.
  • the structure (third configuration example) wherein the circulation pump 3 is coupled to the top heat radiation plate 24 of the second cooling panel 2 via the O-ring 332 may incur the possibility of occurring of evaporation or leakage of the refrigerant through the coupling by the O-ring 332 because of the separate structure of the circulation pump 3 .
  • this case allows an easy maintenance.
  • the second cooling panel wherein the groove formed on the bottom heat radiation plate of the second cooling panel is covered with the top heat radiation plate of the second cooling panel, is mounted on the bottom of the electronic equipment.
  • struts for reinforcing the bonding between the bottom heat radiation plate and the top heat radiation plate are formed in the passage of the second cooling panel mounted on the bottom of the electronic equipment.
  • This configuration provides a larger width for the passage of the second cooling panel, and reduces the thickness of the bottom heat radiation plate and top heat radiation plate of the second cooling panel. This assures a sufficient heat radiation area to thereby improve the radiation efficiency, and reduces the thickness of the cooling device.
  • the configuration wherein the circulation pump is fixed onto the top surface of the second cooling panel mounted on the bottom of the electronic equipment, effectively prevents leakage of the refrigerant.
  • the branch hole is provided which branches upward from the passage of the second cooling panel mounted on the bottom of the electronic equipment, and the reservoir is located overlying the branch hole.
  • the branch hole is provided which branches upward from the passage of the second cooling panel mounted on the bottom of the electronic equipment, and the reservoir is located overlying the branch hole.
  • the metallic material having a superior heat conductivity is employed for the bottom heat radiation plate and top heat radiation plate of the second cooling panel configuring the passage through which the refrigerant circulates, and the top heat radiation plate of the second cooling panel and the circulation pump are coupled together by using a metallic bonding technique.
  • This provides an integral body for the circulation pump and the passage, and allows the entirety of the passage to be covered with the metallic material, thereby achieving the advantage of occurring of no evaporation or leakage of the refrigerant.
  • the structure wherein the circulation pump 3 is coupled to the top heat radiation plate of the second cooling panel via the O-ring may incur the possibility of occurring of evaporation or leakage of the refrigerant because of the separate structure of the circulation pump 3 .
  • the cooling panel (substrate) 20 has an integral body and includes therein a groove 231 configuring the passage 21 .
  • the passage 21 extending in a two-dimensional plane is provided with a laid-down-type reservoir 4 and the standing-rest-type reservoir 411 along the passage.
  • the present cooling device can be used in a standing posture, for example, with the top side shown in FIG. 26 being the upside in the vertical direction and the bottom side shown in FIG. 26 being the downside in the vertical direction.
  • the standing-rest-type reservoir 411 plays the roll for alleviating the pressure change in the passage against the expansion or compression caused by the temperature change of the refrigerant, and for trapping the air bubbles in the passage 11 .
  • the laid-down-type reservoir 4 plays the roll similar to that of the standing-rest-type reservoir 411 .
  • provision of both the reservoirs 4 and 411 allows the pressure change caused by expansion or compression due to the temperature change of the refrigerant in the passage to be alleviated in the case where the electronic equipment body such as a notebook PC is used on a desk or used while being hanged on the wall, contributing improvement in the withstand-pressure performance of the present cooling device by trapping the air bubbles in the passage 21 .
  • FIG. 27 shows enlarged standing-rest-type reservoir 411 shown in FIG. 1 , wherein the electronic equipment body such as notebook PC is used in a standing posture. In other words, this figure is depicted in the state wherein the user observes from the front thereof.
  • the air bubbles 413 generated as by the temperature change and included in the refrigerant 415 circulated by the circulation pump 3 within the passage 11 reach the vicinity of the standing-rest-type reservoir 411 , the air bubbles 413 are introduced into the standing-rest-type reservoir 411 along the wall surface of the taper portion 412 due to a lower specific density thereof compared to the liquid. After staying in the upper portion of the reservoir, the air bubbles 413 are eventually trapped in the air layer 414 .
  • the inlet portion of the standing-rest-type reservoir 411 is provided with a trapezoid taper 412 , wherein the inside of the standing-rest-type reservoir 411 is either wide in the lateral direction or longer in the vertical direction to have an internal volume at least comparable to or larger than that of the laid-down-type reservoir 4 .
  • the air bubbles 413 do not return from the standing-rest-type reservoir 411 to the liquid in the passage 11 so long as the configuration wherein the air bubbles 413 have the specific density lower than that of the liquid satisfies. This fact was assured by the present inventors using experiments. Moreover, according to an example of the present invention, it was confirmed that the configuration wherein the standing-rest-type reservoir 411 had a volume comparable to or larger than the volume of the laid-down-type reservoir 4 , or an optimization of the amount of the air layer 414 within the reservoir alleviated the pressure change in the passage caused by the expansion or compression of the refrigerant due to the temperature change thereof.
  • the reservoirs 411 shown in FIGS. 27 ( a ) to 27 ( c ) each play a roll for trapping the air bubbles 413 and alleviating the pressure.
  • the location for mounting the heating part, such as CPU, circulation pump 3 and laid-down-type reservoir 4 is changed, the optimum design for the passage 11 suffers from a variety of restrictions therefrom.
  • the shapes of the standing-rest-type reservoirs 411 shown in FIGS. 27 ( a ) to 27 ( c ) are selected depending on the layout of the large electronic parts in the electronic equipment including heating part on the mother board, such as CPU, or HDD and DVD, thereby effectively achieving the improvement in the cooling performance and smaller thickness.
  • the standing-rest-type reservoir 411 shown in FIG. 27 ( a ) is a laterally elongate type, wherein it is wide in the lateral direction and short in the longitudinal direction, whereby it allows a smallest spacing between the passage 11 and another passage adjacent thereto in the vertical direction, while assuring the function of the reservoir.
  • the standing-rest-type reservoir 411 shown in FIG. 27 ( b ) is a longitudinally elongate type, whereby it allows a smallest spacing between horizontally adjacent passages 11 .
  • a portion of the standing-rest-type reservoir 411 is coupled to the passage 11 .
  • This allows the reservoir to trap the air bubbles in a larger amount compared to the reservoirs shown in FIGS. 27 ( a ) and ( b ), if the flow rate of the refrigerant flowing through the passage 11 increases.
  • the reservoir is not filled with liquid in its full space, thereby allowing a specific amount of air layer 414 to be assured and secure trapping of the air bubbles 413 .
  • the air bubbles 413 occurring in the passage can be effectively trapped.
  • the standing-rest-type reservoir 411 having an air storage function can be extended two-dimensionally for the liquid circulation path in the present cooling device, and can be embedded together with the passage between the top heat radiation panel and the bottom heat radiation panel of the first cooling panel made of a metallic material such as aluminum and copper having a superior heat conductivity. This reduces the total thickness of the plate of the cooling member down to 2 mm or smaller. It is apparent that a plurality of the same type or different types of the standing-rest-type reservoir 411 and laid-down-type reservoir 4 can be provided instead of a single one, to achieve a superior advantage.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US10/562,362 2003-06-27 2004-06-25 Cooler for electronic equipment Abandoned US20070006996A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003-184369 2003-06-27
JP2003184369 2003-06-27
PCT/JP2004/008980 WO2005001674A1 (ja) 2003-06-27 2004-06-25 電子機器の冷却装置

Publications (1)

Publication Number Publication Date
US20070006996A1 true US20070006996A1 (en) 2007-01-11

Family

ID=33549610

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/562,362 Abandoned US20070006996A1 (en) 2003-06-27 2004-06-25 Cooler for electronic equipment

Country Status (5)

Country Link
US (1) US20070006996A1 (ja)
JP (1) JPWO2005001674A1 (ja)
CN (1) CN100418037C (ja)
TW (1) TWI239229B (ja)
WO (1) WO2005001674A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090114372A1 (en) * 2005-09-13 2009-05-07 Mitsubishi Electric Corporation Heat sink
US20100246129A1 (en) * 2009-03-30 2010-09-30 Takeshi Hongo Electronic Apparatus
US20120287655A1 (en) * 2011-05-11 2012-11-15 Mou Hao Jan Heat dissipation device
US20130071699A1 (en) * 2011-09-19 2013-03-21 GM Global Technology Operations LLC Interconnection-less liquid fin design for battery cooling module
US20140092554A1 (en) * 2012-09-28 2014-04-03 Fujitsu Limited Electronic device
US20140272496A1 (en) * 2013-03-12 2014-09-18 GM Global Technology Operations LLC Micro-Channel Cooling Fin Design Based on an Equivalent Temperature Gradient
US20170052574A1 (en) * 2014-10-28 2017-02-23 Nec Platforms, Ltd. Heat dissipation structure for external apparatus, electronic apparatus, and external apparatus
CN112135498A (zh) * 2020-10-12 2020-12-25 上海海事大学 一种变孔隙多孔肋片双层锥形微通道散热器
CN114501917A (zh) * 2020-10-25 2022-05-13 北京航空航天大学 一种具有风冷辅助散热功能的微小通道散热器

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103633A (ja) * 2005-10-04 2007-04-19 Matsushita Electric Ind Co Ltd 冷却装置及びそれを備えた電子機器
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US8081460B2 (en) * 2006-01-24 2011-12-20 Nec Corporation Liquid-cooled heat radiator
CN101375651B (zh) * 2006-01-30 2011-05-25 日本电气株式会社 电子设备的冷却装置
JP5412815B2 (ja) * 2008-12-04 2014-02-12 富士通株式会社 冷却ジャケット、冷却ユニット、冷却システム及び電子機器
CN102338361A (zh) * 2010-07-27 2012-02-01 夏志清 一种led照明灯散热片
JP6127416B2 (ja) * 2012-09-07 2017-05-17 富士通株式会社 電子機器
CN112394778B (zh) * 2020-11-17 2024-02-23 杭州频卓电子工程有限公司 一种电脑机箱
CN115087300A (zh) * 2021-03-12 2022-09-20 华为技术有限公司 一种集气装置

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4420739A (en) * 1980-09-15 1983-12-13 Peter Herren Liquid-cooled electrical assembly
US4674565A (en) * 1985-07-03 1987-06-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe wick
US4712158A (en) * 1985-03-28 1987-12-08 Fujitsu Limited Cooling system for electronic circuit components
US5611214A (en) * 1994-07-29 1997-03-18 Battelle Memorial Institute Microcomponent sheet architecture
US5653111A (en) * 1993-07-07 1997-08-05 Hydrocool Pty. Ltd. Thermoelectric refrigeration with liquid heat exchange
US6016251A (en) * 1997-11-27 2000-01-18 Ando Electric Co., Ltd. Printed circuit board and cooling system therefor
US20010023762A1 (en) * 2000-01-11 2001-09-27 Sagal E. Mikhail Heat pipe spreader construction
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US20030090873A1 (en) * 2000-04-19 2003-05-15 Denso Corporation Coolant cooled type semiconductor device
US6619044B2 (en) * 1999-10-07 2003-09-16 Hydrocool Pyt, Limited Heat exchanger for an electronic heat pump
US20030189815A1 (en) * 2002-04-06 2003-10-09 Lee Sang Cheol Chipset cooling device of video graphic adapter card
US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders
US7483261B2 (en) * 2003-06-27 2009-01-27 Nec Corporation Cooling device for an electronic equipment

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3601282B2 (ja) * 1998-01-20 2004-12-15 株式会社日立製作所 ノート形コンピュータ
JPH11325764A (ja) * 1998-05-08 1999-11-26 Fujikura Ltd 電子素子の冷却装置
KR100319198B1 (ko) * 1999-11-17 2001-12-29 윤종용 반도체 모듈에 히트 싱크를 조립하는 설비 및 그 조립 방법
JP2002009477A (ja) * 2000-06-19 2002-01-11 Aisin Aw Co Ltd 電動機制御用パワーモジュール冷却装置
CN2453646Y (zh) * 2000-11-15 2001-10-10 唐徵 一种导管式风冷散热装置
JP3594900B2 (ja) * 2000-12-19 2004-12-02 株式会社日立製作所 ディスプレイ装置一体型コンピュータ
JP2002182791A (ja) * 2000-12-19 2002-06-26 Sharp Corp 情報機器
JP2002314279A (ja) * 2001-04-19 2002-10-25 Matsushita Electric Ind Co Ltd 冷却装置
JP3698087B2 (ja) * 2001-10-16 2005-09-21 株式会社日立製作所 電子装置
JP3598416B2 (ja) * 2001-12-03 2004-12-08 株式会社日立製作所 電子機器用の熱輸送デバイス
JP3452060B1 (ja) * 2002-05-15 2003-09-29 松下電器産業株式会社 電子機器の冷却装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4420739A (en) * 1980-09-15 1983-12-13 Peter Herren Liquid-cooled electrical assembly
US4712158A (en) * 1985-03-28 1987-12-08 Fujitsu Limited Cooling system for electronic circuit components
US4674565A (en) * 1985-07-03 1987-06-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe wick
US5653111A (en) * 1993-07-07 1997-08-05 Hydrocool Pty. Ltd. Thermoelectric refrigeration with liquid heat exchange
US5611214A (en) * 1994-07-29 1997-03-18 Battelle Memorial Institute Microcomponent sheet architecture
US6016251A (en) * 1997-11-27 2000-01-18 Ando Electric Co., Ltd. Printed circuit board and cooling system therefor
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6619044B2 (en) * 1999-10-07 2003-09-16 Hydrocool Pyt, Limited Heat exchanger for an electronic heat pump
US20010023762A1 (en) * 2000-01-11 2001-09-27 Sagal E. Mikhail Heat pipe spreader construction
US20030090873A1 (en) * 2000-04-19 2003-05-15 Denso Corporation Coolant cooled type semiconductor device
US20030189815A1 (en) * 2002-04-06 2003-10-09 Lee Sang Cheol Chipset cooling device of video graphic adapter card
US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders
US7483261B2 (en) * 2003-06-27 2009-01-27 Nec Corporation Cooling device for an electronic equipment

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090114372A1 (en) * 2005-09-13 2009-05-07 Mitsubishi Electric Corporation Heat sink
US20100246129A1 (en) * 2009-03-30 2010-09-30 Takeshi Hongo Electronic Apparatus
US7961467B2 (en) * 2009-03-30 2011-06-14 Kabushiki Kaisha Toshiba Electronic apparatus
US20120287655A1 (en) * 2011-05-11 2012-11-15 Mou Hao Jan Heat dissipation device
US8902591B2 (en) * 2011-05-11 2014-12-02 Microjet Technology Co., Ltd. Heat dissipation device
US20130071699A1 (en) * 2011-09-19 2013-03-21 GM Global Technology Operations LLC Interconnection-less liquid fin design for battery cooling module
US8927129B2 (en) * 2011-09-19 2015-01-06 GM Global Technology Operations LLC Interconnection-less liquid fin design for battery cooling module
US9414517B2 (en) * 2012-09-28 2016-08-09 Fujitsu Limited Electronic device
US20140092554A1 (en) * 2012-09-28 2014-04-03 Fujitsu Limited Electronic device
US20140272496A1 (en) * 2013-03-12 2014-09-18 GM Global Technology Operations LLC Micro-Channel Cooling Fin Design Based on an Equivalent Temperature Gradient
US9196935B2 (en) * 2013-03-12 2015-11-24 Gm Global Technology Operations, Llc Micro-channel cooling fin design based on an equivalent temperature gradient
US20170052574A1 (en) * 2014-10-28 2017-02-23 Nec Platforms, Ltd. Heat dissipation structure for external apparatus, electronic apparatus, and external apparatus
US9952637B2 (en) * 2014-10-28 2018-04-24 Nec Platforms, Ltd. Heat dissipation structure for external apparatus, electronic apparatus, and external apparatus
CN112135498A (zh) * 2020-10-12 2020-12-25 上海海事大学 一种变孔隙多孔肋片双层锥形微通道散热器
CN114501917A (zh) * 2020-10-25 2022-05-13 北京航空航天大学 一种具有风冷辅助散热功能的微小通道散热器

Also Published As

Publication number Publication date
WO2005001674A1 (ja) 2005-01-06
CN100418037C (zh) 2008-09-10
JPWO2005001674A1 (ja) 2007-09-20
TWI239229B (en) 2005-09-01
CN1813230A (zh) 2006-08-02
TW200507736A (en) 2005-02-16

Similar Documents

Publication Publication Date Title
US7483261B2 (en) Cooling device for an electronic equipment
US20070006996A1 (en) Cooler for electronic equipment
US7694723B2 (en) Water block
US8210243B2 (en) Structure and apparatus for cooling integrated circuits using cooper microchannels
US7407000B2 (en) Liquid cooling device
JP5002522B2 (ja) 電子機器用冷却装置及びこれを備えた電子機器
US9807906B2 (en) Liquid-cooling device and system thereof
US6533028B2 (en) Heat sink, method of manufacturing the same, and cooling apparatus using the same
US20030214783A1 (en) Cooling apparatus for electronic equipment
JP5084516B2 (ja) 電子機器の冷却装置
US20070039716A1 (en) Heat dissipating unit
JP2008187754A (ja) 発熱体冷却構造及び駆動装置
US10921067B2 (en) Water-cooling radiator structure with internal partition member
JP4856960B2 (ja) 液冷式放熱装置
US20100065249A1 (en) Heat sink
US20020186538A1 (en) Cooling module and the system using the same
US11800679B2 (en) Integrated water cooling heat sink
JP2007266403A (ja) 電子機器用冷却装置
KR102012450B1 (ko) 공냉식 냉각을 이용한 열전냉각장치
CN115632037A (zh) 一种高密度asic芯片专用网格型液冷散热器
KR20200049154A (ko) 차량용 유체 가열장치
KR101669702B1 (ko) 내장형 컴퓨터 전자제어장치의 냉각 장치
KR200307398Y1 (ko) 컴퓨터 중앙처리장치의 방열장치
JP2008175448A (ja) 冷却装置
JP2005056951A (ja) 放熱装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: NEC CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MIKUBO, KAZUYUKI;KITAJO, SAKAE;OCHI, ATSUSHI;AND OTHERS;REEL/FRAME:017425/0158

Effective date: 20051215

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION