US20060104111A1 - Diode array architecture for addressing nanoscale resistive memory arrays - Google Patents
Diode array architecture for addressing nanoscale resistive memory arrays Download PDFInfo
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- US20060104111A1 US20060104111A1 US10/990,706 US99070604A US2006104111A1 US 20060104111 A1 US20060104111 A1 US 20060104111A1 US 99070604 A US99070604 A US 99070604A US 2006104111 A1 US2006104111 A1 US 2006104111A1
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- memory cell
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- resistive memory
- voltage
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- 238000003491 array Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 claims abstract description 125
- 230000015556 catabolic process Effects 0.000 description 16
- 238000010348 incorporation Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/003—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/56—Structure including two electrodes, a memory active layer and a so called passive or source or reservoir layer which is NOT an electrode, wherein the passive or source or reservoir layer is a source of ions which migrate afterwards in the memory active layer to be only trapped there, to form conductive filaments there or to react with the material of the memory active layer in redox way
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/74—Array wherein each memory cell has more than one access device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/76—Array using an access device for each cell which being not a transistor and not a diode
Definitions
- This invention relates generally to memory devices, and more particularly, to a memory array incorporating resistive memory cells.
- memory devices associated with computers and other electronic devices are employed to store and maintain information for the operation thereof.
- a memory device includes an array of memory cells, wherein each memory cell can be accessed for programming, erasing, and reading thereof.
- Each memory cell maintains information in an “off” state or an “on” state, also referred to as “0” and “1” respectively, which can be read during the reading step of that memory cell.
- FIG. 1 illustrates a type of memory cell known as a nanoscale resistive memory cell 30 , which includes advantageous characteristics for meeting these needs.
- the memory cell 30 includes, for example, a Cu electrode 32 , a superionic layer 34 such as Cu 2 S on the electrode 32 , an active layer 36 such as Cu 2 O or various polymers on the Cu 2 S layer 34 , and a Ti electrode 38 on the active layer 36 .
- a negative voltage is applied to the electrode 38 , while the electrode 32 is held at ground, so that an electrical potential V pg (the “programming” electrical potential) is applied across the memory cell 30 from a higher to a lower potential in the direction from electrode 32 to electrode 38 (see FIG. 2 , a plot of memory cell current vs. electrical potential applied across the memory cell 30 ).
- V pg the “programming” electrical potential
- This potential is sufficient to cause copper ions to be attracted from the superionic layer 34 toward the electrode 38 and into the active layer 36 , causing the active layer 36 (and the overall memory cell 30 ) to be in a low-resistance or conductive state (A).
- the copper ions drawn into the active layer 36 during the programming step remain therein, so that the active layer 36 (and memory cell 30 ) remain in a conductive or low-resistance state.
- a positive voltage is applied to the electrode 38 , while the electrode 32 is held at ground, so that an electrical potential V er (the “erase” electrical potential) is applied across the memory cell 30 from a higher to a lower electrical potential in the reverse direction.
- V er the “erase” electrical potential
- This potential causes current to flow through the memory cell in the reverse direction (C), and is sufficient to cause copper ions to be repelled from the active layer 36 toward the electrode 32 and into the superionic layer 34 , in turn causing the active layer 36 (and the overall memory cell 30 ) to be in a high-resistance or substantially non-conductive state. This state remains upon removal of such potential from the memory cell 30 .
- FIG. 2 also illustrates the read step of the memory cell 30 in its programmed (conductive) state and in its erased (nonconductive) state.
- An electrical potential V r (the “read” electrical potential) is applied across the memory cell 30 from a higher to a lower electrical potential in the same direction as the electrical potential V pg . This electrical potential is less than the electrical potential V pg applied across the memory cell 30 for programming (see above).
- V r the “read” electrical potential
- V pg the “read” electrical potential
- FIGS. 3, 4 and 5 illustrate a memory cell array 40 which incorporates memory cells 30 of the type described above.
- the memory cell array 40 includes a first plurality 42 of parallel conductors (bit lines) BL 0 , BL 1 , . . . BL n , and a second plurality 44 of parallel conductors (word lines) WL 0 , WL 1 , . . . WL n overlying and spaced from, orthogonal to, and crossing the first plurality of conductors 42 .
- a plurality of memory cells 30 of the type described above are included, each associated with a select diode 50 having a (forward) threshold V t and a (reverse) breakdown voltage V b , to form a memory cell-diode structure.
- Each memory cell 30 is connected in series with a select diode 50 between a conductor BL of the first plurality 42 thereof and a conductor WL of the second plurality 44 thereof at the intersection of those conductors, with the diode 50 oriented in a forward direction from the conductor BL of the first plurality 42 thereof to the conductor WL of the second plurality 44 thereof. For example, as shown in FIG.
- memory cell 30 00 and diode 50 00 in series connect conductor BL 0 of the first plurality of conductors 42 with conductor WL 0 of the second plurality of conductors 44 at the intersection of those conductors BL 0 , WL 0 , memory cell 30 10 and diode 50 10 in series connect conductor BL 1 of the first plurality of conductors 42 with conductor WL 0 of the second plurality of conductors 44 at the intersection of those conductors BL 1 , WL 0 , etc.
- each of the memory cell-diode structures (other than the selected memory cell 30 00 and diode 50 00 structure) connected to the conductor BL 0 and the conductor WL 0 .
- Each of the other memory cell-diode structures has applied thereacross, from higher to lower potential in the reverse direction of the diode 50 , an electrical potential which is equal to V pg +V t .
- This electrical potential is less than the breakdown voltage V b of the diode 50 , and thus no current flows through the associated memory cell.
- the incorporation of the diodes 50 allows one to properly select and program a memory cell, without disturbing any of the other memory cells in the array.
- a voltage of for example 0.5(V pg +V t ) is applied to each of the conductors WL 1 , . . . WL n , and each of the conductors BL 1 , . . . BL n .
- each of the memory cell-diode structures (other than the selected memory cell 30 00 and diode 50 00 structure) connected to the conductor BL 1 and WL 0 .
- Each of the other memory cell-diode structures has applied thereacross, from higher to lower potential in the reverse direction of the diode 50 , an electrical potential which is equal to V r +V t .
- This potential V r +V t is less than the breakdown voltage of the diode 50 , so that no current passes through the associated memory cell.
- FIG. 6 illustrates ideal (G) and actual (H) voltage-current characteristics for a diode of the type incorporated in the memory array of FIGS. 3-5 . It is to be noted that in order to achieve erasing of a selected memory cell, current must be conducted through the selected memory cell, and in order to achieve this conduction of current, the diode associated therewith must be in breakdown.
- such a diode would have a low threshold voltage (forward direction of the diode) on the order of 0.6 volts, and a low breakdown voltage (reverse direction of the diode) on the order of 2.0 volts, as these voltages would readily allow rapid and effective programming, reading, erasing of a selected cell with relatively low electrical potentials applied thereto, so that a low potential power supply can be used.
- the breakdown voltage is substantially greater than 2.0 volts (illustrated at in FIG. 6 ), i.e., for example, 4.5 volts or substantially more. This leads to problems in achieving breakdown of the diode, which is essential in erasing the associated memory cell as described above.
- the present memory structure comprises a first conductor, a second conductor, a resistive memory cell connected to the second conductor, a first diode connected to the resistive memory cell and the first conductor, and oriented in the forward direction from the resistive memory cell to the first conductor, and a second diode connected to the resistive memory cell and the first conductor, in parallel with the first diode, and oriented in the reverse direction from the resistive memory cell to the first conductor.
- FIG. 1 is a cross-sectional view of a typical resistive memory cell
- FIG. 2 is a plot of current vs. voltage in the programming, reading and erasing of the memory cell of FIG. 1 ;
- FIG. 3 is a schematic illustration of a memory array which includes memory cells in accordance with FIG. 1 , illustrating programming of a selected memory cell;
- FIG. 4 is a schematic illustration of a memory array which includes memory cells in accordance with FIG. 1 , illustrating erasing of a selected memory cell;
- FIG. 5 is a schematic illustration of a memory array which includes memory cells in accordance with FIG. 1 , illustrating reading of a selected memory cell;
- FIG. 6 is a plot of current vs. voltage illustrating diode characteristics
- FIG. 7 is a schematic illustration of the first embodiment of the invention.
- FIG. 8 is a plot of current vs. voltage for the invention of FIG. 7 and the invention of FIG. 10 ;
- FIG. 9 is a schematic illustration of a memory array incorporating the invention of FIG. 7 , illustrating programming of a selected memory cell
- FIG. 10 is a schematic illustration of a memory array incorporating the invention of FIG. 7 , illustrating erasing of a selected memory cell
- FIG. 11 is a schematic illustration of a memory array incorporating the invention of FIG. 7 , illustrating reading of a selected memory cell.
- FIG. 7 illustrates an embodiment of the present invention.
- a conductor BL is shown therein, and a conductor WL overlies, crosses and is spaced from the conductor BL.
- a structure 60 interconnects the conductor BL and the conductor WL at the intersection thereof.
- the structure 60 includes a resistive memory cell 130 , similar to the resistive memory cell 30 above, connected to the conductor WL, a first diode 132 connected to the resistive memory cell 130 and the conductor BL, and a second diode 134 also connected to the resistive memory cell 130 and the conductor BL, in parallel with the first diode 132 .
- the first diode 132 is oriented in the forward direction from the resistive memory cell 130 to the conductor BL
- the second diode 134 is oriented in the reverse direction from the resistive memory cell 130 to the conductor BL.
- the two diodes in parallel making up the parallel diode structure 62 connected between the resistive memory cell 130 and the conductor BL have the current-voltage characteristic shown in FIG. 8 .
- the diode 132 will begin to conduct at its threshold voltage of 0.6 volts, well below the breakdown voltage (4.5 volts) of the diode 134 .
- the diode 134 will begin to conduct at its threshold voltage of 2.0 volts, well below the breakdown voltage (4.5 volts) of the diode 132 .
- the parallel diode structure 62 including diodes 132 , 134 in parallel is substantially the equivalent of a single diode having the characteristics shown in FIG. 8 , close to the ideal diode ( FIG. 6 ) as discussed above.
- FIGS. 9, 10 and 11 illustrate a memory cell array 140 which incorporates memory cells 130 of the type described above.
- the memory cell array 140 includes a first plurality 142 of parallel conductors (bit lines) BL 0 , BL 1 , . . . BL n , and a second plurality 144 of parallel conductors (word lines) WL 0 , WL 1 , . . . WL n overlying and spaced from, orthogonal to, and crossing the first plurality of conductors 142 .
- a plurality of structures 60 as set forth above are included, each connecting a conductor BL with a conductor WL at the intersection thereof.
- Each structure includes a resistive memory cell 130 and a parallel diode structure 62 , connected and configured as described above.
- memory cell 130 00 and parallel diode structure 62 00 in series connect conductor BL 0 of the first plurality of conductors 142 with conductor WL 0 of the second plurality of conductors 144 at the intersection of those conductors BL 0 , WL 0
- memory cell 130 10 and parallel diode structure 62 10 in series connect conductor BL 1 of the first plurality of conductors 142 with conductor WL 0 of the second plurality of conductors 144 at the intersection of those conductors BL 1 , WL 0 , etc.
- This electrical potential is less than the threshold voltage V t2 (2 volts) of the diode 134 (and less than the breakdown voltage V b , 4.5 volts, of the diode 132 ), and thus no current flows through the associated memory cells 130 .
- V t2 2 volts
- V b breakdown voltage
- V b breakdown voltage
- This potential V r +V t1 1.1 volts is less than the threshold voltage Vt2 (2.0 volts) of the diode 134 (and is less than the breakdown voltage of the diode 132 , 4.5 volts), so that no current passes through the associated memory cell 130 .
- Vt2 2.0 volts
- Vt1 the threshold voltage of the diode 134
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Abstract
Description
- 1. Technical Field
- This invention relates generally to memory devices, and more particularly, to a memory array incorporating resistive memory cells.
- 2. Background Art
- Generally, memory devices associated with computers and other electronic devices are employed to store and maintain information for the operation thereof. Typically, such a memory device includes an array of memory cells, wherein each memory cell can be accessed for programming, erasing, and reading thereof. Each memory cell maintains information in an “off” state or an “on” state, also referred to as “0” and “1” respectively, which can be read during the reading step of that memory cell.
- As such electronic devices continue to be developed and improved, the amount of information required to be stored and maintained continues to increase.
FIG. 1 illustrates a type of memory cell known as a nanoscaleresistive memory cell 30, which includes advantageous characteristics for meeting these needs. Thememory cell 30 includes, for example, aCu electrode 32, asuperionic layer 34 such as Cu2S on theelectrode 32, anactive layer 36 such as Cu2O or various polymers on the Cu2S layer 34, and aTi electrode 38 on theactive layer 36. Initially, assuming that thememory cell 30 is unprogrammed, in order to program thememory cell 30, a negative voltage is applied to theelectrode 38, while theelectrode 32 is held at ground, so that an electrical potential Vpg (the “programming” electrical potential) is applied across thememory cell 30 from a higher to a lower potential in the direction fromelectrode 32 to electrode 38 (seeFIG. 2 , a plot of memory cell current vs. electrical potential applied across the memory cell 30). This potential is sufficient to cause copper ions to be attracted from thesuperionic layer 34 toward theelectrode 38 and into theactive layer 36, causing the active layer 36 (and the overall memory cell 30) to be in a low-resistance or conductive state (A). Upon removal of such potential (B), the copper ions drawn into theactive layer 36 during the programming step remain therein, so that the active layer 36 (and memory cell 30) remain in a conductive or low-resistance state. - In order to erase the memory cell (
FIG. 2 ), a positive voltage is applied to theelectrode 38, while theelectrode 32 is held at ground, so that an electrical potential Ver (the “erase” electrical potential) is applied across thememory cell 30 from a higher to a lower electrical potential in the reverse direction. This potential causes current to flow through the memory cell in the reverse direction (C), and is sufficient to cause copper ions to be repelled from theactive layer 36 toward theelectrode 32 and into thesuperionic layer 34, in turn causing the active layer 36 (and the overall memory cell 30) to be in a high-resistance or substantially non-conductive state. This state remains upon removal of such potential from thememory cell 30. -
FIG. 2 also illustrates the read step of thememory cell 30 in its programmed (conductive) state and in its erased (nonconductive) state. An electrical potential Vr (the “read” electrical potential) is applied across thememory cell 30 from a higher to a lower electrical potential in the same direction as the electrical potential Vpg. This electrical potential is less than the electrical potential Vpg applied across thememory cell 30 for programming (see above). In this situation, if thememory cell 30 is programmed, thememory cell 30 will readily conduct current (level L1), indicating that thememory cell 30 is in its programmed state. If thememory cell 30 is erased, thememory cell 30 will not conduct current (level L2), indicating that thememory cell 30 is in its erased state. -
FIGS. 3, 4 and 5 illustrate amemory cell array 40 which incorporatesmemory cells 30 of the type described above. As illustrated inFIG. 3 , thememory cell array 40 includes afirst plurality 42 of parallel conductors (bit lines) BL0, BL1, . . . BLn, and asecond plurality 44 of parallel conductors (word lines) WL0, WL1, . . . WLn overlying and spaced from, orthogonal to, and crossing the first plurality ofconductors 42. A plurality ofmemory cells 30 of the type described above are included, each associated with aselect diode 50 having a (forward) threshold Vt and a (reverse) breakdown voltage Vb, to form a memory cell-diode structure. Eachmemory cell 30 is connected in series with aselect diode 50 between a conductor BL of thefirst plurality 42 thereof and a conductor WL of thesecond plurality 44 thereof at the intersection of those conductors, with thediode 50 oriented in a forward direction from the conductor BL of thefirst plurality 42 thereof to the conductor WL of thesecond plurality 44 thereof. For example, as shown inFIG. 3 ,memory cell 30 00 anddiode 50 00 in series connect conductor BL0 of the first plurality ofconductors 42 with conductor WL0 of the second plurality ofconductors 44 at the intersection of those conductors BL0, WL0,memory cell 30 10 anddiode 50 10 in series connect conductor BL1 of the first plurality ofconductors 42 with conductor WL0 of the second plurality ofconductors 44 at the intersection of those conductors BL1, WL0, etc. - In order to program a selected memory cell (
FIG. 3 ), for example selectedmemory cell 30 00, the voltage applied to the conductor BL0 is selected as (Vpg+Vt) greater than the voltage (0) applied to the conductor WL0, where Vpg is as defined above and Vt=(forward) threshold voltage ofdiode 50 00. Additionally, this same voltage Vpg+Vt is applied to each of the conductors WL1, . . . WLn, and zero voltage is applied to each of the conductors BL1, . . . BLn. This results in zero potential being applied across each of the memory cell-diode structures (other than theselected memory cell 30 00 anddiode 50 00 structure) connected to the conductor BL0 and the conductor WL0. Each of the other memory cell-diode structures has applied thereacross, from higher to lower potential in the reverse direction of thediode 50, an electrical potential which is equal to Vpg+Vt. This electrical potential is less than the breakdown voltage Vb of thediode 50, and thus no current flows through the associated memory cell. Thus, the incorporation of thediodes 50 allows one to properly select and program a memory cell, without disturbing any of the other memory cells in the array. - In order to erase a selected memory cell (
FIG. 4 ), for example selectedmemory cell 30 00, the voltage applied to the conductor WL0 is (Ver+Vb) greater than the voltage (0) applied to the conductor BL0, where Ver is as defined above and Vb=(reverse) breakdown voltage ofdiode 50 00. Additionally, a voltage of for example 0.5(Vpg+Vt) is applied to each of the conductors WL1, . . . WLn, and each of the conductors BL1, . . . BLn. This results a potential of 0.5(Vpg+Vt) being applied across each of the diode-memory cell structures (other than theselected memory cell 30 00 anddiode 50 00 structure) connected to the conductor BL0 and the conductor WL0, from higher to lower potential in the reverse direction of thediode 50. This electrical potential 0.5(Vpg+Vt) is less than the breakdown voltage Vb of thediode 50, and thus no current will flow through the associated memory cell. Each of the other memory cell-diode structures has applied thereacross an electrical potential of zero. Similar to the above, the incorporation of thediodes 50 allows one to properly select and erase a memory cell, without disturbing any of the other memory cells in the array. - In order to read a selected memory cell (
FIG. 5 ), for example selectedmemory cell 30 00, the voltage applied to the conductor BL0 is (Vr+Vt) greater than the voltage (0) applied to the conductor WL0, where Vr is as defined above and Vt=threshold voltage of diode 50 00). Additionally, a voltage of Vr+Vt is applied to each of the conductors WL1, . . . WLn, and zero voltage is applied to each of the conductors BL1, . . . BLn. This results in zero potential applied across each of the memory cell-diode structures (other than theselected memory cell 30 00 anddiode 50 00 structure) connected to the conductor BL1 and WL0. Each of the other memory cell-diode structures has applied thereacross, from higher to lower potential in the reverse direction of thediode 50, an electrical potential which is equal to Vr+Vt. This potential Vr+Vt is less than the breakdown voltage of thediode 50, so that no current passes through the associated memory cell. Thus, the incorporation of thediodes 50 allows one to properly select and read a memory cell, without disturbing or otherwise influencing any of the other memory cells in the array. -
FIG. 6 illustrates ideal (G) and actual (H) voltage-current characteristics for a diode of the type incorporated in the memory array ofFIGS. 3-5 . It is to be noted that in order to achieve erasing of a selected memory cell, current must be conducted through the selected memory cell, and in order to achieve this conduction of current, the diode associated therewith must be in breakdown. Ideally, such a diode would have a low threshold voltage (forward direction of the diode) on the order of 0.6 volts, and a low breakdown voltage (reverse direction of the diode) on the order of 2.0 volts, as these voltages would readily allow rapid and effective programming, reading, erasing of a selected cell with relatively low electrical potentials applied thereto, so that a low potential power supply can be used. - However, in reality, while a typical diode may indeed have a threshold voltage on then order of 0.6 volts, the breakdown voltage is substantially greater than 2.0 volts (illustrated at in
FIG. 6 ), i.e., for example, 4.5 volts or substantially more. This leads to problems in achieving breakdown of the diode, which is essential in erasing the associated memory cell as described above. - Therefore, what is needed is an approach wherein the ideal characteristics described above are achieved.
- Broadly stated, the present memory structure comprises a first conductor, a second conductor, a resistive memory cell connected to the second conductor, a first diode connected to the resistive memory cell and the first conductor, and oriented in the forward direction from the resistive memory cell to the first conductor, and a second diode connected to the resistive memory cell and the first conductor, in parallel with the first diode, and oriented in the reverse direction from the resistive memory cell to the first conductor.
- The present invention is better understood upon consideration of the detailed description below, in conjunction with the accompanying drawings. As will become readily apparent to those skilled in the art from the following description, there is shown and described an embodiment of this invention simply by way of the illustration of the best mode to carry out the invention. As will be realized, the invention is capable of other embodiments and its several details are capable of modifications and various obvious aspects, all without departing from the scope of the invention. Accordingly, the drawings and detailed description will be regarded as illustrative in nature and not as restrictive.
- The novel features believed characteristic of the invention are set forth in the appended claims. The invention itself, however, as well as said preferred mode of use, and further objects and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying drawings, wherein:
-
FIG. 1 is a cross-sectional view of a typical resistive memory cell; -
FIG. 2 is a plot of current vs. voltage in the programming, reading and erasing of the memory cell ofFIG. 1 ; -
FIG. 3 is a schematic illustration of a memory array which includes memory cells in accordance withFIG. 1 , illustrating programming of a selected memory cell; -
FIG. 4 is a schematic illustration of a memory array which includes memory cells in accordance withFIG. 1 , illustrating erasing of a selected memory cell; -
FIG. 5 is a schematic illustration of a memory array which includes memory cells in accordance withFIG. 1 , illustrating reading of a selected memory cell; -
FIG. 6 is a plot of current vs. voltage illustrating diode characteristics; -
FIG. 7 is a schematic illustration of the first embodiment of the invention; -
FIG. 8 is a plot of current vs. voltage for the invention ofFIG. 7 and the invention ofFIG. 10 ; -
FIG. 9 is a schematic illustration of a memory array incorporating the invention ofFIG. 7 , illustrating programming of a selected memory cell; -
FIG. 10 is a schematic illustration of a memory array incorporating the invention ofFIG. 7 , illustrating erasing of a selected memory cell; and -
FIG. 11 is a schematic illustration of a memory array incorporating the invention ofFIG. 7 , illustrating reading of a selected memory cell. - Reference is now made in detail to a specific embodiment of the present invention which illustrates the best mode presently contemplated by the inventors for practicing the invention.
-
FIG. 7 illustrates an embodiment of the present invention. A conductor BL is shown therein, and a conductor WL overlies, crosses and is spaced from the conductor BL. Astructure 60 interconnects the conductor BL and the conductor WL at the intersection thereof. Thestructure 60 includes aresistive memory cell 130, similar to theresistive memory cell 30 above, connected to the conductor WL, afirst diode 132 connected to theresistive memory cell 130 and the conductor BL, and asecond diode 134 also connected to theresistive memory cell 130 and the conductor BL, in parallel with thefirst diode 132. Thefirst diode 132 is oriented in the forward direction from theresistive memory cell 130 to the conductor BL, and thesecond diode 134 is oriented in the reverse direction from theresistive memory cell 130 to the conductor BL. Thediodes diode 132 has threshold voltage Vt1=0.6 volts, whilediode 134 has threshold voltage Vt2=2.0 volts. Bothdiodes parallel diode structure 62 connected between theresistive memory cell 130 and the conductor BL have the current-voltage characteristic shown inFIG. 8 . In the direction from the conductor BL to theresistive memory cell 130, thediode 132 will begin to conduct at its threshold voltage of 0.6 volts, well below the breakdown voltage (4.5 volts) of thediode 134. In the direction from thememory cell 130 to the conductor BL, thediode 134 will begin to conduct at its threshold voltage of 2.0 volts, well below the breakdown voltage (4.5 volts) of thediode 132. The net result is that theparallel diode structure 62 includingdiodes FIG. 8 , close to the ideal diode (FIG. 6 ) as discussed above. -
FIGS. 9, 10 and 11 illustrate amemory cell array 140 which incorporatesmemory cells 130 of the type described above. As illustrated inFIG. 9 , thememory cell array 140 includes afirst plurality 142 of parallel conductors (bit lines) BL0, BL1, . . . BLn, and asecond plurality 144 of parallel conductors (word lines) WL0, WL1, . . . WLn overlying and spaced from, orthogonal to, and crossing the first plurality ofconductors 142. A plurality ofstructures 60 as set forth above are included, each connecting a conductor BL with a conductor WL at the intersection thereof. Each structure includes aresistive memory cell 130 and aparallel diode structure 62, connected and configured as described above. For example, as shown inFIG. 9 ,memory cell 130 00 andparallel diode structure 62 00 in series connect conductor BL0 of the first plurality ofconductors 142 with conductor WL0 of the second plurality ofconductors 144 at the intersection of those conductors BL0, WL0,memory cell 130 10 andparallel diode structure 62 10 in series connect conductor BL1 of the first plurality ofconductors 142 with conductor WL0 of the second plurality ofconductors 144 at the intersection of those conductors BL1, WL0, etc. - In order to program a selected memory cell (
FIG. 9 ), for example selectedmemory cell 130 00, the voltage applied to the conductor BL0 is selected as (Vpg+Vt1) greater than the voltage (0) applied to the conductor WL0, where Vpg, as defined above, is in this embodiment 1.0 volts, and Vt1, (forward) threshold voltage of diode=0.6 volts, so that Vpg+Vt1=1.6 volts. Additionally, this same voltage Vpg+Vt1 of 1.6 volts is applied to each of the conductors WL1, . . . WLn, and zero voltage is applied to each of the conductors BL1, . . . BLn. This results in zero potential being applied across each of the structures 60 (other than the structure 60 00) connected to the conductor BL0 and the conductor WL0. Each of theother structures 60 in thearray 140 has applied thereacross, from higher to lower potential in the direction from conductor WL to conductor BL, an electrical potential which is equal to Vpg+Vt1=1.6 volts. This electrical potential is less than the threshold voltage Vt2 (2 volts) of the diode 134 (and less than the breakdown voltage Vb, 4.5 volts, of the diode 132), and thus no current flows through the associatedmemory cells 130. Thus, the incorporation of thediode structure 60 allows one to properly select and program a memory cell, without disturbing or otherwise influencing any of the other memory cells in the array. - In order to erase a selected memory cell (
FIG. 10 ), for example selectedmemory cell 130 00, the voltage applied to the conductor WL0 is (Ver+Vt2) greater than the voltage (0) applied to the conductor BL0, where Ver is as defined above and is in this embodiment 1.0 volts, and Vt2, the threshold voltage of the diode, is 2.0 volts, so that Ver+Vt2=3.0 volts. Additionally, a voltage of for example 0.5(Vpg+Vt2)=1.5 volts is applied to each of the conductors WL1, . . . WLn, and each of the conductors BL1, . . . . BLn. This results in a potential of 1.5 volts being applied across each of the structures 60 (other than the structure 60 00) connected to the conductor BL0 and the conductor WL0, from higher to lower potential in the direction from conductor WL to conductor BL. This electrical potential of 1.5 volts is less than the threshold voltage Vt2 (2.0 volts) of the diode 134 (and less than the breakdown voltage Vb, 4.5 volts, of the diode 132), and thus no current will flow through theother memory cells 130 associated with conductor BL0 and conductor WL0. Each of theother structures 60 in thearray 140 has applied thereacross an electrical potential of zero. Similar to the above, the incorporation of thediode structure 62 allows one to properly select and erase a memory cell, without disturbing any of the other memory cells in the array. - In order to read a selected memory cell (
FIG. 11 ), for example selectedmemory cell 130 00, the voltage applied to the conductor BL0 is (Vr+Vt1) greater than the voltage (0) applied to the conductor WL0, where Vr is as defined above and in this example equals 0.5 volts and Vt1=threshold voltage ofdiode 132 00, i.e., 0.6 volts, so that Vr+Vt1=1.1 volts. Additionally, a voltage of Vr+Vt1=1.1 volts is applied to each of the conductors WL1, . . . WLn, and zero voltage is applied to each of the conductors BL1, . . . BLn. This results in zero potential applied across each of the structures 60 (other than the structure 60 00) connected to the conductor BL1 and WL0. Each of theother structures 60 of the array has applied thereacross, from higher to lower potential in the direction from conductor WL to conductor BL, an electrical potential which is equal to Vr+Vt1. This potential Vr+Vt1=1.1 volts is less than the threshold voltage Vt2 (2.0 volts) of the diode 134 (and is less than the breakdown voltage of thediode 132, 4.5 volts), so that no current passes through the associatedmemory cell 130. Thus, the incorporation of thediode structure 62 allows one to properly select and read a memory cell, without disturbing any of the other memory cells in the array. - It will be seen that a highly efficient and effective approach for programming, erasing and reading resistive memory cells is provided. Of particular importance is the achievement of a diode structure which incorporates an ideal characteristic for threshold voltage and breakdown voltage thereof.
- The foregoing description of the embodiment of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Other modifications or variations are possible in light of the above teachings.
- The embodiment was chosen and described to provide the best illustration of the principles of the invention and its practical application to thereby enable one of ordinary skill of the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. All such modifications and variations are within the scope of the invention as determined by the appended claims when interpreted in accordance with the breadth to which they are fairly, legally and equitably entitled.
Claims (8)
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US10/990,706 US7035141B1 (en) | 2004-11-17 | 2004-11-17 | Diode array architecture for addressing nanoscale resistive memory arrays |
KR1020077010971A KR20070084213A (en) | 2004-11-17 | 2005-11-10 | Diode array architecture for addressing nanoscale resistive memory arrays |
CN2005800390251A CN101057330B (en) | 2004-11-17 | 2005-11-10 | Diode array architecture for addressing nanoscale resistive memory arrays |
GB0708857A GB2434694B (en) | 2004-11-17 | 2005-11-10 | Diode array architecture for addressing nanoscale resistive memory arrays |
PCT/US2005/041173 WO2006055482A1 (en) | 2004-11-17 | 2005-11-10 | Diode array architecture for addressing nanoscale resistive memory arrays |
DE200511002818 DE112005002818B4 (en) | 2004-11-17 | 2005-11-10 | Diode array architecture for addressing nanoscale resistance memory arrays |
JP2007543155A JP4547008B2 (en) | 2004-11-17 | 2005-11-10 | Diode array architecture for handling nanoscale resistive memory arrays |
TW094139852A TWI402840B (en) | 2004-11-17 | 2005-11-14 | Diode array architecture for addressing nanoscale resistive memory arrays |
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CN101057330B (en) | 2010-10-27 |
DE112005002818B4 (en) | 2012-07-19 |
US7035141B1 (en) | 2006-04-25 |
DE112005002818T5 (en) | 2007-09-13 |
TW200632907A (en) | 2006-09-16 |
CN101057330A (en) | 2007-10-17 |
GB2434694B (en) | 2010-03-31 |
JP2008521253A (en) | 2008-06-19 |
JP4547008B2 (en) | 2010-09-22 |
TWI402840B (en) | 2013-07-21 |
KR20070084213A (en) | 2007-08-24 |
WO2006055482A1 (en) | 2006-05-26 |
GB0708857D0 (en) | 2007-06-13 |
GB2434694A (en) | 2007-08-01 |
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