US20060015835A1 - Placement method for decoupling capacitors - Google Patents

Placement method for decoupling capacitors Download PDF

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Publication number
US20060015835A1
US20060015835A1 US11/233,739 US23373905A US2006015835A1 US 20060015835 A1 US20060015835 A1 US 20060015835A1 US 23373905 A US23373905 A US 23373905A US 2006015835 A1 US2006015835 A1 US 2006015835A1
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Prior art keywords
power lines
power
coupled
semiconductor structure
mos capacitor
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US11/233,739
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Chien-Chia Huang
Yu-Wen Tsai
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Faraday Technology Corp
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Faraday Technology Corp
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Publication of US20060015835A1 publication Critical patent/US20060015835A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805—Capacitors only
    • H01L27/0811—MIS diodes

Definitions

  • the present invention relates to a placement method, and more particularly, to a placement method for decoupling capacitors in a semiconductor circuit and a semiconductor structure using the same.
  • VCC supply voltage
  • Vt device threshold voltage
  • the ratio of noise voltage to Vt and VCC increase, since noise levels do not scale down at the same rate as Vt and VCC. Consequently, sensitivity to noise in these types of semiconductor integrated circuit devices increase.
  • decoupling capacitors are often needed in VLSI circuits.
  • Capacitance per unit area provided by conventional capacitance cells is low due to capacitance cell layout style and layout rule.
  • an object of the present invention is to place decoupling capacitors in an integrated circuit to minimize noise effects.
  • the present invention provides a method for placing decoupling capacitors to in integrated circuit during the placement and routing stage of fabrication process.
  • a floor plan of the integrated circuit is created during the placement and routing stage.
  • the floor plan comprises the relative locations of a plurality of functional units.
  • a power mesh is then overlaid on the floor plan.
  • the power mesh comprises a plurality of power lines and divides the floor plan into a plurality of windows.
  • a plurality of semiconductor cells are placed into a portion of the windows.
  • a MOS capacitor is then placed in the detected residual area, serving as a decoupling capacitor.
  • the MOS capacitor has a gate connected to the middle of the three power lines in the detected residual area, and a drain and a source are respectively connected to the remaining two power lines.
  • the present invention also provides a semiconductor structure.
  • a plurality of functional units are disposed in a substrate, and a power mesh is disposed on the substrate.
  • the power mesh comprises a plurality of first power lines and a plurality of second power lines, wherein the first and second power lines are arranged alternately.
  • a MOS capacitor is disposed in the substrate, and has a gate connected to one of the first power lines, and a drain and a source respectively connected to the second power line adjacent to the first power line connected to the gate.
  • FIG. 1 is a flowchart of the placement method for decoupling capacitors in an integrated circuit according to the present invention
  • FIG. 2A shows a floor plan of an integrated circuit
  • FIG. 2B shows a power mesh structure according to the present invention
  • FIG. 2C shows the floor plan with the power mesh structure shown in FIG. 2B ;
  • FIG. 2D shows a semiconductor structure according to the present invention.
  • FIG. 3 shows a structure diagram of MOS capacitor according to the present invention.
  • FIG. 1 is a flowchart of the placement method for decoupling capacitors in an integrated circuit according to the present invention.
  • step S 10 a floor plan 10 of the integrated circuit is created during the placement and routing stage, as shown in FIG. 2A .
  • the floor plan 10 shows the relative locations of a plurality of functional units FU 1 and FU 2 .
  • the functional units can be memory cells, microprocessors or the others.
  • FIG. 2B shows a power mesh structure 15 .
  • the power mesh 15 comprises a plurality of power lines P 1 ⁇ P 19 .
  • the power lines P 1 ⁇ P 9 are typically assigned to first metal layer (M 1 ), and the power lines P 10 ⁇ P 19 are usually assigned to second metal layer (M 2 )
  • the power lines P 1 , P 3 , P 5 , P 7 , P 9 , P 11 , P 13 , P 15 , P 17 and P 19 can be coupled to supply voltage VCC, and power lines P 2 , P 4 , P 6 , P 8 , P 10 , P 12 , P 14 , P 16 and P 18 can be coupled to ground GND, and vice versa.
  • Power lines P 1 , P 3 , P 5 , P 7 and P 9 of the first metal layer (M 1 ) and power lines P 11 , P 13 , P 15 , P 17 and P 19 of the second metal layer (M 2 ) are connected to each other through contacts (not shown).
  • Power lines P 2 , P 4 , P 6 and P 8 of the first metal layer (M 1 ) and power lines P 10 , P 12 , P 14 , P 16 and P 18 of the second metal layer (M 2 ) are connected to each other through contacts (not shown).
  • the power lines of supply voltage VCC and GND are arranged alternately.
  • step S 20 the power mesh 15 is overlaid on the floor plan 10 , dividing the floor plan into a plurality of windows W, as shown in FIG. 2C . Then, a plurality of semiconductor cells SU are placed into the windows W.
  • the semiconductor cells SU can be logic gates, active devices, passive devices or a combination thereof.
  • the active devices comprise switching devices, transistors and the like
  • the passive devices comprise resistors, capacitors, inductors and the like
  • the logic gates comprises OR gate, NOR gate, AND gate, NAND gate or a combination thereof.
  • step S 30 it is determined whether a residual area comprising two adjacent windows in the power mesh without functional units disposed therein and at least three parallel power lines running theretrough exists.
  • the residual area RA 1 comprises two adjacent windows W 1 and W 2 and three parallel power lines P 2 ⁇ P 4 , with no functional units and semiconductor cells arranged therein.
  • the residual area Ra 2 comprises four adjacent windows W 3 ⁇ W 4 and three parallel power lines P 6 ⁇ P 8 , with no functional units semiconductor cells SU arranged therein. Consequently, the residual areas RA 1 and RA 2 can be detected.
  • FIG. 3 shows the structure of the MOS capacitor 30 .
  • the drain D of the MOS capacitor 30 is connected to the power line P 2 by contacts
  • the gate G of the MOS capacitor 30 is connected to the power line P 3 by contacts
  • the source of the MOS capacitor 30 is connected to the power line P 4 by contacts.
  • the drain D of the MOS capacitor 30 is connected to the power line P 6 by contacts
  • the gate G of the MOS capacitor 30 is connected to the power line P 7 by contacts
  • the source of the MOS capacitor 30 is connected to the power line P 8 by contacts.
  • the power lines P 1 , P 3 , P 5 , P 7 , P 9 , P 11 , P 13 , P 15 , P 17 and P 19 are coupled to supply voltage VCC
  • power lines P 2 , P 4 , P 6 , PB, P 10 , P 12 , P 14 , P 16 and P 18 are coupled to ground GND.
  • the MOS capacitor 22 and 24 can be PMOS transistors with a gate coupled to the ground GND and a source and drain both coupled to the supply voltage VCC.
  • the MOS capacitors 22 and 24 can be NMOS transistors with a gate coupled to the supply voltage VCC and a source and drain both coupled to the ground GND.
  • At least one decoupling capacitor can be placed in an integrated circuit during the placement and routing stage in IC design, thereby minimizing noise effects.
  • the present invention can place MOS capacitors in a power mesh layout style integrated circuit to serve as decoupling capacitors without regard to spacing of the P/N MOS transistors in one window of the power mesh.
  • the present invention also provides a semiconductor structure as shown in FIG. 2D .
  • a plurality of functional units FU 1 and FU 2 are disposed in a substrate (not shown), the functional units can be memory cells, microprocessor or the others.
  • the floor plan 10 shows the relative locations of a plurality of functional units FU 1 and FU 2 .
  • the power mesh 15 is disposed on the substrate, and comprises a plurality of first power lines and a plurality of second power lines, and the first and second power lines are arranged alternately.
  • the power mesh 15 comprises a plurality of power lines P 1 ⁇ P 19 .
  • the power line P 1 ⁇ P 9 are usually assigned to the first metal layer (M 1 )
  • the power lines P 10 ⁇ P 19 are usually assigned to the second metal layer (M 2 ).
  • the power lines P 1 , P 3 , P 5 , P 7 , P 9 , P 11 , P 13 , P 15 , P 17 and P 19 can be coupled to supply voltage VCC, and power lines P 2 , P 4 , P 6 , P 8 , P 10 , P 12 , P 14 , P 16 and P 18 can be coupled to ground GND, and vice versa.
  • Power lines P 1 , P 3 , P 5 , P 7 and P 9 of the first metal layer (M 1 ) and power lines P 11 , P 13 , P 15 , P 17 and P 19 of the second metal layer (M 2 ) are connected to each other through contacts (not shown).
  • Power lines P 2 , P 4 , P 6 and P 8 of the first metal layer (M 1 ) and power lines P 10 , P 12 , P 14 , P 16 and P 18 of the second metal layer (M 2 ) are connected to each other through contacts (not shown).
  • the power lines of supply voltage VCC and GND are arranged alternately.
  • a plurality of semiconductor cells SU can be placed into a portion of the windows W.
  • the semiconductor cells SU comprises active devices, passive devices or a combination thereof.
  • Semiconductor cells SU can be OR gates, NOR gates, AND gates, NAND gates or a combination thereof.
  • the active devices comprise switching devices, transistors and the like
  • the passive devices comprise resistors, capacitors, inductors and the like.
  • a MOS capacitor 22 is disposed in the substrate, and has a gate connected to power line P 3 , and a drain and a source respectively connected to the second power lines P 2 and P 4 adjacent to the power line P 1 connected to the gate.
  • the MOS capacitor 30 shown in FIG. 3 serving as the MOS capacitor is placed in the residual area RA 1 , the metal lines ML 1 ⁇ ML 3 correspond to the power lines P 2 ⁇ P 4 .
  • the MOS capacitor 30 has a gate G connected to the power line P 3 (metal line ML 2 ), and a drain D and source S connected to the power lines P 2 and P 4 (the metal lines ML 1 and ML 3 ) respectively.
  • FIG. 3 the MOS capacitor 30 shown in FIG. 3 serving as the MOS capacitor is placed in the residual area RA 1
  • the MOS capacitor 30 has a gate G connected to the power line P 3 (metal line ML 2 ), and a drain D and source S connected to the power lines P 2 and P 4 (the metal lines ML 1 and ML 3 ) respectively.
  • the MOS capacitor 22 can be a PMOS transistor with a gate coupled to the ground GND and a source and drain both coupled to the supply voltage VCC.
  • the MOS capacitor 22 can be a NMOS transistor with a gate coupled to the supply voltage VCC and a source and drain both coupled to the ground GND.
  • MOS capacitor 30 can also be placed in the residual area RA 2 , and the metal lines ML 1 ⁇ ML 3 correspond to the power lines P 6 ⁇ P 8 .
  • the MOS capacitor 30 has a gate G connected to the power line P 7 (metal line ML 2 ), and a drain D and source S connected to the power lines P 6 and P 8 (the metal lines ML 1 and ML 3 ) respectively.
  • the MOS capacitor 24 can be a PMOS transistor with a gate coupled to the ground GND and a source and drain both coupled to the supply voltage VCC, when the power lines P 1 , P 3 , P 5 , P 7 , P 9 , P 11 , P 13 , P 15 , P 17 and P 19 are coupled to supply voltage VCC, and power lines P 2 , P 4 , P 6 , P 8 , P 10 , P 12 , P 14 , P 16 and P 18 are coupled to ground GND as shown in FIG. 2B .
  • the MOS capacitor 24 can be a NMOS transistor with a gate coupled to the supply voltage VCC and a source and drain both coupled to the ground GND.
  • the MOS capacitors 22 and 24 disposed in the residual areas RA 1 and RA 2 serve as decoupling capacitors for minimizing noise effects.

Abstract

A method for placing decoupling capacitors in an integrated circuit during placement and routing stage. In the placement method, a floor plan of the integrated circuit is created, and includes the relative locations of a plurality of functional units. A power mesh comprising a plurality power lines is then overlaid on the floor plan, and the floor plan is divided into a plurality of windows. A plurality of semiconductor cells are placed into a portion of the windows. It is then determined whether a residual area comprising two adjacent windows without functional units and semiconductor cells disposed therein and at least three parallel power lines running theretrough exists. A MOS capacitor is then placed in the detected residual area, serving as a decoupling capacitor.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a placement method, and more particularly, to a placement method for decoupling capacitors in a semiconductor circuit and a semiconductor structure using the same.
  • 2. Description of the Related Art
  • A current trend in semiconductor design, particularly for application specific integrated circuits (ASICs) and advanced/complex semiconductor integrated circuit devices, such as microprocessors, is to lower operating power, thus trend driving power supply and device threshold voltages to lower levels. Another trend emphasizing the need for decoupling is that voltage scaling has lagged behind area/capacitance scaling. As the supply voltage (VCC) and device threshold voltage (Vt) drop, the ratio of noise voltage to Vt and VCC increase, since noise levels do not scale down at the same rate as Vt and VCC. Consequently, sensitivity to noise in these types of semiconductor integrated circuit devices increase. In order to minimize noise effects, decoupling capacitors are often needed in VLSI circuits.
  • Capacitance per unit area provided by conventional capacitance cells, however, is low due to capacitance cell layout style and layout rule.
    • SUMMARY OF THE INVENTION
  • Therefore an object of the present invention is to place decoupling capacitors in an integrated circuit to minimize noise effects.
  • According to the above mentioned object, the present invention provides a method for placing decoupling capacitors to in integrated circuit during the placement and routing stage of fabrication process.
  • In the placement method, a floor plan of the integrated circuit is created during the placement and routing stage. The floor plan comprises the relative locations of a plurality of functional units. A power mesh is then overlaid on the floor plan. The power mesh comprises a plurality of power lines and divides the floor plan into a plurality of windows. A plurality of semiconductor cells are placed into a portion of the windows. First it is determined whether a residual area comprising two adjacent windows without functional units and semiconductor cells disposed therein and at least three parallel power lines running theretrough exists. A MOS capacitor is then placed in the detected residual area, serving as a decoupling capacitor. The MOS capacitor has a gate connected to the middle of the three power lines in the detected residual area, and a drain and a source are respectively connected to the remaining two power lines.
  • According to the above objects, the present invention also provides a semiconductor structure. In the semiconductor structure, a plurality of functional units are disposed in a substrate, and a power mesh is disposed on the substrate. The power mesh comprises a plurality of first power lines and a plurality of second power lines, wherein the first and second power lines are arranged alternately. A MOS capacitor is disposed in the substrate, and has a gate connected to one of the first power lines, and a drain and a source respectively connected to the second power line adjacent to the first power line connected to the gate.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention can be more fully understood by the subsequent detailed description and examples with reference made to the accompanying drawings, wherein:
  • FIG. 1 is a flowchart of the placement method for decoupling capacitors in an integrated circuit according to the present invention;
  • FIG. 2A shows a floor plan of an integrated circuit;
  • FIG. 2B shows a power mesh structure according to the present invention;
  • FIG. 2C shows the floor plan with the power mesh structure shown in FIG. 2B;
  • FIG. 2D shows a semiconductor structure according to the present invention; and
  • FIG. 3 shows a structure diagram of MOS capacitor according to the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 is a flowchart of the placement method for decoupling capacitors in an integrated circuit according to the present invention. In step S10, a floor plan 10 of the integrated circuit is created during the placement and routing stage, as shown in FIG. 2A. The floor plan 10 shows the relative locations of a plurality of functional units FU1 and FU2. In this case, the functional units can be memory cells, microprocessors or the others.
  • FIG. 2B shows a power mesh structure 15. The power mesh 15 comprises a plurality of power lines P1˜P19. For example, the power lines P1˜P9 are typically assigned to first metal layer (M1), and the power lines P10˜P19 are usually assigned to second metal layer (M2) The power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 can be coupled to supply voltage VCC, and power lines P2, P4, P6, P8, P10, P12, P14, P16 and P18 can be coupled to ground GND, and vice versa. Power lines P1, P3, P5, P7 and P9 of the first metal layer (M1) and power lines P11, P13, P15, P17 and P19 of the second metal layer (M2) are connected to each other through contacts (not shown). Power lines P2, P4, P6 and P8 of the first metal layer (M1) and power lines P10, P12, P14, P16 and P18 of the second metal layer (M2) are connected to each other through contacts (not shown). The power lines of supply voltage VCC and GND are arranged alternately.
  • Next, in step S20, the power mesh 15 is overlaid on the floor plan 10, dividing the floor plan into a plurality of windows W, as shown in FIG. 2C. Then, a plurality of semiconductor cells SU are placed into the windows W. The semiconductor cells SU can be logic gates, active devices, passive devices or a combination thereof. For example, the active devices comprise switching devices, transistors and the like, and the passive devices comprise resistors, capacitors, inductors and the like, and the logic gates comprises OR gate, NOR gate, AND gate, NAND gate or a combination thereof.
  • In step S30, it is determined whether a residual area comprising two adjacent windows in the power mesh without functional units disposed therein and at least three parallel power lines running theretrough exists. As shown in FIG. 2C, for example, the residual area RA1 comprises two adjacent windows W1 and W2 and three parallel power lines P2˜P4, with no functional units and semiconductor cells arranged therein. The residual area Ra2 comprises four adjacent windows W3˜W4 and three parallel power lines P6˜P8, with no functional units semiconductor cells SU arranged therein. Consequently, the residual areas RA1 and RA2 can be detected.
  • Next, the MOS capacitors 30 shown in FIG. 3 can be placed in the detected residual areas (RA1 or RA2), to serve as decoupling capacitors, as shown in FIG. 2D. FIG. 3 shows the structure of the MOS capacitor 30. For example, when the MOS capacitor 30 is placed in the residual area RA1, the drain D of the MOS capacitor 30 is connected to the power line P2 by contacts, the gate G of the MOS capacitor 30 is connected to the power line P3 by contacts, and the source of the MOS capacitor 30 is connected to the power line P4 by contacts. In addition, when the MOS capacitor 30 is placed in the residual area RA2, the drain D of the MOS capacitor 30 is connected to the power line P6 by contacts, the gate G of the MOS capacitor 30 is connected to the power line P7 by contacts, and the source of the MOS capacitor 30 is connected to the power line P8 by contacts.
  • As shown in FIG. 2B, the power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 are coupled to supply voltage VCC, and power lines P2, P4, P6, PB, P10, P12, P14, P16 and P18 are coupled to ground GND. In this case, the MOS capacitor 22 and 24 can be PMOS transistors with a gate coupled to the ground GND and a source and drain both coupled to the supply voltage VCC. When the power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 are coupled to ground GND, and power lines P2, P4, P6, P8, P10, P12, P14, P16 and P18 are coupled to supply voltage VCC, the MOS capacitors 22 and 24 can be NMOS transistors with a gate coupled to the supply voltage VCC and a source and drain both coupled to the ground GND.
  • Therefore, in the placement method of the present invention, at least one decoupling capacitor can be placed in an integrated circuit during the placement and routing stage in IC design, thereby minimizing noise effects.
  • If a single PMOS capacitor, NMOS or a combination of PMOS and NMOS transistors is placed in one window of the power mesh, extra metal routing lines and contacts connected to the MOS capacitors and power lines are required, and spacing between P/N MOS transistors must be considered. The present invention can place MOS capacitors in a power mesh layout style integrated circuit to serve as decoupling capacitors without regard to spacing of the P/N MOS transistors in one window of the power mesh.
  • The present invention also provides a semiconductor structure as shown in FIG. 2D. As shown in the floor plan 10, a plurality of functional units FU1 and FU2 are disposed in a substrate (not shown), the functional units can be memory cells, microprocessor or the others. The floor plan 10 shows the relative locations of a plurality of functional units FU1 and FU2.
  • The power mesh 15 is disposed on the substrate, and comprises a plurality of first power lines and a plurality of second power lines, and the first and second power lines are arranged alternately. In this case, the power mesh 15 comprises a plurality of power lines P1˜P19. For example, the power line P1˜P9 are usually assigned to the first metal layer (M1), and the power lines P10˜P19 are usually assigned to the second metal layer (M2). The power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 can be coupled to supply voltage VCC, and power lines P2, P4, P6, P8, P10, P12, P14, P16 and P18 can be coupled to ground GND, and vice versa. Power lines P1, P3, P5, P7 and P9 of the first metal layer (M1) and power lines P11, P13, P15, P17 and P19 of the second metal layer (M2) are connected to each other through contacts (not shown). Power lines P2, P4, P6 and P8 of the first metal layer (M1) and power lines P10, P12, P14, P16 and P18 of the second metal layer (M2) are connected to each other through contacts (not shown). The power lines of supply voltage VCC and GND are arranged alternately.
  • A plurality of semiconductor cells SU can be placed into a portion of the windows W. The semiconductor cells SU comprises active devices, passive devices or a combination thereof. Semiconductor cells SU can be OR gates, NOR gates, AND gates, NAND gates or a combination thereof. For example, the active devices comprise switching devices, transistors and the like, and the passive devices comprise resistors, capacitors, inductors and the like.
  • A MOS capacitor 22 is disposed in the substrate, and has a gate connected to power line P3, and a drain and a source respectively connected to the second power lines P2 and P4 adjacent to the power line P1 connected to the gate.
  • When the MOS capacitor 30 shown in FIG. 3 serving as the MOS capacitor is placed in the residual area RA1, the metal lines ML1˜ML3 correspond to the power lines P2˜P4. Namely, the MOS capacitor 30 has a gate G connected to the power line P3 (metal line ML2), and a drain D and source S connected to the power lines P2 and P4 (the metal lines ML1 and ML3) respectively. As shown in FIG. 2B, the power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 are coupled to the supply voltage VCC, and power lines P2, P4, P6, P8, P10, P12, P14, P16 and P18 are coupled to ground GND. Therefore, the MOS capacitor 22 can be a PMOS transistor with a gate coupled to the ground GND and a source and drain both coupled to the supply voltage VCC. When the power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 are coupled to ground GND, and power lines P2, P4, P6, P8, P10, P12, P14, P16 and P18 are coupled to the supply voltage VCC, the MOS capacitor 22 can be a NMOS transistor with a gate coupled to the supply voltage VCC and a source and drain both coupled to the ground GND.
  • Additionally, another MOS capacitor 30 can also be placed in the residual area RA2, and the metal lines ML1˜ML3 correspond to the power lines P6˜P8. Namely, the MOS capacitor 30 has a gate G connected to the power line P7 (metal line ML2), and a drain D and source S connected to the power lines P6 and P8 (the metal lines ML1 and ML3) respectively.
  • Similarly, the MOS capacitor 24 can be a PMOS transistor with a gate coupled to the ground GND and a source and drain both coupled to the supply voltage VCC, when the power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 are coupled to supply voltage VCC, and power lines P2, P4, P6, P8, P10, P12, P14, P16 and P18 are coupled to ground GND as shown in FIG. 2B. When the power lines P1, P3, P5, P7, P9, P11, P13, P15, P17 and P19 are coupled to ground GND, and power lines P2, P4, P6, P8, P10, P12, P14, P16 and P18 are coupled to supply voltage VCC, the MOS capacitor 24 can be a NMOS transistor with a gate coupled to the supply voltage VCC and a source and drain both coupled to the ground GND.
  • Therefore, the MOS capacitors 22 and 24 disposed in the residual areas RA1 and RA2 serve as decoupling capacitors for minimizing noise effects.
  • While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (8)

1-12. (canceled)
13. A semiconductor structure, comprising:
a substrate having a plurality of functional units and a plurality of semiconductor cells disposed therein;
a power mesh disposed on the substrate, comprising a plurality of first power lines and a plurality of second power lines, wherein the first and second power lines are arranged alternately; and
a MOS capacitor disposed in the substrate, having a gate connected to one of the first power lines, and a drain and a source respectively connected to the second power lines adjacent to the first power line connected to the gate.
14. The semiconductor structure as claimed in claim 13, wherein the semiconductor structure is an application specific integrated circuit (ASIC).
15. The semiconductor structure as claimed in claim 13, wherein the semiconductor structure is a microprocessor.
16. The semiconductor structure as claimed in claim 13, wherein the first power lines are coupled to a power voltage (VCC) and the second power lines are coupled to ground.
17. The semiconductor structure as claimed in claim 16, wherein the MOS capacitor is an NMOS transistor.
18. The semiconductor structure as claimed in claim 13, wherein the first power lines are coupled to ground and the second power lines are coupled to a power voltage (VCC).
19. The semiconductor structure as claimed in claim 18, wherein the MOS capacitor is a PMOS transistor.
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