US20060002830A1 - Wet abatemenbt system for waste SiH4 - Google Patents
Wet abatemenbt system for waste SiH4 Download PDFInfo
- Publication number
- US20060002830A1 US20060002830A1 US11/217,780 US21778005A US2006002830A1 US 20060002830 A1 US20060002830 A1 US 20060002830A1 US 21778005 A US21778005 A US 21778005A US 2006002830 A1 US2006002830 A1 US 2006002830A1
- Authority
- US
- United States
- Prior art keywords
- water
- silane
- filled chamber
- chamber
- abatement system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/77—Liquid phase processes
- B01D53/78—Liquid phase processes with gas-liquid contact
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/46—Removing components of defined structure
Definitions
- the invention relates to a method of and device for abatement of waste SiH 4 in the fabrication of integrated circuits, and more particularly, to a method of and device for safe wet abatement of waste SiH 4 in the manufacture of integrated circuits.
- Chemical vapor deposition (CVD) processes are widely used in integrated circuit manufacturing.
- polysilicon or silicon dioxide layers can be deposited by CVD using silane (SiH 4 ) gas or other similar gases.
- silane (SiH 4 ) gas or other similar gases After the CVD process has been completed, excess silane gas remains in the CVD system.
- excess reactant gases are removed by an exhaust system.
- the exhaust system may vent the reactant gas to the atmosphere.
- silane gas is pyrophoric and cannot be released into the atmosphere.
- Silanes and similar gases must be filtered from the exhaust gas stream or converted to compounds that can be disposed of safely.
- a common method of converting waste silane to a disposable compound is through combustion in a so-called “burn box”.
- the SiH 4 is converted to SiO 2 by the reaction: 2SiH 4 +2O 2 ⁇ 2SiO 2 +4H 2 .
- the risk is that the burn box may be a source of fire if system failure occurs suddenly. For example, if the exhaust system fails, residue SiH 4 will collect in the burn box making it likely that an uncontrolled fire will start.
- U.S. Pat. Nos. 6,174,349 to DeSantis, 6,126,906 to Imamura, and 5,183,646 to Anderson et al describe processes and devices including burn boxes. Wet scrubbers and other abatement methods are also used.
- U.S. Pat. No. 6,174,349 to DeSantis teaches a wet scrubber in combination with the burn box.
- U.S. Pat. No. 5,955,037 to Holst et al shows an oxidation treatment.
- U.S. Pat. No. 5,320,817 to Hardwick et al uses an amine-forming metal salt to scrub silane.
- a principal object of the present invention is to provide an effective and very manufacturable method of silane abatement in the fabrication of integrated circuit devices.
- Another object of the present invention is to provide an effective and very manufacturable method of silane abatement wherein the abatement system does not present the danger of being a source of fire.
- Another object of the invention is to provide a silane abatement system that does not present the danger of being the source of fire.
- Waste silane gas is bubbled into a water-filled chamber.
- the waste silane gas is reacted with oxygen in water in the water-filled chamber whereby SiO 2 precipitates are formed and wherein the SiO 2 precipitates settle to a bottom surface of the water-filled chamber.
- the SiO 2 precipitates are drained out of the water-filled chamber to complete the abatement process.
- the silane abatement system comprises a water-filled chamber within an outer chamber.
- An air intake is located in one upper portion of the outer chamber and an exhaust output is located in another upper portion of the outer chamber.
- a silane gas intake pipe runs into the outer chamber and has its output under water in the water-filled chamber.
- a drain is connected through a valve at a bottom portion of the water-filled chamber.
- FIGS. 1 and 2 schematically illustrate in cross-sectional representation a preferred embodiment of the present invention.
- the present invention provides a method and a device for waste silane abatement.
- the waste silane abatement system of the present invention successfully deals with the waste silane without danger of being a fire source. No burn box is used in the method and-device of the invention. Rather, waste SiH 4 gas is reacted with dissolved oxygen to form solid SiO 2 which can be disposed of safely.
- Safety features of the device of the present invention include sprinklers that will be automatically triggered in the event of fire.
- FIGS. 1 and 2 illustrate the waste SiH 4 abatement system of the present invention.
- waste abatement device 10 is shown. A portion of the device is filled with water 22 . Oxygen gas is dissolved in the water 22 .
- Waste SiH 4 gas enters the chamber 10 from through a pressurized pipe 18 .
- High pressure N 2 gas flow 19 pushes the SiH 4 gas through the pipe 18 , into the chamber 10 and out through the pipe 24 under the water.
- N 2 gas here is used to prevent back fire to the process tool. If backfire occurs, N 2 is activated to push the fire into the water chamber.
- the N 2 gas flow is at a high pressure of about 100 psi.
- FIG. 2 is a close-up of the pipe 24 .
- the waste SiH4 gas is pumped through pipe 18 into a C-shaped stainless steel square pipe 24 .
- Flippers 14 are pushed upward by pressure to release SiH 4 gas for reaction with dissolved O 2 for abatement.
- dissolved O 2 In water at 25° C., there is about 8.4 ppm of dissolved O 2 .
- the gas reacts with dissolved oxygen in the water to form a heavy precipitate of SiO 2 .
- the SiO 2 precipitate sinks slowly to the base of the chamber.
- the drain valve 26 is opened, subject to the SiO 2 level, to clear the solid SiO 2 out through the drain 28 . Most likely, the drain valve may be opened once a day.
- Chamber 20 provides for water overflow. Continuous fresh air intake 30 into the chamber 10 insures the process of oxygen dissolving into the water from the air is not interrupted.
- An open-ended drain 36 in the chamber 20 will capture water over-flow from the water-filled section 22 of the chamber.
- An exhaust pipe 38 is separated from the chamber 10 by an exhaust flipper 32 . The exothermic abatement process may release smoke into the chamber. This smoke is exhausted into the pipe 38 .
- the exhaust pipe also provides forced air ventilation from the chamber outside into chamber 10 for the air dissolving process.
- a controller 34 controls the water supply 42 and fusible link 44 .
- the controller also monitors a water temperature sensor 46 , a water level sensor 48 , and an exhaust temperature sensor 50 .
- Water sprinklers 52 located in the chamber ceiling and in the exhaust pipe are triggered by the controller by a high water temperature, high exhaust pipe temperature, or when the fusible link is broken.
- the fusible link is a burnable material such as nylon. If this link is exposed to heat high enough to break it, the controller will turn on the water sprinklers.
- the water level sensor avoids “dry-run” operations if the water level is not high enough.
- the air intake 30 and the exhaust flipper 32 will shut.
- the flippers are normally open, but will be pushed closed by the pressure of an explosion.
- the oxygen source will also be cut off to stop any fire. That is, the air intake flipper 30 , normally open, will be pushed closed by pressure due to fire. If the fusible link 49 within one or both of the N2 high pressure pipes is broken, indicating high heat, high pressure N 2 flow 19 will be triggered to push the fire back into the water chamber 22 and to form N 2 blanketing to stop a fire.
- the wet abatement system of the present invention consists of a water-filled chamber within an outer chamber.
- a drain is connected through a valve to the water-filled chamber.
- An overflow drain is at the bottom of the outer chamber.
- a controller controls the water supply and monitors the water level, water temperature, exhaust temperature,. and a fusible link within the exhaust pipe.
- a pipe brings waste SiH 4 gas into the water-filled chamber.
- a high pressure pump pushes the waste gas through the pipe.
- waste silane gas is bubbled into the water-filled chamber of the wet abatement system of the present invention.
- N 2 gas at high pressure pushes the silane gas through a pipe into the water-filled chamber.
- the silane gas reacts with oxygen dissolved in the water to form a precipitate of SiO 2 .
- the SiO 2 settles to the bottom of the chamber and is removed from the chamber through a drain.
- the process of the present invention abates waste SiH 4 in the water state.
- the abatement system will not be a source of fire because of the safety features of the wet abatement system of the present invention.
- These safety features include: water sprinklers located on the ceiling of the outer chamber above the water-filled chamber and in the exhaust pipe, air intake and exhaust flippers that close in the event of an explosion, a process pump trip, fusible links located within the exhaust pipe and within the N2 pipes that will break if exposed to high heat, water temperature and exhaust temperature sensors, and a water level sensor.
- the controller monitors the sensors and the fusible links.
- the water sprinklers are triggered, the air intake and exhaust flippers are closed, the oxygen supply into the chamber is cut off, and the N 2 gas pump is shut down after pushing residue waste gas into the water-filled chamber. If the water level sensor shows the water level is too low, the system is also shut down.
- the process and device of the present invention provide wet silane abatement without danger of fire from the abatement system.
- the wet abatement system of the present invention has a variety of safety features that work together to provide safe and effective silane abatement.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Treating Waste Gases (AREA)
- Incineration Of Waste (AREA)
Abstract
A new method of silane abatement is achieved. The novel silane abatement system comprises a water-filled chamber within an outer chamber. An air intake is located in one upper portion of said outer chamber and an exhaust output is located in another upper portion of the outer chamber. A silane gas intake pipe runs into the outer chamber and has its output under water in the water-filled chamber. A drain is connected through a valve at a bottom portion of the water-filled chamber. Many safety features are built into the wet abatement system, including temperature and water level sensors, water sprinklers, and means for shutting off air supply, exhaust, and silane intake. Waste silane gas is bubbled into a water-filled chamber. The waste silane gas is reacted with oxygen in water in the water-filled chamber whereby SiO2 precipitates are formed and wherein the SiO2 precipitates settle to a bottom surface of the water-filled chamber. The SiO2 precipitates are drained out of the water-filled chamber to complete the abatement process.
Description
- 1. Field of the Invention
- The invention relates to a method of and device for abatement of waste SiH4 in the fabrication of integrated circuits, and more particularly, to a method of and device for safe wet abatement of waste SiH4 in the manufacture of integrated circuits.
- 2. Description of the Prior Art
- Chemical vapor deposition (CVD) processes are widely used in integrated circuit manufacturing. For example, polysilicon or silicon dioxide layers can be deposited by CVD using silane (SiH4) gas or other similar gases. After the CVD process has been completed, excess silane gas remains in the CVD system. Typically, excess reactant gases are removed by an exhaust system. The exhaust system may vent the reactant gas to the atmosphere. However, silane gas is pyrophoric and cannot be released into the atmosphere. Silanes and similar gases must be filtered from the exhaust gas stream or converted to compounds that can be disposed of safely. A common method of converting waste silane to a disposable compound is through combustion in a so-called “burn box”. In the burn box, the SiH4 is converted to SiO2 by the reaction: 2SiH4+2O2→2SiO2+4H2. However, the risk is that the burn box may be a source of fire if system failure occurs suddenly. For example, if the exhaust system fails, residue SiH4 will collect in the burn box making it likely that an uncontrolled fire will start.
- U.S. Pat. Nos. 6,174,349 to DeSantis, 6,126,906 to Imamura, and 5,183,646 to Anderson et al describe processes and devices including burn boxes. Wet scrubbers and other abatement methods are also used. U.S. Pat. No. 6,174,349 to DeSantis teaches a wet scrubber in combination with the burn box. U.S. Pat. No. 5,955,037 to Holst et al shows an oxidation treatment. U.S. Pat. No. 5,320,817 to Hardwick et al uses an amine-forming metal salt to scrub silane.
- Accordingly, a principal object of the present invention is to provide an effective and very manufacturable method of silane abatement in the fabrication of integrated circuit devices.
- Another object of the present invention is to provide an effective and very manufacturable method of silane abatement wherein the abatement system does not present the danger of being a source of fire.
- Another object of the invention is to provide a silane abatement system that does not present the danger of being the source of fire.
- In accordance with the objects of this invention a new method of silane abatement is achieved. Waste silane gas is bubbled into a water-filled chamber. The waste silane gas is reacted with oxygen in water in the water-filled chamber whereby SiO2 precipitates are formed and wherein the SiO2 precipitates settle to a bottom surface of the water-filled chamber. The SiO2 precipitates are drained out of the water-filled chamber to complete the abatement process.
- Also in accordance with the objects of this invention a new silane abatement system is achieved. The silane abatement system comprises a water-filled chamber within an outer chamber. An air intake is located in one upper portion of the outer chamber and an exhaust output is located in another upper portion of the outer chamber. A silane gas intake pipe runs into the outer chamber and has its output under water in the water-filled chamber. A drain is connected through a valve at a bottom portion of the water-filled chamber. Many safety features are built into the wet abatement system, including temperature and water level sensors, water sprinklers, and means for shutting off air supply, exhaust, and silane intake.
- In the accompanying drawings forming a material part of this description, there is shown:
-
FIGS. 1 and 2 schematically illustrate in cross-sectional representation a preferred embodiment of the present invention. - The present invention provides a method and a device for waste silane abatement. The waste silane abatement system of the present invention successfully deals with the waste silane without danger of being a fire source. No burn box is used in the method and-device of the invention. Rather, waste SiH4 gas is reacted with dissolved oxygen to form solid SiO2 which can be disposed of safely. Safety features of the device of the present invention include sprinklers that will be automatically triggered in the event of fire.
-
FIGS. 1 and 2 illustrate the waste SiH4 abatement system of the present invention. Referring now toFIG. 1 ,waste abatement device 10 is shown. A portion of the device is filled withwater 22. Oxygen gas is dissolved in thewater 22. Waste SiH4 gas enters thechamber 10 from through a pressurizedpipe 18. High pressure N2 gas flow 19 pushes the SiH4 gas through thepipe 18, into thechamber 10 and out through thepipe 24 under the water. N2 gas here is used to prevent back fire to the process tool. If backfire occurs, N2 is activated to push the fire into the water chamber. The N2 gas flow is at a high pressure of about 100 psi. - The SiH4 gas is bubbled into the
water 22.FIG. 2 is a close-up of thepipe 24. The waste SiH4 gas is pumped throughpipe 18 into a C-shaped stainless steelsquare pipe 24. Flippers 14 are pushed upward by pressure to release SiH4 gas for reaction with dissolved O2 for abatement. In water at 25° C., there is about 8.4 ppm of dissolved O2. The gas reacts with dissolved oxygen in the water to form a heavy precipitate of SiO2. The SiO2 precipitate sinks slowly to the base of the chamber. Thedrain valve 26 is opened, subject to the SiO2 level, to clear the solid SiO2 out through thedrain 28. Most likely, the drain valve may be opened once a day. -
Chamber 20 provides for water overflow. Continuousfresh air intake 30 into thechamber 10 insures the process of oxygen dissolving into the water from the air is not interrupted. An open-endeddrain 36 in thechamber 20 will capture water over-flow from the water-filledsection 22 of the chamber. Anexhaust pipe 38 is separated from thechamber 10 by anexhaust flipper 32. The exothermic abatement process may release smoke into the chamber. This smoke is exhausted into thepipe 38. The exhaust pipe also provides forced air ventilation from the chamber outside intochamber 10 for the air dissolving process. - A
controller 34 controls thewater supply 42 andfusible link 44. The controller also monitors awater temperature sensor 46, awater level sensor 48, and anexhaust temperature sensor 50.Water sprinklers 52 located in the chamber ceiling and in the exhaust pipe are triggered by the controller by a high water temperature, high exhaust pipe temperature, or when the fusible link is broken. The fusible link is a burnable material such as nylon. If this link is exposed to heat high enough to break it, the controller will turn on the water sprinklers. The water level sensor avoids “dry-run” operations if the water level is not high enough. - If a minor explosion occurs within the
chamber 10, theair intake 30 and theexhaust flipper 32 will shut. The flippers are normally open, but will be pushed closed by the pressure of an explosion. The oxygen source will also be cut off to stop any fire. That is, theair intake flipper 30, normally open, will be pushed closed by pressure due to fire. If thefusible link 49 within one or both of the N2 high pressure pipes is broken, indicating high heat, high pressure N2 flow 19 will be triggered to push the fire back into thewater chamber 22 and to form N2 blanketing to stop a fire. - The wet abatement system of the present invention consists of a water-filled chamber within an outer chamber. An air intake flipper and an exhaust flipper control input and output of air. A drain is connected through a valve to the water-filled chamber. An overflow drain is at the bottom of the outer chamber. A controller controls the water supply and monitors the water level, water temperature, exhaust temperature,. and a fusible link within the exhaust pipe. A pipe brings waste SiH4 gas into the water-filled chamber. A high pressure pump pushes the waste gas through the pipe.
- In the wet abatement process of the present invention, waste silane gas is bubbled into the water-filled chamber of the wet abatement system of the present invention. N2 gas at high pressure pushes the silane gas through a pipe into the water-filled chamber. The silane gas reacts with oxygen dissolved in the water to form a precipitate of SiO2. The SiO2 settles to the bottom of the chamber and is removed from the chamber through a drain.
- The process of the present invention abates waste SiH4 in the water state. The abatement system will not be a source of fire because of the safety features of the wet abatement system of the present invention. These safety features include: water sprinklers located on the ceiling of the outer chamber above the water-filled chamber and in the exhaust pipe, air intake and exhaust flippers that close in the event of an explosion, a process pump trip, fusible links located within the exhaust pipe and within the N2 pipes that will break if exposed to high heat, water temperature and exhaust temperature sensors, and a water level sensor. The controller monitors the sensors and the fusible links. If either of the temperature sensors show a high temperature or if any of the fusible links are broken, the water sprinklers are triggered, the air intake and exhaust flippers are closed, the oxygen supply into the chamber is cut off, and the N2 gas pump is shut down after pushing residue waste gas into the water-filled chamber. If the water level sensor shows the water level is too low, the system is also shut down.
- The process and device of the present invention provide wet silane abatement without danger of fire from the abatement system. The wet abatement system of the present invention has a variety of safety features that work together to provide safe and effective silane abatement.
- While the invention has been particularly shown and described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the invention.
- What is claimed is:
Claims (26)
1. A silane abatement system comprising:
a water-filled chamber within an outer chamber;
an air intake in one upper portion of said outer chamber;
an exhaust output in another upper portion of said outer chamber;
a silane gas intake pipe running into said outer chamber and having its output under water in said water-filled chamber; and
a drain connected through a valve at a bottom portion of said water-filled chamber.
2. The silane abatement system according to claim 1 wherein said output of said silane gas intake pipe is into a C-shaped stainless steel pipe having upwardly opening flippers whereby silane gas is released into water within said water-filled chamber.
3. The silane abatement system according to claim 1 wherein said air intake and said exhaust output both comprise inwardly opening flippers.
4. The silane abatement system according to claim 1 further comprising an overflow drain at a bottom portion of said outer chamber.
5. The silane abatement system according to claim 1 further comprising:
a water supply pipe connected to said water-filled chamber;
a water level sensor connected to said water-filled chamber; and
a water temperature sensor connected to said water-filled chamber.
6. The silane abatement system according to claim 5 further comprising a controller that controls said water supply and monitors said water level sensor and said water temperature sensor.
7. The silane abatement system according to claim 6 wherein in the event that said controller detects an unacceptable condition from either of said water level sensor or said water temperature sensor, said air intake and said exhaust output are closed, and residue waste silane gas within said silane gas intake pipe is pumped into said water-filled chamber.
8. The silane abatement system according to claim 1 further comprising:
an exhaust pipe exiting said outer chamber through said exhaust output;
an exhaust temperature sensor connected to said exhaust pipe; and
a fusible link within said exhaust pipe.
9. The silane abatement system according to claim 8 wherein in the event that an unacceptable condition is detected in either of said exhaust temperature sensor or said fusible link, said air intake and said exhaust output are closed, and residue waste silane gas within said silane gas intake pipe is pumped into said water-filled chamber.
10. The silane abatement system according to claim 1 further comprising a high pressure pump connected to said silane gas intake pipe.
11. The silane abatement system according to claim 10 wherein said high pressure pump provides N2 gas for pushing silane gas through said gas intake pipe into said water-filled chamber.
12. The silane abatement system according to claim 1 further comprising a fusible link within said high pressure pump.
13. The silane abatement system according to claim 1 further comprising water sprinklers on an upper portion of said outer chamber and over said water-filled chamber.
14. The silane abatement system according to claim 1 further comprising water sprinklers on surfaces of said exhaust pipe.
15. The silane abatement system according to claim 1 wherein waste silane gas is abated by:
bubbling silane gas through said silane gas intake pipe and into said water-filled chamber;
reacting said silane gas with oxygen dissolved in water in said water-filled chamber whereby SiO2 precipitates are formed and wherein said SiO2 precipitates settle to a bottom surface of said water-filled chamber; and
opening said valve to drain said SiO2 precipitates out of said water-filled chamber through said drain.
16-17. (canceled)
18. A silane abatement system comprising:
a water-filled chamber within an outer chamber;
an air intake in one upper portion of said outer chamber;
an exhaust output in another upper portion of said outer chamber connecting to an exhaust pipe;
water sprinklers on an upper portion of said outer chamber and over said water-filled chamber and on surfaces of said exhaust pipe;
a silane gas intake pipe running into said outer chamber and having its output under water in said water-filled chamber; and
a drain connected through a valve at a bottom portion of said water-filled chamber.
19. The silane abatement system according to claim 18 wherein said output of said silane gas intake pipe is into a C-shaped stainless steel pipe having upwardly opening flippers whereby silane gas is released into water within said water-filled chamber.
20. The silane abatement system according to claim 18 wherein said air intake and said exhaust output both comprise inwardly opening flippers.
21. The silane abatement system according to claim 18 further comprising an overflow drain at a bottom portion of said outer chamber.
22. The silane abatement system according to claim 18 further comprising:
a water supply pipe connected to said water-filled chamber;
a water level sensor connected to said water-filled chamber;
a water temperature sensor connected to said water-filled chamber;
an exhaust temperature sensor connected to said exhaust pipe;
a fusible link within said exhaust pipe; and
a controller that controls said water supply and monitors said water level sensor, said water temperature sensor, said exhaust temperature sensor, and said fusible link.
23. The silane abatement system according to claim 18 further comprising a high pressure pump connected to said silane gas intake pipe having a fusible link within said high pressure pump.
24. The silane abatement system according to claim 18 wherein waste silane gas is abated by:
bubbling silane gas through said silane gas intake pipe and into said water-filled chamber;
reacting said silane gas with oxygen in water in said water-filled chamber whereby SiO2 precipitates are formed and wherein said SiO2 precipitates settle to a bottom surface of said water-filled chamber; and
opening said valve to drain said SiO2 precipitates out of said water-filled chamber through said drain.
25. The silane abatement system according to claim 22 wherein in the event that said controller detects an unacceptable condition from any of said water level sensor, said water temperature sensor, said exhaust temperature sensor, or said fusible link, said water sprinklers are triggered, said air intake and exhaust flippers are closed, and residue waste silane gas within said silane gas intake pipe is pumped into said water-filled chamber.
26. A silane abatement system comprising:
a water-filled chamber within an outer chamber;
an air intake in one upper portion of said outer chamber; and
a silane gas intake pipe running into said outer chamber and having its output under water in said water-filled chamber.
27. The silane abatement system according to claim 26 wherein waste silane gas is abated by:
flowing N2 gas at high pressure to push waste silane gas through said silane gas intake pipe into said water-filled chamber;
reacting said silane gas with oxygen dissolved in water in said water-filled chamber whereby SiO2 precipitates are formed and wherein said SiO2 precipitates settle to a bottom surface of said water-filled chamber; and
draining said SiO2 precipitates out of said water-filled chamber. surface of said water-filled chamber; and
draining said SiO2 precipitates out of said water-filled chamber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/217,780 US20060002830A1 (en) | 2001-09-21 | 2005-09-01 | Wet abatemenbt system for waste SiH4 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/957,424 US6949234B2 (en) | 2001-09-21 | 2001-09-21 | Wet abatement system for waste SiH4 |
US11/217,780 US20060002830A1 (en) | 2001-09-21 | 2005-09-01 | Wet abatemenbt system for waste SiH4 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/957,424 Division US6949234B2 (en) | 2001-09-21 | 2001-09-21 | Wet abatement system for waste SiH4 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060002830A1 true US20060002830A1 (en) | 2006-01-05 |
Family
ID=25499554
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/957,424 Expired - Lifetime US6949234B2 (en) | 2001-09-21 | 2001-09-21 | Wet abatement system for waste SiH4 |
US11/217,780 Abandoned US20060002830A1 (en) | 2001-09-21 | 2005-09-01 | Wet abatemenbt system for waste SiH4 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/957,424 Expired - Lifetime US6949234B2 (en) | 2001-09-21 | 2001-09-21 | Wet abatement system for waste SiH4 |
Country Status (2)
Country | Link |
---|---|
US (2) | US6949234B2 (en) |
SG (1) | SG108865A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110220342A1 (en) * | 2010-03-12 | 2011-09-15 | Applied Materials, Inc. | Methods and apparatus for selectively reducing flow of coolant in a processing system |
US10845229B2 (en) | 2018-07-11 | 2020-11-24 | Edwards Vacuum Llc | Monitoring system and method |
US11517831B2 (en) * | 2019-06-25 | 2022-12-06 | George Andrew Rabroker | Abatement system for pyrophoric chemicals and method of use |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5183646A (en) * | 1989-04-12 | 1993-02-02 | Custom Engineered Materials, Inc. | Incinerator for complete oxidation of impurities in a gas stream |
US5320817A (en) * | 1992-08-28 | 1994-06-14 | Novapure Corporation | Process for sorption of hazardous waste products from exhaust gas streams |
US5955037A (en) * | 1996-12-31 | 1999-09-21 | Atmi Ecosys Corporation | Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases |
US6126906A (en) * | 1998-06-18 | 2000-10-03 | Kanken Techno Co., Ltd. | Apparatus for removing harmful components in a semiconductor exhaust gas |
US6174349B1 (en) * | 1999-04-06 | 2001-01-16 | Seh America, Inc. | Continuous effluent gas scrubber system and method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4801437A (en) * | 1985-12-04 | 1989-01-31 | Japan Oxygen Co., Ltd. | Process for treating combustible exhaust gases containing silane and the like |
US5123836A (en) * | 1988-07-29 | 1992-06-23 | Chiyoda Corporation | Method for the combustion treatment of toxic gas-containing waste gas |
TW506852B (en) * | 2000-08-28 | 2002-10-21 | Promos Technologies Inc | Device and method for processing exhaust from process chamber |
-
2001
- 2001-09-21 US US09/957,424 patent/US6949234B2/en not_active Expired - Lifetime
-
2002
- 2002-08-08 SG SG200204794A patent/SG108865A1/en unknown
-
2005
- 2005-09-01 US US11/217,780 patent/US20060002830A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5183646A (en) * | 1989-04-12 | 1993-02-02 | Custom Engineered Materials, Inc. | Incinerator for complete oxidation of impurities in a gas stream |
US5320817A (en) * | 1992-08-28 | 1994-06-14 | Novapure Corporation | Process for sorption of hazardous waste products from exhaust gas streams |
US5955037A (en) * | 1996-12-31 | 1999-09-21 | Atmi Ecosys Corporation | Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases |
US6126906A (en) * | 1998-06-18 | 2000-10-03 | Kanken Techno Co., Ltd. | Apparatus for removing harmful components in a semiconductor exhaust gas |
US6174349B1 (en) * | 1999-04-06 | 2001-01-16 | Seh America, Inc. | Continuous effluent gas scrubber system and method |
Also Published As
Publication number | Publication date |
---|---|
US20030057576A1 (en) | 2003-03-27 |
US6949234B2 (en) | 2005-09-27 |
SG108865A1 (en) | 2005-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7494628B2 (en) | Apparatus for abatement of by-products generated from deposition processes and cleaning of deposition chambers | |
US6423284B1 (en) | Fluorine abatement using steam injection in oxidation treatment of semiconductor manufacturing effluent gases | |
JP5198786B2 (en) | Exhaust gas purification method and apparatus | |
JP2008520435A5 (en) | ||
US20060002830A1 (en) | Wet abatemenbt system for waste SiH4 | |
US20160166868A1 (en) | Plasma abatement using water vapor in conjunction with hydrogen or hydrogen containing gases | |
US20080310975A1 (en) | Methods and apparatus for a cogeneration abatement system for electronic device manufacturing | |
EP1450936A1 (en) | Method and apparatus for treating exhaust gas | |
JP4772223B2 (en) | Exhaust gas abatement apparatus and method | |
JP2006521925A (en) | Exhaust gas treatment method and apparatus | |
US5743939A (en) | Waste gas processing apparatus and method for semiconductor fabricating equipment | |
US7208127B2 (en) | Method for processing residual gas | |
JP2511363B2 (en) | Vacuum processing equipment | |
KR20090011467A (en) | A exhaust gas disposal appartus of semiconductor | |
CN115948723A (en) | MOCVD (Metal organic chemical vapor deposition) exhaust system and cleaning method | |
JP4629967B2 (en) | Method and apparatus for treating N2O-containing exhaust gas | |
CN103090399B (en) | Silane tail gas treatment deivce and method | |
JP4583880B2 (en) | Exhaust gas treatment method and treatment apparatus | |
KR101491497B1 (en) | Method for Removing Elemental Mercury in the Flue Gas | |
JP2001179051A (en) | Method and device for pretreatment for discharge of exhaust gas containing hydrogen | |
JPH0779949B2 (en) | Exhaust gas treatment device | |
JP4926151B2 (en) | Abatement equipment | |
JP4527595B2 (en) | Gel-like substance processing method and processing apparatus | |
KR101254969B1 (en) | Method for removing sulfur dioxide and elemental mercury from the flue gas | |
KR100311145B1 (en) | Powder trap device of semiconductor equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |