US20050226076A1 - Method for increasing stability of system memory through enhanced quality of supply power - Google Patents
Method for increasing stability of system memory through enhanced quality of supply power Download PDFInfo
- Publication number
- US20050226076A1 US20050226076A1 US10/907,420 US90742005A US2005226076A1 US 20050226076 A1 US20050226076 A1 US 20050226076A1 US 90742005 A US90742005 A US 90742005A US 2005226076 A1 US2005226076 A1 US 2005226076A1
- Authority
- US
- United States
- Prior art keywords
- power
- capacitor
- connector
- expansion
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
Definitions
- the present invention generally relates to increasing the system memory performance of a computer, and more particularly by enhancing the quality of the supply power fed to the system memory.
- a trend in the computer industry has been the increase of the bus speed and all associated devices, primarily the interface between the main processor and the chipset including memory controller as well as the interface between the memory controller and the memory devices known as the memory bus.
- the memory devices are running at memory bus speed.
- VRM voltage regulation module
- Contemporary mainboard (motherboard) technology is using fast switching power management controllers that are supplemented by onboard capacitors for buffering of fast positive or negative voltage transients. Since the requirements for the circuitry lack detailed specifications it is up to the mainboard manufacturers to provide a solution deemed sufficient for delivering adequate supply and termination voltages. In most cases, the embodiment of choice is a single phase solution at minimum manufacturing cost. Despite the use of capacitors, this arrangement is not sufficient to provide optimal supply current to the memory devices, especially under load switching conditions.
- the present invention provides an apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard.
- the apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board.
- the connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin.
- the at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.
- a significant advantage of this invention is that an apparatus is provided capable of buffering voltage transients, that is, overshoots as well as undershoots, within the memory power subsystem by means of capacitors coupled to the subsystem through an expansion slot.
- another advantage of the invention is the ability and ease of upgrading existing systems having an empty expansion slot.
- FIG. 1 is an electrical schematic of a memory VRM of a type known in the art.
- FIG. 2 schematically represents a typical configuration for a memory VRM on a motherboard.
- FIG. 3 represents a capacitor module in accordance with one embodiment of the present invention.
- FIG. 4 is an electrical schematic of the capacitor module of FIG. 3 , representing capacitors between the power and ground pins of the module.
- FIG. 5 is an electrical schematic of a capacitor module with two capacitors in parallel between each power and ground pin in accordance with another embodiment of the present invention.
- FIG. 6 schematically represents the motherboard of FIG. 2 with a capacitor module of this invention inserted in a memory expansion slot on the motherboard.
- FIG. 7 is an electrical schematic of FIG. 6 and shows how the capacitor module in the third memory expansion slot interacts through the shared power and ground traces with the entire memory VRM.
- the present invention makes possible enhancements in the quality of the system memory power supply on a computer motherboard by utilizing empty expansion slots, such as empty memory slots, present on the motherboard.
- FIG. 1 which is an electrical schematic of a memory VRM of a type known in the art, the power and ground circuitry for all memory slots on a conventional motherboard is unified.
- Such an arrangement offers the possibility of using a power supplement that conforms to the form factor used in the memory devices in any empty memory interface, since it will interact with the remaining power circuitry in the same fashion as a memory device.
- FIG. 2 schematically represents a typical configuration for a memory VRM on a computer motherboard 10 with four empty memory expansion slots 22 .
- FIG. 2 also shows a central processor 12 and chipset 14 on the motherboard 10 .
- the expansion slots 22 are conventionally powered through MOSFET's 16 that are regulated by a memory controller 18 , as is well known in the art. Ripple currents and spikes are buffered to some extent by onboard capacitors 20 conventionally mounted to the motherboard 10 .
- the controller 16 uses a feedback loop from the output voltage to regulate the MOSFET's 16 , which receive input voltage and are connected to ground.
- Two resistors (R 1 and R 2 ) are shown in FIG. 1 as being used in the feedback loop to generate a reference voltage for the controller 18 .
- the two capacitors 20 in FIG. 2 are identified as C Out and C 1 in FIG. 1 .
- FIG. 3 represents a module 24 suitable for insertion into one of the memory slots 22 of the motherboard 10 of FIG. 2 for the purpose of enhancing the system memory power supply in accordance with a preferred aspect of this invention.
- the module 24 is in the form of a printed circuit board 26 with a connector 28 along one of its edges.
- the module 24 is shown as being equipped with multiple capacitors 30 for the purpose of buffering voltage transients within the power subsystem supplying the memory on the motherboard 10 .
- the module 24 can be referred to as a capacitor module.
- FIG. 4 is an electrical schematic of the capacitor module 24 of FIG. 3 .
- the capacitors 30 can be of any suitable type, such as electrolytic or tantalum capacitors 30 .
- the multiple capacitors 30 of the module 24 may have different capacitances.
- capacitors with lower capacitance are able to charge and discharge faster than capacitors with higher capacitance, which are therefore more inert.
- a combination of capacitors with capacitance values of about 100 ⁇ F and about 1000 ⁇ F should have the advantage of buffering relatively large fluctuations as well as reacting to relatively smaller, faster transients.
- FIG. 6 schematically represents the motherboard 10 of FIG. 2 with the capacitor module 24 of FIGS. 3 and 4 installed in the third of four memory expansion slots 22 on the motherboard 10 .
- FIG. 7 is an electrical schematic of FIG. 6 and evidences the manner in which the capacitor module 24 in the third memory expansion slot 22 is able to advantageously interact through the shared power and ground traces of the memory bus with the entire memory VRM.
- a notable advantage of using the module 24 of this invention to buffer voltage transients in the memory power subsystem of a motherboard is the proximity of the memory interfaces to each other in most commercially available systems. That is, for reasons of signal integrity and trace length matching, most memory slots (e.g., 22 in FIGS. 2 and 6 ) are placed very close to each other, and usually closer to each other than to the memory voltage regulator module. This, in turn, warrants the fastest possible interaction of any auxiliary power structures with any other memory device present in the system and sharing the same power and ground planes.
- FIG. 5 is an electrical schematic of another capacitor module 34 within the scope of this invention.
- the module 34 differs from the module 24 of FIGS. 3 and 4 as a result of being equipped with two capacitors 30 in parallel between pairs of power and ground pins 32 .
- This particular embodiment allows the use of physically smaller capacitors, which is advantageous in terms of space constraints (especially in server environments), while maintaining a high buffering capacitance.
- the embodiment of FIG. 5 is also useful in situations where capacitors with different capacitance values are to be used in combination, as described above.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Sources (AREA)
Abstract
Description
- This application claims the benefit of U.S. Provisional Application No. 60/521,320, filed Mar. 31, 2004.
- The present invention generally relates to increasing the system memory performance of a computer, and more particularly by enhancing the quality of the supply power fed to the system memory.
- A trend in the computer industry has been the increase of the bus speed and all associated devices, primarily the interface between the main processor and the chipset including memory controller as well as the interface between the memory controller and the memory devices known as the memory bus. The memory devices are running at memory bus speed.
- Aside from obvious speed issues that the memory devices can be subjected to, another concern relates to power draw of the individual devices as well as their aggregates in the form of memory modules. The power draw is proportional to the operating frequency, meaning that at lower operating frequencies, the devices will draw less power than at higher frequency. In addition to the raw issue of power draw, a major concern is the switching frequency of the devices, that is, how fast the transition from, e.g., a low power state in the form of active standby or even open page state to a four bank interleaved read occurs. The rapid switching between the different power states requires equally rapid switching capabilities of the power supply units as well as buffering capabilities of the entire voltage regulation module (VRM). The demand on the VRM increases with either overclocking or else increased system memory density, that is, more memory that needs to be powered. In this case, the state change of each module within the system can lead to interactions on the level of power supply between different modules, that can result in voltage peaks and valley, either of which can adversely affect the operability and stability of all memory devices within the system.
- Contemporary mainboard (motherboard) technology is using fast switching power management controllers that are supplemented by onboard capacitors for buffering of fast positive or negative voltage transients. Since the requirements for the circuitry lack detailed specifications it is up to the mainboard manufacturers to provide a solution deemed sufficient for delivering adequate supply and termination voltages. In most cases, the embodiment of choice is a single phase solution at minimum manufacturing cost. Despite the use of capacitors, this arrangement is not sufficient to provide optimal supply current to the memory devices, especially under load switching conditions.
- The present invention provides an apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.
- In view of the above, it can be seen that a significant advantage of this invention is that an apparatus is provided capable of buffering voltage transients, that is, overshoots as well as undershoots, within the memory power subsystem by means of capacitors coupled to the subsystem through an expansion slot. As such, another advantage of the invention is the ability and ease of upgrading existing systems having an empty expansion slot.
- Other objects and advantages of this invention will be better appreciated from the following detailed description.
-
FIG. 1 is an electrical schematic of a memory VRM of a type known in the art. -
FIG. 2 schematically represents a typical configuration for a memory VRM on a motherboard. -
FIG. 3 represents a capacitor module in accordance with one embodiment of the present invention. -
FIG. 4 is an electrical schematic of the capacitor module ofFIG. 3 , representing capacitors between the power and ground pins of the module. -
FIG. 5 is an electrical schematic of a capacitor module with two capacitors in parallel between each power and ground pin in accordance with another embodiment of the present invention. -
FIG. 6 schematically represents the motherboard ofFIG. 2 with a capacitor module of this invention inserted in a memory expansion slot on the motherboard. -
FIG. 7 is an electrical schematic ofFIG. 6 and shows how the capacitor module in the third memory expansion slot interacts through the shared power and ground traces with the entire memory VRM. - The present invention makes possible enhancements in the quality of the system memory power supply on a computer motherboard by utilizing empty expansion slots, such as empty memory slots, present on the motherboard. As evident from
FIG. 1 , which is an electrical schematic of a memory VRM of a type known in the art, the power and ground circuitry for all memory slots on a conventional motherboard is unified. Such an arrangement offers the possibility of using a power supplement that conforms to the form factor used in the memory devices in any empty memory interface, since it will interact with the remaining power circuitry in the same fashion as a memory device. -
FIG. 2 schematically represents a typical configuration for a memory VRM on acomputer motherboard 10 with four emptymemory expansion slots 22. For reference,FIG. 2 also shows acentral processor 12 andchipset 14 on themotherboard 10. Theexpansion slots 22 are conventionally powered through MOSFET's 16 that are regulated by amemory controller 18, as is well known in the art. Ripple currents and spikes are buffered to some extent byonboard capacitors 20 conventionally mounted to themotherboard 10. As represented inFIG. 1 , thecontroller 16 uses a feedback loop from the output voltage to regulate the MOSFET's 16, which receive input voltage and are connected to ground. Two resistors (R1 and R2) are shown inFIG. 1 as being used in the feedback loop to generate a reference voltage for thecontroller 18. The twocapacitors 20 inFIG. 2 are identified as COut and C1 inFIG. 1 . -
FIG. 3 represents amodule 24 suitable for insertion into one of thememory slots 22 of themotherboard 10 ofFIG. 2 for the purpose of enhancing the system memory power supply in accordance with a preferred aspect of this invention. As with a conventional memory module, themodule 24 is in the form of a printedcircuit board 26 with aconnector 28 along one of its edges. However, instead of featuring actual memory devices connected to power andground pins 32 of theconnector 28, themodule 24 is shown as being equipped withmultiple capacitors 30 for the purpose of buffering voltage transients within the power subsystem supplying the memory on themotherboard 10. As such, themodule 24 can be referred to as a capacitor module. Eachcapacitor 30 is shown connected to a single pair of VDD (power/+) and VSS (ground/−)pins 32 of theconnector 28. All other pins on theconnector 28 are no-connects.FIG. 4 is an electrical schematic of thecapacitor module 24 ofFIG. 3 . - The
capacitors 30 can be of any suitable type, such as electrolytic ortantalum capacitors 30. Furthermore, themultiple capacitors 30 of themodule 24 may have different capacitances. In particular, capacitors with lower capacitance are able to charge and discharge faster than capacitors with higher capacitance, which are therefore more inert. As an example, a combination of capacitors with capacitance values of about 100 μF and about 1000 μF should have the advantage of buffering relatively large fluctuations as well as reacting to relatively smaller, faster transients. -
FIG. 6 schematically represents themotherboard 10 ofFIG. 2 with thecapacitor module 24 ofFIGS. 3 and 4 installed in the third of fourmemory expansion slots 22 on themotherboard 10.FIG. 7 is an electrical schematic ofFIG. 6 and evidences the manner in which thecapacitor module 24 in the thirdmemory expansion slot 22 is able to advantageously interact through the shared power and ground traces of the memory bus with the entire memory VRM. - As evident from
FIGS. 6 and 7 , a notable advantage of using themodule 24 of this invention to buffer voltage transients in the memory power subsystem of a motherboard is the proximity of the memory interfaces to each other in most commercially available systems. That is, for reasons of signal integrity and trace length matching, most memory slots (e.g., 22 inFIGS. 2 and 6 ) are placed very close to each other, and usually closer to each other than to the memory voltage regulator module. This, in turn, warrants the fastest possible interaction of any auxiliary power structures with any other memory device present in the system and sharing the same power and ground planes. -
FIG. 5 is an electrical schematic of anothercapacitor module 34 within the scope of this invention. Themodule 34 differs from themodule 24 ofFIGS. 3 and 4 as a result of being equipped with twocapacitors 30 in parallel between pairs of power andground pins 32. This particular embodiment allows the use of physically smaller capacitors, which is advantageous in terms of space constraints (especially in server environments), while maintaining a high buffering capacitance. Alternatively or in addition, the embodiment ofFIG. 5 is also useful in situations where capacitors with different capacitance values are to be used in combination, as described above. - While the invention has been described in terms of a preferred embodiment, it is apparent that other forms could be adopted by one skilled in the art. For example, the physical configuration of the
modules
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/907,420 US7310240B2 (en) | 2004-03-31 | 2005-03-31 | Method for increasing stability of system memory through enhanced quality of supply power |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52132004P | 2004-03-31 | 2004-03-31 | |
US10/907,420 US7310240B2 (en) | 2004-03-31 | 2005-03-31 | Method for increasing stability of system memory through enhanced quality of supply power |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050226076A1 true US20050226076A1 (en) | 2005-10-13 |
US7310240B2 US7310240B2 (en) | 2007-12-18 |
Family
ID=35060378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/907,420 Active 2025-12-21 US7310240B2 (en) | 2004-03-31 | 2005-03-31 | Method for increasing stability of system memory through enhanced quality of supply power |
Country Status (1)
Country | Link |
---|---|
US (1) | US7310240B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070239387A1 (en) * | 2006-04-06 | 2007-10-11 | Daniel Douriet | Apparatus and Method for Selectively Monitoring Multiple Voltages in an IC or other Electronic Chip |
US20140185255A1 (en) * | 2013-01-02 | 2014-07-03 | iJet Technologies, Inc. | Method to Use Empty Slots in Onboard Aircraft Servers and Communication Devices to Install Non-Proprietary Servers and Communications Interfaces |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101796116B1 (en) | 2010-10-20 | 2017-11-10 | 삼성전자 주식회사 | Semiconductor device, memory module and memory system having the same and operating method thereof |
CN102929331A (en) * | 2011-08-08 | 2013-02-13 | 鸿富锦精密工业(深圳)有限公司 | Expansion device for solid state drives and mainboard supporting expansion device |
CN115757216A (en) * | 2021-09-03 | 2023-03-07 | 戴尔产品有限公司 | Storage drive with capacitor module |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4780797A (en) * | 1987-12-16 | 1988-10-25 | Tansitor Electronic, Inc. | Capacitor tantalum surface for use as a counterelectrode device and method |
US5369547A (en) * | 1993-03-22 | 1994-11-29 | The Evans Findings Co., Ltd. | Capacitor |
US5638255A (en) * | 1995-12-15 | 1997-06-10 | Lucent Technologies Inc. | Power protection and distribution module |
US5962979A (en) * | 1998-08-24 | 1999-10-05 | Lutron Electronics Co., Inc. | Asymmetrical bus capacitors |
US6219221B1 (en) * | 1998-05-15 | 2001-04-17 | Nec Corporation | Electrical double layer capacitor having short-circuit function |
US6510041B1 (en) * | 1997-09-30 | 2003-01-21 | Elna Kabushiki Kaisha | Electrolytic capacitor unit for audio apparatus |
US7027308B2 (en) * | 2002-10-15 | 2006-04-11 | Samsung Electronics Co., Ltd. | Printed circuit board method and apparatus |
-
2005
- 2005-03-31 US US10/907,420 patent/US7310240B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4780797A (en) * | 1987-12-16 | 1988-10-25 | Tansitor Electronic, Inc. | Capacitor tantalum surface for use as a counterelectrode device and method |
US5369547A (en) * | 1993-03-22 | 1994-11-29 | The Evans Findings Co., Ltd. | Capacitor |
US5638255A (en) * | 1995-12-15 | 1997-06-10 | Lucent Technologies Inc. | Power protection and distribution module |
US6510041B1 (en) * | 1997-09-30 | 2003-01-21 | Elna Kabushiki Kaisha | Electrolytic capacitor unit for audio apparatus |
US6219221B1 (en) * | 1998-05-15 | 2001-04-17 | Nec Corporation | Electrical double layer capacitor having short-circuit function |
US5962979A (en) * | 1998-08-24 | 1999-10-05 | Lutron Electronics Co., Inc. | Asymmetrical bus capacitors |
US7027308B2 (en) * | 2002-10-15 | 2006-04-11 | Samsung Electronics Co., Ltd. | Printed circuit board method and apparatus |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070239387A1 (en) * | 2006-04-06 | 2007-10-11 | Daniel Douriet | Apparatus and Method for Selectively Monitoring Multiple Voltages in an IC or other Electronic Chip |
US7469199B2 (en) * | 2006-04-06 | 2008-12-23 | International Business Machines Corporation | Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chip |
US20140185255A1 (en) * | 2013-01-02 | 2014-07-03 | iJet Technologies, Inc. | Method to Use Empty Slots in Onboard Aircraft Servers and Communication Devices to Install Non-Proprietary Servers and Communications Interfaces |
Also Published As
Publication number | Publication date |
---|---|
US7310240B2 (en) | 2007-12-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7360104B2 (en) | Redundant voltage distribution system and method for a memory module having multiple external voltages | |
US8261102B2 (en) | Power management system capable of saving power and optimizing operating efficiency of power supplies for providing power with back-up or redundancy to plural loads | |
US6363450B1 (en) | Memory riser card for a computer system | |
US9298228B1 (en) | Memory capacity expansion using a memory riser | |
US8753138B2 (en) | Memory module connector with auxiliary power | |
US10453516B2 (en) | Memory module voltage regulator module (VRM) | |
US7310240B2 (en) | Method for increasing stability of system memory through enhanced quality of supply power | |
CN211959077U (en) | Computer power supply assembly | |
EP1600844A2 (en) | Method and apparatus for increasing computer memory performance | |
CN102880269A (en) | Internal memory power supply system | |
JP4199777B2 (en) | Power supply system and notebook personal computer | |
US7796459B2 (en) | Memory voltage control circuit | |
CN113687706B (en) | Device and method for automatically adjusting whether NCSI is opened or not | |
US20140125128A1 (en) | Power redundancy apparatus for rack-mounted server | |
CN101369261B (en) | Motherboard supporting composite memory | |
US20130120924A1 (en) | Power supply system for memory modules and adapter board thereof | |
US7525861B2 (en) | Memory power delivery noise suppression | |
US20070186119A1 (en) | Power system capable of reducing interference between voltage output ports on a daughter board | |
CN115543059B (en) | Processor, processor system and system on chip | |
CN216528037U (en) | Solid state disk and wide-voltage input system thereof | |
CN217955102U (en) | Mixed heterogeneous bearing board card, computer and intelligent computing system | |
CN100419635C (en) | Memory voltage generating circuit | |
US20130091364A1 (en) | Random access memory module with driving voltage adaptor and computing apparatus | |
Kwon et al. | Efficient server power supply configuration for cloud computing data center | |
CN113625857A (en) | Server power supply assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OCZ TECHNOLOGY GROUP, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PETERSEN, RYAN M.;REEL/FRAME:016047/0500 Effective date: 20050404 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
AS | Assignment |
Owner name: WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT, CALIFO Free format text: SECURITY AGREEMENT;ASSIGNOR:OCZ TECHNOLOGY GROUP, INC.;REEL/FRAME:028440/0866 Effective date: 20120510 |
|
AS | Assignment |
Owner name: OCZ TECHNOLOGY GROUP, INC., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT;REEL/FRAME:030088/0443 Effective date: 20130311 |
|
AS | Assignment |
Owner name: HERCULES TECHNOLOGY GROWTH CAPITAL, INC., CALIFORN Free format text: SECURITY AGREEMENT;ASSIGNOR:OCZ TECHNOLOGY GROUP, INC.;REEL/FRAME:030092/0739 Effective date: 20130311 |
|
AS | Assignment |
Owner name: COLLATERAL AGENTS, LLC, NEW YORK Free format text: SECURITY AGREEMENT;ASSIGNOR:OCZ TECHNOLOGY GROUP, INC.;REEL/FRAME:031611/0168 Effective date: 20130812 |
|
AS | Assignment |
Owner name: OCZ STORAGE SOLUTIONS, INC., CALIFORNIA Free format text: CHANGE OF NAME;ASSIGNOR:TAEC ACQUISITION CORP.;REEL/FRAME:032365/0945 Effective date: 20140214 Owner name: TAEC ACQUISITION CORP., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OCZ TECHNOLOGY GROUP, INC.;REEL/FRAME:032365/0920 Effective date: 20130121 |
|
AS | Assignment |
Owner name: TAEC ACQUISITION CORP., CALIFORNIA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE AND ATTACH A CORRECTED ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 032365 FRAME 0920. ASSIGNOR(S) HEREBY CONFIRMS THE THE CORRECT EXECUTION DATE IS JANUARY 21, 2014;ASSIGNOR:OCZ TECHNOLOGY GROUP, INC.;REEL/FRAME:032461/0486 Effective date: 20140121 |
|
AS | Assignment |
Owner name: OCZ TECHNOLOGY GROUP, INC., CALIFORNIA Free format text: RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 031611/0168);ASSIGNOR:COLLATERAL AGENTS, LLC;REEL/FRAME:032640/0455 Effective date: 20140116 Owner name: OCZ TECHNOLOGY GROUP, INC., CALIFORNIA Free format text: RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 030092/0739);ASSIGNOR:HERCULES TECHNOLOGY GROWTH CAPITAL, INC.;REEL/FRAME:032640/0284 Effective date: 20140116 |
|
FEPP | Fee payment procedure |
Free format text: PAT HOLDER NO LONGER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: STOL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: TOSHIBA CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OCZ STORAGE SOLUTIONS, INC.;REEL/FRAME:038434/0371 Effective date: 20160330 |
|
AS | Assignment |
Owner name: TOSHIBA MEMORY CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TOSHIBA CORPORATION;REEL/FRAME:043620/0430 Effective date: 20170706 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 12 |
|
AS | Assignment |
Owner name: K.K. PANGEA, JAPAN Free format text: MERGER;ASSIGNOR:TOSHIBA MEMORY CORPORATION;REEL/FRAME:055659/0471 Effective date: 20180801 Owner name: KIOXIA CORPORATION, JAPAN Free format text: CHANGE OF NAME AND ADDRESS;ASSIGNOR:TOSHIBA MEMORY CORPORATION;REEL/FRAME:055669/0001 Effective date: 20191001 Owner name: TOSHIBA MEMORY CORPORATION, JAPAN Free format text: CHANGE OF NAME AND ADDRESS;ASSIGNOR:K.K. PANGEA;REEL/FRAME:055669/0401 Effective date: 20180801 |