US20050083648A1 - Methods and apparatuses for transferring heat from microelectronic device modules - Google Patents
Methods and apparatuses for transferring heat from microelectronic device modules Download PDFInfo
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- US20050083648A1 US20050083648A1 US10/686,864 US68686403A US2005083648A1 US 20050083648 A1 US20050083648 A1 US 20050083648A1 US 68686403 A US68686403 A US 68686403A US 2005083648 A1 US2005083648 A1 US 2005083648A1
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- heat transfer
- fin
- microelectronic device
- module
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
- The present invention relates generally to methods and apparatuses for transferring heat from microelectronic device modules.
- In response to end-user demand, the computer industry has continually reduced the size of computer components while increasing the capabilities of the components. As the size of computer components decreases and the computing power of these components increases, it becomes increasingly difficult to transfer heat away from the components at an adequate rate. As a result, some components can overheat and fail. In other cases, the speed and/or other operating parameters of the components can become limited by the inability to reject heat from the components at a rapid enough rate.
- One approach to addressing the foregoing problems has been to use heat transfer devices to accelerate the rate at which heat is rejected from computer components. For example, as shown in
FIG. 1A , a module assembly 10 a in accordance with the prior art can include a printedcircuit board 11 which carries two packagedchips 12.Heat spreaders 13 are attached to each side of the printedcircuit board 11 proximate to the packagedchips 12. A thermallyconductive gap filler 14 is disposed between eachheat spreader 13 and the adjacent packagedchip 12. Accordingly, theheat spreaders 13 can provide additional surface area (beyond that of the packagedchips 12 themselves) by which to convectively remove heat from the packagedchips 12. Devices such as those shown inFIG. 1A are available from Rambus of Los Altos, Calif. - One potential drawback with the device shown in
FIG. 1A is that theheat spreaders 13 alone may not be adequate to cool the packagedchips 12 at a rapid enough rate. One approach to addressing this potential drawback is to add a finned heat sink to the module assembly 10 a. For example, as shown inFIG. 1B , amodule assembly 10 b in accordance with another aspect of the prior art includes twoheat sinks 15, one disposed adjacent to each of theheat spreaders 13. Theheat spreaders 13 are positioned adjacent to the packaged chips 12 (as indicated by arrows A), theheat sinks 15 are positioned against the heat spreaders 13 (as indicated by arrows B), and aclip 16 is disposed around themodule assembly 10 b (as indicated by arrow C) to keep the components in close thermal contact with each other. - One drawback with the
module assembly 10 b shown inFIG. 1B is that the fins of theheat sinks 15 can preclude spacingadjacent module assemblies 10 b close to each other and can therefore make it difficult to decrease the size of the computer or other electronic device into which the module assemblies 10 are installed. Another drawback is that the relatively large number of components included in eachmodule assembly 10 b can make assembling themodule 10 b a time consuming process, and can reduce the thermal continuity between one component and the next. -
FIGS. 1A-1B illustrate packaged chip module assemblies having heat transfer devices in accordance with the prior art. -
FIG. 2 is a partially schematic, isometric exploded illustration of a module assembly having a heat transfer device in accordance with an embodiment of the invention. -
FIG. 3 is a partially schematic, cross-sectional illustration of a plurality of module assemblies installed in a computer in accordance with an embodiment of the invention. -
FIGS. 4A-4D are partially schematic, cross-sectional illustrations of module assemblies having heat transfer devices in accordance with further embodiments of the invention. - A. Introduction
- The present invention is directed to methods and apparatuses for transferring heat from microelectronic devices, including, but not limited to, packaged memory chips. An apparatus in accordance with one embodiment of the invention includes a first heat transfer portion positioned to face toward a first surface of a computer chip module, and a second heat transfer portion positioned to face toward a second surface of the computer chip module. The second heat transfer portion can face generally opposite from the first heat transfer portion, and at least a part of the first heat transfer portion can be spaced apart from the second heat transfer portion to receive the computer chip module. An intermediate portion can be disposed between the first and second heat transfer portions, and the apparatus can further include first and second heat transfer fins that each extend away from at least one of the first heat transfer portion, the second heat transfer portion, and the intermediate portion. The first heat transfer fin can have a first length, and the second heat transfer fin can have a second length different than the first length. In another aspect of the invention, the heat transfer fins can be integrally formed with at least one of the foregoing portions.
- A computer assembly in accordance with another aspect of the invention includes a support and a first connector carried by the support. The first connector can have a receptacle with a first insertion axis positioned at an acute first angle relative to the support. A second connector carried by the support can have a receptacle with a second insertion axis positioned at an acute second angle relative to the support. The assembly can further include a first module having a first end region spaced apart from the support and being received in the first receptacle. A second module having a second end region spaced apart from the support can be received in the second receptacle. A first heat sink carried by the first module can have at least one first fin oriented at an acute third angle relative to the support, and a second heat sink carried by the second module can have at least one second fin oriented at an acute fourth angle relative to the support. The at least one second fin can be positioned proximate to the first end region of the first module, with the first end region being interposed between the at least one second fin and the support.
- A method in accordance with another aspect of the invention includes mounting a first connector to a support, the first connector having a receptacle with a first insertion axis positioned at an acute first angle relative to the support. A second connector can be mounted to the support and can have a receptacle with a second insertion axis positioned at an acute second angle relative to the support. The method can further include receiving a first module in the first receptacle, receiving a second module in the second receptacle, positioning a first heat sink in thermal communication with the first module, and positioning a second heat sink in thermal communication with the second module. At least one fin of the second heat sink can be positioned proximate to an end region of the first module, with the end region of the first module being interposed between the at least one second fin and the support.
- B. Apparatuses and Methods in Accordance with Embodiments of the Invention
- Several specific details of the invention are set forth in the following description and in
FIGS. 2-4D to provide a thorough understanding of certain embodiments of the invention. One skilled in the art, however, will understand that the present invention may have additional embodiments, and that other embodiments of the invention may be practiced without several of the specific features explained in the following description. -
FIG. 2 is a partially schematic, partially exploded view of a portion of a computer or otherelectronic device 100 having components cooled in accordance with an embodiment of the invention. In one aspect of this embodiment, the components can includemicroelectronic devices 112 mounted to asubstrate 111 to form amodule 120. In one aspect of this embodiment, thesubstrate 111 can include a printed circuit board (PCB), and themicroelectronic devices 112 can include packaged memory chips. In other embodiments, thesubstrate 111 can include other structures, and/or themicroelectronic devices 112 can have other structures and/or functions. In any of these embodiments, themicroelectronic devices 112 can be electrically coupled tocontacts 122 for electrical communication with other devices located off themodule 120. Themodule 120 can include afirst side 121 a facing opposite from asecond side 121 b. In one aspect of this embodiment, both thefirst side 121 a and thesecond side 121 b can includemicroelectronic devices 112 or other microelectronic devices. In other embodiments, only a single side 121 of themodule 120 can include such devices, as described in greater detail below with reference toFIG. 4A . In any of these embodiments, themicroelectronic devices 112 can be cooled with an integrally formed, finned heat transfer device, as described in greater detail below. - In one aspect of an embodiment shown in
FIG. 2 , themodule 120 can be cooled with aheat transfer device 130 having afirst portion 131 a and asecond portion 131 b. Each of the first andsecond portions first region 136 a and asecond region 136 b. Thefirst regions 136 a can be separated by agap 133, and thesecond regions 136 b can be connected with anintermediate portion 131 c. Theheat transfer device 130 can further include one or more heat transfer fins 132 (two are shown inFIG. 2 as afirst fin 132 a and asecond fin 132 b). In one aspect of this embodiment, thefirst fin 132 a can have a first length L1, and thesecond fin 132 b can have a second L2 that is different than the first length L1. As will be described in greater detail below with reference toFIG. 3 , the different lengths of the first andsecond fins module 120, while also allowingadjacent modules 120 to be positioned closely to each other. - To assemble the
heat transfer device 130 with themodule 120, theheat transfer device 130 can be positioned over themodule 120, as indicated by arrows E so that themodule 120 is received in thegap 133. In one aspect of this embodiment, a thermally conductive paste or other formable, thermallyconductive material 114 can be disposed on the outward facing surfaces of themicroelectronic devices 112, and/or on the inward facing surfaces of the first andsecond portions conductive material 114 can increase the rate at which heat is transferred from themicroelectronic devices 112 to the first andsecond portions heat transfer device 130 can be attached to themodule 120 with an adhesive, or withmechanical fasteners 135, or with the friction between the surfaces of themicroelectronic devices 112 and the first andsecond portions - In one aspect of the foregoing embodiments, the
heat transfer device 130 can include a highly thermally conductive metallic material, such as aluminum or copper. In other embodiments, theheat transfer device 130 can include other metallic or nonmetallic materials that are also highly thermally conductive. In any of these embodiments, the fins 132 can be integrally formed with the other portions of theheat transfer device 130, (e.g., the first, second, and intermediate portions 131 a-131 c). For example, the entireheat transfer device 130 can be molded as a single piece so as to have no readily separable mechanical connections between its component parts. An advantage of this arrangement is that theheat transfer device 130 can provide a single, continuous and uninterrupted heat conductive path between themicroelectronic devices 112 and the environment external to themodule 120. A further advantage is that theheat transfer device 130 can be less time consuming to install on themodule 120. - The
module 120 can be electrically coupled to thecomputer 100 before or after theheat transfer device 130 is coupled to themodule 120. In one embodiment, thecomputer 100 includes a chassis 101 (a portion of which is visible inFIG. 2 ) and asupport 102 positioned to receive themodule 120. Thesupport 102 can include a printed circuit board, (e.g., a motherboard), or another suitable support structure. Thesupport 102 can also include aconnector 103 having areceptacle 104 positioned to receive thecontacts 122 of themodule 120. In one aspect of this embodiment, thereceptacle 104 can have a slot configuration to receive thecontacts 122. Accordingly, themodule 120 can be inserted into thereceptacle 104 along aninsertion axis 105, as indicated by arrows F. In one aspect of this embodiment, theinsertion axis 105 can be inclined relative to thesupport 102 at an acute angle G. As described in greater detail below with reference toFIG. 3 , this arrangement can allowmultiple modules 120 to be positioned in close proximity to each other while also allowing heat to be transferred away from the first andsecond fins -
FIG. 3 is a partially schematic, cross-sectional illustration of thecomputer 100 with a plurality ofmodule assemblies 110 installed in accordance with an embodiment of the invention. In one aspect of this embodiment, eachmodule assembly 110 can include amodule 120 and aheat transfer device 130. Eachmodule assembly 110 can be inserted into acorresponding connector 103 and can accordingly be inclined at the acute angle G relative to thesupport 102. In one embodiment, angle G can have a value of from about 30 degrees to about 60 degrees relative to thesupport 102. In a particular aspect of this embodiment, the angle G can have a value of about 45 degrees. In other embodiments, the angle G can have other acute values. In any of the foregoing embodiments, thefins module assembly 110 can extend adjacent to thefins end region 117 of anadjacent module assembly 110. An advantage of this arrangement is that themodule assemblies 110 can be installed in close proximity to each other without thefins module assembly 110 interfering with thefins Suitable connectors 103 having the foregoing features are available from Molex, Inc. of Lisle, Ill. - In one embodiment, the
computer 100 can include anadjacent structure 106 positioned proximate to thesupport 102 and themodule assemblies 110. In a particular aspect of this embodiment, theadjacent structure 106 can include a power supply or a portion of thechassis 101. In other embodiments, theadjacent structure 106 can include other components. In any of these embodiments, theadjacent structure 106 can be spaced apart from thesupport 102 by a distance D. Accordingly, thefins adjacent structure 106. In still another aspect of this embodiment, thelonger fin 132 b is positioned closer to thecorresponding connector 103 than is theshorter fin 132 a. This arrangement is possible in part because themodule assemblies 110 are inclined at the acute angle G relative to thesupport 102. An advantage of this arrangement is that thelonger fin 132 b can increase the rate at which heat is transferred away from themodule assembly 120. Accordingly, providing theheat sink 130 with fins having different lengths can make increased use of the limited space available between thesupport 102 and theadjacent structure 106. - In other embodiments, a computer or other
electronic device 100 can carry module assemblies having different arrangements. For example, as shown inFIG. 4A , thecomputer 100 can carrymodule assemblies 410 a, each of which includesmicroelectronic devices 112 positioned on only one side of asubstrate 411. A correspondingheat transfer device 430 a of eachmodule assembly 410 a can accordingly include aheat transfer portion 431 carrying a plurality ofheat transfer fins 432 a (three are shown inFIG. 4A ). In one aspect of this embodiment, theheat transfer device 430 a can be releasably attached to the module 420 with aclip 434. In other embodiments, theheat transfer device 430 a can be coupled to the module 420 with other devices. In any of these embodiments, themodule assemblies 410 a can be oriented at an acute angle G relative to thesupport 102, and theheat transfer fins 432 a can extend adjacent to anend region 417 of the neighboringmodule assembly 410 a. Adjacentheat transfer fins 432 a can have different lengths to take advantage of the tapered volume between the module 420 and theadjacent structure 106. Accordingly, themodule assemblies 410 a can be relatively closely spaced while still providing a relatively high rate of heat transfer from themicroelectronic devices 112. - In another embodiment shown in
FIG. 4B , a computer or otherelectronic device 100 can supportmodule assemblies 410 b having a different arrangement ofheat transfer fins 432 b. In one aspect of this embodiment, theheat transfer fins 432 b can extend generally normal to thesupport 102 and theadjacent structure 106. In another aspect of this embodiment, theheat transfer fins 432 b can be attached to a module 420 that is inclined at an acute angle H having a value less than that of angle G shown inFIG. 3 . In a particular aspect of this embodiment, the acute angle H can be about 30 degrees. In other embodiments, the acute angle H can have other values. In any of these embodiments, theheat transfer fins 432 b can enhance the rate at which heat is removed from the corresponding module 420 without interfering with theheat transfer fins 432 b of the adjacent module 420. For example, each module 420 can be generally parallel to its neighbor, and theheat transfer fins 432 b of eachmodule assembly 410 b can be generally parallel to those of the neighboringmodule assembly 410 b. - In still another embodiment (shown in
FIG. 4C ) a computer or otherelectronic device 100 can support a plurality ofmodule assemblies 410 c, each inclined at an acute angle G relative to thesupport 102, and each having aheat transfer device 430 c with a singleheat transfer fin 432 c. In one aspect of this embodiment, theheat transfer fins 432 c can also be inclined at the acute angle G. Accordingly, adjacent modules 420 c can be generally parallel to each other, and theheat transfer fins 432 c ofadjacent module assemblies 410 c can also be generally parallel to each other as described above. This arrangement can allow close spacing betweenadjacent module assemblies 410 c while permitting enhanced heat transfer from eachmodule assembly 410 c. - In still a further embodiment (shown in
FIG. 4D ) a computer or otherelectronic device 100 can supportmodule assemblies 420 d that do not overlap each other but instead extend generally normal to thesupport 102 and theadjacent structure 106. Eachmodule assembly 420 d can include an integrally formedheat transfer device 430 d havingheat transfer fins 432 d. In one aspect of this embodiment, theheat transfer fins 432 d can be oriented at an acute angle J relative to thesupport 102 and/or theadjacent structure 106. Accordingly, adjacent module assemblies 410 d can be generally parallel to each other, and theheat transfer fins 432 d of adjacent module assemblies 410 d can also be generally parallel to each other. - From the foregoing, it will be appreciated that specific embodiments of the invention have been described herein for purposes of illustration, but that various modifications may be made without deviating from the spirit and scope of the invention. Other embodiments of the invention can include the features described above arranged in combinations not explicitly described with reference to
FIGS. 2-4D . Accordingly, the invention is not limited except as by the appended claims.
Claims (38)
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US10/686,864 US6888719B1 (en) | 2003-10-16 | 2003-10-16 | Methods and apparatuses for transferring heat from microelectronic device modules |
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US10/686,864 US6888719B1 (en) | 2003-10-16 | 2003-10-16 | Methods and apparatuses for transferring heat from microelectronic device modules |
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