US20040201134A1 - Forming method of magnetic body, magnetic body, and printed circuit board - Google Patents

Forming method of magnetic body, magnetic body, and printed circuit board Download PDF

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Publication number
US20040201134A1
US20040201134A1 US10/831,428 US83142804A US2004201134A1 US 20040201134 A1 US20040201134 A1 US 20040201134A1 US 83142804 A US83142804 A US 83142804A US 2004201134 A1 US2004201134 A1 US 2004201134A1
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United States
Prior art keywords
circuit board
printed circuit
magnetic body
rubber
fe
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Abandoned
Application number
US10/831,428
Inventor
Hideharu Kawai
Toru Matsuzaki
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Hideharu Kawai
Toru Matsuzaki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2001233559A priority Critical patent/JP4638626B2/en
Priority to JP2001-233559 priority
Priority to US10/209,394 priority patent/US6758999B2/en
Application filed by Hideharu Kawai, Toru Matsuzaki filed Critical Hideharu Kawai
Priority to US10/831,428 priority patent/US20040201134A1/en
Publication of US20040201134A1 publication Critical patent/US20040201134A1/en
Application status is Abandoned legal-status Critical

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/04Fixed inductances of the signal type with magnetic core
    • H01F17/06Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • H01F41/0246Manufacturing of magnetic circuits by moulding or by pressing powder
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/04Fixed inductances of the signal type with magnetic core
    • H01F17/06Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F2017/065Core mounted around conductor to absorb noise, e.g. EMI filter
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • H05K2201/086Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1327Moulding over PCB locally or completely
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Abstract

A method of forming a magnetic body, alternative to a ferrite core, on a printed circuit board is provided. A printed circuit board is set in a mold and injection molding is conducted. The mold comprises a fixed plate, an intermediate plate and a movable plate. A cavity in the intermediate plate is filled with a melted material (i.e., mixture of resin and magnetic filler) supplied via a sprue and a runner. A cavity in the movable plate is also filled with the material supplied to the cavity in the intermediate plate through a hole in the printed circuit board. When a magnetic body for noise control is directly injection molded onto the printed circuit board in such a way, no gap appears between the magnetic body and the printed circuit board. As a result, the magnetic body functions well as desired.

Description

    FIELD OF THE INVENTION
  • This invention relates to a method of forming a magnetic body, such as a choke or transformer core, on a printed circuit board, the magnetic body, and the printed circuit board on which the magnetic body is formed. [0001]
  • BACKGROUND OF THE INVENTION
  • FIG. 4A shows a conventional method for providing a ferrite core and the like on a printed circuit board, for noise control or for use in transformer and choke coil. In this case, a ferrite core is formed and split into two pieces in advance. The split ferrite core pieces [0002] 51 a, 51 b are then attached to a printed circuit board 3, respectively, from both sides and glued to each other via attachment holes 5, 5 created beforehand.
  • However, since a ferrite core is typically molded from compacted ferrite material by a sintering molding process, it is difficult to form the core to the desired measurements and shape. Thus, it is necessary to grind the sinter molded ferrite core to the desired dimensions after the core is sintered. Also, if the maximum tolerances of the sintered ferrite core are too great, the distances to adjacent electronic components on a printed circuit board must be at least as great as the tolerances, and this could prevent high density packaging. Moreover, a ferrite core which is made too thin is likely to break or get chipped when dropped or in transit. [0003]
  • Additionally, if the ferrite core pieces [0004] 51 a, 51 b are attached as above, gaps 57 are likely to appear between the respective ferrite core pieces 51 a, 51 b and a circuit pattern 6 on the printed circuit board 3 as illustrated in FIG. 4B. A gap 57 between the circuit pattern 6 and the ferrite core pieces 51 a, 51 b causes a decline in magnetic properties of the ferrite core, which increases rapidly as the gap 57 increases.
  • SUMMARY OF THE INVENTION
  • An object of the present invention is to provide a magnetic body, and a manufacturing method thereof, as an alternative to a ferrite core or similar shape, for noise control and for use in transformers and choke coils. [0005]
  • In order to attain the above object, the present invention discloses a method of forming a magnetic body by preparing a magnetic material by mixing and melting at least a magnetic filler and a binder containing one or more kinds of resin, setting a printed circuit board in a mold, and injection molding to or around the printed circuit board using the magnetic material, by which the magnetic body is formed to cover a circuit pattern on the printed circuit board. [0006]
  • According to such a forming method, the magnetic body includes resin as binder, and is thereby more resistant to shocks than ferrite alone. Owing to injection molding of the body, the molding tolerances are reduced to 10% of that of the case of sintering molding. Accordingly, there is no need to grind the magnetic body after it is formed. Also, it is possible to arrange the magnetic body close to other electronic components which are generally provided on a printed circuit board (including a flexible board). Thus, high density packaging is realized. [0007]
  • In another aspect of the present invention, the magnetic body is formed in such a manner that it is appressed to the printed circuit board as a result of the injection molding process. Wherein the term “appressed” means that a magnetic body [0008] 7 is formed as a single, unitary body without unwanted gaps therein or unwanted gaps between the magnetic body and the printed circuit board.
  • In this way, a decline in magnetic properties which results from gaps between the printed circuit board and the magnetic body is prevented. [0009]
  • With injection molding, it is easy to have the magnetic body appressed to the printed circuit board. [0010]
  • In further aspect of the present invention, a gate for supplying the melted material to a cavity of the mold is in the form of pin gate. [0011]
  • In this case, a cross section of the gate becomes small and a trace of the gate on the molded magnetic body is not obtrusive, or clearly distinct. Therefore, the gate can be provided at any desired position, even when two magnetic bodies (or a magnetic body and another member) are molded adjacently. [0012]
  • In another aspect of the present invention, the printed circuit board has at least one through-hole in an area where the magnetic body is formed, and material is supplied to form the magnetic body on both sides of the printed circuit board via the through-hole. [0013]
  • In this way, the magnetic body is formed on both sides of the printed circuit board at one time, and it is not necessary to use adhesives and the like to hold the magnetic body fast to the printed circuit board. [0014]
  • In another aspect of the present invention, the magnetic body is formed to cover an electronic component mounted on the printed circuit board. [0015]
  • The covered electronic component is protected from noise. The electronic component to be covered may be a pin, resistance or condenser. Other electronic components can be covered as well. [0016]
  • As explained above, such a magnetic body can function to the full extent, and it does not need be ground after formed. [0017]
  • Additionally, the magnetic body may be formed on only one side of the printed circuit board. [0018]
  • On such a printed circuit as well, the magnetic body can be set adjacent to other electronic components, and high density packaging can be attained.[0019]
  • BRIEF DESCRIPTION OF THE DRAWING FIGURES
  • The invention will now be described, by way of example, with reference to the accompanying drawing, in which: [0020]
  • FIGS. 1A-1C are explanatory views which illustrate the forming of a magnetic body [0021] 7 for noise control or for use as a transformer or choke coil on a printed circuit board 3 according to the present invention.
  • FIGS. 2A and 2B are explanatory views which illustrate forming of the magnetic body [0022] 7 in a mold.
  • FIGS. 3A-3D are explanatory views of a magnetic body [0023] 43 for use in transformer, formed according to the present invention.
  • FIGS. 4A and 4B are explanatory views of prior art using ferrite core pieces [0024] 51 a, 51 b for noise control.
  • FIGS. 5A-5C are explanatory views of an experiment which measures effect by making a magnetic body fast to a printed circuit board.[0025]
  • DETAILED DESCRIPTION OF THE INVENTION
  • FIGS. 1A-1C, [0026] 2A and 2B show how a printed circuit board 3 according to the present invention is produced. With regard to components in those figures, the same reference numbers as those in FIGS. 4A and 4B are used to represent the same components, so far as such use of the same numbers does not cause unnecessary confusion. As an example, a case is described in which a magnetic body for noise control is provided in a position X on the printed circuit board 3 of FIG. 1A. As in the prior art, attachment holes 5, 5 are created in the printed circuit board 3 in advance. The printed circuit board 3 is then set in a mold 11 as shown in FIG. 2A to perform the injection molding process. This mold 11 comprises a fixed plate 11 a, an intermediate plate 11 b and a movable plate 11 c. A melted material 11 d comprised of a magnetic material filler and a binder is filled into a cavity 17 b via a sprue 13, a runner 15 and a gate 16.
  • FIG. 2B is a sectional view taken along the line B-B in FIG. 2A. The cavity [0027] 17 b on the intermediate plate 11 b communicates to a cavity 17 c on the movable plate 11 c via one or more holes 5 in the printed circuit board 3. The material 11 d supplied to the cavity 17 b reaches and fills the cavity 17 c through one or more holes 5, 5. With regard to components of the material 11 d to be filled, soft ferrite is used as a magnetic filler, and PA12 is used as binder. In this example, the gate 16, which is an inflow opening which supplies the material to the cavity 17 b, is in the form of pin gate. However, the gate 16 may be in the form of side gate or submarine gate.
  • FIG. 1B shows a portion of the printed circuit board [0028] 3 after direct injection molding by which, for example, a magnetic body 7 for noise control is formed on the printed circuit board 3. The magnetic body 7 appears similar to conventional ferrite cores pieces 51 a, 51 b. However, as can be seen in FIG. 1C which is a sectional view taken along the line A-A in FIG. 1B, no gap 57 appears in the magnetic body 7 or between the magnetic body 7 and the printed circuit board 3. Consequently, the magnetic body 7 for noise control can function well and without degradation of its magnetic properties.
  • An experiment was conducted on respective cases in which the magnetic body [0029] 7 is appressed to the printed circuit board 3 by the method of the present invention and in which the magnetic body 7 is not appressed to the printed circuit board 3. FIG. 5A shows the case in which the magnetic body 7 is appressed to the printed circuit board in accordance with the present invention. As shown, a magnetic body mixed resin and ferrite is appressed to and around a measuring cable 21. FIG. 5B shows the case in which the magnetic body is not appressed to the printed circuit board according to the present invention and gaps 57 of 0.5 mm are formed between the measuring cable 21 and respective pieces of the magnetic body 23. FIG. 5C is a graph showing the result of measurement by impedance analyzer 25 of impedance frequency characteristics in both cases. A lateral axis represents frequency and a longitudinal axis represents impedance. A full line shows the case of having no gap (FIG. 5A), and a dotted line shows the case of having gaps (FIG. 5B). As can be seen from this graph, when the magnetic body mixed resin 23 is appressed to the measuring cable 21 by the method of the present invention, superior impedance frequency characteristics were achieved.
  • In other words, from this graph, it is understood that higher impedance is achieved at any frequency in the case of having no gap compared to the case of having gaps. The higher the impedance is, the higher and superior the noise absorption is. [0030]
  • A magnetic body [0031] 7 of the present invention is also break resistant since PA12 is used as binder. Accordingly, the magnetic body 7 does not easily break or get chipped, unlike the ferrite core pieces 51 a, 51 b, which break easily. In addition, since the magnetic body 7 is formed as a single, unitary body extending to both sides of the printed circuit board 3, gluing is not necessary, as in the case of ferrite core pieces 51 a, 51 b. Also, since the forming tolerance is reduced to 10% of that of the case in using a sintered product, post-forming processing like grinding becomes unnecessary, and thus it is possible to simplify the manufacturing process. By the same reason, the distances to adjacent electronic components can be made smaller, and thus high density packaging can be realized.
  • In the above, an embodiment of the present invention is described. However, the present invention is not limited to the above embodiment, and other modifications and variations are possible within the scope of the present invention. [0032]
  • For instance, in the present embodiment, soft ferrite is used for magnetic material. However, other materials such as hard ferrite, amorphous in Fe, Fe—Si, Fe—Si—Al, Fe—Si—Cr, Fe—Ni, Fe—Cr, and Co system, Fe-based nanocrystal can be used. In addition, the magnetic filler made from such magnetic materials can be formed in any shape, such as round, flat, etc. [0033]
  • Also, the binder can be thermoplastic resin such as EVA (Ethylen-Vinylacetate copolymer), EVOH (Ethylene-Vinylalcohol-Copolymer), PVC (PlyVinylChloride), CPE (Chlorinated polyethylene), CA (Cellulose-Acetate), POM (PolyOxyMethylene), PA (PolyAmide), PAR (Polyarylate), TPU (Thermoplastic Polyurethane), TPE (Thermoplastic-Elastomer), LCP (Liquid Crystal Polymer), PEEK (PolyEtherEtherKetone), PSU (Polysulphone), PES (PolyEtherSulfone), HDPE (High Density Polyethylene), LDPE (Low Density Polyethylene), LLDPE (Linear Low Density Polyethylene), PET (PolyEthylene Terephthalate), PC (PolyCarbonate), PS (PolyStyrene), PPE (PolyPhenyleneEther), PPO (PolyPhenyleneOxide), PPS (PolyPhenyleneSulfide), PBD (PolyButadiene), PBT (PolyButhylene Terephthalate), PP (PolyPropylene), PMMA (PolyMethylMethAcrylate), PMP (Polymethylpentene) and BP (Butyl Phthalate), thermosetting resin such as EP (Epoxy resin), PDAP (Polydiallyl Phthalate), SI (Silicone), PF (Phenol-Formaldehyde), UP (Unsaturated Polyester), PI (Polyimide), PUR (Polyurethane), MF (Melamine-Formaldehyde) and UF (Urea-Formaldehyde), vulcanized rubber such as SBR (Styrene-Butadiene Rubber), NBR (Nitril-Butadiene Rubber), IR (Isoprene Rubber), CR (Chloroprene-Rubber), BR (Butadiene Rubber), IIR (Isobutylene-Isoprene Rubber), EPDM (Ethylene-Propylene-Diene Methylene linkage), CSM (ChloroSulfonated Polyethylene), AR (Acrylic rubber), FR (Fluorine Rubber), VMQ (Silicone Rubber), ECO (Epichlorhydrin Rubber) and EU (PolyeterUrethane rubber), polyurethane or silicone thermoplastic rubber, liquid rubber or elastomer. [0034]
  • In addition, and for example, a magnetic transformer body [0035] 43, as shown in FIG. 3B, may be formed on the printed circuit board 3 on which three attachment holes 41 are created as shown in FIG. 3A. In this case as well, the magnetic transformer body 43 having an 8-shaped cross section as shown in FIG. 3C can be formed appressed to the printed circuit board 3. Furthermore, when setting the printed circuit board 3 in the mold, it is possible to insert a sintered ferrite plate 45 or a magnetic metal plate 45 in the cavity before performing the injection molding. Then, it is possible to form a magnetic body 7 containing a sintered ferrite plate 45 as shown in FIG. 3D.
  • Moreover, a magnetic body [0036] 7 for choke coil may be formed on the printed circuit board 3. It is also possible to form a magnetic body 7 only on one side of the printed circuit board 3. Additionally, the circuit pattern 6 can be a signal line, power line, ground line, transformer circuit pattern or choke coil pattern.

Claims (19)

1-8. (CANCELED).
9. A printed circuit board on which a magnetic body is formed by a method of:
preparing a melted material by mixing and melting at least a magnetic filler and a binder including at least one resin,
setting the printed circuit board into a mold, and
performing molding to the printed circuit board using the melted material,
wherein the magnetic body is formed on at least one side of the printed circuit board, and
the magnetic body is formed to cover at least a portion of a circuit pattern on the printed circuit board.
10. The printed circuit board according to claim 9, wherein said magnetic body is formed such that the magnetic body is appressed to said printed circuit board.
11. The printed circuit board according to claim 9, wherein said performing molding step includes an injection molding.
12. The printed circuit board according to claim 11, wherein a gate, used as an inflow opening for supplying said melted material to a cavity of said mold during the injection molding step, is one of a pin gate, a side gate and a submarine gate.
13. The printed circuit board according to claim 9, wherein:
the printed circuit board further comprises;
at least one through hole,
a first surface side, and
a second surface side,
wherein the through hole forms a passageway for the melted material to communicate with both the first surface side and the second surface side of the printed circuit board, and
the magnetic body is formed on both sides of the printed circuit board.
14. The printed circuit board according to claim 9, wherein said magnetic body is formed from one soft ferrite, hard ferrite, amorphous in Fe, Fe—Si, Fe—Si—Al, Fe—Se—Cr, Fe—Ni, Fe—Cr and Co system, and Fe-based nanocrystal.
15. The printed circuit board according to claim 9, wherein said binder is selected from thermoplastic resin such as EVA (Ethylene-Vinyl acetate copolymer), EVOH (Ethylene-Vinyl alcohol-Copolymer, PVC (PolyVinylChloride), CPE (Chlorinated polyethylene), CA (Cellulose-Acetate), POM (PolyOxyMethylene), PA (PolyAmide), PAR (Polyarylate), TPU (Thermoplastic Polyurethane), TPE (Thermoplastic-Elastomer), LCP (Liquid Crystal Plymer0, PEEK (PolyEtherEtherKetone), PSU (Polysulphone), PES (PolyEtherSulphone), LLDPE (Linear Low Density Polyethylene), PET (PolyEthylene Terephthalate), PC 9PolyCarbonate0, PS 9PolyStyrene0, PPE (PolyPhenyleneEther), PPO (PolyPhenyleneOxide), PPS (PolyPhenyleneSulfide), PBD (PolyButadiene), PBT (PolyButhylene Terephthalate), PP (PolyPropylene), PMMA (PolyMethylMethAcrylate), PMP (Polymethylpentene) and BP (Butyl Phthalate), thermosetting resin such as EP (Epoxy resin), PDAP (Polydiallyl Phthalate), SI (Silicone), PF (Phenol-Formaldehyde), UP (Unsaturated Polyseter0, PI (Polyimide), PUR (Polyurethane0, MF (Melamine-Formaldehyde) and UF (Urea-Formaldehyde), vulcanized rubber such as SBR (Styrene-Butadiene Rubber0, NBR (Nitril-Butadiene Rubber), IIR (Isobutylene-Isoprene Rubber), EPDM (Ethylene-Propylene-Diene Methylene linkage), CSM (CholroSulfonated Polyethylene), AR (Acrylic rubber), FR (Fluorine Rubber), VMQ (Silicone Rubber), ECO (Epichlorhydrin Rubber) and EU (PolyeterUrethane rubber), polyurethane or silicone thermoplastic rubber, liquid rubber and elastomer.
16. The printed circuit board according to claim 9, wherein said circuit pattern is one of a signal line pattern, a power line pattern, a ground line pattern, a transformer circuit patter and a choke coil pattern.
17. The printed circuit board according to claim 9, further comprising:
at least one magnetic plate,
wherein the at least one magnetic plate is inserted into the mold containing the printed circuit board prior to molding a melted material, and
the melted material covers at least a portion of the magnetic plate and the circuit pattern of the printed circuit board.
18. The printed circuit board according to claim 17, wherein the magnetic plate is at least one of a sintered ferrite plate and a magnetic metal plate.
19. A printed circuit board on which a magnetic body is formed by a method of:
preparing a melted material by mixing and melting at least a magnetic filler and a binder including at least one resin,
setting the printed circuit board into a mold, and
performing molding to the printed circuit board using the melted material,
wherein the magnetic body is formed on at least one side of the printed circuit board, and
the magnetic body is formed to cover at least a portion of an electronic component on the printed circuit board.
20. The printed circuit board according to claim 19, wherein said magnetic body is formed such that the magnetic body is appressed to said printed circuit board.
21. The printed circuit board according to claim 19, wherein said performing molding step includes an injection molding.
22. The printed circuit board according to claim 21, wherein a gate, used as an inflow opening for supplying said melted material to a cavity of said mold during the injection molding step, is one of a pin gate, a side gate and a submarine gate.
23. The printed circuit board according to claim 19, wherein:
the printed circuit board further comprises;
at least one through hole,
a first surface side, and
a second surface side,
wherein the through hole forms a passageway for the melted material to communicate with both the first and second surface side of the printed circuit board, and
the magnetic body is formed on both sides of the printed circuit board.
24. The printed circuit board according to claim 19, wherein said magnetic body is formed from one of the soft ferrite, hard ferrite, amorphous in Fe, Fe—Si, Fe—Si—Al, Fe—Si—Cr, Fe—Ni, Fe—Cr and Co system, and Fe-based nanocrystal.
25. The printed circuit board according to claim 19, wherein said binder is selected from thermoplastic resin such as (EVA (Ethylene-Vinyl acetate copolymer), EVOH (Ethylene-Vinyl alcohol-Copolymer), PVC (PolyVinylChloride), CPE (Chlorinated polyethylene), CA (Cellulose-Acetate), Pom (PolyOxyMethylene), PA (PoluAmide), PAR (Polyarylate), TPU (Thermoplastic Polyurethane), TPE (thermoplastic-Elastomer), LCP (Liquid Crystal Polymer), PEEK (PolyEtherEtherKetone), PSU (Polysulphone), PES (PolyEtherSulfone), HDPE (High Density Polyethylene), LDPE (Low Density Polyethylene), LLDPE (Linear Low Density Polyethylene), PPE (PolyPhenyleneEther), PPO (PolyPhenyleneOxide), PPS (PolyPhenyleneSulfide), PBD (PolyButadiene), PBT (PolyButhylene Terephthalate), PP (PolyPropylene), PMMA (PolyMethylMethAcrylate), PMP (Polymethylpentene) and BP (Butyl Phthalate), thermosetting resin such as EP (Epoxy resin), PDAP (Polydiallyl Phthalate), SI (Silicone), PF (Phenol-Formaldehyde), UP (Unsaturated Polyester), PI (Polyimide), PUR (Polyurethane), MF (Melamine-Formaldehyde) and UF (Urea-Formaldehyde), vulcanized rubber such as SBR (Styrene-Butadiene Rubber), NBR (Nitril-Butadiene Rubber), IR (Isoprene Rubber, CR (Chloroprene-Rubber), BR (Butadiene Rubber), IIR (Isobutylene-Isoprene Rubber), EPDM, Ethylene-Propylene-Diene Methylene linkage), CSM (ChloroSulfonated Polyethylene), AR (Acrylic rubber), FR (Fluorine Rubber0, VMQ (Silicone Rubber), ECO (Epichlorhydrin Rubber) and EU (PolyeterUrethane rubber), polyurethane or silicone thermoplastic rubber, liquid rubber and elastomer.
26. The printed circuit board according to claim 19, wherein the electronic component is one of a pin, a resistance, and a condenser.
US10/831,428 2001-08-01 2004-04-23 Forming method of magnetic body, magnetic body, and printed circuit board Abandoned US20040201134A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001233559A JP4638626B2 (en) 2001-08-01 2001-08-01 Molding method, a magnetic material a magnetic material, and printed circuit board
JP2001-233559 2001-08-01
US10/209,394 US6758999B2 (en) 2001-08-01 2002-07-30 Forming method of magnetic body and printed circuit board
US10/831,428 US20040201134A1 (en) 2001-08-01 2004-04-23 Forming method of magnetic body, magnetic body, and printed circuit board

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US9833190B2 (en) 2008-10-07 2017-12-05 Mc10, Inc. Methods of detecting parameters of a lumen
US9894757B2 (en) 2008-10-07 2018-02-13 Mc10, Inc. Extremely stretchable electronics
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US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
US10325951B2 (en) 2017-06-12 2019-06-18 Mc10, Inc. Methods and applications of non-planar imaging arrays

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EP1282143A2 (en) 2003-02-05
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US6758999B2 (en) 2004-07-06
EP1282143B1 (en) 2010-04-14

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