US20040084210A1 - Apparatus and method for interconnection between a component and a printed circuit board - Google Patents
Apparatus and method for interconnection between a component and a printed circuit board Download PDFInfo
- Publication number
- US20040084210A1 US20040084210A1 US10/625,216 US62521603A US2004084210A1 US 20040084210 A1 US20040084210 A1 US 20040084210A1 US 62521603 A US62521603 A US 62521603A US 2004084210 A1 US2004084210 A1 US 2004084210A1
- Authority
- US
- United States
- Prior art keywords
- pcb
- signal routing
- routing layer
- array
- padless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09545—Plated through-holes or blind vias without lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
- Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
Definitions
- Embodiments of the present invention relate to printed circuit board (PCB) technology and more particularly to interconnecting a component with a PCB.
- PCB printed circuit board
- a BGA component 110 may be interconnected with a printed circuit board (PCB) 120 by aligning an array of solder balls 112 having an array pitch “P” with a corresponding array of contact pads, such as contact pads 122 and 124 , formed on a top surface of the PCB 120 .
- the solder balls 112 may be reflowed to make electrical connections between the solder balls 112 and the contact pads 122 and 124 .
- a layer of solder mask 160 may prevent solder from wicking to adjacent contact pads during reflow.
- the PCB 120 has numerous layers of conductive traces to route signals from the BGA component 110 to other electronic components mounted on both sides of the PCB 120 .
- the PCB 120 may also have a number of vias to route signals from contact pads to the signal routing layers. For example, a signal may travel from the solder ball 112 to the contact pad 122 and through a via 130 to a conductive trace on a bottom surface signal routing layer.
- the via 130 is typically formed by drilling a hole through the contact pad 122 and plating the drilled hole with a plating material 132 . For example, a hole having a diameter D 1 from 10-16 mils may be drilled through a contact pad having a diameter D 3 from 18-24 mils.
- one or more conductive traces may be routed between adjacent contact pads 122 and 124 .
- the BGA array pitch may shrink and the contact pads may occupy a larger percentage of signal routing area beneath the BGA component which may prevent signal routing between adjacent contact pads.
- One approach to increase the signal routing area is to reduce the diameter of the contact pads.
- Another approach to increase signal routing area is to reduce the width and spacing of conductive traces. However, this approach may require more complicated manufacturing processes which may increase overall PCB cost.
- FIG. 1 illustrates a cross-sectional view of a printed circuit board (PCB) with a via according to the prior art.
- FIG. 2 illustrates a cross-sectional view of an exemplary system comprising a PCB according to one embodiment of the present invention.
- FIG. 4 illustrates a flow diagram of a method to fabricate a PCB according to one embodiment of the present invention.
- FIG. 5 illustrates a cross-sectional view of a PCB with a blind padless via according to one embodiment of the present invention.
- FIG. 6 illustrates a cross-sectional view of a PCB with a padless via with a via plug according to one embodiment of the present invention.
- FIG. 7 illustrates a cross-sectional view of a PCB with a padless via with a conductive via plug according to one embodiment of the present invention.
- FIG. 8 illustrates a cross-sectional view of a PCB with a padless via with a conductive via plug according to another embodiment of the present invention.
- FIG. 9 is a table comparing routable conductive traces between interconnections having different diameters for various component pitches.
- Embodiments of the present invention may increase signal routing area on a printed circuit board (PCB) by forming vias without contact pads (“padless vias”).
- An electronic component such as a ball grid array (BGA) component may be attached to the PCB with solder interconnections between the padless vias and contact pads on a bottom surface of the electronic component.
- BGA ball grid array
- conductive traces may be routed between padless vias and adjacent interconnections even for reduced pitch BGA components, which may reduce a total number of PCB layers needed for signal routing and may reduce overall PCB cost.
- These conductive traces may have a standard width and spacing which may further reduce overall PCB cost.
- the component 210 may be, for example, an electronic component, such as a processor, a chipset, a memory, a memory controller, graphics controller, etc., housed in a BGA package or a leadless surface mount package.
- the PCB 220 may be a computer system motherboard and the component 210 may be a processor.
- the component 210 may be a socket for mounting an electronic component, such as a BGA socket or a land grid array (LGA) socket.
- LGA land grid array
- the PCB 220 may have a number of signal routing layers, such as top surface signal routing layer 240 , and one or more conductive planes, such as conductive plane 245 .
- the signal routing layers may have a plurality of conductive traces 242 and 244 to route signals to and from the component 210 .
- the padless via 230 may extend from the top surface signal routing layer 240 to a bottom surface signal routing layer 250 .
- a conductive trace on the bottom surface signal routing layer 250 may be in electrical contact with a plating material 232 formed on an inner surface of the padless via 230 .
- the padless via 230 may be in electrical contact with the conductive plane 245 , which may be a power or ground plane.
- a layer of solder mask material 260 may be deposited over the top surface signal routing layer 240 , with openings to expose the padless via 230 and the contact pad 234 .
- the openings may allow attachment of solder balls 212 , which may be used for electrical interconnection with the component 210 .
- the solder mask material 260 may prevent solder from the solder balls 212 from wicking to adjacent interconnections during a reflow process.
- FIG. 3 illustrates a top view of the PCB 220 with the layer of solder mask material 260 removed to allow a view of the top surface routing layer 240 .
- the contact pad 234 may be in electrical contact with the conductive trace 244 on the top surface signal routing layer 240 . Therefore, a via may not be required to route a signal from the contact pad 234 to another PCB layer and the contact pad 234 may have a smaller diameter D 3 than traditional contact pads.
- traditional contact pads may be in the range of 18 to 32 mils
- the contact pad 234 may have a diameter less than 18 mils because a via will not be drilled through it.
- the contact pad 234 may also have a diameter approximately equal to the diameter of the padless via 230 , for example, 12 mils. As illustrated, the reduced diameter of the padless vias 230 and the contact pad 234 may allow the conductive traces 242 and 244 to be routed between adjacent interconnections. It should be noted, however, that the dimensions of the padless vias and contact pads shown in FIG. 4 are exemplary only, and embodiments of the present invention may have any suitable combination of padless vias and contact pads arranged in any suitable pattern, for example, corresponding to contact pads of a component to be attached to the PCB.
- FIG. 4 illustrates a flow diagram 400 illustrating exemplary operations of a method to fabricate a PCB according to one embodiment of the present invention.
- a first signal routing layer is formed on a first surface of a PCB.
- the first signal routing layer may be formed by any suitable process. Comment: FIG. 4 shows step 430 as a required plugging step. Note that plugging may not be required.
- an array of interconnections is formed on the first surface of the PCB, the array of interconnections comprising at least one padless via extending from the first signal routing layer to at least one conductive plane and/or a second signal routing layer, wherein the at least one padless via is in electrical contact with the at least one conductive plane and/or a conductive trace on the second signal routing layer.
- the array of interconnections may include any suitable combination of contact pads and padless vias, which may be formed by any suitable methods.
- the padless via 230 may be formed by drilling a hole through the top surface signal routing layer 240 and plating the drilled hole with the plating material 232 . Because the hole is not drilled through a contact pad, the padless via 230 may have an outer diameter D 1 equal to a diameter of the drilled hole. Any suitable drilling technique may be used, such as mechanical drilling, laser drilling and plasma drilling. Drilled holes having a diameter less than 8 mils may be achieved using such methods. However, as drilling technologies progress, the achievable diameter of drilled holes may decrease.
- the drilled hole may be plated according to any suitable method, such as electrodeposition or electroless plating.
- the plating material 232 may be any suitable conductive material, such as copper or silver, and may be plated to any suitable thickness.
- a drilled hole having a diameter D 1 of 12 mils may be plated with the plating material 232 to a thickness of 1 mil, resulting in the padless via 230 having an inner diameter D 2 of 10 mils.
- the padless via 230 may extend from the top surface routing layer 240 to the bottom surface routing layer 250 .
- a blind padless via 530 may be formed in a PCB 520 extending from a top surface signal routing layer 540 to an inner layer 545 .
- the inner layer 545 may be an inner signal routing layer or a conductive plane. It may be an advantage that the blind padless via 530 does not extend below inner layer 545 , and therefore does not occupy routing area on signal routing layers below inner layer 545 .
- a via plug may be formed in the padless via.
- a top-side via plug 262 may prevent solder from solder ball 212 from wicking into the padless via 230 which may leave insufficient solder for electrical connection between the padless via 230 and the contact pad 234 .
- the top-side via plug 262 may be formed by allowing the solder mask material 260 to flow into the padless via 230 during formation of the layer of solder mask. After curing, a top portion of the solder mask material 260 in the padless via may be removed, for example, by laser ablation, leaving the top-side via plug 262 .
- a via plug 662 may be formed by depositing a solder mask material 660 on a bottom surface of a PCB 620 , and allowing the solder mask material 660 to flow into a padless via 630 .
- a conductive via plug 762 may be formed of an electrically conductive material, which may provide a greater conductive surface for electrical connection with a solder ball 712 .
- the conductive via plug 762 may be formed by filling a padless via 730 formed in a PCB 720 with an electrically conductive material, which may be any suitable electrically conductive material, such as a solder or a silver-filled epoxy.
- a conductive via plug may be formed by overplating a padless via, such as the blind padless via 530 and removing a top portion of the plating material 532 , for example, by etching. Further, for some embodiments of the present invention, padless vias may not require via plugs.
- a component is attached to the PCB, with a solder interconnection between the at least one padless via and a contact pad on a bottom surface of the component.
- the component 210 may be attached to the PCB 220 by aligning solder balls 212 attached to the contact pads 214 of the component 210 with the padless via 230 and the adjacent contact pad 234 and reflowing the solder balls 212 to electrically couple the contact pads 214 to the plating material 232 of the padless vias 230 and the adjacent contact pad 234 .
- the solder balls 212 may be made of any suitable solder material, such as a common lead-tin alloy. Alternatively, the solder balls 212 may be made of a lead free solder, such as a tin-copper alloy. The solder balls 212 may be reflowed according to any suitable reflow process. For some embodiments of the present invention, in an effort to avoid trapping air, moisture, or gas, which may expand during reflow and create a void or open in a solder joint, a solder ball may be formed with a solder shell solder surrounding a solid center of a material having a higher melting temperature than the solder shell.
- FIG. 8A illustrates a solder ball 812 having a solder shell 814 surrounding a solid center 816 .
- the solder shell 814 may be made of a lead-free solder, for example, having a melting temperature of approximately 410° F.
- the center ball may be made of aluminum or copper, having melting temperatures of approximately 1221° F. or 1981° F., respectively.
- the solid center 816 may have a diameter D 3 greater than an inner diameter D 2 of a padless via 830 formed in a PCB 820 .
- the padless via 830 may have an inner diameter D 2 of 10 mils
- the solid center 816 may have a diameter D 3 of 20 mils.
- the solid center 816 may come in contact with a plating material 832 during reflow of the solder shell 814 , which may enhance the electrical connection between the solder ball 812 and the plating material 832 and may prevent solder from wicking into the padless via 830 .
- Solid-centered solder balls may also help achieve a uniform height among solder interconnections after reflow.
- the padless via 230 and adjacent contact pad 234 be formed on a top surface of the PCB 220 as part of an array of interconnections to connect with a corresponding array of contact pads 214 on a bottom surface of the component 210 .
- the contact pads 214 on the bottom surface of the component 210 may be formed as an array have a substantially uniform pitch P.
- the component 210 may be a BGA component having a standard BGA pitch, such as 1.5 mm, 1.27 mm or 1.0 mm.
- the component 210 may be a BGA component having a reduced BGA pitch, such as 0.8 mm, 0.75 mm, 0.6 mm and 0.5 mm.
- conductive traces may be routed between padless vias and adjacent interconnections for reduced pitch BGA components.
- conductive traces 242 and 244 may be routed between adjacent padless vias 230 .
- D Assuming adjacent padless vias have a same diameter, “D”, a minimum pitch “P” for a component to be attached to the array of interconnections may be determined by the following equation:
- N is the number of conductive traces routed between adjacent interconnections
- t is the trace width
- s is the space between traces
- a is a trace-via spacing
- N ( P ⁇ D ⁇ 2 a+s )/( t+s )
- FIG. 9 is a table comparing a maximum number of routable conductive traces N between interconnections of varying diameters for component pitches ranging from 0.5 mm (19.7 mils) to 1.0 mm (39.4 mils). The table assumes trace and space widths of 3 mils and trace-via spacing of 5 mils. As illustrated, for a component pitch of 0.8 mm, two conductive traces may be routed between adjacent padless vias having a diameter of 12 mils, while no conductive traces may be routed between traditional vias formed through contact pads having a diameter of 24 mils. Further, contact pads having a diameter of 24 mils or greater overlap for component pitches of 0.75 mm or less.
- routing conductive traces between adjacent interconnections may reduce a total number of PCB layers needed for interconnection, which may reduce overall PCB cost. Further, by using a standard width for the conductive traces and spaces, such as 3 mils, PCB costs may be further reduced by avoiding complicated and expensive manufacturing processes which may be required for finer width conductive traces and spaces.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A first signal routing layer may be formed on a first surface of a printed circuit board (PCB). An array of interconnections may formed on the first surface of the PCB, the array of interconnections comprising at least one padless via formed within the PCB, the at least one padless via extending from the first signal routing layer to at least one conductive plane and/or a second signal routing layer. The at least one padless via may be in electrical contact with the at least one conductive plane and/or a conductive trace on the second signal routing layer. A component may be attached to the PCB, with a solder interconnection between the at least one padless via and a contact pad on a bottom surface of the component. The component may be, for example, an electronic component such as a ball grid array (BGA) component or a leadless surface mount component.
Description
- Embodiments of the present invention relate to printed circuit board (PCB) technology and more particularly to interconnecting a component with a PCB.
- Within the electronics industry there is a continuing effort to increase device density and speed. As device density increases, the number of interconnections per square inch of an electronic component may increase accordingly. To accommodate an increased number of interconnections, some electronic components are packaged in a ball grid array (BGA) package with an array of solder balls formed on a bottom surface. As illustrated in FIG. 1, a
BGA component 110 may be interconnected with a printed circuit board (PCB) 120 by aligning an array ofsolder balls 112 having an array pitch “P” with a corresponding array of contact pads, such ascontact pads PCB 120. Thesolder balls 112 may be reflowed to make electrical connections between thesolder balls 112 and thecontact pads solder mask 160 may prevent solder from wicking to adjacent contact pads during reflow. - Typically, the PCB120 has numerous layers of conductive traces to route signals from the
BGA component 110 to other electronic components mounted on both sides of thePCB 120. The PCB 120 may also have a number of vias to route signals from contact pads to the signal routing layers. For example, a signal may travel from thesolder ball 112 to thecontact pad 122 and through avia 130 to a conductive trace on a bottom surface signal routing layer. Thevia 130 is typically formed by drilling a hole through thecontact pad 122 and plating the drilled hole with a platingmaterial 132. For example, a hole having a diameter D1 from 10-16 mils may be drilled through a contact pad having a diameter D3 from 18-24 mils. To make efficient use of the signal routing area on thePCB 120 beneath theBGA component 110, one or more conductive traces may be routed betweenadjacent contact pads - However, as device density increases, the BGA array pitch may shrink and the contact pads may occupy a larger percentage of signal routing area beneath the BGA component which may prevent signal routing between adjacent contact pads. One approach to increase the signal routing area is to reduce the diameter of the contact pads. However, as contact pad diameter decreases, it may become more difficult to drill a via hole through the contact pad due to drill wander and tolerance errors in the drilling process. Errors in the drilling process may lead to non-uniformity in contact pad configuration, which may result in manufacturing errors during assembly of the PCB, and may ultimately lead to scrapping the PCB. Another approach to increase signal routing area is to reduce the width and spacing of conductive traces. However, this approach may require more complicated manufacturing processes which may increase overall PCB cost.
- FIG. 1 illustrates a cross-sectional view of a printed circuit board (PCB) with a via according to the prior art.
- FIG. 2 illustrates a cross-sectional view of an exemplary system comprising a PCB according to one embodiment of the present invention.
- FIG. 3 illustrates a top view of the PCB illustrated in FIG. 2.
- FIG. 4 illustrates a flow diagram of a method to fabricate a PCB according to one embodiment of the present invention.
- FIG. 5 illustrates a cross-sectional view of a PCB with a blind padless via according to one embodiment of the present invention.
- FIG. 6 illustrates a cross-sectional view of a PCB with a padless via with a via plug according to one embodiment of the present invention.
- FIG. 7 illustrates a cross-sectional view of a PCB with a padless via with a conductive via plug according to one embodiment of the present invention.
- FIG. 8 illustrates a cross-sectional view of a PCB with a padless via with a conductive via plug according to another embodiment of the present invention.
- FIG. 9 is a table comparing routable conductive traces between interconnections having different diameters for various component pitches.
- In the following description, numerous specific details are set forth such as material types and ranges, in order to provide a thorough understanding of specific embodiments of the present invention. However, it will be obvious to one of skill in the art, that embodiments of the invention may be practiced without these specific details. In other instances, well-known elements and processing techniques have not been shown in particular detail in order to avoid unnecessarily obscuring the understanding of this description.
- Embodiments of the present invention may increase signal routing area on a printed circuit board (PCB) by forming vias without contact pads (“padless vias”). An electronic component, such as a ball grid array (BGA) component may be attached to the PCB with solder interconnections between the padless vias and contact pads on a bottom surface of the electronic component. Because padless vias may have a smaller diameter than traditional contact pads, conductive traces may be routed between padless vias and adjacent interconnections even for reduced pitch BGA components, which may reduce a total number of PCB layers needed for signal routing and may reduce overall PCB cost. These conductive traces may have a standard width and spacing which may further reduce overall PCB cost.
- FIG. 2 illustrates an
exemplary system 200, according to one embodiment of the present invention, comprising acomponent 210 mounted on aPCB 220. A padless via 230 and anadjacent contact pad 234 may be formed on a top surface of the PCB 220. The padless via 230 and thecontact pad 234 may be collectively referred to as interconnections. The padless via 230 and thecontact pad 234 may be part of an array of interconnections that comprise any suitable combination ofpadless vias 230 andcontact pads 234 for electrically coupling the PCB to a corresponding array ofcontact pads 214 formed on a bottom surface of acomponent 210. - The
component 210 may be, for example, an electronic component, such as a processor, a chipset, a memory, a memory controller, graphics controller, etc., housed in a BGA package or a leadless surface mount package. For one embodiment of the present invention, the PCB 220 may be a computer system motherboard and thecomponent 210 may be a processor. Alternatively, thecomponent 210 may be a socket for mounting an electronic component, such as a BGA socket or a land grid array (LGA) socket. - The PCB220 may have a number of signal routing layers, such as top surface
signal routing layer 240, and one or more conductive planes, such asconductive plane 245. The signal routing layers may have a plurality ofconductive traces component 210. The padless via 230 may extend from the top surfacesignal routing layer 240 to a bottom surfacesignal routing layer 250. A conductive trace on the bottom surfacesignal routing layer 250 may be in electrical contact with a platingmaterial 232 formed on an inner surface of the padless via 230. For some embodiments of the present invention, the padless via 230 may be in electrical contact with theconductive plane 245, which may be a power or ground plane. - A layer of
solder mask material 260 may be deposited over the top surfacesignal routing layer 240, with openings to expose the padless via 230 and thecontact pad 234. The openings may allow attachment ofsolder balls 212, which may be used for electrical interconnection with thecomponent 210. Thesolder mask material 260 may prevent solder from thesolder balls 212 from wicking to adjacent interconnections during a reflow process. - FIG. 3 illustrates a top view of the
PCB 220 with the layer ofsolder mask material 260 removed to allow a view of the topsurface routing layer 240. As illustrated, thecontact pad 234 may be in electrical contact with theconductive trace 244 on the top surfacesignal routing layer 240. Therefore, a via may not be required to route a signal from thecontact pad 234 to another PCB layer and thecontact pad 234 may have a smaller diameter D3 than traditional contact pads. For example, while traditional contact pads may be in the range of 18 to 32 mils, thecontact pad 234 may have a diameter less than 18 mils because a via will not be drilled through it. - The
contact pad 234 may also have a diameter approximately equal to the diameter of the padless via 230, for example, 12 mils. As illustrated, the reduced diameter of thepadless vias 230 and thecontact pad 234 may allow theconductive traces - FIG. 4 illustrates a flow diagram400 illustrating exemplary operations of a method to fabricate a PCB according to one embodiment of the present invention. For
block 410, a first signal routing layer is formed on a first surface of a PCB. The first signal routing layer may be formed by any suitable process. Comment: FIG. 4 showsstep 430 as a required plugging step. Note that plugging may not be required. - For
block 420, an array of interconnections is formed on the first surface of the PCB, the array of interconnections comprising at least one padless via extending from the first signal routing layer to at least one conductive plane and/or a second signal routing layer, wherein the at least one padless via is in electrical contact with the at least one conductive plane and/or a conductive trace on the second signal routing layer. The array of interconnections may include any suitable combination of contact pads and padless vias, which may be formed by any suitable methods. - For example, referring back to FIG. 2, the padless via230 may be formed by drilling a hole through the top surface
signal routing layer 240 and plating the drilled hole with theplating material 232. Because the hole is not drilled through a contact pad, the padless via 230 may have an outer diameter D1 equal to a diameter of the drilled hole. Any suitable drilling technique may be used, such as mechanical drilling, laser drilling and plasma drilling. Drilled holes having a diameter less than 8 mils may be achieved using such methods. However, as drilling technologies progress, the achievable diameter of drilled holes may decrease. - The drilled hole may be plated according to any suitable method, such as electrodeposition or electroless plating. The
plating material 232 may be any suitable conductive material, such as copper or silver, and may be plated to any suitable thickness. For example, a drilled hole having a diameter D1 of 12 mils may be plated with theplating material 232 to a thickness of 1 mil, resulting in the padless via 230 having an inner diameter D2 of 10 mils. - As illustrated, the padless via230 may extend from the top
surface routing layer 240 to the bottomsurface routing layer 250. However, as illustrated in FIG. 5, for some embodiments of the present invention, a blind padless via 530 may be formed in aPCB 520 extending from a top surfacesignal routing layer 540 to aninner layer 545. Theinner layer 545 may be an inner signal routing layer or a conductive plane. It may be an advantage that the blind padless via 530 does not extend belowinner layer 545, and therefore does not occupy routing area on signal routing layers belowinner layer 545. - Optionally, for
block 430 of FIG. 4, a via plug may be formed in the padless via. For example, as illustrated in FIG. 2, a top-side viaplug 262 may prevent solder fromsolder ball 212 from wicking into the padless via 230 which may leave insufficient solder for electrical connection between the padless via 230 and thecontact pad 234. The top-side viaplug 262 may be formed by allowing thesolder mask material 260 to flow into the padless via 230 during formation of the layer of solder mask. After curing, a top portion of thesolder mask material 260 in the padless via may be removed, for example, by laser ablation, leaving the top-side viaplug 262. Alternatively, as illustrated in FIG. 6, a viaplug 662 may be formed by depositing asolder mask material 660 on a bottom surface of aPCB 620, and allowing thesolder mask material 660 to flow into a padless via 630. - As illustrated in FIG. 7, a conductive via
plug 762 may be formed of an electrically conductive material, which may provide a greater conductive surface for electrical connection with asolder ball 712. The conductive viaplug 762 may be formed by filling a padless via 730 formed in aPCB 720 with an electrically conductive material, which may be any suitable electrically conductive material, such as a solder or a silver-filled epoxy. Alternatively, as illustrated in FIG. 5, a conductive via plug may be formed by overplating a padless via, such as the blind padless via 530 and removing a top portion of theplating material 532, for example, by etching. Further, for some embodiments of the present invention, padless vias may not require via plugs. - For
block 440 of FIG. 4, a component is attached to the PCB, with a solder interconnection between the at least one padless via and a contact pad on a bottom surface of the component. For example, referring back to FIG. 2, thecomponent 210 may be attached to thePCB 220 by aligningsolder balls 212 attached to thecontact pads 214 of thecomponent 210 with the padless via 230 and theadjacent contact pad 234 and reflowing thesolder balls 212 to electrically couple thecontact pads 214 to theplating material 232 of thepadless vias 230 and theadjacent contact pad 234. - The
solder balls 212 may be made of any suitable solder material, such as a common lead-tin alloy. Alternatively, thesolder balls 212 may be made of a lead free solder, such as a tin-copper alloy. Thesolder balls 212 may be reflowed according to any suitable reflow process. For some embodiments of the present invention, in an effort to avoid trapping air, moisture, or gas, which may expand during reflow and create a void or open in a solder joint, a solder ball may be formed with a solder shell solder surrounding a solid center of a material having a higher melting temperature than the solder shell. - FIG. 8A illustrates a
solder ball 812 having asolder shell 814 surrounding asolid center 816. Thesolder shell 814 may be made of a lead-free solder, for example, having a melting temperature of approximately 410° F., while the center ball may be made of aluminum or copper, having melting temperatures of approximately 1221° F. or 1981° F., respectively. As illustrated, thesolid center 816 may have a diameter D3 greater than an inner diameter D2 of a padless via 830 formed in aPCB 820. For example, the padless via 830 may have an inner diameter D2 of 10 mils, while thesolid center 816 may have a diameter D3 of 20 mils. - As illustrated in FIG. 8B, the
solid center 816 may come in contact with aplating material 832 during reflow of thesolder shell 814, which may enhance the electrical connection between thesolder ball 812 and theplating material 832 and may prevent solder from wicking into the padless via 830. Solid-centered solder balls may also help achieve a uniform height among solder interconnections after reflow. - Referring back to FIG. 2, the padless via230 and
adjacent contact pad 234 be formed on a top surface of thePCB 220 as part of an array of interconnections to connect with a corresponding array ofcontact pads 214 on a bottom surface of thecomponent 210. As illustrated, thecontact pads 214 on the bottom surface of thecomponent 210 may be formed as an array have a substantially uniform pitch P. For example, thecomponent 210 may be a BGA component having a standard BGA pitch, such as 1.5 mm, 1.27 mm or 1.0 mm. Alternatively, thecomponent 210 may be a BGA component having a reduced BGA pitch, such as 0.8 mm, 0.75 mm, 0.6 mm and 0.5 mm. - As previously described, due to a reduced diameter of padless vias, conductive traces may be routed between padless vias and adjacent interconnections for reduced pitch BGA components. For example, as illustrated in FIG. 3,
conductive traces padless vias 230. Assuming adjacent padless vias have a same diameter, “D”, a minimum pitch “P” for a component to be attached to the array of interconnections may be determined by the following equation: - P=D+N*t+(N−1)*s+2*a
- where “N” is the number of conductive traces routed between adjacent interconnections, “t” is the trace width, “s” is the space between traces, and “a” is a trace-via spacing. Alternatively, the number of conductive traces N that may be routed between padless vias for a given pitch P may be determined by solving the above equation for N, which yields:
- N=(P−D−2a+s)/(t+s)
- If adjacent interconnections, such as a
padless vias 230 and thecontact pad 234, have differing diameters, D1 and D2, the above equations may be modified by substituting (D1+D2)/2 for D to find the number of conductive traces that may be routed between the adjacent interconnections. - FIG. 9 is a table comparing a maximum number of routable conductive traces N between interconnections of varying diameters for component pitches ranging from 0.5 mm (19.7 mils) to 1.0 mm (39.4 mils). The table assumes trace and space widths of 3 mils and trace-via spacing of 5 mils. As illustrated, for a component pitch of 0.8 mm, two conductive traces may be routed between adjacent padless vias having a diameter of 12 mils, while no conductive traces may be routed between traditional vias formed through contact pads having a diameter of 24 mils. Further, contact pads having a diameter of 24 mils or greater overlap for component pitches of 0.75 mm or less.
- As previously described, routing conductive traces between adjacent interconnections may reduce a total number of PCB layers needed for interconnection, which may reduce overall PCB cost. Further, by using a standard width for the conductive traces and spaces, such as 3 mils, PCB costs may be further reduced by avoiding complicated and expensive manufacturing processes which may be required for finer width conductive traces and spaces.
- In the foregoing description, the invention has been described with reference to specific exemplary embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit or scope of the appended claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
Claims (30)
1. A printed circuit board (PCB) comprising:
a first signal routing layer formed on a first surface of the PCB;
at least one conductive plane and/or a second signal routing layer;
at least one padless via extending from the first signal routing layer to the at least one conductive plane and/or the second signal routing layer, the at least one padless via in electrical contact with the at least one conductive plane and/or a conductive trace on the second signal routing layer; and
a layer of solder mask material formed over the first signal routing layer, the layer of solder mask material having at least one opening to expose the at least one padless via.
2. The PCB of claim 1 , wherein the second signal routing layer is an inner signal routing layer and the at least one padless via is a blind padless via extending from the first signal routing layer to the second signal routing layer.
3. The PCB of claim 1 , further comprising a via plug formed within the padless via.
4. The PCB of claim 3 , wherein the via plug is formed of an electrically conductive material.
5. The PCB of claim 1 , further comprising a component attached to the PCB with a solder interconnection between a contact pad on a bottom surface of the component and the at least one padless via.
6. A printed circuit board (PCB) comprising:
a first signal routing layer formed on a first surface of the PCB;
at least one conductive plane and/or a second signal routing layer; and
an array of interconnections formed on the first surface of the PCB, the array of interconnections comprises at least one padless via extending from the first signal routing layer to the at least one conductive plane and/or the second signal routing layer, wherein the padless via is in electrical contact with the at least one conductive plane and/or a conductive trace on the second signal routing layer.
7. The PCB of claim 6 , further comprising an electrically conductive via plug formed within the at least one padless via.
8. The PCB of claim 6 , wherein the array of interconnections further comprises at least one contact pad electrically coupled with a conductive trace on the first signal routing layer, wherein the at least one contact pad has a diameter less than 18 mils.
9. The PCB of claim 6 , further comprising at least two conductive traces formed on the first signal routing layer between the at least one padless via and an adjacent interconnection.
10. The PCB of claim 9 , wherein the array of interconnections has an array pitch of 0.8 mm or less.
11. The PCB of claim 10 , wherein the at least two conductive traces have a width of approximately 3 mils.
12. The PCB of claim 6 , wherein the at least one padless via has a diameter of 12 mils or less.
13. A system comprising:
a printed circuit board (PCB) comprising a first signal routing layer formed on a first surface of the PCB, at least one conductive plane and/or a second signal routing layer, and an array of interconnections formed on the first surface of the PCB, wherein the array of interconnections comprises at least one padless via extending from the first signal routing layer to the at least one conductive plane and/or the second signal routing layer, the at least one padless via electrically connected to the at least one conductive plane and/or a conductive trace on the second signal routing layer; and
a component attached to the PCB by a plurality of solder ball interconnections between the array of interconnections formed on the first surface of the PCB and a corresponding array of contact pads disposed on a bottom surface of the electronic component.
14. The system of claim 13 , wherein the component is a ball grid array (BGA) component having an array pitch less than 1.0 mm.
15. The system of claim 14 , further comprising at least two conductive traces on the first signal routing layer routed between the at least one padless via and an adjacent interconnection.
16. The system of claim 15 , wherein a width of the at least two conductive traces is approximately 3 mils.
17. The system of claim 13 , wherein the at least one padless via has a diameter of 12 mils or less.
18. The system of claim 13 , wherein the PCB is a motherboard and the component is a processor.
19. A method of fabricating a printed circuit board (PCB) comprising:
forming a first signal routing layer on a first surface of a printed circuit board (PCB); and
forming an array of interconnections on the first surface of the PCB, the array of interconnections comprising at least one padless via extending from the first signal routing layer to a conductive plane and/or a second signal routing layer, wherein the first padless via is in electrical contact with the conductive plane and/or a conductive trace on the second signal routing layer.
20. The method of claim 19 , wherein the second signal routing layer is an inner signal routing layer and the at least one padless via is a blind via extending from the first signal routing layer to the second signal routing layer.
21. The method of claim 19 , wherein forming an array of interconnections on the first surface of the PCB comprises forming an array of interconnections having an array pitch of 0.8 mm or less.
22. The method of claim 21 , further comprising routing at least two conductive traces on the first signal routing layer between the at least one padless via and an adjacent interconnection.
23. The method of claim 19 , further comprising forming a via plug within the at least one padless via.
24. The method of claim 19 , wherein forming a via plug within the at least one padless via comprises overplating the at least one padless via to form a via plug of plating material.
25. The method of claim 19 , wherein forming an array of interconnections on the first surface of the PCB comprises forming at least one contact pad on the first surface of the PCB adjacent to the at least one padless via, the at least one contact pad in electrical contact with a conductive trace on the first signal routing layer.
26. A method of attaching a component to a printed circuit board (PCB) comprising:
aligning solder balls attached to an array of contact pads on a bottom surface of the component with a corresponding array of interconnections formed on a first surface of the PCB, the array of interconnections comprising at least one padless via extending from a first signal routing layer on the first surface of the PCB to a conductive plane and/or a second signal routing layer within the PCB, wherein the at least one padless via is in electrical contact with the conductive plane and/or a conductive trace on the second signal routing layer; and
reflowing the solder balls to electrically connect the array of contact pads to the corresponding array of interconnections.
27. The method of claim 26 , wherein the solder balls comprise a solder shell surrounding a solid center of a material having a higher melting temperature than the solder shell.
28. The method of claim 27 , wherein the solder shell is made of a lead-free solder and the solid center is copper or aluminum.
29. The method of claim 26 , wherein the component is an electronic component housed in a ball grid array (BGA) package having a BGA pitch of 0.8 mm or less.
30. The method of claim 29 , wherein the component is a land grid array (LGA) socket.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/625,216 US20040084210A1 (en) | 2002-03-27 | 2003-07-22 | Apparatus and method for interconnection between a component and a printed circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/108,219 US6630631B1 (en) | 2002-03-27 | 2002-03-27 | Apparatus and method for interconnection between a component and a printed circuit board |
US10/625,216 US20040084210A1 (en) | 2002-03-27 | 2003-07-22 | Apparatus and method for interconnection between a component and a printed circuit board |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/108,219 Continuation US6630631B1 (en) | 2002-03-27 | 2002-03-27 | Apparatus and method for interconnection between a component and a printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040084210A1 true US20040084210A1 (en) | 2004-05-06 |
Family
ID=28452826
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/108,219 Expired - Lifetime US6630631B1 (en) | 2002-03-27 | 2002-03-27 | Apparatus and method for interconnection between a component and a printed circuit board |
US10/625,216 Abandoned US20040084210A1 (en) | 2002-03-27 | 2003-07-22 | Apparatus and method for interconnection between a component and a printed circuit board |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/108,219 Expired - Lifetime US6630631B1 (en) | 2002-03-27 | 2002-03-27 | Apparatus and method for interconnection between a component and a printed circuit board |
Country Status (1)
Country | Link |
---|---|
US (2) | US6630631B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060284301A1 (en) * | 2005-06-17 | 2006-12-21 | Corisis David J | CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies |
US20080185178A1 (en) * | 2003-12-04 | 2008-08-07 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment |
US20090233402A1 (en) * | 2008-03-11 | 2009-09-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer level ic assembly method |
US20150092381A1 (en) * | 2007-01-12 | 2015-04-02 | Broadcom Corporation | Padless via |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7061095B2 (en) * | 2001-09-26 | 2006-06-13 | Intel Corporation | Printed circuit board conductor channeling |
US6927346B2 (en) * | 2002-12-20 | 2005-08-09 | Intel Corporation | Surface mount technology to via-in-pad interconnections |
JP4255842B2 (en) * | 2004-01-09 | 2009-04-15 | パナソニック株式会社 | Semiconductor device |
WO2005074335A1 (en) * | 2004-01-23 | 2005-08-11 | Textron Systems Corporation | Conductive vias and associated methods and structures |
US7645940B2 (en) * | 2004-02-06 | 2010-01-12 | Solectron Corporation | Substrate with via and pad structures |
US7241680B2 (en) * | 2004-04-30 | 2007-07-10 | Intel Corporation | Electronic packaging using conductive interposer connector |
US7317255B2 (en) * | 2004-09-30 | 2008-01-08 | Kyocera Wireless Corp. | Reliable printed wiring board assembly employing packages with solder joints |
US7172438B2 (en) * | 2005-03-03 | 2007-02-06 | Samtec, Inc. | Electrical contacts having solder stops |
US8353995B2 (en) * | 2005-07-15 | 2013-01-15 | 3M Innovative Properties Company | Automobile panel repair laminate |
US7596482B2 (en) * | 2006-05-25 | 2009-09-29 | Dell Products L.P. | System and method to analyze and determine ampacity risks on PCB interconnections |
DE102009040022B3 (en) * | 2009-09-03 | 2011-03-24 | Beru Ag | Method for forming a fuse and circuit board with fuse |
US9468090B2 (en) | 2012-10-29 | 2016-10-11 | Cisco Technology, Inc. | Current redistribution in a printed circuit board |
US10074919B1 (en) * | 2017-06-16 | 2018-09-11 | Intel Corporation | Board integrated interconnect |
US10757801B2 (en) * | 2018-09-10 | 2020-08-25 | Hewlett Packard Enterprise Development Lp | Solder mask void regions for printed circuit boards |
JP2020174146A (en) * | 2019-04-11 | 2020-10-22 | イビデン株式会社 | Wiring board and method for measuring wiring board |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5399898A (en) * | 1992-07-17 | 1995-03-21 | Lsi Logic Corporation | Multi-chip semiconductor arrangements using flip chip dies |
US5418689A (en) * | 1993-02-01 | 1995-05-23 | International Business Machines Corporation | Printed circuit board or card for direct chip attachment and fabrication thereof |
US5680701A (en) * | 1992-08-26 | 1997-10-28 | International Business Machines Corporation | Fabrication process for circuit boards |
US5880030A (en) * | 1997-11-25 | 1999-03-09 | Intel Corporation | Unlanded via structure and method for making same |
US6020561A (en) * | 1996-03-29 | 2000-02-01 | Intel Corporation | Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
US20010009066A1 (en) * | 1995-06-06 | 2001-07-26 | International Business Machines Corporation | Full additive process with filled plated through holes |
US6274821B1 (en) * | 1998-09-16 | 2001-08-14 | Denso Corporation | Shock-resistive printed circuit board and electronic device including the same |
US6335565B1 (en) * | 1996-12-04 | 2002-01-01 | Hitachi, Ltd. | Semiconductor device |
US20030001287A1 (en) * | 2001-06-27 | 2003-01-02 | Intel Corporation | Flexible tape electronics packaging |
US6521846B1 (en) * | 2002-01-07 | 2003-02-18 | Sun Microsystems, Inc. | Method for assigning power and ground pins in array packages to enhance next level routing |
US6555208B2 (en) * | 1997-01-10 | 2003-04-29 | Ibiden Co., Ltd. | Printed wiring board and method of manufacturing the same |
-
2002
- 2002-03-27 US US10/108,219 patent/US6630631B1/en not_active Expired - Lifetime
-
2003
- 2003-07-22 US US10/625,216 patent/US20040084210A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5399898A (en) * | 1992-07-17 | 1995-03-21 | Lsi Logic Corporation | Multi-chip semiconductor arrangements using flip chip dies |
US5680701A (en) * | 1992-08-26 | 1997-10-28 | International Business Machines Corporation | Fabrication process for circuit boards |
US5418689A (en) * | 1993-02-01 | 1995-05-23 | International Business Machines Corporation | Printed circuit board or card for direct chip attachment and fabrication thereof |
US20010009066A1 (en) * | 1995-06-06 | 2001-07-26 | International Business Machines Corporation | Full additive process with filled plated through holes |
US6020561A (en) * | 1996-03-29 | 2000-02-01 | Intel Corporation | Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
US6335565B1 (en) * | 1996-12-04 | 2002-01-01 | Hitachi, Ltd. | Semiconductor device |
US6555208B2 (en) * | 1997-01-10 | 2003-04-29 | Ibiden Co., Ltd. | Printed wiring board and method of manufacturing the same |
US5880030A (en) * | 1997-11-25 | 1999-03-09 | Intel Corporation | Unlanded via structure and method for making same |
US6274821B1 (en) * | 1998-09-16 | 2001-08-14 | Denso Corporation | Shock-resistive printed circuit board and electronic device including the same |
US20030001287A1 (en) * | 2001-06-27 | 2003-01-02 | Intel Corporation | Flexible tape electronics packaging |
US6521846B1 (en) * | 2002-01-07 | 2003-02-18 | Sun Microsystems, Inc. | Method for assigning power and ground pins in array packages to enhance next level routing |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080185178A1 (en) * | 2003-12-04 | 2008-08-07 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment |
US20060284301A1 (en) * | 2005-06-17 | 2006-12-21 | Corisis David J | CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies |
US20150092381A1 (en) * | 2007-01-12 | 2015-04-02 | Broadcom Corporation | Padless via |
US9237651B2 (en) * | 2007-01-12 | 2016-01-12 | Broadcom Corporation | Padless via |
US20090233402A1 (en) * | 2008-03-11 | 2009-09-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer level ic assembly method |
US8247267B2 (en) * | 2008-03-11 | 2012-08-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level IC assembly method |
US8551813B2 (en) | 2008-03-11 | 2013-10-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level IC assembly method |
Also Published As
Publication number | Publication date |
---|---|
US20030183421A1 (en) | 2003-10-02 |
US6630631B1 (en) | 2003-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6630631B1 (en) | Apparatus and method for interconnection between a component and a printed circuit board | |
US5459287A (en) | Socketed printed circuit board BGA connection apparatus and associated methods | |
US5706178A (en) | Ball grid array integrated circuit package that has vias located within the solder pads of a package | |
US5875102A (en) | Eclipse via in pad structure | |
US4851614A (en) | Non-occluding mounting hole with solder pad for printed circuit boards | |
US7323787B2 (en) | Off-grid decoupling of ball grid array (BGA) devices and method | |
US6400018B2 (en) | Via plug adapter | |
US7875811B2 (en) | High speed interposer | |
US6817870B1 (en) | Technique for interconnecting multilayer circuit boards | |
US6514845B1 (en) | Solder ball contact and method | |
US7155821B1 (en) | Techniques for manufacturing a circuit board having a countersunk via | |
KR20120056128A (en) | Soldering connecting pin, semiconductor package substrate and method of mounting a semiconductor chip using the same | |
US10510633B1 (en) | Package and printed circuit board attachment | |
US6791035B2 (en) | Interposer to couple a microelectronic device package to a circuit board | |
US20110147058A1 (en) | Electronic device and method of manufacturing electronic device | |
US10912194B2 (en) | Printed circuit board | |
US7073253B2 (en) | Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same | |
US6511347B2 (en) | Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site | |
US8063481B2 (en) | High-speed memory package | |
KR101292594B1 (en) | Embedded printed circuit board with metal dam and method for manufacturing the same | |
JP2715945B2 (en) | Mounting structure of ball grid array package | |
JPH11163489A (en) | Mounting structure of electronic component | |
US7135764B2 (en) | Shielded semiconductor chip carrier having a high-density external interface | |
JPH10270856A (en) | Mounting structure for ball grid array package type semiconductor part | |
JPH0341793A (en) | Conductive board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |