US20040079645A1

US20040079645A1 - Method for manufacturing personal digital assistant

Info

Publication number: US20040079645A1
Application number: US10/249,499
Authority: US
Inventors: Chang-Huang Chiu; Chun-Shih Lee
Original assignee: High Tech Computer Corp
Current assignee: HTC Corp
Priority date: 2002-10-24
Filing date: 2003-04-15
Publication date: 2004-04-29
Also published as: TWI220703B; KR100565539B1; KR20040036519A

Abstract

A method for manufacturing a personal digital assistant (PDA) that contains an upper housing and a lower housing, includes forming a first portion and a second portion of the upper housing through plastic injection molding at one time, and forming at least one positioning stud on an inner side of the upper housing through plastic injection molding. The first portion can be electroplated, the second portion cannot be electroplated, and the positioning stud contains a surface that can be electroplated. The method further includes electroplating the upper housing so as to form an electrically conductive layer on the first portion and the surface of the positioning stud.

Description

BACKGROUND OF INVENTION

1. Field of the Invention

The invention relates to a method for manufacturing a personal digital assistant (PDA), and more particularly, to the method for manufacturing an upper housing of the PDA.

2. Description of the Prior Art

Please refer to FIG. 1. FIG. 1 is a diagram of a personal digital assistant according to the prior art. The

PDA

10 comprises an upper housing 12, a lower housing 14, a liquid crystal display 16, an aerial 18, and a plurality of buttons 20. The upper housing 12 and the lower housing 14 are integrated to form the outer case of the PDA 10. The liquid crystal display 16 is used to display instructions and data of the PDA 10. The aerial 18 is used to receive or deliver data wirelessly. The plurality of buttons 20 is used to enter instructions into the PDA 10.

As shown in FIG. 1, the

upper housing

12 of the PDA 10 comprises a first portion 12 a, which is on the top of the upper housing 12 around the liquid crystal display 16, and a second portion 12 b, which is on the side of the upper housing 12 and around the aerial 18. (The first portion 12 a is divided from the second portion 12 b by a dotted line.) More specifically, the first portion 12 a of the PDA 10 is capable of being electroplated, and the second portion 12 b of the PDA 10 is incapable of being electroplated, so the first portion 12 a is used to prevent electromagnetic waves inside the PDA 10 from passing through the upper portion 12, and the second portion 12 b is used to provide a non-interference area around the aerial 18. Due to the complex structure of the upper housing 12, a relative method for manufacturing the PDA 10 is difficult and costs money.

Please refer to FIG. 2. FIG. 2 is an exploded diagram of the personal digital assistant shown in FIG. 1. The

PDA

10 further comprises a plurality of positioning studs 22, a circuit board 24, and an elastic conductor 26, like electrically conductive foam rubber. The plurality of positioning studs 22 formed on an inner side of the upper housing 12 is used to integrate the upper housing 12 with the lower housing 14. The circuit board 24 set inside the PDA 10 is used to control the PDA 10. One end of the elastic conductor 26 is fixed on the inner side of the first portion 12 a of the upper housing 12, and the other end of the elastic conductor 26 is connected to the circuit board 24 so as to increase the ground connection of the PDA 10 by passing the static electricity received by the upper housing 12 through the first portion 12 a and the circuit board 24 to ground.

In order to complete the above-mentioned functions, a manufacturer forms the

upper housing

12 of the PDA 10 by a complex method of the prior art. Please refer to FIG. 3. FIG. 3 is a flow chart of forming an upper housing 12 of the PDA 10 shown in FIG. 1. The method of the prior art comprises:

Step 100: Form the first portion 12 a through plastic injection molding with a first mold. A material that is capable of being electroplated is used to make the first portion 12 a.

Step 110: Electroplate the first portion 12 a of the upper housing 12 so as to form an electrically conductive layer on the first portion 12 a.

Step 120: Form the second portion 12 b of the upper housing 12 through plastic injection molding with a second mold.

Step 130: Adhere the first portion 12 a to the second portion 12 b so as to form the upper housing 12 of the PDA 10.

Step 140: Fix the elastic conductor 26 on the inner side of the first portion 12 a of the upper housing 12 so as to form an electrical connection between the first portion 12 a and the elastic conductor 26. Connect the other end of the elastic conductor 26 to the circuit board 24 inside the PDA 10 so as to pass the static electricity received by the upper housing 12 to the circuit board 24.

Step 150: End.

Due to the complex method for manufacturing the

upper housing

12 of the PDA 10, the manufacturer has to spend lots time and money to prepare two sets of molds and do the adhering step. The manufacturer also has to fix the elastic conductor 26 on the inner side of the first portion 12 a of the upper housing 12 so as to pass the static electricity received by the upper housing 12 to the circuit board 2. This makes the method for manufacturing the upper housing 12 more complex. In addition to the above-mention steps, the manufacturer uses another method of the prior art to produce the upper housing 12 of the PDA 10. Please refer to FIG. 4. FIG. 4 is another flow chart of forming the upper housing of the personal digital assistant shown in FIG. 1. The method of the prior art comprises:

Step 200: Form the upper housing 12 including first portion 12 a and the second portion 12 b through plastic injection molding with one set of mold. A material that is capable of being electroplated makes the upper housing 12.

Step 210: Spray electroplating-proof liquid on the second portion 12 b of the upper housing 12 so as to form an electroplating-proof layer on the second portion 12 b.

Step 220: Electroplate the upper housing 12 so as to form an electrically conductive layer on the first portion 12 a of the upper housing 12. Due to the electroplating-proof layer on the second portion 12 b of the upper housing 12, the second portion 12 b cannot be electroplated.

Step 230: Remove the electroplating-proof layer from the second portion 12 b.

Step 240: Fix the elastic conductor 26 on the inner side of the first portion 12 a of the upper housing 12 so as to form an electrical connection between the first portion 12 a and the elastic conductor 26. Connect the other end of the elastic conductor 26 to the circuit board 24 inside the PDA 10 so as to pass the static electricity received by the upper housing 12 to the circuit board 24.

Step 250: End.

Although the above-mentioned method comprises forming the

upper housing

12 through plastic injection molding at one time with only one mold and excludes the adhering step, it comprises spraying electroplating-proof liquid on the second portion 12 b of the upper housing 12 before electroplating the upper housing 12 so as to prevent the second portion 12 b from being electroplated with electrically conductive material. And it is especially difficult to spray electroplating-proof liquid on the joint part between the first portion 12 a and the second portion 12 b. In addition, to make electrically connection between the first portion 12 a and the circuit board 24, the manufacturer has to fix the elastic conductor 26 on the inner side of the first portion 12 a of the upper housing 12. Therefore, according to the prior art, the method for manufacturing the upper housing 12 of the PDA 10 is complex and costs a lot.

SUMMARY OF INVENTION

It is therefore a primary objective of the claimed invention to provide a method for manufacturing an upper housing of a personal digital assistant (PDA) to solve the above-mentioned problem.

According to the claimed invention, the PDA comprises the upper housing and a lower housing, and the upper housing comprises at least a first portion and a second portion. The method for manufacturing the PDA comprises forming the first portion and the second portion of the upper housing through plastic injection molding at one time, and forming at least one positioning stud on an inner side of the upper housing through plastic injection molding. The first portion is capable of being electroplated, the second portion is incapable of being electroplated, and the positioning stud comprises a surface that is capable of being electroplated. The method further comprises electroplating the upper housing so as to form an electrically conductive layer on the first portion and the surface of the positioning stud.

It is an advantage of the claimed invention that the method for manufacturing the upper housing of the PDA is simplerso that a manufacturer can save time and cost by using the method.

These and other objectives of the present invention will no doubt obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram of a personal digital assistant according to the prior art. [0026]
FIG. 2 is an exploded diagram of the personal digital assistant shown in FIG. 1. [0027]
FIG. 3 is a flow chart of forming an upper housing of the personal digital assistant shown in FIG. 1. [0028]
FIG. 4 is another flow chart of forming the upper housing of the personal digital assistant shown in FIG. 1. [0029]
FIG. 5 is an exploded diagram of a personal digital assistant according to a present invention. [0030]
FIG. 6 is a flow chart of forming an upper housing of the personal digital assistant according to the present invention.[0031]

DETAILED DESCRIPTION

Please refer to FIG. 1. A personal digital assistant (PDA) of a present invention is similar to a PDA of the prior art. The PDA of the present invention also comprises an [0032] upper housing 12, a lower housing 14, a liquid crystal display 16, an aerial 18, and a plurality of buttons 20. The upper housing 12 also comprises a first portion 12 a, which is capable of being electroplated, and a second portion 12 b, which is incapable of being electroplated. As shown in FIG. 1, the first portion 12 a is divided from the second portion 12 b by a dotted line.
But the method for manufacturing the PDA of the present invention is different from the method of the prior art. The method of the present invention comprises forming the [0033] first portion 12 a and the second portion 12 b of the upper housing 12 at one time through plastic injection molding with a two-color mold set. And the plastic injection device with the two-color mold comprises a first material, like plastic material ABS, that is capable of being electroplated, and a second material, like plastic material PC, that is incapable of being electroplated, so as to form the first portion 12 a of the upper housing with the first material, and form the second portion 12 b with the second material through plastic injection molding. The method further comprises electroplating the upper housing 12 so as to form an electrically conductive layer on the first portion 12 a. Because the second portion 12 b of the upper housing 12 is incapable of being electroplated, it cannot be electroplated with the electrically conductive material, thus, the upper housing 12 can be made easily.
Please refer to FIG. 5. FIG. 5 is an exploded diagram of the [0034] PDA 10 according to the present invention. According to the prior art, a plurality of positioning studs is attached on the inner side of the upper housing 12, and has no electrical connection with the first portion 12 a. However, the method of the present invention comprises forming the plurality of positioning studs 22 a, 22 b, 22 c, and the upper housing 12 at one time through plastic injection molding. And at least one of the plurality of positioning studs 22 a, 22 b, and 22 c is electrically connected to the first portion 12 a of the upper housing 12. The other end of the positioning stud electrically connected to the first portion 12 a is connected to a circuit board 24 inside the PDA 10 so as to pass static electricity received by the upper housing 12 through the first portion 12 a, the electrically conductive positioning studs 22 a, 22 b, 22 c, and the circuit board 24 to ground. Because at least one of the plurality of positioning studs 22 a, 22 b, and 22 c has a ground connection, the manufacturer does not need to fix an elastic conductor 26 on the inner side on the first portion 12 a of the upper housing 12 so as to pass extra static electricity to ground according to the present invention. Therefore, according to the present invention, the method for manufacturing the upper housing 12 is much simpler by using the positioning studs 22 a, 22 b, and 22 c as passages for ground connection.
Please refer to FIG. 6. FIG. 6 is a flow chart of forming an [0035] upper housing 12 of the PDA 10 according to the present invention. The method comprises:
Step [0036] 300: Prepare a plastic injection device with a two-color mold set. The plastic injection device comprises a first material that is capable of being electroplated, and a second material that is incapable of being electroplated. Use the plastic injection device to form the first portion 12 a, second portion 12 b, the plurality of positioning studs 22 a, 22 b, and 22 c of the upper housing 12 at one time. The first portion 12 a is formed with the first material, and the second portion 12 b is formed with the second material. In the preferred embodiment of the present invention, the inner side on the upper housing 12 comprises three positioning studs 22 a, 22 b, and 22 c. And the positioning stud 22 a and 22 b are formed with the first material, while the positioning stud 22 c is formed with the second material. Because the first portion 12 a and the second portion 12 b are formed through plastic injection molding at one time, these two portions are integrated, thus, the manufacturer does not need to adhere these two portions by another step.
Step [0037] 310: Electroplate the upper housing 12 so as to form an electrically conductive layer on the first portion 12 a, the positioning studs 22 a, and 22 b of the upper housing 12. Meanwhile, the second portion 12 b and the positioning stud 22 c of the upper housing 12 are formed with the second material, so they are not be electroplated with electrically conductive material. After being electroplated, the first portion 12 a has electrical connection with the positioning studs 22 a and 22 b so as to pass the static electricity received by the upper housing 12 to ground.
Step [0038] 320: End.
In the above-mentioned embodiment, there are two positioning [0039] studs 22 a and 22 b formed with the material that is capable of being electroplated. However, there also can be only one of the positioning studs or all of the three positioning studs formed with the material that is capable of being electroplated according to the method of the present invention.
In contrast to the prior art, the present invention the method for manufacturing the [0040] PDA 10 comprises using the plastic injection device with the two-color mold to inject the first portion 12 a that is capable of being electroplated and the second portion 12 b that is incapable of being electroplated, and electroplating the first portion 12 a based on the difference between the two portions. Therefore, the method of the present invention is simpler. The method of the present invention further comprises forming the first portion 12 a, the second portion 12 b, the plurality of positioning studs 22 a, 22 b, and 22 c at one time through plastic injection molding at one time, and at least one positioning stud is electrically connected to the first portion 12 a so as to form the passage for ground connection. Thus, the method of the present invention does not comprise fixing the elastic conductor 26 on the inner side of the first portion 12 a the upper housing 12 so as to make electrical connection between the first portion 12 a and the circuit board 24. Therefore, the method of the present invention is quite simple, and helps save time and cost of manufacturing the PDA 10.
Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims. [0041]

Claims

What is claimed is:

1. A method for manufacturing a personal digital assistant (PDA), wherein the personal digital assistant comprises an upper housing and a lower housing, the upper housing comprising at least a first portion and a second portion, the first portion being capable of being electroplated and the second portion being incapable of being electroplated, the method comprising the following steps:

forming the first portion and the second portion of the upper housing through plastic injection molding at one time; and

electroplating the upper housing so as to form an electrically conductive layer on the first portion.

2. The method of claim 1 wherein the upper housing further comprises at least one positioning stud, the positioning stud being formed on an inner side of the upper housing through plastic injection molding.

3. The method of claim 2 wherein the positioning stud, the first portion and the second portion are formed through plastic injection molding at one time.

4. The method of claim 2 wherein the positioning stud comprises a surface that is capable of being electroplated, when electroplating the upper housing, forming an electrically conductive layer on the surface of the positioning stud that is capable of being electroplated.

5. The method of claim 4 wherein the personal data assistant further comprises a circuit board, one end of the positioning stud being connected to the circuit board.

6. The method of claim 1 wherein the first portion of the upper housing is a conductor.

7. A method for manufacturing a personal digital assistant, wherein the personal data assistant comprises an upper housing and a lower housing, the upper housing comprising at least a first portion, a second portion and a positioning stud, the first portion being capable of being electroplated, the second portion being incapable of being electroplated, the method comprising the following steps:

forming the first portion and the second portion of the upper housing and the positioning stud on an inner side of the upper housing through plastic injection molding at one time; and

electroplating the upper housing so as to form an electrically conductive layer on the first portion of the upper housing.

8. The method of claim 7 wherein the positioning stud comprises a surface that is capable of being electroplated, when electroplating the upper housing, forming an electrically conductive layer on the surface of the positioning stud that is capable of being electroplated.

9. The method of claim 8 wherein the personal digital assistant further comprises a circuit board, one end of each positioning stud being connected to the circuit board.

10. A method for manufacturing a personal digital assistant, wherein the personal digital assistant comprises an upper housing and a lower housing, the upper housing comprising at least a first portion, a second portion and a positioning stud, the first portion being capable of being electroplated, the second portion being incapable of being electroplated, the method comprising the following steps:

forming the first portion and the second portion of the upper housing and the positioning stud on an inner side of the upper housing through plastic injection molding at one time, wherein the positioning stud comprises a surface that is capable of being electroplated; and

electroplating the upper housing so as to form an electrically conductive layer on the first portion of the upper housing and on the surface of the positioning stud that is capable of being electroplated.

11. The method of claim 8 wherein the personal digital assistant further comprises a circuit board, one end of each positioning stud being connected to the circuit board.