US20030127714A1 - Electronic package - Google Patents
Electronic package Download PDFInfo
- Publication number
- US20030127714A1 US20030127714A1 US10/043,060 US4306002A US2003127714A1 US 20030127714 A1 US20030127714 A1 US 20030127714A1 US 4306002 A US4306002 A US 4306002A US 2003127714 A1 US2003127714 A1 US 2003127714A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- elastomeric member
- electronic package
- chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 26
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present invention relates generally to electronic packages, and more particularly, to an electronic package including an elastomeric member that supports a substantial portion of the load of a heat sink.
- 2. Related Art
- Current electronic packages are built with semiconductor chips or devices that are exposed so that an end user can connect a heat sink to the chip without additional thermally resistant layers. The chips may be encapsulated or have a layer of material about the chip. In many cases, the chips are flipped and connected with a ball grid to a substrate.
- One problem with this arrangement is that users can damage the chip when they attach the heat sink. One effort to remedy this problem is the use of a ring around the chip that is lower than the chip to guide the heat sink into position. This procedure, however, still may cause damage to the chip when the heat sink meets the chip. In addition, once the heat sink is in position, it needs to be held on with enough force to remain in contact with the chip. Most of the heat sink load is still on the chip with this configuration. The heat sink load includes not only the weight of the heat sink, but also the force of the coupling mechanism, e.g., spring clips, used to connect the heat sink to the substrate and any shock or vibration experienced during use.
- Another problem relative to attaching chips and heat sinks is that new chip technology is advancing with chips that have internal structures that are more fragile than in the past. For instance, one new chip technology provides a dielectric inside the chip such that it includes an outer glass like material with an organic and softer, inner material. These chips cannot withstand the heat sink load as well as older chip technology. Hence, when a heat sink is forced into contact with a new chip, the heat sink load can more easily damage the chip.
- The above-described problem is magnified in that the new chips give off more heat and, therefore, require larger and heavier heat sinks than predecessor chips. This is the case even though the new chips are smaller. New chips also have different coefficients of thermal expansion (CTE) than current heat sinks, which also increases the stresses experienced by the new chips.
- One mechanism that has been used to protect chips is adding a lid over the chip. The lid is oftentimes attached to the chip with an adhesive. A lid, however, adds another layer to the package and, hence, thermal resistance, which negatively impacts performance and reliability. Further thermal resistance is created when an adhesive layer is used to attach the lid to the chip. Another problem with the use of lids is that users want to be able to add the heat sink to the package and then conduct testing. In many cases, the heat sink is also attached to the lid with an adhesive. If the package does not work, the user must then remove the heat sink and/or the lid. Since the heat sink and lid are adhered in place, the user must overcome the adhesive force to remove the heat sink and/or the lid, which can damage the chip.
- Another effort to solve the chip protection problem includes using an adhesive guard applied to the substrate around the chip. The adhesive guard is applied by the user at the time of final mechanical assembly of the finished product. This has solved some of the damage that occurred from that point on but has had no impact on damage occurring sooner in the process. In addition, this solution was not implemented so as to support any significant portion of the heat sink load in operation. Hence, the chip is still susceptible to damage during use.
- In view of the foregoing, there is a need in the art for an electronic package having a mechanism to place a heat sink in contact with a chip but not support the heat sink load on the chip.
- The invention includes an electronic package having an elastomeric member that supports a substantial portion of the load of a heat sink. The elastomeric member includes portions that are compressible to different degrees. The invention allows larger heat sinks on smaller and more fragile chips, and protects the chips from damage.
- A first aspect of the invention includes an electronic package comprising: a substrate having a first portion and a second portion; a semiconductor chip positioned on the first portion; and an elastomeric member positioned on the second portion, wherein the elastomeric member supports a substantial portion of a heat sink load.
- A second aspect of the invention is directed to an electronic package comprising: a substrate having a first portion and a second portion; a semiconductor chip positioned on the first portion of the substrate; an elastomeric member positioned on the second portion of the substrate; and a heat sink positioned on the semiconductor chip and on the elastomeric member, wherein the elastomeric member supports a substantial portion of a load of the heat sink to prevent damage of the semiconductor chip.
- A third aspect of the invention is directed to a method of constructing an electronic package, the method comprising the steps of: providing a substrate; coupling a semiconductor chip to the substrate; placing an elastomeric member having portions compressible to different degrees adjacent the semiconductor chip; and coupling a heat sink to the substrate such that a substantial portion of a load of the heat sink is supported by the elastomeric member.
- The foregoing and other features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention.
- The preferred embodiments of this invention will be described in detail, with reference to the following figures, wherein like designations denote like elements, and wherein:
- FIG. 1 shows a first embodiment of an electronic package;
- FIG. 2 shows the electronic package of FIG. 1 including a heat sink;
- FIG. 3 shows a second embodiment of the electronic package;
- FIG. 4 shows a third embodiment of the electronic package;
- FIG. 5 shows a fourth embodiment of the electronic package;
- FIG. 6 shows a fifth embodiment of the electronic package;
- FIG. 7 shows an electronic package with an alternative lid; and
- FIG. 8 shows an electronic package with an alternative heat spreader.
- With reference to FIG. 1, the invention includes an
electronic package 10 including asubstrate 12, a semiconductor chip or device 14 (hereinafter “chip”) and anelastomeric member 16.Substrate 12 includes afirst portion 18 upon whichsemiconductor chip 14 is positioned, and asecond portion 20 upon whichelastomeric member 16 is positioned.Substrate 12 may be any well known type of substrate. For example, as illustrated,substrate 12 is constructed as a ceramic ball grid array (CBGA) or a flip chip plastic ball grid array (FC-PBGA), which includesballs 22 for interconnection to other components.Substrate 12 may also be constructed with any well known organic material such as urethane.Other devices 15 may also be provided onsubstrate 12, and may be covered byelastomeric member 16. - Referring to FIG. 2,
electronic package 10 may also include aheat sink 24 positioned onchip 14 and onmember 16.Heat sink 24 may be coupled tosubstrate 12 using any well knowncoupling mechanism 13 such as a spring clip, screw or latch. - FIG. 2 also illustrates how
elastomeric member 16 is constructed to provide adequate but limited contact ofheat sink 24 tochip 14 while also allowing for thermal expansion/contraction provided by normal assembly tolerances. As a result,chip 14 need not be encapsulated in the over-mold material or provided with a lid for protection. In order to provide this functionality,member 16 is provided such that it supports a substantial portion of the load ofheat sink 24 and allows limited contact ofheat sink 24 tochip 14. More particularly, limited contact refers toelastomeric member 16 providing a spring back force defined by the difference between themaximum force chip 14 can withstand and the heat sink load. The heat sink load includes static and dynamic loads including, for example, the weight ofheat sink 24, the coupling force ofcoupling mechanism 13 and any shock or vibration experienced during use. - The ability to support a substantial portion of the load of
heat sink 24 and allow limited contact withchip 14 can be provided in a number of ways. In one embodiment, shown in FIG. 1,elastomeric member 16 may be made of a material that allows compressibility to a certain extent to provide the feedback force, and then stiffens against further compressibility. Also,member 16 is sized to be slightly higher than atop surface 17 ofchip 14. When aheat sink 24 is coupled tosubstrate 12, the heat sink load closes the gap between a lower surface of the heat sink andtop surface 17 ofchip 14.Member 16 may be made of a compressible or compliant material such as urethane. -
Elastomeric member 16 may also support a substantial portion ofheat sink 24 load and allow limited contact withchip 14 by having portions that are compressible to different degrees. The different compressibility portions ofmember 16 may be provided by an assortment of configurations. FIGS. 3-5 show embodiments in which the elastomeric member includes a first portion having a first compressibility and a second portion having a second compressibility. The first compressibility is greater than the second compressibility. That is, the extent to which the first portion can be compressed is greater than the second portion (the second portion is stiffer). FIG. 3 shows an embodiment of anelastomeric member 116 in which the portions of differing compressibility are provided by afirst portion 26 being thicker than asecond portion 28. In one embodiment, the thickerfirst portion 26 is positioned at a periphery ofmember 116 while the thinnersecond portion 28 isadjacent semiconductor chip 14. Althoughsecond portion 28 is shown as being thicker thanchip 14, it may be the same thickness or slightly thinner thanchip 14 when assembled tosubstrate 12 withheat sink 24. Whenheat sink 24 is coupled tosubstrate 12, it compressesfirst portion 26 ofmember 16. As this occurs, first portion's compressibility reduces such that further compression is resisted. As a result,heat sink 24 is positioned in limited contact withchip 14 and a substantial portion of the load of the heat sink is supported bymember 16. - In the embodiment shown in FIG. 4, an
elastomeric member 216 also includes afirst portion 126 having a first compressibility and asecond portion 128 having a second compressibility. In this case, however,first portion 126 is made of a first material andsecond portion 128 is made of a second material and each material has different compressibility. Preferably,first portion 126 is more compressible thansecond portion 128. That is, the first material allows for more compression, and the second material is stiffer. Alternatively,portions heat sink 24 is coupled tosubstrate 12, it compressesfirst portion 126. Once this occurs,second portion 128 resists further compression because it is less compressible, i.e., more rigid. As a result,heat sink 24 is positioned in limited contact withchip 14 and a substantial portion of its load is supported bymember 216. - FIG. 5 shows an
elastomeric member 316 in which the member is also constructed of afirst portion 226 having a first compressibility and asecond portion 228 having a second compressibility. Again,first portion 226 is more compressible thansecond portion 228. That is, the first material allows for more compression, and the second material is stiffer. In this embodiment, however,first portion 226 is positioned at a periphery ofsubstrate 12 and is thicker than thesecond portion 228, which is positioned adjacent thesemiconductor chip 14.First portion 226 may be thicker by any size that provides functionality. In one embodiment,first portion 226 is one millimeter thicker thansecond portion 228. Whenheat sink 24 is coupled tosubstrate 12, it compressesfirst portion 226. Once this occurs,second portion 228 resists further compression because it is less compressible, i.e., more rigid. As a result,heat sink 24 is positioned in limited contact withchip 14 and a substantial portion of its load is supported bymember 316. - In the above embodiments, the elastomeric member is formed as an integral member. That is, as a single piece of material or as coupled sections of materials. FIG. 6 shows an
elastomeric member 416 where the member is provided as a number ofposts 440A-D. Posts 440A-D may be configured to have decreasing height the closer tosemiconductor chip 14 their position is to provide the varied compressibility. Alternatively, each post 440 may be constructed of material of varying compressibility similarly to the above-described embodiments. For instance, posts 440A, 440B may be made of a material that is more compressible thanposts posts 440A-D may be made of two materials, one that is more compressible than the other. - The elastomeric member is preferably molded to
substrate 12 early in construction ofelectronic package 10. Alternately, the member can be separately molded and joined tosubstrate 12 during assembly. Leavingchip 14 free of encapsulation allows direct contact betweenchip 14 andheat sink 24. It also does not influence chip underfill, which allowselectronic package 10 to behave as it does in current bare die modules with respect to reliability. - FIG. 7 shows an electronic package constructed in accordance with one of the above-described embodiments (only FIG. 1 embodiment shown) that also includes a
thermal layer 42 that coverssemiconductor chip 14 to provide additional protection.Thermal layer 42 may be made of any highly thermal conductive elastomer material such a grease or phase change material.Thermal layer 42 adds slightly to the thermal resistance but adds improved mechanical protection fordevice 14. - The resiliency of the elastomeric member is preferably matched to the resiliency of
thermal layer 42 such that the elastomeric member supports a substantial portion of the load applied byheat sink 24 and controls the amount of deflection inthermal layer 42 so as to control the thermal resistance without damage tochip 14. In this setting, the elastomeric member can either be molded or applied at the same time asthermal layer 42.Thermal layer 42 can be positioned overchip 14 and part of the member, as shown in FIG. 7; limited toonly chip 14; or extend completely overchip 14 and the member. In either setting, the final thickness ofthermal layer 42 is selected to limit the force applied to chip 14 byheat sink 24. This is accomplished by controlling mechanical tolerances and the relative compliance of the elastomeric member andthermal layer 42. Though providing no significant thermal advantage, the member andthermal layer 42 could be combined and composed entirely of thermally conductive material. In this case, force distribution would be controlled by adjusting the shape of the elastomeric member to give it the correct compliance relative to the portion in contact withchip 14. - In the FIG. 7 embodiment,
thermal layer 42 contributes a thermal resistance proportional to the area in contact withchip 14. This is minimized by makingthermal layer 42 as thin as possible but still results in a thermal resistance higher than for the direct contact ofheat sink 24 tochip 14. - FIG. 8 shows an electronic package having an elastomeric member in accordance with one of the above-described embodiments (only FIG. 1 embodiment shown) and a high thermal
conductivity heat spreader 46.Heat spreader 46 may be made of any high thermal conductivity material such as copper or aluminum. In this setting, asmall gap 48 is positioned betweenheat spreader 46 andchip 14. When a heat sink is connected, the heat sink load appliedcloses gap 48 in the same manner as discussed with earlier embodiments. - In terms of methodology, the elastomeric member is preferably applied at the time of manufacture early in the assembly process so that it may protect
chip 14. The method of constructingelectronic package 10 may include: providingsubstrate 12;coupling chip 14 tosubstrate 12; placing an elastomeric member having portions compressible to different degreesadjacent chip 14; andcoupling heat sink 24 tosubstrate 12 such that a substantial portion of the load ofheat sink 24 is supported by the elastomeric member. As discussed above, coupling ofheat sink 24 includes compressing the elastomeric member. -
Electronic package 10 including the elastomeric member provides many advantages over rigid guard rings. As chips grow smaller and smaller the power densities require highly effective thermal solutions. Typically, this involves large and larger external heat sinks. These large heat sinks expose the chip to high static and dynamic loads. Supporting the heat sink with a carefully tailored compliant material removes this load from the device thereby minimizing damage and improving reliability. -
Electronic package 10 including the elastomeric member offer a number of other advantages beyond those discussed above. For instance, the top of the elastomeric member is available for manufacturer information as is commonly marked on finished goods. In addition, some design elements that would normally be marked can be molded in. This could both improve appearance and reduce cost. The color for the elastomeric member can also be selected to improve the appearance of the finished part. The elastomeric member also provides protection to passive components (e.g., decoupling capacitors) mounted onsubstrate 12 withchip 14. In addition, the elastomeric member provides an easier surface with which pick-and-place tools can locate parts. If the elastomeric member is applied early in the manufacturing flow, it also protectschip 14 from handling damage. - While this invention has been described in conjunction with the specific embodiments outlined above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, the embodiments of the invention as set forth above are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit and scope of the invention as defined in the following claims.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US10/043,060 US6590278B1 (en) | 2002-01-08 | 2002-01-08 | Electronic package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US10/043,060 US6590278B1 (en) | 2002-01-08 | 2002-01-08 | Electronic package |
Publications (2)
Publication Number | Publication Date |
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US6590278B1 US6590278B1 (en) | 2003-07-08 |
US20030127714A1 true US20030127714A1 (en) | 2003-07-10 |
Family
ID=21925251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/043,060 Expired - Lifetime US6590278B1 (en) | 2002-01-08 | 2002-01-08 | Electronic package |
Country Status (1)
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US (1) | US6590278B1 (en) |
Cited By (3)
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US20060202325A1 (en) * | 2005-03-08 | 2006-09-14 | International Business Machines Corporation | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments |
US20150145114A1 (en) * | 2012-09-14 | 2015-05-28 | Freescale Semiconductor, Inc. | Thermally Enhanced Package with Lid Heat Spreader |
US9159643B2 (en) | 2012-09-14 | 2015-10-13 | Freescale Semiconductor, Inc. | Matrix lid heatspreader for flip chip package |
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US7518235B2 (en) * | 2005-03-08 | 2009-04-14 | International Business Machines Corporation | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments |
US20150145114A1 (en) * | 2012-09-14 | 2015-05-28 | Freescale Semiconductor, Inc. | Thermally Enhanced Package with Lid Heat Spreader |
US9159643B2 (en) | 2012-09-14 | 2015-10-13 | Freescale Semiconductor, Inc. | Matrix lid heatspreader for flip chip package |
US9269648B2 (en) * | 2012-09-14 | 2016-02-23 | Freescale Semiconductor, Inc. | Thermally enhanced package with lid heat spreader |
US9640469B2 (en) | 2012-09-14 | 2017-05-02 | Nxp Usa, Inc. | Matrix lid heatspreader for flip chip package |
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