US20030016475A1 - Magnetoresistive element with oxide magnetic layers and metal magnetic films deposited thereon - Google Patents

Magnetoresistive element with oxide magnetic layers and metal magnetic films deposited thereon Download PDF

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US20030016475A1
US20030016475A1 US10/194,308 US19430802A US2003016475A1 US 20030016475 A1 US20030016475 A1 US 20030016475A1 US 19430802 A US19430802 A US 19430802A US 2003016475 A1 US2003016475 A1 US 2003016475A1
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layer
ferromagnetic
film
magnetic
composition
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Hiroyuki Hoshiya
Susumu Soeya
Kenichi Meguro
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HGST Japan Ltd
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Hitachi Ltd
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Publication of US20030016475A1 publication Critical patent/US20030016475A1/en
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Priority to US11/267,186 priority Critical patent/US7265948B2/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/80Constructional details
    • H10N50/85Magnetic active materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • G01R33/093Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/18Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being compounds
    • H01F10/193Magnetic semiconductor compounds
    • H01F10/1936Half-metallic, e.g. epitaxial CrO2 or NiMnSb films
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3254Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H01F10/3272Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B2005/3996Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects large or giant magnetoresistive effects [GMR], e.g. as generated in spin-valve [SV] devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3295Spin-exchange coupled multilayers wherein the magnetic pinned or free layers are laminated without anti-parallel coupling within the pinned and free layers

Definitions

  • the present invention generally relates to magnetic recording/reproducing, and more particularly to a magnetic head suitable for a high-recording density magnetic recording/reproducing device and a magnetoresistive element to be used for it, and to its manufacturing method.
  • a spin-valve magnetoresistive sensor using a multi-layered antiparallel pining layer and an antiferromagnetic exchange layer are disclosed in JP-A No. 16929/1997.
  • a spin-valve sensor using an antiferromagnetic coupling film is disclosed in JP-A-169026/1995.
  • a magnetoresistive element having a second magnetic layer including a third layer made from any of materials such as oxides, on which magnetization is substantially fixed, is disclosed in JP-A-156530/2000.
  • the magnetoresistive type of head which uses a high spin-polarized oxide material in the magnetic layer to supply current perpendicular to the surface of the film is disclosed in JP-A-340859/2000.
  • a tunnel magnetoresistive element using a high-polarized film is disclosed in JP-A-150985/2000.
  • a magnetoresistive element using a high-polarized film on a tunnel barrier layer side is disclosed in Patent No.3050189 (JP-A-135857/1999).
  • a spin-polarized element, to which a ferromagnetic material and semiconductor or a half-metalic material are connected through a non-magnetic layer is disclosed in JP-A-289115/1999.
  • the ferromagnetic tunnel magnetoresistive element using a half-metalic oxide layer is disclosed in JP-A-97766/1999.
  • a magnetoresistive device using a half-metalic material such as Fe 3 O 4 is disclosed in JP-C-504303/1996.
  • the magnetoresistive element using the magnetic layer made from the half-metalic material is disclosed in JP-A-267742/1994.
  • a spin valve sensor including thin oxide layers is disclosed in JA-348935/2000.
  • a giant magnetoresistance which is achieved by means of a multi-layered film with ferromagnetic metal layers deposited through a non-magnetic metal layer, is well known to those skilled in the art. With respect to this type of magnetoresistance, electrical resistance varies with both of magnetization formed on the ferromagnetic layer isolated by the non-magnetic layer and an orientation of the magnetization. A spin-valve structure is proposed so that said giant magnetoresistance may be applied to the magnetoresistive element.
  • the preferred output power can be supplied by achieving the structure of an antiferromagnetic film/an ferromagnetic metal layer/a non-magnetic metal layer/a soft-magnetic metal layer and by substantially fixing the magnetization of the ferromagnetic metal layer stuck fast to the antiferromagnetic film by means of an exchange coupling field induced on an interface between the antiferromagnetic film and the ferromagnetic metal layer to magnetically rotate the counterpart, that is, the soft magnetic metal layer.
  • the above-mentioned effect of magnetization fixation is simply referred to as pinned bias and the antiferromagnetic film, as a pinned bias film.
  • the ferromagnetic metal layer, on which the above-mentioned magnetization is substantially fixed is simply referred to as a pinned film or ferromagnetic pinned layer.
  • the soft magnetic metal film, which is magnetically rotated by means of the external magnetic field is simply referred to as a free layer or soft magnetic free layer.
  • the pinned layer provides such a function that it has the magnetization substantially fixed so that the magnetic field may be sensed and the antiferromagnetic film may be alternatively replaced with a hard magnetic film, that is, another material, which does not affect the magnetization unless a relatively strong magnetic field is applied.
  • the part composed of the ferromagnetic layer/the non-magnetic layer/the soft magnetic layer determines the magnitude of its magnetoresistance. Since the soft magnetic metal layer is one kind of ferromagnetic metal layer, the ferromagnetic metal layer—non-magnetic metal layer interface is responsible for the principle. It is known that the public known art allows improvement in MR ratio by inserting an oxide into the ferromagnetic metal layer or by oxidizing part of it.
  • the oxide layer is deposited at a midpoint of the ferromagnetic metal layer but a given thickness of oxide layer is not disposed at the ferromagnetic metal layer-non-magnetic metal layer interface. That is because the oxide has generally no ferromagnetic property and dose not transmit electrons, which is a major blocking factor of magnetoresistance.
  • the method for increasing magnetoresistance by applying a material of high-polarization has been also proposed but it is very difficult to laminate thin metal films such as ferromagnetic metal layers and the compounds such as the high-polarized oxide for fabricating the magnetoresistive element.
  • the thin films are laminated using the conventional film formation technique, such a problem is encountered that an amorphous or microcrystal structure or a heterogeneous crystal structure is formed.
  • magnetite Fe 3 O 4
  • the thin film formed by the sputtering method at room temperature using the target of magnetite exhibits a magnetization property of only a level ranging from one third to a half of 0.6 tesla for bulk magnetite.
  • the temperature of a substrate needs to be turned up to approx. 500° C.
  • the objective of the present invention is to provide a magnetic recording device with high long-term reliability, which has an ability of high-density recording, or a magnetic head using a magnetoresistive element. More specifically, the objective of the present invention is to achieve a spin valve type of magnetoresistive element with a high MR ratio, which has a ferromagnetic compound layer made from any of materials such as oxide material with a high-polarization disposed at the interface with a non-magnetic layer to provide the magnetic recording/reproducing device employing the element.
  • the spin valve type of giant magnetoresistive multi-layered film used as the magnetoresistive element that is, the magnetoresistive element having the multi-layered composition of the soft magnetic free layer/the non-magnetic intermediate layer/the ferromagnetic pinned layer/the antiferromagnetic film must be used.
  • the antiferromagnetic film which applies an exchange coupling bias to substantially fix the magnetization on the ferromagnetic pinned layer, may be formed by sticking fast directly to the ferromagnetic pinned layer, or have the same effect through indirect magnetic coupling.
  • any other bias applying means for example, residual magnetization on the hard magnetic film or a current bias may be used.
  • the high-polarized layer must be disposed on at least the interface of the ferromagnetic pinned layer with the non magnetic intermediate layer.
  • the high-polarized layer is deposited on at least the interface of the soft magnetic free layer with the non-magnetic intermediate layer.
  • the high-polarized layer may be deposited on the interface between the non-magnetic intermediate layers of both of the ferromagnetic pinned layer and the soft magnetic free layer.
  • the high-polarized layer is easy to use for the ferromagnetic pinned layer.
  • the composition which is formed as a multi-layered construction of the first ferromagnetic layer/the non-magnetic inserted layer/the second ferromagnetic layer, is employed.
  • the high-polarized layer which is disposed on the interface sticking fast to the non-magnetic intermediate layer, may be made from any of ferromagnetic compounds such as half-metal or a mixture of the ferromagnetic compound and a metal and in particular, Fe—O layer is preferably used.
  • the Fe—O layer is formed by continuously laminating together with other metal layers alternately at room temperature or the substrate temperature of 200° C. or lower using any of methods such as sputtering followed by heat-treating the layer to deposit Fe 3 O 4 or Fe 3 O 4-x in the Fe—O layer.
  • the Fe—O layer is made from Fe, in which oxygen atoms are dissolved, the ferromagnetic oxide such as magnetite, the Fe mixture with the ferromagnetic oxide such as magnetite, or Fe 3 O 4-x , (x is a range of values 0-3, and preferably a range of values 2-3), and preferably is formed into the composition with a less oxygen content than that of the stoichiometric composition of magnetite (Fe 3 O 4 ).
  • the composition close to the binary Fe—O system in the equilibrium state that is, a phase with a high-polarization to allow the magnetoresistance to change by inducing the phenomenon of crystal precipitation in the direction near to the binary Fe—Fe 3 O 4 phases can be formed in the layer.
  • a so-called ferrite composition which is the composition with Fe partially replaced with Ni, Co, Mn, Cr, or Mn, may be used for the primary component.
  • the ferromagnetic pinned layer or the soft magnetic free layer may be composed of the high poralizability of layer alone, although by laminating with the high-polarized layer, the metallic ferromagnetic material, and so on, any of structures such as the structure of the high-polarized layer/CoFe layer/Ru layer/CoFe layer/antiferromagnetic layer can be formed for achieving a higher MR ratio and exchange coupling field, as well as appropriate waveform symmetry property.
  • the structure of the high-polarized layer/CoFe layer/NiFe layer can be formed as the soft magnetic free layer to achieve a higher MR ratio and soft magnetic property.
  • the thickness of the high-polarized layer can be made 0.5 nm or more to improve the rate of resistance magnetization and the thickness below 5 nm make the soft magnetic property better with an effect that the interlayer coupling field is reduced.
  • the thickness any of a range 1-3 nm, is preferable because both of higher MR ratio and reduced interlayer coupling field can be achieved.
  • Cu is preferably used for the non-magnetic intermediate layer, however, any of conductive metals such as Au, Ag, Al, Pt, Pd, Os, Re, Ru, and Rh may be used if appropriate, or alloys with any of them may be used.
  • conductive metals such as Au, Ag, Al, Pt, Pd, Os, Re, Ru, and Rh may be used if appropriate, or alloys with any of them may be used.
  • At least one pair of electrodes which sense the output when current is supplied, are disposed at the magnetoresistive element composing a multi-layered composition.
  • the current is supplied parallel to the layer structure of the multi-layered composition to sense giant magnetoresistance due to scattering on the interface.
  • the current is supplied perpendicular to the layer structure of the multi-layered composition to cause polarized electrons in the high-polarized layer to transmit the interface and generate magnetoresistance for sensing magnetoresistance.
  • the magnetoresistive element may have a single magnetic domain structure to prevent noise from occurring by making the soft magnetic free layer into the single domain magnetic structure.
  • the hard magnetic film which has residual magnetization at its ends along the film surface of the magnetoresistive element and perpendicular to the orientation of magnetic field to be sensed, is disposed.
  • the single magnetic domain is achieved by disposing, for example, the hard magnetic film having residual magnetization adjacent to the magnetoresistive element along its film thickness to form the same shape of ends on the hard magnetic film and the multi-layered composition of the magnetoresistive element.
  • the present invention in the magnetoresistive element using the materials and composition, and in the magnetic recording/reproducing device with the magnetoresistive element incorporated in the reproducing part, high-density recording, that is, recording with short recording wavelengths, which are written on the recording medium, and narrow widths of recording trucks, is achieved, enabling sufficient reproducing output to ensure better recording.
  • a magnetoresistive element with a better bias property and high output power and a magnetic head using it can be achieved and in particular, the magnetic head and a high recording-density of magnetic recording/reproducing device with a better reproducing output and bias property can be achieved.
  • FIG. 1 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention
  • FIG. 2 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention
  • FIG. 3 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention
  • FIG. 4 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention
  • FIG. 5 is a main sectional view showing a magnetoresistive head according to an embodiment of the present invention.
  • FIG. 6 is a main sectional view showing a magnetoresistive head according to an embodiment of the present invention.
  • FIG. 7 is a main sectional view showing a magnetoresistive head according to an embodiment of the present invention.
  • FIG. 8 is a characteristic drawing showing the relationship between the compositions of a Fe—O film and saturation flux densities
  • FIG. 9 is a view showing a X-ray diffraction profiles of the Fe—O film with Fe 31 at % added as deposition and after heat-treatment;
  • FIG. 10 is a characteristic drawing showing magnetization curves of the Fe—O film with Fe 31 at % added as deposition and after heat-treatment;
  • FIG. 11 is a characteristic drawing showing magnetization curves and magnetoresistive curves of a spin valve using the Fe—O film with Fe 31 at % added;
  • FIG. 12 is a characteristic drawing showing the thickness of the Fe—O layer, as well as the amount of magnetization, the sheet resistance, and the MR ratio of the spin valve;
  • FIG. 13 is a characteristic drawing showing the relationship among the thickness of a Cu non-magnetic intermediate layer, the MR ratio and sheet resistance of the spin valve film;
  • FIG. 14 is a characteristic drawing showing the relationship among the thickness of the Cu layer, the MR ratio, and the sheet resistance of the spin valves with various compositions using the Fe—O layer;
  • FIG. 15 is a schematic drawing showing the magnetic head mounting the magnetoresistive element of the present invention.
  • FIG. 16 is a block diagram showing the composition example of the magnetic recording/reproducing device of the present invention.
  • a thin film making up a giant magnetoresistive element multi-layered film according to the present invention is fabricated by radio-frequency magnetron sputtering equipment as described below.
  • the materials described below are sequentially laminated on a ceramic substrate with a thickness of 1 mm to form the thin film.
  • Tantalum, nickel-20 at %iron alloy, cupper, cobalt, MnPt, ruthenium, and Fe 3 O 4 (magnetite) are used for sputtering targets.
  • One square cm of Fe and Ni chips are appropriately disposed on a Co target for adjusting the composition.
  • one square cm of, for example, Fe chips are disposed on the magnetite target for adjusting the composition.
  • composition with the Fe—O layer formed is expressed by the total amount of magnetite (Fe 3 O 4 ) plus Fe, for example, the expression Fe10 at % in the Fe—O layer means Fe 3 O 4 90 at %—Fe10 at %.
  • plasma is generated in equipment by applying radio-frequency of current to individual cathodes disposed at the target and then shutters disposed at the individual cathodes are opened and closed one by one.
  • an approx. 80 oersted of magnetic field is applied parallel to the substrate using a permanent magnet to give uniaxial anisotropy.
  • the formed film is heat-treated in the magnetic field under the vacuum condition at 270° C. for three hours to transform the phase of the antiferromagnetic film, which results in deposition of the high-polarized compound layer in the Fe—O layer, and measure magnetoresistance at room temperature.
  • Elements are patterned on a substrate by being subjected to the photoresist process. After then, the substrate is slider-processed and mounted on the magnetic recording device.
  • FIG. 1 is a view showing an example of the composition of a magnetoresistive multi-layered film to be used for a magnetoresistive element.
  • Ti3 expresses a component material as an example of the multi-layered composition and its thickness in nm.
  • the magnetoresistive multi-layered film 10 is formed by continuously laminating a underlayer film 14 , an antiferromagnetic film 11 , a ferromagnetic pinned layer 15 , a non-magnetic intermediate layer 12 , a soft magnetic free layer 13 , and a protective film 37 on the substrate 50 .
  • electric resistance varies with an angle defined between the magnetization orientation of the ferromagnetic pinned layer 15 and that of the soft magnetic free layer 13 by means of giant magnetoresistance or tunnel magnetoresistance.
  • the underlayer film 14 of the magnetoresistive multi-layered film 10 improves the crystallinity and crystalline orientation of part on the underlayer film 14 of the magnetoresistive multi-layered film 10 .
  • the underlayer film 14 has a Ta/NiFe composition but may have another composition. The use of the composition with no underlayer film 14 formed does not act counter to the objective of the present invention.
  • the soft magnetic free layer 13 is shown by a multi-layered construction comprising the high-polarized layer 16 , the first soft magnetic film 131 , and the second soft magnetic film 132 .
  • this is applied to achieve a higher MR ratio by means of the high-polarized layer 16 sticking to the non-magnetic intermediate layer 12 , the first soft magnetic film on the side where the high-polarized layer 16 sticks is formed using a relatively thin layer of Co alloy, for example, Co 90 Fe 10 alloy or Co 80 Fe 8 Ni 12 alloy to control the diffusion and mixture of the high-polarized layer 16 and the second soft magnetic film 132 , the second soft magnetic film on the side of the non-magnetic intermediate layer 12 is formed using, for example, a relatively thick layer NiFe alloy for implementing the multi-layered film with better soft magnetic property and higher MR ratio.
  • Co alloy for example, Co 90 Fe 10 alloy or Co 80 Fe 8 Ni 12 alloy
  • the magnetization state in the same orientation is used to magnetically handle as a single body.
  • the high-polarized film 16 , the first soft magnetic film 132 , and the second soft magnetic film 131 which form the soft magnetic free layer 13 , are directly laminated with no intermediate layer deposited or if any layer exists between them, the thickness of the layer is set to an appropriate value, in particular 1 nm or less to made it thinner.
  • the soft magnetic free layer 13 is composed of the multilayer of the high-polarized layer 16 /the first soft magnetic film 131 , or alternatively, it is made from the third or more multilayer in addition to the first and second ferromagnetic films.
  • the factors such as the magnitude of magnetization aeolotropy is set so that the orientation, in which the soft magnetic free layer 13 is magnetized, may be the same as that of an approximate truck width with no magnetic field applied.
  • the high-polarized layer 16 is preferably made from the compound such as half-metal with high-polarization, for example, Fe 3 O 4 and in particular, more preferably made from a Fe-rich Fe—O film or a Fe—O film containing less oxygen than Fe 3 O 4 , or alternatively, Fe may be partially replaced with Mn, Cr, Ni, or Co. Further, the high-polarized layer 16 with a thickness of 10nm or less, in particular of any of 0.5-3 nm, has a superior magnetic property, reduces the interlayer coupling between the soft magnetic free layer 13 and the ferromagnetic pinned layer 15 , and exhibits high magnetoresistance.
  • the ferromagnetic pinned layer 15 is formed using the first ferromagnetic film 151 on the side where it sticks to the non-magnetic intermediate layer 12 , the second ferromagnetic film 152 on the side where it sticks to a-pinned bias applying means represented by the antiferromagnetic film 11 , and an antiparallel coupling layer 154 inserted between the first and second ferromagnetic films and coupled so that the first ferromagnetic film 151 and the second ferromagnetic film 152 may have antiferromagnetic property, that is antiparallel magnetization.
  • compositions have effects that the output of the static magnetic field from the patterned end of the ferromagnetic pinned layer may be adjusted and when used for a magnetic head, it may make reproducing symmetric property better.
  • the composition of the ferromagnetic pinned layer including the antiparallel coupling layer is effective when applied to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer does not act contrast to the purport of the present invention if it is employed in other compositions and applications.
  • FIG. 2 shows another example composition of the magnetoresistive multi-layered film to be used for the magnetoresistive element according to the prevent invention.
  • the notation in the figure is the same as that of FIG. 1.
  • the magnetoresistive multi-layered film 10 is formed by continuously laminating the underlayer film 14 , antiferromagnetic film 11 , ferromagnetic pinned layer 15 , non-magnetic intermediate layer 12 , the soft magnetic free layer 13 , and the protective film 37 on the substrate 50 .
  • electric resistance varies with the angle defined between the magnetization orientation of the ferromagnetic pinned layer 15 and that of the soft magnetic free layer 13 by means of giant magnetoresistance or tunnel magnetoresistance.
  • compositions and effects of the underlayer film 14 and the like, the soft magnetic free layer 13 , and the like are the same as those shown in FIG. 1, their descriptions are omitted. If the compositions of the underlayer film 14 , the soft magnetic free layer 13 , and the like are somewhat different from those in the figure, it does not act counter to the purport of the present invention.
  • an oxide-inserting layer 155 is included in the composition of the ferromagnetic pinned layer 15 .
  • the ferromagnetic pinned layer 15 is formed using the third ferromagnetic film sticking to the non-magnetic intermediate layer 12 , the second ferromagnetic film 152 on the side where it sticks to the pinned bias applying means represented by the antiferromagnetic film 11 , the first ferromagnetic film 151 antiferromagnetically coupling to the second ferromagnetic film through the antiparallel coupling film 154 , and the oxide inserting layer 155 inserted between the first ferromagnetic film 151 and the third ferromagnetic film, which increases the crystallinity of the third ferromagnetic film to enhance the MR ratio.
  • composition of the ferromagnetic pinned layer containing the antiparallel coupling layer is effective in application to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer does not act contrary to the purport of the present invention if it is employed in other compositions or applications.
  • the composition containing the oxide inserting layer 155 with the soft magnetic free layer 13 which has the high-polarized layer 16 at the interface with the non-magnetic intermediate layer 12 , crystallinity is improved and high MR ratio is achieved.
  • FIG. 3 is the view showing a further another example of the magnetoresistive multi-layered film to be used for the magnetoresistive element of the present invention.
  • the notation in the figure is the same as that shown in FIG. 1.
  • the magnetoresistive multi-layered film 10 is formed by continuously laminating the underlayer film 14 , the antiferromagnetic film 11 , ferromagnetic pinned layer 15 , non-magnetic intermediate layer 12 , the soft magnetic free layer 13 , and the protective film 37 on the substrate 50 .
  • the ferromagnetic pinned layer 15 is formed using the third ferromagnetic film sticking to the non-magnetic intermediate layer 12 , the second ferromagnetic film 152 on the side where it sticks to the pinned bias applying means represented by the antiferromagnetic film 11 , the first ferromagnetic film 151 antiferromagnetically coupling to the second ferromagnetic film through the antiparallel coupling film 154 , and the high-polarized layer 161 sticking to the non-magnetic intermediate layer 12 at the interface.
  • the composition of the ferromagnetic pinned layer containing the antiparallel coupling layer is effective in application to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer does not act contrary to the purport of the present invention if it is employed in other compositions or applications.
  • the soft magnetic free layer 13 formed according to the composition has a continuous multi-layered composition, which is ferromagnetically coupled so that it implements the magnetization process as one magnetic film.
  • the soft magnetic free layer 13 is made from the multilayer of the high-polarized layer 162 sticking to the non-magnetic intermediate layer 12 at the interface, the first soft magnetic film 131 , and the second magnetic film 132 .
  • the second soft magnetic film 132 may be omitted.
  • Two high-polarized layers 161 and 162 are adjacent one another through the non-magnetic intermediate layer 12 , inducing magnetoresistance.
  • the high-polarized thin layers with a thickness of 1-2 nm, in particular, reduce the interlayer coupling field.
  • FIG. 4 is the view showing a further another example of the magnetoresistive multi-layered film to be used for the magnetoresistive element of the present invention.
  • the notation in the figure is the same as that shown in FIG. 1.
  • the magnetoresistive multi-layered film 10 is formed by continuously laminating the underlayer film 14 , the soft magnetic free layer 13 , the non-magnetic intermediate layer 12 , the ferromagnetic pinned layer 15 , the antiferromagnetic film 11 , and the protective film 37 on the substrate 50 .
  • electric resistance varies with the angle defined between the magnetization orientation of the ferromagnetic pinned layer 15 and that of the soft magnetic free layer 13 by means of giant magnetoresistance or tunnel magnetoresistance.
  • compositions and effects of the underlayer film 14 and the like are the same as those shown in FIG. 1, their descriptions are omitted. If the composition of the underlayer film 14 and the like are somewhat different from those in the figure, it does not act counter to the purport of the present invention.
  • high-polarized layer 16 is included in the composition of the ferromagnetic pinned layer 15 .
  • the ferromagnetic pinned layer 15 is formed using the high-polarized layer 16 sticking to the non-magnetic intermediate layer 12 , the second ferromagnetic film 152 on the side where it sticks to the pinned bias applying means represented by the antiferromagnetic film 11 , and the first ferromagnetic film 151 antiferromagnetically coupling to the second ferromagnetic film 152 through the antiparallel coupling film 154 .
  • composition of the ferromagnetic pinned layer 15 containing the antiparallel coupling layer 154 is effective in application to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer 154 does not act contrary to the purport of the present invention if it is employed in other compositions or applications.
  • the soft magnetic free layer 13 formed according to the composition has a continuous multi-layered composition, which is ferromagnetically coupled so that it implements the magnetization process as one magnetic film.
  • a magnetostriction or an inserting layer to improve the magnetic property and crystallinity may be included between the soft magnetic free layer 13 and the underlayer film 14 .
  • the high-polarized layer 16 are adjacent to the soft free layer 13 , in particular, the first soft magnetic film 131 , through the non-magnetic intermediate layer 12 , inducing magnetoresistance.
  • FIG. 5 is a sectional view facing to a magnetic medium showing an example of the composition of the magnetoresistive head using the magnetoresistive multi-layered film of the present invention.
  • the left-right direction on the paper indicates the direction of the truck width on the magnetic head and the width on the paper indicates the direction of the element height.
  • the magnetic head according to the embodiment is formed by laminating a lower magnetic shield 35 , and a lower gap shield film 71 on the substrate 50 , on which the magnetoresistive multi-layered film 10 and a magnetic domain control film 45 are deposited, further on which an upper gap film 72 and a upper magnetic shield 36 are deposited to form a reproducing gap 43 for detecting reproduced signals.
  • An electrode 40 is disposed in contact with the magnetoresistive multi-layered film 10 to detect any application of sensing current or any change in electric resistance.
  • the magnetic domain control film 45 which is formed using the magnetic film having residual magnetization by means of coupling to the hard magnetic film or the antiferromagnetic film and the like, is deposited slightly apart from the magnetoresistive multi-layered film 10 so that it may induce bias effects on the magnetoresistive multi-layered film 10 for insulting the single magnetic domain.
  • the composition of the magnetoresistive multi-layered film 10 may be the same as those described in the embodiments 1-4, although it is preferable that the magnetic domain control film 45 is composed so that the soft magnetic free layer is disposed on the lamination surface side.
  • the producing magnetic gap 43 retains the magnetoresistive multi-layered film 10 at the rough center of the gap, allowing the magnetic signal component leaking into the reproducing magnetic gap 43 to be reproduced at a high resolution.
  • FIG. 6 is a sectional view facing to a magnetic medium showing another example of the composition of the magnetoresistive head using the magnetoresistive multi-layered film of the present invention. Similar to FIG. 5, the left-right direction on the paper indicates the direction of the truck width on the magnetic head and the width on the paper indicates the direction of the element height.
  • the magnetic head according to the embodiment is formed by laminating the lower magnetic shield 35 , and a lower conductive gap film 73 on the substrate 50 , on which the magnetoresistive multi-layered film 10 and the magnetic domain control film 45 are deposited, further on which an upper conductive gap film 74 and the upper magnetic shield 36 are deposited to form the reproducing gap 43 for detecting reproduced signals.
  • the electrode 40 is disposed in contact with the magnetoresistive multi-layered film 10 and the magnetic domain control film 45 to detect any change in electric resistance when sensing current is supplied in the direction of the thickness of the magnetoresistive multi-layered film 10 .
  • the magnetic domain control film 45 which is formed using the magnetic film having residual magnetization by means of exchange coupling to the hard magnetic film or the antiferromagnetic film, is deposited slightly apart from the magnetoresistive multi-layered film 10 so that it may induce bias effects on the magnetoresistive multi-layered film 10 for insulting the single magnetic domain.
  • the composition of the magnetoresistive multi-layered film 10 may be the same as those described in the embodiments 1-4, although it is preferable that the magnetic control film 45 is composed so that the soft magnetic free layer is disposed on the lamination surface side.
  • the antiferromagnetic film 11 with the same width as that of any other parts of the magnetoresistive multi-layered film 10 is formed, although the antiferromagnetic film with the size changed may be composed so that current bypasses the antiferromagnetic film 11 .
  • the producing magnetic gap 43 retains the magnetoresistive multi-layered film 10 at the rough center of the gap, allowing the magnetic signal component leaking into the reproducing magnetic gap 43 to be reproduced at a high resolution.
  • FIG. 7 is a sectional view facing to a magnetic medium showing further another example of the composition of the magnetoresistive head using the magnetoresistive multi-layered film of the present invention. Similar to FIG. 5, the left-right direction on the paper indicates the direction of the truck width on the magnetic head and the width on the paper indicates the direction of the element height.
  • the magnetic head according to the embodiment is formed by laminating the lower magnetic shield 35 and the lower conductive gap film 73 on the substrate 50 , on which the magnetoresistive multi-layered film 10 is deposited, further on which the upper conductive gap film 74 and the upper magnetic shield 36 are deposited to form the reproducing gap 43 for detecting reproduced signals.
  • the electrode 40 is disposed directly at the magnetoresistive multi-layered film 10 to detect any application of sensing current or any change in electric resistance.
  • the magnetic domain control film 45 which is formed using the magnetic film having residual magnetization by means of exchange coupling to the hard magnetic film or the antiferromagnetic film, is deposited so that its ends may roughly come into contact with the left and right sides of the magnetoresistive multi-layered film 10 , allowing it to have bias effects on the magnetoresistive multi-layered film 10 .
  • the producing magnetic gap 43 retains the magnetoresistive multi-layered film 10 at the rough center of the gap, allowing the magnetic signal component leaking into the reproducing magnetic gap 43 to be reproduced at a high resolution.
  • FIG. 8 is a view showing the relationship between the composition of the Fe—O film and a saturation magnetic flux density.
  • the Fe—O layer is formed as single-layer film with a thickness of approx. 0.3 ⁇ m for easy measurement.
  • the saturation magnetic flux density of the Fe—O film containing no Fe which is made by the sputtering method using the magnetite (Fe 3 O 4 ) target, is 0.2 tesla at film formation, at most 0.3 tesla or lower after three-hour heat-treatment at 270° C., which is a half or lower of 0.6 tesla at saturated magnetization of bulk magnetite (Fe 3 O 4 ).
  • the saturation magnetic flux density of the Fe—O film with approx. 30 at % of Fe added is 0.5 tesla before heat-treatment and 0.7 tesla or more after heat-treatment. At that time, the magnetization might be induced by Fe.
  • FIG. 9 shows X-ray diffraction curves representing the saturated flux densities of the Fe—O film with 31 at % of Fe added as deposition (a) and after heat-treatment (b).
  • deposition before heat treatment
  • the broad peaks corresponding to wider plane spacings than those of the normal Fe (110) are observed, indicating that the Fe—O film has a structure near to that of Fe, in which oxygen is dissolved. For this reason, it is suggested that most of magnetization is contributed by metal Fe rather than Fe 3 O 4 in the composition phase.
  • FIG. 10 shows the magnetization curves of the Fe—O film with 31 at % of Fe added as deposition (a) and after heat-treatment (b).
  • the magnetization curve as deposition exhibits low coercivity and draws perpendicular magnetization loops, suggesting that ferromagnetic Fe or Fe—O particles are dispersed in its non-magnetic matrix.
  • the magnetization curve after heat-treatment exhibits approx. 500 Oe of coercivity, suggesting that it reflects magnetocrystalline anisotropy of magnetite (Fe 3 O 4 ) precipitated by heat-treatment.
  • Electric resistance of these Fe—O films depend on the film thickness. Approx. 0.3 ⁇ m thickness of film given here exhibits 1224 ⁇ cm as deposition and 566 ⁇ cm after heat-treatment.
  • FIG. 11 shows the magnetization and magnetoresistive curves of the spin valve film when the Fe—O layer with Fe 31 at % added is used for the soft magnetic free layer and when it is used for ferromagnetic pinned layer.
  • the Fe—O layers have 20 nm or 10 nm of thickness.
  • the magnetoresistive curves were measured by supplying current in-plane, so called the CIP measuring method.
  • the Fe—O layer is used for the soft magnetic free layer
  • the magnetization curves of the ferromagnetic pinned layer and the soft magnetic free layer regardless of Cu non-magnetic intermediate layer being thick (10 nm). That is because the interlayer coupling between the ferromagnetic layer and the soft magnetic free layer is ferromagnetic.
  • the Fe—O layer used for the soft magnetic free layer is sufficiently strong.
  • the magnetoresistive curve exhibits a low resistance of 1% or lower.
  • the Fe—O layer when used for ferromagnetic pinned layer, no clear distinction can be observed between the magnetization curves of the ferromagnetic pinned layer and the soft magnetic free layer regardless of Cu non-magnetic intermediate layer being thick (10 nm). Thus, the magnetoresistive curve exhibits a low resistance of 1% or lower. Note that as known from the amount of magnetization represented by the magnetization curve, the Fe—O layer used for the ferromagnetic pinned layer is sufficiently ferromagnetic and exchange coupling was achieved by forming the ferromagnetic pinned layer as the multilayer of Fe—O layer/CoFe layer in contact with the MnPt antiferromagnetic film.
  • FIG. 12 shows the relationship between the thickness of the Fe—O layer and the magnetization amount, sheet resistance, and MR ratio of the spin valve film. Similar to FIG. 11, The Fe—O layer is used for the soft magnetic free layer and ferromagnetic pinned layer. For convenient, the relationship between the thickness and the amount of magnetization of the Fe—O single-layer film is shown as well.
  • the amount of magnetization of the Fe—O layer decreases gradually along a straight line corresponding to the approx. 0.8 tesla and reaches almost 0 (zero) when the thickness of the layer becomes thinner than 10 nm.
  • the magnetization amount is on the straight line corresponding to approx. 1 (one) tesla for both of the ferromagnetic pinned layer and the soft magnetic free layer and draws the straight line with a thickness of down to 1 nm in either case.
  • the Fe—O layer with in the spin valve may retains a high magnetization of one tesla. That may be because the effects given by the underlayer film of the spin valve film and formation of the Fe—O layer made from any of the materials, CoFe, Cu, and the like improve crystallinity.
  • Sheet resistance not so strongly depends on the thickness of the Fe—O layer. That is because the electric resistance of the Fe—O layer is higher than that of any other metal layer.
  • the dependence of the MR ratio on the layer thickness varies between the ferromagnetic pinned layer and the soft magnetic free layer.
  • the Fe—O layer When used for the soft magnetic free layer, it may drop if the thickness of the Fe—O layer becomes thinner than 2 nm. That may be because when the Fe—O layer with a thickness of 1 nm is used for soft magnetic free layer, the amount of magnetization deviates from the straight line, indicating that the amount of magnetization is reduced.
  • the MR ratio increases as-the layer thickness becomes thinner. This means that the interlayer coupling field decreases as the thickness of the Fe—O layer becomes thinner.
  • the MR ratio decreases but not increases. That may be because since the Cu layer is formed on the Fe—O layer, the substrate has effects on the Cu layer on the sufficiently thick Fe—O layer.
  • the MR ratio increases again and it reaches a high value for the Fe—O layer with a thickness of 1 nm. This means that as the Fe—O layer becomes thinner, the interlayer coupling field is reduced.
  • the amount of magnetization of the Fe—O layer in the ferromagnetic pinned layer is better even if the layer thickness is 1 nm.
  • FIG. 13 is a view showing the amounts of Fe added to the Fe—O layer, the thickness of the Cu non-magnetic intermediate layer and the property of the spin valve film.
  • the MR ratio increases as the Cu layer becomes thinner while it decreases when the interlayer coupling field become large even if the Cu layer is thin.
  • the Cu layer with a thickness of 10 nm exhibits almost the same MR ratio regardless of its composition, although the MR ratio begins to decrease in the Cu layer with a thickness of 7 nm when the amount of Fe added is 20 at % and continuously reduces in the Cu layer as the amount of Fe added increases.
  • the MR ratio reaches the maximum value when the amount of Fe added is 40 at % and the high MR ratio is achieved when the amount of Fe added is any of 30-55 at %.
  • the MR ratio varies depending on it, that is, 20, 30, or 40 at %.
  • the sheet resistance varies with the thickness of the Cu layer only but does not depend on the Fe composition.
  • FIG. 14 is a view showing the relationship among the thickness of the Cu layers in the spin valve films, which have various compositions using the Fe—O layer, the MR ratio, and the sheet resistance.
  • Types A, B, and C have the Fe—O layer only in the soft magnetic free layer while types D and E use the multi-layered construction of the Fe—O layer/CoFe layer in the soft magnetic free layer.
  • Types B, C, and E have the oxide inserting layer in the ferromagnetic pinned layer precipitated.
  • a difference between the types B and C is in that the former has a thickness of 3 nm while the latter, 2 nm.
  • the MR ratio does not increase even if the thickness of the Cu layer becomes thinner than 7 nm while in the type B composition, the MR ratio does not decease even if the thickness of the Cu layer becomes thinner than 3-5 nm,
  • the MR ratio gradually increases until the Cu layer thickness reaches 2-3 nm and a high MR ratio, 5-7% is achieved.
  • the sheet resistance increases as the thickness of the Cu layer becomes thinner regardless of the combination of the fixes layer or the Fe—O layer and the CoFe layer.
  • FIG. 15 is a schematic view showing the magnetic head mounting the magnetoresistive element of the present invention.
  • the magnetoresistive multi-layered film 10 , the magnetic domain control film (not shown), the electrode 40 , the lower shield 35 , the upper shield 36 , the lower magnetic core 84 , the coil 42 , and the upper core 83 are formed on the substrate 50 .
  • the magnetic head has the structure with the upper magnetic shield 36 and the lower magnetic core 84 disposed. Note that the use of the upper magnetic shield and the lower magnetic core, which are made from the same material, does not act contract to the purport of the present invention.
  • FIG. 16 a view showing an example of the magnetic recording/reproducing device of the present invention.
  • a disk 95 holding a recording medium 91 which records magnetically information is rotated by means of a spindle motor 93 , and a head slider 90 with the magnetic head attached shown in FIG. 15 is guided onto the truck on the disk 95 by means of an actuator 92 .
  • the actuator 92 is preferably of rotary actuator type.
  • Recording signals are recorded on the medium by means of the recording head through a signal processing system 94 and the output from the reproducing head is handled as reproducing signals through the signal processing system 94 .
  • the reproducing head moves onto the desired recording truck, the accurate positions on the truck can be detected using high sensitivity of outputs from the reproducing head and the positioning of the head slider can be performed by controlling the actuator.
  • one head slider 90 and one disk 95 are shown, although more than one head sliders and disks may be used.
  • the recording medium 91 may be disposed on both the sides of the disk 95 for recording information. When is desired that information is recorded on both sides of the disk, individual head sliders 90 are also disposed on both sides of the disk.
  • a method for manufacturing the above magnetoresistive element comprises the steps of: mixing the oxide of Co, Fe, Ni, Mn, and Cr or the mixed oxide thereof and metals Co, Fe, Ni, Mn, and Cr or alloys thereof by means of vacuum thin film formation such as simultaneous sputtering; and heat treating a resulting mixture at 200-400° C. to form said high-polarized layer.
  • this method comprises the steps of: forming a metal thin film layer; and exposing said metal thin film layer to an atmosphere containing reactive gas such as oxygen for oxidization or chemical combination, thereby forming said high-polarized layer.
  • a magnetic head in which a magnetism sensitive part comprises the above magnetoresistive element.

Abstract

No related magnetoresistive multi-layered films made from a metal magnetic film provide sufficient reproducing output power. A high-polarized layer with a thickness of 10 nm or less is formed as a Fe-rich Fe—O layer in contact with the interface of a non-magnetic intermediate layer and the resulting layers are heat treated to form a multi-layered film of ferromagnetic Fe—O layers, achieving a magnetoresistive element having high magnetoresistance.

Description

    FIELD OF THE INVENTION
  • The present invention generally relates to magnetic recording/reproducing, and more particularly to a magnetic head suitable for a high-recording density magnetic recording/reproducing device and a magnetoresistive element to be used for it, and to its manufacturing method. [0001]
  • BACKGROUND OF THE INVENTION
  • A spin-valve magnetoresistive sensor using a multi-layered antiparallel pining layer and an antiferromagnetic exchange layer are disclosed in JP-A No. 16929/1997. A spin-valve sensor using an antiferromagnetic coupling film is disclosed in JP-A-169026/1995. A magnetoresistive element having a second magnetic layer including a third layer made from any of materials such as oxides, on which magnetization is substantially fixed, is disclosed in JP-A-156530/2000. [0002]
  • The Abstracts of 23th Academic Lectures, 6aA-5 published by the Magnetics Society of Japan describes the spin valve film having a magnetization pinned layer including an ultra thin oxide layer. Digest of Intermag 2000, FA-08 describes a giant magnetoresistive (GMR) film using also a thin oxide layer. Digest of Intermag 2000, FA-07 describes the GMR film with a protective oxide film deposited on a free layer. Digest of Intermag 2000, BQ-12 describes the GMR film with a protective oxide film deposited on a free layer. Digest of Intermag 2000, FA-09 describes the spin valve film using the magnetic oxide layer. Digests of Intermag 1999, DB-01 describes the spin valve film using the pinned layer with the oxide layer inserted. [0003]
  • The magnetoresistive type of head, which uses a high spin-polarized oxide material in the magnetic layer to supply current perpendicular to the surface of the film is disclosed in JP-A-340859/2000. A tunnel magnetoresistive element using a high-polarized film is disclosed in JP-A-150985/2000. A magnetoresistive element using a high-polarized film on a tunnel barrier layer side is disclosed in Patent No.3050189 (JP-A-135857/1999). A spin-polarized element, to which a ferromagnetic material and semiconductor or a half-metalic material are connected through a non-magnetic layer is disclosed in JP-A-289115/1999. [0004]
  • The descriptions of a ferromagnetic tunnel magnetoresistive element using LaSrMnO[0005] 3 as a half-metalic material are found in Applied Physics Letters, vol. 73, 1008 (1998). Applied Physics Letters, vol 74, 4017 (1999) describes ferromagnetic tunnel magnetoresistance achieved by means of materials, iron oxide and Co.
  • The ferromagnetic tunnel magnetoresistive element using a half-metalic oxide layer is disclosed in JP-A-97766/1999. A magnetoresistive device using a half-metalic material such as Fe[0006] 3O4 is disclosed in JP-C-504303/1996. The magnetoresistive element using the magnetic layer made from the half-metalic material is disclosed in JP-A-267742/1994. A spin valve sensor including thin oxide layers is disclosed in JA-348935/2000.
  • In the related art, it is impossible to successfully dispose the magnetoresistive element, which acts on an external magnetic field with sufficient sensitivity and output power and provides good characteristics with a well symmetric property, at the reproducing part of a magnetic recording device, which makes it different to implement the function indispensable to the device with a considerably high level of recording density. [0007]
  • A giant magnetoresistance, which is achieved by means of a multi-layered film with ferromagnetic metal layers deposited through a non-magnetic metal layer, is well known to those skilled in the art. With respect to this type of magnetoresistance, electrical resistance varies with both of magnetization formed on the ferromagnetic layer isolated by the non-magnetic layer and an orientation of the magnetization. A spin-valve structure is proposed so that said giant magnetoresistance may be applied to the magnetoresistive element. This means that the preferred output power can be supplied by achieving the structure of an antiferromagnetic film/an ferromagnetic metal layer/a non-magnetic metal layer/a soft-magnetic metal layer and by substantially fixing the magnetization of the ferromagnetic metal layer stuck fast to the antiferromagnetic film by means of an exchange coupling field induced on an interface between the antiferromagnetic film and the ferromagnetic metal layer to magnetically rotate the counterpart, that is, the soft magnetic metal layer. [0008]
  • Hereafter, in the following descriptions, the above-mentioned effect of magnetization fixation is simply referred to as pinned bias and the antiferromagnetic film, as a pinned bias film. In addition, the ferromagnetic metal layer, on which the above-mentioned magnetization is substantially fixed, is simply referred to as a pinned film or ferromagnetic pinned layer. Similarly, the soft magnetic metal film, which is magnetically rotated by means of the external magnetic field, is simply referred to as a free layer or soft magnetic free layer. [0009]
  • The pinned layer provides such a function that it has the magnetization substantially fixed so that the magnetic field may be sensed and the antiferromagnetic film may be alternatively replaced with a hard magnetic film, that is, another material, which does not affect the magnetization unless a relatively strong magnetic field is applied. [0010]
  • In the magnetic head using the spin valve type of magnetoresistive multi-layered film, the part composed of the ferromagnetic layer/the non-magnetic layer/the soft magnetic layer determines the magnitude of its magnetoresistance. Since the soft magnetic metal layer is one kind of ferromagnetic metal layer, the ferromagnetic metal layer—non-magnetic metal layer interface is responsible for the principle. It is known that the public known art allows improvement in MR ratio by inserting an oxide into the ferromagnetic metal layer or by oxidizing part of it. In this case, however, the oxide layer is deposited at a midpoint of the ferromagnetic metal layer but a given thickness of oxide layer is not disposed at the ferromagnetic metal layer-non-magnetic metal layer interface. That is because the oxide has generally no ferromagnetic property and dose not transmit electrons, which is a major blocking factor of magnetoresistance. [0011]
  • Alternatively, the method for increasing magnetoresistance by applying a material of high-polarization has been also proposed but it is very difficult to laminate thin metal films such as ferromagnetic metal layers and the compounds such as the high-polarized oxide for fabricating the magnetoresistive element. This is due to the problems that alternately laminating the high-polarized material usually composed of compounds such as oxides with metal layers may cause the high-polarized material to react to the metal layers, or may cause constituents of the material to diffuse in the metal layers to form a non-stoichiometric composition, resulting in deterioration in properties. [0012]
  • Further, when the thin films are laminated using the conventional film formation technique, such a problem is encountered that an amorphous or microcrystal structure or a heterogeneous crystal structure is formed. As an example, in case of magnetite (Fe[0013] 3O4), which is known for a half-metalic material, the thin film formed by the sputtering method at room temperature using the target of magnetite exhibits a magnetization property of only a level ranging from one third to a half of 0.6 tesla for bulk magnetite. To achieve a good thin crystalline magnetite film, the temperature of a substrate needs to be turned up to approx. 500° C. Film formation, however, at such a higher temperature of the substrate not only makes it difficult to continuously form other metal layers and disturbs formation of ultra thin flattened metal layers, but also significantly accelerate the reactions between the high-polarized layers and other metal layers, for example, CoFe layers, interfering with formation of preferable high-polarized layers. Thus, it is practically very difficult to laminate the magnetoresistive film with high-polarized layers and metal layers deposited.
  • SUMMARY OF THE INVENTION
  • The objective of the present invention is to provide a magnetic recording device with high long-term reliability, which has an ability of high-density recording, or a magnetic head using a magnetoresistive element. More specifically, the objective of the present invention is to achieve a spin valve type of magnetoresistive element with a high MR ratio, which has a ferromagnetic compound layer made from any of materials such as oxide material with a high-polarization disposed at the interface with a non-magnetic layer to provide the magnetic recording/reproducing device employing the element. [0014]
  • According to the present invention, to provide the magnetic recording device, on which the magnetoresistive element using giant magnetoresistance is mounted and which has the ability of high-density recording, the spin valve type of giant magnetoresistive multi-layered film used as the magnetoresistive element, that is, the magnetoresistive element having the multi-layered composition of the soft magnetic free layer/the non-magnetic intermediate layer/the ferromagnetic pinned layer/the antiferromagnetic film must be used. [0015]
  • Here, the antiferromagnetic film, which applies an exchange coupling bias to substantially fix the magnetization on the ferromagnetic pinned layer, may be formed by sticking fast directly to the ferromagnetic pinned layer, or have the same effect through indirect magnetic coupling. Alternatively, instead of the antiferromagnetic film, any other bias applying means, for example, residual magnetization on the hard magnetic film or a current bias may be used. [0016]
  • According to the present invention, to resolve the problem with conventional devices and provide the magnetic recording/reproducing device, on which the magnetoresistive element and the magnetic head are mounted and which has the ability of high-density recording, the high-polarized layer must be disposed on at least the interface of the ferromagnetic pinned layer with the non magnetic intermediate layer. Alternatively, the high-polarized layer is deposited on at least the interface of the soft magnetic free layer with the non-magnetic intermediate layer. The high-polarized layer may be deposited on the interface between the non-magnetic intermediate layers of both of the ferromagnetic pinned layer and the soft magnetic free layer. From the standpoint of correcting soft magnetic property and magnetostriction, the high-polarized layer is easy to use for the ferromagnetic pinned layer. The composition, which is formed as a multi-layered construction of the first ferromagnetic layer/the non-magnetic inserted layer/the second ferromagnetic layer, is employed. [0017]
  • The high-polarized layer, which is disposed on the interface sticking fast to the non-magnetic intermediate layer, may be made from any of ferromagnetic compounds such as half-metal or a mixture of the ferromagnetic compound and a metal and in particular, Fe—O layer is preferably used. The Fe—O layer is formed by continuously laminating together with other metal layers alternately at room temperature or the substrate temperature of 200° C. or lower using any of methods such as sputtering followed by heat-treating the layer to deposit Fe[0018] 3O4 or Fe3O4-x in the Fe—O layer. Here, the Fe—O layer is made from Fe, in which oxygen atoms are dissolved, the ferromagnetic oxide such as magnetite, the Fe mixture with the ferromagnetic oxide such as magnetite, or Fe3O4-x, (x is a range of values 0-3, and preferably a range of values 2-3), and preferably is formed into the composition with a less oxygen content than that of the stoichiometric composition of magnetite (Fe3O4).
  • By heat treating the Fe—O layer, which has a crystal structure wherein oxygen atoms are exclusively dissolved in Fe in an amorphous or microcrystal state as deposition, at an appropriate temperature of 200-400° C., the composition close to the binary Fe—O system in the equilibrium state, that is, a phase with a high-polarization to allow the magnetoresistance to change by inducing the phenomenon of crystal precipitation in the direction near to the binary Fe—Fe[0019] 3O4 phases can be formed in the layer. The use of above-mentioned manufacturing method and composition not only enables the high-polarized layer with good crystallinity, and in particular, the magnetite-containing layer to be formed, but also to reduce the ferromagnetic coupling field, a so called interlayer coupling field, generated between the ferromagnetic pinned layer and the soft magnetic free layer.
  • Alternatively, with respect to the high-polarized layer, a so-called ferrite composition, which is the composition with Fe partially replaced with Ni, Co, Mn, Cr, or Mn, may be used for the primary component. Since the high-polarized layer exhibits ferromagnetism, the ferromagnetic pinned layer or the soft magnetic free layer may be composed of the high poralizability of layer alone, although by laminating with the high-polarized layer, the metallic ferromagnetic material, and so on, any of structures such as the structure of the high-polarized layer/CoFe layer/Ru layer/CoFe layer/antiferromagnetic layer can be formed for achieving a higher MR ratio and exchange coupling field, as well as appropriate waveform symmetry property. Alternatively, the structure of the high-polarized layer/CoFe layer/NiFe layer can be formed as the soft magnetic free layer to achieve a higher MR ratio and soft magnetic property. [0020]
  • The thickness of the high-polarized layer can be made 0.5 nm or more to improve the rate of resistance magnetization and the thickness below 5 nm make the soft magnetic property better with an effect that the interlayer coupling field is reduced. In particular, the thickness, any of a range 1-3 nm, is preferable because both of higher MR ratio and reduced interlayer coupling field can be achieved. [0021]
  • Cu is preferably used for the non-magnetic intermediate layer, however, any of conductive metals such as Au, Ag, Al, Pt, Pd, Os, Re, Ru, and Rh may be used if appropriate, or alloys with any of them may be used. [0022]
  • At least one pair of electrodes, which sense the output when current is supplied, are disposed at the magnetoresistive element composing a multi-layered composition. The current is supplied parallel to the layer structure of the multi-layered composition to sense giant magnetoresistance due to scattering on the interface. Alternatively, the current is supplied perpendicular to the layer structure of the multi-layered composition to cause polarized electrons in the high-polarized layer to transmit the interface and generate magnetoresistance for sensing magnetoresistance. [0023]
  • The magnetoresistive element may have a single magnetic domain structure to prevent noise from occurring by making the soft magnetic free layer into the single domain magnetic structure. For example, the hard magnetic film, which has residual magnetization at its ends along the film surface of the magnetoresistive element and perpendicular to the orientation of magnetic field to be sensed, is disposed. Alternatively, the single magnetic domain is achieved by disposing, for example, the hard magnetic film having residual magnetization adjacent to the magnetoresistive element along its film thickness to form the same shape of ends on the hard magnetic film and the multi-layered composition of the magnetoresistive element. [0024]
  • According to the present invention, in the magnetoresistive element using the materials and composition, and in the magnetic recording/reproducing device with the magnetoresistive element incorporated in the reproducing part, high-density recording, that is, recording with short recording wavelengths, which are written on the recording medium, and narrow widths of recording trucks, is achieved, enabling sufficient reproducing output to ensure better recording. [0025]
  • As mentioned above, according to the present invention, a magnetoresistive element with a better bias property and high output power and a magnetic head using it can be achieved and in particular, the magnetic head and a high recording-density of magnetic recording/reproducing device with a better reproducing output and bias property can be achieved.[0026]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention will be described in more detail with reference to the accompanying drawings, in which: [0027]
  • FIG. 1 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention; [0028]
  • FIG. 2 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention; [0029]
  • FIG. 3 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention; [0030]
  • FIG. 4 is a sectional view showing a multi-layered composition of a magnetoresistive multi-layered film according to an embodiment of the present invention; [0031]
  • FIG. 5 is a main sectional view showing a magnetoresistive head according to an embodiment of the present invention; [0032]
  • FIG. 6 is a main sectional view showing a magnetoresistive head according to an embodiment of the present invention; [0033]
  • FIG. 7 is a main sectional view showing a magnetoresistive head according to an embodiment of the present invention; [0034]
  • FIG. 8 is a characteristic drawing showing the relationship between the compositions of a Fe—O film and saturation flux densities; [0035]
  • FIG. 9 is a view showing a X-ray diffraction profiles of the Fe—O film with Fe 31 at % added as deposition and after heat-treatment; [0036]
  • FIG. 10 is a characteristic drawing showing magnetization curves of the Fe—O film with Fe 31 at % added as deposition and after heat-treatment; [0037]
  • FIG. 11 is a characteristic drawing showing magnetization curves and magnetoresistive curves of a spin valve using the Fe—O film with Fe 31 at % added; [0038]
  • FIG. 12 is a characteristic drawing showing the thickness of the Fe—O layer, as well as the amount of magnetization, the sheet resistance, and the MR ratio of the spin valve; [0039]
  • FIG. 13 is a characteristic drawing showing the relationship among the thickness of a Cu non-magnetic intermediate layer, the MR ratio and sheet resistance of the spin valve film; [0040]
  • FIG. 14 is a characteristic drawing showing the relationship among the thickness of the Cu layer, the MR ratio, and the sheet resistance of the spin valves with various compositions using the Fe—O layer; [0041]
  • FIG. 15 is a schematic drawing showing the magnetic head mounting the magnetoresistive element of the present invention; and [0042]
  • FIG. 16 is a block diagram showing the composition example of the magnetic recording/reproducing device of the present invention.[0043]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • (Embodiment 1) [0044]
  • A thin film making up a giant magnetoresistive element multi-layered film according to the present invention is fabricated by radio-frequency magnetron sputtering equipment as described below. In the atmosphere, in which 1-6 mm Torr of argon is present, the materials described below are sequentially laminated on a ceramic substrate with a thickness of 1 mm to form the thin film. Tantalum, nickel-20 at %iron alloy, cupper, cobalt, MnPt, ruthenium, and Fe[0045] 3O4 (magnetite) are used for sputtering targets. One square cm of Fe and Ni chips are appropriately disposed on a Co target for adjusting the composition. Similarly, one square cm of, for example, Fe chips are disposed on the magnetite target for adjusting the composition.
  • Hereafter, the composition with the Fe—O layer formed is expressed by the total amount of magnetite (Fe[0046] 3O4) plus Fe, for example, the expression Fe10 at % in the Fe—O layer means Fe3O4 90 at %—Fe10 at %.
  • To sequentially form individual layers of the multi-layered film, plasma is generated in equipment by applying radio-frequency of current to individual cathodes disposed at the target and then shutters disposed at the individual cathodes are opened and closed one by one. When the film is formed, an approx. 80 oersted of magnetic field is applied parallel to the substrate using a permanent magnet to give uniaxial anisotropy. The formed film is heat-treated in the magnetic field under the vacuum condition at 270° C. for three hours to transform the phase of the antiferromagnetic film, which results in deposition of the high-polarized compound layer in the Fe—O layer, and measure magnetoresistance at room temperature. Elements are patterned on a substrate by being subjected to the photoresist process. After then, the substrate is slider-processed and mounted on the magnetic recording device. [0047]
  • FIG. 1 is a view showing an example of the composition of a magnetoresistive multi-layered film to be used for a magnetoresistive element. In the notation of the figure, for example, “Ta3” expresses a component material as an example of the multi-layered composition and its thickness in nm. [0048]
  • This means that according to an embodiment illustrated in the figure, the magnetoresistive [0049] multi-layered film 10 is formed by continuously laminating a underlayer film 14, an antiferromagnetic film 11, a ferromagnetic pinned layer 15, a non-magnetic intermediate layer 12, a soft magnetic free layer 13, and a protective film 37 on the substrate 50. In the multi-layered composition, electric resistance varies with an angle defined between the magnetization orientation of the ferromagnetic pinned layer 15 and that of the soft magnetic free layer 13 by means of giant magnetoresistance or tunnel magnetoresistance.
  • The [0050] underlayer film 14 of the magnetoresistive multi-layered film 10 improves the crystallinity and crystalline orientation of part on the underlayer film 14 of the magnetoresistive multi-layered film 10. The underlayer film 14 has a Ta/NiFe composition but may have another composition. The use of the composition with no underlayer film 14 formed does not act counter to the objective of the present invention.
  • The most important purport in the example composition illustrated in FIG. 1 is the composition of the soft magnetic [0051] free layer 13. In FIG. 1, the soft magnetic free layer 13 is shown by a multi-layered construction comprising the high-polarized layer 16, the first soft magnetic film 131, and the second soft magnetic film 132. For example, as shown in the figure, this is applied to achieve a higher MR ratio by means of the high-polarized layer 16 sticking to the non-magnetic intermediate layer 12, the first soft magnetic film on the side where the high-polarized layer 16 sticks is formed using a relatively thin layer of Co alloy, for example, Co90Fe10 alloy or Co80Fe8Ni12 alloy to control the diffusion and mixture of the high-polarized layer 16 and the second soft magnetic film 132, the second soft magnetic film on the side of the non-magnetic intermediate layer 12 is formed using, for example, a relatively thick layer NiFe alloy for implementing the multi-layered film with better soft magnetic property and higher MR ratio.
  • Since the multi-layered construction is formed so that it may magnetically couple with the counterpart, the magnetization state in the same orientation is used to magnetically handle as a single body. To implement the magnetization state, the high-[0052] polarized film 16, the first soft magnetic film 132, and the second soft magnetic film 131, which form the soft magnetic free layer 13, are directly laminated with no intermediate layer deposited or if any layer exists between them, the thickness of the layer is set to an appropriate value, in particular 1 nm or less to made it thinner. Unlike the example shown in the figure, it does not act counter to the purport of the present invention that the soft magnetic free layer 13 is composed of the multilayer of the high-polarized layer 16/the first soft magnetic film 131, or alternatively, it is made from the third or more multilayer in addition to the first and second ferromagnetic films. The factors such as the magnitude of magnetization aeolotropy is set so that the orientation, in which the soft magnetic free layer 13 is magnetized, may be the same as that of an approximate truck width with no magnetic field applied. the high-polarized layer 16 is preferably made from the compound such as half-metal with high-polarization, for example, Fe3O4 and in particular, more preferably made from a Fe-rich Fe—O film or a Fe—O film containing less oxygen than Fe3O4, or alternatively, Fe may be partially replaced with Mn, Cr, Ni, or Co. Further, the high-polarized layer 16 with a thickness of 10nm or less, in particular of any of 0.5-3 nm, has a superior magnetic property, reduces the interlayer coupling between the soft magnetic free layer 13 and the ferromagnetic pinned layer 15, and exhibits high magnetoresistance.
  • The ferromagnetic pinned [0053] layer 15 is formed using the first ferromagnetic film 151 on the side where it sticks to the non-magnetic intermediate layer 12, the second ferromagnetic film 152 on the side where it sticks to a-pinned bias applying means represented by the antiferromagnetic film 11, and an antiparallel coupling layer 154 inserted between the first and second ferromagnetic films and coupled so that the first ferromagnetic film 151 and the second ferromagnetic film 152 may have antiferromagnetic property, that is antiparallel magnetization. The composition have effects that the output of the static magnetic field from the patterned end of the ferromagnetic pinned layer may be adjusted and when used for a magnetic head, it may make reproducing symmetric property better. Thus, the composition of the ferromagnetic pinned layer including the antiparallel coupling layer is effective when applied to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer does not act contrast to the purport of the present invention if it is employed in other compositions and applications.
  • (Embodiment 2) [0054]
  • Similarly, FIG. 2 shows another example composition of the magnetoresistive multi-layered film to be used for the magnetoresistive element according to the prevent invention. The notation in the figure is the same as that of FIG. 1. The magnetoresistive [0055] multi-layered film 10 is formed by continuously laminating the underlayer film 14, antiferromagnetic film 11, ferromagnetic pinned layer 15, non-magnetic intermediate layer 12, the soft magnetic free layer 13, and the protective film 37 on the substrate 50. With respect to the multi-layered composition, electric resistance varies with the angle defined between the magnetization orientation of the ferromagnetic pinned layer 15 and that of the soft magnetic free layer 13 by means of giant magnetoresistance or tunnel magnetoresistance. Since the compositions and effects of the underlayer film 14 and the like, the soft magnetic free layer 13, and the like are the same as those shown in FIG. 1, their descriptions are omitted. If the compositions of the underlayer film 14, the soft magnetic free layer 13, and the like are somewhat different from those in the figure, it does not act counter to the purport of the present invention.
  • The most important purport of this example of the present invention is in that an oxide-inserting [0056] layer 155 is included in the composition of the ferromagnetic pinned layer 15. As shown in the figure, the ferromagnetic pinned layer 15 is formed using the third ferromagnetic film sticking to the non-magnetic intermediate layer 12, the second ferromagnetic film 152 on the side where it sticks to the pinned bias applying means represented by the antiferromagnetic film 11, the first ferromagnetic film 151 antiferromagnetically coupling to the second ferromagnetic film through the antiparallel coupling film 154, and the oxide inserting layer 155 inserted between the first ferromagnetic film 151 and the third ferromagnetic film, which increases the crystallinity of the third ferromagnetic film to enhance the MR ratio.
  • The composition of the ferromagnetic pinned layer containing the antiparallel coupling layer is effective in application to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer does not act contrary to the purport of the present invention if it is employed in other compositions or applications. [0057]
  • The [0058] oxide inserting layer 155 with 1 nm thickness retained couples ferromagnetically between the third ferromagnetic film 153 and the first ferromagnetic film 151 through the oxide inserting layer 155 and enables the third ferromagnetic film 153 and the first ferromagnetic film 151 to function as single magnetization. By combining the composition containing the oxide inserting layer 155 with the soft magnetic free layer 13, which has the high-polarized layer 16 at the interface with the non-magnetic intermediate layer 12, crystallinity is improved and high MR ratio is achieved.
  • (Embodiment 3) [0059]
  • FIG. 3 is the view showing a further another example of the magnetoresistive multi-layered film to be used for the magnetoresistive element of the present invention. The notation in the figure is the same as that shown in FIG. 1. The magnetoresistive [0060] multi-layered film 10 is formed by continuously laminating the underlayer film 14, the antiferromagnetic film 11, ferromagnetic pinned layer 15, non-magnetic intermediate layer 12, the soft magnetic free layer 13, and the protective film 37 on the substrate 50.
  • With respect to the multi-layered composition, electric resistance varies with the angle defined between the magnetization orientation of the ferromagnetic pinned [0061] layer 15 and that of the soft magnetic free layer 13 by means of giant magnetoresistance or tunnel magnetoresistance. Since the compositions and effects of the underlayer film 14 and the like are the same as those shown in FIG. 1, their descriptions are omitted. If the composition of the underlayer film 14 or any other part are somewhat different from that in the figure, it does not act counter to the purport of the present invention. The most important purport of this example of the present invention is in that high- polarized layers 162 and 161 are included in the compositions of the soft magnetic free layer 13 and the ferromagnetic pinned layer 15, respectively. As shown in the figure, the ferromagnetic pinned layer 15 is formed using the third ferromagnetic film sticking to the non-magnetic intermediate layer 12, the second ferromagnetic film 152 on the side where it sticks to the pinned bias applying means represented by the antiferromagnetic film 11, the first ferromagnetic film 151 antiferromagnetically coupling to the second ferromagnetic film through the antiparallel coupling film 154, and the high-polarized layer 161 sticking to the non-magnetic intermediate layer 12 at the interface. The composition of the ferromagnetic pinned layer containing the antiparallel coupling layer is effective in application to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer does not act contrary to the purport of the present invention if it is employed in other compositions or applications.
  • The soft magnetic [0062] free layer 13 formed according to the composition has a continuous multi-layered composition, which is ferromagnetically coupled so that it implements the magnetization process as one magnetic film. Similarly, the soft magnetic free layer 13 is made from the multilayer of the high-polarized layer 162 sticking to the non-magnetic intermediate layer 12 at the interface, the first soft magnetic film 131, and the second magnetic film 132. The second soft magnetic film 132 may be omitted. Two high- polarized layers 161 and 162 are adjacent one another through the non-magnetic intermediate layer 12, inducing magnetoresistance. The high-polarized thin layers with a thickness of 1-2 nm, in particular, reduce the interlayer coupling field.
  • (Embodiment 4) [0063]
  • FIG. 4 is the view showing a further another example of the magnetoresistive multi-layered film to be used for the magnetoresistive element of the present invention. The notation in the figure is the same as that shown in FIG. 1. The magnetoresistive [0064] multi-layered film 10 is formed by continuously laminating the underlayer film 14, the soft magnetic free layer 13, the non-magnetic intermediate layer 12, the ferromagnetic pinned layer 15, the antiferromagnetic film 11, and the protective film 37 on the substrate 50. With respect to the multi-layered composition, electric resistance varies with the angle defined between the magnetization orientation of the ferromagnetic pinned layer 15 and that of the soft magnetic free layer 13 by means of giant magnetoresistance or tunnel magnetoresistance. Since the compositions and effects of the underlayer film 14 and the like are the same as those shown in FIG. 1, their descriptions are omitted. If the composition of the underlayer film 14 and the like are somewhat different from those in the figure, it does not act counter to the purport of the present invention.
  • The important purport of this example of the present invention is in that high-[0065] polarized layer 16 is included in the composition of the ferromagnetic pinned layer 15. As shown in the figure, the ferromagnetic pinned layer 15 is formed using the high-polarized layer 16 sticking to the non-magnetic intermediate layer 12, the second ferromagnetic film 152 on the side where it sticks to the pinned bias applying means represented by the antiferromagnetic film 11, and the first ferromagnetic film 151 antiferromagnetically coupling to the second ferromagnetic film 152 through the antiparallel coupling film 154. The composition of the ferromagnetic pinned layer 15 containing the antiparallel coupling layer 154 is effective in application to the magnetic head. Note that the use of the composition containing no antiparallel coupling layer 154 does not act contrary to the purport of the present invention if it is employed in other compositions or applications.
  • The soft magnetic [0066] free layer 13 formed according to the composition has a continuous multi-layered composition, which is ferromagnetically coupled so that it implements the magnetization process as one magnetic film. A magnetostriction or an inserting layer to improve the magnetic property and crystallinity may be included between the soft magnetic free layer 13 and the underlayer film 14. The high-polarized layer 16 are adjacent to the soft free layer 13, in particular, the first soft magnetic film 131, through the non-magnetic intermediate layer 12, inducing magnetoresistance. The high-polarized thin layer 16 with a thickness of approx. 1 -2 nm, reduces, in particular, the interlayer coupling field.
  • (Embodiment 5) [0067]
  • FIG. 5 is a sectional view facing to a magnetic medium showing an example of the composition of the magnetoresistive head using the magnetoresistive multi-layered film of the present invention. The left-right direction on the paper indicates the direction of the truck width on the magnetic head and the width on the paper indicates the direction of the element height. [0068]
  • The magnetic head according to the embodiment, is formed by laminating a lower [0069] magnetic shield 35, and a lower gap shield film 71 on the substrate 50, on which the magnetoresistive multi-layered film 10 and a magnetic domain control film 45 are deposited, further on which an upper gap film 72 and a upper magnetic shield 36 are deposited to form a reproducing gap 43 for detecting reproduced signals. An electrode 40 is disposed in contact with the magnetoresistive multi-layered film 10 to detect any application of sensing current or any change in electric resistance. The magnetic domain control film 45, which is formed using the magnetic film having residual magnetization by means of coupling to the hard magnetic film or the antiferromagnetic film and the like, is deposited slightly apart from the magnetoresistive multi-layered film 10 so that it may induce bias effects on the magnetoresistive multi-layered film 10 for insulting the single magnetic domain.
  • In the example, the composition of the magnetoresistive [0070] multi-layered film 10 may be the same as those described in the embodiments 1-4, although it is preferable that the magnetic domain control film 45 is composed so that the soft magnetic free layer is disposed on the lamination surface side. The producing magnetic gap 43 retains the magnetoresistive multi-layered film 10 at the rough center of the gap, allowing the magnetic signal component leaking into the reproducing magnetic gap 43 to be reproduced at a high resolution.
  • (Embodiment 6) [0071]
  • FIG. 6 is a sectional view facing to a magnetic medium showing another example of the composition of the magnetoresistive head using the magnetoresistive multi-layered film of the present invention. Similar to FIG. 5, the left-right direction on the paper indicates the direction of the truck width on the magnetic head and the width on the paper indicates the direction of the element height. [0072]
  • The magnetic head according to the embodiment, is formed by laminating the lower [0073] magnetic shield 35, and a lower conductive gap film 73 on the substrate 50, on which the magnetoresistive multi-layered film 10 and the magnetic domain control film 45 are deposited, further on which an upper conductive gap film 74 and the upper magnetic shield 36 are deposited to form the reproducing gap 43 for detecting reproduced signals. The electrode 40 is disposed in contact with the magnetoresistive multi-layered film 10 and the magnetic domain control film 45 to detect any change in electric resistance when sensing current is supplied in the direction of the thickness of the magnetoresistive multi-layered film 10.
  • Here, the magnetic [0074] domain control film 45, which is formed using the magnetic film having residual magnetization by means of exchange coupling to the hard magnetic film or the antiferromagnetic film, is deposited slightly apart from the magnetoresistive multi-layered film 10 so that it may induce bias effects on the magnetoresistive multi-layered film 10 for insulting the single magnetic domain.
  • In the example, the composition of the magnetoresistive [0075] multi-layered film 10 may be the same as those described in the embodiments 1-4, although it is preferable that the magnetic control film 45 is composed so that the soft magnetic free layer is disposed on the lamination surface side. In the figure, an example of the antiferromagnetic film 11 with the same width as that of any other parts of the magnetoresistive multi-layered film 10 is formed, although the antiferromagnetic film with the size changed may be composed so that current bypasses the antiferromagnetic film 11. The producing magnetic gap 43 retains the magnetoresistive multi-layered film 10 at the rough center of the gap, allowing the magnetic signal component leaking into the reproducing magnetic gap 43 to be reproduced at a high resolution.
  • (Embodiment 7) [0076]
  • FIG. 7 is a sectional view facing to a magnetic medium showing further another example of the composition of the magnetoresistive head using the magnetoresistive multi-layered film of the present invention. Similar to FIG. 5, the left-right direction on the paper indicates the direction of the truck width on the magnetic head and the width on the paper indicates the direction of the element height. [0077]
  • The magnetic head according to the embodiment, is formed by laminating the lower [0078] magnetic shield 35 and the lower conductive gap film 73 on the substrate 50, on which the magnetoresistive multi-layered film 10 is deposited, further on which the upper conductive gap film 74 and the upper magnetic shield 36 are deposited to form the reproducing gap 43 for detecting reproduced signals. The electrode 40 is disposed directly at the magnetoresistive multi-layered film 10 to detect any application of sensing current or any change in electric resistance. The magnetic domain control film 45, which is formed using the magnetic film having residual magnetization by means of exchange coupling to the hard magnetic film or the antiferromagnetic film, is deposited so that its ends may roughly come into contact with the left and right sides of the magnetoresistive multi-layered film 10, allowing it to have bias effects on the magnetoresistive multi-layered film 10. The producing magnetic gap 43 retains the magnetoresistive multi-layered film 10 at the rough center of the gap, allowing the magnetic signal component leaking into the reproducing magnetic gap 43 to be reproduced at a high resolution.
  • FIG. 8 is a view showing the relationship between the composition of the Fe—O film and a saturation magnetic flux density. The Fe—O layer is formed as single-layer film with a thickness of approx. 0.3 μm for easy measurement. The saturation magnetic flux density of the Fe—O film containing no Fe, which is made by the sputtering method using the magnetite (Fe[0079] 3O4) target, is 0.2 tesla at film formation, at most 0.3 tesla or lower after three-hour heat-treatment at 270° C., which is a half or lower of 0.6 tesla at saturated magnetization of bulk magnetite (Fe3O4). On the other hand, the saturation magnetic flux density of the Fe—O film with approx. 30 at % of Fe added is 0.5 tesla before heat-treatment and 0.7 tesla or more after heat-treatment. At that time, the magnetization might be induced by Fe.
  • FIG. 9 shows X-ray diffraction curves representing the saturated flux densities of the Fe—O film with 31 at % of Fe added as deposition (a) and after heat-treatment (b). As known from the result, the structures of them are different before and after heat-treatment. As deposition (before heat treatment), the broad peaks corresponding to wider plane spacings than those of the normal Fe (110) are observed, indicating that the Fe—O film has a structure near to that of Fe, in which oxygen is dissolved. For this reason, it is suggested that most of magnetization is contributed by metal Fe rather than Fe[0080] 3O4 in the composition phase. On the other hand, after heat-treatment, the peaks close to those of Fe (100), which the plane spacings were shifted to the narrow side, and the peaks corresponding to Fe3O4 (220) (311) are clearly observed. Thus, it is clear that Fe3O4 is deposited by heat treating the Fe—O film and a mixture film of Fe or Fe with oxygen dissolved and Fe3O4 was formed.
  • FIG. 10 shows the magnetization curves of the Fe—O film with 31 at % of Fe added as deposition (a) and after heat-treatment (b). The magnetization curve as deposition exhibits low coercivity and draws perpendicular magnetization loops, suggesting that ferromagnetic Fe or Fe—O particles are dispersed in its non-magnetic matrix. On the other hand, the magnetization curve after heat-treatment exhibits approx. 500 Oe of coercivity, suggesting that it reflects magnetocrystalline anisotropy of magnetite (Fe[0081] 3O4) precipitated by heat-treatment.
  • Electric resistance of these Fe—O films depend on the film thickness. Approx. 0.3 μm thickness of film given here exhibits 1224 μΩcm as deposition and 566 μΩcm after heat-treatment. [0082]
  • FIG. 11 shows the magnetization and magnetoresistive curves of the spin valve film when the Fe—O layer with Fe 31 at % added is used for the soft magnetic free layer and when it is used for ferromagnetic pinned layer. The Fe—O layers have 20 nm or 10 nm of thickness. The magnetoresistive curves were measured by supplying current in-plane, so called the CIP measuring method. [0083]
  • When the Fe—O layer is used for the soft magnetic free layer, no clear distinction can be observed between the magnetization curves of the ferromagnetic pinned layer and the soft magnetic free layer regardless of Cu non-magnetic intermediate layer being thick (10 nm). That is because the interlayer coupling between the ferromagnetic layer and the soft magnetic free layer is ferromagnetic. Note that as known from the amount of magnetization represented by the magnetization curve, the Fe—O layer used for the soft magnetic free layer is sufficiently strong. Thus, the magnetoresistive curve exhibits a low resistance of 1% or lower. [0084]
  • Similarly, when the Fe—O layer is used for ferromagnetic pinned layer, no clear distinction can be observed between the magnetization curves of the ferromagnetic pinned layer and the soft magnetic free layer regardless of Cu non-magnetic intermediate layer being thick (10 nm). Thus, the magnetoresistive curve exhibits a low resistance of 1% or lower. Note that as known from the amount of magnetization represented by the magnetization curve, the Fe—O layer used for the ferromagnetic pinned layer is sufficiently ferromagnetic and exchange coupling was achieved by forming the ferromagnetic pinned layer as the multilayer of Fe—O layer/CoFe layer in contact with the MnPt antiferromagnetic film. [0085]
  • FIG. 12 shows the relationship between the thickness of the Fe—O layer and the magnetization amount, sheet resistance, and MR ratio of the spin valve film. Similar to FIG. 11, The Fe—O layer is used for the soft magnetic free layer and ferromagnetic pinned layer. For convenient, the relationship between the thickness and the amount of magnetization of the Fe—O single-layer film is shown as well. [0086]
  • As known from the figure, the amount of magnetization of the Fe—O layer decreases gradually along a straight line corresponding to the approx. 0.8 tesla and reaches almost 0 (zero) when the thickness of the layer becomes thinner than 10 nm. On the other hand, it is also known that when the Fe—O layer is used for the spin valve layer, the magnetization amount is on the straight line corresponding to approx. 1 (one) tesla for both of the ferromagnetic pinned layer and the soft magnetic free layer and draws the straight line with a thickness of down to 1 nm in either case. This means that unlike the Fe—O monolayer, the Fe—O layer with in the spin valve, even if its thickness is thin, for example, 1-2 nm, may retains a high magnetization of one tesla. That may be because the effects given by the underlayer film of the spin valve film and formation of the Fe—O layer made from any of the materials, CoFe, Cu, and the like improve crystallinity. [0087]
  • Sheet resistance not so strongly depends on the thickness of the Fe—O layer. That is because the electric resistance of the Fe—O layer is higher than that of any other metal layer. The dependence of the MR ratio on the layer thickness varies between the ferromagnetic pinned layer and the soft magnetic free layer. When the Fe—O layer is used for the soft magnetic free layer, it may drop if the thickness of the Fe—O layer becomes thinner than 2 nm. That may be because when the Fe—O layer with a thickness of 1 nm is used for soft magnetic free layer, the amount of magnetization deviates from the straight line, indicating that the amount of magnetization is reduced. For the Fe—O layer with a thickness of any of 2-20 nm, however, the MR ratio increases as-the layer thickness becomes thinner. This means that the interlayer coupling field decreases as the thickness of the Fe—O layer becomes thinner. On the other hand, when the Fe—O layer with a thickness of 10 nm or less is used for the ferromagnetic pinned layer, the MR ratio decreases but not increases. That may be because since the Cu layer is formed on the Fe—O layer, the substrate has effects on the Cu layer on the sufficiently thick Fe—O layer. With the layer thickness of 3 nm or less, the MR ratio increases again and it reaches a high value for the Fe—O layer with a thickness of 1 nm. This means that as the Fe—O layer becomes thinner, the interlayer coupling field is reduced. In addition, it means that the amount of magnetization of the Fe—O layer in the ferromagnetic pinned layer is better even if the layer thickness is 1 nm. [0088]
  • These result show that for the ferromagnetic pinned layer, the MR ratio is better even if the layer thickness is 1 nm, which is thinner than that for the soft magnetic free layer. That may be because if the Fe—O layer is disposed near to the ferromagnetic metal CoFe layer, the property of the thinner Fe—O layer is improved. [0089]
  • FIG. 13 is a view showing the amounts of Fe added to the Fe—O layer, the thickness of the Cu non-magnetic intermediate layer and the property of the spin valve film. The MR ratio increases as the Cu layer becomes thinner while it decreases when the interlayer coupling field become large even if the Cu layer is thin. As known from the figure, the Cu layer with a thickness of 10 nm exhibits almost the same MR ratio regardless of its composition, although the MR ratio begins to decrease in the Cu layer with a thickness of 7 nm when the amount of Fe added is 20 at % and continuously reduces in the Cu layer as the amount of Fe added increases. The MR ratio reaches the maximum value when the amount of Fe added is 40 at % and the high MR ratio is achieved when the amount of Fe added is any of 30-55 at %. In this composition, when the amount of Fe added increases up to 22-55% in the Fe—O layer, the MR ratio varies depending on it, that is, 20, 30, or 40 at %. on the other hand, the sheet resistance varies with the thickness of the Cu layer only but does not depend on the Fe composition. [0090]
  • FIG. 14 is a view showing the relationship among the thickness of the Cu layers in the spin valve films, which have various compositions using the Fe—O layer, the MR ratio, and the sheet resistance. Types A, B, and C have the Fe—O layer only in the soft magnetic free layer while types D and E use the multi-layered construction of the Fe—O layer/CoFe layer in the soft magnetic free layer. Types B, C, and E have the oxide inserting layer in the ferromagnetic pinned layer precipitated. A difference between the types B and C is in that the former has a thickness of 3 nm while the latter, 2 nm. [0091]
  • In the type A composition, the MR ratio does not increase even if the thickness of the Cu layer becomes thinner than 7 nm while in the type B composition, the MR ratio does not decease even if the thickness of the Cu layer becomes thinner than 3-5 nm, In addition, for types C-E, the MR ratio gradually increases until the Cu layer thickness reaches 2-3 nm and a high MR ratio, 5-7% is achieved. Thus, by reducing the thickness of the Fe—O layer, laminating the Fe—O layer with a thinner thickness of approx. 1 nm together with the CoFe layer and the like to form a multilayer, and inserting the oxide layer into the pinned layer, a higher MR ratio can be achieved. [0092]
  • As known from the figure, the sheet resistance increases as the thickness of the Cu layer becomes thinner regardless of the combination of the fixes layer or the Fe—O layer and the CoFe layer. [0093]
  • FIG. 15 is a schematic view showing the magnetic head mounting the magnetoresistive element of the present invention. The magnetoresistive [0094] multi-layered film 10, the magnetic domain control film (not shown), the electrode 40, the lower shield 35, the upper shield 36, the lower magnetic core 84, the coil 42, and the upper core 83 are formed on the substrate 50. In the figure, the magnetic head has the structure with the upper magnetic shield 36 and the lower magnetic core 84 disposed. Note that the use of the upper magnetic shield and the lower magnetic core, which are made from the same material, does not act contract to the purport of the present invention.
  • FIG. 16 a view showing an example of the magnetic recording/reproducing device of the present invention. In this example, a [0095] disk 95 holding a recording medium 91, which records magnetically information is rotated by means of a spindle motor 93, and a head slider 90 with the magnetic head attached shown in FIG. 15 is guided onto the truck on the disk 95 by means of an actuator 92. This means that in the magnetic disk device, a reproducing head and recording head disposed at the head slider 95 are forced toward a given recording position through this mechanism to achieve the desired mutual movement, resulting in successful signal writing and reading. The actuator 92 is preferably of rotary actuator type.
  • Recording signals are recorded on the medium by means of the recording head through a signal processing system [0096] 94 and the output from the reproducing head is handled as reproducing signals through the signal processing system 94. in addition, when the reproducing head moves onto the desired recording truck, the accurate positions on the truck can be detected using high sensitivity of outputs from the reproducing head and the positioning of the head slider can be performed by controlling the actuator. In the figure, one head slider 90 and one disk 95 are shown, although more than one head sliders and disks may be used. Besides, the recording medium 91 may be disposed on both the sides of the disk 95 for recording information. When is desired that information is recorded on both sides of the disk, individual head sliders 90 are also disposed on both sides of the disk.
  • In another embodiment of the present invention, a method for manufacturing the above magnetoresistive element is provided. This method comprises the steps of: mixing the oxide of Co, Fe, Ni, Mn, and Cr or the mixed oxide thereof and metals Co, Fe, Ni, Mn, and Cr or alloys thereof by means of vacuum thin film formation such as simultaneous sputtering; and heat treating a resulting mixture at 200-400° C. to form said high-polarized layer. [0097]
  • In a further embodiment of the present invention, another method for manufacturing the above magnetoresistive elements provided. This method comprises the steps of: forming a metal thin film layer; and exposing said metal thin film layer to an atmosphere containing reactive gas such as oxygen for oxidization or chemical combination, thereby forming said high-polarized layer. [0098]
  • According to a still further aspect of the present invention, a magnetic head is provided in which a magnetism sensitive part comprises the above magnetoresistive element. [0099]
  • The result from the test on the magnetic head of the present invention and the magnetic recording/reproducing device mounting it shows that they exhibit sufficient outputs and better bias property, as well as well reliability of operation. [0100]

Claims (12)

What is claimed is:
1. A magnetoresistive element having a multi-layered composition of a ferromagnetic layer/a non-magnetic intermediate layer/a ferromagnetic layer, which are separated through the non-magnetic intermediate layer and has at least two ferromagnetic layers, and including elements, which allows the multi-layered composition to induce magnetoresistance when a relative magnetization angle defined between the ferromagnetic layers varies depending on an external magnetic field exerted, and at least one pair of electrodes for detecting the change in said magnetoresistance, wherein:
at least one of said ferromagnetic layers is comprised of a high-polarized layer; and
at least one of the non-magnetic intermediate layer-ferromagnetic layer interface has a composition of a non-magnetic intermediate layer/a high-polarized layer/a ferromagnetic metal layer, said high-polarized layer being a ferromagnetic compound such as half-metal or a mixture of any of ferromagnetic compounds and metal.
2. The magnetoresistive element claimed in claim 1, wherein:
at least one of said ferromagnetic layers is composed of a multi-layered construction of the high-polarized layer and the ferromagnetic metal layer; and
at least one of the non-magnetic intermediate layer-a ferromagnetic layer interface has the composition of the non-magnetic intermediate layer/the high-polarized layer/the ferromagnetic metal layer, said high-polarized layer being a ferromagnetic compound such as half-metal or a mixture of any of ferromagnetic compounds and metal.
3. The magnetoresistive element claimed in claim 1, wherein:
at least one of said ferromagnetic layer is composed of a multi-layered construction containing the ferromagnetic compound or the multi-layered construction of the high-polarized layer and the ferromagnetic metal layer containing the ferromagnetic compound, and
at least one of the non-magnetic intermediate layer-ferromagnetic layer interface has the composition of the non-magnetic intermediate layer/the high-polarized layer/the ferromagnetic metal layer, said high-polarized layer being a ferromagnetic oxide mainly composed of magnetite, Fe3O4-x (x is 0-3, and preferably 2-3), or MFe2O4-x (M═Fe, Co, Ni, Mn, Cr, or Zn, x is 0-3, and preferably 2-3), a mixture of said ferromagnetic oxide and Fe, or a mixture of said ferromagnetic oxide and the ferromagnetic metal including any of Fe, Co, Ni, and the like.
4. The magnetoresistive element claimed in claim 1, wherein:
a magnetization orientation of one of ferromagnetic layers with the composition of said ferromagnetic layer/non-magnetic intermediate layer/ferromagnetic layer is fixed substantially to the magnetic field to be sensed by means of the antiferromagnetic film and a fixing means, such as exchange coupling deposited on its whole surface.
5. A magnetoresistive element having the multi-layered composition of a first ferromagnetic metal layer/a non-magnetic intermediate layer/a second ferromagnetic layer/a antiparallel coupling layer/a third ferromagnetic metal layer/a antiferromagnetic film, and including the elements, which allows the said multi-layered composition to induce magnetoresistance when a relative magnetization angle defined between said first ferromagnetic layers varies depending on an external magnetic field exerted, and at least one pair of electrodes for detecting the change in said magnetoresistance, wherein:
the magnetization of said third ferromagnetic layer is fixed substantially to the magnetic field to be sensed by means of said antiferromagnetic film and exchange coupling deposited on its whole surface by means of an exchange coupling force applied by said antiferromagnetic film, by which the magnetization of said second ferromagnetic layer is fixed substantially antiparallel to the magnetization orientation of said third ferromagnetic layer by means of the exchange coupling force applied by said antiparallel coupling layer, further by which the magnetization of said second ferromagnetic metal layer is fixed substantially to the magnetic field to be sensed, and
said second ferromagnetic layer is composed of the multi-layered construction of the high-polarized layer, which is a mixture of the ferromagnetic oxide or the ferromagnetic oxide with a high-polarization and the ferromagnetic metal, and of the ferromagnetic metal layer;
said magnetoresistive element having the composition of the first ferromagnetic layer/the non-magnetic intermediate layer/the high-polarized layer/the ferromagnetic metal layer.
6. The magnetoresistive element claimed in claim 5, wherein:
each of said first and second ferromagnetic layers is composed of the multi-layered construction of the high-polarized layer, which is a mixture of the ferromagnetic oxide or the ferromagnetic oxide with a high-polarization and the ferromagnetic metal, and of the ferromagnetic metal layer;
said magnetoresistive element having the composition of the first ferromagnetic metal layer/the non-magnetic intermediate layer/the second high-polarized layer/the second ferromagnetic metal layer.
7. The magnetoresistive element claimed in claim 1, wherein said high-polarized layer has a thickness of 0.5-5 nm, and preferably 1-3 nm.
8. The magnetoresistive element claimed in claim 1, wherein said non-magnetic intermediate layer is composed of any conductive metals such as Cu or Au, Ag, Al, Pt, Pd, Os, Re, Ru, and Rh.
9. The magnetoresistive element claimed in claim 1, wherein said non-magnetic intermediate layer is composed of an insulating film made from any of materials such as alumina and said magnetoresistance is the tunnel effect.
10. The magnetoresistive element claimed in claim 1, wherein said ferromagnetic layer contains an oxide inserting layer having the function of an electron reflection layer, diffusion control layer, or crystallinity improvement layer and have the composition of the ferromagnetic metal layer/the oxide inserting layer/the ferromagnetic metal layer.
11. The magnetoresistive element claimed in claim 1, wherein said electrodes are structured so that they apply current parallel to the multi-layered surface of said multi-layered composition.
12. The magnetoresistive element claimed in claim 1, wherein said electrodes are structured so that they apply current in the direction of thickness of the film in said multi-layered composition.
US10/194,308 2001-07-17 2002-07-15 Magnetoresistive element with oxide magnetic layers and metal magnetic films deposited thereon Abandoned US20030016475A1 (en)

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030197985A1 (en) * 2002-04-19 2003-10-23 International Business Machines Corporation Method and apparatus for improved pinning strength for self-pinned giant magnetoresistive heads
US20060227465A1 (en) * 2005-03-22 2006-10-12 Kabushiki Kaisha Toshiba Magneto-resistance effect element and magnetic memory
US20070099107A1 (en) * 2003-07-08 2007-05-03 Hirishi Shimbori Resin for positive resist composition, and positive resist composition using the same, laminate and method for forming resist pattern
US20070188938A1 (en) * 2006-02-10 2007-08-16 Hitachi Global Storage Technologies Netherlands, B.V. Method and apparatus for providing improved pinning structure for tunneling magnetoresistive sensor
CN100423313C (en) * 2003-02-24 2008-10-01 日立环球储存科技荷兰有限公司 Magnetoresistive device with exchange-coupled structure having half-metallic ferromagnetic heusler alloy in the pinned layer
US20090190262A1 (en) * 2008-01-30 2009-07-30 Kabushiki Kaisha Toshiba Magnetoresistive element and method of manufacturing the same
US20090190264A1 (en) * 2008-01-30 2009-07-30 Kabushiki Kaisha Toshiba Magnetoresistive element and method of manufacturing the same
US7663848B1 (en) * 2006-07-14 2010-02-16 Grandis, Inc. Magnetic memories utilizing a magnetic element having an engineered free layer
US20110261478A1 (en) * 2010-04-21 2011-10-27 Kabushiki Kaisha Toshiba Magnetoresistive element and magnetic recording apparatus
US20120288963A1 (en) * 2009-12-28 2012-11-15 Canon Anelva Corporation Manufacturing method of magneto-resistive element
US9177574B2 (en) 2009-11-27 2015-11-03 Kabushiki Kaisha Toshiba Magneto-resistance effect device with mixed oxide function layer
US20170210228A1 (en) * 2016-01-22 2017-07-27 Yazaki Corporation Vehicle display device

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Publication number Priority date Publication date Assignee Title
JP4572524B2 (en) * 2003-10-15 2010-11-04 ヤマハ株式会社 Method for manufacturing magnetoresistive film
US7390529B2 (en) * 2004-05-26 2008-06-24 Headway Technologies, Inc. Free layer for CPP GMR having iron rich NiFe
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JP2007194457A (en) * 2006-01-20 2007-08-02 Alps Electric Co Ltd Tunnel magnetism detection element, and its manufacturing method
JP2008041827A (en) 2006-08-03 2008-02-21 Alps Electric Co Ltd Tunnel-type magnetic detection element and its manufacturing method
JP5389370B2 (en) * 2008-03-04 2014-01-15 公益財団法人電磁材料研究所 Ferromagnetic thin film material and manufacturing method thereof
CN101409134B (en) * 2008-07-24 2011-03-23 复旦大学 Alloy film capable of improving exchange bias field size and enhancing exchange bias stability, as well as preparation method thereof
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US11719772B2 (en) 2020-04-01 2023-08-08 Analog Devices International Unlimited Company AMR (XMR) sensor with increased linear range

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407890B1 (en) * 2000-02-08 2002-06-18 International Business Machines Corporation Dual spin valve sensor read head with a specular reflector film embedded in each antiparallel (AP) pinned layer next to a spacer layer
US6501626B1 (en) * 2000-05-03 2002-12-31 International Business Machines Corporation Read head with a combined second read gap and pinning layer for a top spin valve sensor
US6580589B1 (en) * 2000-10-06 2003-06-17 International Business Machines Corporation Pinned layer structure for a spin valve sensor having cobalt iron (CoFe) and cobalt iron oxide (CoFeO) laminated layers
US6624986B2 (en) * 2001-03-08 2003-09-23 International Business Machines Corporation Free layer structure for a spin valve sensor with a specular reflecting layer composed of ferromagnetic oxide
US6654211B2 (en) * 2001-04-06 2003-11-25 International Business Machines Corporation Read head including a spin valve sensor with a specular reflecting cap layer structure
US6693776B2 (en) * 2001-03-08 2004-02-17 Hitachi Global Storage Technologies Netherlands B.V. Spin valve sensor with a spin filter and specular reflector layer

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3516404B2 (en) 1993-03-12 2004-04-05 株式会社東芝 Magnetoresistance effect element
JPH08504303A (en) 1993-10-06 1996-05-07 フィリップス エレクトロニクス ネムローゼ フェン ノートシャップ Magnetoresistive device and magnetic head using such device
US5465185A (en) 1993-10-15 1995-11-07 International Business Machines Corporation Magnetoresistive spin valve sensor with improved pinned ferromagnetic layer and magnetic recording system using the sensor
SG46731A1 (en) 1995-06-30 1998-02-20 Ibm Spin valve magnetoresistive sensor with antiparallel pinned layer and improved exchange bias layer and magnetic recording system using the senor
EP0814519B1 (en) * 1996-06-17 2004-01-21 Sharp Kabushiki Kaisha Magnetoresistive effect device, process for fabricating the same, and magnetic head produced using the same
JPH1197766A (en) 1997-09-17 1999-04-09 Res Inst Electric Magnetic Alloys Ferromagnetic tunnel junction element
JP3050189B2 (en) * 1997-10-30 2000-06-12 日本電気株式会社 Magnetoresistive element and method of manufacturing the same
JP3206582B2 (en) 1998-01-27 2001-09-10 松下電器産業株式会社 Spin polarization element
JP4409656B2 (en) 1998-03-20 2010-02-03 株式会社東芝 Magnetoresistive element and magnetic reproducing apparatus
JP2000195021A (en) * 1998-12-28 2000-07-14 Alps Electric Co Ltd Magneto-resistive element
JP2000150985A (en) 1999-01-01 2000-05-30 Nec Corp Magneto-resistance effect element
US6277505B1 (en) 1999-01-21 2001-08-21 Read-Rite Corporation Read sensor with improved thermal stability and manufacturing method therefor
US6567246B1 (en) * 1999-03-02 2003-05-20 Matsushita Electric Industrial Co., Ltd. Magnetoresistance effect element and method for producing the same, and magnetoresistance effect type head, magnetic recording apparatus, and magnetoresistance effect memory element
JP4572434B2 (en) 1999-03-23 2010-11-04 パナソニック株式会社 Magnetoresistive element, magnetoresistive head, and memory element
US6700757B2 (en) * 2001-01-02 2004-03-02 Hitachi Global Storage Technologies Netherlands B.V. Enhanced free layer for a spin valve sensor
US6661626B2 (en) * 2001-03-20 2003-12-09 International Business Machines Corporation Tunnel valve sensor having a pinned layer structure with an iron oxide (Fe3O4) layer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407890B1 (en) * 2000-02-08 2002-06-18 International Business Machines Corporation Dual spin valve sensor read head with a specular reflector film embedded in each antiparallel (AP) pinned layer next to a spacer layer
US6501626B1 (en) * 2000-05-03 2002-12-31 International Business Machines Corporation Read head with a combined second read gap and pinning layer for a top spin valve sensor
US6580589B1 (en) * 2000-10-06 2003-06-17 International Business Machines Corporation Pinned layer structure for a spin valve sensor having cobalt iron (CoFe) and cobalt iron oxide (CoFeO) laminated layers
US6624986B2 (en) * 2001-03-08 2003-09-23 International Business Machines Corporation Free layer structure for a spin valve sensor with a specular reflecting layer composed of ferromagnetic oxide
US6693776B2 (en) * 2001-03-08 2004-02-17 Hitachi Global Storage Technologies Netherlands B.V. Spin valve sensor with a spin filter and specular reflector layer
US6654211B2 (en) * 2001-04-06 2003-11-25 International Business Machines Corporation Read head including a spin valve sensor with a specular reflecting cap layer structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6801412B2 (en) * 2002-04-19 2004-10-05 International Business Machines Corporation Method and apparatus for improved pinning strength for self-pinned giant magnetoresistive heads
US20030197985A1 (en) * 2002-04-19 2003-10-23 International Business Machines Corporation Method and apparatus for improved pinning strength for self-pinned giant magnetoresistive heads
CN100423313C (en) * 2003-02-24 2008-10-01 日立环球储存科技荷兰有限公司 Magnetoresistive device with exchange-coupled structure having half-metallic ferromagnetic heusler alloy in the pinned layer
US7422839B2 (en) 2003-07-08 2008-09-09 Tokyo Ohka Kogyo Co., Ltd. Resin for positive resist composition, and positive resist composition using the same, laminate and method for forming resist pattern
US20070099107A1 (en) * 2003-07-08 2007-05-03 Hirishi Shimbori Resin for positive resist composition, and positive resist composition using the same, laminate and method for forming resist pattern
US7663171B2 (en) * 2005-03-22 2010-02-16 Kabushiki Kaisha Toshiba Magneto-resistance effect element and magnetic memory
US20060227465A1 (en) * 2005-03-22 2006-10-12 Kabushiki Kaisha Toshiba Magneto-resistance effect element and magnetic memory
US20100091556A1 (en) * 2005-03-22 2010-04-15 Kabushiki Kaisha Toshiba Magneto-resistance effect element and magnetic memory
US7977719B2 (en) 2005-03-22 2011-07-12 Kabushiki Kaisha Toshiba Magneto-resistance effect element and magnetic memory
US8134193B2 (en) 2005-03-22 2012-03-13 Kabushiki Kaisha Toshiba Magneto-resistance effect element and magnetic memory
US20070188938A1 (en) * 2006-02-10 2007-08-16 Hitachi Global Storage Technologies Netherlands, B.V. Method and apparatus for providing improved pinning structure for tunneling magnetoresistive sensor
US7821747B2 (en) * 2006-02-10 2010-10-26 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for providing improved pinning structure for tunneling magnetoresistive sensor
US7663848B1 (en) * 2006-07-14 2010-02-16 Grandis, Inc. Magnetic memories utilizing a magnetic element having an engineered free layer
US20090190262A1 (en) * 2008-01-30 2009-07-30 Kabushiki Kaisha Toshiba Magnetoresistive element and method of manufacturing the same
US20090190264A1 (en) * 2008-01-30 2009-07-30 Kabushiki Kaisha Toshiba Magnetoresistive element and method of manufacturing the same
US8184408B2 (en) 2008-01-30 2012-05-22 Kabushiki Kaisha Toshiba Magnetoresistive element and method of manufacturing the same
US9028909B2 (en) 2008-01-30 2015-05-12 Kabushiki Kaisha Toshiba Magnetoresistive element and method of manufacturing the same
US9177574B2 (en) 2009-11-27 2015-11-03 Kabushiki Kaisha Toshiba Magneto-resistance effect device with mixed oxide function layer
US8728830B2 (en) * 2009-12-28 2014-05-20 Canon Anelva Corporation Manufacturing method of magneto-resistive element
US20120288963A1 (en) * 2009-12-28 2012-11-15 Canon Anelva Corporation Manufacturing method of magneto-resistive element
US20110261478A1 (en) * 2010-04-21 2011-10-27 Kabushiki Kaisha Toshiba Magnetoresistive element and magnetic recording apparatus
US20170210228A1 (en) * 2016-01-22 2017-07-27 Yazaki Corporation Vehicle display device

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