US20020092962A1 - Sacrificial plastic mold with electroplatable base - Google Patents
Sacrificial plastic mold with electroplatable base Download PDFInfo
- Publication number
- US20020092962A1 US20020092962A1 US09/765,078 US76507801A US2002092962A1 US 20020092962 A1 US20020092962 A1 US 20020092962A1 US 76507801 A US76507801 A US 76507801A US 2002092962 A1 US2002092962 A1 US 2002092962A1
- Authority
- US
- United States
- Prior art keywords
- porous metal
- substrate
- plastic mold
- metal substrate
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
- B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
- B29C33/52—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles soluble or fusible
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49982—Coating
- Y10T29/49984—Coating and casting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49988—Metal casting
Definitions
- the present invention relates to the replication of metal micro-scale parts, and more specifically, it relates to the production of sacrificial, electroplatable molds.
- electroplatable molds enable the efficient replication of metal micro-scale parts, which would otherwise require the iteration of synchrotron exposures and other costly or time-consuming processes.
- a key challenge in LIGA is the replication of multiple sacrificial molds for the electroplating of metal parts/structures. Many applications require metal parts for mechanical, electrical or other reasons.
- the ability to replicate electroplatable plastic molds would eliminate the need for repetitive synchrotron exposures, a costly and time-consuming step, as well as the subsequent development step.
- U.S. Pat. No. 4,541,977 titled “Method For Producing Separating Nozzle Elements,” is directed to a very specific method for producing a complex multi-nozzle assembly including an array of micro-channels and nozzles held between top and bottom plates with corresponding inlets and outlets. This assembly is used for the separation of gaseous or vaporous mixtures.
- a process for the replication of the internal features is described which infuses a polymer into a master mold of the internal features contacting a metallic bottom plate. Upon removal of the master mold, the negative plastic mold remains adhered to the bottom plate due to the presence of dove-tailed inlets which lock onto the infused plastic. Subsequent electroplating of this structure provides a metal replicate of the original master features from which the plastic mold can then be removed.
- U.S. Pat. No. 4,661,212 titled “Method For Producing A Plurality Of Plate Shaped Microstructured Metal Bodies,” provides a number of more general approaches for producing electroplatable plastic molds that rely on the use of metal or carbon filled PMMA formulations. Different methods are used depending on whether the features to be electroplated are contiguous or non-contiguous. Non-contiguous features require the casting of an unfilled non-conductive PMMA resin into the features of a master mold followed by a second overlay casting with a filled conductive PMMA. Upon demolding from the master, this filled PMMA provides a conductive and electroplatable base to which the unfilled PMMA features are bonded.
- One variation on this approach describes the prefabrication of a two-layer PMMA substrate in which one layer is unfilled and insulating and the bottom layer contains a conductive filler.
- This two-layer substrate is embossed with a master such that the features of the master penetrate through the insulating unfilled layer into the conductive filled layer.
- Such two-layer substrates are also used in other patents referenced below.
- the same patent describes another process suitable only for contiguous features in which the master mold is first dip-coated to apply a thin mold release layer to the feature tops and then similarly dip-coated in a conductive, filled PMMA formulation such that the feature tops only are coated. The wells between the features on this mold are then filled and covered over with an unfilled, non-conductive PMMA material. Upon demolding, the contiguous conducting path of the filled PMMA layer allows electroplating of the desired metal replicate.
- U.S. Pat. No. 4,981,558 titled “Process For The Reproduction Of A Microstructured, Plate-Shaped Body,” discloses a process similar to that in U.S. Pat. No. 4,661,212 with the addition of the use of ultrasound to enhance penetration of the metal master through the insulating top layer and into the conducting PMMA bottom layer of a pre-formed two-layer PMMA substrate.
- Use of ultrasound permits the elimination of the heating and cooling steps normally involved in such embossing procedures.
- U.S. Pat. No. 5,055,163 is titled “Process For Producing A Two-Dimensionally Extending Metallic Microstructure Body With A Multitude Of Minute Openings And A Tool Suitable For This Invention,” describes a more specific process similar to that in U.S. Pat. No. 4,661,212 in which a master mold with multiple tapered projections is embossed into a two-layer substrate in which the conducting lower layer might be a filled PMMA, another filled polymer or a low melting metal.
- the tapered feature tips facilitate penetration of the master features through the top layer and into the conducting layer of the substrate.
- the use of cylindrical master tools in a continuous process and the use of ultrasound are also described.
- U.S. Pat. No. 5,073,237 titled “Method Of Making Molds For Electrodeposition Forming Of Microstructured Bodies,” discloses a method that overcomes some of the difficulties associated with the preceding processes by using a two-layer substrate that consists of a sputtered or vapor deposited film of metal or carbon on an insulating polymer base such as PMMA.
- a two-layer substrate that consists of a sputtered or vapor deposited film of metal or carbon on an insulating polymer base such as PMMA.
- the metal film along the walls of the embossed features is stretched and disrupted to form a discontinuous and therefore non-conductive array of isolated spangles of the deposited film.
- the film in the bottom of the embossed features is not disrupted in this manner and provides a conductive contact for subsequent electroplating of the features.
- the features in this case must be contiguous, however.
- U.S. Pat. No. 5,162,078, titled “Method Of Producing Microstructured Metallic Bodies,” is directed to the removal by reactive ion etching of residual polymeric films in the bottom of plastic mold cavities, which would prevent electroplating on the conductive base supporting those features. Such residues are a potential problem when embossing through the two-layer substrates described in many of the above patents.
- the reactive ion etch is directed perpendicularly to the surface of the base plate to avoid degradation of the plastic features.
- None of the above processes provide a simple and versatile method of replicating either contiguous or non-contiguous features in a sacrificial plastic mold. Many require the pre-fabrication of specific plastic substrates, which contain a conducting layer adhered to a non-conducting layer with precise height requirements. Various techniques have been used to insure penetration of the tooled embossing features through the non-conducting layer into the conducting layer. Some of these require the fabrication of special embossing tools with sharpened or roughened features. Some of the above techniques are also applicable only to contiguous features, a major limitation. There remains a need in the micro-fabrication art for a general method capable of replicating metal structures and parts now made by processes such as the described LIGA technology.
- the invention provides a sacrificial plastic mold having an electroplatable backing, wherein the mold comprises the product of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold supporting or contacting the porous metal substrate.
- a porous metal substrate sheet, screen, mesh or foam
- the porous metal substrate will be embedded within the surface of the thermoplastic and the surface of the porous metal substrate will project a plastic structure with features determined by the master mold.
- This plastic structure provides a sacrificial plastic mold that can be used to replicate the features of the original master mold.
- the porous metal substrate to which the plastic mold is mechanically bonded provides a conducting support suitable for electroplating processes.
- the plated metal can be lapped and polished and the sacrificial plastic can be dissolved to leave the replicated metal structure bonded to the metal substrate.
- the plastic mold can be overplated and the overplated metal then lapped and polished to provide a metal base containing the electroplated features.
- the porous metal substrate might then be removed by machining and polishing processes.
- the electroplated parts may also be debonded from the metal substrate by the use of different metals for the substrate and electroplating process and subsequent selective dissolution of the substrate metal.
- an appropriate metal coating or strike might be deposited on the porous metal substrate, before or after the embossing or molding process used to form the sacrificial plastic mold. That metal strike might then be selectively dissolved to release the plated metal parts.
- free metal parts they might either be underplated or the overplated metal might be machined away to the level of the plastic micro-mold.
- the porous metal substrate or base might then be removed by lapping prior to dissolution of the plastic mold.
- the electroplated parts may also be debonded from the metal substrate by the use of different metals for the substrate and electroplating process and subsequent selective dissolution of the substrate metal.
- an appropriate metal coating or strike might be deposited on the porous metal substrate, before or after the embossing or molding process used to form the sacrificial plastic mold. That metal strike might then be selectively dissolved to release the plated metal parts.
- Both hot embossing and injection molding processes may be used to infuse the thermoplastic through the porous metal substrate and into the contacting mold.
- the arrangement of the porous metal substrate, the master mold and the infused polymer will vary according to the process used. In both processes, it is often desirable to carry out the plastic infusion and feature replication under vacuum to avoid air entrapment and loss of fidelity in the replicated features.
- FIG. 1A shows a thin perforated metal substrate lying on a plastic substrate. A metal embossing tool is shown above these materials.
- FIG. 1B shows the metal embossing tool in contact with the perforated metal substrate.
- FIG. 1C illustrates plastic flow through the pores or perforations in the metal substrate as the temperature of the plastic substrate is raised. This plastic then fills the cavities in the metal embossing tool.
- FIG. 1D shows the embossed plastic and the perforated metal after the plastic has cooled and the metal embossing tool has been removed.
- FIG. 1E shows the plastic micro-mold and the perforated metal after the cavities in the plastic mold have been filled with electroplated metal. In this case, any overplated metal has been removed by lapping and polishing.
- FIG. 1F shows the remaining electroplated metal structure after the sacrificial plastic mold has been dissolved.
- FIG. 2A shows a plastic substrate lying on top of a porous metal mesh. A metal embossing tool is shown above these materials.
- FIG. 2B shows the metal embossing tool in contact with the plastic substrate.
- FIG. 2C illustrates plastic flow through the porous metal mesh as the temperature of the plastic substrate is raised. This plastic also fills the cavities in the metal embossing tool.
- FIG. 2D shows the embossed plastic and the metal mesh after the metal embossing tool has been removed. A portion of the metal mesh is shown to be infused with plastic.
- FIG. 2E shows the plastic micro-mold and the metal mesh after the cavities in the plastic mold have been filled with electroplated metal. In this case, any overplated metal has been removed by lapping and polishing.
- FIG. 2F shows the remaining electroplated metal structure after the sacrificial plastic mold has been dissolved.
- FIG. 3A shows a mold cavity with a tooled metal insert in the bottom. Lying on top of that tooled insert is a thin porous metal substrate and filling the remainder of the mold cavity is a porous metal mesh.
- FIG. 3B shows the mold cavity filled with injection-molded plastic which has infused the porous metal substrates and the features in the tooled insert.
- FIG. 3C shows porous metal substrates and the molded plastic features after removal from the mold cavity.
- FIG. 3D shows the plastic micro-mold and the porous metal substrates after the cavities in the plastic mold have been filled with electroplated metal. In this case, any overplated metal has been removed by lapping and polishing.
- FIG. 3E shows the remaining electroplated metal structure after the sacrificial plastic mold has been dissolved.
- FIG. 4A shows a circular sacrificial PMMA mold containing a micro-etched stainless steel screen as the electroplatable base.
- FIG. 4B shows a close-up of some of the features in the PMMA mold and the underlying micro-etched screen shown in FIG. 4A.
- FIG. 5 shows a SEM photograph of a microstructure made according to the method described in Example 2.
- FIG. 6 shows a SEM photograph of a microstructure made according to the method described in Example 2.
- thermoplastic substrates porous metal substrates, patterning methods, or the like, as such may vary.
- thermoplastic material includes mixtures of thermoplastic materials
- porous metal substrate includes reference to two or more porous metal substrates
- microscale feature includes multiple microscale features, and the like.
- FIGS. 1 A- 1 F illustrate one embodiment of the present invention that utilizes the hot embossing of sacrificial plastic molds for electroplating metal structures.
- FIG. 1A shows a plastic substrate 10 in contact with a porous metal substrate, in this case a perforated metal screen 11 .
- An embossing tool 12 is positioned above the metal screen 11 .
- the embossing tool containing the micro-scale features may be fabricated, e.g., using the LIGA process. In such a tool fabrication process, a solid metal plate might be used as the base supporting the PMMA resist material in such a process and would thus provide a metal tool onto which the micro-features have been electroplated.
- a silicon wafer might be used as the base and the electroplated metal can then be overplated and machined to provide the final metal tool to which the electroplated features are attached.
- the silicon wafer would then be released by dissolution processes.
- the embossing process is usually performed under vacuum.
- FIG. 1B the embossing tool 12 and the perforated metal 11 are brought in contact. Either before or after contact, the temperature of the plastic substrate 10 is raised to a point at which the plastic resin is softened enough to flow. Upon the application of compressive force, the perforated metal substrate 11 will be pressed into the plastic substrate 10 as the plastic flows through the pores or perforations in the metal 11 and fills in the features of the embossing tool 12 . This is shown in FIG. 1C.
- the amount of compressive force required to carry out the aforementioned step will vary with several factors, e.g., the particular metal substrate employed, the selected plastic, temperature, etc. However, the compressive force applied will generally be in the range of approximately 25 psi to 2500 psi.
- the metal embossing tool 12 is removed, the embossed plastic and the perforated metal remain together as shown in FIG. 1D and provide the desired sacrificial plating mold.
- the plastic mold is then filled in with electroplated metal 14 as shown in FIG. 1E.
- Suitable metals that can be used for electroplating include, but are not limited to, nickel, copper, silver, platinum, gold, nickel/iron, nickel/cobalt, nickel/tungsten, tin/lead and other mixtures and alloys thereof. Machining and polishing processes might be employed as needed to level any overplated metal to the height shown.
- various selective metal dissolution or overplating and lapping processes might also be used to provide free metal parts or structures.
- FIGS. 2 A- 2 F illustrate another embossing technique where the plastic substrate is initially located between the embossing tool and the porous metal substrate, in this case a metal mesh.
- FIG. 2A shows the plastic substrate 20 located between the metal mesh 21 and metal embossing tool 22 .
- FIG. 2B the embossing tool is in contact with the plastic substrate.
- the plastic substrate 20 is heated to a temperature where the plastic is softened enough to flow, compressive force is applied and the plastic allowed to fill in the features of the embossing tool and also flow into the metal mesh until the embossing tool contacts the mesh.
- FIG. 2C where the top portion 21 ′ of the metal mesh is infused with plastic.
- FIG. 2D shows the embossed plastic 20 and the metal mesh 21 and 21 ′ after the metal embossing tool 22 has been removed.
- the plastic micro-mold of FIG. 2D is electroplated with metal 23 as shown in FIG. 2E.
- the electroplated metal structure that results from dissolution of the sacrificial plastic mold of FIG. 2E is shown in FIG. 2F. Again, various processes might be used to obtain free metal parts or structures after the electroplating step.
- FIGS. 3 A- 3 E illustrate another embodiment of the present invention, which uses injection molding of the thermoplastic material in combination with one or more porous metal substrates placed within the injection-molding cavity.
- both a perforated metal sheet 30 and a soft, porous metal mesh 31 are stacked within the injection-molding cavity 32 on top of the tooled mold 33 .
- the molten plastic 34 is infused through both porous metal substrates 30 and 31 into the tooled features of tooled mold 33 as shown in FIG. 3B.
- FIG. 3C shows the injected plastic 34 and porous metals 30 and 31 after removal from the mold cavity 32 .
- FIG. 3D shows the plastic micro-mold filled in with electroplated metal 35
- FIG. 3E shows the electroplated metal structure, which consists of metal mesh 31 , perforated metal sheet 30 and electroplated metal 35 , after dissolution of the sacrificial plastic mold.
- a rigid metal mesh or other porous metal may replace the perforated metal screen in the above-described embodiment.
- the use of the softer high porosity mesh is also optional and is meant to insure the rigid mesh or screen does not move away from the tooled cavity face during resin injection.
- Other methods, such as a pattern of studs either on the metal substrate or the opposing mold face to prevent such movement of the porous metal substrate might also be used.
- the tooled features in the injection molding cavity might be provided by the LIGA fabrication of a metal tool, similar to those used in the above hot embossing processes, which is inserted into an injection mold base designed to accommodate interchangeable tooling inserts.
- This type of injection molding process which uses free porous metal substrates in the mold cavity, is facilitated by a vertical arrangement of the injection-molding machine.
- porous metal materials suitable for use in the processes embodied above are available commercially.
- Mott Industrial manufactures a range of hard sintered meshes widely used in filtering and sparging applications. These are available in a range of metals (stainless steel, Monel, nickel, Hastelloy, Inconel, titanium, silver, gold and platinum) are sintered into a variety of shapes with average porosities of 0.2, 0.5, 1, 2, 5, 10, 20, 40 and 100 microns.
- Technetics Corporation in DeLand, Fla. manufactures porous metal felts from various alloys using 10-150 micron fibers and 35-90% pore volumes. BuckbeeMears St.
- any of these porous metal substrates might be modified by the application of a thin metal coating or strike suitable for later dissolution.
- a thin metal coating or strike suitable for later dissolution might be applied by electroplating techniques or by other metal coating techniques known in the art. While coatings of many metals might easily be applied, copper is most commonly used in the case of nickel-plated parts due to the selective etching behavior of copper.
- thermoplastic substrates are usable in both the hot embossing and injection-molding processes described above and are well known in the art.
- This class of plastic materials (also referred to as resins or polymers) is characterized by their ability to soften and become moldable at elevated temperatures and to become hard when cooled.
- thermoplastics include acetals, acrylics such as polymethylmethacrylate, acrylonitrile-butadiene-styrene (ABS) resins, cellulosics (e.g., Cellophane®), polyamides (nylon), polyarylates, polysulfones, polycarbonates, polyesters (PBT and PET), polyethylene, polypropylene, polystyrene, polytetrafluoroethylene (Teflon®), polyurethanes, polyvinyl chloride (PVC) and many others including copolymers and polymer blends.
- ABS acrylonitrile-butadiene-styrene
- cellulosics e.g., Cellophane®
- polyamides nylon
- polyarylates polysulfones
- polycarbonates polyesters
- PET polyesters
- PBT and PET polyethylene
- polypropylene polystyrene
- Teflon® polytetra
- Suitable additives include, for example, antioxidants, light and UV stabilizers, flow modifiers, anti-static modifiers, platicizers, brightenenrs, and others while suitable fillers include, but are not limited to, inorganic fillers (such as calcium carbonate, clays and metal oxides), polymeric fillers (such as Teflon powder), pigments and dyes, silicas and others.
- inorganic fillers such as calcium carbonate, clays and metal oxides
- polymeric fillers such as Teflon powder
- pigments and dyes silicas and others.
- a feature important to the sacrificial plastic molds of this invention is their ability to be dissolved in appropriate solvents such as aliphatic hydrocarbons, ketones, halogenated hydrocarbons, aromatic hydrocarbons, alcohols, ethers, hydrofluoroethers and hydrofluorocarbons, glycols, glycol ethers and glycol esters, carbonates, polar aprotic solvents such as dimethylsulfoxide and dimethylformamide, and others. These will vary in usefulness according to the nature of the thermoplastic. Commonly used solvents to dissolve thermoplastics would include acetone, dichloromethane, dimethylformamide and tetrahydrofuran. Some thermoplastics are also susceptible to aqueous acids or bases.
- polyacetals are readily dissolved in phenolic and inorganic acids and polyesters can be dissolved in strong base.
- Appropriate radiation, oxidative, thermal or other treatments might be used to degrade the molecular structure of the thermoplastic to enhance the solubility of the sacrificial mold or to directly remove the plastic. This might include UV or x-ray exposure or an ashing treatment.
- micro-scale chem/bio detectors Some of the many uses of the invention include micro-scale chem/bio detectors, portable or miniaturized medical diagnostic equipment, DNA analysis equipment, optical switches and related equipment, inertial sensing devices, and other miniaturized devices.
- a plastic disk (1 ⁇ 8 inch thick ⁇ 3.5 inch diameter) was molded from polymethyl methacrylate (PMMA, Elf-Atochem V920 grade) and fastened in a circular metal frame having a lid that only covered the edge of the disk to hold it down.
- This circular lip had a 3 3 ⁇ 8 inch diameter.
- a similar but slightly larger disk of micro-etched stainless steel sheet (from Buckbee-Mears) having a regular hexagonal pattern of tapered holes (hole diameter about 150 microns facing up and about 100 microns facing down) was placed on top of the PMMA before the top portion of the frame with the securing lip was secured. Portions of the metal sheet protruded from the top and bottom portions of the frame and later provided a conducting attachment for the electroplating process.
- the frame fixture was fastened to the bottom of a large tool steel die equipped with a side vacuum port and a thermocouple channel below the plastic frame.
- a matching top die to which was fastened a metal embossing tool was lowered into the bottom die.
- This embossing tool contained a variety of features, all approximately 95 microns deep, ranging from gears and channels of various dimensions to wedge-like structures and other designs. Vacuum was pulled and heating applied through platens attached to the top and bottom dies.
- the die thermocouple indicated a temperature of about 165° C.
- the top die was forced into the softened plastic at a pressure of about 125 psi.
- the fixturing and plastic were cooled to about room temperature and the electroplatable plastic mold was removed.
- FIGS. 4A and 4B Such a sacrificial mold is pictured in FIGS. 4A and 4B.
- FIG. 4A shows a circular sacrificial PMMA mold containing a micro-etched stainless steel screen as the electroplatable base.
- FIG. 4B shows a close-up of some of the features in the PMMA mold and the underlying micro-etched screen shown in FIG. 4A.
- the sacrificial plastic mold was electrolytically cleaned in a 70% v/v sulfuric acid solution at a current density of 150 A/ft 2 for three minutes.
- the fresh stainless steel surfaces within the mold were given a Wood's nickel strike in a nickel chloride bath at 50 A/ft 2 for three minutes followed by a copper seed layer deposited from a copper sulfate bath at 15 A/ft 2 for ten minutes.
- the mold was then placed in a nickel sulfamate electroplating bath at 15 A/ft 2 for seven hours.
- the features in this mold were only partially plated to a depth of about 35 microns.
- the PMMA mold was dissolved from the sheet and plated features using acetone.
- Example 1 The process of Example 1 was used except that the holes in the micro-etched sheet were smaller in diameter (about 75 microns, Buckbee-Mears 2-1-8 screen) and were not tapered. A higher melt flow grade of PMMA was also used (Elf Atochem VM-100). The features were over-plated in nickel and then lapped to eliminate the over-plated metal.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Micromachines (AREA)
Abstract
Description
- [0001] The United States Government has rights in this invention pursuant to Contract No. DE-AC04-94AL85000 between the United States Department of Energy and Sandia Corporation for the operation of Sandia National Laboratories.
- The present invention relates to the replication of metal micro-scale parts, and more specifically, it relates to the production of sacrificial, electroplatable molds. Such electroplatable molds enable the efficient replication of metal micro-scale parts, which would otherwise require the iteration of synchrotron exposures and other costly or time-consuming processes.
- A key challenge in LIGA (described below) is the replication of multiple sacrificial molds for the electroplating of metal parts/structures. Many applications require metal parts for mechanical, electrical or other reasons. The ability to replicate electroplatable plastic molds would eliminate the need for repetitive synchrotron exposures, a costly and time-consuming step, as well as the subsequent development step.
- The production of micro-scale metal parts via LIGA (German acronym for lithography, electroplating and molding) is a multi-step process requiring mask production, synchrotron exposure of the polymethylmethacrylate (PMMA) substrate (typically PMMA bonded to a metallized silicon wafer or a solid metal plate), development of the PMMA, electroplating to fill the cavities left within the PMMA mold, lapping and final dissolution of the remaining PMMA. Such technology is described in U.S. Pat. No. 5,378,583. A constraining step in this process is the requirement for access to one of the very limited number of synchrotron facilities. If the electroplatable PMMA (or other plastic) molds could be replicated without the need for repetitive synchrotron exposures, this would provide an enormous savings in time and cost in the production of larger quantities of the desired metal parts.
- Numerous approaches to this replication problem have been explored at Kernforschungszentrum Karlsruhe GmbH.
- U.S. Pat. No. 4,541,977, titled “Method For Producing Separating Nozzle Elements,” is directed to a very specific method for producing a complex multi-nozzle assembly including an array of micro-channels and nozzles held between top and bottom plates with corresponding inlets and outlets. This assembly is used for the separation of gaseous or vaporous mixtures. A process for the replication of the internal features is described which infuses a polymer into a master mold of the internal features contacting a metallic bottom plate. Upon removal of the master mold, the negative plastic mold remains adhered to the bottom plate due to the presence of dove-tailed inlets which lock onto the infused plastic. Subsequent electroplating of this structure provides a metal replicate of the original master features from which the plastic mold can then be removed.
- U.S. Pat. No. 4,661,212, titled “Method For Producing A Plurality Of Plate Shaped Microstructured Metal Bodies,” provides a number of more general approaches for producing electroplatable plastic molds that rely on the use of metal or carbon filled PMMA formulations. Different methods are used depending on whether the features to be electroplated are contiguous or non-contiguous. Non-contiguous features require the casting of an unfilled non-conductive PMMA resin into the features of a master mold followed by a second overlay casting with a filled conductive PMMA. Upon demolding from the master, this filled PMMA provides a conductive and electroplatable base to which the unfilled PMMA features are bonded. One variation on this approach describes the prefabrication of a two-layer PMMA substrate in which one layer is unfilled and insulating and the bottom layer contains a conductive filler. This two-layer substrate is embossed with a master such that the features of the master penetrate through the insulating unfilled layer into the conductive filled layer. Such two-layer substrates are also used in other patents referenced below. The same patent describes another process suitable only for contiguous features in which the master mold is first dip-coated to apply a thin mold release layer to the feature tops and then similarly dip-coated in a conductive, filled PMMA formulation such that the feature tops only are coated. The wells between the features on this mold are then filled and covered over with an unfilled, non-conductive PMMA material. Upon demolding, the contiguous conducting path of the filled PMMA layer allows electroplating of the desired metal replicate.
- U.S. Pat. No. 4,981,558 titled “Process For The Reproduction Of A Microstructured, Plate-Shaped Body,” discloses a process similar to that in U.S. Pat. No. 4,661,212 with the addition of the use of ultrasound to enhance penetration of the metal master through the insulating top layer and into the conducting PMMA bottom layer of a pre-formed two-layer PMMA substrate. Use of ultrasound permits the elimination of the heating and cooling steps normally involved in such embossing procedures.
- U.S. Pat. No. 5,055,163 is titled “Process For Producing A Two-Dimensionally Extending Metallic Microstructure Body With A Multitude Of Minute Openings And A Tool Suitable For This Invention,” describes a more specific process similar to that in U.S. Pat. No. 4,661,212 in which a master mold with multiple tapered projections is embossed into a two-layer substrate in which the conducting lower layer might be a filled PMMA, another filled polymer or a low melting metal. The tapered feature tips facilitate penetration of the master features through the top layer and into the conducting layer of the substrate. The use of cylindrical master tools in a continuous process and the use of ultrasound are also described.
- U.S. Pat. No. 5,073,237 titled “Method Of Making Molds For Electrodeposition Forming Of Microstructured Bodies,” discloses a method that overcomes some of the difficulties associated with the preceding processes by using a two-layer substrate that consists of a sputtered or vapor deposited film of metal or carbon on an insulating polymer base such as PMMA. During the standard embossing process, the metal film along the walls of the embossed features is stretched and disrupted to form a discontinuous and therefore non-conductive array of isolated spangles of the deposited film. The film in the bottom of the embossed features is not disrupted in this manner and provides a conductive contact for subsequent electroplating of the features. The features in this case must be contiguous, however.
- It is important in the electroplating of micro-features with high aspect ratios that the walls of the electroplating mold be non-conductive. If the feature walls as well as the feature bases are conductive, the electroplating process will tend to close off the feature cavity before it has been completely plated up from the bottom. Such difficulties preclude the simple deposition of a metallic conducting film on the surface of a sacrificial plastic mold prior to electroplating or the use of conductive plastics in a standard embossing or injection molding process to form sacrificial molds. In the case of low aspect ratio features, either of the above options is readily applicable.
- U.S. Pat. No. 5,162,078, titled “Method Of Producing Microstructured Metallic Bodies,” is directed to the removal by reactive ion etching of residual polymeric films in the bottom of plastic mold cavities, which would prevent electroplating on the conductive base supporting those features. Such residues are a potential problem when embossing through the two-layer substrates described in many of the above patents. The reactive ion etch is directed perpendicularly to the surface of the base plate to avoid degradation of the plastic features.
- U.S. Pat. No. 5,676,983 titled “Tool For Making A Microstructured Plastic Mold From Which Structures Can Be Formed Galvanically,” and U.S. Pat. No. 5,795,519 titled “Process Of Making A Microstructured Plastic Mold,” again utilize a two-layer substrate but provide an embossing master tool in which the features have smooth walls but the top surfaces of the features possess rough surfaces having points and ridges adapted to penetrate into the electrically insulating layer. This enhanced penetration allows the embossing tool to more efficiently expose the electrically insulating layer at the bottom of the embossed cavities.
- None of the above processes provide a simple and versatile method of replicating either contiguous or non-contiguous features in a sacrificial plastic mold. Many require the pre-fabrication of specific plastic substrates, which contain a conducting layer adhered to a non-conducting layer with precise height requirements. Various techniques have been used to insure penetration of the tooled embossing features through the non-conducting layer into the conducting layer. Some of these require the fabrication of special embossing tools with sharpened or roughened features. Some of the above techniques are also applicable only to contiguous features, a major limitation. There remains a need in the micro-fabrication art for a general method capable of replicating metal structures and parts now made by processes such as the described LIGA technology.
- It is an object of the present invention to provide a sacrificial plastic mold having an electroplatable backing.
- It is another object of the present invention to provide sacrificial plastic molds by the use of plastic forming technologies and without the use of repetitive lithographic exposures.
- It is still another object of the present invention to provide sacrificial plastic molds with more than one level features, wherein the features in the different levels may be the same or different.
- It is a further object of the present invention to provide sacrificial plastic molds in which either contiguous or non-contiguous features may be electroplated.
- It is still a further object of the invention to provide a method for making a sacrificial plastic mold having an electroplatable backing.
- Additional objects, advantages and novel features of the invention will be set forth in part in the description that follows, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned by practice of the invention.
- Whether contiguous or non-contiguous, it is also an object of the present invention to produce sacrificial plastic molds with more than one level of features. Embossing or injection molding tools can be fabricated with multiple levels with different features using known LIGA and micro-machining technology. Such multiple levels of features can also be replicated in the plastic molds of this invention and in the electroplated metal parts produced from those molds.
- In one embodiment, the invention provides a sacrificial plastic mold having an electroplatable backing, wherein the mold comprises the product of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold supporting or contacting the porous metal substrate. Upon cooling of the thermoplastic and demolding, the porous metal substrate will be embedded within the surface of the thermoplastic and the surface of the porous metal substrate will project a plastic structure with features determined by the master mold. This plastic structure, in turn, provides a sacrificial plastic mold that can be used to replicate the features of the original master mold. In particular, the porous metal substrate to which the plastic mold is mechanically bonded provides a conducting support suitable for electroplating processes. After electroplating, the plated metal can be lapped and polished and the sacrificial plastic can be dissolved to leave the replicated metal structure bonded to the metal substrate.
- If a metal structure is desired, the plastic mold can be overplated and the overplated metal then lapped and polished to provide a metal base containing the electroplated features. The porous metal substrate might then be removed by machining and polishing processes. Alternatively, the electroplated parts may also be debonded from the metal substrate by the use of different metals for the substrate and electroplating process and subsequent selective dissolution of the substrate metal. In another variation, an appropriate metal coating or strike might be deposited on the porous metal substrate, before or after the embossing or molding process used to form the sacrificial plastic mold. That metal strike might then be selectively dissolved to release the plated metal parts.
- If free metal parts are desired they might either be underplated or the overplated metal might be machined away to the level of the plastic micro-mold. The porous metal substrate or base might then be removed by lapping prior to dissolution of the plastic mold. Alternatively, the electroplated parts may also be debonded from the metal substrate by the use of different metals for the substrate and electroplating process and subsequent selective dissolution of the substrate metal. In another variation also used with the metal structures above, an appropriate metal coating or strike might be deposited on the porous metal substrate, before or after the embossing or molding process used to form the sacrificial plastic mold. That metal strike might then be selectively dissolved to release the plated metal parts.
- Both hot embossing and injection molding processes may be used to infuse the thermoplastic through the porous metal substrate and into the contacting mold. The arrangement of the porous metal substrate, the master mold and the infused polymer will vary according to the process used. In both processes, it is often desirable to carry out the plastic infusion and feature replication under vacuum to avoid air entrapment and loss of fidelity in the replicated features.
- FIG. 1A shows a thin perforated metal substrate lying on a plastic substrate. A metal embossing tool is shown above these materials.
- FIG. 1B shows the metal embossing tool in contact with the perforated metal substrate.
- FIG. 1C illustrates plastic flow through the pores or perforations in the metal substrate as the temperature of the plastic substrate is raised. This plastic then fills the cavities in the metal embossing tool.
- FIG. 1D shows the embossed plastic and the perforated metal after the plastic has cooled and the metal embossing tool has been removed.
- FIG. 1E shows the plastic micro-mold and the perforated metal after the cavities in the plastic mold have been filled with electroplated metal. In this case, any overplated metal has been removed by lapping and polishing.
- FIG. 1F shows the remaining electroplated metal structure after the sacrificial plastic mold has been dissolved.
- FIG. 2A shows a plastic substrate lying on top of a porous metal mesh. A metal embossing tool is shown above these materials.
- FIG. 2B shows the metal embossing tool in contact with the plastic substrate.
- FIG. 2C illustrates plastic flow through the porous metal mesh as the temperature of the plastic substrate is raised. This plastic also fills the cavities in the metal embossing tool.
- FIG. 2D shows the embossed plastic and the metal mesh after the metal embossing tool has been removed. A portion of the metal mesh is shown to be infused with plastic.
- FIG. 2E shows the plastic micro-mold and the metal mesh after the cavities in the plastic mold have been filled with electroplated metal. In this case, any overplated metal has been removed by lapping and polishing.
- FIG. 2F shows the remaining electroplated metal structure after the sacrificial plastic mold has been dissolved.
- FIG. 3A shows a mold cavity with a tooled metal insert in the bottom. Lying on top of that tooled insert is a thin porous metal substrate and filling the remainder of the mold cavity is a porous metal mesh.
- FIG. 3B shows the mold cavity filled with injection-molded plastic which has infused the porous metal substrates and the features in the tooled insert.
- FIG. 3C shows porous metal substrates and the molded plastic features after removal from the mold cavity.
- FIG. 3D shows the plastic micro-mold and the porous metal substrates after the cavities in the plastic mold have been filled with electroplated metal. In this case, any overplated metal has been removed by lapping and polishing.
- FIG. 3E shows the remaining electroplated metal structure after the sacrificial plastic mold has been dissolved.
- FIG. 4A shows a circular sacrificial PMMA mold containing a micro-etched stainless steel screen as the electroplatable base.
- FIG. 4B shows a close-up of some of the features in the PMMA mold and the underlying micro-etched screen shown in FIG. 4A.
- FIG. 5 shows a SEM photograph of a microstructure made according to the method described in Example 2.
- FIG. 6 shows a SEM photograph of a microstructure made according to the method described in Example 2.
- Before describing the present invention in detail, it is to be understood that unless otherwise indicated this invention is not limited to specific thermoplastic substrates, porous metal substrates, patterning methods, or the like, as such may vary.
- It must be noted that, as used in this specification and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a” thermoplastic material includes mixtures of thermoplastic materials, reference to “a porous metal substrate” includes reference to two or more porous metal substrates, reference to “a microscale feature” includes multiple microscale features, and the like.
- FIGS.1A-1F illustrate one embodiment of the present invention that utilizes the hot embossing of sacrificial plastic molds for electroplating metal structures. FIG. 1A shows a
plastic substrate 10 in contact with a porous metal substrate, in this case aperforated metal screen 11. Anembossing tool 12 is positioned above themetal screen 11. The embossing tool containing the micro-scale features may be fabricated, e.g., using the LIGA process. In such a tool fabrication process, a solid metal plate might be used as the base supporting the PMMA resist material in such a process and would thus provide a metal tool onto which the micro-features have been electroplated. Alternatively, a silicon wafer might be used as the base and the electroplated metal can then be overplated and machined to provide the final metal tool to which the electroplated features are attached. The silicon wafer would then be released by dissolution processes. The embossing process is usually performed under vacuum. In FIG. 1B, theembossing tool 12 and theperforated metal 11 are brought in contact. Either before or after contact, the temperature of theplastic substrate 10 is raised to a point at which the plastic resin is softened enough to flow. Upon the application of compressive force, theperforated metal substrate 11 will be pressed into theplastic substrate 10 as the plastic flows through the pores or perforations in themetal 11 and fills in the features of theembossing tool 12. This is shown in FIG. 1C. It will be appreciated by those skilled in the art that the amount of compressive force required to carry out the aforementioned step will vary with several factors, e.g., the particular metal substrate employed, the selected plastic, temperature, etc. However, the compressive force applied will generally be in the range of approximately 25 psi to 2500 psi. After themetal embossing tool 12 is removed, the embossed plastic and the perforated metal remain together as shown in FIG. 1D and provide the desired sacrificial plating mold. Using standard electroplating processes, the plastic mold is then filled in with electroplatedmetal 14 as shown in FIG. 1E. Suitable metals that can be used for electroplating include, but are not limited to, nickel, copper, silver, platinum, gold, nickel/iron, nickel/cobalt, nickel/tungsten, tin/lead and other mixtures and alloys thereof. Machining and polishing processes might be employed as needed to level any overplated metal to the height shown. The electroplated metal structure consisting of the electroplatedmetal 13 attached to theperforated metal substrate 11, as shown in FIGURE IF, remains after the sacrificial plastic mold is dissolved. As noted above, various selective metal dissolution or overplating and lapping processes might also be used to provide free metal parts or structures. - FIGS.2A-2F illustrate another embossing technique where the plastic substrate is initially located between the embossing tool and the porous metal substrate, in this case a metal mesh. FIG. 2A shows the
plastic substrate 20 located between themetal mesh 21 andmetal embossing tool 22. In FIG. 2B, the embossing tool is in contact with the plastic substrate. After theplastic substrate 20 is heated to a temperature where the plastic is softened enough to flow, compressive force is applied and the plastic allowed to fill in the features of the embossing tool and also flow into the metal mesh until the embossing tool contacts the mesh. This is shown in FIG. 2C where thetop portion 21′ of the metal mesh is infused with plastic. For most plastics, the temperature required for softening is generally in the range of about 75° C. to 200° C., and the corresponding compressive force required to fill in the features in the embossing tool is generally in the range of approximately 25 psi to 2500 psi. FIG. 2D shows the embossedplastic 20 and themetal mesh metal embossing tool 22 has been removed. In the next step, the plastic micro-mold of FIG. 2D is electroplated withmetal 23 as shown in FIG. 2E. The electroplated metal structure that results from dissolution of the sacrificial plastic mold of FIG. 2E is shown in FIG. 2F. Again, various processes might be used to obtain free metal parts or structures after the electroplating step. - FIGS.3A-3E illustrate another embodiment of the present invention, which uses injection molding of the thermoplastic material in combination with one or more porous metal substrates placed within the injection-molding cavity. As shown in FIG. 3A, both a
perforated metal sheet 30 and a soft,porous metal mesh 31 are stacked within the injection-molding cavity 32 on top of the tooledmold 33. Upon injection, themolten plastic 34 is infused through bothporous metal substrates mold 33 as shown in FIG. 3B. FIG. 3C shows the injectedplastic 34 andporous metals mold cavity 32. FIG. 3D shows the plastic micro-mold filled in with electroplatedmetal 35 and FIG. 3E shows the electroplated metal structure, which consists ofmetal mesh 31,perforated metal sheet 30 and electroplatedmetal 35, after dissolution of the sacrificial plastic mold. - A rigid metal mesh or other porous metal may replace the perforated metal screen in the above-described embodiment. The use of the softer high porosity mesh is also optional and is meant to insure the rigid mesh or screen does not move away from the tooled cavity face during resin injection. Other methods, such as a pattern of studs either on the metal substrate or the opposing mold face to prevent such movement of the porous metal substrate might also be used.
- The tooled features in the injection molding cavity might be provided by the LIGA fabrication of a metal tool, similar to those used in the above hot embossing processes, which is inserted into an injection mold base designed to accommodate interchangeable tooling inserts. This type of injection molding process, which uses free porous metal substrates in the mold cavity, is facilitated by a vertical arrangement of the injection-molding machine.
- A variety of porous metal materials suitable for use in the processes embodied above are available commercially. For example, Mott Industrial (division of Mott Corporation in Farmington, Conn.) manufactures a range of hard sintered meshes widely used in filtering and sparging applications. These are available in a range of metals (stainless steel, Monel, nickel, Hastelloy, Inconel, titanium, silver, gold and platinum) are sintered into a variety of shapes with average porosities of 0.2, 0.5, 1, 2, 5, 10, 20, 40 and 100 microns. Technetics Corporation in DeLand, Fla. manufactures porous metal felts from various alloys using 10-150 micron fibers and 35-90% pore volumes. BuckbeeMears St. Paul (division of BMC Industries, Inc. in Minneapolis, Minn.) manufactures micro-etched metal screens with a wide range of hole sizes (down to 3 mils in diameter) and in various spatial arrangements. Specialty metals other than the standard stainless steel can be requested. Inco Limited in Toronto, Canada manufactures compressible woven mats from nickel.
- Any of these porous metal substrates might be modified by the application of a thin metal coating or strike suitable for later dissolution. Such a coating might be applied by electroplating techniques or by other metal coating techniques known in the art. While coatings of many metals might easily be applied, copper is most commonly used in the case of nickel-plated parts due to the selective etching behavior of copper.
- A variety of thermoplastic substrates are usable in both the hot embossing and injection-molding processes described above and are well known in the art. This class of plastic materials (also referred to as resins or polymers) is characterized by their ability to soften and become moldable at elevated temperatures and to become hard when cooled. Some of the common thermoplastics include acetals, acrylics such as polymethylmethacrylate, acrylonitrile-butadiene-styrene (ABS) resins, cellulosics (e.g., Cellophane®), polyamides (nylon), polyarylates, polysulfones, polycarbonates, polyesters (PBT and PET), polyethylene, polypropylene, polystyrene, polytetrafluoroethylene (Teflon®), polyurethanes, polyvinyl chloride (PVC) and many others including copolymers and polymer blends. Such thermoplastics are typically available in a range of melt flow grades and might also be modified with various additives and fillers. Suitable additives include, for example, antioxidants, light and UV stabilizers, flow modifiers, anti-static modifiers, platicizers, brightenenrs, and others while suitable fillers include, but are not limited to, inorganic fillers (such as calcium carbonate, clays and metal oxides), polymeric fillers (such as Teflon powder), pigments and dyes, silicas and others.
- A feature important to the sacrificial plastic molds of this invention is their ability to be dissolved in appropriate solvents such as aliphatic hydrocarbons, ketones, halogenated hydrocarbons, aromatic hydrocarbons, alcohols, ethers, hydrofluoroethers and hydrofluorocarbons, glycols, glycol ethers and glycol esters, carbonates, polar aprotic solvents such as dimethylsulfoxide and dimethylformamide, and others. These will vary in usefulness according to the nature of the thermoplastic. Commonly used solvents to dissolve thermoplastics would include acetone, dichloromethane, dimethylformamide and tetrahydrofuran. Some thermoplastics are also susceptible to aqueous acids or bases. In particular, polyacetals are readily dissolved in phenolic and inorganic acids and polyesters can be dissolved in strong base. Appropriate radiation, oxidative, thermal or other treatments might be used to degrade the molecular structure of the thermoplastic to enhance the solubility of the sacrificial mold or to directly remove the plastic. This might include UV or x-ray exposure or an ashing treatment.
- The use of replicated sacrificial molds for the production of electroplated metal structures and parts provides significant savings in both time and money in the production of larger volumes of micro-scale devices. In contrast to the standard LIGA process, only one synchrotron exposure is needed to fabricate a molding or embossing tool that can then be used to form repetitive copies of the sacrificial plastic mold used in the electroplating step.
- Some of the many uses of the invention include micro-scale chem/bio detectors, portable or miniaturized medical diagnostic equipment, DNA analysis equipment, optical switches and related equipment, inertial sensing devices, and other miniaturized devices.
- It is to be understood that while the invention has been described in conjunction with the preferred specific embodiments thereof, the foregoing description and the examples that follow are intended to illustrate and not limit the scope of the invention. Other aspects, advantages and modifications within the scope of the invention will be apparent to those skilled in the art to which the invention pertains.
- All patents, patent applications, and publications mentioned herein are hereby incorporated by reference in their entireties.
- A plastic disk (⅛ inch thick×3.5 inch diameter) was molded from polymethyl methacrylate (PMMA, Elf-Atochem V920 grade) and fastened in a circular metal frame having a lid that only covered the edge of the disk to hold it down. This circular lip had a 3 ⅜ inch diameter. A similar but slightly larger disk of micro-etched stainless steel sheet (from Buckbee-Mears) having a regular hexagonal pattern of tapered holes (hole diameter about 150 microns facing up and about 100 microns facing down) was placed on top of the PMMA before the top portion of the frame with the securing lip was secured. Portions of the metal sheet protruded from the top and bottom portions of the frame and later provided a conducting attachment for the electroplating process. The frame fixture was fastened to the bottom of a large tool steel die equipped with a side vacuum port and a thermocouple channel below the plastic frame. A matching top die to which was fastened a metal embossing tool was lowered into the bottom die. This embossing tool contained a variety of features, all approximately 95 microns deep, ranging from gears and channels of various dimensions to wedge-like structures and other designs. Vacuum was pulled and heating applied through platens attached to the top and bottom dies. When the die thermocouple indicated a temperature of about 165° C., the top die was forced into the softened plastic at a pressure of about 125 psi. The fixturing and plastic were cooled to about room temperature and the electroplatable plastic mold was removed. Examination of the molded part showed that the micro-etched metal sheet had been forced into the PMMA disk while the PMMA flowing through the holes in the metal sheet was patterned with the embossing tool features. Bare metal sheet was visible at the bottom of the embossed features. Such a sacrificial mold is pictured in FIGS. 4A and 4B. FIG. 4A shows a circular sacrificial PMMA mold containing a micro-etched stainless steel screen as the electroplatable base. FIG. 4B shows a close-up of some of the features in the PMMA mold and the underlying micro-etched screen shown in FIG. 4A.
- The sacrificial plastic mold was electrolytically cleaned in a 70% v/v sulfuric acid solution at a current density of 150 A/ft2 for three minutes. The fresh stainless steel surfaces within the mold were given a Wood's nickel strike in a nickel chloride bath at 50 A/ft2 for three minutes followed by a copper seed layer deposited from a copper sulfate bath at 15 A/ft2 for ten minutes. The mold was then placed in a nickel sulfamate electroplating bath at 15 A/ft2 for seven hours. The features in this mold were only partially plated to a depth of about 35 microns. The PMMA mold was dissolved from the sheet and plated features using acetone.
- Examination, including cross-sectioned samples, of the plated features showed excellent plating infill over the holes in the screen. Because the mold was only partially plated in this case, a regular array of dimples in the plated metal indicated where the underlying holes in the sheet were arranged. Dissolution of the copper metal strike in a chromic/sulfuric acid copper etch released the plated nickel structures from the stainless steel porous sheet.
- The process of Example 1 was used except that the holes in the micro-etched sheet were smaller in diameter (about 75 microns, Buckbee-Mears 2-1-8 screen) and were not tapered. A higher melt flow grade of PMMA was also used (Elf Atochem VM-100). The features were over-plated in nickel and then lapped to eliminate the over-plated metal.
- The foregoing description of the invention has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described to best explain the principles of the invention and its practical application to thereby enable others skilled in the art to best use the invention in various embodiments and with various modifications suited to the particular use contemplated. The scope of the invention is to be defined by the following examples and claims.
Claims (29)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/765,078 US6422528B1 (en) | 2001-01-17 | 2001-01-17 | Sacrificial plastic mold with electroplatable base |
US10/052,948 US6679471B2 (en) | 2001-01-17 | 2002-01-17 | Castable plastic mold with electroplatable base |
PCT/US2002/001565 WO2002057516A2 (en) | 2001-01-17 | 2002-01-17 | Sacrificial plastic mold with electroplatable base and associated method of manufacture |
US10/134,060 US6929733B2 (en) | 2001-01-17 | 2002-04-24 | Sacrificial plastic mold with electroplatable base |
US10/222,763 US7090189B2 (en) | 2001-01-17 | 2002-08-15 | Compliant cantilevered micromold |
US11/440,867 US7465419B1 (en) | 2001-01-17 | 2006-05-24 | Method for providing a compliant cantilevered micromold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/765,078 US6422528B1 (en) | 2001-01-17 | 2001-01-17 | Sacrificial plastic mold with electroplatable base |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/052,948 Continuation-In-Part US6679471B2 (en) | 2001-01-17 | 2002-01-17 | Castable plastic mold with electroplatable base |
US10/134,060 Division US6929733B2 (en) | 2001-01-17 | 2002-04-24 | Sacrificial plastic mold with electroplatable base |
Publications (2)
Publication Number | Publication Date |
---|---|
US20020092962A1 true US20020092962A1 (en) | 2002-07-18 |
US6422528B1 US6422528B1 (en) | 2002-07-23 |
Family
ID=25072579
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/765,078 Expired - Lifetime US6422528B1 (en) | 2001-01-17 | 2001-01-17 | Sacrificial plastic mold with electroplatable base |
US10/052,948 Expired - Lifetime US6679471B2 (en) | 2001-01-17 | 2002-01-17 | Castable plastic mold with electroplatable base |
US10/134,060 Expired - Fee Related US6929733B2 (en) | 2001-01-17 | 2002-04-24 | Sacrificial plastic mold with electroplatable base |
US11/440,867 Expired - Fee Related US7465419B1 (en) | 2001-01-17 | 2006-05-24 | Method for providing a compliant cantilevered micromold |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/052,948 Expired - Lifetime US6679471B2 (en) | 2001-01-17 | 2002-01-17 | Castable plastic mold with electroplatable base |
US10/134,060 Expired - Fee Related US6929733B2 (en) | 2001-01-17 | 2002-04-24 | Sacrificial plastic mold with electroplatable base |
US11/440,867 Expired - Fee Related US7465419B1 (en) | 2001-01-17 | 2006-05-24 | Method for providing a compliant cantilevered micromold |
Country Status (2)
Country | Link |
---|---|
US (4) | US6422528B1 (en) |
WO (1) | WO2002057516A2 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060151915A1 (en) * | 2004-08-24 | 2006-07-13 | Dyke Darrell V | Machine and process for fusion molding of plastic single-use containers |
US20060259546A1 (en) * | 2003-12-11 | 2006-11-16 | Heptagon Oy | Manufacturing a replication tool, sub-master or replica |
US20060279025A1 (en) * | 2005-06-10 | 2006-12-14 | Babak Heidari | Pattern replication with intermediate stamp |
US20090200550A1 (en) * | 2008-02-08 | 2009-08-13 | Roger Stanley Kerr | Method for forming an electronic device on a flexible substrate supported by a detachable carrier |
US20100155988A1 (en) * | 2008-12-19 | 2010-06-24 | Obducat Ab | Process and method for modifying polymer film surface interaction |
US20100160478A1 (en) * | 2008-12-19 | 2010-06-24 | Obducat Ab | Methods and processes for modifying polymer material surface interactions |
DE102012206097A1 (en) * | 2012-04-13 | 2013-10-17 | Robert Bosch Gmbh | Method for manufacturing metal structure e.g. movable metallic microstructure, involves galvanizing metal structure on surface of substrate so that shaped portion and substrate are formed with structured surface formed by column matrix |
WO2016155760A1 (en) * | 2015-03-27 | 2016-10-06 | Wageningen Universiteit | A method of manufacturing a microfluidic device |
CN107636878A (en) * | 2015-05-18 | 2018-01-26 | 索诺瓦公司 | Anode can sacrificial mandrel and manufacture method |
CN109909504A (en) * | 2019-02-28 | 2019-06-21 | 昆明理工大学 | A kind of porous foam enhancing metallic composite and preparation method thereof |
CN110963457A (en) * | 2018-09-29 | 2020-04-07 | 中国科学院微电子研究所 | High-precision micro-channel network manufacturing method |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6422528B1 (en) * | 2001-01-17 | 2002-07-23 | Sandia National Laboratories | Sacrificial plastic mold with electroplatable base |
US20020130444A1 (en) * | 2001-03-15 | 2002-09-19 | Gareth Hougham | Post cure hardening of siloxane stamps for microcontact printing |
US20020180108A1 (en) * | 2001-04-16 | 2002-12-05 | Kiyofumi Koshiba | Electromagnetic shielding box and method of manufacturing the same |
US6716754B2 (en) * | 2002-03-12 | 2004-04-06 | Micron Technology, Inc. | Methods of forming patterns and molds for semiconductor constructions |
US7229542B2 (en) * | 2002-05-07 | 2007-06-12 | Microfabrica Inc. | Methods of and apparatus for molding structures using sacrificial metal patterns |
US7125510B2 (en) * | 2002-05-15 | 2006-10-24 | Zhili Huang | Microstructure fabrication and microsystem integration |
JP2004009144A (en) * | 2002-06-03 | 2004-01-15 | Disco Abrasive Syst Ltd | Method of manufacturing micro parts |
US6899838B2 (en) * | 2002-07-12 | 2005-05-31 | Becton, Dickinson And Company | Method of forming a mold and molding a micro-device |
DE10236812A1 (en) * | 2002-08-10 | 2004-02-19 | Forschungszentrum Karlsruhe Gmbh | For the production of metal/ceramic micro-components, a lost negative mold is shaped in a three-dimensional body by injection molding using two polymer fractions, where one is electrically conductive |
US7371975B2 (en) * | 2002-12-18 | 2008-05-13 | Intel Corporation | Electronic packages and components thereof formed by substrate-imprinting |
US20040126547A1 (en) * | 2002-12-31 | 2004-07-01 | Coomer Boyd L. | Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
US6974775B2 (en) * | 2002-12-31 | 2005-12-13 | Intel Corporation | Method and apparatus for making an imprinted conductive circuit using semi-additive plating |
US7296592B2 (en) * | 2003-09-16 | 2007-11-20 | Eksigent Technologies, Llc | Composite polymer microfluidic control device |
CA2540035C (en) | 2003-09-23 | 2012-11-20 | University Of North Carolina At Chapel Hill | Photocurable perfluoropolyethers for use as novel materials in microfluidic devices |
JP2005166105A (en) * | 2003-11-28 | 2005-06-23 | Tdk Corp | Manufacturing method of master disk for transferring irregular pattern and stamper for manufacturing information recording medium |
US7052926B2 (en) * | 2003-12-18 | 2006-05-30 | Corporation For National Research Initiatives | Fabrication of movable micromechanical components employing low-cost, high-resolution replication technology method |
US9040090B2 (en) | 2003-12-19 | 2015-05-26 | The University Of North Carolina At Chapel Hill | Isolated and fixed micro and nano structures and methods thereof |
KR101376715B1 (en) | 2003-12-19 | 2014-03-27 | 더 유니버시티 오브 노쓰 캐롤라이나 엣 채플 힐 | Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography |
US20070275193A1 (en) * | 2004-02-13 | 2007-11-29 | Desimone Joseph M | Functional Materials and Novel Methods for the Fabrication of Microfluidic Devices |
US20050221112A1 (en) * | 2004-03-31 | 2005-10-06 | Daewoong Suh | Microtools for package substrate patterning |
GB0412097D0 (en) * | 2004-05-29 | 2004-06-30 | Rolls Royce Plc | Method of producing a self supporting form from a coating material |
WO2005124788A2 (en) * | 2004-06-14 | 2005-12-29 | Axon Technologies Corporation | Nanoscale programmable structures and methods of forming and using same |
JP4554330B2 (en) * | 2004-10-21 | 2010-09-29 | 株式会社リコー | High durability heat insulating stamper structure |
US20090027603A1 (en) * | 2005-02-03 | 2009-01-29 | Samulski Edward T | Low Surface Energy Polymeric Material for Use in Liquid Crystal Displays |
WO2006113758A2 (en) * | 2005-04-19 | 2006-10-26 | Cool Options, Inc. | Method of two shot mold metallizing of polymer components |
KR101222946B1 (en) * | 2005-06-24 | 2013-01-17 | 엘지디스플레이 주식회사 | method for fabricating soft mold attached back-plane |
WO2007007755A1 (en) * | 2005-07-14 | 2007-01-18 | Matsushita Electric Industrial Co., Ltd. | Forming member of reflection preventing structure and transfer material using this, and optical apparatus provided with reflection preventing structure and production method thereof |
WO2007133235A2 (en) * | 2005-08-08 | 2007-11-22 | Liquidia Technologies, Inc. | Micro and nano-structure metrology |
EP1922364A4 (en) | 2005-08-09 | 2010-04-21 | Univ North Carolina | Methods and materials for fabricating microfluidic devices |
CA2619509C (en) | 2005-08-12 | 2015-01-06 | Modumetal, Llc. | Compositionally modulated composite materials and methods for making the same |
WO2008011051A1 (en) * | 2006-07-17 | 2008-01-24 | Liquidia Technologies, Inc. | Nanoparticle fabrication methods, systems, and materials |
US8243358B2 (en) * | 2006-11-24 | 2012-08-14 | The Hong Kong University Of Science & Technology | Constructing planar and three-dimensional microstructures with PDMS-based conducting composite |
US8128393B2 (en) * | 2006-12-04 | 2012-03-06 | Liquidia Technologies, Inc. | Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom |
US20100151031A1 (en) * | 2007-03-23 | 2010-06-17 | Desimone Joseph M | Discrete size and shape specific organic nanoparticles designed to elicit an immune response |
US8851442B2 (en) | 2008-01-22 | 2014-10-07 | Honeywell International Inc. | Aerogel-bases mold for MEMS fabrication and formation thereof |
MX366510B (en) | 2008-12-05 | 2019-07-11 | Liquidia Tech Inc | Method for producing patterned materials. |
EP2370348A4 (en) * | 2008-12-17 | 2016-12-21 | 3M Innovative Properties Co | Fabrication of conductive nanostructures on a flexible substrate |
DE102009010954A1 (en) * | 2009-02-27 | 2010-09-23 | Karlsruher Institut für Technologie | Production method for a negative mold for a galvanic or electrophoretic deposition |
BRPI1010877B1 (en) | 2009-06-08 | 2020-09-15 | Modumetal, Inc | CORROSION RESISTANT MULTILAYER COATING AND ELECTRODEPOSITION METHOD |
US8992200B2 (en) * | 2009-12-29 | 2015-03-31 | General Electric Company | Resin infusion apparatus and system, layup system, and methods of using these |
US8293657B2 (en) | 2010-11-05 | 2012-10-23 | Honeywell International Inc. | Sacrificial layers made from aerogel for microelectromechanical systems (MEMS) device fabrication processes |
US8747639B2 (en) | 2011-03-31 | 2014-06-10 | Pratt & Whitney Canada Corp. | Metal plating method and apparatus |
TW201321315A (en) * | 2011-11-25 | 2013-06-01 | Hon Hai Prec Ind Co Ltd | Mold core and method for manufacturing the same |
BR112015011468A2 (en) * | 2012-11-20 | 2017-07-11 | Federal Mogul Corp | Low friction, high strength designed material for bearings and other applications |
BR112015022020A8 (en) | 2013-03-15 | 2019-12-10 | Modumetal Inc | object or coating and its manufacturing process |
EP2971261A4 (en) | 2013-03-15 | 2017-05-31 | Modumetal, Inc. | Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes |
WO2016044720A1 (en) | 2014-09-18 | 2016-03-24 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
BR112015022078B1 (en) | 2013-03-15 | 2022-05-17 | Modumetal, Inc | Apparatus and method for electrodepositing a nanolaminate coating |
EA032264B1 (en) | 2013-03-15 | 2019-05-31 | Модьюметл, Инк. | Method of coating an article, article prepared by the above method and pipe |
CA2917888A1 (en) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Plated polymer composite molding |
RS61459B1 (en) | 2013-11-19 | 2021-03-31 | Aqua Metals Inc | Devices and methods for smelterless recycling of lead acid batteries |
EA201790644A1 (en) * | 2014-09-18 | 2017-08-31 | Модьюметал, Инк. | METHODS OF PRODUCTION OF PRODUCTS ELECTRICAL PLANTING AND PROCESSES OF LAYERED SYNTHESIS |
US9875987B2 (en) * | 2014-10-07 | 2018-01-23 | Nxp Usa, Inc. | Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices |
JP6857125B2 (en) * | 2014-12-26 | 2021-04-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | Sinterable bonding material and semiconductor devices using it |
EP3294931A4 (en) * | 2015-05-13 | 2018-12-26 | Aqua Metals Inc. | Electrodeposited lead composition, methods of production, and uses |
CA2986001A1 (en) | 2015-05-13 | 2016-11-17 | Stephen R. Clarke | Closed loop systems and methods for recycling lead acid batteries |
PE20180144A1 (en) | 2015-05-13 | 2018-01-18 | Aqua Metals Inc | SYSTEMS AND METHODS FOR LEAD RECOVERY FROM LEAD ACID BATTERIES |
KR102433789B1 (en) * | 2015-09-14 | 2022-08-18 | 삼성디스플레이 주식회사 | Tension test piece and method of manufacturing the same |
CN105239110A (en) * | 2015-11-12 | 2016-01-13 | 清华大学 | Three-dimensional electroforming machining method and system |
US10316420B2 (en) | 2015-12-02 | 2019-06-11 | Aqua Metals Inc. | Systems and methods for continuous alkaline lead acid battery recycling |
AR109584A1 (en) | 2016-09-08 | 2018-12-26 | Modumetal Inc | PROCESSES TO PROVIDE LAMINATED COATINGS ON WORK PARTS, AND THE ARTICLES OBTAINED WITH THE SAME |
CN106544705A (en) * | 2016-10-31 | 2017-03-29 | 常州瑞丰特科技有限公司 | The manufacture method of the micro- replica metal micro structure of precise electrotyping |
CN106876277B (en) * | 2017-02-20 | 2020-03-17 | 武汉华星光电技术有限公司 | Preparation method of thin film transistor and preparation method of display panel |
CA3057836A1 (en) | 2017-03-24 | 2018-09-27 | Modumetal, Inc. | Lift plungers with electrodeposited coatings, and systems and methods for producing the same |
EP3612669A1 (en) | 2017-04-21 | 2020-02-26 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
EP3784823A1 (en) | 2018-04-27 | 2021-03-03 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
CN109202046B (en) * | 2018-09-13 | 2020-08-25 | 昆明理工大学 | Layered periodic pore structure aluminum or aluminum alloy foam and preparation method thereof |
US20200103179A1 (en) * | 2018-10-01 | 2020-04-02 | GM Global Technology Operations LLC | Assemblies having enhanced heat transfer through vascular channels and methods of manufacturing assemblies having vascular channels |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1203038A (en) * | 1966-12-06 | 1970-08-26 | Ici Ltd | Improved method for the production of embossing surfaces |
US4336221A (en) * | 1972-08-11 | 1982-06-22 | Armen Garabedian | Process for making a stress-free plastic article |
US4162078A (en) * | 1978-02-01 | 1979-07-24 | Union Carbide Corporation | Injectable packing formulation containing flexible graphite |
DE2933570C3 (en) | 1979-08-18 | 1982-02-25 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Process for making separation nozzle elements |
DE3206820C2 (en) | 1982-02-26 | 1984-02-09 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Process for making separation nozzle elements |
DE3537483C1 (en) | 1985-10-22 | 1986-12-04 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Process for producing a large number of plate-shaped microstructure bodies made of metal |
DE3842610C1 (en) | 1988-12-17 | 1990-06-21 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
DE3842611C1 (en) | 1988-12-17 | 1990-02-22 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
DE3937308C1 (en) | 1989-11-09 | 1991-03-21 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
DE4010669C1 (en) | 1990-04-03 | 1991-04-11 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
JP3005945B2 (en) * | 1991-01-31 | 2000-02-07 | アサヒプラスチックス株式会社 | Composite material and method for producing the same |
US5190637A (en) | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
DE4219667C2 (en) | 1992-06-16 | 1994-12-01 | Kernforschungsz Karlsruhe | Tool and method for producing a microstructured plastic layer |
US5378583A (en) | 1992-12-22 | 1995-01-03 | Wisconsin Alumni Research Foundation | Formation of microstructures using a preformed photoresist sheet |
US5780140A (en) * | 1996-09-23 | 1998-07-14 | Reflexite Corporation | Retroreflective microprismatic material with top face curvature and method of making same |
US5875549A (en) * | 1997-03-17 | 1999-03-02 | Siemens Westinghouse Power Corporation | Method of forming internal passages within articles and articles formed by same |
AU743394B2 (en) * | 1997-04-04 | 2002-01-24 | University Of Southern California | Article, method, and apparatus for electrochemical fabrication |
US6149160A (en) * | 1997-08-08 | 2000-11-21 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Mechanical seals enhanced with microstructures |
EP1003078A3 (en) * | 1998-11-17 | 2001-11-07 | Corning Incorporated | Replicating a nanoscale pattern |
RU2184799C1 (en) * | 2000-11-22 | 2002-07-10 | Борисов Дмитрий Сергеевич | Galvanoplastic process of manufacture of models with complex structure |
US7090189B2 (en) * | 2001-01-17 | 2006-08-15 | Sandia National Laboratories | Compliant cantilevered micromold |
US6422528B1 (en) * | 2001-01-17 | 2002-07-23 | Sandia National Laboratories | Sacrificial plastic mold with electroplatable base |
-
2001
- 2001-01-17 US US09/765,078 patent/US6422528B1/en not_active Expired - Lifetime
-
2002
- 2002-01-17 WO PCT/US2002/001565 patent/WO2002057516A2/en not_active Application Discontinuation
- 2002-01-17 US US10/052,948 patent/US6679471B2/en not_active Expired - Lifetime
- 2002-04-24 US US10/134,060 patent/US6929733B2/en not_active Expired - Fee Related
-
2006
- 2006-05-24 US US11/440,867 patent/US7465419B1/en not_active Expired - Fee Related
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8221665B2 (en) * | 2003-12-11 | 2012-07-17 | Heptagon Oy | Manufacturing a replication tool, sub-master or replica |
US20060259546A1 (en) * | 2003-12-11 | 2006-11-16 | Heptagon Oy | Manufacturing a replication tool, sub-master or replica |
US20060151915A1 (en) * | 2004-08-24 | 2006-07-13 | Dyke Darrell V | Machine and process for fusion molding of plastic single-use containers |
US20060279025A1 (en) * | 2005-06-10 | 2006-12-14 | Babak Heidari | Pattern replication with intermediate stamp |
US7704425B2 (en) * | 2005-06-10 | 2010-04-27 | Obducat Ab | Pattern replication with intermediate stamp |
US9627420B2 (en) * | 2008-02-08 | 2017-04-18 | Carestream Health, Inc. | Method for forming an electronic device on a flexible substrate supported by a detachable carrier |
US20090200550A1 (en) * | 2008-02-08 | 2009-08-13 | Roger Stanley Kerr | Method for forming an electronic device on a flexible substrate supported by a detachable carrier |
US20100160478A1 (en) * | 2008-12-19 | 2010-06-24 | Obducat Ab | Methods and processes for modifying polymer material surface interactions |
US20100155988A1 (en) * | 2008-12-19 | 2010-06-24 | Obducat Ab | Process and method for modifying polymer film surface interaction |
US8426025B2 (en) | 2008-12-19 | 2013-04-23 | Obducat Ab | Process and method for modifying polymer film surface interaction |
US9063408B2 (en) | 2008-12-19 | 2015-06-23 | Obducat Ab | Methods and processes for modifying polymer material surface interactions |
DE102012206097A1 (en) * | 2012-04-13 | 2013-10-17 | Robert Bosch Gmbh | Method for manufacturing metal structure e.g. movable metallic microstructure, involves galvanizing metal structure on surface of substrate so that shaped portion and substrate are formed with structured surface formed by column matrix |
WO2016155760A1 (en) * | 2015-03-27 | 2016-10-06 | Wageningen Universiteit | A method of manufacturing a microfluidic device |
US11052388B2 (en) | 2015-03-27 | 2021-07-06 | Wageningen Universiteit | Method of manufacturing a microfluidic device |
CN107636878A (en) * | 2015-05-18 | 2018-01-26 | 索诺瓦公司 | Anode can sacrificial mandrel and manufacture method |
CN110963457A (en) * | 2018-09-29 | 2020-04-07 | 中国科学院微电子研究所 | High-precision micro-channel network manufacturing method |
CN109909504A (en) * | 2019-02-28 | 2019-06-21 | 昆明理工大学 | A kind of porous foam enhancing metallic composite and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2002057516A3 (en) | 2003-07-24 |
US7465419B1 (en) | 2008-12-16 |
WO2002057516A2 (en) | 2002-07-25 |
US6929733B2 (en) | 2005-08-16 |
US20020179449A1 (en) | 2002-12-05 |
US20020117599A1 (en) | 2002-08-29 |
US6422528B1 (en) | 2002-07-23 |
US6679471B2 (en) | 2004-01-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6422528B1 (en) | Sacrificial plastic mold with electroplatable base | |
McGeough et al. | Electroforming process and application to micro/macro manufacturing | |
JP3269827B2 (en) | Articles, methods and apparatus for electrochemical manufacturing | |
Lee et al. | Design and fabrication of CD-like microfluidic platforms for diagnostics: polymer-based microfabrication | |
US7090189B2 (en) | Compliant cantilevered micromold | |
US6268025B1 (en) | Method of producing integrated electrodes in plastic dies, plastic dies containing integrated electrodes and application of the same | |
WO2006096005A1 (en) | Waterproof substrate and method for fabricating the same | |
KR100996655B1 (en) | Method of manufacturing a holey electroformed shell for patterning | |
US9074293B2 (en) | Porous electroformed shell for patterning and manufacturing method thereof | |
US4981558A (en) | Process for the reproduction of a microstructured, plate-shaped body | |
JP3783862B2 (en) | Method for producing mold for forming structure having fine ridge and method for producing structure having fine bulge using the mold | |
Domeier et al. | Microscreen-based replication of electroforming micromolds | |
JP4546232B2 (en) | Electroforming mold and manufacturing method thereof | |
Parkinson | Electroforming: A Unique Metal Fabrication Process | |
GB2172013A (en) | Manufacture of air permeable electrocast shell | |
Piotter et al. | New developments of process technologies for microfabrication | |
KR100996656B1 (en) | Holey electroformed shell for patterning | |
Narasimhan et al. | Rapid fabrication of hot embossing tools using PDMS | |
Turner | Tapered LIGA mold insert | |
MXPA99009010A (en) | Article, method, and apparatus for electrochemical fabrication |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SANDIA CORPORATION, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MORALES, ALFREDO M.;HRUBY, JILL M.;DOMEIER, LINDA A.;REEL/FRAME:011951/0828;SIGNING DATES FROM 20010611 TO 20010613 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
CC | Certificate of correction | ||
AS | Assignment |
Owner name: U.S. DEPARTMENT OF ENERGY, DISTRICT OF COLUMBIA Free format text: CONFIRMATORY LICENSE;ASSIGNOR:SANDIA CORPORATION;REEL/FRAME:013908/0508 Effective date: 20020725 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SAN Free format text: CHANGE OF NAME;ASSIGNOR:SANDIA CORPORATION;REEL/FRAME:043894/0094 Effective date: 20170501 |