US20020057559A1 - PCB structure for regulating constant power source and strengthening ground connections - Google Patents
PCB structure for regulating constant power source and strengthening ground connections Download PDFInfo
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- US20020057559A1 US20020057559A1 US09/924,880 US92488001A US2002057559A1 US 20020057559 A1 US20020057559 A1 US 20020057559A1 US 92488001 A US92488001 A US 92488001A US 2002057559 A1 US2002057559 A1 US 2002057559A1
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- 238000005728 strengthening Methods 0.000 title claims abstract description 15
- 230000001105 regulatory effect Effects 0.000 title claims abstract description 12
- 230000011664 signaling Effects 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 239000003973 paint Substances 0.000 description 4
- 230000000087 stabilizing effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002250 progressing effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Definitions
- the present invention relates to the main board of a computer system. More particularly, the present invention relates to a computer main board structure for regulating constant power source.
- CPUs central processing units
- GHz gigahertz
- one object of the present invention is to provide a circuit board and circuit sub-board capable of regulating constant power source and strengthening ground connections without increasing surface or volume of a main board so that the first and the fourth signaling layers on the main board are almost identical and that the cost of manufacture remains low.
- the invention provides a circuit sub-board that can be applied to a computer system for regulating constant power sources and strengthening ground connections.
- the computer system includes a main board.
- the main board further includes a first power-source hole, a first ground-connection hole, a first power-source layer and a first ground-connection layer.
- the circuit sub-board includes a printed circuit board.
- the printed circuit board further includes a second power-source layer and a second ground-connection layer.
- the second power-source layer has second power-source holes and the second ground-connection layer has second ground-connection holes.
- the printed circuit board can be a double-layered circuit board, for example.
- the printed circuit board serves to stabilize voltage and strengthen ground connections.
- the second power layer is electrically connected to the first power-source hole via the second power-source hole.
- the first power-source layer is connected to the main board and the second ground-connection hole is above the printed circuit board.
- the second ground-connection layer is electrically connected to the first ground-connection hole via the second ground-connection hole so that the first ground layer of the main board is connected.
- the circuit sub-board is actually attached to the main board.
- regions on the main board that corresponds to various components are excavated so that the circuit sub-board can attach to the main board.
- the second ground-connection layer is closer to the main board than the second power-source layer.
- the structure formed by attaching the aforementioned circuit sub-board to the main board is achieved by piercing a plurality of guiding legs through the first power-source holes and the second power-source holes as well as piercing through the first ground-connection holes and the second ground-connection holes.
- the computer system further includes a chipset and a memory module slot.
- the circuit sub-board is in such a shape that most of the signaling lines between the chipset and the memory module slot are covered. Because the fourth signaling layer is electrically connected with and close to the circuit sub-board, this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference.
- This invention also provides a circuit board structure that can be applied to a computer system for regulating constant power sources and strengthening ground connections.
- the computer board structure includes a main board.
- the main board further includes a first printed circuit board, a first power-source layer, a first ground-connection layer, first power-source holes and first ground-connection holes.
- the first power-source holes are electrically connected to the first power-source layer.
- the first ground-connection holes are electrically connected to the first ground-connection layer and a circuit sub-board.
- the circuit sub-board serves to stabilize voltage.
- the printed circuit sub-board for example, can be a double-layered circuit board such as a second printed circuit board having a second power-source layer and a second ground-connection layer.
- the second power-source layer has second power-source holes.
- the second ground-connection layer has second ground-connection holes and is above the second printed circuit board.
- the second power-source layer is electrically connected to the first power-source holes via the second power-source holes.
- the second ground-connection holes are above the second printed circuit board.
- the second ground-connection layer is electrically connected to the first ground-connection holes via the second ground-connection holes.
- the circuit sub-board is actually attached to the main board. Regions on the main board that corresponds to various components are excavated so that the circuit sub-board can attach to the main board.
- the second ground-connection layer is closer to the main board than the second power-source layer.
- the structure formed by attaching the aforementioned circuit sub-board to the circuit board structure is achieved by piercing a plurality of guiding legs through the first power-source holes and the second power-source holes as well as the first ground-connection holes and the second ground-connection holes.
- the computer system further includes a chipset and a memory module slot.
- the circuit sub-board is in such a shape that most of the signaling lines between the chipset and the memory module slot are covered. Because the fourth signaling layer is electrically connected with and close to the circuit sub-board, this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference.
- FIG. 1 is a sketch of the power-source layer on a circuit sub-board for regulating constant power source and strengthening ground connections according to one preferred embodiment of this invention
- FIG. 2 is a sketch of the ground-connection layer on the circuit sub-board shown in FIG. 1;
- FIG. 3 is a sketch showing locations of components on the first layer of a main board that are used together with the circuit sub-board of this invention
- FIG. 4 is a sketch showing locations of components on the fourth layer of the main board shown in FIG. 3;
- FIG. 5 is a sketch showing a portion of the layout design for the main board components shown in FIG. 3;
- FIG. 6 is a sketch showing a portion of the layout design at the backside of the main board shown in FIG. 3.
- FIGS. 1 through 6 are diagrams according to the invention showing circuit sub-board structures, associated main board structures and their corresponding layouts for regulating constant power source and strengthening ground connections.
- the circuit sub-board 46 for regulating constant power source and strengthening ground connections can be applied to a computer system.
- the computer system includes a main board 52 .
- the main board 52 further includes first power-source holes 10 , 12 , 14 , 16 , 18 , first ground-connection holes 30 , 32 , 34 , 36 , a first power-source layer and a first ground-connection layer.
- the circuit sub-board 46 includes a printed circuit board.
- the printed circuit board includes a second power-source layer 48 and a second ground-connection layer 50 .
- the second power-source layer 48 has second power-source holes 20 , 22 , 24 , 26 and 28 .
- the second ground-connection layer has second ground-connection holes 38 , 40 , 42 and 44 .
- the printed circuit board 46 can be a double-layered circuit board, for example. The printed circuit board 46 serves to stabilize voltage and strengthen ground connections.
- the second power-source layer 48 is electrically connected to the first power-source holes ( 10 , 12 , 14 , 16 and 18 ) via the second power-source holes ( 20 , 22 , 24 , 26 and 28 ). Hence, the first power-source layer of the main board 52 is connected.
- the second ground-connection holes 38 , 40 , 42 and 44 are above the printed circuit board 46 .
- the second ground-connection layer 50 is electrically connected to the first ground-connection holes ( 30 , 32 , 34 and 36 ) via the second ground-connection holes ( 38 , 40 , 42 and 44 ). Hence, the first ground-connection layer of the main board is connected. Portions of the main board 52 that corresponds to various electrical devices on the circuit sub-board 46 are excavated to prevent any electrical connection. Alternatively, instead of excavating the main board 52 , an insulating material such as insulating paint may be painted over the electrical devices on the main board 52 . The paint serves as electrical isolation for the circuit sub-board 46 so that the circuit sub-board 46 can actually attach to the main board 52 .
- the second ground connection layer is closer to the main board 52 than the second power source layer. However, even if the second power source layer 48 of the circuit sub-board 46 is closer to the main board 52 , power source stabilizing and ground connection strengthening effects are still present, although not as good as when the second ground connection layer 50 is closer to the main board 52 .
- the structure formed by attaching the aforementioned circuit sub-board 46 to the main board 52 is achieved by piercing a plurality of guiding legs through the first power-source holes 10 , 12 , 14 , 16 , 18 and the second power-source holes 20 , 22 , 24 , 26 , 28 as well as piercing through the first ground-connection holes 30 , 32 , 34 , 36 and the second ground-connection holes 38 , 40 , 42 , 44 .
- These guiding legs not only serve as a medium of connection and piercing, but also serve as a tool for securing the circuit sub-board 46 .
- the computer system further includes a chipset 70 and memory module slots 58 , 60 , 62 , 64 , 66 and 68 .
- the circuit sub-board 46 has such a shape that most of the signaling lines between the chipset 70 and the memory module slots 58 , 60 , 62 , 64 , 66 and 68 are covered as shown by labels 54 and 56 in the FIGS. 4 and 5. Because the fourth signaling layer is electrically connected with and close to the circuit sub-board 46 , this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference.
- This invention also provides a circuit board structure for regulating constant power source and strengthening ground connections that can be applied to a computer system.
- the circuit board structure includes a main board 52 .
- the main board 52 further includes a first printed circuit board, a first power-source layer, a first ground-connection layer, first power-source holes 10 , 12 , 14 , 16 , 18 and first ground-connection holes 30 , 32 , 34 , 36 .
- the first power-source holes 10 , 12 , 14 , 16 , 18 are electrically connected to the first power-source layer.
- the first ground-connection holes 30 , 32 , 34 , 36 are electrically connected to the first ground-connection layer.
- the circuit board structure also includes a circuit sub-board 46 .
- the circuit sub-board 46 serves to stabilize voltage.
- the circuit sub-board 46 can be a double-layered circuit board, for example.
- the circuit sub-board 46 is a second printed circuit having a second power-source layer 48 and a second ground-connection layer 50 .
- the second power-source layer 48 has second power-source holes 20 , 22 , 24 , 26 and 28 .
- the second ground-connection layer 50 has second ground-connection holes 38 , 40 , 42 , 44 above the second printed circuit board.
- the second power-source layer 48 is electrically connected to the first power-source holes ( 10 , 12 , 14 , 16 and 18 ) via the second power-source holes ( 20 , 22 , 24 , 26 and 28 ) above the second printed circuit board.
- the second ground-connection layer 50 is electrically connected to the first ground-connection holes ( 30 , 32 , 34 and 36 ) via the second ground-connection holes ( 38 , 40 , 42 and 44 ). Portions of the main board 52 that corresponds to various electrical devices on the circuit sub-board 46 are excavated to prevent any electrical connection. Alternatively, instead of excavating the main board 52 , an insulating material such as insulating paint may be painted over the electrical devices on the main board 52 . The paint serves as electrical isolation for the circuit sub-board 46 so that the circuit sub-board 46 can actually attach to the main board 52 .
- the second ground connection layer 50 is closer to the main board 52 than the second power source layer. However, even if the second power-source layer 48 of the circuit sub-board 46 is closer to the main board 52 , power source stabilizing and ground connection strengthening effects are still present, although not as good as when the second ground connection layer 50 is closer to the main board 52 .
- the structure formed by attaching the aforementioned circuit sub-board 46 to the main board 52 is achieved by piercing a plurality of guiding legs through the first power-source holes 10 , 12 , 14 , 16 , 18 and the second power-source holes 20 , 22 , 24 , 26 , 28 as well as piercing through the first ground-connection holes 30 , 32 , 34 , 36 and the second ground-connection holes 38 , 40 , 42 , 44 .
- These guiding legs not only serve as a medium of connection and piercing, but also serve as a tool for securing the circuit sub-board 46 .
- the computer system further includes a chipset 70 and memory module slots 58 , 60 , 62 , 64 , 66 and 68 .
- the circuit sub-board 46 has such a shape that most of the signaling lines between the chipset 70 and the memory module slots 58 , 60 , 62 , 64 , 66 and 68 are covered. Because the fourth signaling layer is electrically connected with and close to the circuit sub-board 46 , this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A circuit sub-board for regulating constant power source and strengthening ground connections. The circuit sub-board is a double-layered printed circuit board having a large surface power-source layer and a ground-connection layer. The circuit sub-board is utilized to cover the insufficiently ground-covered main board signaling lines as well as insufficiently ground-connected power and ground signaling lines on the main board. With the installation of the circuit sub-board, signals can be transmitted more reliably and with less interference.
Description
- This application claims the priority benefit of Taiwan application serial no. 89123792, filed Nov. 10, 2000.
- 1. Field of Invention
- The present invention relates to the main board of a computer system. More particularly, the present invention relates to a computer main board structure for regulating constant power source.
- 2. Description of Related Art
- Due to the rapid progress in semiconductor fabrication technologies, powerful central processing units (CPUs) capable of executing billions of instructions per second are constructed. Consequently, most recent personal computers operate at a bus speed related to the processor clock rate progressing in the gigahertz (GHz) frequency range. Even computer peripheral products can perform at a speed that parallels the CPU.
- As the early computer system, the operating frequency is much lower than nowadays. Hence, signal reception for these types of computers are rarely affected by weak ground connections or an unstable voltage supply. However, the recent computer generally operates at a bus speed related to the processor clock rate progressing in the gigahertz frequency range. And the printed circuit board of the recent computer presents highly tight squeeze layout leg and outlet legs that requires a pierce-hole method to transmit signals from the top layer to the bottom layer. Consequently, producing an extensive ground layer or a power-source layer on a computer main board is almost impossible. Due to differences in power source and ground connection areas, signal received by the top signal layer and the bottom signal layer is bound to be unstable.
- However, a printed circuit board with four layers is the most cost-effective means of production at present. Hence, a circuit board capable of regulating constant power source, strengthening ground connections, protecting signal integrity during transmission and shielding out external electromagnetic interference is in great demand.
- Accordingly, one object of the present invention is to provide a circuit board and circuit sub-board capable of regulating constant power source and strengthening ground connections without increasing surface or volume of a main board so that the first and the fourth signaling layers on the main board are almost identical and that the cost of manufacture remains low.
- To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides a circuit sub-board that can be applied to a computer system for regulating constant power sources and strengthening ground connections. The computer system includes a main board. The main board further includes a first power-source hole, a first ground-connection hole, a first power-source layer and a first ground-connection layer. The circuit sub-board includes a printed circuit board. The printed circuit board further includes a second power-source layer and a second ground-connection layer. The second power-source layer has second power-source holes and the second ground-connection layer has second ground-connection holes. The printed circuit board can be a double-layered circuit board, for example. The printed circuit board serves to stabilize voltage and strengthen ground connections. The second power layer is electrically connected to the first power-source hole via the second power-source hole. Hence, the first power-source layer is connected to the main board and the second ground-connection hole is above the printed circuit board. The second ground-connection layer is electrically connected to the first ground-connection hole via the second ground-connection hole so that the first ground layer of the main board is connected. The circuit sub-board is actually attached to the main board. In this invention, regions on the main board that corresponds to various components are excavated so that the circuit sub-board can attach to the main board. In addition, the second ground-connection layer is closer to the main board than the second power-source layer. Although power source stabilizing and ground-connection strengthening effects are weaker when the second power-source layer is closer to the main board, the effects are present nonetheless.
- According to the embodiment of this invention, the structure formed by attaching the aforementioned circuit sub-board to the main board is achieved by piercing a plurality of guiding legs through the first power-source holes and the second power-source holes as well as piercing through the first ground-connection holes and the second ground-connection holes. The computer system further includes a chipset and a memory module slot. The circuit sub-board is in such a shape that most of the signaling lines between the chipset and the memory module slot are covered. Because the fourth signaling layer is electrically connected with and close to the circuit sub-board, this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference.
- This invention also provides a circuit board structure that can be applied to a computer system for regulating constant power sources and strengthening ground connections. The computer board structure includes a main board. The main board further includes a first printed circuit board, a first power-source layer, a first ground-connection layer, first power-source holes and first ground-connection holes. The first power-source holes are electrically connected to the first power-source layer. The first ground-connection holes are electrically connected to the first ground-connection layer and a circuit sub-board. The circuit sub-board serves to stabilize voltage. The printed circuit sub-board, for example, can be a double-layered circuit board such as a second printed circuit board having a second power-source layer and a second ground-connection layer. The second power-source layer has second power-source holes. The second ground-connection layer has second ground-connection holes and is above the second printed circuit board. The second power-source layer is electrically connected to the first power-source holes via the second power-source holes. The second ground-connection holes are above the second printed circuit board. The second ground-connection layer is electrically connected to the first ground-connection holes via the second ground-connection holes. The circuit sub-board is actually attached to the main board. Regions on the main board that corresponds to various components are excavated so that the circuit sub-board can attach to the main board. In addition, the second ground-connection layer is closer to the main board than the second power-source layer. Although power source stabilizing and ground-connection strengthening effects are weaker when the second power-source layer is closer to the main board, the effects are present nonetheless.
- According to the embodiment of this invention, the structure formed by attaching the aforementioned circuit sub-board to the circuit board structure is achieved by piercing a plurality of guiding legs through the first power-source holes and the second power-source holes as well as the first ground-connection holes and the second ground-connection holes. The computer system further includes a chipset and a memory module slot. The circuit sub-board is in such a shape that most of the signaling lines between the chipset and the memory module slot are covered. Because the fourth signaling layer is electrically connected with and close to the circuit sub-board, this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
- FIG. 1 is a sketch of the power-source layer on a circuit sub-board for regulating constant power source and strengthening ground connections according to one preferred embodiment of this invention;
- FIG. 2 is a sketch of the ground-connection layer on the circuit sub-board shown in FIG. 1;
- FIG. 3 is a sketch showing locations of components on the first layer of a main board that are used together with the circuit sub-board of this invention;
- FIG. 4 is a sketch showing locations of components on the fourth layer of the main board shown in FIG. 3;
- FIG. 5 is a sketch showing a portion of the layout design for the main board components shown in FIG. 3; and
- FIG. 6 is a sketch showing a portion of the layout design at the backside of the main board shown in FIG. 3.
- Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
- FIGS. 1 through 6 are diagrams according to the invention showing circuit sub-board structures, associated main board structures and their corresponding layouts for regulating constant power source and strengthening ground connections. As shown in FIGS. 1 through 6, the circuit sub-board46 for regulating constant power source and strengthening ground connections can be applied to a computer system. The computer system includes a
main board 52. Themain board 52 further includes first power-source holes 10, 12, 14, 16, 18, first ground-connection holes 30, 32, 34, 36, a first power-source layer and a first ground-connection layer. Thecircuit sub-board 46 includes a printed circuit board. The printed circuit board includes a second power-source layer 48 and a second ground-connection layer 50. The second power-source layer 48 has second power-source holes 20, 22, 24, 26 and 28. The second ground-connection layer has second ground-connection holes 38, 40, 42 and 44. The printedcircuit board 46 can be a double-layered circuit board, for example. The printedcircuit board 46 serves to stabilize voltage and strengthen ground connections. The second power-source layer 48 is electrically connected to the first power-source holes (10, 12, 14, 16 and 18) via the second power-source holes (20, 22, 24, 26 and 28). Hence, the first power-source layer of themain board 52 is connected. The second ground-connection holes 38, 40, 42 and 44 are above the printedcircuit board 46. The second ground-connection layer 50 is electrically connected to the first ground-connection holes (30, 32, 34 and 36) via the second ground-connection holes (38, 40, 42 and 44). Hence, the first ground-connection layer of the main board is connected. Portions of themain board 52 that corresponds to various electrical devices on thecircuit sub-board 46 are excavated to prevent any electrical connection. Alternatively, instead of excavating themain board 52, an insulating material such as insulating paint may be painted over the electrical devices on themain board 52. The paint serves as electrical isolation for thecircuit sub-board 46 so that thecircuit sub-board 46 can actually attach to themain board 52. The second ground connection layer is closer to themain board 52 than the second power source layer. However, even if the secondpower source layer 48 of thecircuit sub-board 46 is closer to themain board 52, power source stabilizing and ground connection strengthening effects are still present, although not as good as when the secondground connection layer 50 is closer to themain board 52. - According to the embodiment of this invention, the structure formed by attaching the
aforementioned circuit sub-board 46 to themain board 52 is achieved by piercing a plurality of guiding legs through the first power-source holes 10, 12, 14, 16, 18 and the second power-source holes 20, 22, 24, 26, 28 as well as piercing through the first ground-connection holes 30, 32, 34, 36 and the second ground-connection holes 38, 40, 42, 44. These guiding legs not only serve as a medium of connection and piercing, but also serve as a tool for securing thecircuit sub-board 46. The computer system further includes achipset 70 andmemory module slots circuit sub-board 46 has such a shape that most of the signaling lines between thechipset 70 and thememory module slots labels 54 and 56 in the FIGS. 4 and 5. Because the fourth signaling layer is electrically connected with and close to thecircuit sub-board 46, this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference. - This invention also provides a circuit board structure for regulating constant power source and strengthening ground connections that can be applied to a computer system. The circuit board structure includes a
main board 52. Themain board 52 further includes a first printed circuit board, a first power-source layer, a first ground-connection layer, first power-source holes 10, 12, 14, 16, 18 and first ground-connection holes 30, 32, 34, 36. The first power-source holes 10, 12, 14, 16, 18 are electrically connected to the first power-source layer. The first ground-connection holes 30, 32, 34, 36 are electrically connected to the first ground-connection layer. The circuit board structure also includes acircuit sub-board 46. Thecircuit sub-board 46 serves to stabilize voltage. Thecircuit sub-board 46 can be a double-layered circuit board, for example. Thecircuit sub-board 46 is a second printed circuit having a second power-source layer 48 and a second ground-connection layer 50. The second power-source layer 48 has second power-source holes 20, 22, 24, 26 and 28. The second ground-connection layer 50 has second ground-connection holes 38, 40, 42, 44 above the second printed circuit board. The second power-source layer 48 is electrically connected to the first power-source holes (10, 12, 14, 16 and 18) via the second power-source holes (20, 22, 24, 26 and 28) above the second printed circuit board. The second ground-connection layer 50 is electrically connected to the first ground-connection holes (30, 32, 34 and 36) via the second ground-connection holes (38, 40, 42 and 44). Portions of themain board 52 that corresponds to various electrical devices on thecircuit sub-board 46 are excavated to prevent any electrical connection. Alternatively, instead of excavating themain board 52, an insulating material such as insulating paint may be painted over the electrical devices on themain board 52. The paint serves as electrical isolation for thecircuit sub-board 46 so that thecircuit sub-board 46 can actually attach to themain board 52. The secondground connection layer 50 is closer to themain board 52 than the second power source layer. However, even if the second power-source layer 48 of thecircuit sub-board 46 is closer to themain board 52, power source stabilizing and ground connection strengthening effects are still present, although not as good as when the secondground connection layer 50 is closer to themain board 52. - According to the embodiment of this invention, the structure formed by attaching the
aforementioned circuit sub-board 46 to themain board 52 is achieved by piercing a plurality of guiding legs through the first power-source holes 10, 12, 14, 16, 18 and the second power-source holes 20, 22, 24, 26, 28 as well as piercing through the first ground-connection holes 30, 32, 34, 36 and the second ground-connection holes 38, 40, 42, 44. These guiding legs not only serve as a medium of connection and piercing, but also serve as a tool for securing thecircuit sub-board 46. The computer system further includes achipset 70 andmemory module slots circuit sub-board 46 has such a shape that most of the signaling lines between thechipset 70 and thememory module slots circuit sub-board 46, this is equivalent to increasing the surface area of the ground connections and power source. Hence, the signaling lines are in a stable environment shielded from external electromagnetic interference. - It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (12)
1. A circuit sub-board used in a computer system for regulating constant power source and strengthening ground connections, wherein the computer system includes a main board, and said main board further includes a first power-source hole, a first ground-connection hole, a first power-source layer and a first ground-connection layer, the circuit sub-board comprising:
a printed circuit board including a second power-source layer and a second ground-connection layer, wherein said printed circuit board serves to regulate constant voltage;
a plurality of second power-source holes on said printed circuit board, wherein said second power-source layer is electrically connected to said first power-source holes via said second power-source holes and hence connected to said first power-source layer of said main board; and
a plurality second ground-connection holes on said printed circuit board, wherein said second ground-connection layer is electrically connected to said first ground-connection holes via said second ground-connection holes and hence connected to said first ground-connection layer of said main board;
wherein said circuit sub-board is attached to the main board.
2. The circuit sub-board of claim 1 , wherein said structure after attaching said circuit sub-board to said main board is formed by using a plurality of guiding legs that pierce through said first power-source holes, said second power-source holes, said first ground-connection holes and said second ground-connection holes.
3. The circuit sub-board of claim 1 , wherein said computer system can operate over 133 MHz frequency range at a bus speed.
4. The circuit sub-board of claim 1 , wherein said computer system further includes a chipset and memory module slots, and said circuit sub-boardmantles most of said signaling lines between said chipset and said memory module slots.
5. The circuit sub-board of claim 1 , wherein said printed circuit board further includes a double-layered circuit board.
6. The circuit sub-board of claim 1 , wherein said second ground-connection layer is closer to said main board than said second power-source layer.
7. A circuit board structure, comprising:
a main board, including:
a first printed circuit board having a first power-source layer and a first ground-connection layer;
a plurality of power-source holes on said first printed circuit board electrically connected to said first power-source layer; and
a plurality of first ground-connection holes on said first printed circuit board electrically connected to said first ground-connection layer; and
a circuit sub-board, including:
a second printed circuit board having a second power-source layer and a second ground-connection layer;
a plurality of second power-source holes on said second printed circuit board, wherein said second power-source layer is electrically connected to said first power-source holes via said second power-source holes; and
a plurality of ground-connection holes on said second printed circuit board, wherein said second ground-connection layer is electrically connected to said first ground-connection holes via said second ground-connection holes, wherein said circuit sub-board is attached to the main board.
8. The structure of claim 7 , wherein said circuit sub-board attached to said main board is formed by using a plurality of guiding legs that pierce through said first power-source holes, said second power-source holes, said first ground-connection holes and said second ground-connection holes.
9. The circuit board structure of claim 7 , wherein said computer system can operate over 133 MHz frequency range at a bus speed.
10. The circuit board structure of claim 7 , wherein said computer system further includes a chipset and memory module slots, and said circuit sub-board has a shape that covers most of said signaling lines between said chipset and said memory module slots.
11. The circuit board structure of claim 7 , wherein said printed circuit board includes a double-layered circuit board.
12. The circuit board structure of claim 7 , wherein said second ground-connection layer is closer to said main board than said second power-source layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89123792 | 2000-11-10 | ||
TW089123792A TW483293B (en) | 2000-11-10 | 2000-11-10 | Circuit daughter board and circuit board structure for stabilizing power source and strengthening grounding |
Publications (2)
Publication Number | Publication Date |
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US20020057559A1 true US20020057559A1 (en) | 2002-05-16 |
US6459045B1 US6459045B1 (en) | 2002-10-01 |
Family
ID=21661900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/924,880 Expired - Lifetime US6459045B1 (en) | 2000-11-10 | 2001-08-08 | PCB structure for regulating constant power source and strengthening ground connections |
Country Status (2)
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US (1) | US6459045B1 (en) |
TW (1) | TW483293B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI245378B (en) * | 2003-11-05 | 2005-12-11 | Advanced Semiconductor Eng | Substrate for use in forming electronic package |
CN100490604C (en) * | 2005-11-04 | 2009-05-20 | 鸿富锦精密工业(深圳)有限公司 | Printing circuit board |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
US4799128A (en) * | 1985-12-20 | 1989-01-17 | Ncr Corporation | Multilayer printed circuit board with domain partitioning |
US5191174A (en) * | 1990-08-01 | 1993-03-02 | International Business Machines Corporation | High density circuit board and method of making same |
US5410107A (en) * | 1993-03-01 | 1995-04-25 | The Board Of Trustees Of The University Of Arkansas | Multichip module |
US5841686A (en) * | 1996-11-22 | 1998-11-24 | Ma Laboratories, Inc. | Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate |
JP3206561B2 (en) * | 1998-10-01 | 2001-09-10 | 日本電気株式会社 | Multilayer wiring board |
-
2000
- 2000-11-10 TW TW089123792A patent/TW483293B/en not_active IP Right Cessation
-
2001
- 2001-08-08 US US09/924,880 patent/US6459045B1/en not_active Expired - Lifetime
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TW483293B (en) | 2002-04-11 |
US6459045B1 (en) | 2002-10-01 |
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