US20020030935A1 - Bonding pad of suspension circuit - Google Patents
Bonding pad of suspension circuit Download PDFInfo
- Publication number
- US20020030935A1 US20020030935A1 US09/741,684 US74168400A US2002030935A1 US 20020030935 A1 US20020030935 A1 US 20020030935A1 US 74168400 A US74168400 A US 74168400A US 2002030935 A1 US2002030935 A1 US 2002030935A1
- Authority
- US
- United States
- Prior art keywords
- bonding
- pad
- suspension
- substance
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49025—Making disc drive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Definitions
- the present invention generally relates to a circuit bonding pad for a magnetic recording head of a disk drive, and more specifically, to a circuit and suspension assembly for a disk drive magnetic head assembly.
- a head assembly has a constitution in which a head slider having a head element is supported by a slider suspension (hereinafter referred to as a suspension). While the head slider is levitated through the suspension at a fixed distance from a surface of a magnetic recording medium, information is reproduced from or recorded on the recording medium such as a magnetic disk.
- a suspension a slider suspension
- the above-described methods achieve their advantages by electrically connecting the head slider to the suspension.
- the method in which the head slider is connected to the ball bonding by using the soldering contact pad has a problem that the suspension is deformed when more pressure than specified is applied to the pad in a ball bonding process. This deformation has as influence on the levitation property of the head slider and thus causes a disadvantageous reduction in a yield.
- the method in which the conductive resin is applied requires an additional process of applying the conductive resin as well as a process of bonding the head slider to the suspension. This additional process increases a lead time.
- the head assembly is manufactured through many processes as described above and therefore the head element may be damaged by static electricity at the time of handling.
- Another object of the present invention is to provide a disk drive for a computer.
- a further object of the present invention is to provide an assembly method for the bonding pad.
- a bonding pad for electrically bonding a magnetic head terminal comprises a metal pad and a bonding substance as a surface finishing material.
- a disk drive comprises the bonding pad.
- an assembly method for the bonding pad for electrically bonding a magnetic head terminal comprises following steps:
- the new type of bonding pad in accordance with the present invention enables the reuse of the suspension and circuit by removing the connection between the slider and bonding pad with heat treatment.
- FIG. 1 is a example of a magnetic recording head and suspension circuit
- FIG. 2B is a sectional view of the bonding pad of suspension circuit shown in FIG. 2A.
- FIG. 1 is a example of a magnetic recording head and suspension circuit
- FIG. 3 is a flow chart showing an assembly method of the present invention, firstly, a metal pad is provided on a suspension, and then a bonding substance is applied onto the metal pad of the suspension circuit by means of a solder plating or solder paste printing process.
- connection is completed between the suspension and the slider pad.
Landscapes
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Magnetic Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
A new type of suspension circuit electrical bonding pad is described for electrically and mechanically connecting process for the magnetic recording head. The new type of bonding pad will serve as the joint material as well as the joint interface. Thus there is no need to apply the conductive material in between the bonding pads and magnetic recording head terminals, consequently reducing the process leading time and simplifying the magnetic recording head assemble process.
Description
- The present invention generally relates to a circuit bonding pad for a magnetic recording head of a disk drive, and more specifically, to a circuit and suspension assembly for a disk drive magnetic head assembly.
- Generally, a head assembly has a constitution in which a head slider having a head element is supported by a slider suspension (hereinafter referred to as a suspension). While the head slider is levitated through the suspension at a fixed distance from a surface of a magnetic recording medium, information is reproduced from or recorded on the recording medium such as a magnetic disk.
- The disclosures summarized below seem to be relevant to the present invention: Japanese Non-examined Patent Publication No. Sho 63-226999 discloses a flexible shield wire board with a configuration in which an anisotropic conductive sheet is welded onto an insulating substrate having an electrode terminal so that the sheet is electrically connected to the terminal on the insulating substrate side. Japanese Non-examined Patent Publication No. Hei 9-115125 teaches a method in which the head is bonded to the suspension by use of an anisotropic conductive film (sheet).
- Moreover, Japanese Non-examined Patent Publication No. Hei 9-282824 of common assignment, which also seems to be relevant to the present invention, proposes a head slider suspension mechanism having a partition pattern for avoiding the contact of plural types of adhesives used for bonding the head slider to the suspension.
- The above-described methods achieve their advantages by electrically connecting the head slider to the suspension. However, the method in which the head slider is connected to the ball bonding by using the soldering contact pad has a problem that the suspension is deformed when more pressure than specified is applied to the pad in a ball bonding process. This deformation has as influence on the levitation property of the head slider and thus causes a disadvantageous reduction in a yield. The method in which the conductive resin is applied requires an additional process of applying the conductive resin as well as a process of bonding the head slider to the suspension. This additional process increases a lead time. Moreover, the head assembly is manufactured through many processes as described above and therefore the head element may be damaged by static electricity at the time of handling.
- The present invention is developed to overcome the above problems.
- One object of the present invention is to provide a new type of bonding pad.
- Another object of the present invention is to provide a disk drive for a computer.
- A further object of the present invention is to provide an assembly method for the bonding pad.
- In one aspect of the present invention, a bonding pad for electrically bonding a magnetic head terminal comprises a metal pad and a bonding substance as a surface finishing material.
- In another aspect of the present invention, a disk drive comprises the bonding pad.
- In a further aspect of the present invention, an assembly method for the bonding pad for electrically bonding a magnetic head terminal comprises following steps:
- providing a metal pad on an incoming suspension;
- planting solder onto said metal pad of said suspension;
- potting a slider on said suspension; and
- making a heat treatment for said suspension so that said solder on said metal pad adheres to a metal pad of said slider, and becomes a solid state.
- The new type of bonding pad in accordance with the present invention enables the rapid connection by simple heat treatment.
- Furthermore, the new type of bonding pad in accordance with the present invention enables the reuse of the suspension and circuit by removing the connection between the slider and bonding pad with heat treatment.
- Other and further objects, features and advantages of the invention will appear more fully in the following description.
- FIG. 1 is a example of a magnetic recording head and suspension circuit,
- FIG. 2A is a top view of a bonding pad for a suspension circuit in accordance with an embodiment of the present invention,
- FIG. 2B is a sectional view of the bonding pad of suspension circuit shown in FIG. 2A, and
- FIG. 3 is a flow chart showing an assembly method of an embodiment of the present invention.
- Preferred embodiments of the present invention now will be described with reference to the accompanying drawings.
- FIG. 1 is a example of a magnetic recording head and suspension circuit,
- FIG. 2A is a top view of the bonding pad of the suspension circuit. As shown in the figure, a suspension is provided on its one end with several bonding bumps for bonding the suspension and its slider connection circuit. The bonding bumps include a conductive metal and a surface finish material, and the surface finish material comprises a material such as solder, conductive polymer, adhesive and film.
- FIG. 2B is a sectional view of the bonding pad shown in FIG. 2A. As shown in FIGS. 2A and 2B, the solder bump is cylinder and hemisphere-shaped, and has a height around 50-300 μm and a diameter less than 180 μm.
- Refer to FIG. 3, which is a flow chart showing an assembly method of the present invention, firstly, a metal pad is provided on a suspension, and then a bonding substance is applied onto the metal pad of the suspension circuit by means of a solder plating or solder paste printing process.
- Next, heat treatment is applied to the bonding substance so that it forms a sphere or another desired shape.
- Finally, during the heat treatment, connection is completed between the suspension and the slider pad.
- While the present invention has been described by way of the preferred embodiments, the foregoing described is in all aspects illustrative, not restrictive. It is obvious to a person skilled in this art that numerous variations and modifications can be devised from the foregoing description without departure from the scope of the invention.
Claims (18)
1. A bonding pad for electrically bonding a magnetic head terminal comprising a metal pad having a bonding substance as a surface finishing material.
2. A bonding pad for electrically bonding a magnetic head terminal as set forth in claim 1 , wherein said bonding substance is solder.
3. A bonding pad for electrically bonding a magnetic head terminal as set forth in claim 1 , wherein said bonding substance is a conductive polymer.
4. A bonding pad for electrically bonding a magnetic head terminal as set forth in claim 1 , wherein said bonding substance is an adhesive.
5. A bonding pad for electrically bonding a magnetic head terminal as set forth in claim 1 , wherein said bonding substance is a film.
6. A bonding pad for electrically bonding a magnetic head terminal as set forth in claim 1 , wherein the solder bump height is approximately 50-300 μm, and the solder bump diameter is less than 180 μm.
7. A disk drive comprising:
a bonding pad for electrically bonding a magnetic head terminal, wherein said bonding pad includes a metal pad having a bonding substance as a surface finishing material.
8. The disk drive as claimed in claim 7 , wherein said bonding substance is solder.
9. The disk drive as claimed in claim 7 , wherein said bonding substance is a conductive polymer.
10. The disk drive as claimed in claim 7 , wherein said bonding substance is an adhesive.
11. The disk drive as claimed in claim 7 , wherein said bonding substance is a film.
12. The disk drive as claimed in claim 7 , wherein the solder bump height is approximately 50-300 μm, and the solder bump diameter is less than 180 μm.
13. An assemble method for a bonding pad for electrically bonding a magnetic head terminal comprising:
providing a metal pad on an incoming suspension;
planting solder onto said metal pad of said suspension;
potting a slider on said suspension; and
making a heat treatment for said suspension so that said solder on said metal pad adheres to a metal pad of said slider, and becomes a solid state.
14. The method as claimed in claim 13 , wherein said bonding substance is solder.
15. The method as claimed in claim 13 , wherein said bonding substance is a conductive polymer.
16. The method as claimed in claim 13 , wherein said bonding substance is an adhesive.
17. The method as claimed in claim 13 , wherein said bonding substance is a film.
18. The method as claimed in claim 13 , wherein the solder bump height is approximately 50-300 μm, and the solder bump diameter is less than 180 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/294,108 US6874677B2 (en) | 2000-08-09 | 2002-11-13 | Bonding pad of suspension circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNPCT/CN00/00227 | 2000-08-09 | ||
PCT/CN2000/000227 WO2002013189A1 (en) | 2000-08-09 | 2000-08-09 | Bonding pad of suspension circuit |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/294,108 Division US6874677B2 (en) | 2000-08-09 | 2002-11-13 | Bonding pad of suspension circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
US20020030935A1 true US20020030935A1 (en) | 2002-03-14 |
Family
ID=4574679
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/741,684 Abandoned US20020030935A1 (en) | 2000-08-09 | 2000-12-18 | Bonding pad of suspension circuit |
US10/294,108 Expired - Fee Related US6874677B2 (en) | 2000-08-09 | 2002-11-13 | Bonding pad of suspension circuit |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/294,108 Expired - Fee Related US6874677B2 (en) | 2000-08-09 | 2002-11-13 | Bonding pad of suspension circuit |
Country Status (3)
Country | Link |
---|---|
US (2) | US20020030935A1 (en) |
CN (1) | CN1188840C (en) |
WO (1) | WO2002013189A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100359567C (en) * | 2002-11-19 | 2008-01-02 | 新科实业有限公司 | Method and apparatus for connecting a micro-actuator to driver arm sustension |
TWI551201B (en) * | 2015-11-27 | 2016-09-21 | 達方電子股份有限公司 | Light source device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5249092A (en) * | 1989-10-27 | 1993-09-28 | International Business Machines Corporation | Head lead termination |
US5645735A (en) * | 1994-04-15 | 1997-07-08 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
US6078472A (en) * | 1997-11-19 | 2000-06-20 | Fujitsu Limited | Suspension for head assembly |
US6318624B1 (en) * | 1996-07-11 | 2001-11-20 | International Business Machines Corporation | Solder balltape and method for making electrical connection between a head transducer and an electrical lead |
US6396665B1 (en) * | 1997-12-25 | 2002-05-28 | Kabushiki Kaisha Toshiba | Head suspension assembly with a relay printed circuit board having openings through which electrodes protude |
US6404706B1 (en) * | 1999-02-12 | 2002-06-11 | Read-Rite Corporation | Laser mounting for a thermally assisted GMR head |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4761699A (en) * | 1986-10-28 | 1988-08-02 | International Business Machines Corporation | Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file |
JPS63226999A (en) | 1987-03-16 | 1988-09-21 | 松下電器産業株式会社 | Flexible shielded wiring board |
US5530604A (en) * | 1994-05-19 | 1996-06-25 | International Business Machines Corporation | Electrical connection and slider-suspension assembly having an improved electrical connection |
US6313972B1 (en) * | 1995-05-22 | 2001-11-06 | Maxtor Corporation | Flex circuit flexure with integral high compliance gimbal |
JPH09115125A (en) | 1995-10-20 | 1997-05-02 | Hitachi Ltd | Supporting body for magnetic head |
WO1997031369A1 (en) * | 1996-02-26 | 1997-08-28 | Quantum Corporation | Method of attaching and electrically interconnecting a read/write head to a flexure |
US5680275A (en) * | 1996-03-19 | 1997-10-21 | International Business Machines Corporation | Adjustable solder bump spacer for slider-suspension attachment |
JP3296187B2 (en) | 1996-04-15 | 2002-06-24 | ティーディーケイ株式会社 | Magnetic head slider support mechanism and head gimbal assembly using the support mechanism |
JPH09326103A (en) * | 1996-06-05 | 1997-12-16 | Yamaha Corp | Pad of thin-film magnetic head |
US5821494A (en) * | 1996-09-27 | 1998-10-13 | International Business Machines Corporation | Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow |
US5949618A (en) * | 1997-10-14 | 1999-09-07 | International Business Machines Corporation | Solder bump electrical connection and method for fabrication |
JPH11185231A (en) * | 1997-12-24 | 1999-07-09 | Tdk Corp | Magnetic head device |
JP2001043647A (en) * | 1999-07-15 | 2001-02-16 | Internatl Business Mach Corp <Ibm> | Hard disk drive, slider holding structure, head gimbals assembly and its manufacture |
-
2000
- 2000-08-09 WO PCT/CN2000/000227 patent/WO2002013189A1/en active Application Filing
- 2000-08-09 CN CNB008140308A patent/CN1188840C/en not_active Expired - Fee Related
- 2000-12-18 US US09/741,684 patent/US20020030935A1/en not_active Abandoned
-
2002
- 2002-11-13 US US10/294,108 patent/US6874677B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5249092A (en) * | 1989-10-27 | 1993-09-28 | International Business Machines Corporation | Head lead termination |
US5645735A (en) * | 1994-04-15 | 1997-07-08 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
US6318624B1 (en) * | 1996-07-11 | 2001-11-20 | International Business Machines Corporation | Solder balltape and method for making electrical connection between a head transducer and an electrical lead |
US6078472A (en) * | 1997-11-19 | 2000-06-20 | Fujitsu Limited | Suspension for head assembly |
US6396665B1 (en) * | 1997-12-25 | 2002-05-28 | Kabushiki Kaisha Toshiba | Head suspension assembly with a relay printed circuit board having openings through which electrodes protude |
US6404706B1 (en) * | 1999-02-12 | 2002-06-11 | Read-Rite Corporation | Laser mounting for a thermally assisted GMR head |
Also Published As
Publication number | Publication date |
---|---|
WO2002013189A8 (en) | 2002-03-14 |
CN1188840C (en) | 2005-02-09 |
WO2002013189A1 (en) | 2002-02-14 |
US20030058577A1 (en) | 2003-03-27 |
CN1378685A (en) | 2002-11-06 |
US6874677B2 (en) | 2005-04-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5781380A (en) | Swing-type actuator assembly having internal conductors | |
US5821494A (en) | Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow | |
US6449838B2 (en) | Method of mounting a semiconductor device to a substrate | |
KR100398858B1 (en) | Semiconductor module and method of manufacturing thereof | |
EP0683491A3 (en) | Transducer head solder connection | |
KR0172203B1 (en) | Semiconductor package and its manufacturing method | |
US6420787B1 (en) | Semiconductor device and process of producing same | |
US6944936B2 (en) | Method for manufacturing an integrated lead suspension | |
JP2000332055A (en) | Flip-chip mounting structure and mounting method | |
KR20010005659A (en) | Method for making a contactless card with antenna connected with soldered wires | |
JPH1187425A (en) | Semiconductor bare chip, manufacture thereof and mounting structure therefor | |
US6874677B2 (en) | Bonding pad of suspension circuit | |
JP2647047B2 (en) | Flip chip mounting method for semiconductor element and adhesive used in this mounting method | |
US20020153608A1 (en) | Land grid array semiconductor device and method of mounting land grid array semiconductor devices | |
JP2581592B2 (en) | Flexible pin carrier and semiconductor device using the same | |
JP3319269B2 (en) | Electronic component joining method | |
JP2002050017A (en) | Magnetic head device, and method and device for manufacturing the same | |
JPH07226455A (en) | Semiconductor package and its manufacturing method | |
JPH05267394A (en) | Mounting of semiconductor element | |
JP2921179B2 (en) | Flip chip mounting method | |
JPH085577Y2 (en) | Magnetic head | |
EP0347997A2 (en) | Method of producing a magnetic head as well as a magnetic head producted in accordance with the method | |
JP3265316B2 (en) | Semiconductor device and manufacturing method thereof | |
JP3067364B2 (en) | Semiconductor device with metal bump electrode | |
JP3220102B2 (en) | Magnetic head device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SAE MAGNETICS (H.K.) LTD., HONG KONG Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WONG, XM;TAO, ROCK;REEL/FRAME:011915/0933 Effective date: 20010103 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION |