US20020028338A1 - Method and an apparatus for forming an under bump metallization structure - Google Patents
Method and an apparatus for forming an under bump metallization structure Download PDFInfo
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- US20020028338A1 US20020028338A1 US09/929,408 US92940801A US2002028338A1 US 20020028338 A1 US20020028338 A1 US 20020028338A1 US 92940801 A US92940801 A US 92940801A US 2002028338 A1 US2002028338 A1 US 2002028338A1
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Definitions
- One method of coupling bonding pads of an integrated circuit chip to a package is by forming a metal bump (e.g., tin-lead (Sn-Pb) solder bump) on each pad and soldering the substrate to a package.
- a metal bump e.g., tin-lead (Sn-Pb) solder bump
- IBM calls its version of this technology controlled collapse chip connection (C4).
- Improvements in the area of bump metallization include incorporating an under bump metallization (UBM) layer onto a chip.
- UBM under bump metallization
- a UBM layer acts as a barrier preventing elements from diffusing between a pad on a substrate and the bump that connects a bump chip and its packaging substrate. Additionally, a UBM layer improves adhesion between the bump and the pad on a substrate. Moreover, a UBM layer may act as a wetting layer that ensures improved chip joint properties between a solder-based bump and the UBM layer.
- UBM layer comprising a two layer structure A/B-C, wherein A is, for example, a non-refractory metal such as gold or nickel and B-C is a binary metal alloy such as titanium/tungsten (Ti/W), or a three layer structure A/B/C wherein A is a nonrefractory metal and B and C are refractory metals.
- A is, for example, a non-refractory metal such as gold or nickel and B-C is a binary metal alloy such as titanium/tungsten (Ti/W), or a three layer structure A/B/C wherein A is a nonrefractory metal and B and C are refractory metals.
- Refractory metals and their nitrides such as titanium (Ti) and titanium nitride (TiN) are widely used as adhesion promoter and diffusion barrier layers in UBM.
- a refractory metal nitride layer such as TiN can be formed by depositing TiN via physical sputtering or chemical vapor deposition or annealing refractory metal in an N 2 or NH 3 ambient at temperatures up to 700° C.
- high temperature back-end processing can lead to serious reliability related failure, especially in a chip using copper-based interconnects.
- EM electromigration
- a method including forming a refractory layer over a pad coupled to a substrate and annealing the refractory layer in ambient hydrogen.
- FIG. 1A shows a cross-sectional side view of a pad and a passivation layer on a substrate.
- FIG. 1B shows a cross-sectional side view of the device shown in FIG. 1A with an under bump metallization layer deposited onto the pad.
- Figure 1C shows a cross-sectional side view of the device shown in Figure 1B undergoing rapid thermal processing in ambient hydrogen.
- FIG. 2 shows another embodiment of the invention wherein a refractory hydride layer is formed next to the bump.
- FIG. 3 shows another embodiment of the invention wherein a refractory layer is formed between the bump and the pad.
- FIG. 4 a shows another embodiment of the invention wherein multiple layers of refractory and non-refractory material are formed between the pad and the bump.
- FIG. 4 b shows the structure of FIG. 4 a after thermal processing to form a refractory hydride layer.
- FIG. 5 is a flow chart that illustrates a process for forming a refractory hydride layer using a rapid thermal processing chamber.
- UBM material comprised of refractory metals selected from the group comprising halfnium (Hf), niobium (Nb), titanium (Ti), vanadium (V), zirconium (Zr), or any combination thereof deposited onto a pad that is formed over a substrate.
- the UBM may have a thickness that ranges from approximately 1000 ⁇ to 5000 ⁇ .
- These metals may be combined with a variety of other components to ensure physical and chemical stability such as copper (Cu) and nickel (Ni) to form a copper-nickel-titanium (Cu/Ni/Ti) layered structure.
- FIGS. 1 A through IC show one embodiment of forming a refractory hydride layer according to the invention.
- FIG. 1A shows substrate 40 with pad 45 and passivation layer 50 .
- pad 45 comprises aluminum (Al) but other materials such as copper may be used.
- Pad 45 is patterned over substrate 40 (e.g., semiconductor substrate) according to a variety of methods that are known in the art.
- Passivation layer 50 is, for example, silicon dioxide (SiO 2 ), or polyimide, but other like materials may be used.
- FIG. 1B shows UBM 55 conformally deposited over pad 45 and passivation layer 50 .
- UBM 55 deposition may occur through a variety of methods such as physical vapor deposition (e.g.
- UBM 55 is comprised of a metal or metal alloy containing at least one refractory metal. Additionally, UBM may comprise a single refractory metal or metal alloy layer or multiple layers.
- FIG. 1C shows substrate 40 undergoing annealing in ambient hydrogen.
- Annealing may be performed in devices that are capable of rapid and uniform heating such as a rapid thermal processor.
- the temperature may range from approximately 300° C. to approximately 500° C.
- One suitable temperature range for the hydrogen annealing is 350° C. to 450° C.
- Annealing in hydrogen forms refractory hydride layer 60 of a portion of the material of UBM 55 .
- Refractory hydride layer 60 may range in thickness from approximately 100 ⁇ to approximately 500 ⁇ .
- a bump such as a Sn-Pb solder bump, may be formed over refractory hydride layer 60 to pad 45 according to processes known in the art.
- a binary layer is comprised of alloys wherein A is a nonrefractory metal such as gold or nickel and B is a refractory metal such as those mentioned herein ranging from 1 to 10 weight percent (wt%).
- a bilayer structure A/B is formed where A (non-refractory metal) is on the pad side and B (refractory metal) is on the bump side.
- a bilayer structure B/A is formed where B is on the pad side.
- a three element structure A-B/C is formed that contains two different kinds of refractory metals B and C such as niobium (Nb), titanium (Ti), tantalum (Ta), vanadium (V), or zirconium (Zr).
- a UBM structure containing a refractory metal layer according to this embodiment has a thickness approximately in the range of 1000 ⁇ to approximately 5000 ⁇ .
- A is a nonrefractory metal with a thickness approximately in the range of 500 ⁇ to 2000 ⁇ .
- a refractory hydride structure may be formed by annealing the binary layer, bilayer, or multi-layer, respectively, in ambient H 2 .
- FIG. 2 shows an embodiment of the invention wherein a cross-section of substrate 70 having pad 75 , passivation layer 80 , UBM 90 comprising a bilayer of a non-refractory metal layer 92 such as nickel (Ni) or copper (Cu) formed over refractory metal layer 85 .
- the thickness of layer 92 is in the range of 500 ⁇ -1000 ⁇ .
- this structure is subjected to thermal processing in a rapid thermal processor with ambient hydrogen (H 2 ).
- a suitable temperature range for the thermal processing is approximately 350° C. to approximately 550° C. Additionally, a suitable time period of this process ranges from approximately one minute to five minutes.
- Refractory metal layer 85 After rapid thermal processing, a portion of refractory metal layer 85 is converted to a refractory hydride layer.
- Refractory hydride layer 85 is essentially formed in a self-aligning process without changing or adding any new materials.
- Refractory hydride layer 85 has a thickness that preferably ranges from approximately 100 ⁇ to 550 ⁇ and is uniformly controlled by the UBM thickness and the rapid thermal process. Bump 95 is formed over UBM 90 .
- FIG. 3 shows substrate 100 with pad 110 and passivation layer 120 .
- UBM layer 130 comprises a refractory metal in a binary alloy (A 1 ⁇ x B x ) form.
- A is a non-refractory metal.
- B is a refractory metal.
- X is in a range of 0.05 to 0.5.
- H 2 ambient temperature ranging from 350° C. to 550° C.
- Bump 140 is formed over UBM layer 130 .
- FIG. 4 a shows another embodiment of the method of the invention wherein the substrate 200 includes UBM layer 235 of non-refractory metal layer 250 and metal layer 230 that is a binary alloy of a non-refractory metal and a refractory metal.
- the structure is subjected to thermal processing in ambient H 2 to form a refractory hydride.
- FIG. 4 b shows the structure of FIG. 4 a after thermal processing comprising non-refractory metal layer 250 , refractory hydride layer 240 , and non-refractory metal layer 245 .
- a tri-layer structure is formed with a portion of the binary alloy forming the refractory hydride layer. This structure may be thought of as a combination of two previous structures mentioned in FIG. 2 and FIG. 3.
- FIG. 5 is a flow chart of an embodiment of a method of the invention.
- a metal pad is patterned on a substrate using methods known in the art.
- refractory metals are deposited over the pad and a passivation layer previously patterned on the substrate.
- a variety of methods may be used to deposit the layer of refractory metals on the pad and passivation layer. For example, physical vapor deposition (e.g. sputtering) or electron beam co-evaporation techniques may be used.
- the substrate of operation 300 is inserted into the rapid thermal processor. Rapid thermal processing occurs in ambient hydrogen at operation 320 . In this process, an optimal temperature range of approximately 350° C. through 550° C.
- a refractory hydride layer is formed. However, it should be noted that multiple refractory hydride layers may be formed using the same operating conditions provided above for forming a single refractory hydride layer.
- bump plating of the UBM may occur either before or after patterning of the UBM.
Abstract
Methods and apparatuses are disclosed in which a refractory layer is formed during rapid thermal processing wherein ambient hydrogen is used in the thermal processing chamber. Rapid thermal processing may occur at a temperature approximately in the range of 350° C. to approximately 550° C.
Description
- One method of coupling bonding pads of an integrated circuit chip to a package is by forming a metal bump (e.g., tin-lead (Sn-Pb) solder bump) on each pad and soldering the substrate to a package. IBM calls its version of this technology controlled collapse chip connection (C4).
- Improvements in the area of bump metallization include incorporating an under bump metallization (UBM) layer onto a chip. A UBM layer acts as a barrier preventing elements from diffusing between a pad on a substrate and the bump that connects a bump chip and its packaging substrate. Additionally, a UBM layer improves adhesion between the bump and the pad on a substrate. Moreover, a UBM layer may act as a wetting layer that ensures improved chip joint properties between a solder-based bump and the UBM layer. These advantages apply to a UBM layer comprising a two layer structure A/B-C, wherein A is, for example, a non-refractory metal such as gold or nickel and B-C is a binary metal alloy such as titanium/tungsten (Ti/W), or a three layer structure A/B/C wherein A is a nonrefractory metal and B and C are refractory metals.
- Refractory metals and their nitrides, such as titanium (Ti) and titanium nitride (TiN) are widely used as adhesion promoter and diffusion barrier layers in UBM. A refractory metal nitride layer such as TiN can be formed by depositing TiN via physical sputtering or chemical vapor deposition or annealing refractory metal in an N2 or NH3 ambient at temperatures up to 700° C. However, high temperature back-end processing can lead to serious reliability related failure, especially in a chip using copper-based interconnects.
- Several other disadvantages exist with processes known in the art. One problem is that interdiffusion of elements occurs between a bump and a pad when a packaged chip operates at a higher temperature. This causes the UBM layer to react with tin (Sn) contained in solder to form intermetallic compounds that are mechanically and electrically harmful to chip joints. The interfacial reaction at the bump/UBM interface can lead to delamination of the UBM layer on a pad, inducing chip malfunction. Moreover, electromigration (EM) induced failure may result at the bump/UBM interface from using known methods due to “voids” forming near the interface of the solder bump materials such as tin-lead (Sn-Pb) and UBM materials when a high current is imposed on a bump at 100° C. It is therefore desirable to simplify the process of forming UBM layers and generally improve the effectiveness of the UBM layer.
- In one embodiment, a method is disclosed including forming a refractory layer over a pad coupled to a substrate and annealing the refractory layer in ambient hydrogen.
- The invention is illustrated by way of example. The invention is not limited to the figures of the accompanying drawings in which like references indicate similar elements. Additionally, the elements are not drawn to scale.
- FIG. 1A shows a cross-sectional side view of a pad and a passivation layer on a substrate.
- FIG. 1B shows a cross-sectional side view of the device shown in FIG. 1A with an under bump metallization layer deposited onto the pad.
- Figure 1C shows a cross-sectional side view of the device shown in Figure 1B undergoing rapid thermal processing in ambient hydrogen.
- FIG. 2 shows another embodiment of the invention wherein a refractory hydride layer is formed next to the bump.
- FIG. 3 shows another embodiment of the invention wherein a refractory layer is formed between the bump and the pad.
- FIG. 4a shows another embodiment of the invention wherein multiple layers of refractory and non-refractory material are formed between the pad and the bump.
- FIG. 4b shows the structure of FIG. 4a after thermal processing to form a refractory hydride layer.
- FIG. 5 is a flow chart that illustrates a process for forming a refractory hydride layer using a rapid thermal processing chamber.
- Methods are disclosed for forming a UBM structure that includes a refractory hydride layer. In the following description, numerous specific details such as layer thicknesses, sequences, times, temperatures, etc., are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without employing these specific details. In other instances, well known processes and processing techniques have not been described in detail in order to avoid unnecessarily obscuring the present invention.
- One embodiment of the invention describes a UBM material comprised of refractory metals selected from the group comprising halfnium (Hf), niobium (Nb), titanium (Ti), vanadium (V), zirconium (Zr), or any combination thereof deposited onto a pad that is formed over a substrate. In one embodiment, the UBM may have a thickness that ranges from approximately 1000 Å to 5000 Å. These metals may be combined with a variety of other components to ensure physical and chemical stability such as copper (Cu) and nickel (Ni) to form a copper-nickel-titanium (Cu/Ni/Ti) layered structure.
- FIGS.1A through IC show one embodiment of forming a refractory hydride layer according to the invention. FIG. 1A shows
substrate 40 withpad 45 andpassivation layer 50. In this embodiment,pad 45 comprises aluminum (Al) but other materials such as copper may be used.Pad 45 is patterned over substrate 40 (e.g., semiconductor substrate) according to a variety of methods that are known in the art.Passivation layer 50 is, for example, silicon dioxide (SiO2), or polyimide, but other like materials may be used. FIG. 1B shows UBM 55 conformally deposited overpad 45 andpassivation layer 50. UBM 55 deposition may occur through a variety of methods such as physical vapor deposition (e.g. sputtering or evaporation), chemical vapor deposition, or other like methods. In this example, UBM 55 is comprised of a metal or metal alloy containing at least one refractory metal. Additionally, UBM may comprise a single refractory metal or metal alloy layer or multiple layers. - After deposition of
UBM 55,substrate 40 undergoes thermal processing in a rapid thermal processor using ambient hydrogen. FIG. 1C showssubstrate 40 undergoing annealing in ambient hydrogen. Annealing may be performed in devices that are capable of rapid and uniform heating such as a rapid thermal processor. In rapid thermal processing, the temperature may range from approximately 300° C. to approximately 500° C. One suitable temperature range for the hydrogen annealing is 350° C. to 450° C. Annealing in hydrogen formsrefractory hydride layer 60 of a portion of the material of UBM 55.Refractory hydride layer 60 may range in thickness from approximately 100 Å to approximately 500 Å. After annealing, a bump, such as a Sn-Pb solder bump, may be formed overrefractory hydride layer 60 topad 45 according to processes known in the art. - The invention contemplates various configurations for the UBM layer. For example, in one embodiment, a binary layer (A-B) is comprised of alloys wherein A is a nonrefractory metal such as gold or nickel and B is a refractory metal such as those mentioned herein ranging from 1 to 10 weight percent (wt%). In another embodiment, a bilayer structure A/B is formed where A (non-refractory metal) is on the pad side and B (refractory metal) is on the bump side. In yet another embodiment, a bilayer structure B/A is formed where B is on the pad side. In another embodiment, a three element structure A-B/C is formed that contains two different kinds of refractory metals B and C such as niobium (Nb), titanium (Ti), tantalum (Ta), vanadium (V), or zirconium (Zr). A UBM structure containing a refractory metal layer according to this embodiment has a thickness approximately in the range of 1000 Å to approximately 5000 Å. A is a nonrefractory metal with a thickness approximately in the range of 500 Å to 2000 Å. In each of the above examples, a refractory hydride structure may be formed by annealing the binary layer, bilayer, or multi-layer, respectively, in ambient H2.
- FIG. 2 shows an embodiment of the invention wherein a cross-section of
substrate 70 havingpad 75,passivation layer 80, UBM 90 comprising a bilayer of anon-refractory metal layer 92 such as nickel (Ni) or copper (Cu) formed overrefractory metal layer 85. The thickness oflayer 92 is in the range of 500 Å-1000 Å. According to the invention, this structure is subjected to thermal processing in a rapid thermal processor with ambient hydrogen (H2). A suitable temperature range for the thermal processing is approximately 350° C. to approximately 550° C. Additionally, a suitable time period of this process ranges from approximately one minute to five minutes. After rapid thermal processing, a portion ofrefractory metal layer 85 is converted to a refractory hydride layer.Refractory hydride layer 85 is essentially formed in a self-aligning process without changing or adding any new materials.Refractory hydride layer 85 has a thickness that preferably ranges from approximately 100 Å to 550 Å and is uniformly controlled by the UBM thickness and the rapid thermal process.Bump 95 is formed over UBM 90. - FIG. 3 shows
substrate 100 withpad 110 andpassivation layer 120. In this embodiment,UBM layer 130 comprises a refractory metal in a binary alloy (A1−xBx) form. A is a non-refractory metal. B is a refractory metal. In this embodiment, X is in a range of 0.05 to 0.5. Upon thermal processing in H2 ambient (temperature ranging from 350° C. to 550° C.)refractory hydride portion 135 is formed.Bump 140 is formed overUBM layer 130. - FIG. 4a shows another embodiment of the method of the invention wherein the
substrate 200 includesUBM layer 235 ofnon-refractory metal layer 250 andmetal layer 230 that is a binary alloy of a non-refractory metal and a refractory metal. The structure is subjected to thermal processing in ambient H2 to form a refractory hydride. FIG. 4b shows the structure of FIG. 4a after thermal processing comprisingnon-refractory metal layer 250,refractory hydride layer 240, andnon-refractory metal layer 245. In this embodiment, a tri-layer structure is formed with a portion of the binary alloy forming the refractory hydride layer. This structure may be thought of as a combination of two previous structures mentioned in FIG. 2 and FIG. 3. - FIG. 5 is a flow chart of an embodiment of a method of the invention. At
operation 305, a metal pad is patterned on a substrate using methods known in the art. Atoperation 300, refractory metals are deposited over the pad and a passivation layer previously patterned on the substrate. A variety of methods may be used to deposit the layer of refractory metals on the pad and passivation layer. For example, physical vapor deposition (e.g. sputtering) or electron beam co-evaporation techniques may be used. Atoperation 310, the substrate ofoperation 300 is inserted into the rapid thermal processor. Rapid thermal processing occurs in ambient hydrogen atoperation 320. In this process, an optimal temperature range of approximately 350° C. through 550° C. and an annealing time in the range of approximately 1-5 minutes is used. Atoperation 330, a refractory hydride layer is formed. However, it should be noted that multiple refractory hydride layers may be formed using the same operating conditions provided above for forming a single refractory hydride layer. Atoperation 340, bump plating of the UBM may occur either before or after patterning of the UBM. - In the foregoing specification, the invention has been described with reference to specific exemplary embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than restrictive sense.
Claims (17)
1. A method comprising:
(a) forming a layer comprising a refractory material over a pad coupled to a substrate; and
(b) annealing the layer in ambient hydrogen (H2).
2. The method of claim 1 , wherein the annealing forms a refractory hydride layer.
3. The method of claim 1 , wherein an annealing temperature is between the range of approximately 350° C. and approximately 550° C.
4. The method of claim 1 , wherein the layer comprises a material selected from the group consisting of halfnium (Hf), niobium (Nb), titanium (Ti), vanadium (V), zirconium (Zr), and any combination thereof.
5. The method of claim 2 , wherein the layer comprises a material selected from the group consisting of halfnium (Hf), niobium (Nb), titanium (Ti), vanadium (V), zirconium (Zr), and any combination thereof.
6. The method of claim 2 , further comprising forming a bump over the layer wherein the layer is substantially unreactive with the bump and the pad at a temperature approximately in the range of 350° C.-550° C.
7. The method of claim 2 , wherein the refractory hydride layer has a thickness approximately in the range of 100 Å to 500 Å.
8. The method of claim 1 , wherein annealing time is approximately in the range of 1 to 5 minutes.
9. The method of claim 2 , wherein the refractory hydride layer adheres to the pad.
10. An apparatus comprising:
a passivation layer disposed over a substrate;
a pad disposed over the substrate and exposed through the passivation layer; and
a refractory hydride layer disposed over a portion of the passivation layer and a portion of the pad, the refractory hydride layer being conductive with a thickness approximately in the range of 100 Å to 500 Å.
11. The apparatus of claim 10 , wherein the refractory hydride layer comprises a material selected from the group consisting of halfnium (Hf), niobium (Nb), titanium (Ti), vanadium (V), zirconium (Zr), and any combination thereof.
12. The apparatus of claim 10 , wherein the refractory hydride layer adheres to the pad.
13. The apparatus of claim 10 , wherein the refractory hydride layer has a thickness approximately in the range of 100 Å to 500 Å.
14. An apparatus comprising:
a substrate;
a passivation layer coupled to a substrate
a pad coupled to a substrate;
a refractory layer coupled to the pad; and
a under bump metallization layer comprising a refractory metal hydride.
15. The apparatus of claim 14 , wherein the under bump metallization layer further comprises a non-refractory layer.
16. The apparatus of claim 15 , wherein the non-refractory layer of the under bump metallization layer is 500 Å to 1000 Å.
17. The apparatus of claim 14 , wherein the refractory layer is a refractory hydride layer.
Priority Applications (1)
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US09/929,408 US6461954B1 (en) | 1999-09-02 | 2001-08-14 | Method and an apparatus for forming an under bump metallization structure |
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US09/389,162 US6312830B1 (en) | 1999-09-02 | 1999-09-02 | Method and an apparatus for forming an under bump metallization structure |
US09/929,408 US6461954B1 (en) | 1999-09-02 | 2001-08-14 | Method and an apparatus for forming an under bump metallization structure |
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US09/389,162 Division US6312830B1 (en) | 1999-09-02 | 1999-09-02 | Method and an apparatus for forming an under bump metallization structure |
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US09/929,408 Expired - Fee Related US6461954B1 (en) | 1999-09-02 | 2001-08-14 | Method and an apparatus for forming an under bump metallization structure |
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AU (1) | AU7883100A (en) |
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US20040180526A1 (en) * | 2003-03-12 | 2004-09-16 | Plas Hubert Allen Vander | Solder on a sloped surface |
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JP3651765B2 (en) * | 2000-03-27 | 2005-05-25 | 株式会社東芝 | Semiconductor device |
US6521996B1 (en) * | 2000-06-30 | 2003-02-18 | Intel Corporation | Ball limiting metallurgy for input/outputs and methods of fabrication |
DE10127889A1 (en) * | 2001-06-08 | 2002-12-19 | Infineon Technologies Ag | Process for re-melting solder material applied on connecting sites used in the semiconductor industry comprises re-melting the solder material using an RTP method |
US6737353B2 (en) * | 2001-06-19 | 2004-05-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor device having bump electrodes |
TW546792B (en) * | 2001-12-14 | 2003-08-11 | Advanced Semiconductor Eng | Manufacturing method of multi-chip stack and its package |
US20040007779A1 (en) * | 2002-07-15 | 2004-01-15 | Diane Arbuthnot | Wafer-level method for fine-pitch, high aspect ratio chip interconnect |
EP1489659A1 (en) * | 2003-06-18 | 2004-12-22 | ABB Technology AG | Contact metallisation for semiconductor devices |
US7242097B2 (en) | 2003-06-30 | 2007-07-10 | Intel Corporation | Electromigration barrier layers for solder joints |
DE102004047730B4 (en) * | 2004-09-30 | 2017-06-22 | Advanced Micro Devices, Inc. | A method for thinning semiconductor substrates for the production of thin semiconductor wafers |
US7339267B2 (en) * | 2005-05-26 | 2008-03-04 | Freescale Semiconductor, Inc. | Semiconductor package and method for forming the same |
US10074553B2 (en) * | 2007-12-03 | 2018-09-11 | STATS ChipPAC Pte. Ltd. | Wafer level package integration and method |
US9460951B2 (en) | 2007-12-03 | 2016-10-04 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of wafer level package integration |
US11682640B2 (en) | 2020-11-24 | 2023-06-20 | International Business Machines Corporation | Protective surface layer on under bump metallurgy for solder joining |
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JP2796919B2 (en) | 1992-05-11 | 1998-09-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Metallization composites and semiconductor devices |
JPH07226403A (en) * | 1994-02-10 | 1995-08-22 | Nippondenso Co Ltd | Manufacture of semiconductor device |
JP3089943B2 (en) * | 1994-04-15 | 2000-09-18 | 株式会社デンソー | Electrode device for semiconductor device |
US5466635A (en) * | 1994-06-02 | 1995-11-14 | Lsi Logic Corporation | Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating |
US5656858A (en) * | 1994-10-19 | 1997-08-12 | Nippondenso Co., Ltd. | Semiconductor device with bump structure |
US5492235A (en) * | 1995-12-18 | 1996-02-20 | Intel Corporation | Process for single mask C4 solder bump fabrication |
US5773359A (en) | 1995-12-26 | 1998-06-30 | Motorola, Inc. | Interconnect system and method of fabrication |
US5789318A (en) | 1996-02-23 | 1998-08-04 | Varian Associates, Inc. | Use of titanium hydride in integrated circuit fabrication |
US5736456A (en) * | 1996-03-07 | 1998-04-07 | Micron Technology, Inc. | Method of forming conductive bumps on die for flip chip applications |
JPH10125685A (en) | 1996-10-16 | 1998-05-15 | Casio Comput Co Ltd | Protruding electrode and its forming method |
US5969425A (en) | 1997-09-05 | 1999-10-19 | Advanced Micro Devices, Inc. | Borderless vias with CVD barrier layer |
US5943597A (en) * | 1998-06-15 | 1999-08-24 | Motorola, Inc. | Bumped semiconductor device having a trench for stress relief |
WO2000021126A1 (en) * | 1998-10-05 | 2000-04-13 | Kulicke & Soffa Investments, Inc. | Semiconductor copper bond pad surface protection |
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1999
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040180526A1 (en) * | 2003-03-12 | 2004-09-16 | Plas Hubert Allen Vander | Solder on a sloped surface |
WO2004082347A2 (en) * | 2003-03-12 | 2004-09-23 | Hewlett-Packard Development Company, L.P. | Solder on a sloped surface |
WO2004082347A3 (en) * | 2003-03-12 | 2005-06-02 | Hewlett Packard Development Co | Solder on a sloped surface |
US6979906B2 (en) | 2003-03-12 | 2005-12-27 | Hewlett-Packard Development Company, L.P. | Solder on a sloped surface |
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AU7883100A (en) | 2001-03-26 |
US6461954B1 (en) | 2002-10-08 |
WO2001017013A2 (en) | 2001-03-08 |
GB0206843D0 (en) | 2002-05-01 |
GB2370417A (en) | 2002-06-26 |
US6312830B1 (en) | 2001-11-06 |
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WO2001017013A3 (en) | 2001-10-25 |
DE10084995T1 (en) | 2002-10-31 |
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