US20020000671A1 - Bonding over integrated circuits - Google Patents
Bonding over integrated circuits Download PDFInfo
- Publication number
- US20020000671A1 US20020000671A1 US09/458,593 US45859399A US2002000671A1 US 20020000671 A1 US20020000671 A1 US 20020000671A1 US 45859399 A US45859399 A US 45859399A US 2002000671 A1 US2002000671 A1 US 2002000671A1
- Authority
- US
- United States
- Prior art keywords
- integrated circuit
- layer
- circuit according
- metal
- contact pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 87
- 239000002184 metal Substances 0.000 claims abstract description 87
- 238000000034 method Methods 0.000 claims description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims description 27
- 239000010703 silicon Substances 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 238000001465 metallisation Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 229910052721 tungsten Inorganic materials 0.000 claims description 10
- 239000010937 tungsten Substances 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910021483 silicon-carbon alloy Inorganic materials 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000013461 design Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 12
- 239000003989 dielectric material Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 239000003870 refractory metal Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 6
- 238000005336 cracking Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910001080 W alloy Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 2
- 208000037408 Device failure Diseases 0.000 description 1
- 241000587161 Gomphocarpus Species 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004964 aerogel Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000000637 aluminium metallisation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000010267 cellular communication Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HWEYZGSCHQNNEH-UHFFFAOYSA-N silicon tantalum Chemical compound [Si].[Ta] HWEYZGSCHQNNEH-UHFFFAOYSA-N 0.000 description 1
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- -1 tungsten nitride Chemical class 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
- H01L2224/02165—Reinforcing structures
- H01L2224/02166—Collar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05075—Plural internal layers
- H01L2224/0508—Plural internal layers being stacked
- H01L2224/05082—Two-layer arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/05166—Titanium [Ti] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/05181—Tantalum [Ta] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/05184—Tungsten [W] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/05624—Aluminium [Al] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/05647—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/45164—Palladium (Pd) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/45169—Platinum (Pt) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
- H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48617—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
- H01L2224/48624—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
- H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48638—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/48647—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
- H01L2224/487—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48717—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
- H01L2224/48724—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
- H01L2224/487—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48738—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/48747—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48799—Principal constituent of the connecting portion of the wire connector being Copper (Cu)
- H01L2224/488—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48817—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
- H01L2224/48824—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48799—Principal constituent of the connecting portion of the wire connector being Copper (Cu)
- H01L2224/488—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48838—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/48847—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01022—Titanium [Ti]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0495—5th Group
- H01L2924/04953—TaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0504—14th Group
- H01L2924/05042—Si3N4
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
Definitions
- the present invention is related in general to the field of semiconductor devices and processes, and more specifically to integrated circuits that permit wire bonding to be performed directly over portions of the active circuit area.
- bonding pads on silicon integrated circuits ICs In order to accommodate balls of bonding wires or solder, typical bonding pads on silicon integrated circuits ICs have to be of sufficient size; they typically range from squares of 80 ⁇ 80 ⁇ m to squares of 150 ⁇ 150 ⁇ m. They consume, therefore, an area between approximately 1 and 20% of the circuit area, dependent on the number of bonding pads and the size of the integrated circuit. For manufacturing and assembly reasons, the bonding pads are arranged in rows along the periphery of the circuit, usually stringed along all four chip sides.
- the second trend concerns certain processes in the assembly of a semiconductor chip. It is well known that bonding pads in silicon ICs can be damaged during wafer probing using fine-tip tungsten needles, further during conventional thermosonic wire bonding to aluminum metallization on the circuits, or during solder ball attachment in chip-to-substrate devices of more recent assembly developments. In wire bonding, particularly suspect are the mechanical loading and ultrasonic stresses applied the tip of the bonding capillary to the bonding pad. When the damage is not apparent during the bonding process, the defects may manifest themselves subsequently by succumbing to thermo-mechanical stresses generated during the plastic encapsulation, accelerated reliability testing, temperature cycling, and device operation.
- microcracks which may progress to fatal fractures in the underlying dielectric material, as chip-outs of brittle or mechanically weak dielectric films, often together with pieces of metal or silicon, or as lifted ball bonds, or as delamination of metal layers.
- the metal is deposited and then etched to form “reservoirs” to be filled with the dielectric material, for example HSQ. Since HSQ is deposited by a spin-on process, the sizes of the reservoirs have to remain large enough to be filled controllably with the dielectric. This requirement is contrary to the industry trend for continued shrinking of all circuit feature sizes.
- At least a portion of a contact pad can be positioned over the IC, when a combination of a bondable metal layer, a stress-absorbing metal layer, and a mechanically strengthened, electrically insulating layer, separate the contact pad and the portion of the IC, provided that each layer has sufficient thickness.
- This combination of layers and thicknesses provides a system strong enough to withstand the mechanical forces required in the bonding process.
- the present invention is related to high density ICs, especially those having high numbers of metallized inputs/outputs, or contact pads. These circuits can be found in many semiconductor device families such as standard linear and logic products, processors, digital and analog devices, high frequency and high power devices, and both large and small area chip categories.
- the invention saves significant amounts of silicon real estate and thus permits the shrinking of IC chips. Consequently, the invention helps to alleviate the space constraints of continually shrinking applications such as cellular communications, pagers, hard disk drives, laptop computers and medical instrumentation.
- the invention utilizes the materials and the sequence of processing steps applied to producing the IC.
- the metals and dielectric offering high stress-absorbing characteristics are applied as layers of sufficient thickness. No extra layers of stress-absorbing materials such as polyimides are needed.
- Another object of the present invention is to advance the process and operation reliability of semiconductor probing, and wire bonded and solder-attached assemblies by providing the metal and insulating layers separating the contact pad and the circuit portions in thicknesses sufficient to reliably absorb mechanical, thermal and impact stresses.
- Another object of the invention is to eliminate restrictions on the processes of probing and of wire bonding and solder attachment, thus minimizing the risks of inflicting cracking damage even to very brittle circuit dielectrics.
- Another object of the invention is to provide design and layout concepts and process methods which are flexible so that they can be applied to many families of semiconductor IC products, and are general, so that they can be applied to several generations of products.
- Another object of the invention is to provide a low-cost and high-speed process for fabrication, testing and assembly.
- Another object of the invention is to use only design and processes most commonly used and accepted in the fabrication of IC devices, thus avoiding the cost of new capital investment and using the installed fabrication equipment base.
- the layer of bondable metal is preferably copper-doped aluminum about 1400 nm thick; the stress-absorbing metal is preferably titanium-tungsten alloy about 300 nm thick; and the mechanically strengthened, electrically insulating layer is preferably silicon nitride about 1000 nm thick.
- the layer of bondable metal aluminum can be substituted by copper, preferably about 1500 nm thick.
- suitable circuit portions under the contact pad include resistors, interconnectors, electrostatic discharge structures, inductors, and capacitors.
- transistors preferably CMOS transistors may be placed under the contact pad.
- the electrically insulating layer further serves as the protective overcoat of the IC, since it is made of moisture-impenetrable silicon nitride.
- the bondable metal layer and the stress-absorbing metal layer further serve as the metallization of the contact pad. The thicknesses of the combination of layers are optimized for the thermal, impact and ultrasonic stresses encountered in wire ball bonding.
- the bondable metal layer is further modified to include an interface metal layer of, for example, nickel, and a solderable metal layer of, for example gold, palladium or platinum.
- an interface metal layer of, for example, nickel and a solderable metal layer of, for example gold, palladium or platinum.
- the thicknesses of the combination of layers are optimized for the reflow stresses encountered in solder attachment.
- the relative positions of the via, connecting the contact pad and the circuit, and the bonding wire ball are varied in order to ascertain the insensitivity of the system and the process with respect to the stresses associated with the different positions.
- FIG. 1 is a schematic and simplified cross sectional view of the contact pad positioning (with bonding wire ball attached) in the known art.
- FIG. 2 is a schematic and simplified cross sectional view of a contact pad positioning (with bonding wire ball attached) according to one embodiment of the invention.
- FIG. 3 is a schematic and simplified cross sectional view of a contact pad positioning (with bonding wire ball attached) according to another embodiment of the invention.
- FIG. 4 is a more detailed schematic cross sectional view of a bonding pad positioning in the known art.
- FIG. 5 is a more detailed schematic cross sectional view of a contact pad positioning over a portion of an integrated circuit according to an embodiment of the invention.
- FIG. 6 is a more detailed schematic cross sectional view of a contact pad positioning over a portion of an integrated circuit according to another embodiment of the invention.
- the present invention is related to the input/output (I/O) terminals of integrated circuits (ICs), commonly referred to as “contact pads”.
- I/O input/output
- ICs integrated circuits
- contact pads When wire bonding is used in the assembly of IC chips, these pads are also referred to as “bonding pads” or “bond pads”.
- bond pads As defined herein, the term “contact pad” refers to the metallized I/Os of the circuits.
- a contact pad suitable for a metal ball in wire bonding or for a solder ball in reflow assembly requires a substantial area of semiconductor (usually silicon) “real estate” (from squares of 80 ⁇ 80 ⁇ m to squares of 150 ⁇ 150 ⁇ m).
- the signal, power and ground connections need numerous contact pads, ranging in number from 8 to over 1000, causing a significant sacrifice of precious silicon.
- FIG. 1 illustrates schematically an example of the standard contact pad arrangement as practiced in known technology, for a double-level metal silicon IC.
- the first metal layer 101 is deposited and patterned as required by the IC design. In most ICs, this metal layer is thin (typically about 450 nm) and made of aluminum, usually doped with up to 2% copper.
- the interlevel oxide 102 (typically 800 nm made of silicon dioxode or combinations of insulating layers including HSQ or other materials of low dielectric constant) is followed by the second metal layer 103 , usually made of aluminum doped with up to 2% copper (more recently also made of copper), with thicknesses typically ranging from 0.5 to 1.0 ⁇ m.
- Layer 103 is topped by the protective overcoat layer 104 , usually made of silicon nitride, about 1 ⁇ m thick). In this overcoat 104 , a window 105 is opened in order to expose the underlying metal so that it can serve as a contact pad.
- Window 105 has typically a width of 100 ⁇ m, resulting in a contact pad area of 100 ⁇ 100 ⁇ m 2 (in some devices, the area is as large as 150 ⁇ 150 ⁇ m 2 ).
- the contact pad is used for attaching a bonding wire ball 106 ; most frequently, wire and ball are made of gold, less frequently of copper.
- FIG. 2 shows an embodiment for a double-level metal silicon IC.
- the first metal layer 201 is deposited. It is thin (typically about 450 nm), made of aluminum with up to 2% copper, and designed and patterned according to the fine feature sizes of a contemporary IC.
- layer 201 has a thin underlayer (about 100 to 300 nm) made of refractory metal or alloy.
- Metal layer 201 is followed by the interlevel oxide layer 202 (typically 800 nm made of silicon dioxide or combinations of insulating layers including HSQ or other materials of low dielectric constant).
- the second level metal layer 203 is similar to layer 201 , usually somewhat thicker (about 600 nm).
- the protective overcoat layer 204 is usually made of moisture-impenetrable silicon nitride. Other choices include silicon oxynitride, silicon carbon alloys, and sandwiched films thereof. As an important feature of the present invention, the thickness of this layer has to be such that it can contribute to the stress-absorbing characteristic of the hierarchy of layer under the contact pad. Preferably, layer 204 has a thickness of between 1.0 and 1.5 ⁇ m, but for some material choices 400 nm may suffice.
- metals used for the underlayer 206 of contact pad metal layer 208 preferably include tungsten, titanium, titanium nitride, or titanium-tungsten alloy; other choices are tantalum, tantalum nitride, tantalum silicon nitride, tungsten nitride, or tungsten silicon nitride.
- this underlayer made of refractory metal has a thickness large enough to reliably act as a stress-absorbing buffer. Thicknesses between about 200 and 500 nm, preferably about 300 nm, are satisfactory. The thickness for optimum stress absorption depends not only on the selected metal, but also on the deposition technique selected, the rate of deposition, and the temperature of the silicon substrate during the time of deposition, since these parameters determine the microcrystallinity of the deposited layer.
- the layer formation is preferably performed at a rate of about 4 to 5 nm/s onto a silicon substrate at ambient temperature, increasing to about 70° C. when a thickness of at least 300 nm is reached.
- the tungsten microcrystals thus created have an average size and distribution such that they act reliably as stressabsorbing “springs” during the wire bonding process in assembly.
- the bondable metal layer 207 is usually made of aluminum with up to 2% copper, in the thickness range from about 500 to 2800 nm, with a preferred thickness of about 1400 to 1500 nm. Further, copper is being used as the bondable metal.
- the contact pad is used for attaching a bonding wire ball 209 ; most frequently, wire and ball are made of gold, less frequently of copper.
- the contact pad metallization 208 should be suitable for solder ball attachment, it usually has a surface of a combination of thin metal layers, such as nickel or chromium followed by gold, palladium or platinum.
- the bonding process (or soldering process, respectively) can be performed safely without risk of affecting the IC or damaging or cracking any brittle or mechanically weak layers, especially dielectric layers. It is, therefore, advantageous to keep via hole 205 small and utilize the majority of the contact pad area for placing elements of the IC in the layers 203 , 202 , and 201 under the contact pad. In FIG. 2, the area gain for this design opportunity is generally designated 210 .
- FIG. 3 indicates another embodiment of the invention. Shown is schematically a double-level metal IC similar to the IC shown in FIG. 2 (with identical reference numbers indicating corresponding features in both FIGS. )
- the combination 308 of metal layers on top of the protective overcoat 204 is extended over a significant portion of the IC surface.
- This design feature provides the freedom to place the bonding wire ball 209 (or solder ball, respectively) on a location on the IC surface distant from via 205 . Consequently, the size of the bonding ball (or solder ball) does no longer have to shrink with the bond pad size, and the placement on the bondable metal is more relaxed since it is no longer confined by tightly controlled precise positioning.
- the opportunity is provided to place more IC elements under the contact pad.
- These elements may include at least one electrically conductive structure constructed as an interconnector, a resistor, an inductor or a capacitor.
- the circuit portion may include at least one active component such as a transistor or a diode.
- these IC portions may include mechanically weak or brittle dielectric layers. To which extent the available contact pad area is utilized for placing IC components under, is variable according to the specific IC design; the circuit portion may occupy a substantial area under the contact pad.
- FIGS. 4, 5 and 6 illustrate this fact by comparing two embodiments of the invention in FIGS. 5 and 6 with the known technology in FIG. 4.
- FIGS. 4 to 6 although schematic, are drawn to the same relative scale (but not absolute scale) and aligned relative to the chip edges in order to highlight the relative area savings.
- FIG. 4 is a cross sectional view of a small portion of a two-level metal IC, generally designated 400 , which is fabricated on a silicon substrate 401 and singulated by sawing line 402 . Over the silicon, a couple of oxide layers 403 a and 403 b are shown, which are opened to access the diffusions for source 404 and drain 405 of a CMOS transistor. In these openings, the contacts to source and drain are established by metal level I, represented by the combination of refractory metal 406 (for instance titanium/tungsten) and bondable metal 407 (for instance aluminum). The same metal level is used to contact the gate, represented by polysilicon 408 .
- metal level I represented by the combination of refractory metal 406 (for instance titanium/tungsten) and bondable metal 407 (for instance aluminum).
- the same metal level is used to contact the gate, represented by polysilicon 408 .
- the protective overcoat 410 for instance silicon nitride.
- the large window 411 (usually a square of 80 to 150 ⁇ m side length) is opened to attach a wire bond ball or solder ball to the underlying contact pad metallization.
- This metallization is provided by metal level II consisting of the refractory metal 412 (preferred thickness about 200 to 500 nm) and the bondable metal 413 (preferred thickness about 1000 to 1500 nm).
- the whole contact pad metallization is in low-resistance and non-rectifying contact with the metal leading to the source of the CMOS transistor displayed; in contrast, other contact pads of the same IC may have dielectric under their areas.
- FIGS. 5 and 6 For illustrating the impact of the invention to save silicon real estate area by way of example, the requirements to accommodate the contact pad in the known technology of FIG. 4 are compared with two illustrative embodiments of the invention displayed in FIGS. 5 and 6 for portions of two-level metal ICs (generally designated 500 and 600 , respectively) analogous to the IC portion in FIG. 4.
- the silicon real estate savings are indicated by the distance 501 and 601 , respectively, of the actual sawing lines ( 502 a in FIG. 5 and 602 a in FIG. 6) to the dashed contours 502 b and 602 b , respectively, normalized to the sawing lines before the implementation of the teachings of this invention.
- FIGS. 5 and 6 depict a couple of insulating layers 503 a and 503 b (fir instance silicon dioxide and other dielectrics described in FIG. 2) deposited over the silicon substrate 701 ; preferred total thickness of the oxide layers is about 600 to 800 nm.
- the oxide layers are opened to access the diffusions for source 504 and drain 505 of a CMOS transistor.
- the contacts to source and drain by metal level I represented by the combination of refractory metal 506 (for instance, titanium/tungsten or titanium nitride, preferred thickness about 200 to 400 nm) and bondable metal 507 (for instance, copper-doped aluminum or copper, preferred thickness about 400 to 800 nm).
- metal level I represented by the combination of refractory metal 506 (for instance, titanium/tungsten or titanium nitride, preferred thickness about 200 to 400 nm) and bondable metal 507 (for instance, copper-doped aluminum or copper, preferred thickness about 400 to 800 nm).
- the same metal level is used to contact
- the interlevel dielectric layer 509 (preferred thickness about 600 to 1000 nm) separates metal level I and metal level II.
- This dielectric layer may contain the mechanically weak but low-dielectric constant materials described in conjunction with FIG. 2; also combinations of dielectric layers are being used.
- the protective overcoat 510 (for example, made of moisture-impenetrable, mechanically strengthened silicon nitride or silicon carbide, preferred thickness about 800 to 1200 nm).
- metal level II consists of a layer of refractory metal (for instance, titanium/tungsten or titanium nitride, preferred thickness about 200 to 400 nm) and a layer of bondable metal (for instance copper-doped aluminum, or copper, preferred thickness about 400 to 800 nm).
- metal level II (designated 512 and 513 ) is shown to be contacted by the via; in FIG. 6, metal level II (designated 612 and 613 ) is also shown to contact the source of the CMOS transistor.
- the IC is designed so that the protective overcoat 510 can retain its mechanically strengthened characteristic; consequently, only a relatively small via 511 (diameter about 20 to 30 ⁇ m) is opened into it in order to contact metal level II and thus the IC.
- This contact is established by the metallization layers 514 and 515 of the actual contact pad, which in FIGS. 5 and 6 is laid out to stretch over a considerable portion of the IC area, including an active component (CMOS transistor) and passive resistors and interconnectors.
- CMOS transistor active component
- passive resistors and interconnectors passive resistors and interconnectors.
- layer 514 has stress-absorbing thickness and microcrystallinity.
- the process detail is described in conjunction with FIG. 2.
- a good example is a sputter-deposited titanium/tungsten layer of preferably 250 to 350 nm thickness.
- Another preferred method is chemical vapor deposition.
- the top metal layer 515 contacted by the connecting gold or copper ball bond, consists of bondable copper-doped aluminum (preferred thickness about 1400 to 1500 nm) forming intermetallics with the bonding wire material.
- solderable metals such as nickel, gold, palladium or platinum, are deposited on top of the aluminum.
- the combined layers 514 and 515 have sufficient thickness to protect the underlying circuit components from bonding impact.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Abstract
An architecture and method of fabrication for an integrated circuit having a bond pad; at lest one portion of said integrated circuit disposed under said contact pad and electrically connected to said pad through a via; a combination of a bondable metal layer, a stress-absorbing metal layer, and a mechanically strengthened, electrically insulating layer; and said combination of layers separating said contact pad and said portion of said integrated circuit, and having sufficient thickness to protect said circuit from bonding impact.
Description
- The present invention is related in general to the field of semiconductor devices and processes, and more specifically to integrated circuits that permit wire bonding to be performed directly over portions of the active circuit area.
- Two independent trends in semiconductor technology, both with a long history, contribute to the urgency for the present invention. The first trend concerns aspects of manufacturing cost savings by conserving semiconductor “real estate”.
- In order to accommodate balls of bonding wires or solder, typical bonding pads on silicon integrated circuits ICs) have to be of sufficient size; they typically range from squares of 80×80 μm to squares of 150×150 μm. They consume, therefore, an area between approximately 1 and 20% of the circuit area, dependent on the number of bonding pads and the size of the integrated circuit. For manufacturing and assembly reasons, the bonding pads are arranged in rows along the periphery of the circuit, usually stringed along all four chip sides.
- Until now, all semiconductor devices manufactured had to exclude the area covered by the bonding pads from use for laying out actual circuit patterns because of the high risk of damaging the circuit structures due to the unavoidable forces needed in the bonding process. Evidently, considerable savings of silicon real estate can be obtained if circuit patterns could be allowed to be laid out under the bonding pad metal. One way to achieve this would be to create another level of metallization dedicated solely to bonding pad formation. This level would be built over a protective overcoat covering an active circuit area. In existing technology, however, a special stress buffer layer of polyimide has to be applied between the protective overcoat and the extra metal layer, as shown by K. G. Heinen et al. (“Wire Bonds over Active Circuits”, Proc. IEEE 44th Elect. Comp. Tech. Conf., 1994, pp. 922-928). The cost of applying this polyimide layer has so far prohibited the implementation of the bonds-over-active-circuit concept.
- Another approach in existing technology has been proposed in U.S. patent application No. 60/092,961, filed Jun. 14, 1998 (Saran, “System and Method for Bonding Over Active Integrated Circuits”). In order to make the bonding pads strong enough to withstand the mechanical forces required in the wire bonding process, reinforcing systems under the bonding pad are described which utilize specific portions of the actual IC as the means to reinforce weak dielectric layers under the bonding pad. This method requires specific design or redesign of the IC and is poorly suited for standard linear and logic ICs which often have numerous bonding pads but relatively small circuit areas.
- The second trend concerns certain processes in the assembly of a semiconductor chip. It is well known that bonding pads in silicon ICs can be damaged during wafer probing using fine-tip tungsten needles, further during conventional thermosonic wire bonding to aluminum metallization on the circuits, or during solder ball attachment in chip-to-substrate devices of more recent assembly developments. In wire bonding, particularly suspect are the mechanical loading and ultrasonic stresses applied the tip of the bonding capillary to the bonding pad. When the damage is not apparent during the bonding process, the defects may manifest themselves subsequently by succumbing to thermo-mechanical stresses generated during the plastic encapsulation, accelerated reliability testing, temperature cycling, and device operation. The damage appears in most cases as microcracks which may progress to fatal fractures in the underlying dielectric material, as chip-outs of brittle or mechanically weak dielectric films, often together with pieces of metal or silicon, or as lifted ball bonds, or as delamination of metal layers.
- Recent technological developments in the semiconductor technology tend to aggravate the problem. For instance, newer dielectric materials such as silicon-containing hydrogen silsesquioxane (HSQ) are being preferred due to their lower dielectric constant which helps to reduce the capacitance C in the RC time constant and thus allows higher circuit speeds. Since lower density and porosity of dielectric films reduce the dielectric constant, films with these characteristics are introduced even when they are mechanically weaker. Films made of aerogels, organic polyimides, and parylenes fall into the same category. These materials are mechanically weaker than previous standard insulators such as the plasma-enhanced chemical vapor deposited dielectrics. Since these materials are also used under the bonding pad metal, they magnify the risk of device failure by cracking.
- In addition, the spacing between bonding pads is being progressively reduced to save valuable silicon real estate. Consequently, the bonding parameters have to become more aggressive to achieve stronger bonds in spite of the smaller size. Bonding force and ultrasonic energy during bonding are being increased. Again, the risk of yield loss and lowered reliability is becoming greater.
- For conventional bonding pad metallization processes, a solution to the aforementioned problems was disclosed in U.S. patent application Ser. No. 08/847,239, filed May 01, 1997 (Saran et al., “System and Method for Reinforcing a Bond Pad”). Some concepts and methods of this disclosure have been subsequently described by M. Saran et al. in a publication entitled “Elimination of Bond-pad Damage through Structural Reinforcement of Intermetal Dielectrics” (Internat. Reliab. Physics Symp., March 1998). In essence, a metal structure designed for mechanical strength serves as a reinforcement for the mechanically weak dielectric layer. The metal is deposited and then etched to form “reservoirs” to be filled with the dielectric material, for example HSQ. Since HSQ is deposited by a spin-on process, the sizes of the reservoirs have to remain large enough to be filled controllably with the dielectric. This requirement is contrary to the industry trend for continued shrinking of all circuit feature sizes.
- When the insulator film is formed first, openings such as trenches are etched into this film; metal such as copper or aluminum is then deposited to fill these openings, while metal deposited elsewhere on the surface is removed grinding and polishing (so-called damascene metallization process). Wire bonding and solder ball flip-chip bonding over damascene metal pads are facing the same risks of cracking weak dielectric layers as in the case of conventional metallization. U.S. patent application No. 60/085,876, filed May 18, 1998 (Saran et al., “Fine Pitch System and Method for Reinforcing Bond Pads in Semiconductor Devices”) teaches the design and fabrication process for metal structures made with the damascene technique reinforcing weak dielectrics under the bonding pads.
- An urgent need has therefore arisen for a low-cost, reliable mass production system and method providing the manufacture of wire and solder ball bonds directly over active IC areas. The system should provide stress-free, simple, and no-cost-added contact pads for flexible, tolerant bonding processes even when the contact pads are situated above one or more structurally and mechanically weak dielectric layers. The system and method should be applicable to a wide spectrum of design, material and process variations, leading to significant savings of silicon, as well as to improved process yield and device reliability. Preferably, these innovations should be accomplished using the installed process and equipment base so that no investment in new manufacturing machines is needed.
- According to the present invention for semiconductor integrated circuits (ICs), at least a portion of a contact pad can be positioned over the IC, when a combination of a bondable metal layer, a stress-absorbing metal layer, and a mechanically strengthened, electrically insulating layer, separate the contact pad and the portion of the IC, provided that each layer has sufficient thickness. This combination of layers and thicknesses provides a system strong enough to withstand the mechanical forces required in the bonding process.
- The present invention is related to high density ICs, especially those having high numbers of metallized inputs/outputs, or contact pads. These circuits can be found in many semiconductor device families such as standard linear and logic products, processors, digital and analog devices, high frequency and high power devices, and both large and small area chip categories. The invention saves significant amounts of silicon real estate and thus permits the shrinking of IC chips. Consequently, the invention helps to alleviate the space constraints of continually shrinking applications such as cellular communications, pagers, hard disk drives, laptop computers and medical instrumentation.
- The invention utilizes the materials and the sequence of processing steps applied to producing the IC. The metals and dielectric offering high stress-absorbing characteristics are applied as layers of sufficient thickness. No extra layers of stress-absorbing materials such as polyimides are needed.
- It is an object of the present invention to reduce the cost of IC chips by reducing the silicon area consumed for the overall circuit design. This object is achieved through utilizing the areas underneath the (numerous) contact pads by positioning portions of the actual circuit under the bond pad areas while simultaneously exploiting the metal and insulating layers separating the contact pad and the circuit portions for functions in the circuit design.
- Another object of the present invention is to advance the process and operation reliability of semiconductor probing, and wire bonded and solder-attached assemblies by providing the metal and insulating layers separating the contact pad and the circuit portions in thicknesses sufficient to reliably absorb mechanical, thermal and impact stresses.
- Another object of the invention is to eliminate restrictions on the processes of probing and of wire bonding and solder attachment, thus minimizing the risks of inflicting cracking damage even to very brittle circuit dielectrics.
- Another object of the invention is to provide design and layout concepts and process methods which are flexible so that they can be applied to many families of semiconductor IC products, and are general, so that they can be applied to several generations of products.
- Another object of the invention is to provide a low-cost and high-speed process for fabrication, testing and assembly.
- Another object of the invention is to use only design and processes most commonly used and accepted in the fabrication of IC devices, thus avoiding the cost of new capital investment and using the installed fabrication equipment base.
- These objects have been achieved by the teachings of the invention concerning design concepts and process flow suitable for mass production. Various modifications have been successfully employed so satisfy different selections of product geometries and materials.
- In one embodiment of the invention, at least one portion of the IC is disposed under the contact pad, occupying a substantial area under the contact pad. This concept is applied to circuit designs employing two or more levels of metal. In this embodiment, the layer of bondable metal is preferably copper-doped aluminum about 1400 nm thick; the stress-absorbing metal is preferably titanium-tungsten alloy about 300 nm thick; and the mechanically strengthened, electrically insulating layer is preferably silicon nitride about 1000 nm thick. For the layer of bondable metal, aluminum can be substituted by copper, preferably about 1500 nm thick. Examples for suitable circuit portions under the contact pad include resistors, interconnectors, electrostatic discharge structures, inductors, and capacitors. In addition, transistors (preferably CMOS transistors) may be placed under the contact pad.
- In another embodiment of the invention, the electrically insulating layer further serves as the protective overcoat of the IC, since it is made of moisture-impenetrable silicon nitride. In addition, the bondable metal layer and the stress-absorbing metal layer further serve as the metallization of the contact pad. The thicknesses of the combination of layers are optimized for the thermal, impact and ultrasonic stresses encountered in wire ball bonding.
- In another embodiment of the invention, the bondable metal layer is further modified to include an interface metal layer of, for example, nickel, and a solderable metal layer of, for example gold, palladium or platinum. The thicknesses of the combination of layers are optimized for the reflow stresses encountered in solder attachment.
- In another embodiment of the invention, the relative positions of the via, connecting the contact pad and the circuit, and the bonding wire ball are varied in order to ascertain the insensitivity of the system and the process with respect to the stresses associated with the different positions.
- The technical advances represented by the invention, as well as the objects thereof, will become apparent from the following description of the preferred embodiments of the invention, when considered in conjunction with the accompanying drawings and the novel features set forth in the appended claims.
- FIG. 1 is a schematic and simplified cross sectional view of the contact pad positioning (with bonding wire ball attached) in the known art.
- FIG. 2 is a schematic and simplified cross sectional view of a contact pad positioning (with bonding wire ball attached) according to one embodiment of the invention.
- FIG. 3 is a schematic and simplified cross sectional view of a contact pad positioning (with bonding wire ball attached) according to another embodiment of the invention.
- FIG. 4 is a more detailed schematic cross sectional view of a bonding pad positioning in the known art.
- FIG. 5 is a more detailed schematic cross sectional view of a contact pad positioning over a portion of an integrated circuit according to an embodiment of the invention.
- FIG. 6 is a more detailed schematic cross sectional view of a contact pad positioning over a portion of an integrated circuit according to another embodiment of the invention.
- The present invention is related to the input/output (I/O) terminals of integrated circuits (ICs), commonly referred to as “contact pads”. When wire bonding is used in the assembly of IC chips, these pads are also referred to as “bonding pads” or “bond pads”. As defined herein, the term “contact pad” refers to the metallized I/Os of the circuits. A contact pad suitable for a metal ball in wire bonding or for a solder ball in reflow assembly requires a substantial area of semiconductor (usually silicon) “real estate” (from squares of 80×80 μm to squares of 150×150 μm). In modern circuits, the signal, power and ground connections need numerous contact pads, ranging in number from 8 to over 1000, causing a significant sacrifice of precious silicon.
- The processes of wire bonding and solder reflow exert considerable mechanical stress onto the contact pads and their underlying materials so that especially insulator layers may be threatened by microcracks. The present invention solves both the area and the strength problems of the circuit contact pads.
- The impact of the present invention can be most easily appreciated by highlighting the shortcomings of the known technology. FIG. 1 illustrates schematically an example of the standard contact pad arrangement as practiced in known technology, for a double-level metal silicon IC. Over the
silicon substrate 100 and a first silicon dioxide layer (not shown), thefirst metal layer 101 is deposited and patterned as required by the IC design. In most ICs, this metal layer is thin (typically about 450 nm) and made of aluminum, usually doped with up to 2% copper. The interlevel oxide 102 (typically 800 nm made of silicon dioxode or combinations of insulating layers including HSQ or other materials of low dielectric constant) is followed by thesecond metal layer 103, usually made of aluminum doped with up to 2% copper (more recently also made of copper), with thicknesses typically ranging from 0.5 to 1.0 μm.Layer 103, in turn, is topped by theprotective overcoat layer 104, usually made of silicon nitride, about 1 μm thick). In thisovercoat 104, awindow 105 is opened in order to expose the underlying metal so that it can serve as a contact pad.Window 105 has typically a width of 100 μm, resulting in a contact pad area of 100×100 μm2 (in some devices, the area is as large as 150×150 μm2). In the example of FIG. 1, the contact pad is used for attaching abonding wire ball 106; most frequently, wire and ball are made of gold, less frequently of copper. - Experience of many years has shown that the process of wire bonding exerts considerable stress onto the underlying layers of metal and insulators. Main contributors to the challenge of this process step are the impact of the bonding capillary (to flatten the gold ball and form the nailhead contact), the frequency and energy of the ultrasonic agitation of the capillary and the gold ball (to break through the aluminum oxide film on the surface of the exposed metal layer103), and the time and temperature of the process (to initiate the formation of the intermetallic compounds of the gold/aluminum weld). Due to the stress of the wirebonding operation, and also the stresses exerted in multiprobe testing and in device operation after assembly, design rules for the layout of the IC have been established over the years which prohibit circuit structures to be placed in the area under the bonding pad, and also recommend to avoid the use of brittle, mechanically weak dielectric materials. Otherwise, the risk of cracking or cratering the layers under the bonding pad has been found to be acceptably high. Consequently, considerable real estate area of silicon is required just for accommodating the bonding pad.
- The solution to these problems according to the present invention is illustrated in FIG. 2, showing an embodiment for a double-level metal silicon IC. Over the
silicon substrate 200 and a first silicon dioxide layer (not shown), thefirst metal layer 201 is deposited. It is thin (typically about 450 nm), made of aluminum with up to 2% copper, and designed and patterned according to the fine feature sizes of a contemporary IC. Often,layer 201 has a thin underlayer (about 100 to 300 nm) made of refractory metal or alloy. -
Metal layer 201 is followed by the interlevel oxide layer 202 (typically 800 nm made of silicon dioxide or combinations of insulating layers including HSQ or other materials of low dielectric constant). The secondlevel metal layer 203 is similar tolayer 201, usually somewhat thicker (about 600 nm). - The
protective overcoat layer 204 is usually made of moisture-impenetrable silicon nitride. Other choices include silicon oxynitride, silicon carbon alloys, and sandwiched films thereof. As an important feature of the present invention, the thickness of this layer has to be such that it can contribute to the stress-absorbing characteristic of the hierarchy of layer under the contact pad. Preferably,layer 204 has a thickness of between 1.0 and 1.5 μm, but for somematerial choices 400 nm may suffice. - As shown in FIG. 2, it is another important feature of the present invention to open only a relatively small via205 through the overcoat layer 204 (about 20 to 30 μm diameter). It is filled with the refractory metal used for the
underlayer 206 of contactpad metal layer 208. Metals used preferably include tungsten, titanium, titanium nitride, or titanium-tungsten alloy; other choices are tantalum, tantalum nitride, tantalum silicon nitride, tungsten nitride, or tungsten silicon nitride. - As for the
layer 206, it is a pivotal feature of the present invention that this underlayer made of refractory metal has a thickness large enough to reliably act as a stress-absorbing buffer. Thicknesses between about 200 and 500 nm, preferably about 300 nm, are satisfactory. The thickness for optimum stress absorption depends not only on the selected metal, but also on the deposition technique selected, the rate of deposition, and the temperature of the silicon substrate during the time of deposition, since these parameters determine the microcrystallinity of the deposited layer. It has been found, for instance, that when using sputter deposition of tungsten, the layer formation is preferably performed at a rate of about 4 to 5 nm/s onto a silicon substrate at ambient temperature, increasing to about 70° C. when a thickness of at least 300 nm is reached. The tungsten microcrystals thus created have an average size and distribution such that they act reliably as stressabsorbing “springs” during the wire bonding process in assembly. - The
bondable metal layer 207 is usually made of aluminum with up to 2% copper, in the thickness range from about 500 to 2800 nm, with a preferred thickness of about 1400 to 1500 nm. Further, copper is being used as the bondable metal. In the embodiment of FIG. 2, the contact pad is used for attaching abonding wire ball 209; most frequently, wire and ball are made of gold, less frequently of copper. When thecontact pad metallization 208 should be suitable for solder ball attachment, it usually has a surface of a combination of thin metal layers, such as nickel or chromium followed by gold, palladium or platinum. - With the bonding wire ball209 (or solder ball, respectively) separated from the underlying IC by the combination of the bondable layer 207 (or solderable layer, respectively), the stress-absorbing
layer 206, and the mechanically strengthened, electrically insulatinglayer 204, the bonding process (or soldering process, respectively) can be performed safely without risk of affecting the IC or damaging or cracking any brittle or mechanically weak layers, especially dielectric layers. It is, therefore, advantageous to keep viahole 205 small and utilize the majority of the contact pad area for placing elements of the IC in thelayers - FIG. 3 indicates another embodiment of the invention. Shown is schematically a double-level metal IC similar to the IC shown in FIG. 2 (with identical reference numbers indicating corresponding features in both FIGS. ) In this embodiment, the
combination 308 of metal layers on top of theprotective overcoat 204 is extended over a significant portion of the IC surface. This design feature provides the freedom to place the bonding wire ball 209 (or solder ball, respectively) on a location on the IC surface distant from via 205. Consequently, the size of the bonding ball (or solder ball) does no longer have to shrink with the bond pad size, and the placement on the bondable metal is more relaxed since it is no longer confined by tightly controlled precise positioning. - In addition, the opportunity is provided to place more IC elements under the contact pad. These elements may include at least one electrically conductive structure constructed as an interconnector, a resistor, an inductor or a capacitor. Furthermore, the circuit portion may include at least one active component such as a transistor or a diode. In addition, these IC portions may include mechanically weak or brittle dielectric layers. To which extent the available contact pad area is utilized for placing IC components under, is variable according to the specific IC design; the circuit portion may occupy a substantial area under the contact pad.
- This advantage provided by the invention to place active and passive IC components under the contact pad results in significant savings of silicon real estate. The sequence of FIGS. 4, 5 and6 illustrate this fact by comparing two embodiments of the invention in FIGS. 5 and 6 with the known technology in FIG. 4. FIGS. 4 to 6, although schematic, are drawn to the same relative scale (but not absolute scale) and aligned relative to the chip edges in order to highlight the relative area savings.
- FIG. 4 is a cross sectional view of a small portion of a two-level metal IC, generally designated400, which is fabricated on a
silicon substrate 401 and singulated by sawingline 402. Over the silicon, a couple ofoxide layers source 404 and drain 405 of a CMOS transistor. In these openings, the contacts to source and drain are established by metal level I, represented by the combination of refractory metal 406 (for instance titanium/tungsten) and bondable metal 407 (for instance aluminum). The same metal level is used to contact the gate, represented bypolysilicon 408. - Over the interlevel oxide409 and metal level II is the protective overcoat 410 (for instance silicon nitride). Into this overcoat, the large window 411 (usually a square of 80 to 150 μm side length) is opened to attach a wire bond ball or solder ball to the underlying contact pad metallization. This metallization is provided by metal level II consisting of the refractory metal 412 (preferred thickness about 200 to 500 nm) and the bondable metal 413 (preferred thickness about 1000 to 1500 nm). In the example of FIG. 4, the whole contact pad metallization is in low-resistance and non-rectifying contact with the metal leading to the source of the CMOS transistor displayed; in contrast, other contact pads of the same IC may have dielectric under their areas.
- For illustrating the impact of the invention to save silicon real estate area by way of example, the requirements to accommodate the contact pad in the known technology of FIG. 4 are compared with two illustrative embodiments of the invention displayed in FIGS. 5 and 6 for portions of two-level metal ICs (generally designated500 and 600, respectively) analogous to the IC portion in FIG. 4. The silicon real estate savings are indicated by the
distance contours - As examples for the embodiments of the invention, FIGS. 5 and 6 depict a couple of insulating
layers silicon substrate 701; preferred total thickness of the oxide layers is about 600 to 800 nm. The oxide layers are opened to access the diffusions forsource 504 and drain 505 of a CMOS transistor. In these openings, the contacts to source and drain by metal level I, represented by the combination of refractory metal 506 (for instance, titanium/tungsten or titanium nitride, preferred thickness about 200 to 400 nm) and bondable metal 507 (for instance, copper-doped aluminum or copper, preferred thickness about 400 to 800 nm). The same metal level is used to contact the transistor gate, represented bypolysilicon 508. - The interlevel dielectric layer509 (preferred thickness about 600 to 1000 nm) separates metal level I and metal level II. This dielectric layer may contain the mechanically weak but low-dielectric constant materials described in conjunction with FIG. 2; also combinations of dielectric layers are being used. Over the interlevel oxide and metal level II is the protective overcoat 510 (for example, made of moisture-impenetrable, mechanically strengthened silicon nitride or silicon carbide, preferred thickness about 800 to 1200 nm). Similar to metal level I, metal level II consists of a layer of refractory metal (for instance, titanium/tungsten or titanium nitride, preferred thickness about 200 to 400 nm) and a layer of bondable metal (for instance copper-doped aluminum, or copper, preferred thickness about 400 to 800 nm). In FIG. 5, metal level II (designated 512 and 513) is shown to be contacted by the via; in FIG. 6, metal level II (designated 612 and 613) is also shown to contact the source of the CMOS transistor.
- It is important for the invention that the IC is designed so that the
protective overcoat 510 can retain its mechanically strengthened characteristic; consequently, only a relatively small via 511 (diameter about 20 to 30 μm) is opened into it in order to contact metal level II and thus the IC. This contact is established by the metallization layers 514 and 515 of the actual contact pad, which in FIGS. 5 and 6 is laid out to stretch over a considerable portion of the IC area, including an active component (CMOS transistor) and passive resistors and interconnectors. - It is further important for the invention that
layer 514 has stress-absorbing thickness and microcrystallinity. The process detail is described in conjunction with FIG. 2. A good example is a sputter-deposited titanium/tungsten layer of preferably 250 to 350 nm thickness. Another preferred method is chemical vapor deposition. Thetop metal layer 515, contacted by the connecting gold or copper ball bond, consists of bondable copper-doped aluminum (preferred thickness about 1400 to 1500 nm) forming intermetallics with the bonding wire material. When the connections are established by solder balls, thin layers of solderable metals, such as nickel, gold, palladium or platinum, are deposited on top of the aluminum. The combined layers 514 and 515 have sufficient thickness to protect the underlying circuit components from bonding impact. - While this invention has been described in reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to the description. It is therefore intended that the appended claims encompass any such modifications or embodiments.
Claims (20)
1. An integrated circuit comprising:
a contact pad;
at least one portion of said integrated circuit disposed under said contact pad and electrically connected to said pad through a via;
a combination of a bondable metal layer, a stress-absorbing metal layer, and a mechanically strengthened, electrically insulating layer; and
said combination of layers separating said contact pad and said portion of said integrated circuit, and having sufficient thickness to protect said circuit from bonding impact.
2. The integrated circuit according to claim 1 wherein said circuit portion occupies a substantial area under the contact pad.
3. The integrated circuit according to claim 1 wherein said circuit portion includes at least one electrically conductive structure constructed as an interconnector, a resistor, an inductor or a capacitor.
4. The integrated circuit according to claim 1 wherein said circuit portion includes at least one active component.
5. The integrated circuit according to claim 1 wherein said circuit portion includes a mechanically weak dielectric layer.
6. The integrated circuit according to claim 1 wherein said bondable metal layer and said stress-absorbing metal layer further serve as the metallization of said contact pad.
7. The integrated circuit according to claim 1 wherein said bondable metal further is solderable.
8. The integrated circuit according to claim 1 wherein said bondable metal is selected from a group consisting of aluminum, aluminum alloy, copper, gold, platinum and palladium.
9. The integrated circuit according to claim 1 wherein said layer of bondable metal is between about 500 and 2800 nm thick.
10. The integrated circuit according to claim 1 wherein said layer of bondable metal is about 1400 to 1500 nm thick.
11. The integrated circuit according to claim 1 wherein said stress-absorbing metal is selected from a group consisting of tungsten, titanium, titanium nitride, molybdenum, chromium, or alloys thereof.
12. The integrated circuit according to claim 1 wherein said layer of stress-absorbing metal is between about 200 and 500 nm thick.
13. The integrated circuit according to claim 1 wherein said layer of stress-absorbing metal is about 300 nm thick.
14. The integrated circuit according to claim 1 wherein said electrically insulating layer further serves as the protective overcoat of said integrated circuit.
15. The integrated circuit according to claim 1 wherein said electrically insulating layer comprises materials selected from a group consisting of silicon nitride, silicon oxynitride, silicon carbon alloys, and sandwiched films thereof.
16. The integrated circuit according to claim 1 wherein said electrically insulating layer is between about 400 and 1500 nm thick.
17. The integrated circuit according to claim 1 wherein said electrically insulating layer is about 1000 nm thick.
18. A method for fabricating an integrated circuit having a contact pad positioned over a portion of said integrated circuit comprising the steps of:
depositing a mechanically strengthened, electrically insulating layer overcoating said integrated circuit;
opening a via through said insulating layer;
depositing a layer of stress-absorbing metal over said insulating layer, filling said via therein;
depositing a layer of bondable metal over said layer of stress-absorbing metal; and
patterning said bondable metal layer and said stress-absorbing metal layer such that at least a portion of the remaining layers form a contact pad positioned over said integrated circuit.
19. The method according to claim 18 wherein said layer depositions comprise sputtering or chemical vapor deposition techniques.
20. The method according to claim 18 further comprising the step of attaching bonding wires or solder balls to said contact pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/458,593 US6384486B2 (en) | 1998-12-15 | 1999-12-10 | Bonding over integrated circuits |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11252998P | 1998-12-15 | 1998-12-15 | |
US09/458,593 US6384486B2 (en) | 1998-12-15 | 1999-12-10 | Bonding over integrated circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
US20020000671A1 true US20020000671A1 (en) | 2002-01-03 |
US6384486B2 US6384486B2 (en) | 2002-05-07 |
Family
ID=22344386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/458,593 Expired - Lifetime US6384486B2 (en) | 1998-12-15 | 1999-12-10 | Bonding over integrated circuits |
Country Status (4)
Country | Link |
---|---|
US (1) | US6384486B2 (en) |
EP (1) | EP1017098A3 (en) |
JP (1) | JP2000183104A (en) |
KR (1) | KR20000048115A (en) |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030132516A1 (en) * | 2002-01-15 | 2003-07-17 | Yasufumi Uchida | Semiconductor device and manufacturing method thereof |
US6680545B2 (en) * | 2000-07-31 | 2004-01-20 | Koninklijke Philips Electronics N.V. | Semiconductor devices |
US20040070042A1 (en) * | 2002-10-15 | 2004-04-15 | Megic Corporation | Method of wire bonding over active area of a semiconductor circuit |
US20040227237A1 (en) * | 2003-03-19 | 2004-11-18 | Naohiro Ueda | Semiconductor apparatus and method of manufactuing the same |
DE10345470A1 (en) * | 2003-09-30 | 2004-12-30 | Infineon Technologies Ag | Semiconductor chip wafer contact structure has cup shaped test contact surfaces and active connection multiplexer circuit in sawing grid areas |
US20050067709A1 (en) * | 2003-09-30 | 2005-03-31 | Bachman Mark Adam | Methods and system for reinforcing a bond pad |
US20060091536A1 (en) * | 2004-11-02 | 2006-05-04 | Tai-Chun Huang | Bond pad structure with stress-buffering layer capping interconnection metal layer |
US20070164279A1 (en) * | 2005-12-05 | 2007-07-19 | Megica Corporation | Semiconductor chip |
US20070212869A1 (en) * | 2006-03-07 | 2007-09-13 | Chiu-Ming Chou | Wire bonding method for preventing polymer cracking |
US20070262457A1 (en) * | 1998-12-21 | 2007-11-15 | Mou-Shiung Lin | Top layers of metal for high performance IC's |
US20070275503A1 (en) * | 2006-05-18 | 2007-11-29 | Megica Corporation | Method for fabricating chip package |
US20080042280A1 (en) * | 2006-06-28 | 2008-02-21 | Megica Corporation | Semiconductor chip structure |
US20080050912A1 (en) * | 1998-12-21 | 2008-02-28 | Megica Corporation | Chip structure and process for forming the same |
US20080048328A1 (en) * | 2001-12-13 | 2008-02-28 | Megica Corporation | Chip structure and process for forming the same |
US20080093729A1 (en) * | 2006-10-20 | 2008-04-24 | Dirk Siepe | Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate |
US20080121943A1 (en) * | 1998-12-21 | 2008-05-29 | Mou-Shiung Lin | Top layers of metal for integrated circuits |
US20080224326A1 (en) * | 2003-12-08 | 2008-09-18 | Megica Corporation | Chip structure with bumps and testing pads |
US20080246154A1 (en) * | 1998-12-21 | 2008-10-09 | Megica Corporation | Top layers of metal for high performance IC's |
US20080284014A1 (en) * | 2007-03-13 | 2008-11-20 | Megica Corporation | Chip assembly |
US7595225B1 (en) * | 2004-10-05 | 2009-09-29 | Chun Ho Fan | Leadless plastic chip carrier with contact standoff |
US20100224987A1 (en) * | 2006-01-24 | 2010-09-09 | Nxp B.V. | Stress buffering package for a semiconductor component |
US7919412B2 (en) | 2004-07-16 | 2011-04-05 | Megica Corporation | Over-passivation process of forming polymer layer over IC chip |
US7960825B2 (en) | 2006-09-06 | 2011-06-14 | Megica Corporation | Chip package and method for fabricating the same |
US7973401B2 (en) | 2005-05-03 | 2011-07-05 | Megica Corporation | Stacked chip package with redistribution lines |
US8030775B2 (en) | 2007-08-27 | 2011-10-04 | Megica Corporation | Wirebond over post passivation thick metal |
USRE43674E1 (en) | 2000-10-18 | 2012-09-18 | Megica Corporation | Post passivation metal scheme for high-performance integrated circuit devices |
US20130105935A1 (en) * | 2008-12-10 | 2013-05-02 | Kenji Yokoyama | Semiconductor integrated circuit device and method for designing the same |
US20140252627A1 (en) * | 2007-09-28 | 2014-09-11 | Infineon Technologies Austria Ag | Semiconductor component comprising copper metallizations |
CN105655312A (en) * | 2009-07-31 | 2016-06-08 | 格罗方德半导体公司 | Semiconductor including stress buffer material formed on low-K metalized system |
US20180233571A1 (en) * | 2017-02-15 | 2018-08-16 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
CN110785375A (en) * | 2017-06-23 | 2020-02-11 | 罗伯特·博世有限公司 | Bonding pad system, gas sensor and method for manufacturing gas sensor |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6437425B1 (en) * | 2000-01-18 | 2002-08-20 | Agere Systems Guardian Corp | Semiconductor devices which utilize low K dielectrics |
JP2001284360A (en) * | 2000-03-31 | 2001-10-12 | Hitachi Ltd | Semiconductor device |
KR100343284B1 (en) * | 2000-06-23 | 2002-07-15 | 윤종용 | Bonding pad structure in semiconductor device and fabrication method thereof |
JP2002164437A (en) * | 2000-07-27 | 2002-06-07 | Texas Instruments Inc | Integrated power circuit with dispersed bonding and current distribution and its method |
EP1306898A1 (en) * | 2001-10-29 | 2003-05-02 | Dialog Semiconductor GmbH | Sub-milliohm on-chip interconnection |
US6617655B1 (en) * | 2002-04-05 | 2003-09-09 | Fairchild Semiconductor Corporation | MOSFET device with multiple gate contacts offset from gate contact area and over source area |
US20030234436A1 (en) * | 2002-06-19 | 2003-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with a spiral inductor and magnetic material |
DE10229493B4 (en) * | 2002-07-01 | 2007-03-29 | Infineon Technologies Ag | Integrated semiconductor structure |
US7495343B1 (en) | 2003-07-31 | 2009-02-24 | Nvidia Corporation | Pad over active circuit system and method with frame support structure |
US7453158B2 (en) * | 2003-07-31 | 2008-11-18 | Nvidia Corporation | Pad over active circuit system and method with meshed support structure |
DE10337569B4 (en) * | 2003-08-14 | 2008-12-11 | Infineon Technologies Ag | Integrated connection arrangement and manufacturing method |
JP2005085939A (en) | 2003-09-08 | 2005-03-31 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
US7372153B2 (en) * | 2003-10-07 | 2008-05-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Integrated circuit package bond pad having plurality of conductive members |
US7038280B2 (en) * | 2003-10-28 | 2006-05-02 | Analog Devices, Inc. | Integrated circuit bond pad structures and methods of making |
US7241636B2 (en) * | 2005-01-11 | 2007-07-10 | Freescale Semiconductor, Inc. | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance |
US7247552B2 (en) * | 2005-01-11 | 2007-07-24 | Freescale Semiconductor, Inc. | Integrated circuit having structural support for a flip-chip interconnect pad and method therefor |
WO2006134643A1 (en) * | 2005-06-14 | 2006-12-21 | Renesas Technology Corp. | Semiconductor device and method for manufacturing same |
JP2007059867A (en) * | 2005-07-26 | 2007-03-08 | Matsushita Electric Ind Co Ltd | Semiconductor device |
US7205673B1 (en) * | 2005-11-18 | 2007-04-17 | Lsi Logic Corporation | Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
US20070267748A1 (en) * | 2006-05-16 | 2007-11-22 | Tran Tu-Anh N | Integrated circuit having pads and input/output (i/o) cells |
US7808117B2 (en) * | 2006-05-16 | 2010-10-05 | Freescale Semiconductor, Inc. | Integrated circuit having pads and input/output (I/O) cells |
US7605435B2 (en) * | 2006-07-10 | 2009-10-20 | Great Wall Semiconductor Corporation | Bi-directional MOSFET power switch with single metal layer |
US7612457B2 (en) * | 2007-06-21 | 2009-11-03 | Infineon Technologies Ag | Semiconductor device including a stress buffer |
JP5034740B2 (en) | 2007-07-23 | 2012-09-26 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
DE102008041873A1 (en) | 2008-09-08 | 2010-03-11 | Biotronik Crm Patent Ag | LTCC substrate structure and method of making the same |
CN103295992A (en) * | 2008-10-10 | 2013-09-11 | 住友电木株式会社 | Semiconductor device |
JP5820437B2 (en) * | 2008-12-03 | 2015-11-24 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
JP5331610B2 (en) | 2008-12-03 | 2013-10-30 | ルネサスエレクトロニクス株式会社 | Semiconductor integrated circuit device |
US8436251B2 (en) * | 2009-07-08 | 2013-05-07 | Medtronic, Inc. | Ribbon connecting electrical components |
DE102010062453A1 (en) * | 2010-12-06 | 2012-06-06 | Robert Bosch Gmbh | Semiconductor device with increased stability to thermo-mechanical influences and method for contacting a semiconductor |
US9646899B2 (en) * | 2012-09-13 | 2017-05-09 | Micron Technology, Inc. | Interconnect assemblies with probed bond pads |
JP5772926B2 (en) * | 2013-01-07 | 2015-09-02 | 株式会社デンソー | Semiconductor device |
JP6062393B2 (en) * | 2014-05-12 | 2017-01-18 | 株式会社豊田中央研究所 | Semiconductor device manufacturing method and semiconductor device |
US10431494B2 (en) * | 2018-01-29 | 2019-10-01 | International Business Machines Corporation | BEOL self-aligned interconnect structure |
CN108511350B (en) * | 2018-05-14 | 2020-09-01 | 南京溧水高新创业投资管理有限公司 | Packaging method of power device and power device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5975639A (en) * | 1982-10-25 | 1984-04-28 | Nec Corp | Semiconductor integrated circuit device |
US5719448A (en) * | 1989-03-07 | 1998-02-17 | Seiko Epson Corporation | Bonding pad structures for semiconductor integrated circuits |
US5175609A (en) * | 1991-04-10 | 1992-12-29 | International Business Machines Corporation | Structure and method for corrosion and stress-resistant interconnecting metallurgy |
US5565378A (en) * | 1992-02-17 | 1996-10-15 | Mitsubishi Denki Kabushiki Kaisha | Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution |
US5367195A (en) * | 1993-01-08 | 1994-11-22 | International Business Machines Corporation | Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
EP0637840A1 (en) * | 1993-08-05 | 1995-02-08 | AT&T Corp. | Integrated circuit with active devices under bond pads |
JP3432284B2 (en) * | 1994-07-04 | 2003-08-04 | 三菱電機株式会社 | Semiconductor device |
US5705427A (en) * | 1994-12-22 | 1998-01-06 | Sgs-Thomson Microelectronics, Inc. | Method of forming a landing pad structure in an integrated circuit |
US5661082A (en) * | 1995-01-20 | 1997-08-26 | Motorola, Inc. | Process for forming a semiconductor device having a bond pad |
JPH08213422A (en) * | 1995-02-07 | 1996-08-20 | Mitsubishi Electric Corp | Semiconductor device and bonding pad structure thereof |
US5965903A (en) * | 1995-10-30 | 1999-10-12 | Lucent Technologies Inc. | Device and method of manufacture for an integrated circuit having a BIST circuit and bond pads incorporated therein |
JP3457123B2 (en) * | 1995-12-07 | 2003-10-14 | 株式会社リコー | Semiconductor device |
US5700735A (en) * | 1996-08-22 | 1997-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming bond pad structure for the via plug process |
US6016000A (en) * | 1998-04-22 | 2000-01-18 | Cvc, Inc. | Ultra high-speed chip semiconductor integrated circuit interconnect structure and fabrication method using free-space dielectrics |
US6031293A (en) * | 1999-04-26 | 2000-02-29 | United Microelectronics Corporation | Package-free bonding pad structure |
-
1999
- 1999-12-08 JP JP11349152A patent/JP2000183104A/en active Pending
- 1999-12-10 US US09/458,593 patent/US6384486B2/en not_active Expired - Lifetime
- 1999-12-14 EP EP99204298A patent/EP1017098A3/en not_active Ceased
- 1999-12-14 KR KR1019990057359A patent/KR20000048115A/en not_active Application Discontinuation
Cited By (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070290348A1 (en) * | 1998-12-21 | 2007-12-20 | Mou-Shiung Lin | Top layers of metal for high performance IC's |
US8304907B2 (en) | 1998-12-21 | 2012-11-06 | Megica Corporation | Top layers of metal for integrated circuits |
US20100117236A1 (en) * | 1998-12-21 | 2010-05-13 | Megica Corporation | Top layers of metal for high performance ic's |
US7863654B2 (en) | 1998-12-21 | 2011-01-04 | Megica Corporation | Top layers of metal for high performance IC's |
US8471384B2 (en) | 1998-12-21 | 2013-06-25 | Megica Corporation | Top layers of metal for high performance IC's |
US7884479B2 (en) | 1998-12-21 | 2011-02-08 | Megica Corporation | Top layers of metal for high performance IC's |
US8350386B2 (en) | 1998-12-21 | 2013-01-08 | Megica Corporation | Top layers of metal for high performance IC's |
US20070290368A1 (en) * | 1998-12-21 | 2007-12-20 | Mou-Shiung Lin | Top layers of metal for high performance IC's |
US7906849B2 (en) | 1998-12-21 | 2011-03-15 | Megica Corporation | Chip structure and process for forming the same |
US8138079B2 (en) | 1998-12-21 | 2012-03-20 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
US8035227B2 (en) | 1998-12-21 | 2011-10-11 | Megica Corporation | Top layers of metal for high performance IC's |
US8022546B2 (en) | 1998-12-21 | 2011-09-20 | Megica Corporation | Top layers of metal for high performance IC's |
US8022545B2 (en) | 1998-12-21 | 2011-09-20 | Megica Corporation | Top layers of metal for high performance IC's |
US20090045516A1 (en) * | 1998-12-21 | 2009-02-19 | Megica Corporation | TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC's |
US20070262457A1 (en) * | 1998-12-21 | 2007-11-15 | Mou-Shiung Lin | Top layers of metal for high performance IC's |
US20070262456A1 (en) * | 1998-12-21 | 2007-11-15 | Mou-Shiung Lin | Top layers of metal for high performance IC's |
US7999384B2 (en) | 1998-12-21 | 2011-08-16 | Megica Corporation | Top layers of metal for high performance IC's |
US7906422B2 (en) | 1998-12-21 | 2011-03-15 | Megica Corporation | Chip structure and process for forming the same |
US20070284750A1 (en) * | 1998-12-21 | 2007-12-13 | Mou-Shiung Lin | Top layers of metal for high performance IC's |
US20070290351A1 (en) * | 1998-12-21 | 2007-12-20 | Mou-Shiung Lin | Top layers of metal for high performance IC's |
US8531038B2 (en) | 1998-12-21 | 2013-09-10 | Megica Corporation | Top layers of metal for high performance IC's |
US20080246154A1 (en) * | 1998-12-21 | 2008-10-09 | Megica Corporation | Top layers of metal for high performance IC's |
US8415800B2 (en) | 1998-12-21 | 2013-04-09 | Megica Corporation | Top layers of metal for high performance IC's |
US20080136034A1 (en) * | 1998-12-21 | 2008-06-12 | Megica Corporation | Chip structure and process for forming the same |
US20080121943A1 (en) * | 1998-12-21 | 2008-05-29 | Mou-Shiung Lin | Top layers of metal for integrated circuits |
US20080050912A1 (en) * | 1998-12-21 | 2008-02-28 | Megica Corporation | Chip structure and process for forming the same |
US20080124918A1 (en) * | 1998-12-21 | 2008-05-29 | Megica Corporation | Chip structure and process for forming the same |
US7915157B2 (en) | 1998-12-21 | 2011-03-29 | Megica Corporation | Chip structure and process for forming the same |
US6680545B2 (en) * | 2000-07-31 | 2004-01-20 | Koninklijke Philips Electronics N.V. | Semiconductor devices |
USRE43674E1 (en) | 2000-10-18 | 2012-09-18 | Megica Corporation | Post passivation metal scheme for high-performance integrated circuit devices |
US7919867B2 (en) | 2001-12-13 | 2011-04-05 | Megica Corporation | Chip structure and process for forming the same |
US7915734B2 (en) | 2001-12-13 | 2011-03-29 | Megica Corporation | Chip structure and process for forming the same |
US20080142978A1 (en) * | 2001-12-13 | 2008-06-19 | Megica Corporation | Chip structure and process for forming the same |
US20080122099A1 (en) * | 2001-12-13 | 2008-05-29 | Megica Corporation | Chip structure and process for forming the same |
US20080142979A1 (en) * | 2001-12-13 | 2008-06-19 | Megica Corporation | Chip structure and process for forming the same |
US8008776B2 (en) | 2001-12-13 | 2011-08-30 | Megica Corporation | Chip structure and process for forming the same |
US7932603B2 (en) | 2001-12-13 | 2011-04-26 | Megica Corporation | Chip structure and process for forming the same |
US20080048328A1 (en) * | 2001-12-13 | 2008-02-28 | Megica Corporation | Chip structure and process for forming the same |
US8546947B2 (en) | 2001-12-13 | 2013-10-01 | Megica Corporation | Chip structure and process for forming the same |
US20030132516A1 (en) * | 2002-01-15 | 2003-07-17 | Yasufumi Uchida | Semiconductor device and manufacturing method thereof |
US7317244B2 (en) * | 2002-01-15 | 2008-01-08 | Oki Electric Industry Co., Ltd. | Semiconductor device and manufacturing method thereof |
US20080045003A1 (en) * | 2002-10-15 | 2008-02-21 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
US20040070042A1 (en) * | 2002-10-15 | 2004-04-15 | Megic Corporation | Method of wire bonding over active area of a semiconductor circuit |
US20070164452A1 (en) * | 2002-10-15 | 2007-07-19 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
US8026588B2 (en) * | 2002-10-15 | 2011-09-27 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
US8021976B2 (en) * | 2002-10-15 | 2011-09-20 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
US7521812B2 (en) * | 2002-10-15 | 2009-04-21 | Megica Corp. | Method of wire bonding over active area of a semiconductor circuit |
US9153555B2 (en) * | 2002-10-15 | 2015-10-06 | Qualcomm Incorporated | Method of wire bonding over active area of a semiconductor circuit |
US20070164453A1 (en) * | 2002-10-15 | 2007-07-19 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
US9142527B2 (en) | 2002-10-15 | 2015-09-22 | Qualcomm Incorporated | Method of wire bonding over active area of a semiconductor circuit |
US8742580B2 (en) | 2002-10-15 | 2014-06-03 | Megit Acquisition Corp. | Method of wire bonding over active area of a semiconductor circuit |
US20070273031A1 (en) * | 2002-10-15 | 2007-11-29 | Jin-Yuan Lee | Method of wire bonding over active area of a semiconductor circuit |
US20040227237A1 (en) * | 2003-03-19 | 2004-11-18 | Naohiro Ueda | Semiconductor apparatus and method of manufactuing the same |
GB2406707B (en) * | 2003-09-30 | 2006-10-11 | Agere Systems Inc | Methods and system for reinforcing a bond pad |
US6960836B2 (en) | 2003-09-30 | 2005-11-01 | Agere Systems, Inc. | Reinforced bond pad |
US20050067709A1 (en) * | 2003-09-30 | 2005-03-31 | Bachman Mark Adam | Methods and system for reinforcing a bond pad |
GB2406707A (en) * | 2003-09-30 | 2005-04-06 | Agere Systems Inc | Reinforcing bond pads for integrated circuits |
DE10345470A1 (en) * | 2003-09-30 | 2004-12-30 | Infineon Technologies Ag | Semiconductor chip wafer contact structure has cup shaped test contact surfaces and active connection multiplexer circuit in sawing grid areas |
US20080224326A1 (en) * | 2003-12-08 | 2008-09-18 | Megica Corporation | Chip structure with bumps and testing pads |
US7855461B2 (en) | 2003-12-08 | 2010-12-21 | Megica Corporation | Chip structure with bumps and testing pads |
US7919412B2 (en) | 2004-07-16 | 2011-04-05 | Megica Corporation | Over-passivation process of forming polymer layer over IC chip |
US7595225B1 (en) * | 2004-10-05 | 2009-09-29 | Chun Ho Fan | Leadless plastic chip carrier with contact standoff |
US7741714B2 (en) * | 2004-11-02 | 2010-06-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bond pad structure with stress-buffering layer capping interconnection metal layer |
US20060091536A1 (en) * | 2004-11-02 | 2006-05-04 | Tai-Chun Huang | Bond pad structure with stress-buffering layer capping interconnection metal layer |
US8426958B2 (en) | 2005-05-03 | 2013-04-23 | Megica Corporation | Stacked chip package with redistribution lines |
US7973401B2 (en) | 2005-05-03 | 2011-07-05 | Megica Corporation | Stacked chip package with redistribution lines |
US7947978B2 (en) | 2005-12-05 | 2011-05-24 | Megica Corporation | Semiconductor chip with bond area |
US20110198589A1 (en) * | 2005-12-05 | 2011-08-18 | Megica Corporation | Semiconductor chip |
US8304766B2 (en) | 2005-12-05 | 2012-11-06 | Megica Corporation | Semiconductor chip with a bonding pad having contact and test areas |
US20070164279A1 (en) * | 2005-12-05 | 2007-07-19 | Megica Corporation | Semiconductor chip |
US20100224987A1 (en) * | 2006-01-24 | 2010-09-09 | Nxp B.V. | Stress buffering package for a semiconductor component |
US8338967B2 (en) * | 2006-01-24 | 2012-12-25 | Nxp B.V. | Stress buffering package for a semiconductor component |
US20070212869A1 (en) * | 2006-03-07 | 2007-09-13 | Chiu-Ming Chou | Wire bonding method for preventing polymer cracking |
US8344524B2 (en) | 2006-03-07 | 2013-01-01 | Megica Corporation | Wire bonding method for preventing polymer cracking |
US20070275503A1 (en) * | 2006-05-18 | 2007-11-29 | Megica Corporation | Method for fabricating chip package |
US8420520B2 (en) | 2006-05-18 | 2013-04-16 | Megica Corporation | Non-cyanide gold electroplating for fine-line gold traces and gold pads |
US8421227B2 (en) | 2006-06-28 | 2013-04-16 | Megica Corporation | Semiconductor chip structure |
US20080042280A1 (en) * | 2006-06-28 | 2008-02-21 | Megica Corporation | Semiconductor chip structure |
US20110215446A1 (en) * | 2006-09-06 | 2011-09-08 | Megica Corporation | Chip package and method for fabricating the same |
US7960825B2 (en) | 2006-09-06 | 2011-06-14 | Megica Corporation | Chip package and method for fabricating the same |
US8436449B2 (en) | 2006-09-06 | 2013-05-07 | Megica Corporation | Chip package and method for fabricating the same |
US20080093729A1 (en) * | 2006-10-20 | 2008-04-24 | Dirk Siepe | Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate |
US8164176B2 (en) | 2006-10-20 | 2012-04-24 | Infineon Technologies Ag | Semiconductor module arrangement |
US8193636B2 (en) | 2007-03-13 | 2012-06-05 | Megica Corporation | Chip assembly with interconnection by metal bump |
US20080284014A1 (en) * | 2007-03-13 | 2008-11-20 | Megica Corporation | Chip assembly |
US8030775B2 (en) | 2007-08-27 | 2011-10-04 | Megica Corporation | Wirebond over post passivation thick metal |
US20140252627A1 (en) * | 2007-09-28 | 2014-09-11 | Infineon Technologies Austria Ag | Semiconductor component comprising copper metallizations |
US10347580B2 (en) * | 2007-09-28 | 2019-07-09 | Infineon Technologies Austria Ag | Semiconductor component comprising copper metallizations |
US20130105935A1 (en) * | 2008-12-10 | 2013-05-02 | Kenji Yokoyama | Semiconductor integrated circuit device and method for designing the same |
US8759941B2 (en) * | 2008-12-10 | 2014-06-24 | Panasonic Corporation | Semiconductor integrated circuit device and method for designing the same |
CN105655312A (en) * | 2009-07-31 | 2016-06-08 | 格罗方德半导体公司 | Semiconductor including stress buffer material formed on low-K metalized system |
US20180233571A1 (en) * | 2017-02-15 | 2018-08-16 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
US10115798B2 (en) * | 2017-02-15 | 2018-10-30 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
CN110785375A (en) * | 2017-06-23 | 2020-02-11 | 罗伯特·博世有限公司 | Bonding pad system, gas sensor and method for manufacturing gas sensor |
Also Published As
Publication number | Publication date |
---|---|
EP1017098A2 (en) | 2000-07-05 |
EP1017098A3 (en) | 2001-04-11 |
KR20000048115A (en) | 2000-07-25 |
US6384486B2 (en) | 2002-05-07 |
JP2000183104A (en) | 2000-06-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6384486B2 (en) | Bonding over integrated circuits | |
US6232662B1 (en) | System and method for bonding over active integrated circuits | |
EP1176640B1 (en) | Contact structure of an integrated power circuit | |
KR101203220B1 (en) | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | |
US6614091B1 (en) | Semiconductor device having a wire bond pad and method therefor | |
US7276797B2 (en) | Structure and method for fabricating a bond pad structure | |
US6800555B2 (en) | Wire bonding process for copper-metallized integrated circuits | |
US7514292B2 (en) | Individualized low parasitic power distribution lines deposited over active integrated circuits | |
US7592205B2 (en) | Over-passivation process of forming polymer layer over IC chip | |
US20010033020A1 (en) | Structure and method for bond pads of copper-metallized integrated circuits | |
US7351651B2 (en) | Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits | |
US20060094228A1 (en) | Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits | |
US20070187837A1 (en) | Active area bonding compatible high current structures | |
US20080111244A1 (en) | Copper-metallized integrated circuits having an overcoat for protecting bondable metal contacts and improving mold compound adhesion | |
US7061114B2 (en) | Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits | |
US20020068385A1 (en) | Method for forming anchored bond pads in semiconductor devices and devices formed | |
US20050224987A1 (en) | Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits | |
US20240047345A1 (en) | Semiconductor structure and method of manufacturing the same | |
KR20070022032A (en) | Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: TEXAS INSTRUMENTS INCORPORATED, TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZUNIGA, EDGAR R.;CIANI, SAMUEL A.;REEL/FRAME:010463/0494;SIGNING DATES FROM 19981217 TO 19981218 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |