US20010040090A1 - Plating pretreatment apparatus and plating treatment apparatus - Google Patents
Plating pretreatment apparatus and plating treatment apparatus Download PDFInfo
- Publication number
- US20010040090A1 US20010040090A1 US09/765,742 US76574201A US2001040090A1 US 20010040090 A1 US20010040090 A1 US 20010040090A1 US 76574201 A US76574201 A US 76574201A US 2001040090 A1 US2001040090 A1 US 2001040090A1
- Authority
- US
- United States
- Prior art keywords
- anode
- plating
- cathode
- treated
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Definitions
- the present invention relates to a plating pretreatment apparatus used when plating treatment is given to the inner peripheral surface of an object to be treated formed into a cylindrical shape such as a cylinder block, and also relates to a plating treatment apparatus used when high-speed plating treatment is given to the inner peripheral surface of an object to be treated formed into a cylindrical shape such as a cylinder block.
- plating pretreatment is done, for example, by electrolytic etching to improve the adhesion of plating film to a base material.
- electrolytic etching As the condition values of liquid temperature, flow rate, and electric current amount increase, the etching amount increases.
- plating film formed in a portion where the etching amount is small has a lower adhesion than that formed in a portion where the etching amount is large, so that variations in adhesion of plating film between portions also occur. Therefore, it has so far been difficult to apply plating pretreatment by means of electrolytic etching to a cylinder block.
- anode-cathode distance between the electrode and the object to be treated is short, the flow of plating liquid in a gap between the object to be treated and the anode is liable to be nonuniform, so that a fault of plating film such as burnt deposit develops, and therefore good plating treatment cannot be done.
- an anode in which soluble nickel pellets are housed in a lath-shaped titanium basket has so far been used.
- the thickness of plating film formed on the inner peripheral surface of the object to be treated is made nonuniform by the wavy shape of the outer peripheral surface of the anode when the anode-cathode distance is as short as 1 to 5 mm. Therefore, good plating treatment cannot be done.
- the present invention has been made to solve the above problems, and accordingly an object thereof is to provide a plating pretreatment apparatus which can etch a cylindrical object to be treated such as a cylinder block uniformly, and can also be used for a multi-cylinder cylinder block uniformly without variations between cylinders, and a plating treatment apparatus which can cause a plating liquid to flow between an anode and an object to be treated, and can also be used for a multi-cylinder cylinder block.
- the present invention provides a plating pretreatment apparatus in which a cylindrical cathode is disposed in a fixing jig in which a hollow portion is formed, and a cylindrical object to be treated is installed on the fixing jig so that the cathode is arranged in the object to be treated, wherein a lower cathode of the cathode is formed so as to have a smaller diameter than an upper cathode, whereby the volume of a lower void formed between the lower cathode and the fixing jig is made larger than that of an upper void formed between the upper cathode and the object to be treated.
- a plating pretreatment liquid flows at a uniform flow velocity in the object to be treated, uniform etching can be performed over the whole inside surface of the object to be treated, and adhesion of plating film is improved, resulting in a decrease in poor adhesion.
- the cathode is configured so as to be capable of being divided into the upper cathode and lower cathode.
- thermometer is arranged in each cylinder.
- the present invention provides a plating treatment apparatus in which a plating liquid is sent from a plating liquid tank into an anode, in which a hollow portion into which the plating liquid is sent is formed, in a state in which an electrical current is caused to flow in a cylindrical object to be treated and the anode, is discharged into the object to be treated through a top end of the anode, is caused to flow between the outside surface of the anode and the inside surface of the object to be treated, is further caused to flow between the outside surface of the anode and the inside surface of an outlet jig, and is returned to the plating liquid tank, whereby the inside surface of the object to be treated is plated, wherein the diameter of a lower anode of the anode, which is disposed in a hollow portion of the outlet jig, is made smaller than the diameter of an upper anode disposed in the object to be treated.
- anode-cathode distance between the outside surface of the anode and the inside surface of the outlet jig is made larger than an anode-cathode distance between the outside surface of the anode and the inside surface of the object to be treated, a buffering effect is produced in the outlet jig, so that the plating liquid flows uniformly in the object to be treated. Therefore, when high-speed plating is performed, a fault of plating such as burnt deposit can be restrained, and a shortened treatment time and a reduced treatment cost can be achieved.
- the above-described plating treating apparatus preferably has a construction in which the outlet jig, in which a hollow portion is formed, for installing a cylindrical object to be treated on a top face thereof, the cylindrical anode disposed so that the top end thereof projects from the top face of the outlet jig, and the plating liquid tank connected to the anode and the outlet jig through pipes are included, and the cylindrical object to be treated is installed on the top face of the outlet jig and the upper side of the anode is arranged in the object to be treated.
- an insoluble anode is used as the anode.
- the anode-cathode distance can further be decreased, so that the plating treatment time can further be shortened.
- the anode-cathode distance can be decreased to 1 to 5 mm, although the conventional anode-cathode distance needs to be 5 mm and larger.
- the anode is configured so as to be capable of being divided into the upper anode and lower anode.
- a plurality of hollow portions of the outlet jig and anodes are provided, whereby plating treatment can also be given to a multi-cylinder engine.
- a buffering effect is produced by the lower void formed in the fixing jig, so that the plating pretreatment liquid flows uniformly in the object to be treated. Therefore, when high-speed plating is performed, a fault of plating such as burnt deposit can be restrained, and a shortened treatment time and a reduced treatment cost can be achieved.
- the plating treatment apparatus in accordance with the present invention, a buffering effect is produced in the outlet jig, so that the plating liquid flows uniformly in the object to be treated. Therefore, when high-speed plating is performed, a fault of plating such as burnt deposit can be restrained, and a shortened treatment time and a reduced treatment cost can be achieved.
- FIG. 1 is a sectional view of a plating pretreatment apparatus in accordance with the present invention.
- FIG. 2 is a sectional view of a plating treatment apparatus in accordance with the present invention, in which the diameter of a lower anode is smaller than that of an upper anode;
- FIG. 3 is a sectional view of a plating treatment apparatus using an anode having lower and upper portions with the same diameter.
- a plating pretreatment apparatus 1 in accordance with the embodiment of the present invention includes, as shown in FIG. 1, a fixing jig 3 in which a hollow portion is formed, a cylindrical cathode 10 disposed in the fixing jig 3 so that a top end 6 thereof projects from a top face 8 of the fixing jig 3 , a plating pretreatment liquid tank 15 connected to the fixing jig 3 and the cathode 10 via pipes 12 and 13 , respectively, power sources 19 and 20 connected to a cylinder block 17 , which is an object to be treated, and the cathode 10 , respectively, and a thermometer 25 disposed in a crankcase portion 23 of the cylinder block 17 .
- the fixing jig 3 is surrounded by a side plate 27 formed into a cylindrical shape and a bottom plate 28 , and the hollow portion is formed by the side plate 27 and the bottom plate 28 .
- the diameter of the hollow portion is made about equal to the diameter of a hollow portion of a cylinder bore 30 of the cylinder block 17 , and a sealing member 31 is disposed on the top face 8 of the side plate 27 .
- a sealing member 31 a material that has elasticity so as to be capable of maintaining sealing ability with respect to the cylinder block 17 is preferably used.
- an inflow port 33 is provided at the lower part of the fixing jig 3 , and the fixing jig 3 is connected to the plating pretreatment liquid tank 15 through the inflow port 33 via the pipe 12 .
- a pump 34 In a halfway position of the pipe 12 is disposed a pump 34 which can deliver under pressure a pretreatment liquid 37 in the pretreatment liquid tank 15 .
- the cathode 10 which is formed into a cylindrical shape in which the interior is hollow, is disposed vertically so as to penetrate the hollow portions of the cylinder block 17 and the fixing jig 3 .
- the cathode 10 is divided into two parts, upper and lower, that are constructed detachably.
- a top end 40 a of a lower cathode 40 disposed on the lower side has a height about equal to the height of the top face 8 of the fixing jig 3
- the top end 6 of an upper cathode 41 disposed on the upper side is positioned at a height about equal to the height of an edge 23 a of the crankcase portion 23 of the cylinder block 17 .
- the diameter of the lower cathode 40 is made smaller than the diameter of the upper cathode 41 .
- the diameter of the lower cathode 40 has only to be slightly smaller than that of the upper cathode 41 , the dimensional difference between the diameters should preferably be, for example, 5 mm and larger.
- the diameter thereof is expanded to a diameter about equal to the diameter at the lower end of the upper cathode 41 .
- an upper void 44 formed between the outer peripheral surface of the upper cathode 41 and the inside surface of the cylinder bore 30 has a smaller volume than a lower void 45 formed between the outer peripheral surface of the lower cathode 40 and the inner side surface of the fixing jig 3 .
- an outflow port 48 At the lower end of the lower cathode 40 is provided an outflow port 48 .
- the pipe 12 extending from the inflow port 33 of the fixing jig 3 is connected to the plating pretreatment liquid tank 15 via the pump 34 , and also the plating pretreatment liquid tank 15 is connected to the outflow port 48 of the lower cathode 40 through the pipe 13 .
- the pretreatment liquid 37 is fed from the plating pretreatment liquid tank 15 to the lower void 45 of the fixing jig 3 , and rises up to the upper void 44 .
- the pretreatment liquid 37 flows into the upper cathode 41 through the top end 6 of the upper cathode 41 , and returns to the plating pretreatment liquid tank 15 through the outflow port 48 of the lower cathode 40 .
- An object to be treated that is capable of being treated by the above-described plating pretreatment apparatus 1 is a cylindrical part in which a hollow portion is formed, such as the cylinder block 17 , as shown in FIG. 1, and plating pretreatment is given to the inside surface of the hollow portion.
- the cylinder block 17 is installed on the plating pretreatment apparatus 1 in a vertically inverted state. That is to say, for the cylinder block 17 in a state of being mounted on a vehicle, the lower side thereof is the crankcase portion 23 whose lower part spreads outward, and the upper side is a cylinder head, the cylinder bore 30 that slidably houses a piston, not shown, being formed in the cylinder head. Therefore, when the cylinder block 17 is turned over, the upper side is the crankcase portion 23 , and the lower side is a cylinder head face.
- the cylinder head face of the cylinder block 17 is brought into contact with the sealing member 31 disposed on the fixing jig 3 , and the lower face of the crankcase portion 23 is brought into contact with a sealing member 50 , whereby both of the upper and lower ends of the cylinder block 17 are sealed.
- the pretreatment liquid 37 is sent from the plating pretreatment liquid tank 15 to the lower void 45 of the fixing jig 3 through the pipe 12 by a driving force of the pump 34 . Then, the pretreatment liquid 37 rises from the lower void 45 to the upper void 44 . Since the lower void 45 has a larger volume than the upper void 45 , the lower void 45 plays a role of a so-called buffer. Therefore, the flow velocity of the pretreatment liquid 37 rising along the upper void 44 is uniformed, so that the whole inside surface of the cylinder bore 30 uniformly undergoes electrolytic etching.
- the pretreatment liquid 37 overflows and flows into the upper cathode 41 through an opening formed at the top end 6 of the upper cathode 41 , and then is sent to the plating pretreatment liquid tank 15 through the outflow port 48 of the lower cathode 40 via the pipe 13 .
- a plating treatment apparatus 101 in accordance with the embodiment of the present invention includes, as shown in FIG. 2, an outlet jig 103 in which a hollow portion 105 is formed, a cylindrical anode 110 disposed in the hollow portion 105 of the outlet jig 103 so that a top end 106 thereof projects from a top face 108 of the outlet jig 103 , a plating liquid tank 115 connected to the outlet jig 103 and the anode 110 via pipes 112 and 113 , respectively, and power sources 119 and 120 connected to a cylinder block 117 , which is an object to be treated, and the anode 110 , respectively.
- the outlet jig 103 is surrounded by a side plate 122 formed into a cylindrical shape and a bottom plate 123 , and a thin sealing material 125 is disposed on the top face 108 of the side plate 122 .
- a sealing material 125 a material that has elasticity so as to be capable of maintaining sealing ability with respect to the cylinder block 117 is preferably used.
- a plating liquid outflow port 126 is provided at the lower part of the outlet jig 103 , and the outlet jig 103 is connected to the plating liquid tank 115 through the plating liquid outflow port 126 via the pipe 112 .
- the anode 110 which is formed into a cylindrical shape in which the interior is hollow, is disposed vertically so as to penetrate a hollow portion 128 of the cylinder block 117 and the hollow portion 105 of the outlet jig 103 .
- the anode 110 which is an insoluble anode, is divided into two parts, upper and lower, that are constructed detachably.
- a top end 130 a of a lower anode 130 disposed on the lower side has a height about equal to the height of the top face 108 of the outlet jig 103 , and the top end 106 of an upper anode 131 disposed on the upper side is positioned at a height about equal to the height of an edge 133 a of a crankcase portion 133 of the cylinder block 117 , which is an object to be treated.
- the diameter of the lower anode 130 is made smaller than the diameter of the upper anode 131 .
- the diameter of the lower anode 130 has only to be slightly smaller than that of the upper anode 131 , the dimensional difference between the diameters should preferably be, for example, 10 mm and larger.
- anode 110 for example, an anode in which the surface of a cylindrical base material composed of titanium is plated with platinum, an anode of clad material in which a thin sheet composed of platinum is bonded to a cylindrical base material composed of titanium, or an anode in which the surface of a cylindrical base material composed of titanium is coated with iridium oxide film can preferably used.
- an anode-cathode distance that is a gap (distance) between the outer peripheral surface of the upper anode 131 and the inside surface of the cylinder block 117 is made smaller than an anode-cathode distance that is a gap (distance) between the outer peripheral surface of the lower anode 130 and the inside surface of the outlet jig 103 .
- the upper anode 131 is arranged in a state of being separated from the inside surface of a cylinder bore in the cylinder block 117 with a gap of 1 to 5 mm formed therebetween and substantially in parallel with the inside surface of the cylinder bore.
- a plating liquid outflow port 135 is provided at the lower end of the lower anode 130 .
- the pipe 112 extending from the plating liquid outflow port 126 of the outlet jig 103 is connected to the plating liquid tank 115 , and also the plating liquid tank 115 is connected to the lower end of the lower anode 130 through the pipe 113 via a pump 136 .
- a plating liquid 138 is fed from the plating liquid tank 115 to the anode 110 , and after plating treatment is given to the inside surface of the cylinder block 117 , the plating liquid 138 returns to the plating liquid tank 115 .
- An object to be treated that is capable of being treated by the above-described plating treatment apparatus 101 is a cylindrical part such as the cylinder block 117 , as shown in FIG. 2, and plating treatment is given to the inside surface of the cylindrical part.
- the cylinder block 117 is installed on the plating treatment apparatus 101 in a vertically inverted state. That is to say, for the cylinder block 117 in a state of being mounted on a vehicle, the lower side thereof is the crankcase portion 133 whose lower part spreads outward, and the upper side is a cylinder head portion, the cylinder bore that slidably houses a piston, not shown, being formed in the cylinder head portion. Therefore, when the cylinder block 117 is turned over, the upper side is the crankcase portion 133 , and the lower side is the cylinder head portion.
- a cylinder head face of the cylinder block 117 is brought into contact with the sealing material 125 disposed on the top face 108 of the outlet jig 103 , and the lower face of the crankcase portion 133 is brought into contact with a sealing member 140 , whereby both of the upper and lower ends of the cylinder block 117 are sealed.
- the above-described upper anode 131 is disposed up to a height corresponding to the inside surface of the cylinder bore.
- high-speed plating means high-speed plating treatment conducted at a high current density of 100 (A/dm 2 ) and higher.
- the plating liquid 138 is caused to flow from the plating liquid tank 115 to the lower anode 130 through the pipe 113 by a driving force of the pump 136 . Since hollow portions are formed in the lower and upper anodes 130 and 131 , the plating liquid 138 rises from the interior of the lower anode 130 to the interior of the upper anode 131 , and is discharged toward the interior of the crankcase portion 133 of the cylinder block 117 through an opening provided at the top end 106 of the upper anode 131 . The plating liquid 138 temporarily accumulates in the crankcase portion 133 , so that the interior of the crankcase portion 133 plays a role of a so-called buffering effect.
- the flow of the plating liquid 138 is uniformed. Thereafter, the plating liquid 138 flows downward between the upper anode 131 and the inside surface of the cylinder bore.
- the anode-cathode distance at the lower anode 130 is larger than that at the upper anode 131 , so that the plating liquid 138 flows uniformly and smoothly due to the buffering effect between the lower anode 130 and the outlet jig 103 as well.
- a synergistic effect caused by these two buffering effects can maintain a uniform flow of the plating liquid 138 from the interior of crankcase portion to the outlet jig 103 .
- plating treatment was done by using a not illustrated plating treatment apparatus.
- the cathode 10 disposed in the plating pretreatment apparatus 1 is composed of the cylindrical upper cathode 41 and the lower cathode 40 having a smaller diameter than the upper cathode 41 as described above, and these upper and lower cathodes 41 and 40 can be separated from each other.
- the flow rate was 10 liter/minute
- the concentration of phosphoric acid was 300 g/liter
- the liquid temperature was 65° C.
- the density of current caused to flow between the cathode 10 and the cylinder block 17 was 50 A/dm 2 .
- the thermometer 25 was arranged in each cylinder of the cylinder block 17 . Pretreatment was given to the inside surface of the cylinder block 17 while appropriately regulating the current amount and the flow rate of pretreatment liquid so that the temperature of the pretreatment liquid 37 in each cylinder is kept constant. Then, plating treatment was done to form Ni-SiC or Ni-P-SiC plating film on the inside surface of the cylinder block 17 .
- FIG. 2 shows the plating treatment apparatus 101 having the lower anode 130 with a smaller diameter than that of the upper anode 131 .
- FIG. 3 a plating treatment apparatus 151 having a lower anode 153 with almost the same diameter as that of the upper anode 131 is shown in FIG. 3. All the construction of the plating treatment apparatus 151 shown in FIG. 3 is the same as that of the plating treatment apparatus 101 shown in FIG. 2 except for the lower anode 153 .
- the average flow velocity of the plating liquid 138 in both of the apparatuses 101 and 151 was kept constant, being 1,7 m/s, and all of the anode-cathode distance of the upper anode 131 in the apparatus 101 shown in FIG. 2 and the anode-cathode distances of the upper anode 131 and the lower anode 153 in the apparatus 151 shown in FIG. 3 were set at 5 mm. Also, three current densities of 100, 120 and 150 (A/dm 2 ) were used. TABLE 1 Current density (A/dm 2 ) Present invention Comparative example 100 ⁇ ⁇ 120 ⁇ X 150 ⁇ X
- burnt deposit means a fault of plating such that hydrogen are produced due to a shortage of supplied Ni ions, so that the vicinity of the cathode becomes alkali, and therefore Ni(OH)x is yielded to make the portion black in color. This fault is liable to occur in a portion where the flow of the plating liquid 138 stagnates.
- the use of the plating treatment apparatus 1 in accordance with the present invention yielded a good result without the occurrence of burnt deposit at any current density of 100 to 150 (A/dm 2 ).
- the anode 110 of this type enabled high-speed plating and could restrain the occurrence of burnt deposit, whereby satisfactory plating treatment of the cylinder block 117 was made possible.
- the use of the plating treatment apparatus 151 in accordance with the comparative example brought about burnt deposit at high current densities of 120 and 150 (A/dm 2 ).
- the cylinder block 117 was plated by using the anode in the shape shown in FIG. 2 and by changing only the anode to an insoluble anode or a titanium basket.
- the average flow velocity of the plating liquid 138 in both cases was kept constant, being 1.7 m/s.
- Table 2 Current density Present invention Comparative example (A/dm 2 ) (insoluble anode) (titanium basket) 100 ⁇ ⁇ 120 ⁇ X 150 ⁇ X
- the insoluble anode In the case of the insoluble anode, no fault of plating such as burnt deposit occurred, and satisfactory plating treatment could be done at any current density of 100 to 150 (A/dm 2 ). However, in the case of titanium basket, a fault of plating such as burnt deposit occurred at current densities of 120 to 150 (A/dm 2 ). Also, since the outer peripheral surface of the titanium basket is formed into a wavy shape and therefore the dimensional accuracy is poor, a small anode-cathode distance may cause short-circuit between the anode and the object to be treated. Therefore, the anode-cathode distance must be larger than 5 mm.
- the cathode divided into upper and lower sides has been described in the pretreatment apparatus in accordance with the embodiment of the present invention, this is a case where the plating pretreatment apparatus itself is disposed vertically.
- a cathode on the downstream side (corresponding to the lower cathode 40 ) with respect to the flow direction of pretreatment liquid in the cathode is formed integrally with a cathode on the upstream side (corresponding to the upper cathode 41 ) so as to have a smaller diameter than the cathode on the upstream side, whereby the effects of the present invention can be achieved.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
There are provided a plating pretreatment apparatus capable of causing a plating pretreatment liquid to flow uniformly between a cathode and an object to be treated, and a plating treatment apparatus, which can also be used for a multi-cylinder engine.
In the plating pretreatment apparatus in accordance with the present invention in which a cylindrical cathode 10 is disposed in a fixing jig 3 in which a hollow portion is formed, and a cylindrical object to be treated 17 is installed on the fixing jig 3 so that the cathode 10 is arranged in the object to be treated 17, a lower cathode 40 of the cathode 10 is formed so as to have a smaller diameter than an upper cathode 41. Also, a plurality of hollow portions of the fixing jig 3 and cathodes 10 are provided, and a thermometer 25 is arranged in each cylinder.
The plating treatment apparatus in accordance with the present invention includes an outlet jig 103, in which a hollow portion 105 is formed, for installing a cylindrical object to be treated 117 on a top face 108 thereof, a cylindrical anode 110 disposed so that a top end 106 thereof projects from the top face 108 of the outlet jig 103, and a plating liquid tank 115 connected to the anode 110 and the outlet jig 103 through pipes 113 and 112, respectively. When the cylindrical object to be treated 117 is installed on the top face 108 of the outlet jig 103 and an upper anode 131 is arranged in the object to be treated 117, the diameter of a lower anode 130 is made smaller than that of the upper anode 131.
Description
- 1. Field of the Invention
- The present invention relates to a plating pretreatment apparatus used when plating treatment is given to the inner peripheral surface of an object to be treated formed into a cylindrical shape such as a cylinder block, and also relates to a plating treatment apparatus used when high-speed plating treatment is given to the inner peripheral surface of an object to be treated formed into a cylindrical shape such as a cylinder block.
- 2. Description of the Related Art
- Usually, before plating is performed, plating pretreatment is done, for example, by electrolytic etching to improve the adhesion of plating film to a base material. In the pretreatment by means of electrolytic etching, as the condition values of liquid temperature, flow rate, and electric current amount increase, the etching amount increases.
- As one example of the conventional electrolytic etching, a method for plating pretreatment in which electrolytic etching is performed in a pretreatment liquid with an aluminum alloy containing silicon being used as an anode has been disclosed in Japanese Patent Provisional Publication No. 11-1795.
- However, when pretreatment is given to the inside surface of a cylindrical object to be treated such as a cylinder block, the flow velocity of pretreatment liquid between the cylinder bore inside surface and a cathode is unstable, so that the flow rate, one of the above-described condition values, is nonuniform. Therefore, the etching amount varies depending on the portion to be treated. Further, for a cylinder block for a multi-cylinder engine, the liquid temperature, one of the above-described condition values, is nonuniform between cylinders, so that variations in etching amount occur. The reason for this is that even if the liquid temperature of pretreatment liquid in a pretreatment liquid tank is made constant, the voltage applied to the cylinder block increases the liquid temperature. Also, the reason is that since the outside shape differs between cylinders, a difference in liquid temperature between cylinders arises.
- If plating treatment is done in this state, plating film formed in a portion where the etching amount is small has a lower adhesion than that formed in a portion where the etching amount is large, so that variations in adhesion of plating film between portions also occur. Therefore, it has so far been difficult to apply plating pretreatment by means of electrolytic etching to a cylinder block.
- On the other hand, usually, when electroplating is given to a cylindrical object to be treated such as a cylinder block, high-speed plating is sometimes given by increasing the current density or by decreasing an anode-cathode distance between the electrode and the object to be treated to enhance the productivity.
- First, the case in which the current density is increased will be explained. For example, in the case where SiC is deposited in a form of Ni-P-SiC or Ni-SiC as plating film, if the flow of plating liquid is nonuniform, the deposition of SiC is also nonuniform, so that a problem in regard to wear resistance of cylinder occurs. Also, at a high current density, abnormal deposition of plating film called “burnt deposit” may occur in a portion where the plating liquid flows slowly.
- Also, if the anode-cathode distance between the electrode and the object to be treated is short, the flow of plating liquid in a gap between the object to be treated and the anode is liable to be nonuniform, so that a fault of plating film such as burnt deposit develops, and therefore good plating treatment cannot be done. Further, an anode in which soluble nickel pellets are housed in a lath-shaped titanium basket has so far been used. However, since the outer peripheral surface of the anode is formed into a wave shape, the thickness of plating film formed on the inner peripheral surface of the object to be treated is made nonuniform by the wavy shape of the outer peripheral surface of the anode when the anode-cathode distance is as short as 1 to 5 mm. Therefore, good plating treatment cannot be done.
- An adverse influence caused by nonuniform flow of plating liquid arises more easily as the anode-cathode distance, that is, the distance between the anode and the inside surface of the object to be treated is decreased. Therefore, the uniform flow of plating liquid is very important.
- One prior art for providing uniform flow of plating liquid has been disclosed in Japanese Patent Publication No. 8-16278. However, this prior art is still insufficient to be used for high-speed plating, and further uniformity of plating liquid flow is demanded. When a multi-cylinder cylinder block is plated, the cylinder is required to have a construction such that it does not interfere with other cylinders.
- The present invention has been made to solve the above problems, and accordingly an object thereof is to provide a plating pretreatment apparatus which can etch a cylindrical object to be treated such as a cylinder block uniformly, and can also be used for a multi-cylinder cylinder block uniformly without variations between cylinders, and a plating treatment apparatus which can cause a plating liquid to flow between an anode and an object to be treated, and can also be used for a multi-cylinder cylinder block.
- To achieve the above object, the present invention provides a plating pretreatment apparatus in which a cylindrical cathode is disposed in a fixing jig in which a hollow portion is formed, and a cylindrical object to be treated is installed on the fixing jig so that the cathode is arranged in the object to be treated, wherein a lower cathode of the cathode is formed so as to have a smaller diameter than an upper cathode, whereby the volume of a lower void formed between the lower cathode and the fixing jig is made larger than that of an upper void formed between the upper cathode and the object to be treated.
- According to the above-described plating pretreatment apparatus, since a plating pretreatment liquid flows at a uniform flow velocity in the object to be treated, uniform etching can be performed over the whole inside surface of the object to be treated, and adhesion of plating film is improved, resulting in a decrease in poor adhesion.
- Also, in the plating pretreatment apparatus in accordance with one mode of the present invention, the cathode is configured so as to be capable of being divided into the upper cathode and lower cathode.
- Therefore, when maintenance on the cathode is performed, only the upper cathode or only the lower cathode can be replaced conveniently. Also, pretreatment can be given to a cylinder block with a different bore diameter.
- Further, in the plating pretreatment apparatus in accordance with another mode of the present invention, a plurality of hollow portions of the fixing jig and cathodes are provided, and a thermometer is arranged in each cylinder.
- Thereby, even in the case of multi-cylinder engine, the temperature of pretreatment liquid contained in each cylinder can be grasped, and by appropriately regulating the current value and the flow rate of pretreatment liquid according to the temperature, the liquid temperature can be kept constant. Therefore, there are no variations in etching amount between cylinders, and the adhesion of plating film is improved, so that the present invention can also be applied to a multi-cylinder cylinder block.
- To achieve the above object, the present invention provides a plating treatment apparatus in which a plating liquid is sent from a plating liquid tank into an anode, in which a hollow portion into which the plating liquid is sent is formed, in a state in which an electrical current is caused to flow in a cylindrical object to be treated and the anode, is discharged into the object to be treated through a top end of the anode, is caused to flow between the outside surface of the anode and the inside surface of the object to be treated, is further caused to flow between the outside surface of the anode and the inside surface of an outlet jig, and is returned to the plating liquid tank, whereby the inside surface of the object to be treated is plated, wherein the diameter of a lower anode of the anode, which is disposed in a hollow portion of the outlet jig, is made smaller than the diameter of an upper anode disposed in the object to be treated.
- According to the above-described plating treatment apparatus, since an anode-cathode distance between the outside surface of the anode and the inside surface of the outlet jig is made larger than an anode-cathode distance between the outside surface of the anode and the inside surface of the object to be treated, a buffering effect is produced in the outlet jig, so that the plating liquid flows uniformly in the object to be treated. Therefore, when high-speed plating is performed, a fault of plating such as burnt deposit can be restrained, and a shortened treatment time and a reduced treatment cost can be achieved.
- The above-described plating treating apparatus preferably has a construction in which the outlet jig, in which a hollow portion is formed, for installing a cylindrical object to be treated on a top face thereof, the cylindrical anode disposed so that the top end thereof projects from the top face of the outlet jig, and the plating liquid tank connected to the anode and the outlet jig through pipes are included, and the cylindrical object to be treated is installed on the top face of the outlet jig and the upper side of the anode is arranged in the object to be treated.
- Also, in the plating treatment apparatus in accordance with one mode of the present invention, an insoluble anode is used as the anode.
- If the insoluble anode is used, the anode-cathode distance can further be decreased, so that the plating treatment time can further be shortened. For example, when a cylinder block is used as the object to be treated, according to the present invention, the anode-cathode distance can be decreased to 1 to 5 mm, although the conventional anode-cathode distance needs to be 5 mm and larger.
- Further, in the plating treatment apparatus in accordance with another mode of the present invention, the anode is configured so as to be capable of being divided into the upper anode and lower anode.
- Therefore, when maintenance on the cathode is performed, only the upper anode or only the lower anode can be replaced conveniently.
- Further, in the plating treatment apparatus in accordance with still another mode of the present invention, a plurality of hollow portions of the outlet jig and anodes are provided, whereby plating treatment can also be given to a multi-cylinder engine.
- As described above, according to the plating pretreatment apparatus in accordance with the present invention, a buffering effect is produced by the lower void formed in the fixing jig, so that the plating pretreatment liquid flows uniformly in the object to be treated. Therefore, when high-speed plating is performed, a fault of plating such as burnt deposit can be restrained, and a shortened treatment time and a reduced treatment cost can be achieved.
- On the other hand, according to the plating treatment apparatus in accordance with the present invention, a buffering effect is produced in the outlet jig, so that the plating liquid flows uniformly in the object to be treated. Therefore, when high-speed plating is performed, a fault of plating such as burnt deposit can be restrained, and a shortened treatment time and a reduced treatment cost can be achieved.
- FIG. 1 is a sectional view of a plating pretreatment apparatus in accordance with the present invention;
- FIG. 2 is a sectional view of a plating treatment apparatus in accordance with the present invention, in which the diameter of a lower anode is smaller than that of an upper anode; and
- FIG. 3 is a sectional view of a plating treatment apparatus using an anode having lower and upper portions with the same diameter.
- First, a plating pretreatment apparatus in accordance with an embodiment of the present invention will be described in detail with reference to the accompanying drawing.
- A plating pretreatment apparatus1 in accordance with the embodiment of the present invention includes, as shown in FIG. 1, a
fixing jig 3 in which a hollow portion is formed, acylindrical cathode 10 disposed in thefixing jig 3 so that atop end 6 thereof projects from atop face 8 of thefixing jig 3, a plating pretreatmentliquid tank 15 connected to thefixing jig 3 and thecathode 10 viapipes power sources cylinder block 17, which is an object to be treated, and thecathode 10, respectively, and athermometer 25 disposed in a crankcase portion 23 of thecylinder block 17. - The
fixing jig 3 is surrounded by aside plate 27 formed into a cylindrical shape and abottom plate 28, and the hollow portion is formed by theside plate 27 and thebottom plate 28. The diameter of the hollow portion is made about equal to the diameter of a hollow portion of acylinder bore 30 of thecylinder block 17, and asealing member 31 is disposed on thetop face 8 of theside plate 27. As the sealingmember 31, a material that has elasticity so as to be capable of maintaining sealing ability with respect to thecylinder block 17 is preferably used. Also, aninflow port 33 is provided at the lower part of thefixing jig 3, and thefixing jig 3 is connected to the plating pretreatmentliquid tank 15 through theinflow port 33 via thepipe 12. In a halfway position of thepipe 12 is disposed apump 34 which can deliver under pressure apretreatment liquid 37 in thepretreatment liquid tank 15. - The
cathode 10, which is formed into a cylindrical shape in which the interior is hollow, is disposed vertically so as to penetrate the hollow portions of thecylinder block 17 and the fixingjig 3. Thecathode 10 is divided into two parts, upper and lower, that are constructed detachably. Atop end 40 a of alower cathode 40 disposed on the lower side has a height about equal to the height of thetop face 8 of the fixingjig 3, and thetop end 6 of anupper cathode 41 disposed on the upper side is positioned at a height about equal to the height of anedge 23 a of the crankcase portion 23 of thecylinder block 17. The diameter of thelower cathode 40 is made smaller than the diameter of theupper cathode 41. Although the diameter of thelower cathode 40 has only to be slightly smaller than that of theupper cathode 41, the dimensional difference between the diameters should preferably be, for example, 5 mm and larger. As shown in FIG. 1, at the upper part of thelower cathode 40, the diameter thereof is expanded to a diameter about equal to the diameter at the lower end of theupper cathode 41. - Therefore, an
upper void 44 formed between the outer peripheral surface of theupper cathode 41 and the inside surface of the cylinder bore 30 has a smaller volume than alower void 45 formed between the outer peripheral surface of thelower cathode 40 and the inner side surface of the fixingjig 3. At the lower end of thelower cathode 40 is provided anoutflow port 48. - As described above, the
pipe 12 extending from theinflow port 33 of the fixingjig 3 is connected to the platingpretreatment liquid tank 15 via thepump 34, and also the platingpretreatment liquid tank 15 is connected to theoutflow port 48 of thelower cathode 40 through thepipe 13. Thereupon, thepretreatment liquid 37 is fed from the platingpretreatment liquid tank 15 to thelower void 45 of the fixingjig 3, and rises up to theupper void 44. Thereafter, thepretreatment liquid 37 flows into theupper cathode 41 through thetop end 6 of theupper cathode 41, and returns to the platingpretreatment liquid tank 15 through theoutflow port 48 of thelower cathode 40. - An object to be treated that is capable of being treated by the above-described plating pretreatment apparatus1 is a cylindrical part in which a hollow portion is formed, such as the
cylinder block 17, as shown in FIG. 1, and plating pretreatment is given to the inside surface of the hollow portion. - As shown in FIG. 1, the
cylinder block 17 is installed on the plating pretreatment apparatus 1 in a vertically inverted state. That is to say, for thecylinder block 17 in a state of being mounted on a vehicle, the lower side thereof is the crankcase portion 23 whose lower part spreads outward, and the upper side is a cylinder head, the cylinder bore 30 that slidably houses a piston, not shown, being formed in the cylinder head. Therefore, when thecylinder block 17 is turned over, the upper side is the crankcase portion 23, and the lower side is a cylinder head face. The cylinder head face of thecylinder block 17 is brought into contact with the sealingmember 31 disposed on the fixingjig 3, and the lower face of the crankcase portion 23 is brought into contact with a sealingmember 50, whereby both of the upper and lower ends of thecylinder block 17 are sealed. - The following is a description of the flow and operation of the
plating pretreatment liquid 37 in the plating pretreatment apparatus 1 having the above-described construction. - First, the
pretreatment liquid 37 is sent from the platingpretreatment liquid tank 15 to thelower void 45 of the fixingjig 3 through thepipe 12 by a driving force of thepump 34. Then, thepretreatment liquid 37 rises from thelower void 45 to theupper void 44. Since thelower void 45 has a larger volume than theupper void 45, thelower void 45 plays a role of a so-called buffer. Therefore, the flow velocity of thepretreatment liquid 37 rising along theupper void 44 is uniformed, so that the whole inside surface of the cylinder bore 30 uniformly undergoes electrolytic etching. Next, thepretreatment liquid 37 overflows and flows into theupper cathode 41 through an opening formed at thetop end 6 of theupper cathode 41, and then is sent to the platingpretreatment liquid tank 15 through theoutflow port 48 of thelower cathode 40 via thepipe 13. - Next, a plating treatment apparatus in accordance with an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
- A
plating treatment apparatus 101 in accordance with the embodiment of the present invention includes, as shown in FIG. 2, anoutlet jig 103 in which ahollow portion 105 is formed, acylindrical anode 110 disposed in thehollow portion 105 of theoutlet jig 103 so that atop end 106 thereof projects from atop face 108 of theoutlet jig 103, a platingliquid tank 115 connected to theoutlet jig 103 and theanode 110 viapipes power sources cylinder block 117, which is an object to be treated, and theanode 110, respectively. - The
outlet jig 103 is surrounded by aside plate 122 formed into a cylindrical shape and abottom plate 123, and athin sealing material 125 is disposed on thetop face 108 of theside plate 122. As the sealingmaterial 125, a material that has elasticity so as to be capable of maintaining sealing ability with respect to thecylinder block 117 is preferably used. Also, a platingliquid outflow port 126 is provided at the lower part of theoutlet jig 103, and theoutlet jig 103 is connected to theplating liquid tank 115 through the platingliquid outflow port 126 via thepipe 112. - The
anode 110, which is formed into a cylindrical shape in which the interior is hollow, is disposed vertically so as to penetrate ahollow portion 128 of thecylinder block 117 and thehollow portion 105 of theoutlet jig 103. Theanode 110, which is an insoluble anode, is divided into two parts, upper and lower, that are constructed detachably. Atop end 130 a of alower anode 130 disposed on the lower side has a height about equal to the height of thetop face 108 of theoutlet jig 103, and thetop end 106 of anupper anode 131 disposed on the upper side is positioned at a height about equal to the height of anedge 133 a of acrankcase portion 133 of thecylinder block 117, which is an object to be treated. The diameter of thelower anode 130 is made smaller than the diameter of theupper anode 131. Although the diameter of thelower anode 130 has only to be slightly smaller than that of theupper anode 131, the dimensional difference between the diameters should preferably be, for example, 10 mm and larger. As theanode 110, for example, an anode in which the surface of a cylindrical base material composed of titanium is plated with platinum, an anode of clad material in which a thin sheet composed of platinum is bonded to a cylindrical base material composed of titanium, or an anode in which the surface of a cylindrical base material composed of titanium is coated with iridium oxide film can preferably used. - Therefore, an anode-cathode distance that is a gap (distance) between the outer peripheral surface of the
upper anode 131 and the inside surface of thecylinder block 117 is made smaller than an anode-cathode distance that is a gap (distance) between the outer peripheral surface of thelower anode 130 and the inside surface of theoutlet jig 103. For example, theupper anode 131 is arranged in a state of being separated from the inside surface of a cylinder bore in thecylinder block 117 with a gap of 1 to 5 mm formed therebetween and substantially in parallel with the inside surface of the cylinder bore. Further, a platingliquid outflow port 135 is provided at the lower end of thelower anode 130. - As described above, the
pipe 112 extending from the platingliquid outflow port 126 of theoutlet jig 103 is connected to theplating liquid tank 115, and also theplating liquid tank 115 is connected to the lower end of thelower anode 130 through thepipe 113 via apump 136. Thereupon, aplating liquid 138 is fed from the platingliquid tank 115 to theanode 110, and after plating treatment is given to the inside surface of thecylinder block 117, the plating liquid 138 returns to theplating liquid tank 115. - An object to be treated that is capable of being treated by the above-described
plating treatment apparatus 101 is a cylindrical part such as thecylinder block 117, as shown in FIG. 2, and plating treatment is given to the inside surface of the cylindrical part. - As shown in FIG. 2, the
cylinder block 117 is installed on theplating treatment apparatus 101 in a vertically inverted state. That is to say, for thecylinder block 117 in a state of being mounted on a vehicle, the lower side thereof is thecrankcase portion 133 whose lower part spreads outward, and the upper side is a cylinder head portion, the cylinder bore that slidably houses a piston, not shown, being formed in the cylinder head portion. Therefore, when thecylinder block 117 is turned over, the upper side is thecrankcase portion 133, and the lower side is the cylinder head portion. A cylinder head face of thecylinder block 117 is brought into contact with the sealingmaterial 125 disposed on thetop face 108 of theoutlet jig 103, and the lower face of thecrankcase portion 133 is brought into contact with a sealingmember 140, whereby both of the upper and lower ends of thecylinder block 117 are sealed. The above-describedupper anode 131 is disposed up to a height corresponding to the inside surface of the cylinder bore. - The following is a description of the flow and operation of the plating liquid138 in the
plating treatment apparatus 101 having the above-described construction. In the present invention, high-speed plating means high-speed plating treatment conducted at a high current density of 100 (A/dm2) and higher. - First, the
plating liquid 138 is caused to flow from the platingliquid tank 115 to thelower anode 130 through thepipe 113 by a driving force of thepump 136. Since hollow portions are formed in the lower andupper anodes lower anode 130 to the interior of theupper anode 131, and is discharged toward the interior of thecrankcase portion 133 of thecylinder block 117 through an opening provided at thetop end 106 of theupper anode 131. The plating liquid 138 temporarily accumulates in thecrankcase portion 133, so that the interior of thecrankcase portion 133 plays a role of a so-called buffering effect. Therefore, the flow of theplating liquid 138 is uniformed. Thereafter, the plating liquid 138 flows downward between theupper anode 131 and the inside surface of the cylinder bore. As described above, the anode-cathode distance at thelower anode 130 is larger than that at theupper anode 131, so that the plating liquid 138 flows uniformly and smoothly due to the buffering effect between thelower anode 130 and theoutlet jig 103 as well. A synergistic effect caused by these two buffering effects can maintain a uniform flow of the plating liquid 138 from the interior of crankcase portion to theoutlet jig 103. By increasing the anode-cathode distance between theoutlet jig 103 and thelower anode 130, an interference of thecylinder block 117 with other cylinders is eliminated, so that this apparatus can also be applied to a multi-cylinder engine. - Next, the present invention will further be explained by means of examples.
- After plating pretreatment was given to the inside surface of the
cylinder block 17 by using the plating pretreatment apparatus 1 shown in FIG. 1, plating treatment was done by using a not illustrated plating treatment apparatus. Thecathode 10 disposed in the plating pretreatment apparatus 1 is composed of the cylindricalupper cathode 41 and thelower cathode 40 having a smaller diameter than theupper cathode 41 as described above, and these upper andlower cathodes - Regarding the conditions of the
plating pretreatment liquid 37, the flow rate was 10 liter/minute, the concentration of phosphoric acid was 300 g/liter, and the liquid temperature was 65° C. Also, the density of current caused to flow between thecathode 10 and thecylinder block 17 was 50 A/dm2. Thethermometer 25 was arranged in each cylinder of thecylinder block 17. Pretreatment was given to the inside surface of thecylinder block 17 while appropriately regulating the current amount and the flow rate of pretreatment liquid so that the temperature of thepretreatment liquid 37 in each cylinder is kept constant. Then, plating treatment was done to form Ni-SiC or Ni-P-SiC plating film on the inside surface of thecylinder block 17. - Thereby, almost the same etching amount was provided for each cylinder, and variations in adhesion of plating film between cylinders were also eliminated.
- The inside surface of the
cylinder block 117 was plated at various current densities by usingplating treatment apparatuses plating treatment apparatus 101 having thelower anode 130 with a smaller diameter than that of theupper anode 131. - Contrarily, as a comparative example, a
plating treatment apparatus 151 having alower anode 153 with almost the same diameter as that of theupper anode 131 is shown in FIG. 3. All the construction of theplating treatment apparatus 151 shown in FIG. 3 is the same as that of theplating treatment apparatus 101 shown in FIG. 2 except for thelower anode 153. - Regarding the plating treatment conditions, the average flow velocity of the plating liquid138 in both of the
apparatuses upper anode 131 in theapparatus 101 shown in FIG. 2 and the anode-cathode distances of theupper anode 131 and thelower anode 153 in theapparatus 151 shown in FIG. 3 were set at 5 mm. Also, three current densities of 100, 120 and 150 (A/dm2) were used.TABLE 1 Current density (A/dm2) Present invention Comparative example 100 ◯ ◯ 120 ◯ X 150 ◯ X - The circle mark indicates a satisfactory cylinder block
- without a fault of plating such as burnt deposit, and the cross mark indicates a cylinder block in which a fault of plating occurred. The term “burnt deposit” means a fault of plating such that hydrogen are produced due to a shortage of supplied Ni ions, so that the vicinity of the cathode becomes alkali, and therefore Ni(OH)x is yielded to make the portion black in color. This fault is liable to occur in a portion where the flow of the
plating liquid 138 stagnates. - According to Table 1, the use of the plating treatment apparatus1 in accordance with the present invention yielded a good result without the occurrence of burnt deposit at any current density of 100 to 150 (A/dm2). The
anode 110 of this type enabled high-speed plating and could restrain the occurrence of burnt deposit, whereby satisfactory plating treatment of thecylinder block 117 was made possible. Contrarily, the use of theplating treatment apparatus 151 in accordance with the comparative example brought about burnt deposit at high current densities of 120 and 150 (A/dm2). This burnt deposit occurred at a portion where the flow of plating liquid 138 was nonuniform and had a low flow velocity, and also in the comparative example, since the flow of theplating liquid 138 is nonuniform, the eutectoid of SiC was also nonuniform. - According to example 2, by making the diameter of the
lower anode 153 small, the plating liquid 138 flowed uniformly even at the anode-cathode distance of 1 to 5 mm. Also, the use of a flat insoluble anode such that the outer peripheral surface of theanode 110 has no irregularities such as a wavy form brought about a constant anode-cathode distance between each portion of theanode 110 and thecylinder block 117. Therefore, good plating film with uniform film thickness and without burnt deposit could be obtained. - Next, the
cylinder block 117 was plated by using the anode in the shape shown in FIG. 2 and by changing only the anode to an insoluble anode or a titanium basket. Regarding the treatment conditions of plating treatment, the average flow velocity of the plating liquid 138 in both cases was kept constant, being 1.7 m/s. The result is given in Table 2.TABLE 2 Current density Present invention Comparative example (A/dm2) (insoluble anode) (titanium basket) 100 ◯ ◯ 120 ◯ X 150 ◯ X - In the case of the insoluble anode, no fault of plating such as burnt deposit occurred, and satisfactory plating treatment could be done at any current density of 100 to 150 (A/dm2). However, in the case of titanium basket, a fault of plating such as burnt deposit occurred at current densities of 120 to 150 (A/dm2). Also, since the outer peripheral surface of the titanium basket is formed into a wavy shape and therefore the dimensional accuracy is poor, a small anode-cathode distance may cause short-circuit between the anode and the object to be treated. Therefore, the anode-cathode distance must be larger than 5 mm.
- The present invention is not limited to the above-described embodiments, and various modifications and changes can be made based on the technical concept of the present invention.
- For example, although the cathode divided into upper and lower sides has been described in the pretreatment apparatus in accordance with the embodiment of the present invention, this is a case where the plating pretreatment apparatus itself is disposed vertically. In the case where the plating pretreatment apparatus is disposed obliquely or substantially horizontally, a cathode on the downstream side (corresponding to the lower cathode40) with respect to the flow direction of pretreatment liquid in the cathode is formed integrally with a cathode on the upstream side (corresponding to the upper cathode 41) so as to have a smaller diameter than the cathode on the upstream side, whereby the effects of the present invention can be achieved.
Claims (7)
1. A plating pretreatment apparatus in which a cylindrical cathode is disposed in a fixing jig in which a hollow portion is formed, and a cylindrical object to be treated is installed on said fixing jig so that said cathode is arranged in said object to be treated, wherein a lower cathode of said cathode is formed so as to have a smaller diameter than an upper cathode, whereby the volume of a lower void formed between said lower cathode and said fixing jig is made larger than that of an upper void formed between said upper cathode and said object to be treated.
2. The plating pretreatment apparatus according to , wherein said cathode is configured so as to be capable of being divided into said upper cathode and lower cathode.
claim 1
3. The plating pretreatment apparatus according to or , wherein a plurality of hollow portions of said fixing jig and cathodes are provided, and a thermometer is arranged in each cylinder, whereby pretreatment can be given to a multi-cylinder engine.
claim 1
2
4. A plating treatment apparatus in which a plating liquid is sent from a plating liquid tank into an anode, in which a hollow portion into which the plating liquid is sent is formed, in a state in which an electrical current is caused to flow in a cylindrical object to be treated and said anode, is discharged into said object to be treated through a top end of said anode, is caused to flow between the outside surface of said anode and the inside surface of said object to be treated, is further caused to flow between the outside surface of said anode and the inside surface of an outlet jig, and is returned to said plating liquid tank, whereby the inside surface of said object to be treated is plated,
wherein the diameter of a lower anode of said anode, which is disposed in a hollow portion of said outlet jig, is made smaller than the diameter of an upper anode disposed in said object to be treated.
5. The plating treatment apparatus according to , wherein an insoluble anode is used as said anode.
claim 4
6. The plating treatment apparatus according to or , wherein said anode is configured so as to be capable of being divided into said upper anode and lower anode.
claim 4
5
7. The plating treatment apparatus according to any one of to , wherein a plurality of hollow portions of said outlet jig and anodes are provided, whereby plating treatment can also be given to a multi-cylinder engine.
claims 4
6
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000009599A JP2001200391A (en) | 2000-01-19 | 2000-01-19 | Plating pretreatment device |
JP2000-009599 | 2000-01-19 | ||
JP2000-009598 | 2000-01-19 | ||
JP2000009598A JP3835099B2 (en) | 2000-01-19 | 2000-01-19 | Plating equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010040090A1 true US20010040090A1 (en) | 2001-11-15 |
US6383348B2 US6383348B2 (en) | 2002-05-07 |
Family
ID=26583729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/765,742 Expired - Lifetime US6383348B2 (en) | 2000-01-19 | 2001-01-19 | Plating pretreatment apparatus and plating treatment apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | US6383348B2 (en) |
DE (1) | DE10102145B4 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060102469A1 (en) * | 2004-11-18 | 2006-05-18 | General Electric Company | Electroplating apparatus |
US20100104738A1 (en) * | 2008-10-24 | 2010-04-29 | Suzuki Motor Corporation | Plating pretreatment apparatus and method for multi-cylinder block |
CN105980608A (en) * | 2013-12-13 | 2016-09-28 | 新日铁住金株式会社 | Device for electroplating steel pipe |
EP3009537A4 (en) * | 2013-06-14 | 2017-03-22 | KYB Corporation | Anode and high-speed plating device provided with same |
US10006137B2 (en) | 2013-06-14 | 2018-06-26 | Kyb Corporation | Holding device and high-speed plating machine provided with the same |
US10006143B2 (en) | 2013-06-14 | 2018-06-26 | Kyb Corporation | Power supplying member and high-speed plating machine provided with the same |
CN109312488A (en) * | 2016-06-16 | 2019-02-05 | 株式会社村田制作所 | Plater and coating method |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6652657B2 (en) * | 2000-07-31 | 2003-11-25 | United Technologies Corporation | Method for electrochemically treating articles and apparatus and method for cleaning articles |
US6547945B2 (en) * | 2000-07-31 | 2003-04-15 | United Technologies Corporation | Method and apparatuses for electrochemically treating an article |
US7560015B2 (en) * | 2002-05-27 | 2009-07-14 | Concast Ag | Process for electrolytic coating of a strand casting mould |
US20050194257A1 (en) * | 2004-03-08 | 2005-09-08 | Tom Januszek | Electroplating system and method |
US8101050B2 (en) * | 2006-06-20 | 2012-01-24 | Vetco Gray Inc. | System, method, and apparatus for continuous electroplating of elongated workpieces |
JP5168062B2 (en) * | 2008-09-30 | 2013-03-21 | スズキ株式会社 | Cylinder block plating pretreatment apparatus and method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT142881B (en) * | 1933-02-21 | 1935-09-25 | Henderik Van Der Horst | Process for depositing chromium layers in cylinder bores of internal combustion engines. |
US3956096A (en) * | 1973-03-23 | 1976-05-11 | Electro-Coatings, Inc. | Apparatus for plating aircraft cylinders |
US4246088A (en) * | 1979-01-24 | 1981-01-20 | Metal Box Limited | Method and apparatus for electrolytic treatment of containers |
JP3096566B2 (en) | 1994-06-29 | 2000-10-10 | 三洋電機株式会社 | Component detachable structure for portable electronic devices |
JP3267831B2 (en) * | 1995-04-06 | 2002-03-25 | ヤマハ発動機株式会社 | Plating method, plating apparatus and internal plating engine cylinder |
US6086731A (en) * | 1996-10-24 | 2000-07-11 | Honda Giken Kogyo Kabushiki Kaisha | Composite plating apparatus |
JP3296543B2 (en) | 1996-10-30 | 2002-07-02 | スズキ株式会社 | Plating coated aluminum alloy, its cylinder block, plating line, plating method |
JP3534334B2 (en) * | 1997-05-09 | 2004-06-07 | 日本パーカライジング株式会社 | In-cylinder inner surface composite plating equipment |
-
2001
- 2001-01-18 DE DE10102145A patent/DE10102145B4/en not_active Expired - Fee Related
- 2001-01-19 US US09/765,742 patent/US6383348B2/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060102469A1 (en) * | 2004-11-18 | 2006-05-18 | General Electric Company | Electroplating apparatus |
US20100104738A1 (en) * | 2008-10-24 | 2010-04-29 | Suzuki Motor Corporation | Plating pretreatment apparatus and method for multi-cylinder block |
US8815062B2 (en) * | 2008-10-24 | 2014-08-26 | Suzuki Motor Corporation | Plating pretreatment apparatus and method for multi-cylinder block |
EP3009537A4 (en) * | 2013-06-14 | 2017-03-22 | KYB Corporation | Anode and high-speed plating device provided with same |
US10006137B2 (en) | 2013-06-14 | 2018-06-26 | Kyb Corporation | Holding device and high-speed plating machine provided with the same |
US10006143B2 (en) | 2013-06-14 | 2018-06-26 | Kyb Corporation | Power supplying member and high-speed plating machine provided with the same |
CN105980608A (en) * | 2013-12-13 | 2016-09-28 | 新日铁住金株式会社 | Device for electroplating steel pipe |
CN109312488A (en) * | 2016-06-16 | 2019-02-05 | 株式会社村田制作所 | Plater and coating method |
Also Published As
Publication number | Publication date |
---|---|
DE10102145B4 (en) | 2008-04-03 |
DE10102145A1 (en) | 2001-08-02 |
US6383348B2 (en) | 2002-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6383348B2 (en) | Plating pretreatment apparatus and plating treatment apparatus | |
US6113759A (en) | Anode design for semiconductor deposition having novel electrical contact assembly | |
KR101886914B1 (en) | Electrolytic copper foil | |
US8551303B2 (en) | Multi-anode system for uniform plating of alloys | |
US6090260A (en) | Electroplating method | |
CN101054701B (en) | Method of increasing electroplating evenness | |
US6251251B1 (en) | Anode design for semiconductor deposition | |
EP3054035B1 (en) | Method for forming a nickel film | |
TW490510B (en) | Method and apparatus for producing electrolytic copper foil | |
KR100864753B1 (en) | Metal Foil Electrolytic Manufacturing Apparatus | |
US8226805B2 (en) | Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same | |
KR20160043209A (en) | Electric plating apparatus with horizontal cell | |
EP0134580A1 (en) | Method and apparatus for electrolytic treatment | |
US9840786B2 (en) | Film deposition device of metal film and film deposition method | |
EP0059481A1 (en) | High speed plating apparatus | |
JP4687876B2 (en) | Jet plating equipment | |
JP3835099B2 (en) | Plating equipment | |
JP3405517B2 (en) | Electroplating method and apparatus | |
CN108971674B (en) | Device for electrolytically machining micro groove and electrolytic machining method | |
JP2002004095A (en) | Insoluble anode and power feeding method for the same | |
KR101633617B1 (en) | Electric plating apparatus with horizontal cell and edge mask for using the same | |
KR101325390B1 (en) | Metal Foil Manufacturing Apparatus Comprising Perpendicular Type Cell | |
US20170175281A1 (en) | Method of forming metal coating | |
KR100634446B1 (en) | Wafer plating apparatus for improving process uniformity | |
JP4061583B2 (en) | Intermediate jig for plating equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SUZUKI MOTOR CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KURODA, TETSUYA;KATO, HIDEZUMI;REEL/FRAME:011481/0030 Effective date: 20001205 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
CC | Certificate of correction | ||
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |