US20010023087A1 - Method for housing sensors in a package - Google Patents

Method for housing sensors in a package Download PDF

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Publication number
US20010023087A1
US20010023087A1 US09/804,148 US80414801A US2001023087A1 US 20010023087 A1 US20010023087 A1 US 20010023087A1 US 80414801 A US80414801 A US 80414801A US 2001023087 A1 US2001023087 A1 US 2001023087A1
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Prior art keywords
package
hollow space
sensor
sensor surface
active sensor
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Granted
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US09/804,148
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US6395585B2 (en
Inventor
Manfred Brandl
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Ams AG
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Austriamicrosystems AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/14—Casings, e.g. of special material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • the invention relates to a method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package.
  • Chemical sensors like flow sensors or optical sensors, may be manufactured already in an integrated form in a cost-effective manner and at a high precision by conventional chip manufacturing processes.
  • IC sensors or chip sensors subsequently had to be incorporated in a package, which involved cumbersome assembly work, whereby the package, as a rule, was either screwed or glued and the connections to the sensors had to be led out of the package in a suitable manner.
  • incorporation in a package constituted a cost-determining factor for mass production.
  • the invention aims to provide a method of the initially defined kind, by which the assembly work involved can be substantially reduced and the necessary connections can, at the same time, be provided in a cost-effective manner by a few method steps.
  • the method according to the invention essentially consists in that, in a first method step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires, that, after this, the package is formed by molding, in particular injection molding, and that, in a third method step or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened.
  • chip molding with a suitable molding compound is known for many electronic components.
  • the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface in a fist method step, the respective active sensor surface is kept free of the molding compound to be applied subsequently.
  • the provision of bond wires as is common in chip manufacturing may be accomplished in a simple manner by conventional means, wherein, by a subsequent molding procedure, in particular an injection molding procedure, a finished component already comprising all electrical contacts is immediately provided.
  • the active sensor surface in a suitable manner will again be in contact with the environment, to which end the hollow space is mechanically opened either during the second method step simultaneously with the casting-on or molding of the package or following this second method step.
  • the opening of the hollow space in a third method step carried out subsequently is preferred to the simultaneous formation of the opening not the least because the simultaneous opening of the hollow space requires that the wall of the cap defining the hollow space be pierced immediately upon closure of the mold or injection mold, respectively. Since the injection molding compound, as a rule, has not set at that point of time, this will cause the previously positioned sensor to be displaced within the molding compound if no suitable abutment is provided on the opposite side.
  • the package may be made of suitable synthetics, a number of synthetics having proved to be suitable in semiconductor technology.
  • the hollow space advantageously may be opened by drilling, whereupon an optical fiber is introduced into the opened hollow space.
  • FIG. 1 illustrates a section through a sensor
  • FIG. 2 is a section through the sensor incorporated in a package
  • FIG. 3 is a sectional view analogous to FIG. 2, schematically illustrating an operating tool intended to open the hollow space;
  • FIG. 4 is a view of the sensor upon opening of the hollow space.
  • FIG. 5 shows an alternative method step for the formation of the opening of the hollow space in an illustration analogous to FIG. 2.
  • FIG. 1 depicts an IC sensor 1 whose sensor surface 2 is housed on the external side of the IC.
  • a cap 3 forming a hollow space above the active sensor surface 2 is put on and electrical contacting is effected via bond wires 4 .
  • the schematically represented package 5 is apparent after the injection molding procedure.
  • a lead frame 6 comprising the respective bond wires is already integrated in the package 5 , the hollow space 7 left being visible above the active sensor surface 2 .
  • a saw is indicated at 8 , by which the external wall of the package 5 and the cover cap 3 are appropriately severed so as to create an open connection to the hollow space 7 containing the active sensor element 2 .
  • FIG. 4 illustrates the thus produced sensor, showing its opening 9 which enables the active sensor element 2 contained in the interior of the package 5 to communicate with the atmosphere.
  • FIG. 5 once again elucidates the method step for the production of the package under the simultaneous formation of an opening in an illustration analogous to FIG. 2.
  • the method step of subsequently providing the opening of the hollow space indicated in FIG. 3 may be obviated.
  • the cap 3 forming the hollow space does already comprise an interruption, the injection mold thus having to be modified accordingly.
  • the mold consists of a first mold half 10 and a second mold half 11 , wherein the first mold half 10 , which is located adjacent to the cap 3 , comprises inwardly projecting webs 12 which are sealingly pressed at the cap outside the interruption 13 of the cap already provided.
  • the second mold half 11 comprises an accordingly formed pressure element 14 capable of pressing the webs 12 at the cap 3 in an accordingly tight manner such that an open access to the hollow space 7 will be formed immediately upon removal from the mold.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Measuring Fluid Pressure (AREA)
  • Light Receiving Elements (AREA)

Abstract

There is disclosed a method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. In a first step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires. In a second method step, the package is formed by molding, in particular injection molding. In a third method step, or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The invention relates to a method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. [0002]
  • 2. Prior Art [0003]
  • Chemical sensors, like flow sensors or optical sensors, may be manufactured already in an integrated form in a cost-effective manner and at a high precision by conventional chip manufacturing processes. However, such IC sensors or chip sensors subsequently had to be incorporated in a package, which involved cumbersome assembly work, whereby the package, as a rule, was either screwed or glued and the connections to the sensors had to be led out of the package in a suitable manner. This applied not only to the electrical connections, but, in the case of chemical sensors, flow rate sensors or optical sensors, naturally also to line connections or optical fiber connections, which called for appropriate additional adaptation work of the packages. Thus, in the production of such sensors, incorporation in a package constituted a cost-determining factor for mass production. [0004]
    • SUMMARY OF THE INVENTION
  • The invention aims to provide a method of the initially defined kind, by which the assembly work involved can be substantially reduced and the necessary connections can, at the same time, be provided in a cost-effective manner by a few method steps. To solve this object, the method according to the invention essentially consists in that, in a first method step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires, that, after this, the package is formed by molding, in particular injection molding, and that, in a third method step or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened. In principle, chip molding with a suitable molding compound is known for many electronic components. Yet, none of the known methods is suitable for sensors which require to be in contact with the atmosphere, since after molding the sensor will no longer be accessible without cumbersome aftertreatment and the risk of damage to the sensor cannot be excluded in case of subsequent adaptation work. Due to the fact that, according to the invention, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface in a fist method step, the respective active sensor surface is kept free of the molding compound to be applied subsequently. The provision of bond wires as is common in chip manufacturing may be accomplished in a simple manner by conventional means, wherein, by a subsequent molding procedure, in particular an injection molding procedure, a finished component already comprising all electrical contacts is immediately provided. Thus, it merely has to be safeguarded that the active sensor surface in a suitable manner will again be in contact with the environment, to which end the hollow space is mechanically opened either during the second method step simultaneously with the casting-on or molding of the package or following this second method step. The opening of the hollow space in a third method step carried out subsequently is preferred to the simultaneous formation of the opening not the least because the simultaneous opening of the hollow space requires that the wall of the cap defining the hollow space be pierced immediately upon closure of the mold or injection mold, respectively. Since the injection molding compound, as a rule, has not set at that point of time, this will cause the previously positioned sensor to be displaced within the molding compound if no suitable abutment is provided on the opposite side. If injection molding is performed at an accordingly higher pressure, it will also have to be ensured in such a case that the mold will tightly sever the cap in order to prevent molding compound from being pressed into the hollow space. In the context of the method according to the invention, it is, therefore, advantageously proceeded such that the hollow space is opened by sawing and/or drilling after the at least partial setting of the molding compound. [0005]
  • In a particularly simple manner, the package may be made of suitable synthetics, a number of synthetics having proved to be suitable in semiconductor technology. [0006]
  • If an optical sensor is employed, the hollow space advantageously may be opened by drilling, whereupon an optical fiber is introduced into the opened hollow space. [0007]
  • In order to ensure the simultaneous formation of the electrical contacts with a view to inserting such a sensor provided with a package into a base or an appropriately prepared printed circuit board, it may advantageously be proceeded in a manner that the bond wires are connected with a frame including contact pins and that the frame is embbed in the molding compound leaving free the contact pins.[0008]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • In the following, the invention will be explained in more detail by way of the individual method steps schematically illustrated in the drawing. Therein: [0009]
  • FIG. 1 illustrates a section through a sensor; [0010]
  • FIG. 2 is a section through the sensor incorporated in a package; [0011]
  • FIG. 3 is a sectional view analogous to FIG. 2, schematically illustrating an operating tool intended to open the hollow space; [0012]
  • FIG. 4 is a view of the sensor upon opening of the hollow space; and [0013]
  • FIG. 5 shows an alternative method step for the formation of the opening of the hollow space in an illustration analogous to FIG. 2.[0014]
    • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • FIG. 1 depicts an [0015] IC sensor 1 whose sensor surface 2 is housed on the external side of the IC. In the first method step, a cap 3 forming a hollow space above the active sensor surface 2 is put on and electrical contacting is effected via bond wires 4.
  • From FIG. 2, the schematically represented [0016] package 5 is apparent after the injection molding procedure. A lead frame 6 comprising the respective bond wires is already integrated in the package 5, the hollow space 7 left being visible above the active sensor surface 2.
  • In the illustration according to FIG. 3, a saw is indicated at [0017] 8, by which the external wall of the package 5 and the cover cap 3 are appropriately severed so as to create an open connection to the hollow space 7 containing the active sensor element 2.
  • FIG. 4 illustrates the thus produced sensor, showing its [0018] opening 9 which enables the active sensor element 2 contained in the interior of the package 5 to communicate with the atmosphere.
  • FIG. 5 once again elucidates the method step for the production of the package under the simultaneous formation of an opening in an illustration analogous to FIG. 2. With this mode of operation, the method step of subsequently providing the opening of the hollow space indicated in FIG. 3 may be obviated. In the instant configuration, the [0019] cap 3 forming the hollow space does already comprise an interruption, the injection mold thus having to be modified accordingly. The mold consists of a first mold half 10 and a second mold half 11, wherein the first mold half 10, which is located adjacent to the cap 3, comprises inwardly projecting webs 12 which are sealingly pressed at the cap outside the interruption 13 of the cap already provided. To this end, the second mold half 11 comprises an accordingly formed pressure element 14 capable of pressing the webs 12 at the cap 3 in an accordingly tight manner such that an open access to the hollow space 7 will be formed immediately upon removal from the mold.
  • In the main, it is thus feasible to produce in a cost-effective manner encapsulated sensors appropriately integrated in a package by a few method steps suitable for series and mass production. [0020]

Claims (9)

What I claim is:
1. A method for housing a semiconductor or IC sensor having an active sensor surface, such as a chemical sensor, a flow sensor or an optical sensor, in a package, which method comprises
providing a cap above said active sensor surface so as to form a hollow space above said active sensor surface and connecting contact means and bond wire means to said sensor in a first method step,
forming said package by molding using a molding compound in a second method step, and
opening said hollow space formed above said active sensor surface in a third method step.
2. A method for housing a semiconductor or IC sensor having an active sensor surface, such as a chemical sensor, a flow sensor or an optical sensor, in a package, which method comprises
providing a cap above said active sensor surface so as to form a hollow space above said active sensor surface and connecting contact means and bond wire means to said sensor in a first method step, and
forming said package by molding using a molding compound and opening said hollow space formed above said active sensor surface in a second method step.
3. A method as set forth in
claim 1
 or
2
, wherein said package is formed by injection molding.
4. A method as set forth in
claim 1
 or
2
, wherein said hollow space is opened by sawing after said molding compound has at least partially set.
5. A method as set forth in
claim 1
 or
2
, wherein said hollow space is opened by drilling after said molding compound has at least partially set.
6. A method as set forth in
claim 1
 or
2
, wherein said hollow space is opened by sawing and drilling after said molding compound has at least partially set.
7. A method as set forth in
claim 1
 or
2
, wherein said package is made of a synthetic material.
8. A method as set forth in
claim 1
 or
2
, further comprising introducing an optical fiber into said hollow space after opening thereof.
9. A method as set forth in
claim 1
 or
2
, further comprising providing a frame including contact pin means, connecting said bond wire means with said frame and embedding said frame in said molding compound while leaving free said contact pin means.
US09/804,148 2000-03-14 2001-03-13 Method for housing sensors in a package Expired - Fee Related US6395585B2 (en)

Applications Claiming Priority (3)

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AT420/00 2000-03-14
AT0042000A AT410727B (en) 2000-03-14 2000-03-14 METHOD FOR PLACING SENSORS IN A HOUSING
ATA420/2000 2000-03-14

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US6395585B2 US6395585B2 (en) 2002-05-28

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EP (1) EP1134557B1 (en)
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ATA4202000A (en) 2002-11-15
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EP1134557A2 (en) 2001-09-19
EP1134557B1 (en) 2008-10-15

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