US20010018979A1 - Device and method of forming a unitary electrically shielded panel - Google Patents
Device and method of forming a unitary electrically shielded panel Download PDFInfo
- Publication number
- US20010018979A1 US20010018979A1 US09/808,493 US80849301A US2001018979A1 US 20010018979 A1 US20010018979 A1 US 20010018979A1 US 80849301 A US80849301 A US 80849301A US 2001018979 A1 US2001018979 A1 US 2001018979A1
- Authority
- US
- United States
- Prior art keywords
- panel
- electrically
- shielded
- conductive
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1424—Card cages
- H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Definitions
- the present invention relates to electronic enclosure sealing devices and, more particularly, to a device and method of forming a unitary electrically shielded panel.
- Electromagnetic interference is often the bane of electronic equipment and circuit designers. Federal regulations mandate that electronic equipment enclosures must not radiate electromagnetic signals that interfere with other proximately located electronic equipment. Electronic equipment enclosures must also be sufficiently shielded against interference from electromagnetic signals radiated from other proximately located equipment. The challenge to designers to control EMI becomes increasingly more difficult as the operating speed of electronic devices increases.
- apertures defined in electronic equipment enclosures are sealed using electrically shielded panels, e.g. circuit-pack faceplates, blank filler panels, covers, doors, etc., that may comprise a separate panel part and gasket.
- a metallic panel part will function as a conductive shield that spans the enclosure opening to reduce EMI passage therethrough.
- the gasket need only provide a perimeter seal between the panel part and the enclosure.
- the panel part may also be non-metallic, in which case a conductive paint or other similar conductive material must be applied to the surface of the panel part that is to receive the gasket.
- the conductive paint serves as a shield spanning the enclosure opening and the gasket provides a perimeter seal below the panel part and the enclosure.
- the gasket may be, for example, of metal, a metal-impregnated elastomer, or an elastomer wrapped in a metal sheath, and is affixed to the panel part in a subsequent operation after the panel part is formed.
- the gasket may be secured to the panel part by friction, adhesive, or by interlocking complementary parts on the panel part and gasket.
- fabricating an electrically shielded panel involves at least a two step process: 1) fabricating the panel part; and thereafter 2) affixing a gasket thereto.
- U.S. Pat. No. 5,641,438 to Bunyan et al. discloses a method of extruding a fluent electrically conductive polymeric material onto a rigid substrate to form a polymeric EMI gasket thereon. The polymeric material is then cured to produce a bead-like gasket on the substrate.
- the gasket disclosed in this reference is extruded onto the substrate as a secondary operation only after the substrate is fabricated and provides only a perimeter electrical seal.
- U.S. Pat. No. 5,524,908 to Reis discloses a multi-layered EMI gasket having first and second electrically conductive layers, with the second layer being more rigid than the first.
- the second layer must be conductive and generally malleable to permit bending, folding, notching and other forming of the disclosed EMI gasket.
- the layers may be secured together in a variety of ways including bonding, welding, laminating, or other art recognized affixation methods and techniques—ostensibly as a third step after the layers have been fabricated.
- the EMI gasket disclosed in this reference it must then be fastened to or between a substrate or other rigid material before it may be used to electronically seal an enclosure opening.
- the present invention advantageously provides a novel and unobvious device and method of forming a unitary electrically shielded panel that may be used to electrically seal an opening defined in an electronic enclosure to reduce the passage of EMI through the enclosure opening.
- the unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket, i.e. a thermoplastic elastomer, in a single tool during a single injection-molding operation.
- a unitarily formed electrically shielded panel is fabricated using a single tool during a single, two-shot injection-molding operation.
- a cavity defined within the tool comprises two parts: a first cavity part sized and shaped for forming the rigid panel part; and a second cavity part sized and shaped for forming the gasket.
- a first shot of the two-shot forming operation injects an electrically nonconductive rigid thermoplastic into the first cavity part to form the rigid panel part while a core is articulatably situated in the second cavity part—the core being substantially the same size and shape as the gasket or the second cavity part.
- the core is articulated so as to substantially vacate the second cavity part, and a second shot of the two-shot forming operation injects an electrically conductive elastomer into the second cavity part to form the gasket.
- the conductive elastomer chemically bonds to and with the electrically non-conductive rigid thermoplastic, thereby forming a unitary electrically shielded panel having an electrically non-conductive rigid thermoplastic panel part and a substantially planar and coextensive electrically conductive gasket unitarily formed therewith.
- the present invention is less costly to fabricate, requires no additional assembly, and provides a uniform and reliable EMI seal between the electrically shielded panel and the electronic enclosure.
- the panel part and gasket are separable and completely recyclable.
- FIG. 1 is a front perspective view of a unitarily formed electrically shielded panel in accordance with the present invention
- FIG. 2 is a rear perspective view of the shielded panel of FIG. 1;
- FIG. 3 is a front face view of the shielded panel of FIG. 1;
- FIG. 4 is a cross-sectional view of the shielded panel of FIG. 3 taken along the lines 4 - 4 in FIG. 3;
- FIG. 5 is a right side view of the shielded panel of FIG. 3 having a circuit-pack attached thereto;
- FIG. 6 is a rear face view of the shielded panel of FIG. 3;
- FIG. 7 is a front view of an electronic equipment enclosure having a plurality of electrically shielded panels constructed in accordance with the present invention installed therein;
- FIG. 8 is a diagrammatic view of a two-shot injection-molding apparatus for forming a unitary electrically shielded panel in accordance with the method of the present invention.
- the present invention advantageously provides a novel and unobvious unitarily formed electrically shielded panel that may be used to physically and electromagnetically seal an opening defined in an electronic equipment enclosure to reduce the passage of EMI through the enclosure opening.
- the present invention also provides a method of forming such a unitary electrically shielded panel.
- the unitary shielded panel comprises an electrically non-conductive rigid thermoplastic panel part that is chemically bound to and with a substantially planar, electrically conductive elastomeric shield or gasket, both formed in a single tool or mold during a single injection-molding operation.
- shield and gasket are used interchangeably herein in describing the substantially planar elastomeric part of the inventive shielded panel.
- FIGS. 1 and 2 depict an electrically shielded panel 10 constructed in accordance with the present invention.
- the term panel is intended to include, by way of non-limiting example, circuit-pack faceplates, blank filler panels, doors, covers, and other similar structure or devices that may be used to cover or seal an opening defined in an electronic equipment enclosure.
- the present invention applies to unitarily formed electrically shielded panels of virtually any shape and size and is not intended to be limited to the generally rectangular shielded circuit-pack faceplate described herein, which is merely an illustrative example and not intended to define or otherwise limit the scope of the present invention.
- the terms electronic equipment enclosure and electronic equipment cabinet are used in their broadest sense to refer generally to structures that contain electronic components, devices, systems, apparatuses, and the like.
- the unitary electrically shielded panel 10 comprises an electrically non-conductive rigid thermoplastic panel part 20 and a substantially planar, conductive elastomeric shield or gasket 30 .
- the shielded panel 10 is formed in a common or single tool or mold during a single, two-shot injection-molding operation (as described in further detail hereinbelow) during which the panel part 20 and gasket 30 are chemically bonded or bound together concurrent with their formation or fabrication to form the inventive unitary shielded panel 10 .
- the panel part 20 is generally rectangular in shape when viewed straight-on (i.e. from the front as in FIG.
- the unitary shielded panel 10 is employed as a circuit-pack faceplate, for example, the panel part 20 and gasket 30 may have a plurality of apertures 28 defined therethrough to accommodate displays (e.g., LEDs) or other visual indicators, switches, and other operative or informative circuit-pack components as well as screws or other fasteners utilized to secure the unitary shielded panel 10 to an enclosure 40 (FIG. 7).
- displays e.g., LEDs
- switches e.g., switches, and other operative or informative circuit-pack components as well as screws or other fasteners utilized to secure the unitary shielded panel 10 to an enclosure 40 (FIG. 7).
- the panel part 20 and gasket 30 may alternatively comprise substantially solid or continuous parts, devoid of openings, apertures, and the like. Since the inventive shielded panel 10 may be used in various configurations, it will be obvious to a person skilled in the art that the panel part 20 and gasket 30 may include, as a general matter of design choice, apertures, ridges, grooves, tabs, bosses, and numerous other structural features to facilitate use of the panel 10 .
- the panel part 20 is preferably formed from an electrically non-conductive rigid thermoplastic such, by way of non-limiting example, as polyetherimide (PEI), polysulfone, polycarbonate, or polybutal (PBT), although other thermoplastics are also contemplated by the present invention.
- PEI polyetherimide
- PBT polybutal
- the gasket 30 forms a substantially planar and coextensive conductive shield that covers the rear surface of the panel part 20 .
- the gasket 30 is generally rectangular in shape when viewed straight-on (as in FIG. 6) and has a periphery defining a gasket footprint 36 that is, at least in part, peripherally larger than the panel footprint 26 .
- the gasket 30 is wider than the panel part 20 preferably over most of its longitudinal length as depicted in FIGS. 3 and 4.
- the gasket 30 is preferably formed of a thermoplastic elastomer blended with a conductive filler and is sufficiently compatible with the non-conductive thermoplastic panel part 20 to permit the two materials to bond together during formation of the panel 10 in a single tool during a two-shot injection molding process. The compatibility also prevents adverse reaction between the conductive and non-conductive materials during formation and use of the inventive panel 10 .
- the compatibility further ensures sufficient bonding between the dissimilar materials as the panel 10 is fabricated and during the useful life of the panel 10 yet permits their selective separation for recyclability.
- the materials may be chemically and/or mechanically bonded together—mechanical bonding resulting from the high pressure at which the two materials are processed during formation of the panel 10 .
- Exemplary, non-limiting elastomers include ethylene-propylene-diene-terpolymers and styrene block copolymers.
- the conductive filler may by way of example comprise a short or long graphite fiber compound or a graphite powder. It will nevertheless be obvious to persons skilled in the art that other electrically conductive elastomers may alternatively be used to form the gasket 30 without departing from the spirit of the present invention.
- the rigid panel part 20 will generally include a plurality of mounting tabs 21 that extend substantially perpendicularly outward therefrom. (See, e.g., FIGS. 4 and 5).
- the gasket 30 may also include a plurality of conductive tabs 31 located near and spaced apart from the mounting tabs 21 and extending generally parallel thereto.
- a circuit-pack 60 may be attached to the tabs 21 , 31 using any suitable type of art-recognized attachment means or methods for mechanically and electrically attaching the circuit-pack 60 to the shielded panel 10 .
- an electronic equipment enclosure 40 having a plurality of electrically shielded panels 10 disposed in adjacent abutting relation to each other so as to provide an electromagnetic barrier or seal over an aperture 50 defined in the enclosure 40 .
- the aperture 50 defines the opening through which circuit-packs are operatively inserted into the enclosure 40 , although the aperture 50 may alternatively be an access opening in the enclosure 40 , a single circuit-pack opening, or any other number of functional openings.
- each electrically shielded panel 10 serves at least three purposes: first, it electrically contactingly engages the electronic enclosure 40 at least along the short sides 34 of the gasket 30 ; second, it abuttingly contacts the gasket 30 of adjacent electrically shielded panels 10 ; and third, it provides a substantially planar shield that attenuates or reduces the passage of EMI through the aperture 50 .
- the plural panels 10 effectively seal the aperture 50 and substantially block or reduce the passage of EMI therethrough. Consequently, the enclosure 40 radiates less EMI and is less susceptible to EMI radiated by other electronic devices.
- the plural inventive panels 10 depicted in FIG. 7 and discussed in the illustrative example hereinabove may consist of any combination of circuit-pack faceplates, blank filler panels or covers.
- a single electrically shielded panel 10 may be sized and shaped to sealingly cover the entire aperture 50 .
- the present invention additionally provides a method of forming, in a common or single tool or mold and during a single injection-molding operation, a unitary electrically shielded panel 10 having a non-electrically conductive rigid thermoplastic panel part 20 chemically bound to and integrally carrying a substantially planar and coextensive electrically conductive elastomeric shield or gasket 30 .
- injection-molding includes without limitation gas-assist injection-molding, high-pressure and low-pressure structural foam injection-molding, and other art-recognized thermoplastic and thermoset pressure-based forming methods and processes.
- the inventive method diagrammatically depicted by the apparatus of FIG.
- a tool or mold 120 has a first cavity 140 defined therein in the approximate size and shape of the panel part 20 .
- a second cavity 150 is defined within the tool 120 immediately adjacent the first cavity 140 so that the first and second cavities 140 , 150 are relatively positioned in the same manner in which the panel part 20 and gasket 30 are relatively positioned in the completed panel 10 , and is preferably the approximate size and shape of the gasket 30 .
- the tool 120 is configured for a two-shot injection-molding process during which a first shot injects an electrically non-conductive rigid thermoplastic 100 into the first cavity 140 to form the rigid panel part 20 .
- a second shot injects an electrically conductive elastomer 110 into the second cavity 150 to form the gasket 30 which bonds to it with the panel part 20 concurrent with its formation in the mold 120 .
- the predetermined time period is between approximately 15 and 30 seconds. It will be obvious to persons skilled in the art that the time period required for other thermoplastics to change from a liquid to a solid may vary.
- an articulatable core 130 is located within the second cavity 150 and preferably conforms to the size and shape of the cavity 150 .
- the core 130 is articulated so as to substantially vacate the second cavity 150 prior to the second shot.
- the electrically shielded panel 10 produced by the hereindescribed method is an integrated and unitary device comprised of an electrically nonconductive rigid thermoplastic panel part 20 that is chemically joined and bound to and with a substantially planar, electrically conductive elastomeric gasket 30 . It is thus possible, according to the present invention, to reliably, quickly and inexpensively fabricate an electromagnetic shield panel.
- Both the first and second shot occur during a single forming operation and thus form the inventive electrically shielded panel 10 during a single, two-shot injection-molding process.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A device and method of unitarily forming an electrically shielded panel for use in electromagnetically sealing an opening defined in an electronic enclosure. The unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket bonded together to form the unitary panel in a single tool during a single injection-molding operation.
Description
- 1. Field of the Invention
- The present invention relates to electronic enclosure sealing devices and, more particularly, to a device and method of forming a unitary electrically shielded panel.
- 2. Description of the Related Art
- Electromagnetic interference (“EMI”) is often the bane of electronic equipment and circuit designers. Federal regulations mandate that electronic equipment enclosures must not radiate electromagnetic signals that interfere with other proximately located electronic equipment. Electronic equipment enclosures must also be sufficiently shielded against interference from electromagnetic signals radiated from other proximately located equipment. The challenge to designers to control EMI becomes increasingly more difficult as the operating speed of electronic devices increases.
- Currently, apertures defined in electronic equipment enclosures are sealed using electrically shielded panels, e.g. circuit-pack faceplates, blank filler panels, covers, doors, etc., that may comprise a separate panel part and gasket. A metallic panel part will function as a conductive shield that spans the enclosure opening to reduce EMI passage therethrough. Here, the gasket need only provide a perimeter seal between the panel part and the enclosure. The panel part may also be non-metallic, in which case a conductive paint or other similar conductive material must be applied to the surface of the panel part that is to receive the gasket. The conductive paint serves as a shield spanning the enclosure opening and the gasket provides a perimeter seal below the panel part and the enclosure. The gasket may be, for example, of metal, a metal-impregnated elastomer, or an elastomer wrapped in a metal sheath, and is affixed to the panel part in a subsequent operation after the panel part is formed. The gasket may be secured to the panel part by friction, adhesive, or by interlocking complementary parts on the panel part and gasket. In other words, fabricating an electrically shielded panel involves at least a two step process: 1) fabricating the panel part; and thereafter 2) affixing a gasket thereto.
- U.S. Pat. No. 5,641,438 to Bunyan et al. discloses a method of extruding a fluent electrically conductive polymeric material onto a rigid substrate to form a polymeric EMI gasket thereon. The polymeric material is then cured to produce a bead-like gasket on the substrate. However, the gasket disclosed in this reference is extruded onto the substrate as a secondary operation only after the substrate is fabricated and provides only a perimeter electrical seal.
- U.S. Pat. No. 5,524,908 to Reis discloses a multi-layered EMI gasket having first and second electrically conductive layers, with the second layer being more rigid than the first. The second layer must be conductive and generally malleable to permit bending, folding, notching and other forming of the disclosed EMI gasket. The layers may be secured together in a variety of ways including bonding, welding, laminating, or other art recognized affixation methods and techniques—ostensibly as a third step after the layers have been fabricated. However, after the EMI gasket disclosed in this reference is formed, it must then be fastened to or between a substrate or other rigid material before it may be used to electronically seal an enclosure opening.
- The present invention advantageously provides a novel and unobvious device and method of forming a unitary electrically shielded panel that may be used to electrically seal an opening defined in an electronic enclosure to reduce the passage of EMI through the enclosure opening. In accordance with the present invention, the unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket, i.e. a thermoplastic elastomer, in a single tool during a single injection-molding operation.
- In accordance with the method of the present invention, a unitarily formed electrically shielded panel is fabricated using a single tool during a single, two-shot injection-molding operation. A cavity defined within the tool comprises two parts: a first cavity part sized and shaped for forming the rigid panel part; and a second cavity part sized and shaped for forming the gasket. A first shot of the two-shot forming operation injects an electrically nonconductive rigid thermoplastic into the first cavity part to form the rigid panel part while a core is articulatably situated in the second cavity part—the core being substantially the same size and shape as the gasket or the second cavity part. Following the first shot, the core is articulated so as to substantially vacate the second cavity part, and a second shot of the two-shot forming operation injects an electrically conductive elastomer into the second cavity part to form the gasket. The conductive elastomer chemically bonds to and with the electrically non-conductive rigid thermoplastic, thereby forming a unitary electrically shielded panel having an electrically non-conductive rigid thermoplastic panel part and a substantially planar and coextensive electrically conductive gasket unitarily formed therewith.
- The present invention is less costly to fabricate, requires no additional assembly, and provides a uniform and reliable EMI seal between the electrically shielded panel and the electronic enclosure. In addition, the panel part and gasket are separable and completely recyclable.
- Other objects and features of the present invention will become apparent from the following detailed description considered in conjunction with the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims.
- In the drawings, wherein like reference characters denote similar elements throughout the several views:
- FIG. 1 is a front perspective view of a unitarily formed electrically shielded panel in accordance with the present invention;
- FIG. 2 is a rear perspective view of the shielded panel of FIG. 1;
- FIG. 3 is a front face view of the shielded panel of FIG. 1;
- FIG. 4 is a cross-sectional view of the shielded panel of FIG. 3 taken along the lines4-4 in FIG. 3;
- FIG. 5 is a right side view of the shielded panel of FIG. 3 having a circuit-pack attached thereto;
- FIG. 6 is a rear face view of the shielded panel of FIG. 3;
- FIG. 7 is a front view of an electronic equipment enclosure having a plurality of electrically shielded panels constructed in accordance with the present invention installed therein; and
- FIG. 8 is a diagrammatic view of a two-shot injection-molding apparatus for forming a unitary electrically shielded panel in accordance with the method of the present invention.
- The present invention advantageously provides a novel and unobvious unitarily formed electrically shielded panel that may be used to physically and electromagnetically seal an opening defined in an electronic equipment enclosure to reduce the passage of EMI through the enclosure opening. The present invention also provides a method of forming such a unitary electrically shielded panel. In accordance with the present invention, the unitary shielded panel comprises an electrically non-conductive rigid thermoplastic panel part that is chemically bound to and with a substantially planar, electrically conductive elastomeric shield or gasket, both formed in a single tool or mold during a single injection-molding operation. The terms shield and gasket are used interchangeably herein in describing the substantially planar elastomeric part of the inventive shielded panel.
- Referring now to the drawings in detail, FIGS. 1 and 2 depict an electrically shielded
panel 10 constructed in accordance with the present invention. As used herein, the term panel is intended to include, by way of non-limiting example, circuit-pack faceplates, blank filler panels, doors, covers, and other similar structure or devices that may be used to cover or seal an opening defined in an electronic equipment enclosure. The present invention applies to unitarily formed electrically shielded panels of virtually any shape and size and is not intended to be limited to the generally rectangular shielded circuit-pack faceplate described herein, which is merely an illustrative example and not intended to define or otherwise limit the scope of the present invention. In addition, the terms electronic equipment enclosure and electronic equipment cabinet are used in their broadest sense to refer generally to structures that contain electronic components, devices, systems, apparatuses, and the like. - The unitary electrically shielded
panel 10 comprises an electrically non-conductive rigidthermoplastic panel part 20 and a substantially planar, conductive elastomeric shield orgasket 30. The shieldedpanel 10 is formed in a common or single tool or mold during a single, two-shot injection-molding operation (as described in further detail hereinbelow) during which thepanel part 20 andgasket 30 are chemically bonded or bound together concurrent with their formation or fabrication to form the inventive unitary shieldedpanel 10. Thepanel part 20 is generally rectangular in shape when viewed straight-on (i.e. from the front as in FIG. 3) and has two substantially parallel peripherallong sides 22 and two substantially parallel peripheralshort sides 24—the periphery of thepanel part 20 defining a panel part footprint 26 (see, e.g. FIG. 3). When the unitary shieldedpanel 10 is employed as a circuit-pack faceplate, for example, thepanel part 20 andgasket 30 may have a plurality ofapertures 28 defined therethrough to accommodate displays (e.g., LEDs) or other visual indicators, switches, and other operative or informative circuit-pack components as well as screws or other fasteners utilized to secure the unitary shieldedpanel 10 to an enclosure 40 (FIG. 7). It will be apparent to persons skilled in the art that the quantity, size and location of theapertures 28 will depend upon the specific shape and intended application of the shieldedpanel 10. Thepanel part 20 andgasket 30 may alternatively comprise substantially solid or continuous parts, devoid of openings, apertures, and the like. Since the inventive shieldedpanel 10 may be used in various configurations, it will be obvious to a person skilled in the art that thepanel part 20 andgasket 30 may include, as a general matter of design choice, apertures, ridges, grooves, tabs, bosses, and numerous other structural features to facilitate use of thepanel 10. - The
panel part 20 is preferably formed from an electrically non-conductive rigid thermoplastic such, by way of non-limiting example, as polyetherimide (PEI), polysulfone, polycarbonate, or polybutal (PBT), although other thermoplastics are also contemplated by the present invention. - As shown more clearly in FIGS. 2 and 6, the
gasket 30 forms a substantially planar and coextensive conductive shield that covers the rear surface of thepanel part 20. Thegasket 30 is generally rectangular in shape when viewed straight-on (as in FIG. 6) and has a periphery defining agasket footprint 36 that is, at least in part, peripherally larger than thepanel footprint 26. Specifically, thegasket 30 is wider than thepanel part 20 preferably over most of its longitudinal length as depicted in FIGS. 3 and 4. Thus, when two or more electrically shieldedpanels 10 are placed side-by-side, as depicted in FIG. 7, thelong sides 32 of thegaskets 30 of immediately adjacent electrically shieldedpanels 10 abuttingly contact each other so as to provide a physical and electrical seal therebetween—effectively forming a substantially continuous and planar electrical shield for electrically sealing anopening 50 defined in anelectronic enclosure 40. Thegasket 30 is preferably formed of a thermoplastic elastomer blended with a conductive filler and is sufficiently compatible with the non-conductivethermoplastic panel part 20 to permit the two materials to bond together during formation of thepanel 10 in a single tool during a two-shot injection molding process. The compatibility also prevents adverse reaction between the conductive and non-conductive materials during formation and use of theinventive panel 10. The compatibility further ensures sufficient bonding between the dissimilar materials as thepanel 10 is fabricated and during the useful life of thepanel 10 yet permits their selective separation for recyclability. The materials may be chemically and/or mechanically bonded together—mechanical bonding resulting from the high pressure at which the two materials are processed during formation of thepanel 10. Exemplary, non-limiting elastomers include ethylene-propylene-diene-terpolymers and styrene block copolymers. The conductive filler may by way of example comprise a short or long graphite fiber compound or a graphite powder. It will nevertheless be obvious to persons skilled in the art that other electrically conductive elastomers may alternatively be used to form thegasket 30 without departing from the spirit of the present invention. - When the inventive shielded
panel 10 is configured as a circuit-pack faceplate, as is depicted for example in the drawings, therigid panel part 20 will generally include a plurality of mountingtabs 21 that extend substantially perpendicularly outward therefrom. (See, e.g., FIGS. 4 and 5). Thegasket 30 may also include a plurality ofconductive tabs 31 located near and spaced apart from the mountingtabs 21 and extending generally parallel thereto. In this arrangement, a circuit-pack 60 may be attached to thetabs pack 60 to the shieldedpanel 10. - Referring next to FIG. 7, an
electronic equipment enclosure 40 is depicted having a plurality of electrically shieldedpanels 10 disposed in adjacent abutting relation to each other so as to provide an electromagnetic barrier or seal over anaperture 50 defined in theenclosure 40. For this illustrative example, theaperture 50 defines the opening through which circuit-packs are operatively inserted into theenclosure 40, although theaperture 50 may alternatively be an access opening in theenclosure 40, a single circuit-pack opening, or any other number of functional openings. Thegasket 30 of each electrically shieldedpanel 10 serves at least three purposes: first, it electrically contactingly engages theelectronic enclosure 40 at least along theshort sides 34 of thegasket 30; second, it abuttingly contacts thegasket 30 of adjacent electrically shieldedpanels 10; and third, it provides a substantially planar shield that attenuates or reduces the passage of EMI through theaperture 50. Thus, when a plurality of theinventive panels 10 are installed in theenclosure 40 so as to completely fill the expanse of theaperture 50, theplural panels 10 effectively seal theaperture 50 and substantially block or reduce the passage of EMI therethrough. Consequently, theenclosure 40 radiates less EMI and is less susceptible to EMI radiated by other electronic devices. The pluralinventive panels 10 depicted in FIG. 7 and discussed in the illustrative example hereinabove may consist of any combination of circuit-pack faceplates, blank filler panels or covers. Alternatively, a single electrically shieldedpanel 10 may be sized and shaped to sealingly cover theentire aperture 50. - The present invention additionally provides a method of forming, in a common or single tool or mold and during a single injection-molding operation, a unitary electrically shielded
panel 10 having a non-electrically conductive rigidthermoplastic panel part 20 chemically bound to and integrally carrying a substantially planar and coextensive electrically conductive elastomeric shield orgasket 30. As used herein, the term injection-molding includes without limitation gas-assist injection-molding, high-pressure and low-pressure structural foam injection-molding, and other art-recognized thermoplastic and thermoset pressure-based forming methods and processes. The inventive method, diagrammatically depicted by the apparatus of FIG. 8, is preferably a two-shot injection-molding process, although other processes suitable for molding or otherwise forming thermoplastics are also contemplated by and within the scope of the present invention. A tool ormold 120 has afirst cavity 140 defined therein in the approximate size and shape of thepanel part 20. Asecond cavity 150 is defined within thetool 120 immediately adjacent thefirst cavity 140 so that the first andsecond cavities panel part 20 andgasket 30 are relatively positioned in the completedpanel 10, and is preferably the approximate size and shape of thegasket 30. Thetool 120 is configured for a two-shot injection-molding process during which a first shot injects an electrically non-conductiverigid thermoplastic 100 into thefirst cavity 140 to form therigid panel part 20. After a predetermined time period, i.e. the time required for the thermoplastic 100 to change from a liquid to a solid, a second shot injects an electricallyconductive elastomer 110 into thesecond cavity 150 to form thegasket 30 which bonds to it with thepanel part 20 concurrent with its formation in themold 120. For the preferred thermoplastic (i.e. polyetherimide), the predetermined time period is between approximately 15 and 30 seconds. It will be obvious to persons skilled in the art that the time period required for other thermoplastics to change from a liquid to a solid may vary. During the first shot, anarticulatable core 130 is located within thesecond cavity 150 and preferably conforms to the size and shape of thecavity 150. Thecore 130 is articulated so as to substantially vacate thesecond cavity 150 prior to the second shot. The electrically shieldedpanel 10 produced by the hereindescribed method is an integrated and unitary device comprised of an electrically nonconductive rigidthermoplastic panel part 20 that is chemically joined and bound to and with a substantially planar, electrically conductiveelastomeric gasket 30. It is thus possible, according to the present invention, to reliably, quickly and inexpensively fabricate an electromagnetic shield panel. - Both the first and second shot occur during a single forming operation and thus form the inventive electrically shielded
panel 10 during a single, two-shot injection-molding process. - Thus, while there have shown and described and pointed out fundamental novel features of the invention as applied to preferred embodiments thereof, it will be understood that various omissions and substitutions and changes in the form and details of the devices illustrated, and in their operation, may be made by those skilled in the art without departing from the spirit of the invention. For example, it is expressly intended that all combinations of those elements and/or method steps which perform substantially the same function in substantially the same way to achieve substantially the same results are within the scope of the invention. It is the intention, therefore, to be limited only as indicated by the scope of the claims appended hereto.
Claims (26)
1. A unitary electrically shielded panel installable in an electronic equipment enclosure for electrically sealing an aperture defined in the enclosure against passage of electromagnetic radiation, said electrically shielded panel comprising:
an electrically non-conductive rigid panel part having a periphery; and
a substantially planar electrically conductive shield formed unitarily with said panel part and substantially coextensive with said panel part so that said shield overlaps and extends beyond said periphery of said panel part so that said electrically shielded panel operatively reduces passage of electromagnetic energy through the enclosure aperture when said electrically shielded panel is sealingly placed over the enclosure aperture.
2. The shielded panel of , wherein said shield comprises a gasket that electrically connects said shielded panel to the enclosure when said shielded panel is installed in the enclosure.
claim 1
3. The shielded panel of , wherein said shield is chemically bound to said panel part.
claim 1
4. The shielded panel of , wherein said panel part is formed from a thermoplastic.
claim 1
5. The shielded panel of , wherein said panel part is formed from polyetherimide.
claim 4
6. The shielded panel of , wherein said shield is formed from a thermoplastic elastomer.
claim 4
7. The shielded panel of , wherein said shield comprises a gasket that electrically connects said shielded panel to the enclosure when said shielded panel is installed in the enclosure.
claim 6
8. The shielded panel of , wherein said shield is chemically bound to said panel part.
claim 6
9. The shielded panel of , wherein said panel part periphery defines a panel part footprint and said shield has a periphery that defines a shield footprint, at least a portion of said shield footprint being larger than said panel part footprint.
claim 1
10. The shielded panel of , wherein said shielded panel is configured as a faceplate for a circuit-pack having a circuit ground, said panel part and said shield have a plurality of apertures defined therein, said panel part further comprising a mounting tab for mounting the circuit-pack to said shielded panel, said shield further comprising a conductive tab for electrically connecting the circuit ground to said shield and thereby electrically connecting the circuit ground and said shield to the electronic enclosure when said shielded panel is installed in the enclosure.
claim 1
11. A method of forming during a single forming operation an electrically shielded panel unitarily formed of an electrically non-conductive rigid part and a substantially planar and coextensive electrically conductive shield, said method comprising the steps of:
(a) introducing an electrically non-conductive thermoplastic in a flowable state into a first part of a cavity defined in a tool, the tool cavity having a second part having an articulatable core sized and shaped to fit within the second part of the tool cavity and initially disposed therein;
(b) permitting the electrically non-conductive flowable-state thermoplastic to at least partly solidify within the first part of the tool cavity;
(c) following said step (b), articulating the core so as to remove the core from the second part of the tool cavity; and
(d) following said step (c), introducing into the second part of the tool cavity an electrically conductive elastomer that bonds with the electrically non-conductive thermoplastic in the first part of the cavity to form a unitary electrically shielded panel having an electrically non-conductive rigid part and a substantially planar and coextensive electrically conductive shield.
12. The method of , wherein the bond between the electrically conductive elastomer and the electrically non-conductive thermoplastic is at least partly a chemical bond.
claim 11
13. The method of , wherein the bond between the electrically conductive elastomer and the electrically non-conductive thermoplastic is at least partly a mechanical bond.
claim 12
14. The method of , wherein said electrically non-conductive thermoplastic comprises polyetherimide.
claim 11
15. The method of , where said step (b) further comprises waiting between approximately 15 to 30 seconds for the non-conductive thermoplastic to at least partly solidify.
claim 14
16. The method of , wherein said step (a) further comprises injecting the electrically non-conductive rigid thermoplastic into the first cavity part under high pressure, and said step (d) further comprises injecting the electrically conductive elastomer into the second cavity part under high pressure.
claim 11
17. The method of , wherein said electrically non-conductive thermoplastic comprises polyetherimide.
claim 16
18. The method of , where said step (b) further comprises waiting between approximately 15 to 30 seconds for the non-conductive thermoplastic to at least partly solidify.
claim 17
19. The method of , wherein said step (a) further comprises injecting the electrically non-conductive rigid thermoplastic into the first cavity part under low pressure, and said step (d) further comprises injecting the electrically conductive elastomer into the second cavity part under low pressure.
claim 11
20. The method of , wherein said electrically non-conductive thermoplastic comprises polyetherimide.
claim 19
21. The method of , where said step (b) further comprises waiting between approximately 15 to 30 seconds for the non-conductive thermoplastic to at least partly solidify.
claim 20
22. A unitary electrically shielded panel installable in an electronic equipment enclosure for electrically sealing an aperture defined in the enclosure against passage of electromagnetic radiation, said electrically shielded panel comprising:
an electrically non-conductive rigid panel part formed by introducing an electrically non-conductive thermoplastic in a flowable state into a first part of a cavity defined in a tool, the cavity having a second part having an articulatable core initially disposed therein; and
a substantially planar electrically conductive shield formed unitarily with said panel part and substantially coextensive with said panel part and formed by articulating the core from the second part of the tool cavity so as to remove the core from the second part of the tool cavity after said forming of said rigid panel part and thereafter introducing into the second part of the tool cavity an electrically conductive elastomer that chemically bonds together with said panel part in the first part of the tool cavity so that said shield overlaps said panel part to thereby form said electrically shielded panel for operatively reducing passage of electromagnetic energy through an aperture of an enclosure when said electrically shielded panel is sealingly placed over the enclosure aperture.
23. The shielded panel of , wherein said shield comprises a gasket that electrically connects said shielded panel to the enclosure.
claim 22
24. The shielded panel of , wherein said panel part is formed from polyetherimide.
claim 22
25. The shielded panel of , wherein said shield is formed from a thermoplastic elastomer.
claim 24
26. The shielded panel of , wherein said shield comprises a gasket that electrically connects said shielded panel to the enclosure when said shielded panel is installed in the enclosure.
claim 25
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/808,493 US20010018979A1 (en) | 1997-12-10 | 2001-03-14 | Device and method of forming a unitary electrically shielded panel |
US10/614,641 US6865805B2 (en) | 1997-12-10 | 2003-07-07 | Device and method of forming a unitary electrically shielded panel |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US98851797A | 1997-12-10 | 1997-12-10 | |
US6328798A | 1998-04-20 | 1998-04-20 | |
US09/808,493 US20010018979A1 (en) | 1997-12-10 | 2001-03-14 | Device and method of forming a unitary electrically shielded panel |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US6328798A Division | 1997-12-10 | 1998-04-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/614,641 Continuation US6865805B2 (en) | 1997-12-10 | 2003-07-07 | Device and method of forming a unitary electrically shielded panel |
Publications (1)
Publication Number | Publication Date |
---|---|
US20010018979A1 true US20010018979A1 (en) | 2001-09-06 |
Family
ID=26743249
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/808,493 Abandoned US20010018979A1 (en) | 1997-12-10 | 2001-03-14 | Device and method of forming a unitary electrically shielded panel |
US10/614,641 Expired - Fee Related US6865805B2 (en) | 1997-12-10 | 2003-07-07 | Device and method of forming a unitary electrically shielded panel |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/614,641 Expired - Fee Related US6865805B2 (en) | 1997-12-10 | 2003-07-07 | Device and method of forming a unitary electrically shielded panel |
Country Status (1)
Country | Link |
---|---|
US (2) | US20010018979A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030201111A1 (en) * | 2001-08-21 | 2003-10-30 | Dell Products L.P. | Perforated EMI gasket |
US20050281013A1 (en) * | 2004-06-21 | 2005-12-22 | Carullo Thomas J | Removable ribs in a chassis housing to accommodate extra-wide printed circuit board assemblies |
US20110180315A1 (en) * | 2010-01-22 | 2011-07-28 | Fujitsu Network Communications, Inc. | Filler Panel for Air Flow Management |
US20110180314A1 (en) * | 2010-01-22 | 2011-07-28 | Fujitsu Network Communications, Inc. | Filler Panel with Cable Management Feature |
US20120186869A1 (en) * | 2011-01-21 | 2012-07-26 | Remy Technologies, L.L.C. | Method of blocking electro-magnetic interference (emi) in an electric machine and apparatus |
US20130309440A1 (en) * | 2011-10-28 | 2013-11-21 | Idc Solutions Pty Ltd | Panel |
US20130335899A1 (en) * | 2008-04-11 | 2013-12-19 | Apple Inc. | Portable Electronic Device Housing Structures |
US20140217564A1 (en) * | 2008-12-17 | 2014-08-07 | Microsoft Corporation | Semiconductor device with integrated antenna and manufacturing method therefor |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050236171A1 (en) * | 2004-04-23 | 2005-10-27 | Garcia Jorge L | Shield frame for a radio frequency shielding assembly |
US6991490B1 (en) * | 2005-07-11 | 2006-01-31 | Universal Scientific Industrial Co., Ltd. | Electronic device with a waterproof connector port cover |
JP4966377B2 (en) * | 2006-07-28 | 2012-07-04 | パーカー.ハニフィン.コーポレイション | Electronic component mounting assembly, its use and manufacturing method |
KR100836746B1 (en) * | 2007-04-17 | 2008-06-10 | 주식회사 나노인터페이스 테크놀로지 | Electromagnetic wave shielding heat-radiation sheet and manufactured method thereof |
EP2328749B1 (en) | 2008-08-18 | 2019-09-25 | Productive Research LLC. | Formable light weight composites |
JP2011040812A (en) * | 2009-08-06 | 2011-02-24 | Panasonic Corp | Portable wireless device |
KR20170103030A (en) | 2009-12-28 | 2017-09-12 | 프로덕티브 리서치 엘엘씨 | Processes for welding composite materials and articles therefrom |
KR102032405B1 (en) | 2010-02-15 | 2019-10-16 | 프로덕티브 리서치 엘엘씨 | Formable light weight composite material systems and methods |
US9233526B2 (en) | 2012-08-03 | 2016-01-12 | Productive Research Llc | Composites having improved interlayer adhesion and methods thereof |
US20150124425A1 (en) * | 2013-11-06 | 2015-05-07 | Cisco Technology, Inc. | Conductive Gasket |
US10103478B1 (en) * | 2017-06-23 | 2018-10-16 | Amazon Technologies, Inc. | Water resistant connectors with conductive elements |
US11338552B2 (en) | 2019-02-15 | 2022-05-24 | Productive Research Llc | Composite materials, vehicle applications and methods thereof |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2021A (en) * | 1841-03-29 | Peters | ||
US6340782B1 (en) * | 1989-10-04 | 2002-01-22 | Sca Hygiene Products Aktiebolag | Method of securing an elastic band and an article that includes such an elastic band |
SE508409C2 (en) * | 1992-03-04 | 1998-10-05 | Sca Hygiene Prod Ab | Absorbent diaper pants |
US5464578A (en) * | 1992-03-18 | 1995-11-07 | Hewlett-Packard Company | Method of making a compact fluid coupler for thermal inkjet print cartridge ink reservoir |
SE508027C2 (en) * | 1993-05-12 | 1998-08-10 | Moelnlycke Ab | Belt fastening device |
SE508186C2 (en) * | 1993-05-12 | 1998-09-07 | Moelnlycke Ab | Fixing belt for garments of absorbent material |
US5807368A (en) * | 1993-06-14 | 1998-09-15 | Minnesota Mining And Manufacturing Company | Disposable garment formed from an elastic film laminate |
GB2282054B (en) * | 1993-08-31 | 1997-05-07 | Kimberly Clark Co | Disposable panty |
KR100353702B1 (en) * | 1993-11-19 | 2003-10-08 | 더 프록터 앤드 갬블 캄파니 | Absorption Products with Structural Elastic Film Web Waist Belt |
US5554145A (en) * | 1994-02-28 | 1996-09-10 | The Procter & Gamble Company | Absorbent article with multiple zone structural elastic-like film web extensible waist feature |
SE508613C2 (en) * | 1994-04-12 | 1998-10-19 | Sca Hygiene Prod Ab | A method of making a pant diaper or a panty and such an absorbent article |
US5500063A (en) * | 1994-06-28 | 1996-03-19 | Kimberly-Clark Corporation | Method of joining an elastic band to a continuously moving partially elastic substrate |
WO1996000551A1 (en) * | 1994-06-30 | 1996-01-11 | Drypers Corporation | Diaper with de-elasticized elastic and manufacturing method |
US6551430B1 (en) * | 1995-05-31 | 2003-04-22 | Kimberly-Clark Worldwide, Inc. | Process for making a training pant having a unitary waist elastic system |
US5601547A (en) * | 1995-05-31 | 1997-02-11 | Kimberly-Clark Corporation | Waist elastic system with improved modulus of elasticity for a child's training pant |
US5711832A (en) * | 1995-05-31 | 1998-01-27 | Kimberly-Clark Worldwide, Inc. | Process for making a training pant having a separate waist elastic system |
AU712652C (en) * | 1995-07-14 | 2004-11-11 | Uni-Charm Corporation | Disposable absorbent undergarment of pants type |
US5827259A (en) * | 1995-10-25 | 1998-10-27 | Kimberly-Clark Worldwide, Inc. | Absorbent article with waist elastic and containment system |
CA2166008A1 (en) * | 1995-12-18 | 1997-06-19 | Daniel Richard Laux | Absorbent article with improved elastic margins and containment system |
US5846232A (en) * | 1995-12-20 | 1998-12-08 | Kimberly-Clark Worldwide, Inc. | Absorbent article containing extensible zones |
SE508102C2 (en) * | 1996-12-09 | 1998-08-24 | Moelnlycke Ab | Process for producing an intermittent elastic material web |
US6187425B1 (en) * | 1996-12-30 | 2001-02-13 | Kimberly-Clark Worldwide, Inc. | Elastic materials with improved performance at body temperature |
US6121545A (en) * | 1997-07-11 | 2000-09-19 | Parker-Hannifin Corporation | Low closure force EMI shielding spacer gasket |
US5932497A (en) * | 1997-09-15 | 1999-08-03 | Kimberly-Clark Worldwide, Inc. | Breathable elastic film and laminate |
CA2273284C (en) * | 1997-10-03 | 2009-12-15 | Kimberly-Clark Worldwide, Inc. | High performance elastic composite materials made from high molecular weight thermoplastic triblock elastomers |
US6129720A (en) * | 1997-12-31 | 2000-10-10 | Kimberly-Clark Worldwide, Inc. | Extensible absorbent article including an extensible absorbent pad layer |
US6193701B1 (en) * | 1997-12-31 | 2001-02-27 | Kimberly-Clark Worldwide, Inc. | Personal care article having zones with different resistance-to stretch |
US6264641B1 (en) * | 1998-05-07 | 2001-07-24 | Kimberly-Clark Worldwide, Inc. | Expandable cover garment |
US6322552B1 (en) * | 1998-06-19 | 2001-11-27 | Kimberly-Clark Worldwide, Inc. | Absorbent articles having belt loops and an adjustable belt |
US6248097B1 (en) * | 1998-08-06 | 2001-06-19 | Kimberly-Clark Worldwide, Inc. | Absorbent article with more conformable elastics |
US6135975A (en) * | 1999-02-01 | 2000-10-24 | Leading Lady, Inc. | Surgical chest dressing |
US6387471B1 (en) * | 1999-03-31 | 2002-05-14 | Kimberly-Clark Worldwide, Inc. | Creep resistant composite elastic material with improved aesthetics, dimensional stability and inherent latency and method of producing same |
US6572601B2 (en) * | 1999-06-04 | 2003-06-03 | Kimberly-Clark Worldwide, Inc. | Disposable absorbent articles having an adjustable, pretensioned waistband fastening system |
US6465073B1 (en) * | 1999-06-30 | 2002-10-15 | Kimberly-Clark Worldwide, Inc. | Variable stretch material and process to make it |
US6570056B1 (en) * | 1999-08-27 | 2003-05-27 | Kimberly-Clark Worldwide, Inc. | Absorbent article having zoned directional stretching |
JP3576045B2 (en) * | 1999-08-30 | 2004-10-13 | ユニ・チャーム株式会社 | Pants-type disposable diapers |
US6361527B1 (en) * | 1999-10-21 | 2002-03-26 | Kimberly-Clark Worldwide, Inc. | Three-dimensional pocket garment |
US6551294B1 (en) * | 1999-12-17 | 2003-04-22 | Kimberly-Clark Worldwide | Disposable absorbent articles having a stretch panel and an integrated waist size adjustment mechanism |
US6451679B1 (en) * | 2000-04-03 | 2002-09-17 | Taiwan Semiconductor Manufacturing Company | Ion mixing between two-step titanium deposition process for titanium salicide CMOS technology |
-
2001
- 2001-03-14 US US09/808,493 patent/US20010018979A1/en not_active Abandoned
-
2003
- 2003-07-07 US US10/614,641 patent/US6865805B2/en not_active Expired - Fee Related
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030201111A1 (en) * | 2001-08-21 | 2003-10-30 | Dell Products L.P. | Perforated EMI gasket |
US20050281013A1 (en) * | 2004-06-21 | 2005-12-22 | Carullo Thomas J | Removable ribs in a chassis housing to accommodate extra-wide printed circuit board assemblies |
US20130335899A1 (en) * | 2008-04-11 | 2013-12-19 | Apple Inc. | Portable Electronic Device Housing Structures |
US9730338B2 (en) * | 2008-04-11 | 2017-08-08 | Apple Inc. | Portable electronic device housing structures |
US10559544B2 (en) * | 2008-12-17 | 2020-02-11 | Microsoft Technology Licensing, Llc | Semiconductor device with integrated antenna and manufacturing method therefor |
US20140217564A1 (en) * | 2008-12-17 | 2014-08-07 | Microsoft Corporation | Semiconductor device with integrated antenna and manufacturing method therefor |
US8624133B2 (en) * | 2010-01-22 | 2014-01-07 | Fujitsu Limited | Filler panel with cable management feature |
US8502087B2 (en) * | 2010-01-22 | 2013-08-06 | Fujitsu Limited | Filler panel for air flow management |
US20110180314A1 (en) * | 2010-01-22 | 2011-07-28 | Fujitsu Network Communications, Inc. | Filler Panel with Cable Management Feature |
US20110180315A1 (en) * | 2010-01-22 | 2011-07-28 | Fujitsu Network Communications, Inc. | Filler Panel for Air Flow Management |
US8513541B2 (en) * | 2011-01-21 | 2013-08-20 | Remy Technologies, L.L.C. | Method of blocking electro-magnetic interference (EMI) in an electric machine and apparatus |
US20120186869A1 (en) * | 2011-01-21 | 2012-07-26 | Remy Technologies, L.L.C. | Method of blocking electro-magnetic interference (emi) in an electric machine and apparatus |
US20130309440A1 (en) * | 2011-10-28 | 2013-11-21 | Idc Solutions Pty Ltd | Panel |
US9872418B2 (en) * | 2011-10-28 | 2018-01-16 | Idc Solutions Pty Ltd. | Panel |
Also Published As
Publication number | Publication date |
---|---|
US6865805B2 (en) | 2005-03-15 |
US20040035599A1 (en) | 2004-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6865805B2 (en) | Device and method of forming a unitary electrically shielded panel | |
US6624432B1 (en) | EMI containment apparatus | |
US9456531B2 (en) | Lightweight electronic system for automotive applications and method | |
US8149594B2 (en) | Electromagnetic shield structure of electronics housing | |
US6178318B1 (en) | Shielding housing and a method of producing a shielding housing | |
US5473111A (en) | Shielded enclosure for housing electronic components and manufacturing method thereof | |
US6031732A (en) | Electronic apparatus with a shield structure and a shield case used in the shield structure and a manufacturing method of the shield case | |
US9271430B2 (en) | Flexible electronic circuit enclosure assembly | |
US8183470B2 (en) | Shielding cage having improved gasket | |
US20140313675A1 (en) | Electronic control apparatus for vehicle using overmolding and manufacturing method thereof | |
EP0936045A1 (en) | Molded electromagnetic shielding housings | |
US6963495B1 (en) | EMI shielded chassis for electrical circuitry | |
JPH08274483A (en) | Enclosure for electronic equipment and its manufacture | |
EP0872396A2 (en) | Valve control device | |
EP0818133A1 (en) | Control unit for a motor vehicle | |
EP1410931B1 (en) | Air vent having a electronic component embedded therein | |
US10285284B2 (en) | Method for molding outer case of electronic-circuit unit | |
JP3630595B2 (en) | Electromagnetic wave shield molding | |
CN1436382A (en) | Electromagnetic interference shielding of electrical cables and connectors | |
CN1436440A (en) | Shielding compartment | |
US10952323B2 (en) | Cable assembly for in-molded electronics assembly | |
JP6275894B2 (en) | Electromagnetic shielding container | |
EP2362551A2 (en) | Lightweight audio system for automotive applications and method | |
US20240314945A1 (en) | Sealed ecu assembly | |
CN212573290U (en) | Electronic product and vehicle |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |