JPH08274483A - Enclosure for electronic equipment and its manufacture - Google Patents

Abstract

PURPOSE: To provide an enclosure for electronic equipment, which has a high strength and high electromagnetic wave shielding property. CONSTITUTION: In an enclosure 11 for electronic equipment which is formed in a box-like shape by integrally forming side plate members 14 with end plate members 13, with each of the members 13 and 14 being composed of a metallic plate 15 and layered high polymer material 16, a contact section 15C which is formed by bending part of the metallic plate 15 in a size larger than the thickness of the plate 15 is exposed from at least part of the opening-side end face of each side plate member 14. When the enclosure 11 is connected to the contacting section 35C of an upper enclosure 33 through the contacting section 15C, the enclosures 11 and 33 can be brought into contact with each other at a low electric resistance and the electromagnetic wave shielding property of the enclosures 11 and 33 can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for an electronic device having an electromagnetic wave shielding property and a method for manufacturing the same, and can be used for a housing of a computer, a word processor, a telephone, and other electronic devices.

[0002]

BACKGROUND ART In recent years, polymer materials have been widely used as housings for electronic devices instead of metals, and it has become an important issue to block leakage or intrusion of electromagnetic waves generated from electronic devices. , Various countermeasures are adopted. Conventionally, as a means for imparting an electromagnetic wave shielding function to a polymer material housing, a method of attaching a conductive substance to the surface of a polymer molded body by thermal spraying, vapor deposition, sputtering, ion plating, plating, coating, etc. There is known a method of integrally molding using a conductive plastic in which a conductive filler is mixed with a polymer material. In addition, there is no need for complicated secondary processing steps such as the above-mentioned thermal spraying, vapor deposition, plating, etc., and the product properties such as impact resistance decrease and deterioration of product appearance due to mixing of conductive filler in the conductive plastic. In order to solve the problems such as a decrease in the product temperature and a decrease in the productivity due to a decrease in the fluidity at the time of molding, a method of laminating a metal foil or a metal plate and a polymer material and integrally molding is also known.

As an example of a laminate of a metal plate or the like and a polymer material, there are, for example, JP-A-4-135815 and JP-A-6-29669. In the former case, a shield material made of aluminum foil or the like is press-formed into a box shape that includes the shape corresponding to the electronic component mounting protrusion, the sandwiching margin during press molding is cut, and then the insert layer is formed to form the shield layer. To obtain a resin molded product. As a result, electromagnetic waves can be shielded and electrical connection between the earth circuit of the electronic component and the shield layer can be easily achieved. The latter is an electronic device casing in which a synthetic resin portion is provided so as to cover one side of a base body such as a plate-shaped aluminum plate. As a result, it is possible to achieve both higher strength, smaller size, and lighter weight, and electromagnetic shielding, as compared with an enclosure made of only synthetic resin.

FIG. 16 shows a schematic structure of an electronic equipment casing similar to that described in the above publication. In FIG. 16, a housing 110 for an electronic device is a metal plate 1 formed in a box shape.
A polymer material 112 is molded integrally with the member 11. The polymer material 112 integrally includes a boss 113 and a rib 114 that project through the metal plate 111, and a screw hole 115 is formed in the boss 113 as needed.

[0005]

However, in the former case of the above-mentioned publication, that is, the one disclosed in JP-A-4-135815, it is parallel to the end plate portion (bottom portion) of the press-formed shield material. Since the pinching margin of the press is cut and removed, the end of the side plate rising from the end plate has only the thickness of the shield material in the direction parallel to the end plate. . Therefore, when two dish-shaped resin molded bodies formed in this manner are opposed to each other to form a housing of an electronic device, a shield material (aluminum foil) is formed at the joint (joint surface) of the two molded bodies. Since the plates face each other with a small thickness corresponding to the plate thickness, there is a problem that a sufficient effect of blocking leakage or intrusion of electromagnetic waves cannot be obtained. It is considered that this is because the electromagnetic wave shield on the joint surface of the molded body was not sufficiently considered. Also,
Even in the latter case, that is, in the one disclosed in Japanese Patent Laid-Open No. 6-29669, the upper and lower casings face each other by the thickness of the metal substrate, which is the same as the former, and the same problem. There is.

In FIG. 17, the casing 110 in FIG. 16 is cut at different cross-sectional positions, and two upper and lower casings 11 of the same shape are cut.
The state of facing 0 is shown. According to this FIG. 17, the state at the joint (bonding surface) 116 of the metal plate 111 can be well understood, and the problems in each of the above-mentioned publications (sufficient leakage of electromagnetic waves, difficulty in blocking intrusion) are understood. it can.

By the way, a method of laminating a metal foil or a metal plate and a polymeric material and integrally molding them can be divided into two methods depending on the method of closely contacting the metal and the polymeric material. An adhesive / adhesive resin is adhered to the metal in advance by coating or laminating, and is adhered during molding. By conventionally known outsert formation, bosses and ribs are formed on a metal plate and adhered to each other. Among these, it is necessary to subject the metal to complicated pretreatment, and there are essentially the same problems as those of the above-mentioned thermal spraying, vapor deposition, plating and the like. On the other hand, the method of forming the boss and the rib on the metal plate by the outsert molding and bringing them into close contact has the following problems. Since the adhesion is expressed only by the parts made of a specific polymer material such as the boss and the rib, the adhesion with the sheet metal is insufficient, and the effect of reinforcing the housing by the sheet metal is not sufficient. In particular,
Since these parts are rarely installed on the side surface of the housing, the reinforcing effect on the side surface is low. In the upper and lower parts of the casing in a half-divided state, that is, at the connecting surfaces of the parts such as the upper lid and the lower lid, the metal plates are bonded with a very small width corresponding to the thickness of the metal plate, as described above, so connection The electrical contact resistance on the surface becomes large, and sufficient effect of blocking the leakage or intrusion of electromagnetic waves cannot be obtained.

An object of the present invention is to maximize the reinforcing effect of a metal plate and to provide a sufficient electromagnetic wave shielding property when the housing of an electronic device is subjected to an electromagnetic wave shield treatment using a metal plate. An object of the present invention is to provide an electronic device casing and a method for manufacturing the same.

[0009]

In a housing for electronic equipment of the present invention, a part of the metal plate is exposed by bending a part of the metal plate at a size equal to or larger than the thickness of the metal plate at the end face on the opening side which is the joint surface of the housing. By doing so, the above-described object is achieved. At this time, the member facing the joint surface of the housing is not limited to the dish-shaped member similar to the housing, and may be a simple plate-shaped member or the like.

The electronic equipment casing of the present invention is specifically
A side plate member is integrally formed on the periphery of the end plate member to form a box shape, and the end plate member and the side plate member are formed by layering a metal plate and a polymer material into a casing for electronic equipment. In, at least a part of the opening side end surface of the side plate member,
A housing for an electronic device, characterized in that a contact portion formed by bending a part of a metal plate with a size larger than the thickness of the metal plate is exposed.

In the case of the present invention, the metal plate is preferably arranged inside the case. In the present invention,
It is preferable that the terminal edge of the contact portion of the metal plate is located inside the thickness of the side plate member in that the metal material is not exposed to the outer surface of the housing. Furthermore, the terminal edge faces inward of the side plate member. It is preferable that it is further folded back from the viewpoint of strengthening the bonding force with the polymer material. Further, in the present invention, the fact that a part of the metal plate is integrally bent and exposed also at the tip end surface of the circuit board mounting protrusion protruding from the end plate member provides electrical continuity with the circuit board. It is preferable above.

The method for manufacturing a housing for electronic equipment of the present invention corresponds to the end plate member and the side plate member integrally formed on the peripheral edge of the end plate member, which constitutes the box-shaped housing for electronic equipment. A predetermined polymer material is injected in a state where a metal plate having the end plate portion and the side plate portion and having the contact portion bent from the side plate portion toward the outside of the housing is inserted into the mold. Is integrally formed by exposing a part of the contact portion of the metal plate to an end portion of the side plate member to obtain a housing for an electronic device.

In the method of the present invention, it is preferable that the metal plate is formed in a box shape by bending a substantially thick cross metal material by press molding.

[0014]

In the electronic equipment casing of the present invention, a dish-shaped casing having a substantially similar shape or a different shape is joined so as to face each other, or a flat plate-shaped lid including a metal plate is joined to form a closed space. When a housing for electronic equipment is configured, the metal plates at the joints come into contact with each other at the exposed portions having a thickness equal to or greater than the thickness of the metal plates, so that a pair of casings or a casing and a lid have low electrical contact. Contact with resistance. Therefore, the entire circumference of the housing including the contact surface is continuous with sufficient conductivity, and sufficient electromagnetic wave shielding property is exhibited.
At this time, due to the presence of the metal plate, the housing or housing has sufficient strength and can be made thin.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 7 show an embodiment of the present invention. In FIG. 1, a housing used for an electronic device
10 is the lower half and upper half (back and front)
The electronic device casings 11 and 31 are connected to each other with the openings 12 and 32 facing each other and fixed by a bolt 41 as a connecting tool. The casings 11 and 31 are each formed in a dish shape, and end plate members 13 and 33 having a shape of a substantially rectangular plane or the like which constitutes a lid or a bottom portion.
And side plate members 14 and 34 integrally formed around the end plate members 13 and 33. The end plate members 13 and 33 and the side plate members 14 and 34 that form the casings 11 and 31 include the end plate portions 15A and 35A and the side plates 15B corresponding to the end plate members 13 and 33, respectively.
35B integrally formed with 35B, 35 and this metal plate 15,
The polymeric material 16, 36 that integrally covers the periphery of 35 with the end plate portions 16A, 36A and the side plate portions 16B, 36B is formed in layers.

The polymer materials 16 and 36 have bosses 17 and 37 which penetrate the end plates 15A and 35A of the metal plates 15 and 35 and project into the housing.
Are integrally formed. Of these bosses 17, 37,
The boss 17 of the lower housing 11 is provided with a screw hole 18 into which a bolt 41 is screwed, while the boss 37 of the upper housing 31 is provided with a stepped hole 38 into which the bolt 41 is inserted and which receives the head. ing.

At the opening-side end faces of the side plate members 14 and 34 of the casings 11 and 31, the peripheral portions of the metal plates 15 and 35 are integrally bent from the side plate portions 15B and 35B of the metal plates 15 and 35 to the outer peripheral side. The contact portions 15C and 35C thus formed are formed. This contact part 15C, 35C
Is bent to a size larger than the plate thickness of the metal plates 15 and 35, and is formed so as to be exposed at the opening-side end faces of the side plate members 14 and 34 (see also FIG. 2). This allows two housings 1
When the 1 and 31 are joined, the openings 12 and 32 of both housings 11 and 31
The contact portions 15C and 35C are in contact with each other in an electrically low resistance state, and a sufficient electromagnetic wave shielding property can be exhibited.

3 and 4 show the shape of the metal plate 15 of the one housing 11 before and after the bending. In addition,
Since the metal plate 35 of the other case 31 has the same shape, the description thereof will be omitted. In FIG. 3, the metal plate 15 is formed by punching a metal material such as an aluminum plate into a substantially bold cross shape by pressing or the like. As described above, the metal plate 15 is formed integrally with the rectangular end plate portion 15A, the side plate portion 15B protruding from each side of the end plate portion 15A, and the tip side of each side plate portion 15B. And a contact portion 15C. End plate 15A
A plurality of through holes 15D having a slightly large diameter for penetrating the boss 17 are formed at a plurality of positions, that is, four positions in this embodiment. Also,
The end plate portion 15A and the side plate portion 15B have a metal plate 15 and a polymer material.
A plurality of small holes 15E are formed at a plurality of positions, in the present embodiment, 17 positions, which are formed to penetrate the small holes 15E in order to ensure sufficient bonding strength with the 16. As shown in FIG. 4, the metal material of FIG. 3 is bent by pressing or the like, and is formed into a rectangular box shape (dish shape) in which the contact portion 15C is projected in a direction parallel to the end plate portion 15A. . On the metal plate 15, a polymer material 16 is integrally formed as a layer by a molding method described later.

For better understanding of the above description, FIGS. 5 (A), 5 (B) and 5 (C) show that the metal plate 15 is made of a polymer material.
A plan view, a right side view, and a bottom view after integrally molding 16 in a layer shape are shown. In addition, line VI-VI, VII-VII in FIG.
Cross-sections along the line are shown in FIGS. The planes and cross-sections of these are the same between the one housing 11 and the other housing 31, and the illustration of the other housing 31 is omitted.

FIG. 8 shows a housing for electronic equipment according to this embodiment.
An example of manufacturing methods 11 and 31 is shown. In FIG. 8 (A), a male die 51 forming a part of the die 50 is formed in a substantially convex shape, and the convex portion 51 of this male die 51 has a shape as shown in FIG. 8 (B). In addition, the end plate portion 15A, the side plate portion 15B and the contact portion 15
A metal plate 15 having C is coated and attached. The male mold 51 to which the metal plate 15 is attached has a concave portion 52A corresponding to the convex portion 51A.
As shown in FIG. 8 (C), the female mold 52 having is moved in the arrow direction to be engaged. Male mold 51 and female mold 5 engaged with the metal plate 15 attached (inserted)
2, that is, the mold 50 has a space (cavity) for injecting a polymer material (synthetic resin) as shown in FIG.
53 is formed, and a polymeric material having fluidity is injected into the cavity 53 from a nozzle 54 of a molding machine such as an injection molding machine or an extrusion molding machine, and the polymeric material 16 is layered around the metal plate 15. It is integrally molded. After that, the polymer material 16 is solidified by heating, cooling, or the like. Then, after the female mold 52 is opened,
As shown in FIG. 8 (E), the metal plate 15 and the polymer material
The electronic device casing 11 constituted by 16 is taken out in the direction of the arrow, and further, as shown in FIG. 8F, unnecessary portions such as the gate portion are cut off to form an electronic device casing 11 as a product.
Is obtained.

In manufacturing the electronic device casings 11 and 31, the shape of the gate portion is not limited to the direct gate having the shape shown in FIG. That is, in addition to the direct gate, a standard gate shape such as side, fan, submarine, pinpoint, or a special gate shape such as film or tab may be used. The runner may be a hot runner in addition to the cold runner of the system shown in FIG.

The characteristics of the metal plates 15 and 35 used in this embodiment are as follows. Material Any material may be used as long as it has electromagnetic wave shielding performance and is easy to process, and the type of metal is not limited. Specific examples include aluminum, copper, iron, nickel, tin, zinc, and alloys containing these metals as main components (for example, stainless steel, brass, brass, etc.). Further, those obtained by plating these metals and alloys (alloys) with zinc, nickel, chromium or the like can be used. However, when used for portable electronic devices, various steel materials and aluminum having a high longitudinal elastic modulus per specific gravity are suitable. Thickness In order to provide electromagnetic wave shielding performance for electronic devices, a thickness of 0.1 mm or more is sufficient for the above materials. This thickness may be appropriately determined for each material used in consideration of the balance between the degree of improvement in functions such as mechanical strength and heat resistance and the weight of the housing. Further, when the metal plates 15 and 35 are relatively thin, they may be called metal foils, but in the present invention, such names are also included in the metal plates, and the names thereof are not limited. Shape From the viewpoint of electromagnetic wave shielding performance, a box shape that covers the entire inner surface of the housing of the electronic device is desirable. Regarding the development of adhesion between the metal plate 15 and the polymer material (synthetic resin) 16, the reduction in the size of the resin 16 that covers the box-shaped metal plate 15 from the outside after molding is large with respect to the dimensional change of the metal plate 15. It is expressed using this,
In order to make this adhesion sufficient, a box-shaped metal plate 15
It is preferable to have the following structure. (1) Side 15B and / or bottom 15A of the box made of metal plate 15
Holes 15E are provided in the metal plate 15 to allow the resin 16 to pass through the metal plate 15 at the time of molding, or to project on the metal plate 15 after the resin 16 passes.
(See FIG. 9A) or forming (protruding) the protrusion 16E larger than the size of the hole 15E (see FIG. 9B). In these structures, stress may be generated in the resin 16 passing through the hole 15E due to expansion and contraction of the resin 16 due to a change in environmental temperature during use. Therefore, the shape of the hole 15E concentrates stress. It is difficult to have a circular or elliptical shape. (2) On the side surface portion 15B of the metal plate 15, the concave shape portion 1 when viewed from the inner peripheral side.
There is a method of providing 5F or the convex portion 15G (Fig. 10).
(See (A) and (B)). In these structures, due to the expansion and contraction of the resin 16 due to changes in the ambient temperature during use, stress may concentrate on the resin 16 that exists in or near the depression, so a concave or convex shape may cause stress concentration. A hemisphere or an ellipse that is difficult to make is desirable. (3) Combine (1) and (2), and make a hole 1 in the concave portion 15F.
5E is provided to allow the resin 16 to pass through the metal plate 15 at the time of molding, or to be provided with protrusions 16C and 16D which are projected on the metal plate 15 after the passage (see FIG. 11A), or the size of the hole 15E. Forming (protruding) a protrusion 16E having a larger size (FIG. 11).
(See (B)) method. These methods are effective when the resin 16 that protrudes does not increase the wall thickness of the housing 11 and thus is desired to be thin. (4) There is also a method of using the hole 16H for the purpose of radiating heat and inserting a connector for connection to peripheral devices (see FIG. 12).
In order to form the hole 16H, a large hole 15H is formed in the metal plate 15, and the resin passes through a part of the cross section of the hole 15H (FIG. 12 (A)).
(See FIG. 12) or, after passing, it projects onto the metal plate 15 (FIG. 12 (B)).
(See FIG. 12) or a size larger than the size of the hole 15H (protruding) (see FIG. 12C).

Further, the polymer material 1 used in this example
Nos. 6 and 36 have the following characteristics. That is, the polymer materials 16 and 36 are used to appeal to consumers' sensibilities and to provide designs with excellent functionality. Therefore, as long as it has sufficient fluidity for molding at the time of molding and is solidified and shaped by a predetermined operation, the type of thermoplasticity or thermosetting is not selected. Specific examples of the polymer materials 16 and 36 include thermoplastic resins such as ABS (acrylonitrile-butadiene-styrene), AS (acrylonitrile-styrene), PMMA (polymethylmethacrylate), PA (polyamide), POM (polyoxymethylene, Polyacetal), PPS (polyphenylene sulfide), PC (polycarbonate), PS (polystyrene), PBT (polybutylene terephthalate), PE
T (polyethylene terephthalate), PP (polypropylene), PVC (polyvinyl chloride), PE (polyethylene), and other resins can be used. Further, alloys obtained by blending two or more of these resins, or those obtained by blending the above-mentioned resins alone or alloys with fibrous, plate-like, spherical, amorphous organic, inorganic and metal fillers, and further, EPR (Ethylene-propylene rubber), EPDM (Ethylene-propylene-diene rubber)
It may be a blend of rubber components such as. As the thermosetting resin, phenol resin, epoxy resin,
Unsaturated polyester resin, polysulfone resin, and other resins can be used.

According to the above-mentioned embodiment, there are the following effects. That is, the electronic device casings 11 and 31 of the present embodiment are
The contact portions 15C, 35C integrally formed with the metal plates 15, 35 are exposed at the end faces of the openings 12, 32.
Since C and 35C have a size larger than the plate thickness of the metal plate 15, a pair of housings 11 and 31 are opposed to each other and combined to form a housing.
When 10 is formed, the contact portions 15C and 35C come into contact with each other with a low electric resistance, and it is possible to prevent the deterioration of the electromagnetic wave shielding property, which is a problem in the method using the conventional metal plate, and to exhibit a sufficient electromagnetic wave shielding property. . Further, the casings 11 and 31 have the functions of sufficient strength, more specifically, impact resistance, rigidity, heat resistance, and the like, as compared with the case where only the polymer material is used, due to the metal plates 15 and 35. Therefore, it is possible to reduce the thickness of the housings 11 and 31.

Furthermore, since the metal plates 15 and 35 are manufactured only by the steps of punching and bending, they can be easily manufactured by pressing. Also, the end plate members of the casings 11 and 31.
For the outer surface of 13, 33, that is, for the design on the side where the metal plates 15, 35 are not installed, since the polymeric materials 16, 36 are used, it is not affected by the shape of the inner metal plates 15, 35, therefore, It is possible to add appropriate decorations and R shapes according to the requirements.

Next, experimental examples and comparative examples conducted for confirming the effects of the present invention will be described. Experimental Example In the present Experimental Examples 1, 2, and 3, a metal plate 15 having a box shape as shown in FIGS.
The outer shape of the housing 11 after integrally molding 16 is shown in FIG.
As shown in (B), vertical dimension L1 = 200mm, horizontal dimension L
2 = 270 mm, height L3 = 30 mm, vertical dimension L4 = 10 mm from the outer edge of the housing at the center of each boss 17, horizontal dimension L5 = 15 mm, product thickness is 2.5 mm including metal plate 16 Has been done.
At this time, the metal plate 15 and the polymer material 16 have 17 positions at the small holes 15E shown by small circles in FIGS. 5A, 5B and 5C, in addition to the 4 positions of the boss 17, It is connected and fixed at 21 places in total.

As the resin of the polymer material 16, flame-retardant polystyrene (melt index = 5 g / 10 min) was used. More specifically, 15 parts of a bromine-based flame retardant was added to high-impact polystyrene obtained by copolymerizing butadiene and used. The melt index was measured at a load of 5 kgf and a temperature of 200 ° C. Stainless steel bolts were used to fix the upper and lower (front side and back side) housings.

The plate thickness and the material of the metal plate 15 differ depending on the experimental example. In Experimental Examples 1 and 3, a steel plate having a thickness of 0.2 mm was pressed, and in Experimental Example 2, a plate having a thickness of 0.3 mm was used. A pressed aluminum plate was used. The molding conditions of the polymer material 16 also differ depending on the experimental example, and the experimental example 1,
In No. 2, an injection molding machine with a mold clamping force of 650 Ton was used and molding was performed at a cylinder temperature of 220 ° C and a mold temperature of 45 ° C. In Experimental Example 3, an injection compression molding machine was used instead of the injection molding machine of Experimental Example 1,
From the initial die clearance of 4.0 mm to the product wall thickness of 2.5 mm, the mold was clamped in about 20 seconds from 1 second before the completion of filling to mold.

Comparative Example As the metal plate, a steel plate having a thickness of 0.2 mm was pressed, as in Experimental Examples 1 and 3. Experimental example 1,
Use the same shape and size as in item 3, but cut away the contact parts that are folded back to a size larger than the plate thickness, and use the metal plates of the upper and lower casings to abut with the plate thickness. . Further, the product thickness is the same as the experimental example in that the product thickness including the metal plate is 2.5 mm, but the metal plate and the polymer material are different from each other as shown in FIG.
(C) was not connected or fixed by the small hole 15E. Flame-retardant polystyrene (mate index = 5 g / 10 min) was used as the polymer material, and the molding was performed using an injection molding machine with a mold clamping force of 650 Ton, as in Experimental Examples 1 and 2.
It was molded under the molding conditions of 220 ° C and a mold temperature of 45 ° C.

Table 1 shows the measurement results of the characteristics of Experimental Examples 1 to 3 and Comparative Example. Here, the measuring method of each characteristic is as follows. Electromagnetic wave shield effect Advantest method: Using an Advantest shield evaluation device, the shield effect was measured at a frequency of 500 MHz. Buckling strength The load during buckling was measured with a compression tester. Falling ball impact strength A 530-g steel ball was dropped onto the center of the top surface of the product and cracked with a 50% probability, and the height at which cracking occurred was measured. Load deflection temperature A vertical load of 5 kg was applied to the center of the top surface of the product with an indenter of R = 5 mm, and the temperature was measured when a vertical deformation of 5 mm occurred. Heat cycle test -10 ℃ → 80 ℃ → -10 ℃ → 80 ℃ …… The cycle that changes between -10 ℃ and 80 ℃ cyclically as in The temperature was kept for 3 hours, 1 cycle was carried out for 8 hours for 30 cycles and 240 hours, and then the presence or absence of cracks was confirmed.

[0031]

[Table 1]

According to Table 1, in most performances,
Experimental Examples 1 to 3 according to the present invention showed superior performance to Comparative Examples. In the heat cycle test, Experimental Examples 1 and 2
Although cracks were generated in the sample, the degree thereof was milder than that of the comparative example.

It should be noted that the present invention is not limited to the above-described embodiments, and modifications within the range in which the object of the present invention can be achieved are included in the present invention. For example, in the above-described embodiment, the metal plate 15 and the polymer material 16 are formed by insert molding, but if necessary, the boss and rib may be formed on the metal by outsert molding. Also,
The stepped hole 38 on the front side and the screw hole 18 on the back side of the housings 11 and 31 may be replaced with each other. In other words, it does not matter which side has the stepped hole (boss hole) or which side has the screw hole. Further, the external shape of the housings 11 and 31 is not limited to the planar quadrangular shape, and may be a circle, an ellipse, a quadrangle with rounded corners, a triangle, a polygon having five or more sides, or another irregular shape. It doesn't matter.

When a thermoplastic polymer material is used as the polymer material 16, the mechanical strength of the thermoplastic polymer material,
Properties such as heat resistance are generally better when the molecular weight is increased, but on the other hand, the fluidity is reduced and thin molding becomes difficult. Therefore, when performing thin-wall molding of a thermoplastic polymer material, it is an effective technique to use injection compression molding as a molding method of the polymer material of the present invention. That is,
When supplying an injection molding machine with the amount of polymer material required to mold a product on a metal plate that has the simple shape of the product installed in the mold, make it larger than the target product wall thickness of the mold. It is a method in which the polymer material is supplied and the mold is clamped to the intended product thickness after the polymer material is supplied. This method allows the formation of a housing for electronic equipment having an outer layer of thin polymeric material. This is suitable for housings of various portable electronic devices that require compactness. Further, using the same molding method also has the effect of reducing internal strain during molding, so when used for molding a product with a normal wall thickness,
It is possible to reduce the amount of deformation due to changes in environmental temperature. For this reason, it is preferable to use it also for molding a product having a normal thickness.

Further, as shown in FIGS. 13A to 13D, the bent contact portion 15C of the metal plate 15 can be variously modified. That is, as shown in FIG. 13 (A), the end of the contact portion 15C is not extended to the outer periphery of the side plate member 14 but is located inside the thickness thereof, and the metal plate 15 is on the outer surface of the housing 11. It may not be exposed. By doing so, it is possible to improve the appearance and prevent the metal plate 15 from being externally affected by electrical influences such as electric leakage. Figure 13 (B)
The contact portion 15C of the above is stepped so that the upper and lower casings 31 and 11 are securely engaged with each other. 13C and 13D show
Similar to (A), the peripheral edge (end) of the contact portion 15C is the side plate member 14
The stepped portion 16I or the recessed portion 16J which is integral with the polymer material 16 is formed on the outside of the intermediate portion. Even in the structures shown in FIGS. 13C and 13D, the housings 11 and 31 are
There is an effect that can be surely engaged.

Further, as shown in FIGS. 14A to 14E, the side plate member 14 is continuous with the outer edge of the contact portion 15C of the metal plate 15.
A folded-back portion 15I that faces inward may be provided. Here, in the example of FIGS. 14A to 14E, the folded portion 15H is provided continuously to the contact portion 15C of the metal plate 15 in FIGS. 2 and 13A to 13D, respectively. . If such a folded portion 15I is provided, the end portion of the metal plate 15 and the polymer material 16
It is possible to add an effect that the binding with the can be more reliably performed.

Further, in each of the above-described embodiments, the metal plate 15 is provided on the inner peripheral side of the polymer material 16, but it may be provided inside or on the outer peripheral side of the polymer material 16. However, if it is provided on the inner peripheral side, there is an advantage that a mold or the like can be easily manufactured and electrical contact with the outside can be prevented. At this time, when the metal plate 15 is provided on the outer peripheral side of the polymer material 16, the contact portion 15C is of course bent inward of the housing.

Further, the contact portion 15C does not need to be provided on the entire circumference of the opening side end surface of the side plate member 14, but may be provided on at least a part thereof so that the upper and lower casings 31 and 11 are electrically connected to each other with low electrical conductivity. It is enough if you can do it under resistance.

As shown in FIG. 15, inside the housing 11, the end plate member 13 has a circuit board (not shown, for example, Japanese Patent Laid-Open No. 4-135815).
Similar to the one shown in Japanese Patent Publication)
17 may be provided. The protrusion 17 is provided with a base conduction portion 15J which is formed by bending a part of the metal plate 15 integrally and is exposed to the inside of the housing 11, and has a screw hole at the center of the protrusion 17. 16K is preferably formed. If formed in this way, the metal plate 15 and the circuit board are automatically electrically connected when the circuit board is attached to the housing 11.

Further, as shown by an imaginary line (two-dot chain line) in FIG. 6, the members that are combined with the housing 11 and constitute the electronic device housing 10 include a metal plate 56 and a polymer material 57. The lid 55 may be integrally formed in a flat plate shape, or may be a simple metal plate, and its shape is not limited.

[0041]

According to the present invention, in the housing for electronic equipment, there is an effect that the electromagnetic wave shielding property can be improved while maintaining the mechanical strength.

[Brief description of drawings]

FIG. 1 is a sectional view showing an essential part of an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part of FIG.

FIG. 3 is a development view of a metal plate used in the embodiment of FIG.

4 is a perspective view of a metal plate used in the embodiment of FIG. 1 after bending.

5 shows a housing used in the embodiment of FIG. 1, (A)
Is a plan view, (B) is a right side view, and (C) is a bottom view.

FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG.

FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG.

8A to 8C show an example of a method for manufacturing the embodiment of FIG.
The process drawing shown in (F).

FIG. 9 is a cross-sectional view showing two different examples (A) and (B) of increasing the bonding strength between the metal plate and the polymer material according to the present invention.

FIG. 10 is a cross-sectional view showing two different examples (A) and (B) of increasing the bonding strength between a metal plate and a polymer material, which is different from FIG.

FIG. 11 is a cross-sectional view showing two different examples (A) and (B) of increasing the bonding strength between a metal plate and a polymer material, which is different from those of FIGS. 9 and 10;

FIG. 12 is a cross-sectional view showing three different examples (A) to (C) for increasing the bonding strength between a metal plate and a polymer material, which are different from those in FIGS. 9 to 11;

FIG. 13 is a cross-sectional view showing four examples (A) to (D) of the contact portion of the metal plate according to the present invention, which are different from the embodiment of FIG.

14A to 14E are five different examples of the folded portions that are continuous with the contact portion of the metal plate according to the modified example of the present invention.
FIG.

FIG. 15 is a perspective view showing a part of still another modification of the present invention.

FIG. 16 is a sectional view showing an example of a conventional electronic device casing.

FIG. 17 is a cross-sectional view showing a combined state of a conventional electronic device casing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10: Housing 11: Electronic device housing 12: Opening 13: End plate member 14: Side plate member 15: Metal plate 15A: End plate part 15B: Side plate part 15C: Contact part 15I: Folding part 15J: Board conducting part 16 : Polymer material 17: Circuit board mounting protrusion 31: Electronic device housing 32: Opening 33: End plate member 34: Side plate member 35: Metal plate 35A: End plate part 35B: Side plate part 35C: Contact part 36 : Polymer material 50: Mold

Claims (7)

[Claims] 1. A side plate member is integrally formed on a peripheral edge of the end plate member to form a box shape, and the end plate member and the side plate member are formed by layering a metal plate and a polymer material. In a housing for an electronic device, a contact portion formed by bending a part of the metal plate to a size larger than a plate thickness dimension of the metal plate is exposed on at least a part of an opening side end surface of the side plate member. A housing for an electronic device, which is characterized in that 2. The electronic device casing according to claim 1, wherein the metal plate is arranged on an inner peripheral side of the casing. 3. The electronic device casing according to claim 1, wherein the terminal end of the contact portion is located inside the thickness of the side plate member. 4. The electronic device casing according to claim 1, wherein the end of the contact portion has a folded-back portion that faces inward of the side plate member. Equipment housing. 5. The electronic device casing according to claim 1, wherein the end plate member is provided with a circuit board mounting protrusion arranged inside the casing, A housing for an electronic device, wherein a part of the metal plate is integrally bent and exposed on an end surface of the protrusion. 6. An end plate member and a side plate member respectively corresponding to an end plate member and a side plate member integrally formed on a peripheral edge of the end plate member, which constitutes a box-shaped housing for electronic equipment, and ,
A metal plate having a contact portion bent from the side plate portion toward the outside of the housing is inserted into a mold, and a predetermined polymer material is injected to integrally mold the metal plate at the end portion of the side plate member. A method for manufacturing a casing for an electronic device, comprising exposing a part of the contact portion of the casing to obtain a casing for an electronic device. 7. The method of manufacturing an electronic device casing according to claim 6, wherein the metal plate is a metal material punched out in a substantially thick cross shape, and is bent by press forming into a box shape. A method for manufacturing a housing for an electronic device, which is formed.