CN101091425A - Methods and devices for connecting and grounding an emi shield to a printed circuit board - Google Patents
Methods and devices for connecting and grounding an emi shield to a printed circuit board Download PDFInfo
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- CN101091425A CN101091425A CN 200480008247 CN200480008247A CN101091425A CN 101091425 A CN101091425 A CN 101091425A CN 200480008247 CN200480008247 CN 200480008247 CN 200480008247 A CN200480008247 A CN 200480008247A CN 101091425 A CN101091425 A CN 101091425A
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Abstract
The present invention provides electronic devices, kits, and connector assemblies for coupling an EMI shield to a ground trace. In one embodiment, the present invention provides an electronic device comprising a printed circuit board and an EMI shield that has a flange around at least a portion of a perimeter of the EMI shield. One or more connectors coupled to the flange removably contact the flange to a ground trace of the printed circuit board.
Description
The cross reference of related application
The application requires the U.S. Provisional Patent Application of the sequence number 60/449,934 submitted on February 26th, 2003 and the sequence number submitted on March 10th, 2003 is the priority of 60/452,678 U.S. Provisional Patent Application, and the whole of them are disclosed in this in conjunction with reference.
Technical field
The present invention relates generally to the method that the electromagnetic interference (EMI) shielding is connected to the printed circuit board (PCB) (PCB) of electronic device.Particularly, the present invention relates to different shield design techniques, parts and the use of subconnector element, be used for effectively and economically one or more EMI shielded being connected to printed circuit board (PCB).
Background technology
All electronic products all can send generally in the electromagnetic radiation of 50MHz to 3GHz (but being not limited thereto scope), consider recently in the ability of the quick increase of the progress of high speed microprocessor design and high and switch particularly like this.The emission problem of electromagnetic radiation is not new problem for electronic device design person, in fact, in order to reduce electromagnetic interference, static discharge, radio frequency interference (below be referred to as " EMI ") and taked significant effort, in fact, each country has regular mechanism (as the FCC of the U.S.), and the market for electronic devices of the strict demand that restriction can not be by EMI (electronic device radiation or intercept and capture (also claim susceptibility) by electronic device) is sold.
The present scheme that is used for EMI shielding generally comprises use and is fixed to plastic casing, conductive spacer and the metal can of the band conductive coating on the printed circuit board (PCB) by soldering or similar approach, and some of them are the semipermanent printed circuit board (PCB)s that are attached to.But, in all situations of reality, existing scheme is expensive, to providing the electronic equipment increase very big cost, described electronic equipment has cell phone, PDA(Personal Digital Assistant), kneetop computer, set-top box, cable modem, comprises switch, bridge and cross-coupled networked devices etc. except other a large amount of electronic products.
In the work that in the situation that increases the EMI shielding, reduces cost, developed the various technology of utilizing metallized polymer substrate and shielded to be used for effective EMI.For example, the U.S. Patent No. 5,811,050 at its disclosed Gabower of this reference provides a kind of screen method, wherein the substrate of thermoformable (any amount of polymer) at first hot forming metallize then.The advantage that this method provides is, eliminated any stress that takes place when being thermoformed into metal layer, and described metal layer is applied on the substrate before forming technology.This product has shown the method for the very effective and lower cost of the effective EMI control (being also referred to as Electro Magnetic Compatibility or EMC) that provides electronic product.
Utilize plastic shielded having proved of metallized shaping to reduce the cost relevant and effective screen method of total weight with the shielding of electronic device.But,, cause some universal methods that more common metal EMI shielding is attached to printed circuit board (PCB) just not to be suitable for the shielding of polymer for the basis owing to use polymer substrate to set up the EMI shielding of these types.For example, form shields common soldering to the position of printed circuit board (PCB) for the EMI of " metal can ".Soldering is the method that low melting point metal material or alloy is heated to fusing.Then, the scolding tin of fusing is added to metallic shield and common simultaneously on the ground trace of exposing on the printed circuit board (PCB).In case solder cools and solidifying again, it has just been set up the machinery between EMI shielding and printed circuit board (PCB) and has been electrically connected.Soldering obtains two targets, and the shielding of soldering is physically located in and is retained in the direction and position of hope, and soldering connects makes the EMI bonding effectively, and this is desirable to effective shielding.
Yet, if this same soldering technology is used in combination with the metal plastic shielding, can damage plastic, and may be harmful in the shield effectiveness of EMI shielding from the heat that the scolding tin of fusing is next.Therefore, must produce shield design techniques, parts (feature) and the using method of the replacement of auxiliary element, effectively economically one or more EMI shieldings are connected to printed circuit board (PCB).
Summary of the invention
The invention provides electronic device, EMI with improved EMI shield assembly shields suite and the EMI shielding is connected to the printed circuit board (PCB) of electronic device and the connector of ground connection.
In one aspect, the invention provides suite with EMI shielding and one or more connectors, described EMI shielding comprises around the bead of at least a portion of EMI shielding periphery, described connector can be coupled to described bead, make the bead of EMI shielding removably be coupled to the grounded part of the hope of printed circuit board (PCB) (, being used for printed circuit board (PCB) is connected to ground connection eyelet or other earthing positions on the circuit board of screw of outer cover or support downwards) as the ground trace on printed circuit board (PCB).Suite can randomly comprise the guide for use of the method for statement use EMI shielding and connector.
On the other hand, the invention provides a kind of electronic device.Described electronics part comprises printed circuit board (PCB) and EMI shielding, and described EMI shielding comprises around the bead of at least a portion of EMI shielding periphery.One or more connectors of described bead are coupled in utilization, and circuit board removably is coupled in described EMI shielding.Generally, the grounded part of printed circuit board (PCB) removably is coupled in the EMI shielding, as the ground trace on printed circuit board (PCB).
The EMI shielding can comprise one or more compartments.Like this, the EMI shielding can be got different shape, size and form, makes to be consistent with the given shape and the structure of the printed circuit board (PCB) that shields.For example, in one embodiment, the EMI shielding comprises top surface and a plurality of sidewall.Bead crosses out and extends the plane substantially parallel with the top surface of printed circuit board (PCB) from a plurality of sidewalls.
The EMI shielding can comprise metallized polymer substrate.Though the shielding of the polymer EMI of preferable alloyization it should be understood that aspect of the present invention is not limited to the EMI of employed type, described EMI shielding can be " metal can " or any other conventional or special-purpose EMI shielding.
In the embodiment that uses the metallized polymeric substrate, the metallized polymeric substrate can be shaped as and forms one or more compartments, and can use hot forming or other conventional methods to form the bead that centers on periphery.Thereafter, can be on the interior and/or outer surface of the substrate that is shaped deposited metal.
Connector of the present invention can be a conduction or nonconducting, and can be regularly in conjunction with or removably be attached on the bead of EMI shielding.In one embodiment, at least a portion of connector is integrally formed in the part of the bead of EMI shielding or other hope.In another structure, at least a portion of connector is fixedly joined to the grounded part of printed circuit board (PCB) (as ground trace) and removably is attached to the bead or the sidewall of EMI shielding.In another structure, described connector removably be attached to EMI shielding bead and printed circuit board (PCB) grounded part one of at least on.
Connector can comprise conduction or nonconducting binding agent, and it can be coupled on the bead of EMI shielding.Described binding agent is band shape, the discontinuous deposit of binding agent, the consecutive deposition of binding agent etc., can directly place on the bead, or can directly place printed circuit board (PCB) the target part (as, on stria trace at least in part).In some structures, binding agent can be deposited on the bead of the groove of printed circuit board (PCB) or EMI shielding.
In another embodiment, connector comprises one or more removable mechanical connectors.The size of described connector and shape form to such an extent that be inserted in the bead and the hole at printed circuit board (PCB) of EMI shielding, make the bead with the EMI shielding releasably be attached to the grounded part (ground trace) of printed circuit board (PCB).The bight that described connector can be coupled to the EMI shielding along the coupling of long surface or the described connector of bead.
In an ad hoc structure, removable mechanical connector comprises first and second arms, and their position is perpendicular to one another substantially.The end of the shaping of first and second arms or the size that refers to and shape form to such an extent that can be inserted in each hole of the shielding of EMI and printed circuit board (PCB).
In another structure, removable mechanical connector comprises crooked, microscler main body, and the size of its end and shape form in each hole that can enter EMI shielding and printed circuit board (PCB).For EMI shielding being attached to printed circuit board (PCB), apply power to the mechanical connector of described bending, make microscler main body become straight flat, and the end of the mechanical connector of bending is aimed at the hole that EMI shields.The result of the bending of elongate body, intrinsic elastic force produces and stretches and friction between each hole of the end of connector and printed circuit board (PCB).Described stretching and friction keep straight shape with flexible connector, and keep striding the pressure of the whole bead of EMI shielding, so that connector (with the EMI shielding) is fixing on the throne.Randomly, crooked elongate body can comprise a plurality of contact points, makes when the connector of bending becomes straight, and contact point contacts the surface of bead and applies basic power uniformly along bead.
In another embodiment, described connector is integrally formed in the bead of EMI shielding.Described connector can form the projection of stretching out to printed circuit board (PCB) from bead.As understanding, in other embodiments, it is outstanding that described connector can leave the surface of printed circuit board (PCB), and can interact with positive connector on printed circuit board (PCB) or with another EMI shielding, makes the EMI shielding is connected to printed circuit board (PCB).
In another embodiment, described connector comprises the mechanical clamp of one or more conductions, with conductive adhesive or scolding tin it is fixedly coupled at least a portion of the ground trace of printed circuit board (PCB).Mechanical clamp can releasably be coupled to EMI the grounded part (as ground trace) of printed circuit board (PCB), makes it possible to easily take off the EMI shielding from grounded part.In a structure, conductive mechanical folder comprises the main body with first and second relative arms.The part of EMI shielding as bead or sidewall, is contained between first and second arms, and machinery and the grounded part that is electrically coupled to printed circuit board (PCB).
In another embodiment, the mechanical clamp connector can be fixedly joined to printed circuit board (PCB) and ground trace is adjacent, makes releasable bead with the EMI shielding be pressed to ground trace.In such structure, the mechanical clamp connector is normally nonconducting.
On the other hand, the invention provides a kind of electronic device.This electronic device comprises printed circuit board (PCB) and EMI shielding.Described EMI shielding can be first and second portion form, or clamshell shape shielding form, and it comprises the first of being coupled to second portion with hinge.First can be structured on first side that can be positioned at printed circuit board (PCB).First and second parts will have one or the removable connector on the part (as bead) of shielding, make first and second parts can be coupled to the opposite sides of printed circuit board (PCB).For example, any connector described herein can be used for first and second parts machinery that EMI is shielded and/or be electrically connected to printed circuit board (PCB).
Two parts/ad hoc structure of hinged EMI shielding in, the first of EMI shielding comprises along one or more positive connectors (as projection) of at least a portion of bead.The second portion of EMI shielding comprises that along one or more negative connectors of the appropriate section of bead described negative connector is shape, size and the position of the positive connector of corresponding first substantially.Printed circuit board (PCB) can comprise the one or more holes corresponding with the position of positive connector, make that each projection can be inserted in the hole of printed circuit board (PCB) when the first of EMI shielding correctly locatees with the electronic component on first side of shielding at printed circuit board (PCB).Then, the second portion of EMI shielding makes negative connector and the positive connector of giving prominence to by each hole connect along second side location of printed circuit board (PCB).By " stinging tight " together or other being connected with positive with negative connector, first and second parts of EMI shielding will be coupled to printed circuit board (PCB), and can be with the two sides shielding of printed circuit board (PCB).If desired, described hole is the conductive earthing hole and/or is arranged in the ground trace, makes in projection (also can metallize) when passing described hole first and second partial earthings.
On the other hand, the invention provides the EMI shielding, the EMI shielding comprises main body (as metallized polymer), and described main body comprises: the upper surface with one or more parts (feature); A plurality of sidewalls, it stretches out from top surface; And bead, it leaves sidewall and crosses out.Be configured as when housing during at the described parts on the described top surface at the printed circuit panel area, interact with the inner surface of the housing of electronic device, thus with the bead of metallized polymer to grounded part (as the ground trace on the printed circuit board (PCB)) compression at printed circuit board (PCB).
On the other hand, the invention provides electronic device.Described electronic device has printed circuit board (PCB), and described printed circuit board (PCB) comprises electronic component and the ground trace of surrounding electronic component to small part.Described electronic device also comprises the EMI shielding, and described EMI shielding comprises: the upper surface with one or more parts; A plurality of sidewalls that stretch out from top surface; And bead, it is extending with the surperficial parallel direction of printed circuit board (PCB) substantially.The EMI shielding can be coupled on the ground trace of printed circuit board (PCB).The housing of described electronic device constitutes sealing printed circuit board (PCB) and EMI shielding, makes the inner surface interaction of described parts and housing on top surface.Such interaction with the bead of EMI shielding to compressing at the grounded part on the printed circuit board (PCB) (as the ground trace on the printed circuit board (PCB)).
In one embodiment, the parts on the top surface of EMI shielding are semicircular projections, and they extend from the inner surface of described top surface to housing.Can understand, described parts can be got various other shapes.For example, described parts can be oval, V-arrangement, groove shaped, rhombus etc.Described parts can be provided with along any place on the surface that EMI shields.But generally some parts are substantially disposed on the sidewall of EMI shielding, and making provides the compression stress that arrives bead along sidewall.Parts on the top surface of EMI shielding can have identical height and shape or different height and shapes.
Randomly, the EMI shielding can comprise the one or more parts that extend to printed circuit board (PCB) from bead, make and the interaction of the corresponding component (as hole or groove) on printed circuit board (PCB), so that about ground trace location and fixedly EMI shielding.If wish that the described parts on printed circuit board (PCB) can be provided with adjacent with ground trace, or in ground trace.As another optional feature, EMI shielding can comprise the cavity that holds the rib that comes out from the housing of electronic device.
In another embodiment, the invention provides suite.Described suite comprises: the EMI shielding with top surface and a plurality of sidewalls; With the Elecrical connector assembly, it constitutes the ground trace that is fixedly connected to printed circuit board (PCB).Described Elecrical connector assembly constitutes releasably the EMI shielding is coupled on the ground trace.Described Elecrical connector assembly is provided at electricity and the mechanical connection between the grounded part (as ground trace) of EMI shielding and printed circuit board (PCB).Suite can randomly comprise the guide for use of the method for explanation use EMI shielding and connector assembly.
In aspect other, the invention provides electronic device.Described electronic device comprises the printed circuit board (PCB) with electronic component and grounded part (as ground trace).Electronic device also comprises the EMI shielding with top surface and a plurality of sidewalls.The Elecrical connector assembly is fixedly joined to grounded part and releasably grounded part is coupled in the EMI shielding.
The Elecrical connector assembly can comprise one or more folders, with welding or conductive adhesive it is fixedly joined to ground trace.In the structure, described Elecrical connector assembly comprises the main body with first and second relative arms.Arm can constitute sidewall or the bead that releasably is attached to the EMI shielding relatively.The opposite side of the described part of described shielding is kept by relative arm " clamping " or other modes, so that is based upon machinery and electric combination between EMI shielding and the grounded part.
Remainder and accompanying drawing with reference to this specification will make that the features and advantages of the present invention are more than you know.
Description of drawings
Fig. 1 is the simplification sectional exploded view that the EMI shielding is attached to printed circuit board (PCB) with binding agent;
Figure 1A is the downside figure with EMI shielding of a plurality of discontinuous adhesive dots on the bead of EMI shielding and inwall;
Figure 1B is the cutaway view with printed circuit board (PCB) of the groove that holds binding agent;
Fig. 1 C is the part top view of ground trace and a plurality of discontinuous binding agents;
The decomposition diagram that Fig. 2 is to use a plurality of mechanical connectors to be provided with on the ground trace on the printed circuit board (PCB) and fixing EMI on the throne shields;
Fig. 2 A illustrates an embodiment of the mechanical connector of the Fig. 2 that the present invention includes;
Fig. 3 is provided with and fixes the decomposition diagram that EMI on the throne shields by using a plurality of bendings, flexible connector on printed circuit board (PCB);
Fig. 4 illustrates flexible connector with bending and is attached to method on EMI shielding and the printed circuit board (PCB);
Fig. 5 is the interactional close up view in hole of the end of flexible connector of bending of Fig. 3 and 4 and it and printed circuit board (PCB);
Fig. 6 illustrates the alternate embodiment that comprises along the connector of a plurality of contact points of its main body;
Fig. 7 is the decomposition diagram that is attached to the mechanical clamp on the printed circuit board (PCB), and it removably is coupled to the EMI shielding on the ground trace of printed circuit board (PCB);
Fig. 8 is the part end view that EMI is shielded the folder of the Fig. 7 that is coupled to ground trace;
Fig. 9 illustrates another embodiment that the EMI shielding removably is coupled to the mechanical clamp of ground trace;
Figure 10 and 11 illustrates the EMI shielding that is held in place by the interaction between the inner surface of outer cover of parts in the EMI shielding and electronic device on printed circuit board (PCB);
Figure 12 illustrates the multicompartmented EMI shielding with cavity, and described cavity is used to hold shell rib and the semi-circular features along the top surface of EMI shielding, to improve the compression stress of the EMI shielding on printed circuit board (PCB);
Figure 13 is illustrated in the male part in the EMI shielding, and it interacts with corresponding female part (as groove) on printed circuit board (PCB), the EMI shielding is kept and is positioned on the printed circuit board (PCB);
Figure 14 illustrates EMI shielding is attached to the specific tongue piece of printed circuit board (PCB) and the embodiment of groove;
Figure 15 is the bottom view that the groove in printed circuit board (PCB) clamps tab member;
Figure 16 is the partial graph that an EMI shields and the 2nd EMI shields that is coupled to the two opposite sides of printed circuit board (PCB) with the Yin and Yang connector of coupling;
Figure 17 is illustrated in the pad that is provided with between EMI shielding and the shell rib;
Figure 18 illustrate comprise with the EMI shielding on the shell of the interactional positive locator of negative locator; With
Figure 19 illustrates the suite that the present invention includes.
Embodiment
The invention provides the electromagnetic interference (EMI) shielding is connected to the printed circuit board (PCB) (PCB) of electronic device and the method and the assembly of ground connection.
EMI shielding of the present invention generally comprises resin film layer, and it can form desirable shape by various plastic working methods, partially or completely to seal printed circuit board (PCB) and the electronic component on printed circuit board (PCB).In the embodiment of demonstration, the thermoformable plastics that resin film layer is to use hot forming technology (as vacuum, pressure, or mechanical force) to be shaped.However, it should be understood that and to use any routine or special-purpose method shaping resin rete.The resin film layer of EMI shielding has at least one metal level at least one side of resin film layer usually.Described metal level has the thickness that is enough to stop the EMI transmission, generally between 1 to 50 micron.
Described metal level of the present invention is generally after-applied to resin film layer at the shaping resin rete.If before the shaping resin rete, apply metal level, then forming technology (as hot forming) can make metal level partly draw back with attenuation a little less than.Have found that such drawing makes the EMI screening ability of metal level weaken with attenuation and make its destruction sometimes.EMI of the present invention shielding always has the uniform thickness of the metal level that is enough to stop that EMI passes through.It is all disclosed for this specification reference, the U.S. Patent No. of owning together 5,811,050 and the U.S. Patent application No.09/788 that owns together that submits to February 16 calendar year 2001,263, the U.S. Patent application No.09/947 that submit to September 4 calendar year 2001,229, the U.S. Patent application No.09/685 that submitted on October 10th, 2000 has illustrated the further details of some embodiment of the EMI shielding that can use with the present invention among the PCT patent application No.00/27610 that on October 6th, 969 and 2000 submitted to.
Generally, use vacuum metallization processes depositing metal rete on one or more surfaces of resin molding.Because can apply basic even metal layer to set up the EMI shielding on the resin film layer that is shaped, vacuum metallization processes is a preferable methods.However, it should be understood that not departing from scope of the present invention can use additive method to the substrate deposited metal.For example, replace vacuum metallization processes, can use the additive method of deposited metal on the resin film layer that is shaped, fill up (random mat) or fibrous braid at random as deposit, sputter applies, and electroplates deposit coating, chemical plating, the conductive layer of lamination etc.Generally, metal level has the thickness between about 1 to 50 micron.In this embodiment, metal level is generally used the grounded part ground connection of printed circuit board (PCB), so that set up Faraday cage.
As will be appreciated, though metallized hot forming shielding is preferred, but method of attachment of the present invention and connector assembly can be applicable to conventional metal can and other routines or special-purpose EMI shielding equally, the invention is not restricted to the concrete EMI shielding in this explanation.
In a plurality of embodiment of the present invention, the bead of described connector permission EMI shielding removably combines with the grounded part on printed circuit board (PCB).Can understand,, the invention is not restricted to such ground structure though respectively illustrate electricity and mechanical connection between the ground trace that the peripheral of electronic component extends.For example, EMI of the present invention shielding can be grounding to not the ground trace that the whole peripheral at electronic component extends, to the ground hole on printed circuit board (PCB), described hole is to use for the screw that printed circuit board (PCB) is connected to outer cover or bracing frame downwards, or arrives other conventional earthing position.
See Fig. 1, EMI shielding 10 comprises polymer film 11 and one or more metal level 13 of shaping.Can use connector with EMI shielding 10 ground trace 12 that are attached on the printed circuit board (PCB) (PCB) 14.In one embodiment, connector shields EMI with ground trace 12 machineries and is electrically connected, and makes electronic component 15 be contained in the scope of EMI shielding 10.A connector of the present invention can be taked the form of pressure sensitive adhesives 16, and it is positioned on the part of hope of EMI shielding 10.Binding agent 16 can conduct electricity, or non-conductive.Binding agent 16 remains on the EMI shielding position of hope with respect to ground trace 12.In the structure that illustrates, binding agent 16 is " bilateral " bands, is attached on the transverse process edge 18 that the peripheral in EMI shielding 10 extends.Though not shown, binding agent 16 also can be coupled on the inwall (if having any inwall) of EMI shielding etc.
It is such the caking property of binding agent 16 can being chosen to, and it is enough to keep the position of EMI shielding on printed circuit board (PCB), shields with the EMI that printed circuit board (PCB) joins but allow manually to take off and substitute the back.In other embodiments, binding agent 16 can have the caking property that substantially for good and all the EMI shielding is bonded on the ground trace 12.The binding agent of operable a kind of demonstration is the binding agent (3M Part No. 9713 and 9703) of 3M PSA.
In a preferred embodiment, the binding agent 16 of bilateral is an intrinsic conduction, makes machinery keep the position of EMI shielding 10, and the electric coupling to ground trace 12 also is provided, thereby improve the EMI shielding properties.Can understand, the shape and the size of EMI shielding can form like this, make the design of the printed circuit board ground trace line 12 that exposes in the form fit of bead 18, any inwall and the conductive adhesive 16 of the peripheral of EMI shielding, aim at and place so that will shield easily, and improve ground connection and shielding properties.
Double-sided adhesive can be the adhesive strips that precuts, maybe can use silk screen or the pad typography (pad printing) be coated in double-sided adhesive on the ground trace or the EMI shielding on.Can in all sorts of ways and apply double-sided adhesive 16.For example, in a method, double-sided adhesive can be applied to bead (with other parts of EMI shielding) and then can be by manipulator or manually the EMI shielding is placed on the ground trace.As an alternative, double-sided adhesive can be applied to ground trace, then can be or manually EMI shielding is placed on the double-sided adhesive by manipulator.
See Figure 1A to 1C,, binding agent 16 can be positioned at all places for EMI shielding 10 is coupled on the ground trace 12 of printed circuit board (PCB) 14.For example, in Figure 1A, use the method for any hope, binding agent is taked the discontinuous form of deposition of binding agent 16, and it can be with the separate structure of any hope, places on the downside of bead 18 of EMI shielding 10.Can by syringe, apply binding agent with manipulator or manually in the position and the frequency of hope with continuous droplet.As an alternative, binding agent can be screen-printed on the bead of shielding.
If binding agent is placed as drop, then the distance between the binding agent drop can change according to application, Shielding Design and the frequency of operation of electronic device.Generally, the distance of the binding agent of use, feasible binding agent with minimum amount provides sufficient mechanical connection between shielding and printed circuit board (PCB), enough electrical connections also are provided simultaneously.If it is too far away that binding agent is separated by, can leak out more undesirable EMI noise, particularly upper frequency under the EMI shielding.Upper frequency has less wavelength, and it can leak out from smaller opening.Therefore, for upper frequency, the position of binding agent drop is more close.
Though not shown, in certain embodiments, in the bead 18 of shielding 10, form pit, so that as groove or cistern, work, make any too much binding agent flow to wherein and collect.Flat bead can by mistake be extruded shielding with binding agent, makes binding agent spread to other elements.Use conductive adhesive, this existing picture may cause short circuit on printed circuit board (PCB).Therefore, need consider the design of the distance and the bead of drop and pit to each independent design.
As an alternative, shown in Figure 1B, printed circuit board (PCB) 14 can be carried out etching, boring or machine work.On printed circuit board (PCB) 14, set up groove, to set up a plurality of discontinuous grooves 17 with thick soldering mask.The size of groove 17 and shape make it possible to accept the binding agent 16 of q.s, so that can reliably the metal level 13 on the bead 18 of EMI shielding 10 be coupled to ground trace 12.For less printed circuit board (PCB), the wide groove of 1mm-2mm is generally just enough.Usually only 1-2mm is thick owing to printed circuit board (PCB), and the degree of depth of groove can not be very big.The degree of depth of groove should be dark as far as possible, with " well " that provides binding agent to flow into, keeps its position and guide any binding agent to flow.In the embodiment of demonstration, the degree of depth of these grooves is about 0.25mm-0.5mm, but it can be greater or lesser, and this depends on the size of printed circuit board (PCB).Can use artificial or the manipulator injection, or, finish the filling of 16 pairs of grooves of binding agent by applying on the EMI shielding forward direction printed circuit board (PCB) optionally wire mark binding agent.
See Fig. 2 and 2A, additionally, can use one or more mechanical connectors 12 alternatively or except binding agent 16, combine and ground connection with the ground trace 2 of printed circuit board (PCB) 14 to strengthen EMI shielding 10.Mechanical connector can be made by non electrically conductive material (as plastics) or electric conducting material (as metal).
These mechanical connectors 20 can be passed in each hole 22 in the EMI shielding, enter into printed circuit board (PCB) 14, so that promote the inner metal layer of EMI shielding 10 and physics and the electrical connection between the ground trace 12.These mechanical connectors 20 can be similar with screw, pin, shackle (staple), rivet, carriage or multiple other similar mechanical devices that metal is made.Connector 20 can be designed to forever the EMI shielding is fixed to printed circuit board (PCB) or be designed to EMI to be shielded repeated removal and insertion.The latter's design feature may be desirable, makes EMI shielding 10 repeatedly to add and to take off, so that the electronic component not on the printed circuit board (PCB) of tool using contact EMI shielding sealing.Can understand, the electronic component on printed circuit board (PCB) needs maintenance and repair every now and then, so combination and what take off EMI shielding 10 is desirable with non-destructive method repeatably.Mechanical connector 20 can be inserted through hole 22 and the hole in printed circuit board (PCB) 24 in shielding with artificial or manipulator.Can make additional step, to guarantee the fixing of connector and the connection electrical ground between EMI shielding and printed circuit board (PCB).These additional steps can include, but is not limited to soldering, ultra-sonic welded, sintering, laser fusion etc.
Fig. 2 A illustrates a demonstration mechanical connector 20 that the present invention includes.Connector 20 comprises the first arm 26, and it is coupled to second arm 28.Arm 26 and 28 is perpendicular to one another substantially.Each arm 26,28 comprises finger-like or crooked projection 30, and the size of its end and shape form to such an extent that can be inserted into hole 22,24.In the use, mechanical connector is aimed at hole 22,24, and projection 30 is inserted in the hole up to shielding 10 and fixedly positioning with respect to ground trace 12.It should be noted that the connector 20 shown in Fig. 2 and the 2A is arranged on the bight of EMI shielding 10 of basic rectangle and inserts.Can understand, mechanical connector can be shaped with other parts that are inserted into the EMI shielding and locate on other key positions.
Some method for optimizing with hole 22 coupled connectors 20 are to sting tight fit by interference fit (mechanical interference), tension fit or tension force.For tension fit applications, crooked projection 30 extends through corresponding hole 24 in hole 22 in the EMI shielding and the printed circuit board (PCB).Projection 30 can be suitable for curving inwardly, and makes to be equal to or less than the diameter of connector or the corresponding hole in printed circuit board (PCB).In case pass the thickness of printed circuit board (PCB) 14, projection 30 is outwards back crooked, under projection does not back curve inwardly, does not allow connector projection 30 back to pass printed circuit board aperture 24.
Fig. 3 to 5 illustrates the embodiment of another mechanical connector of the present invention.In illustrated embodiment, use the connector 40 of one or more bendings that ground trace 12 is coupled in EMI shielding 10.Crooked flexible connector 40 comprises microscler main body 42, and it has the bending that the surface of leaving printed circuit board (PCB) makes progress slightly.The end 44 of elongate body and 46 size and shape form to such an extent that can cooperate in the hole in the printed circuit board (PCB) 14 24.Crooked flexible connector 40 can be by manufacturings such as aluminium, steel, copper.As an alternative, crooked flexible connector 40 can be made of the plastics of injection moulding, or is made of the plastics of extruding.Plastics can be nylon, polypropylene, ABS, polystyrene, PET or similar polymerization thing.
Because the bending of connector 40, the end 44,46 of connector is bent downwardly (top surface of vertical printed circuit plate), and not exclusively aims at the hole 24 in the printed circuit board (PCB) (seeing Figure 4 and 5).In order to make the end 44,46 of crooked carriage aim at the hole 24 in the printed circuit board (PCB), must by on the center 48 of connector or near it to pressing down, make the stressed outside pushing of end of flexible connector 40, make whole connector cut-off (shown in the dotted line among Fig. 5).
As shown in Figure 5, in case connector 40 basic cut-ofves, end 44,46 is aimed at hole 24, generation tension force and the friction between the hole 24 of the end 44,46 of connector and printed circuit board (PCB) of the resultant intrinsic elastic force of connector 40 bendings.This tension force and friction can remain flexible connector 40 straight, and can keep striding the pressure of whole bead of EMI shielding 10 and also that connector 40 is fixing on the throne.In order to take off this connector from printed circuit board (PCB) and to take off the EMI shielding, the user only needs to apply power (as above drawing) upwards on connector 40, and mobile connector is got back to its warp architecture, and this will unclamp tension force and frictional force between end 44,46 and hole 24.
Fig. 6 illustrates another embodiment of connector 40 of the present invention.Similar to the embodiment of Fig. 3 to 5, the connector 40 of Fig. 6 has a little bending, makes that to the hole of printed circuit board (PCB) 24 insertion ends 44,46 o'clock, frictional force and tension force remain on EMI shielding 10 on the ground trace 12.In addition, the flexible connector 40 of Fig. 6 has a plurality of contact points 50 on the length of elongate body.Therefore, when flexible connector 40 became straight, contact point 50 contact beads 18 also applied a substantially even pressure downward into printed circuit board (PCB) on the length of the bead 18 of EMI shielding.Contact point 50 can be added on the elongate body, or elongate body can be configured with contact point.For example, crooked connector 40 can be snakelike, and bottom apex will play contact point 50.
See Fig. 7 and 8, connector of the present invention can have a plurality of folder members 60, generally with binding agent or soldering (not shown) it is attached to ground trace 12.Folder member 60 can be by the metal manufacturing, and soldering is to the key position of the hope of printed circuit board (PCB).Can design folder member 60 to hold 10 sidewall 11 of EMI shielding, it is similar to play folder.The part of the sidewall 11 of EMI shielding is clamped effectively by the parts 62,64 on the relative arm 66,68 of folder member, EMI shielding 10 is fixed on the ground trace 12, and between the metallized sidewall 11 of ground trace 12 and EMI shielding, forms connection electrical ground.Such structure makes EMI shielding 10 repeatedly install and to take off according to the needs of maintenance, and does not damage EMI shielding or printed circuit board (PCB).Randomly, the EMI shielding also can have groove or hole (not shown), constitutes them and holds the parts 62,64 that press from both sides member.
Fig. 9 illustrates another embodiment of the mechanical connector 61 that the present invention includes.In this embodiment, mechanical connector 61 can be folder shape, and its location and formation make the bead 18 of Mechanical Contact in EMI shielding 10.Folder 61 can be various sizes and shape, can be by various made, but normally conduction and constitute by metal.Can understand, it is desirable forming folder 61 by metallized plastics.Folder 61 can comprise the main body of basic U-shaped or C shape, and this main body comprises the first and second relative arms 63 and 65, is used to hold the part of EMI shielding 10.Folder 61 directly is attached to ground trace 12 usually, can be provided with adjacently with ground trace but press from both sides 61, makes that the metal level on the bead 18 directly contacts ground trace and ground connection.
Similar to other electronic components on printed circuit board (PCB), place or place by hand and will press from both sides 61 and be set to printed circuit board (PCB) 14 by robot.In one embodiment, can folder be attached to ground trace (or printed circuit board (PCB) 14) with the binding agent (not shown).As an alternative, similar to other electronic components on printed circuit board (PCB), folder 61 can transmit by hand soldering or common surface mounting technology (SMT) production line.On the SNT production line, the electronic component of printed circuit board (PCB) and placement transmits by reflow ovens (reflow oven), is put in place by soldering at each element of described reflow ovens.As known in the art, element is placed on printed circuit board (PCB) 14 and the tinol so that element is fixing on the throne.Tinol contains scolder 67 and solder flux.In case scolder 67 and element be by reflow ovens, flux evaporates, solder fusing, printed circuit board (PCB) comes out from stove then, and scolder solidifies and foundation combines with the mechanical/electrical of printed circuit board (PCB) 14 in stove.
In case the folder soldering puts in place, metallized hot forming EMI shielding 10 may slide in the folder, and the bead 18 that shields at this EMI is clamped between the arm 63,65, and EMI is held in place, and forms by pressing from both sides electrically contacting of 61 ground connection.Can understand, with such structure, the EMI shielding removably is attached to ground trace by folder.And EMI shielding 10 combination easily and taking off as required makes it possible to contact the circuit and the element of setting in EMI shielding 10.
Allow to be independent of the position of the outer cover of electronic device at the connector shown in Fig. 1 to 9, connect and take off EMI shielding 10 from printed circuit board (PCB) 14.Therefore, the outer cover of electronic device can take off from printed circuit board (PCB)/dismantle, and does not influence the shielding action that the EMI shielding provides.
Figure 10 and 11 illustrates two EMI is shielded 10 ground connection and be fixed to the additional embodiment of printed circuit board (PCB) 14.Such embodiment utilizes various design parts 70, and when forming technology, it can be attached on the top surface 72 of EMI shielding.The design of the outer cover 74 of the design of printed circuit board (PCB) and electronic device 76 is often depended in the shape of design part 70 and position.Design part 70 often has the part of convex, and it is outstanding to the inner surface 78 of the outer cover 74 of electronic device 76 to leave printed circuit board (PCB) 14.Parts 70 make EMI shielding 10 dimensionally than the height height in the available space that allows in outer cover and between the surface of printed circuit board (PCB).Consequently, when closed cover, the inner surface 78 of outer cover is pressed to downwards on the convex part 70 of EMI shielding, and the ground trace of printed circuit board (PCB) 14 is compressed this shielding relatively, thereby fixes its position with respect to printed circuit board (PCB).This additional compression stress also improves conductive surface (as bead 18) and the pressure that electrically contacts between any ground trace of exposing 12 on the printed circuit board surface in EMI shielding 10, thereby the ground connection of improving shielding connects and shielding properties.
Figure 12 illustrates multicompartmented EMI shielding 10, and it comprises the constitutional detail 70 of top surface 72 outside the edge of the compression stress that raising is caused by the interaction between the outer cover of EMI shielding 10 and electronic device (as cell phone).In illustrated structure, constitutional detail 70 is semicircular parts.Constitutional detail 70 also comprises cavity 79, constitutes the rib (Figure 17) that it holds the shell that is attached to electronic device.Can understand, when in EMI shielding 10 shell being set, rib extends in the cavity 79, makes semicircular feature 70 contact with the inner surface of shell.Shell be placed on the printed circuit board (PCB) (not shown) around the time, rib and semicircular feature 70 play the effect with respect to the bead 18 of the ground trace on printed circuit board (PCB) compression EMI shielding 10.Can understand, in certain embodiments, semicircular feature 70 enough shields 10 with respect to printed circuit board (PCB) compression EMI, and will not need rib.
As shown in figure 13, another embodiment of the present invention relates to male part 80 is attached to EMI shielding, and the corresponding female part 82 of its contact on printed circuit board (PCB) 14 is to strengthen the stationary positioned of EMI shielding 10 and printed circuit board (PCB) 14 in electronic device 76.
In use, the female part 82 in printed circuit board (PCB) can be used as recipient, and accepts the male part of EMI shielding, assists location EMI shielding on printed circuit board (PCB).Randomly, parts 80 can be used for the EMI shielding lock is stayed in the groove.If desired, female part 82 can comprise grooving or dovetail groove shape, makes parts 80 are clamped, and improves the fixing ability on the throne of EMI shielding.
Randomly, bead 18 can comprise binding agent (not shown) (as conduction, double-sided adhesive 16), makes the EMI shielding is attached to ground trace 12.Additionally or alternatively, as just Figure 10 to 12 is described, EMI shield 10 parts 70 that can comprise along top surface 72, and it is used for and outer cover 74 interacts, and 12 pushing EMI shield with respect to ground trace.
Another embodiment is included in the parts on the bead 18, and shown in Figure 14 and 15, the positive and female part 80,82 are similar in appearance to tongue piece and groove here.Groove 82 is channel shaped, forms in the surface of printed circuit board (PCB) 14.The bead 18 of EMI shielding 10 can form one with one or more projections " tongue piece " or boss parts 80, and parts 80 designs are used for cooperating with the groove 82 that forms in printed circuit board (PCB) 14.Utilize to make the intrinsic flexibility and the compressibility of the plastics (polymer) of shielding, tab member 80 can be out of shape naturally with the profile and the form fit of groove 82.Therefore, if the shape of groove 82 is become little than parts 80 with size design, then the distortion of parts should cause the enough CONTACT WITH FRICTION between the corresponding component of the parts of shielding and printed circuit board (PCB), with the position of fixed mask.Though the example of tongue piece and groove is specific design part, should understand, attempting to obtain identical location and fixedly among the result, the design part of Chang Yong other also can be attached in printed circuit board (PCB), shielding or the two the design to one skilled in the art.
And, replacing in the EMI shielding, having male part, EMI also can manufacture has female part, and male part also can be added on the printed circuit board (PCB).In such an embodiment, the groove in the printed circuit board (PCB) is similar to the through hole that the screw of electroplating in printed circuit board (PCB) passes, and the both makes printed circuit board (PCB) fix and ground connection.The through hole of these plating is the through holes with identical ground trace wire material electricity coating, and is electrically connected to the ground plane of printed circuit board (PCB).Concerning described groove, groove can pass the certain depth of printed circuit board (PCB), or in the position in cycle the whole printed circuit board (PCB) that passes so that the tongue piece that provides enough holes to make described shielding can electrically contact with the plate surface of groove.Part is little, yet also can form the little part that enters into described shielding.
Figure 16 illustrates another embodiment that the present invention includes.In this structure, printed circuit board (PCB) 14 is clipped between the clamshell shape shielding of two or loose-joint butt.In illustrated embodiment, positive snap feature 83 or boss can be integrally formed with the bead 84 of first shielding or be combined on it.The bead 87 of female snap features 86 and secondary shielding 88 is integrally formed or combine on it.Positive snap feature can upwards press, and passes the opposite side of printed circuit board (PCB) 14 outstanding by the hole in printed circuit board (PCB) 14 89.When making second half of shielding relative with printed circuit board (PCB) 14 downwards, the outstanding while of positive snap feature 83 engages with female snap features 86.
Positive and negative snap feature 83 can mechanically be secured together each half shielding 85,88 by mechanical interference.The degree of interference fit can change by the design of snap feature.If wish more or less interference, then can corresponding increase or reduce the diameter of the positive (or negative) snap feature.
Can understand, in the embodiment that replaces, the size of the shielding of these two parts and formation can form like this, make the EMI shielding reach beyond the edge of printed circuit board (PCB), so that positive and female snap features 83,86 constitutes to sting outside printed circuit board (PCB) and is tightened to together, consequently effectively printed circuit board (PCB) is clipped between these two half the shieldings.
In another embodiment, first shielding 85 and secondary shielding 88 all can have positive snap feature (not shown), and they are configured with the different hole of printed circuit board (PCB) and aim at.As an alternative, first shielding 85 and secondary shielding 88 also can all have female snap features, and they are aimed at positive projection or fixture that printed circuit board surface is stretched out.
Randomly, conduction can be electroplated or formed in addition to the internal diameter in the hole 89 in printed circuit board (PCB), and be connected to the ground plan on printed circuit board (PCB).Get among the embodiment such, positive snap feature also can provide the electrical connection to the ground plan of printed circuit board (PCB), and this is desirable to effective EMI shielding.
Though illustrated embodiment only illustrates a pair of positive and negative snap feature 83,86, can understand, shielding can be in conjunction with as many snap feature as requested.For example, can only on each bight of printed circuit board (PCB), snap feature be set.As an alternative, also can snap feature be set along the selection of periphery part (or along printed circuit board (PCB) Anywhere lip-deep).
See Figure 17, among the embodiment of the EMI shielding 10 with the cavity that holds the rib that stretches out from the shell of electronic device, pad 96 is placed in the cavity 94 between rib 98 and the EMI shielding 10.Pad 96 increases the contact pressure of EMI shielding 10 and 12 formation of the ground trace on printed circuit board (PCB) 14.Can understand, higher contact pressure is strengthened being electrically connected.The explanation more completely of suitable pad and other shieldings are can see in the U.S. Patent application owned together of 09/685,969 (abandoning now) in its series number of all submitting on October 10th, 1 of this specification reference.
Figure 19 illustrates the suite that the present invention includes.Suite 100 comprises EMI shielding 112 and connector 114.EMI shielding 112 can be any EMI shielding described herein, maybe can be any conventional EMI well known by persons skilled in the art.EMI shielding 112 constitute can with the connector adapted, make it possible to be attached to printed circuit board (PCB).Connector 114 can be any connector in this explanation.Connector 114 can form one with the EMI shielding, removably is attached to the ground trace that EMI shielded and/or be fixedly joined to printed circuit board (PCB).
Though the diagram and concrete form of the present invention has been described, can make various changes without departing from the spirit and scope of the present invention.For example, though the assembly of above-mentioned combination be depicted as and be separated from each other.It should be understood that any coupling unit of the present invention is not mutually mutual exclusive, and any embodiment can combination with one another.For example, the electronic component below the combination of binding agent and one or more connectors 20,40 (Fig. 2 and 3) can allow to be easy to contact, the position that still keeps EMI to shield simultaneously.And, though EMI of the present invention shielding generally is that metallization is hot formed, the EMI shielding of other types, as the metal can type of routine, or also can the using with connector of the present invention of conductive polymer type.
Claims (54)
1. electronic device, it comprises:
Printed circuit board (PCB);
EMI shields, and comprises the bead of at least a portion of the periphery that centers on described EMI shielding; With
One or more connectors are coupled to described bead, make the bead that removably described EMI is shielded be coupled to described printed circuit board (PCB) and ground connection.
2. electronic device as claimed in claim 1, wherein said RMI shielding comprises polymer substrate metallized, that be shaped.
3. electronic device as claimed in claim 1, wherein said EMI shielding comprises top surface and a plurality of sidewall, wherein said bead in the plane on the surface that is basically parallel to described printed circuit board (PCB) from described sidewall horizontal expansion.
4. at least one in described printed circuit board (PCB) and the ground trace of electronic device as claimed in claim 1, wherein said connector secure bond.
5. electronic device as claimed in claim 1, wherein said connector removably is attached to described bead.
6. electronic device as claimed in claim 5, wherein removable connector extend through hole in the bead of described EMI shielding and the hole in the described printed circuit board (PCB).
7. electronic device as claimed in claim 6, wherein said bead comprise four bights, and wherein said connector is arranged on four bights of described bead.
8. electronic device as claimed in claim 7, wherein said connector comprises the first arm with first and second ends, with second arm with first and second ends, wherein first end of the first arm is connected to first end of second arm, make the first arm vertical substantially with second arm, wherein second end constitutes the hole that extends through in described bead and printed circuit board (PCB).
9. electronic device as claimed in claim 6, wherein said connector are arranged between four bights of described bead.
10. 6 electronic device as claimed in claim, wherein said connector comprises the elongate body of the bending with first end and second end, wherein first and second ends constitute the hole that extends through in described bead and the hole in the printed circuit board (PCB), when the main body cut-off of bending, make described printed circuit board (PCB) releasably is coupled in described EMI shielding.
11. 10 electronic device as claimed in claim, the elongate body of wherein said bending comprises a plurality of contact points along its length, makes that when the elongate body of described bending was coupled to described bead, described contact point provided the pressure with respect to described bead.
12. 10 electronic device as claimed in claim, wherein first and second ends are provided at frictional force and the tension force in the direction that is parallel to described printed circuit board surface, make and keep in touch between described bead and printed circuit board (PCB).
13. electronic device as claimed in claim 1, wherein connector is integrally formed in bead, and wherein integrally formed connector can be inserted in the hole of printed circuit board (PCB).
14. electronic device as claimed in claim 1, wherein said printed circuit board (PCB) comprises ground trace, and wherein said connector conducts electricity, so that improve the electrical connection between the ground trace on described bead and the printed circuit board (PCB).
15. electronic device as claimed in claim 1, wherein said connector comprises binding agent.
16. as the said electronic device of claim 15, wherein said printed circuit board (PCB) comprises one or more grooves, wherein said binding agent is arranged in groove, sets up mechanical bond and be connected with ground connection between the bead of described EMI shielding and described printed circuit board (PCB).
17. electronic device as claimed in claim 1, wherein said connector is integrally formed in the described bead.
18. electronic device as claimed in claim 17, wherein integrally formed connector is outstanding to described printed circuit board (PCB) from described bead, and size is for can be contained in the hole of described printed circuit board (PCB).
19. electronic device as claimed in claim 17 also comprises the 2nd EMI shielding, it comprises that around the bead of at least a portion of the periphery of the 2nd EMI shielding the 2nd EMI shielding is arranged on the side opposite with described EMI shielding of described printed circuit board (PCB),
Wherein the bead of the 2nd EMI shielding comprises the negative connector of one, and the negative connector of described one connects with the connector of giving prominence to by the hole of described printed circuit board (PCB).
20. a suite, it comprises:
The EMI shielding, it comprises around the bead of at least a portion of EMI shielding periphery; With
One or more connectors, they can be coupled to described bead, make the bead that described EMI is shielded removably be coupled to printed circuit board (PCB) and ground connection.
21. suite as claimed in claim 20, wherein said EMI shielding comprises the polymer substrate of metallized shaping.
22. suite as claimed in claim 20, wherein said EMI shielding comprises top surface and a plurality of sidewall, and wherein said bead crosses out from described sidewall on the plane on the surface that is basically parallel to described printed circuit board (PCB).
23. suite as claimed in claim 20, wherein said connector removably is attached to described bead.
24. suite as claimed in claim 20, wherein removable connector extend through hole in the described EMI shielding bead and the hole in the printed circuit board (PCB).
25. suite as claimed in claim 24, wherein said bead comprise four bights, wherein said connector is arranged on four bights of described bead.
26. suite as claimed in claim 25, wherein said connector comprises the first arm with first and second ends, with second arm with first and second ends, wherein first end of the first arm is connected to first end of second arm, make the first arm vertical substantially with second arm, wherein second end constitutes the hole that extends through in described bead and printed circuit board (PCB).
27. suite as claimed in claim 24, wherein said connector are arranged between four bights of described bead.
28. suite as claimed in claim 24, wherein said connector comprises the elongate body of the bending with first end and second end, wherein first end and second end constitute the hole that extends through in the described bead and the hole in the printed circuit board (PCB), so that described printed circuit board (PCB) is coupled in described EMI shielding.
29. suite as claimed in claim 28, the elongate body of wherein said bending comprise a plurality of contact points along its length, make that when the elongate body of bending was coupled to described bead, described contact point provided the pressure with respect to described bead.
30. suite as claimed in claim 28, wherein first and second ends are provided at frictional force and the tension force in the direction that is parallel to described printed circuit board surface, the feasible contact that remains between described bead and the printed circuit board (PCB).
31. suite as claimed in claim 20, wherein said connector is integrally formed in described bead, and wherein integrally formed connector can be inserted in the hole of described printed circuit board (PCB).
32. suite as claimed in claim 20, wherein said connector conducts electricity, so that improve the electrical connection between described bead and printed circuit board ground part.
33. suite as claimed in claim 20, wherein said connector comprises conductive adhesive.
34. suite as claimed in claim 20 also comprises guide for use.
35. an electronic device, it comprises:
Printed circuit board (PCB) comprises electronic component and grounded part;
The EMI shielding comprises: the upper surface with one or more parts; A plurality of sidewalls, they stretch out from top surface; And bead, it is extending with the surperficial substantially parallel direction of described printed circuit board (PCB); With
The housing of electronic device constitutes described printed circuit board (PCB) of sealing and EMI shielding,
Wherein, the parts on top surface and the inner surface of described housing interact, and make the bead of described EMI shielding is compressed with respect to the grounded part on described printed circuit board (PCB).
36. electronic device as claimed in claim 35, wherein said EMI shielding comprises the polymer substrate of metallized shaping.
37. electronic device as claimed in claim 35, wherein said parts comprise the semicircular projection to the inner surface extension of housing.
38. electronic device as claimed in claim 35, wherein said parts are substantially disposed on the described sidewall.
39. electronic device as claimed in claim 35, wherein said EMI shielding also comprises the one or more parts that extend to printed circuit board (PCB) from described bead, and described printed circuit board (PCB) comprises the corresponding component that cooperates with described parts in the described EMI shielding, with described EMI shielding and grounded part stationary positioned.
40. electronic device as claimed in claim 39, wherein the parts on the bead of described EMI comprise projection, and the parts on described printed circuit board (PCB) comprise groove.
41. electronic device as claimed in claim 39, the wherein adjacent setting of the parts on described printed circuit board (PCB) with described grounded part.
42. an EMI shielding, it comprises:
Main body comprises the upper surface with one or more parts; A plurality of sidewalls that stretch out from top surface; With the bead that crosses out from described sidewall; And
Wherein, the inner surface that the parts on top surface are configured as with the housing of electronic device interacts, at described housing during around printed circuit board (PCB), with the grounded part compression of metallized polymer bead with respect to printed circuit board (PCB).
43. EMI shielding as claimed in claim 42, wherein said main body comprises metallized polymer.
44. EMI shielding as claimed in claim 42, wherein said parts are included in the half-circle projection of the direction extension of leaving described bead.
45. EMI shielding as claimed in claim 42, wherein said parts are substantially disposed on the described sidewall.
46. EMI shielding as claimed in claim 42 also comprises and leaves one or more parts that top surface stretches out from described bead, the described parts on described bead constitute with corresponding parts and interact, with described EMI shielding and grounded part positioning and fixing.
47. EMI shielding as claimed in claim 46, wherein the parts on the bead of described EMI shielding comprise projection, and the parts on described printed circuit board (PCB) comprise groove.
48. an electronic device, it comprises:
Printed circuit board (PCB) comprises electronic component and ground trace;
The EMI shielding comprises top surface and a plurality of sidewall; With
The Elecrical connector assembly is fixedly joined to ground trace, and described Elecrical connector releasably is coupled to described ground trace with described EMI shielding.
49. electronic device as claimed in claim 48, wherein said Elecrical connector assembly comprises the relative arm of the opposite side of the sidewall that contacts described EMI.
50. electronic device as claimed in claim 48, wherein said EMI shielding also comprises the bead that is coupled to described sidewall, and wherein said Elecrical connector assembly removably is attached to described bead.
51. electronic device as claimed in claim 50, wherein said Elecrical connector assembly comprise the relative arm of the opposite side of the bead that the described EMI of contact shields.
52. a suite, it comprises:
The EMI shielding comprises top surface and a plurality of sidewall; With
The Elecrical connector assembly can be connected to the ground trace of printed circuit board (PCB), and described Elecrical connector constitutes described ground trace releasably is coupled in described EMI shielding.
53. 52 described suites as claimed in claim, wherein said Elecrical connector assembly comprise the relative arm of opposite side of the sidewall of the described EMI shielding of contact.
54. the described suite of claim 52, wherein said Elecrical connector assembly comprises the bead that is coupled to described sidewall,
Wherein said Elecrical connector assembly comprises the relative arm of the opposite side of the bead that the described EMI of contact shields.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US44993403P | 2003-02-26 | 2003-02-26 | |
| US60/449,934 | 2003-02-26 | ||
| US60/452,678 | 2003-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101091425A true CN101091425A (en) | 2007-12-19 |
Family
ID=38943815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200480008247 Pending CN101091425A (en) | 2003-02-26 | 2004-02-26 | Methods and devices for connecting and grounding an emi shield to a printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101091425A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651963A (en) * | 2011-02-25 | 2012-08-29 | 卓英社有限公司 | Shielding case used for shielding emi and PCB assembly |
| CN102742377A (en) * | 2010-02-03 | 2012-10-17 | 卓英社有限公司 | Easily soldered shield case for electromagnetic-wave shielding |
| CN102883550A (en) * | 2011-07-15 | 2013-01-16 | 上海艾特维通信科技有限公司 | Welding method of shielding cover and electronic circuit board |
| CN104754859A (en) * | 2013-12-10 | 2015-07-01 | 博科通讯系统有限公司 | Printed circuit board with fluid flow channels |
| CN104837327A (en) * | 2015-05-21 | 2015-08-12 | 小米科技有限责任公司 | Circuit protection structure and electronic device |
| CN106132182A (en) * | 2016-06-27 | 2016-11-16 | 努比亚技术有限公司 | Printed circuit board, mobile terminal, mobile terminal shielding frame and preparation method |
| CN110493949A (en) * | 2019-08-08 | 2019-11-22 | 上海创功通讯技术有限公司 | Flexible circuit board and preparation method thereof, electronic equipment |
-
2004
- 2004-02-26 CN CN 200480008247 patent/CN101091425A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102742377A (en) * | 2010-02-03 | 2012-10-17 | 卓英社有限公司 | Easily soldered shield case for electromagnetic-wave shielding |
| CN102651963A (en) * | 2011-02-25 | 2012-08-29 | 卓英社有限公司 | Shielding case used for shielding emi and PCB assembly |
| CN102883550A (en) * | 2011-07-15 | 2013-01-16 | 上海艾特维通信科技有限公司 | Welding method of shielding cover and electronic circuit board |
| CN102883550B (en) * | 2011-07-15 | 2017-02-08 | 上海闻泰电子科技有限公司 | Welding method of shielding cover and electronic circuit board |
| CN104754859A (en) * | 2013-12-10 | 2015-07-01 | 博科通讯系统有限公司 | Printed circuit board with fluid flow channels |
| CN104837327A (en) * | 2015-05-21 | 2015-08-12 | 小米科技有限责任公司 | Circuit protection structure and electronic device |
| CN106132182A (en) * | 2016-06-27 | 2016-11-16 | 努比亚技术有限公司 | Printed circuit board, mobile terminal, mobile terminal shielding frame and preparation method |
| CN110493949A (en) * | 2019-08-08 | 2019-11-22 | 上海创功通讯技术有限公司 | Flexible circuit board and preparation method thereof, electronic equipment |
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