US20010001747A1 - Multi-connectable printed circuit board - Google Patents
Multi-connectable printed circuit board Download PDFInfo
- Publication number
- US20010001747A1 US20010001747A1 US09/387,202 US38720299A US2001001747A1 US 20010001747 A1 US20010001747 A1 US 20010001747A1 US 38720299 A US38720299 A US 38720299A US 2001001747 A1 US2001001747 A1 US 2001001747A1
- Authority
- US
- United States
- Prior art keywords
- printed circuit
- array
- substrate
- edge
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
Definitions
- the present invention relates generally to printed circuit boards, and more particularly to printed circuit board connectors.
- FIG. 1 A typical layout for a PCB (printed circuit board) and a mating electrical connector 00 is illustrated in FIG. 1.
- the connector 00 is shown as a flex circuit having circuit traces which terminate into rectangular mounting or soldering pads along a distal edge.
- the mating connector 00 may be part of an electrical device, an electronic circuit or module, an instrument, a sensor, etc.
- the pads of the mating connector 00 are aligned upon corresponding mounting pads 66 disposed along an edge 22 on the PCB substrate 11 , and are then attached thereto by soldering or the like.
- the contacts on the mating connector 00 are illustrated here as being mounting pads, they may alternatively by plated through holes, plated blind vias, male connector pins, sliding contacts that are mechanically clamped or crimped onto the PCB pads 66 , etc.
- the present invention overcomes the disadvantages of prior art approaches by providing a multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate having a first edge and first and second edge regions, wherein at least the first edge region is defined along the first edge; (b) a first array of electrical connection features disposed on or within the substrate proximate the first edge region; (c) a second array of electrical connection features disposed on or within the substrate proximate the second edge region, wherein the second array is substantially a duplication or a mirror image of the first array; and (d) a plurality of circuit traces disposed on or within the substrate such that each electrical connection feature of the first array is connected by one of the circuit traces to a corresponding electrical connection feature of the second array.
- the present invention facilitates easy disconnection of a mating connector from a PCB, as well as easy reconnection of a replacement mating connector to the PCB.
- FIG. 1 is a partial plan view of a printed circuit board having electrical connection features thereon and a mating connector according to the prior art.
- FIG. 2 is a partial plan view of a multi-connectable printed circuit board according to a first embodiment of the present invention.
- FIG. 3 is a partial plan view of an interior circuit layer of the printed circuit board shown in FIG. 2.
- FIG. 4 is a partial plan view of a multi-connectable printed circuit board according to a second embodiment of the present invention.
- FIG. 5 is a partial plan view of an interior circuit layer of the printed circuit board shown in FIG. 4.
- FIG. 6 is a partial plan view of a multi-connectable printed circuit board according to a third embodiment of the present invention.
- FIGS. 2 - 6 show a multi-connectable printed circuit board assembly according to the present invention.
- the assembly includes: (a) a printed circuit substrate 11 having a first edge 22 and first and second edge regions 44 / 55 , wherein at least the first edge region 44 is defined along the first edge 22 ; (b) a first array 77 of electrical connection features 66 disposed on or within the substrate proximate the first edge region 44 ; (c) a second array 88 of electrical connection features 66 disposed on or within the substrate proximate the second edge region 55 , wherein the second array 88 is substantially a duplication or a mirror image of the first array 77 ; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that each electrical connection feature 66 of the first array 77 is connected by one of the circuit traces 99 to a corresponding electrical connection feature 66 of the second array 88 .
- 66 ′ Plated through holes/vias for connecting connection features 66 between arrays 77 / 88
- A-D Specific electrical connection features 66
- A′-D′ Specific plated through holes/vias 66 ′ for A-D
- the first and second connector arrays 77 / 88 may be located along the same edge 22 of the substrate (FIGS. 2 - 3 ), or along adjacent edges 22 / 33 (FIGS. 4 - 5 ), or on edges 22 / 33 at opposite ends of the substrate (FIG. 6).
- the electrical connection features 66 of the first and second arrays 77 / 88 may be plated through holes, plated blind vias, mounting pads/solder pads, or the like.
- the edges 22 / 33 proximate to which or along which the connector arrays 77 / 88 are disposed may extend locally outward (away from the board) at the edge regions 44 / 55 , or may be recessed locally inward thereat, or may remain relatively undeviated.
- a given edge region may extend locally outward in the form of a single tab on which the connectors 66 are formed, or may extend outward as a number or “fingers” on which mounting pads 66 are formed, thereby acting as a male feature or “jack” onto or around which a female electrical connector or “plug” may be connectably fitted.
- the substrate 11 may be made of generally rigid ceramic material (e.g., alumina), generally rigid polymeric material (e.g., FR-4 epoxy-glass laminate; filled or unfilled injection molded thermoplastic or thermoset material such as acrylonitrile-butadiene-styrene, epoxy, polyester, polyolefin; etc.), generally flexible polymeric material (e.g., “flex circuitry” made of relatively thin sheets of polyester, polyimide, etc.), or the like.
- generally rigid ceramic material e.g., alumina
- generally rigid polymeric material e.g., FR-4 epoxy-glass laminate; filled or unfilled injection molded thermoplastic or thermoset material such as acrylonitrile-butadiene-styrene, epoxy, polyester, polyolefin; etc.
- generally flexible polymeric material e.g., “flex circuitry” made of relatively thin sheets of polyester, polyimide, etc.
- circuit traces 99 that connect together corresponding connector elements 66 between the arrays 77 / 88 may extend along one or both sides of the circuit board, and/or may connect with plated through-holes or plated blind vias 66 ′ which extend through the various layers of the board, and/or may be routed along the various inner conductive layers of the board.
- each array 77 / 88 is essentially a duplicate or a mirror image of the other.
- This redundancy of connector arrays is useful when it is desired to temporarily disconnect the PCB from the mating connector 00 and then subsequently re-connect it. This may be done, for example, when the device or circuit associated with the mating connector 00 needs to be separated from the PCB (e.g., due to damage, a component failure, etc.), followed by attaching a new mating connector 00 to the PCB.
- the mating connector 00 is made of flex circuit material
- the flex can simply be cut with scissors (preferably flush with the edge of the substrate 11 ), leaving a small tab of flex material and its connector elements attached to the PCB at the first array 77 . Then, a new mating connector 00 can be aligned and attached the PCB at the second connector array 88 .
- the mating connector 00 can be connected to the PCB in a duplicated orientation (see FIGS. 2, 3, and 6 , where elements A through D run counter-clockwise around the PCB), or turned upside down and connected in a mirror image orientation (see FIGS. 4 - 5 , where A through D runs counter-clockwise in the first region 44 , but runs clockwise in the second region 55 ).
- the PCB assembly may not only have two similar connector arrays 77 / 88 , but may optionally have three or more of such arrays if desired.
- Other modifications not explicitly mentioned herein are also possible and within the scope of the present invention. It is the following claims, including all equivalents, which define the scope of the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates generally to printed circuit boards, and more particularly to printed circuit board connectors.
- 2. Disclosure Information
- A typical layout for a PCB (printed circuit board) and a mating
electrical connector 00 is illustrated in FIG. 1. Here, theconnector 00 is shown as a flex circuit having circuit traces which terminate into rectangular mounting or soldering pads along a distal edge. (Although not shown in the drawings, themating connector 00 may be part of an electrical device, an electronic circuit or module, an instrument, a sensor, etc.) The pads of themating connector 00 are aligned uponcorresponding mounting pads 66 disposed along anedge 22 on the PCB substrate 11, and are then attached thereto by soldering or the like. Although the contacts on themating connector 00 are illustrated here as being mounting pads, they may alternatively by plated through holes, plated blind vias, male connector pins, sliding contacts that are mechanically clamped or crimped onto thePCB pads 66, etc. - If the device or circuit associated with the
mating connector 00 becomes damaged or has a failed component, it may become necessary to disconnect theconnector 00 from the PCB. However, the disconnecting process (e.g., desoldering) may present the risk of damage to the PCB, and may also be quite inconvenient (e.g., if no de-soldering equipment is readily available). It would be desirable, therefore, to provide a way of facilitating disconnection of the mating connector from the PCB, and to provide for subsequent connection of a replacement mating connector, while minimizing the aforementioned inconvenience and risk of damage. - The present invention overcomes the disadvantages of prior art approaches by providing a multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate having a first edge and first and second edge regions, wherein at least the first edge region is defined along the first edge; (b) a first array of electrical connection features disposed on or within the substrate proximate the first edge region; (c) a second array of electrical connection features disposed on or within the substrate proximate the second edge region, wherein the second array is substantially a duplication or a mirror image of the first array; and (d) a plurality of circuit traces disposed on or within the substrate such that each electrical connection feature of the first array is connected by one of the circuit traces to a corresponding electrical connection feature of the second array.
- It is an object and advantage that the present invention facilitates easy disconnection of a mating connector from a PCB, as well as easy reconnection of a replacement mating connector to the PCB.
- Another advantage is that the present invention may be used with a wide variety of PCB types.
- These and other advantages, features and objects of the invention will become apparent from the drawings, detailed description and claims which follow.
- FIG. 1 is a partial plan view of a printed circuit board having electrical connection features thereon and a mating connector according to the prior art.
- FIG. 2 is a partial plan view of a multi-connectable printed circuit board according to a first embodiment of the present invention.
- FIG. 3 is a partial plan view of an interior circuit layer of the printed circuit board shown in FIG. 2.
- FIG. 4 is a partial plan view of a multi-connectable printed circuit board according to a second embodiment of the present invention.
- FIG. 5 is a partial plan view of an interior circuit layer of the printed circuit board shown in FIG. 4.
- FIG. 6 is a partial plan view of a multi-connectable printed circuit board according to a third embodiment of the present invention.
- Referring now to the drawings, FIGS.2-6 show a multi-connectable printed circuit board assembly according to the present invention. As illustrated in the drawings, the assembly includes: (a) a printed circuit substrate 11 having a
first edge 22 and first andsecond edge regions 44/55, wherein at least thefirst edge region 44 is defined along thefirst edge 22; (b) afirst array 77 ofelectrical connection features 66 disposed on or within the substrate proximate thefirst edge region 44; (c) asecond array 88 ofelectrical connection features 66 disposed on or within the substrate proximate thesecond edge region 55, wherein thesecond array 88 is substantially a duplication or a mirror image of thefirst array 77; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that eachelectrical connection feature 66 of thefirst array 77 is connected by one of the circuit traces 99 to a correspondingelectrical connection feature 66 of thesecond array 88. - To assist the reader in understanding the present invention, all reference numbers used herein are summarized in the table below, along with the elements they represent:
-
-
-
-
-
-
-
arrays 77/88 -
-
-
-
- A-D=Specific electrical connection features66
- A′-D′=Specific plated through holes/
vias 66′ for A-D - The first and
second connector arrays 77/88 may be located along thesame edge 22 of the substrate (FIGS. 2-3), or alongadjacent edges 22/33 (FIGS. 4-5), or onedges 22/33 at opposite ends of the substrate (FIG. 6). The electrical connection features 66 of the first andsecond arrays 77/88 may be plated through holes, plated blind vias, mounting pads/solder pads, or the like. Theedges 22/33 proximate to which or along which theconnector arrays 77/88 are disposed may extend locally outward (away from the board) at theedge regions 44/55, or may be recessed locally inward thereat, or may remain relatively undeviated. For example, a given edge region may extend locally outward in the form of a single tab on which theconnectors 66 are formed, or may extend outward as a number or “fingers” on which mountingpads 66 are formed, thereby acting as a male feature or “jack” onto or around which a female electrical connector or “plug” may be connectably fitted. - The substrate11 may be made of generally rigid ceramic material (e.g., alumina), generally rigid polymeric material (e.g., FR-4 epoxy-glass laminate; filled or unfilled injection molded thermoplastic or thermoset material such as acrylonitrile-butadiene-styrene, epoxy, polyester, polyolefin; etc.), generally flexible polymeric material (e.g., “flex circuitry” made of relatively thin sheets of polyester, polyimide, etc.), or the like.
- The circuit traces99 that connect together
corresponding connector elements 66 between thearrays 77/88 may extend along one or both sides of the circuit board, and/or may connect with plated through-holes or platedblind vias 66′ which extend through the various layers of the board, and/or may be routed along the various inner conductive layers of the board. - With the
individual connector elements 66 of onearray 77 connected through circuit traces 99 to their correspondingindividual elements 66 of theother array 88 as shown in the drawings, eacharray 77/88 is essentially a duplicate or a mirror image of the other. This redundancy of connector arrays is useful when it is desired to temporarily disconnect the PCB from themating connector 00 and then subsequently re-connect it. This may be done, for example, when the device or circuit associated with themating connector 00 needs to be separated from the PCB (e.g., due to damage, a component failure, etc.), followed by attaching anew mating connector 00 to the PCB. If themating connector 00 is made of flex circuit material, the flex can simply be cut with scissors (preferably flush with the edge of the substrate 11), leaving a small tab of flex material and its connector elements attached to the PCB at thefirst array 77. Then, anew mating connector 00 can be aligned and attached the PCB at thesecond connector array 88. Regardless of whether thearray regions 44/55 are on thesame edge 22 ordifferent edges 22/33, themating connector 00 can be connected to the PCB in a duplicated orientation (see FIGS. 2, 3, and 6, where elements A through D run counter-clockwise around the PCB), or turned upside down and connected in a mirror image orientation (see FIGS. 4-5, where A through D runs counter-clockwise in thefirst region 44, but runs clockwise in the second region 55). - Various other modifications to the present invention may occur to those skilled in the art to which the present invention pertains. For example, the PCB assembly may not only have two
similar connector arrays 77/88, but may optionally have three or more of such arrays if desired. Other modifications not explicitly mentioned herein are also possible and within the scope of the present invention. It is the following claims, including all equivalents, which define the scope of the present invention.
Claims (20)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/387,202 US6270354B2 (en) | 1999-08-31 | 1999-08-31 | Multi-connectable printed circuit board |
PCT/GB2000/003082 WO2001017322A1 (en) | 1999-08-31 | 2000-08-10 | Multi-connectable printed circuit board |
BR0013674-3A BR0013674A (en) | 1999-08-31 | 2000-08-10 | Multi-pluggable printed circuit board |
JP2001521129A JP2003508930A (en) | 1999-08-31 | 2000-08-10 | Printed circuit board with multiple connections |
MXPA02001736A MXPA02001736A (en) | 1999-08-31 | 2000-08-10 | Multiconnectable printed circuit board. |
EP00953287A EP1210849A1 (en) | 1999-08-31 | 2000-08-10 | Multi-connectable printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/387,202 US6270354B2 (en) | 1999-08-31 | 1999-08-31 | Multi-connectable printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010001747A1 true US20010001747A1 (en) | 2001-05-24 |
US6270354B2 US6270354B2 (en) | 2001-08-07 |
Family
ID=23528909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/387,202 Expired - Fee Related US6270354B2 (en) | 1999-08-31 | 1999-08-31 | Multi-connectable printed circuit board |
Country Status (6)
Country | Link |
---|---|
US (1) | US6270354B2 (en) |
EP (1) | EP1210849A1 (en) |
JP (1) | JP2003508930A (en) |
BR (1) | BR0013674A (en) |
MX (1) | MXPA02001736A (en) |
WO (1) | WO2001017322A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040230373A1 (en) * | 2003-05-12 | 2004-11-18 | Assimakis Tzamaloukas | Hierarchical floating car data network |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6528892B2 (en) * | 2001-06-05 | 2003-03-04 | International Business Machines Corporation | Land grid array stiffener use with flexible chip carriers |
US6690539B2 (en) * | 2001-07-24 | 2004-02-10 | International Business Machines Corporation | Portable data storage drive cartridge with external interface at each end |
US6506062B1 (en) | 2001-08-01 | 2003-01-14 | Visteon Global Technologies, Inc. | Circuit board having an integrated circuit board connector and method of making the same |
US20060141678A1 (en) * | 2004-12-29 | 2006-06-29 | Stephen Montgomery | Forming a nanotube switch and structures formed thereby |
CN101296556B (en) * | 2007-04-25 | 2010-05-26 | 群康科技(深圳)有限公司 | Flexible circuit board |
US8677617B2 (en) | 2010-04-28 | 2014-03-25 | International Business Machines Corporation | Printed circuit board edge connector |
WO2011154478A1 (en) * | 2010-06-09 | 2011-12-15 | Arcelik Anonim Sirketi | Electronic card programmed with an external programming device |
TWI484882B (en) * | 2011-12-30 | 2015-05-11 | Uer Technology Corp | Welding structure and welding method for connecting lithium battery to electric circuit board |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3033914A (en) * | 1960-04-20 | 1962-05-08 | Gen Electric | Printed circuit boards |
DE1665071B1 (en) * | 1966-09-06 | 1971-01-07 | Masing & Co Kg Dr | Arrangement for the optional construction of different circuit arrangements from plug-in units |
US3605061A (en) * | 1968-09-09 | 1971-09-14 | Reliance Electric & Eng Co | Printed circuit board |
US3808505A (en) * | 1973-03-19 | 1974-04-30 | Gte Automatic Electric Lab Inc | Apparatus for interconnecting a plurality of electronic equipment frames |
DE3628981A1 (en) * | 1986-08-26 | 1988-03-03 | Bosch Gmbh Robert | Printed circuit board |
JPH02208634A (en) * | 1989-02-08 | 1990-08-20 | Hitachi Ltd | Liquid crystal display element |
US5010446A (en) * | 1989-10-30 | 1991-04-23 | Commonwealth Edison Company | Multi-edge extender board |
JPH03194868A (en) * | 1989-12-22 | 1991-08-26 | Hitachi Chem Co Ltd | Circuit connection method using aelotropic conductive film |
DE69131269T2 (en) | 1990-09-19 | 1999-10-14 | Sumitomo Electric Industries | Circuit structure for instrument panel of a motor vehicle and its manufacturing process |
US5712764A (en) | 1996-05-03 | 1998-01-27 | Ford Motor Company | Apparatus and method of assembling vehicle instrument panel structural and electronic components |
-
1999
- 1999-08-31 US US09/387,202 patent/US6270354B2/en not_active Expired - Fee Related
-
2000
- 2000-08-10 BR BR0013674-3A patent/BR0013674A/en not_active IP Right Cessation
- 2000-08-10 JP JP2001521129A patent/JP2003508930A/en active Pending
- 2000-08-10 MX MXPA02001736A patent/MXPA02001736A/en unknown
- 2000-08-10 WO PCT/GB2000/003082 patent/WO2001017322A1/en not_active Application Discontinuation
- 2000-08-10 EP EP00953287A patent/EP1210849A1/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040230373A1 (en) * | 2003-05-12 | 2004-11-18 | Assimakis Tzamaloukas | Hierarchical floating car data network |
US7188026B2 (en) * | 2003-05-12 | 2007-03-06 | Dash Navigation, Inc. | Hierarchical floating car data network |
US20070271029A1 (en) * | 2003-05-12 | 2007-11-22 | Assimakis Tzamaloukas | Hierarchical floating car data network |
US8965695B2 (en) | 2003-05-12 | 2015-02-24 | Google Technology Holdings LLC | Hierarchical floating car data network |
Also Published As
Publication number | Publication date |
---|---|
US6270354B2 (en) | 2001-08-07 |
EP1210849A1 (en) | 2002-06-05 |
WO2001017322A1 (en) | 2001-03-08 |
BR0013674A (en) | 2002-05-14 |
MXPA02001736A (en) | 2002-09-23 |
JP2003508930A (en) | 2003-03-04 |
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Legal Events
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AS | Assignment |
Owner name: FORD MOTOR COMPANY, MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, DELIN;BAKER, JAY DEAVIS;ACHARI, ACHYUTA;AND OTHERS;REEL/FRAME:010215/0393 Effective date: 19990806 |
|
AS | Assignment |
Owner name: VISTEON GLOBAL TECHNOLOGIES, INC., MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FORD MOTOR COMPANY;REEL/FRAME:010968/0220 Effective date: 20000615 |
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REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20050807 |