DE3628981A1 - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
DE3628981A1
DE3628981A1 DE19863628981 DE3628981A DE3628981A1 DE 3628981 A1 DE3628981 A1 DE 3628981A1 DE 19863628981 DE19863628981 DE 19863628981 DE 3628981 A DE3628981 A DE 3628981A DE 3628981 A1 DE3628981 A1 DE 3628981A1
Authority
DE
Grant status
Application
Patent type
Prior art keywords
circuit board
printed circuit
characterized
lines
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19863628981
Other languages
German (de)
Inventor
Hans-Werner Stollfuss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09127PCB or component having an integral separable or breakable part
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09963Programming circuit by using small elements, e.g. small PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09972Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228Cutting, sawing, milling or shearing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/225Correcting or repairing of printed circuits

Abstract

The printed circuit board (30) carries components (41) and structural units (42) of an electrical circuit in such a manner that functional groups (20, 21) are formed which are associated in terms of circuitry. The components (41) and structural units (42) as well as the associated conductor tracks of each functional group are accommodated on a specific printed circuit board region (31, 32) of the printed circuit board (30). The printed circuit board regions are separated by intended-fracture lines (lines of perforations) (34). In consequence, printed circuit board regions which require repair can be separated from one another simply by breaking them off. The intended-fracture lines (34) preferably consist of a row of holes (36) which are incorporated in the printed circuit board (30). <IMAGE>

Description

Stand der Technik State of the art

Die Erfindung geht von einer Leiterplatte nach der Gattung des Haupt anspruchs aus. The invention is demanding from a printed circuit board according to the preamble of the main.

Es ist bekannt, die Bauteile und Baueinheiten einer elektrischen Schaltung zu funktionsmäßig zusammengehörenden Funktionsgruppen zusammenzufassen und die einzelnen Funktionsgruppen auf je einer Leiterplatte unterzubringen. It is known to functionally belong together functional groups together the components and assemblies of an electrical circuit and to accommodate the individual functional groups on a respective printed circuit board. Damit ist der Nachteil verbunden, daß die Funktionsgruppen der elektrischen Schaltung bzw. die Leiterplatten getrennt bestückt werden müssen. Thus, the disadvantage that the functional groups of the electric circuit or the circuit boards need to be fitted separately. Das Auswechseln einer fehlerhaften Leiterplatte zum Zwecke einer Reparatur ist dagegen verhältnismäßig einfach. The replacement of a faulty circuit board for the purpose of repair, however, is relatively simple. Es ist weiterhin bekannt, alle Funktions gruppen einer elektrischen Schaltung auf ein und derselben Leiterplatte anzubringen. It is known further, all functional groups of an electric circuit on one and to apply the same circuit board. Fällt dann jedoch eine Funktionsgruppe aus, so muß entweder die komplette Leiterplatte ersetzt werden oder es muß eine zeit- und kostenaufwendige Reparatur von Hand durchgeführt werden. but then drops a function group, either the entire board must be replaced or it must be carried out a time-consuming and costly repairs by hand.

Vorteile der Erfindung Advantages of the Invention

Die erfindungsgemäße Leiterplatte mit den kennzeichnenden Merkmalen des Hauptanspruchs hat den Vorteil, daß sich alle Funktionsgruppen auf einer Leiterplatte befinden, die in einem Zuge serienmäßig hergestellt werden kann und bei der im Falle einer Reparatur lediglich der fehlerhafte Leiterplattenbereich abgebrochen und gegen einen gleichartigen neuen Leiterplattenbereich ausgewechselt zu werden braucht. The printed circuit board according to the invention with the characterizing features of the main claim that all functional groups are on a circuit board that can be mass-produced in one go and in the case of repair only the defective circuit board area to be canceled and replaced with a similar new printed circuit board area advantage, be needed. Es sind dann nur noch die elektrischen Verbindungen zwischen dem neuen Leiterplatten bereich und der Leiterplatte herzustellen. It is then only the electrical connections between the new printed circuit board area and to produce the circuit board.

Besonders vorteilhaft ist eine erfindungsgemäße Leiterplatte, bei der die Sollbruchlinien durch eine Reihe von Löchern oder Langlöchern gebildet sind. Especially advantageous is a printed circuit board according to the invention, wherein the predetermined breaking lines are formed by a series of holes or slots. Eine derartige Sollbruchlinie ist besonders einfach herstellbar. Such a line of weakness is particularly easy to produce. Wenn darüber hinaus die die Sollbruchlinien überschreitenden Leiterbahnen zwischen benachbarten Löchern oder Langlöchern hindurchgeführt sind und zu beiden Seiten der Sollbruchlinien und in deren unmittelbarer Nähe Lötaugen aufweisen, dann bereitet das Verbinden der unterbrochenen Leiterbahnen mittels Lötbrücken keine Schwierigkeiten. Moreover, if the are passed the intended breaking lines border traces between adjacent holes or long holes, and have on both sides of the break lines and in the immediate vicinity of pads, then the joining of the broken conductive paths by means of solder bridges presents no difficulties.

Zeichnung drawing

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung anhand mehrerer Figuren dargestellt und in der nachfolgenden Beschreibung näher erläutert. An embodiment of the invention is illustrated in the drawing way of several figures and explained in detail in the following description. Die Zeichnung zeigt in The drawing shows in

Fig. 1 ein Blockschaltbild eines Funkempfängers, Fig. 1 is a block diagram of a radio receiver,

Fig. 2 eine in Leiterplattenbereiche aufgeteilte erfindungsgemäße Leiterplatte, Fig. 2 is a split in printed circuit board areas printed circuit board according to the invention,

Fig. 3 eine erfindungsgemäße Leiterplatte, bei der ein abgetrennter Leiterplattenbereich durch einen neuen Leiterplattenbereich ersetzt ist, und Fig. 3 is a printed circuit board according to the invention, in a separated printed circuit board area is replaced by a new printed circuit board area, and

Fig. 4 ein Abschnitt eines Flachbandkabels. Fig. 4 is a section of a ribbon cable.

Beschreibung der Erfindung Description of the Invention

In dem Blockschaltbild nach Fig. 1 bezeichnen 10 eine Hochfrequenz-Vorstufe eines Funkempfängers, 11 eine Misch- und Oszillatorstufe, 12 eine Zwischen frequenzstufe, 13 eine Demodulatorstufe und 14 eine Niederfrequenz-Stufe. In the block diagram of Fig. 1 denote 10 a high-frequency stage of a radio receiver 11 and a mixing stage oscillator, 12 an intermediate frequency stage, 13 is a demodulator 14 and a low frequency stage. Von den genannten Stufen 10 bis 14 bilden zum Beispiel die Stufen 10 und 11 eine erste Funktionsgruppe 20 (in Fig. 1 durch strichpunktierte Linien um rahmter linker Schaltungsteil), die Stufen 12 und 13 eine zweite Funktions gruppe 21 und die Stufe 14 eine dritte Funktionsgruppe 22 . Of the above steps 10 to 14, for example, the steps 12 and 13, a second functional form 10 and 11, a first functional group 20 (in Fig. 1 by dash-dotted lines around-skimmed left circuit part), the stage group 21 and the stage 14 is a third functional group 22nd

Den drei Funktionsgruppen 20 bis 22 sind auf einer Leiterplatte 30 drei Leiterplattenbereiche 31 , 32 , 33 zugeordnet, die durch Sollbruchlinien 34 , 35 voneinander getrennt sind. The three functional groups 20 to 22 are allocated on a printed circuit board 30 includes three printed circuit board areas 31, 32, 33 by lines of weakness 34, 35 are separated from each other. Die Sollbruchlinien entstehen vorzugsweise durch je eine Reihe von Bohrungen 36 , 37 in der Leiterplatte 30 . The lines of weakness preferably formed by a respective series of holes 36, 37 in the circuit board 30th Auf vorzugsweise einer Seite der Leiterplatte 30 befinden sich Leiterbahnen 38 , 39 und 40 , die die Anschlüsse von elektrischen Bauelementen 41 und Baueinheiten 42 , das sind vorzugsweise monolithisch integrierte Halb leiterschaltungen, miteinander bzw. mit Außenanschlüssen 43 der Leiter platte 30 verbinden. On preferably one side of the printed circuit board 30 are printed circuit tracks 38, 39 and 40, the conductor circuits, the terminals of electrical components 41 and units 42, which are preferably monolithically integrated semiconductor connect together or with external terminals 43 of the circuit board 30th Die die Leiterplattenbereiche 31 , 32 , 33 verbinden den Leiterbahnen 39 , 40 werden zwischen benachbarten Bohrungen 36 , 37 der Sollbruchlinien 34 , 35 hindurchgeführt und enthalten in unmittelbarer Nähe und zu beiden Seiten der Sollbruchlinien Lötaugen 45 , 46 . The circuit board portions 31, 32, 33 connect the conductor tracks 39, 40 are between adjacent holes 36, 37 of the tear lines 34, passed 35 and in the immediate vicinity and on both sides of the predetermined breaking lines pads 45, 46th

Die Funktion der vorstehend beschriebenen Leiterplatte 30 ist folgende. The function of the circuit board 30 as described above is as follows.

Hat sich beispielsweise bei einer Prüfung der bestückten Leiterplatte 30 ( Fig. 2) herausgestellt, daß der Leiterplattenbereich 33 fehlerhaft ist, so wird dieser Leiterplattenbereich entlang der Sollbruchlinie 35 von der Leiterplatte 30 abgebrochen, wobei die Leitungsbahnen 40 zwangsläufig aufgetrennt werden. Has, for example, in a test of the circuit board assembly 30 (Fig. 2) has been found that the circuit board section 33 is faulty, this printed circuit board area is interrupted along the predetermined breaking line 35 of the circuit board 30, wherein the conductive lines are separated 40 inevitably. Der fehlerhafte Leiterplattenbereich 33 wird gegen einen neuen, gleichartigen Leiterplattenbereich 50 ( Fig. 3) ausgewechselt, der als Ersatzteil verfügbar ist. The faulty circuit board section 33 is replaced with a new one identical circuit board section 50 (Fig. 3), which is available as a spare part. Um die notwendigen elektrischen Verbin dungen zwischen dem Leiterplattenbereich 32 und dem neuen Leiterplatten bereich 50 herzustellen, werden beispielsweise Lötbrücken 51 in die Lötaugen 46 eingelötet. To make the necessary electrical connections are established between applications of the circuit board section 32 and the new circuit boards area 50, such as solder pads 51 are soldered into the soldering eyes 46th Die Lötbrücken bestehen entweder aus Drahtstücken oder, wie in Fig. 4 gezeigt, aus einem Abschnitt eines Flachbandkabels 52 , dessen Drahtenden 53 abisoliert sind. The solder bridges made of either wire pieces or, as shown in Fig. 4, of a portion of a ribbon cable 52, the wire ends are stripped 53rd Vorausgesetzt wird dabei, daß das Raster des Flachbandkabels mit dem Raster der Leiterbahnen 39 , 40 überein stimmt. It is assumed here that the grid of the ribbon cable with the grid of the traces 39, 40 match is right.

In Fig. 3 ist noch eine alternative Ausführungsform der Sollbruchlinie 34 gezeigt, bei der anstelle einer Reihe von Löchern ( 36 , Fig. 1) Langlöcher 55 treten. In Fig. 3, an alternative embodiment of the break-off line is also shown 34, occur in the place of a series of holes (36, Fig. 1) long holes 55.

Claims (7)

  1. 1. Leiterplatte, die durch Leiterbahnen der Leiterplatte verbundene elektrische Bauelemente oder Baueinheiten einer elektrischen Schaltung trägt, dadurch gekennzeichnet, daß die elektrische Schaltung in Funktionsgruppen ( 20 , 21 ) aufgeteilt ist, daß die Bauelemente ( 41 ) oder Baueinheiten ( 42 ) und die zugehörigen Leiterbahnen 38 einer jeden Funktionsgruppe auf einem bestimmten Leiterplattenbereich untergebracht sind und daß die einzelnen Leiterplattenbereiche durch Sollbruchlinien ( 34 ) voneinander trennbar sind. 1. printed circuit board which carries through conductor tracks of the printed circuit board connected to electrical components or units of an electrical circuit, characterized in that the electrical circuit into functional groups (20, 21) is split in that the components (41) or units (42) and the associated conductor tracks 38 of each functional group are accommodated on a given printed circuit board area, and that the individual printed circuit board areas are separable from one another by predetermined breaking lines (34).
  2. 2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, daß die Sollbruchlinien ( 34 ) aus einer Reihe von Löchern ( 36 ) in der Leiterplatte ( 30 ) bestehen. 2. Printed circuit board according to claim 1, characterized in that the intended breaking lines (34) from a series of holes (36) in the printed circuit board (30) exist.
  3. 3. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, daß die Sollbruchlinien ( 34 ) aus einer Reihe von Langlöchern ( 55 ) in der Leiterplatte ( 30 ) bestehen. 3. The circuit board according to claim 1, characterized in that the intended breaking lines (34) of a series of slots (55) in the printed circuit board (30) exist.
  4. 4. Leiterplatte nach Anspruch 1, 2 oder 3, dadurch gekennzeichnet, daß die die Sollbruchlinien ( 34 ) überschreitenden Leiterbahnen ( 39 ) der Leiterplatte ( 30 ) zwischen benachbarten Löchern ( 36 ) oder Langlöchern ( 55 ) der Sollbruchlinien ( 34 ) hindurchgeführt sind und zu beiden Seiten der Sollbruchlinien und in deren unmittelbarer Nähe Lötaugen ( 45 ) aufweisen. 4. The circuit board according to claim 1, 2 or 3, characterized in that the predetermined breaking lines (34) border strip conductors (39) of the printed circuit board (30) between adjacent holes (36) or slots (55) of the predetermined breaking lines (34) are passed, and on both sides of the break lines and in the immediate vicinity of pads (45).
  5. 5. Leiterplatte nach Anspruch 4, dadurch gekennzeichnet, daß die durch ein Abtrennen eines Leiterplattenbereiches ( 33 ) von der Leiterplatte ( 30 ) hervorgerufene Auftrennung der Leiterbahnen ( 40 ) nach Ersatz des abgetrennten Leiterplattenbereiches ( 33 ) durch einen gleichartigen neuen Leiterplattenbereich ( 50 ) durch in die Lötaugen ( 46 ) eingelötete Lötbrücken ( 51 ) über brückt wird. 5. The circuit board according to claim 4, characterized in that by a severing of a printed circuit board region (33) of the printed circuit board (30) caused separation of the conductor paths (40) for replacement of the severed circuit board section (33) by a similar new circuit board section (50) by in the lands (46) soldered solder bridges (51) is bridged.
  6. 6. Leiterplatte nach Anspruch 5, dadurch gekennzeichnet, daß die Lötbrücken ( 51 ) Drahtstücke sind. 6. The circuit board according to claim 5, characterized in that the solder bridges (51) are pieces of wire.
  7. 7. Leiterplatte nach Anspruch 5, dadurch gekennzeichnet, daß die Lötbrücken ( 51 ) aus einem Abschnitt eines Flachbandkabels ( 52 ) bestehen. 7. The circuit board according to claim 5, characterized in that the solder bridges (51) consist of a portion of a ribbon cable (52).
DE19863628981 1986-08-26 1986-08-26 Printed circuit board Withdrawn DE3628981A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863628981 DE3628981A1 (en) 1986-08-26 1986-08-26 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863628981 DE3628981A1 (en) 1986-08-26 1986-08-26 Printed circuit board

Publications (1)

Publication Number Publication Date
DE3628981A1 true true DE3628981A1 (en) 1988-03-03

Family

ID=6308206

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863628981 Withdrawn DE3628981A1 (en) 1986-08-26 1986-08-26 Printed circuit board

Country Status (1)

Country Link
DE (1) DE3628981A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0412284A1 (en) * 1989-08-03 1991-02-13 Robert Bosch Gmbh Circuit board with at least two different electronic subassemblies
WO1996001551A1 (en) * 1994-07-01 1996-01-18 Werner Will Electronic system
WO2001017322A1 (en) * 1999-08-31 2001-03-08 Ford Motor Company Multi-connectable printed circuit board
WO2001031157A1 (en) * 1999-10-28 2001-05-03 Brose Fahrzeugteile Gmbh & Co. Kg, Coburg Electronic control device for controlling electric units of motor vehicle doors which have different equipment
WO2002067639A1 (en) * 2001-02-16 2002-08-29 Koninklijke Philips Electronics N.V. An electronic device and a circuit arrangement
WO2012171596A1 (en) * 2011-04-09 2012-12-20 Johnson Controls Gmbh Conducting track assembly for a motor vehicle equipment part
DE102013114024A1 (en) * 2013-12-13 2015-06-18 Dr. Fritz Faulhaber Gmbh & Co. Kg "Programmable electronic assembly"

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0412284A1 (en) * 1989-08-03 1991-02-13 Robert Bosch Gmbh Circuit board with at least two different electronic subassemblies
WO1996001551A1 (en) * 1994-07-01 1996-01-18 Werner Will Electronic system
WO2001017322A1 (en) * 1999-08-31 2001-03-08 Ford Motor Company Multi-connectable printed circuit board
US6270354B2 (en) * 1999-08-31 2001-08-07 Visteon Global Technologies, Inc. Multi-connectable printed circuit board
WO2001031157A1 (en) * 1999-10-28 2001-05-03 Brose Fahrzeugteile Gmbh & Co. Kg, Coburg Electronic control device for controlling electric units of motor vehicle doors which have different equipment
US6956303B1 (en) 1999-10-28 2005-10-18 Brose Fahrzeugteile Gmbh & Co. Kg Electronic control device for controlling electric units of motor vehicle doors which have different equipment
WO2002067639A1 (en) * 2001-02-16 2002-08-29 Koninklijke Philips Electronics N.V. An electronic device and a circuit arrangement
WO2012171596A1 (en) * 2011-04-09 2012-12-20 Johnson Controls Gmbh Conducting track assembly for a motor vehicle equipment part
DE102013114024A1 (en) * 2013-12-13 2015-06-18 Dr. Fritz Faulhaber Gmbh & Co. Kg "Programmable electronic assembly"
DE102013114024B4 (en) * 2013-12-13 2016-12-01 Dr. Fritz Faulhaber Gmbh & Co. Kg Programmable electronics module and brushless micromotor

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