US1452573A - Electrodeposition of tin - Google Patents
Electrodeposition of tin Download PDFInfo
- Publication number
- US1452573A US1452573A US535591A US53559122A US1452573A US 1452573 A US1452573 A US 1452573A US 535591 A US535591 A US 535591A US 53559122 A US53559122 A US 53559122A US 1452573 A US1452573 A US 1452573A
- Authority
- US
- United States
- Prior art keywords
- tin
- naphthol
- beta
- colloid
- salt solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/14—Electrolytic production, recovery or refining of metals by electrolysis of solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Definitions
- the object of this invention is to improve the process of electrolytic deposition of tin as 'for example in. tin refining or tin-plating and consists'in the composition of the bath and more particularly in the combination of a"certain addition agent 'for use with the tin-salt solution to constitute the bath.
- the salt solution is preferably stannous sulphate although other salts may be used, and the addition a ent consists of beta-naphthol and a suitable colloid which are added to the salt solution in small amounts successively or as a mixture.
- the addition agent is added in amounts ranging from .01% to 2% by weight of the electrolyte, which proportions may be regarded as the minimum may be conveniently prepared by elec- 30 trolytically dissolving tin in sulphuric acid by the aid of a porous cell as well understood in this art and so a's'to leave some excess of free acid, in the solution, say about 10%.
- the beta-naphthol is added in the proportion of about one gram per litre of-the electrolyte, and in orderto render it miscible therewith it is dissolved in a small quantity of ethyl alcohol and in troduced as a solution.
- the colloid is added in aboutthe proportion of two grams to the litre being first dissolved in water to make about a 10% solution.
- the addition a'gent thus comprises beta-naphthol and a colloid in the proportions of one to two and as above stated they may be added, mixed together, or successively. While hidejgl'ue and other like substances may be usefully .employed as the colloidal component, it is found that one of the peptones such for extone, which is quite soluble in water, forms the mostelective combination with the betanaphthol and the use of this particular .and maximum in this particular instance,
- An electrolytic bath for depositing tin comprising stannous sulphate, free sulphuric and and small "amounts, of betanaphthol and a peptone.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
was Apr. 24,. 1923.
g UNITED STATES PATENT OFFICE.
LOUIS D. SIMPKINS, 0F BROOKLYN, YORK, ASSIGNOB '10 NATIONALLEAD COMPANY, OF NEW' YORK, N. Y., A CORPORATION OF NEW JERSEY.
'mcrnonnrosrmon or TIN.
No Drawing.
To allwkomitmar concem:
Be it known that I, LouIs D. Srmrmns, a citizen of the United States, residing in Brooklyn, New York, U. S. A., have invent- 6 ed the following. described Improvements i. in the Electrodeposition of Tin.
The object of this invention is to improve the process of electrolytic deposition of tin as 'for example in. tin refining or tin-plating and consists'in the composition of the bath and more particularly in the combination of a"certain addition agent 'for use with the tin-salt solution to constitute the bath. According to this invention the salt solution is preferably stannous sulphate although other salts may be used, and the addition a ent consists of beta-naphthol and a suitable colloid which are added to the salt solution in small amounts successively or as a mixture. And in general, as is well known in the art, the addition agent is added in amounts ranging from .01% to 2% by weight of the electrolyte, which proportions may be regarded as the minimum may be conveniently prepared by elec- 30 trolytically dissolving tin in sulphuric acid by the aid of a porous cell as well understood in this art and so a's'to leave some excess of free acid, in the solution, say about 10%. The beta-naphthol is added in the proportion of about one gram per litre of-the electrolyte, and in orderto render it miscible therewith it is dissolved in a small quantity of ethyl alcohol and in troduced as a solution. The colloid is added in aboutthe proportion of two grams to the litre being first dissolved in water to make about a 10% solution. The addition a'gent thus comprises beta-naphthol and a colloid in the proportions of one to two and as above stated they may be added, mixed together, or successively. While hidejgl'ue and other like substances may be usefully .employed as the colloidal component, it is found that one of the peptones such for extone, which is quite soluble in water, forms the mostelective combination with the betanaphthol and the use of this particular .and maximum in this particular instance,
ample as the common pharmaceutical pep-.
Application filed February 10, 1922 Serial No. 535,591.
colloid in such combination is the preferred form of this invention.
The effect of this composite addition agent in the bath, is manifested by the deposit on the cathode of a compact, homometallic tin which when used for tin-plating forms an adherent 'coating naturally so bright as to require very little subsequent destroy the elfect of the beta-naphthol and the colloid, are included in this invention. I am aware that peptone has been heretofore suggested or employed as an addition agent in electrolytic tin-salt solutions and also that beta-naphthol has been suggested as an addition agent for certain other salt solutions but I believe myself to have been the first to discover-the particular utility of the combination of beta-naphthol and peptone or equivalent colloid, in a tin-salt solution as a means of obtaining the results above referred to and this patentis intended to cover that discovery without limitation except as specified in the followmg.
Claims: 1. An electrolytic bath for depositing tin, containing a tin-salt solution and small amounts of beta-naphthol and a colloid.
2. An electrolytic bath for depositing tin, containing a tin-salt solution with free acid and small a colloid.
3. An electrolytic bath for depositing tin containing stannous sulphate and small quantities of beta-naphthol and a colloid.
4. An electrolytic bath for depositing tin,
comprising stannous s p with free Sulioo quantities of beta-naphthol and 'geneously dense and coherent layer of.
6. An electrolytic bath for depositing tin,
comprising a tin-salt solution and small amounts ofbe'ta-naphthol and peptone.
' 7. An electrolytic bath for the deposition 5 of tin, containing stannous sulphate, and
small amounts of beta-n'a tone.
phthol and a pep- 8. An electrolytic bath for depositing tin, comprising stannous sulphate, free sulphuric and and small "amounts, of betanaphthol and a peptone.
In testimony whereof, I have signed this specification.
,r LOUIS D. SIMPKINS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US535591A US1452573A (en) | 1922-02-10 | 1922-02-10 | Electrodeposition of tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US535591A US1452573A (en) | 1922-02-10 | 1922-02-10 | Electrodeposition of tin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US1452573A true US1452573A (en) | 1923-04-24 |
Family
ID=24134882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US535591A Expired - Lifetime US1452573A (en) | 1922-02-10 | 1922-02-10 | Electrodeposition of tin |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US1452573A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE746134C (en) * | 1934-06-05 | 1944-06-08 | Max Schloetter Dr Ing | Process for the electrolytic deposition of shiny tin deposits |
| US2458827A (en) * | 1946-05-10 | 1949-01-11 | Mallory & Co Inc P R | Electrodeposition of lead-tin-antimony alloys |
| US3198720A (en) * | 1959-05-23 | 1965-08-03 | Knippers | Method of detinning tin-plate |
| US3859182A (en) * | 1973-01-04 | 1975-01-07 | Allied Chem | Coating printed circuit boards with tin or tin-lead alloy and tin-lead fluoborate plating baths |
-
1922
- 1922-02-10 US US535591A patent/US1452573A/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE746134C (en) * | 1934-06-05 | 1944-06-08 | Max Schloetter Dr Ing | Process for the electrolytic deposition of shiny tin deposits |
| US2458827A (en) * | 1946-05-10 | 1949-01-11 | Mallory & Co Inc P R | Electrodeposition of lead-tin-antimony alloys |
| US3198720A (en) * | 1959-05-23 | 1965-08-03 | Knippers | Method of detinning tin-plate |
| US3859182A (en) * | 1973-01-04 | 1975-01-07 | Allied Chem | Coating printed circuit boards with tin or tin-lead alloy and tin-lead fluoborate plating baths |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3905878A (en) | Electrolyte for and method of bright electroplating of tin-lead alloy | |
| US2171842A (en) | Electroplating | |
| US1452573A (en) | Electrodeposition of tin | |
| US2437865A (en) | Method of electrodepositing copper and baths and compositions therefor | |
| US744170A (en) | Process of depositing metallic coatings on metallic objects. | |
| Glasstone et al. | The electro-deposition of iron-nickel alloys. Part I | |
| US2075623A (en) | Zinc plating | |
| US2196588A (en) | Electroplating | |
| US2793990A (en) | Electrodeposition of alloys containing copper and tin | |
| US3804727A (en) | Electrodeposition of nickel | |
| US2338529A (en) | Electrodeposition of nickel | |
| GB130302A (en) | An Electrolytic Process for Coating Iron or Steel with Lead or Antimony or an Alloy of Lead and Antimony. | |
| US2109887A (en) | Bright zinc plating | |
| US2133996A (en) | Art of gold plating | |
| US2143760A (en) | Method and composition for cadmium plating | |
| US3711384A (en) | Electrodeposition of nickel | |
| US2866740A (en) | Electrodeposition of rhodium | |
| US3285840A (en) | Process and composition for zinc electrodeposition | |
| US3021266A (en) | Additive for copper plating bath | |
| US2773819A (en) | Electrodeposition of lead | |
| US2989449A (en) | Electrodeposition of zinc | |
| US3716463A (en) | Bright gold alloy electroplating bath and process | |
| US2614975A (en) | Electroplating of zinc and electrolyte therefor | |
| US2831803A (en) | Electro-deposition of alloys | |
| US2446716A (en) | Terne electroplating bath |