US12592292B2 - Efuse unit and application circuit thereof - Google Patents
Efuse unit and application circuit thereofInfo
- Publication number
- US12592292B2 US12592292B2 US18/440,635 US202418440635A US12592292B2 US 12592292 B2 US12592292 B2 US 12592292B2 US 202418440635 A US202418440635 A US 202418440635A US 12592292 B2 US12592292 B2 US 12592292B2
- Authority
- US
- United States
- Prior art keywords
- nmos transistor
- port
- efuse unit
- efuse
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
- H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
- G11C17/165—Memory cells which are electrically programmed to cause a change in resistance, e.g. to permit multiple resistance steps to be programmed rather than conduct to or from non-conduct change of fuses and antifuses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/18—Auxiliary circuits, e.g. for writing into memory
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/427—Power or ground buses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/43—Layouts of interconnections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/20—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits
Landscapes
- Read Only Memory (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310240067.1A CN118676133A (en) | 2023-03-14 | 2023-03-14 | efuse unit and its application circuit |
| CN202310240067.1 | 2023-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20240312545A1 US20240312545A1 (en) | 2024-09-19 |
| US12592292B2 true US12592292B2 (en) | 2026-03-31 |
Family
ID=92714612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US18/440,635 Active 2044-05-26 US12592292B2 (en) | 2023-03-14 | 2024-02-13 | Efuse unit and application circuit thereof |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US12592292B2 (en) |
| CN (1) | CN118676133A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130182518A1 (en) * | 2012-01-18 | 2013-07-18 | Tae-hoon Kim | Memory cell of semiconductor memory device and method for driving the same |
| US20210125678A1 (en) * | 2019-10-29 | 2021-04-29 | Key Foundry Co., Ltd. | Electronic fuse cell array structure |
| US20230386590A1 (en) * | 2022-05-30 | 2023-11-30 | Shanghai Huali Integrated Circuit Corporation | Fuse link programming cell, programming circuit, control circuit, and array |
| US20250087285A1 (en) * | 2023-09-12 | 2025-03-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and manufacturing method thereof |
-
2023
- 2023-03-14 CN CN202310240067.1A patent/CN118676133A/en active Pending
-
2024
- 2024-02-13 US US18/440,635 patent/US12592292B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130182518A1 (en) * | 2012-01-18 | 2013-07-18 | Tae-hoon Kim | Memory cell of semiconductor memory device and method for driving the same |
| US20210125678A1 (en) * | 2019-10-29 | 2021-04-29 | Key Foundry Co., Ltd. | Electronic fuse cell array structure |
| US20230386590A1 (en) * | 2022-05-30 | 2023-11-30 | Shanghai Huali Integrated Circuit Corporation | Fuse link programming cell, programming circuit, control circuit, and array |
| US20250087285A1 (en) * | 2023-09-12 | 2025-03-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240312545A1 (en) | 2024-09-19 |
| CN118676133A (en) | 2024-09-20 |
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| AS | Assignment |
Owner name: SHANGHAI HUALI INTEGRATED CIRCUIT CORPORATION, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YAN, YING;REEL/FRAME:066464/0438 Effective date: 20240206 |
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