US12420376B2 - Polishing head assembly having recess and cap - Google Patents

Polishing head assembly having recess and cap

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Publication number
US12420376B2
US12420376B2 US18/065,855 US202218065855A US12420376B2 US 12420376 B2 US12420376 B2 US 12420376B2 US 202218065855 A US202218065855 A US 202218065855A US 12420376 B2 US12420376 B2 US 12420376B2
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United States
Prior art keywords
floor
polishing head
joint
thickness
annular wall
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US18/065,855
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English (en)
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US20230201994A1 (en
Inventor
Chih Yuan Hsu
Jen Chieh Lin
Chieh Hu
Wei Chang Huang
Yau-Ching Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
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GlobalWafers Co Ltd
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Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Priority to US18/065,855 priority Critical patent/US12420376B2/en
Priority to TW111149557A priority patent/TW202344348A/zh
Priority to EP22216026.9A priority patent/EP4201591B1/de
Priority to KR1020220183232A priority patent/KR20230096907A/ko
Assigned to GLOBALWAFERS CO., LTD. reassignment GLOBALWAFERS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, CHIH YUAN, HU, CHIEH, YANG, Yau-Ching, HUANG, WEI CHANG, LIN, JEN CHIEH
Publication of US20230201994A1 publication Critical patent/US20230201994A1/en
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Publication of US12420376B2 publication Critical patent/US12420376B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Definitions

  • This disclosure relates generally to polishing of semiconductor wafers and more particularly to a polishing head assembly having a recess and cap.
  • IC integrated circuit
  • the circuitry is first printed in miniaturized form onto surfaces of the wafers.
  • the wafers are then broken into circuit chips.
  • This miniaturized circuitry requires that front and back surfaces of each wafer be extremely flat and parallel to ensure that the circuitry can be properly printed over the entire surface of the wafer.
  • grinding and polishing processes are commonly used to improve flatness and parallelism of the front and back surfaces of the wafer after the wafer is cut from an ingot.
  • a particularly good finish is required when polishing the wafer in preparation for printing the miniaturized circuits on the wafer by an electron beam-lithographic or photolithographic process (hereinafter “lithography”).
  • lithography electron beam-lithographic or photolithographic process
  • Polishing machines typically include a circular or annular polishing pad mounted on a turntable or platen for driven rotation about a vertical axis passing through the center of the pad and a mechanism for holding the wafer and forcing it into the polishing pad.
  • the wafer is typically mounted to the polishing head using for example, liquid surface tension or vacuum/suction.
  • a polishing slurry typically including chemical polishing agents and abrasive particles, is applied to the pad for greater polishing interaction between the polishing pad and the surface of the wafer. This type of polishing operation is typically referred to as chemical-mechanical polishing (CMP).
  • CMP chemical-mechanical polishing
  • the pad is rotated and the wafer is brought into contact with and forced against the pad by the polishing head.
  • the pad is rotated and the wafer is brought into contact with and forced against the pad by the polishing head.
  • wafer flatness parameters degrade because the pad is no longer flat, but instead has a worn annular band forming a depression along the polishing surface of the pad.
  • Such pad wear impacts wafer flatness, and may cause “dishing” or “doming” or a combination thereof resulting in a “w-shape”.
  • a polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap.
  • the polishing head has a recess along a bottom portion.
  • the recess has a recessed surface.
  • the cap is positioned within the recess.
  • the cap includes an annular wall secured to the polishing head and a floor joined to the annular wall at a joint.
  • the floor extends across the annular wall, and the floor has an upper surface and a lower surface.
  • the upper surface is spaced from the recessed surface to form a chamber therebetween.
  • a deformation resistance of a portion of the floor proximate the joint is weakened to allow the portion of the floor proximate the joint to deflect relative to the polishing head by a change of pressure in the chamber.
  • the polishing head has a top portion and a recess along a bottom portion.
  • the recess has a recessed surface. Holes extend from the top portion through the recessed surface.
  • the cap is positioned within the recess.
  • the cap includes an annular wall having apertures corresponding to the holes. The holes and corresponding apertures receive fasteners to secure the annular wall to the recessed surface.
  • the cap also includes a floor joined to the annular wall at a joint.
  • the floor extends across the annular wall.
  • the floor has an upper surface and a lower surface. The upper surface is spaced from the recessed surface to form a chamber therebetween.
  • the floor is capable of deflecting relative to the polishing head by a change of pressure in the chamber.
  • a deformation resistance of a portion of the floor proximate the joint is weakened to allow the portion of the floor proximate the joint to deflect relative to the polishing head.
  • a polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap.
  • the cap has an annular wall secured to the polishing head and a floor joined to the annular wall at a joint.
  • the polishing head and the cap define a chamber between the polishing head and the floor of the cap.
  • the floor is made from a metallic material capable of deflecting relative to the polishing head in response to a change of pressure in the chamber.
  • a thickness of at least one of the annular wall and the floor is reduced proximate the joint to weaken a deformation resistance of the floor proximate the joint.
  • FIG. 1 is a partially schematic elevation of a polishing apparatus
  • FIG. 2 is a section view of a polishing head assembly adapted for mounting and use in the polishing apparatus shown in FIG. 1 ;
  • FIG. 3 is a section view of the polishing head assembly shown in FIG. 1 having a floor that only partially deflects downwardly;
  • FIG. 4 is a section view of an example polishing head assembly adapted for mounting and use in the polishing apparatus shown in FIG. 1 ;
  • FIG. 5 is a section view of another example polishing head assembly adapted for mounting and use in the polishing apparatus shown in FIG. 1 ;
  • FIG. 6 is a section view of yet another example polishing head assembly adapted for mounting and use in the polishing apparatus shown in FIG. 1 ;
  • FIG. 7 is a section view of still another example polishing head assembly adapted for mounting and use in the polishing apparatus shown in FIG. 1 ;
  • FIG. 8 is a section view of still yet another example polishing head assembly adapted for mounting and use in the polishing apparatus shown in FIG. 1 ;
  • suitable substrate “wafers” include single crystal silicon wafers, such as, for example, silicon wafers obtained by slicing the wafers from single crystal silicon ingots formed by the Czochralski method or the float zone method.
  • Each wafer includes a central axis, a front surface, and a back surface parallel to the front surface.
  • the front and back surfaces are generally perpendicular to the central axis.
  • a circumferential edge joins the front and back surfaces.
  • the wafers may be any diameter suitable for use by those of skill in the art including, for example, 200 millimeter (mm), 300 mm, greater than 300 mm or even 450 mm diameter wafers.
  • a semiconductor wafer that has previously been rough polished so that it has rough front and back surfaces is first subjected to an intermediate polishing operation in which the front surface of the wafer, but not the back surface, is polished to improve flatness parameters or to smooth the front surface and remove handling scratches.
  • the wafer is placed against a polishing head assembly.
  • the wafer is retained in position against the polishing head assembly by surface tension.
  • the wafer also is placed on a turntable of a polishing machine with the front surface of the wafer contacting the polishing surface of a polishing pad.
  • a polishing head assembly mounted on the machine is capable of vertical movement along an axis extending through the wafer. While the turntable rotates, the polishing head assembly is moved against the wafer to urge the wafer toward the turntable, thereby pressing the front surface of the wafer into polishing engagement with the polishing surface of the polishing pad.
  • a conventional polishing slurry containing abrasive particles and a chemical etchant is applied to the polishing pad.
  • the polishing pad works the slurry against the surface of the wafer to remove material from the front surface of the wafer, resulting in a surface of improved smoothness.
  • the intermediate polishing operation preferably removes less than about 1 micron of material from the front side of the wafer.
  • the wafer is then subjected to a finish polishing operation in which the front surface of the wafer is finish polished to remove fine or “micro” scratches caused by large size colloidal silica, such as Syton® from DuPont Air Products Nanomaterials, LLC, in the intermediate step and to produce a highly reflective, damage-free front surface of the wafer.
  • the intermediate polishing operation generally removes more of the wafer than the finishing polishing operation.
  • the wafer may be finish polished in the same polishing machine used to intermediate polish the wafer as described above. However, a separate polishing machine may also be used for the finish polishing operation.
  • a finish polishing slurry typically has an ammonia base and a reduced concentration of colloidal silica is injected between the polishing pad and the wafer.
  • the polishing pad works the finish polishing slurry against the front surface of the wafer to remove any remaining scratches and haze so that the front surface of the wafer is generally highly-reflective and damage free.
  • the polishing apparatus 100 may be used to polish a front surface of semiconductor wafers W. It is contemplated that other types of polishing apparatus may be used.
  • the polishing apparatus 100 includes a wafer holding mechanism, e.g., a template comprising a backing film 110 and a retaining ring 120 , a polishing head assembly 130 , and a turntable 140 having a polishing pad 150 .
  • the backing film 110 is located between a polishing head assembly 130 and the retaining ring 120 , which receives a wafer W.
  • the retaining ring 120 has at least one circular opening to receive the wafer W to be polished therein.
  • the wafer W in this embodiment is attached to and retained against the polishing head assembly 130 by surface tension.
  • the wet saturated backing film 110 is attached to the polishing head assembly 130 with a pressure sensitive adhesive.
  • the backing film 110 and retaining ring 120 form a template or “wafer holding template.”
  • the backing film 110 is generally a soft polymer pad or other suitable material.
  • the wafer W is then pressed into the wet saturated backing film 110 to remove or squeeze out the majority of the water or other suitable liquid. Squeezing out the water causes the wafer to be retained on the backing film 110 by surface tension and the atmospheric pressure on the exposed surface of the wafer. This squeezing out of the water mounts the wafer to the polishing head assembly 130 .
  • a portion of the polishing head assembly 130 is flexible enough to deform in response to a change in pressure applied to the polishing head assembly 130 , and stiff enough not to deform when the wafer is pressed into the wet saturated template.
  • the surface tension provides a constant retaining force over the surface of the wafer. This constant retaining force causes any deformation of the polishing head assembly 130 adjacent to the wafer to be directly translated into proportional deformation of the wafer.
  • the polishing apparatus 100 applies a force to the polishing head assembly 130 to move the polishing head assembly 130 vertically to raise and lower the polishing head assembly 130 with respect to the wafer W and the turntable 140 .
  • An upward force raises the polishing head assembly 130
  • a downward force lowers the polishing head assembly.
  • the downward vertical movement of the polishing head assembly 130 against the wafer W provides the polishing pressure to the wafer to urge the wafer into the polishing pad 150 of the turntable 140 .
  • the polishing head assembly 130 moves vertically lower to increase the polishing pressure.
  • a portion of the polishing head assembly 130 and polishing pad 150 and turntable 140 are rotated at selected rotation speeds by a suitable drive mechanism (not shown) as is known in the art.
  • the rotational speeds of the polishing pad and the turntable may be the same or different.
  • the polishing apparatus 100 includes a controller (not shown) that allows the operator to select rotation speeds for both the polishing head assembly 130 and the turntable 140 , and the downward force applied to the polishing head assembly.
  • the polishing head assembly 200 includes a polishing head 210 , a cap 240 , and a band 270 .
  • the polishing head 210 and/or cap 240 are suitably made of a metallic material, such as aluminum or steel, or may be made of another suitable structural material.
  • the polishing head 210 and/or cap 240 may be made of cast aluminum (for example, MIC6® Aluminum Cast Plate available from Alcoa.)
  • the cap 240 may be made of a ceramic material, such as alumina, a plastic material, or a stainless steel material with anti-corrosion coating, such as, for example, diamond-like carbon.
  • the polishing head 210 has a top 212 and a bottom 214 that are substantially parallel with each other.
  • the polishing head 210 has a platform 220 and an annular member 230 extending downwardly from the platform 220 .
  • a recessed surface 216 is formed in the bottom 214 of the polishing head 210 by the annular member 230 extending downwardly from the platform 220 .
  • the annular member 230 has an outside surface 232 that is substantially perpendicular to the top 212 and bottom 214 of the polishing head 210 .
  • the outside surface 232 of the annular member 230 forms the circumference of both the polishing head 210 and the polishing head assembly 200 .
  • the annular member 230 has an inside surface 234 that is angled with respect to the outside surface 232 such that the annular member 230 is thinnest at bottom 214 of polishing head 210 . This tapering of the annular member 230 provides a stiffer top section adjacent the platform 220 . In other embodiments, the inside surface 234 may be substantially parallel to the outside surface 232 .
  • the cap 240 has a floor 242 and an upwardly extending annular wall 250 along the perimeter of the floor.
  • the annular wall 250 has an outer surface 252 that mates with the inside surface 234 of the annular member 230 . As such, the outer surface 252 of the annular wall 250 is also angled to match the inside surface 234 of the annular member 230 .
  • the outer surface 252 of the annular wall 250 is attached to the inside surface 234 of the annular member 230 of the polishing head 210 with an adhesive (not shown).
  • the adhesive may be an epoxy glue.
  • the floor 242 extends across a bottom opening formed by the annular member 230 .
  • the floor 242 has a top surface 244 and a bottom surface 246 .
  • a chamber 202 is formed between the top surface 244 of the floor 242 and the recessed surface 216 of the polishing head 210 .
  • the annular member 230 and the annular wall 250 determine the radial boundaries of the chamber 202 .
  • the platform 220 and the overlapping annular member 230 and annular wall 250 are thicker and are adapted to be more rigid than the floor 242 .
  • Metal used in the polishing head assembly 200 has the potential to contaminate the wafer by being a source of metal ions through the polishing chemicals or slurry.
  • a template including a backing film e.g., backing film 110 shown in FIG. 1
  • retaining ring e.g., retaining ring 120 shown in FIG. 1
  • the backing film 110 is generally a thin soft polymer pad or other suitable material.
  • Backing film 110 suitably includes two or more layers of material (not shown).
  • backing film 110 may have an adhesive layer, a thin plastic film layer, and a thin polyurethane foam, or other non-woven material (e.g., felt), layer.
  • the adhesive layer seals backing film 110 to bottom surface 246 of cap 240 .
  • the thin plastic film layer provides a protective barrier between cap 240 and the slurry and/or wafer W.
  • the layer comprising polyurethane foam or non-woven material e.g., felt
  • the retaining ring 120 extends downwardly from backing film 110 and is generally a plastic material. The wafer is received by retaining ring 120 and is retained against backing film 110 by surface tension. As such, the wafer does not directly contact the cap 240 .
  • the polishing head 210 and cap 240 are circumscribed with band 270 forming a barrier to prevent the slurry from contacting the metal and contaminating the wafer.
  • the annular member 230 has a side recess 238 that extends inwardly from the outside surface 232 at bottom 214 .
  • a tab 248 extends outwardly from the annular wall 250 of cap 240 opposite floor 242 .
  • Tab 248 and side recess 238 each receive band 270 and may be sealed thereto with an adhesive, such as epoxy glue.
  • the band 270 may overlap backing film 110 and/or retaining ring 120 of template to form a seal therebetween to prevent metal contamination of the polishing process from the polishing head 210 .
  • the band 270 is made of plastic, such as polyetherimide (for example, ULTEMTM Resin 1000 available from Saudi Basic Industries Corporation (SABIC)), polyether ether ketone, polyphenylene sulfide, or polyethylene terephthalate.
  • the polishing head assembly 200 is attached to a spindle (not shown) of the polishing apparatus 100 .
  • the spindle is a tube with a center passage (not shown).
  • the center passage opens to the polishing head assembly 200 at one end and is connected with a rotary connector (not shown) at the other end.
  • a pressurizing source (not shown) is provided through the center passage and connects to a chamber passageway 222 (e.g., via a quick disconnect coupling plug).
  • the chamber passageway 222 extends through the platform 220 to chamber 202 .
  • the pressurizing source (not shown) supplies a pressurized media or fluid to and from the chamber 202 through the spindle (not shown).
  • the pressurizing source may provide a pneumatic supply for increasing or decreasing the pressure within the chamber 202 of the polishing head assembly 200 .
  • the floor 242 is a semi-rigid “flex plate” that is made of the same material as cap 240 (e.g., a metallic material).
  • the floor 242 is adapted to be precisely deformed or deflected to change the pressure distribution and polishing pressure profile, and still be rigid enough to mount and demount the wafer on the backing film 110 by surface tension.
  • the rigidity of the floor 242 is such that it does not substantially deform during the mounting of a wafer on the polishing head assembly 200 .
  • the floor 242 may be substantially flat in an initial or un-deflected state. The floor 242 temporarily deflects in a direction that is perpendicular to the polishing surface as the polishing pressure is increased and as the pressure within chamber 202 is increased.
  • the cap 240 is not permanently deflected or deformed by the pressure.
  • the floor 242 has the ability to transition to a pressurized deflected or downwardly curved shape (shown in FIG. 3 ), to a flat shape that is substantially parallel with a bottom surface of the polishing head 210 (shown in FIG. 2 ), and to an upwardly curved or convex shape (not shown), based on the amount of pressurized media or fluid supplied to the chamber 202 and the polishing pressure.
  • the evenly distributed surface tension mounting and retaining the wafer on the backing film 110 provides direct deformation of the wafer when the pressure in the chamber 202 is adjusted and the floor 242 is deformed. Increasing or decreasing the pressure within the chamber 202 can thereby cause the surface of the floor 242 and wafer to balloon outwardly, remain flat, or be drawn in.
  • the change of pressure within chamber 202 causes a change to a given or predetermined polishing pressure P.
  • the pressurizing source (not shown) may be connected with a controller (not shown) for monitoring and adjusting the pressure within the chamber 202 .
  • the controller may include a pressure regulator (not shown).
  • the pressure can be adjusted either manually, based on general wafer shape of the incoming lot, or may be electronically controlled lot by lot, or even wafer by wafer.
  • a characteristic wafer profile is obtained from a lot of wafers, and the downward pressure applied to the wafer by the polishing head assembly 200 and the distribution of that pressure is varied by adjusting pressure in the chamber 202 .
  • the change in polishing pressure may range from about 0.7 P to about 1.3 P.
  • a change in polishing pressure P by changing the pressure within chamber 202 provides an operator with a control variable and the ability to adjust the polished shape of the wafer.
  • the predetermined polishing pressure may range from 1.0 psi to 4.0 psi. In other embodiments, the predetermined polishing pressure may be less than 6.0 psi.
  • the polishing head assembly 200 of FIG. 2 is shown, with a portion 280 of floor 242 of cap 240 deflected into a downward dome shape as a result of an increase in pressure within chamber 202 .
  • Changing the shape of the floor 242 causes a resulting change in the force distribution of the polishing pressure across a wafer (e.g., wafer W shown in FIG. 1 ) and thereby causes the wafer to bend in response.
  • the change in force distribution also causes a change in the rate of removal of material from the wafer.
  • the rate of removal is increased when Von Mises stresses exerted between the wafer and the polishing pad 150 (shown in FIG. 1 ) are increased.
  • the portion 280 of floor 242 that deflects in response to a change of pressure within chamber 202 increases or decreases these Von Mises stresses as the pressure within chamber 202 is increased or decreased, respectively.
  • floor 242 of polishing head assembly 200 does not completely and uniformly deflect in response to an increase and/or decrease of pressure within chamber 202 . This is due to non-uniform deformation resistance across floor 242 .
  • floor 242 is joined to annular wall 250 at joint 290 .
  • Joint 290 acts as a hinge about which the floor 242 may temporarily deflect without permanently deforming relative to the polishing head 210 .
  • the portion 280 of floor 242 Due to the semi-rigidity of floor 242 , the portion 280 of floor 242 has a suitable deformation resistance to allow the portion 280 to deflect in response to a change of pressure within chamber 202 .
  • portion 282 does not deflect in response to a change of pressure within chamber 202 .
  • Increasing the pressure within chamber 202 therefore does not cause a corresponding increase in Von Misses stresses exerted between the edge of the wafer which is mounted to portion 282 of floor 242 and the polishing pad 150 .
  • the non-uniform Von Mises stress distribution during polishing with polishing head assembly 200 produces a non-uniform removal profile in the polished wafer.
  • portion 282 defines a perimeter of floor 242 and may extend from joint 290 to portion 280 a radial distance of up to about 30 mm. Accordingly, the non-uniform removal profile may cover a substantial amount of the wafer, leading to an unacceptable flatness of the wafer.
  • a thickness of annular wall 250 proximate joint 290 and/or the thickness of floor 242 proximate joint 290 may contribute to the relatively higher deformation resistance of the portion 282 of floor 242 .
  • a thickness of annular wall 250 proximate joint 290 is typically about 8 mm.
  • the thickness of the annular wall 250 is measured as a distance between the outer surface 252 and an inner surface 253 of the annular wall 250 .
  • a thickness of the portion 282 of floor 242 is typically from about 5 mm to about 7 mm.
  • the thickness of the floor 242 is measured as a distance between the top surface 244 and the bottom surface 246 .
  • polishing head assembly 400 includes the elements and components of polishing head assembly 200 shown in FIG. 2 and described above.
  • annular wall 250 of cap 240 includes a first portion 254 joined to floor 242 to form the joint 290 and a second portion 256 extending from the first portion 254 .
  • First portion 254 is defined by a notch 255 formed in an inner surface 253 of annular wall 250 at joint 290 .
  • Notch 255 may be U-shaped or may be substantially circular in shape.
  • a radius of notch 255 is suitably above 1 mm, for example, from above 1 mm to about 3 mm, or about 2.5 mm.
  • the first portion 254 of the annular wall 250 has a thickness that is less than a thickness of the second portion 256 .
  • the thickness of first portion 254 depends on the radius of notch 255 .
  • the radius of notch 255 is such that the thickness of first portion 254 is not reduced to below 1.5 mm.
  • the thickness of first portion 254 may suitably be from about 2 mm to about 5 mm, or about 3 mm.
  • Notch 255 also forms a fillet 257 at joint 290 . Reducing the thickness of first portion 254 and/or forming fillet 257 via notch 255 suitably weakens a deformation resistance of portion 282 of floor 242 proximate joint 290 (shown in FIG. 3 ).
  • notch 255 and/or fillet 257 to weaken the deformation resistance of portion 282 of floor 242 may suitably be performed using computer numeric control (CNC) milling.
  • CNC computer numeric control
  • notch 255 and/or fillet 257 cannot be formed using conventional machining techniques that are used to flatten the floor 242 of cap 240 , such as a conventional lapping process.
  • CNC milling may be used to provide portion 282 of floor 242 having a thickness of from about 5 mm to about 6 mm, such as 5.5 mm, for example.
  • Floor 242 may suitably have a continuous thickness extending the entire diameter of floor 242 between annular wall 250 . Alternatively, the thickness of the floor 242 may vary across the diameter of the floor 242 between the annular wall 250 .
  • polishing head assembly 500 includes the elements and components of polishing head assembly 200 shown in FIG. 2 and described above.
  • the inner surface 253 of annular wall 250 is angled inwardly toward fillet 257 formed at joint 290 .
  • the thickness of annular wall 250 at joint 290 is reduced to a thickness of from about 3 mm to about 5 mm, or about 3 mm.
  • Inner surface 253 may be angled to match outer surface 252 such that the thickness of annular wall 250 is constant.
  • inner surface 253 may be angled such that the thickness of annular wall 250 tapers inwardly down annular wall 250 toward joint 290 , such that annular wall 250 has a smallest thickness at joint 290 . Reducing the thickness of annular wall 250 at joint 290 and/or forming fillet 257 suitably weakens a deformation resistance of portion 282 of floor 242 proximate joint 290 (shown in FIG. 3 ).
  • the formation of the angled profile of inner surface 253 to reduce the thickness of annular wall 250 , and the formation of fillet 257 , to weaken the deformation resistance of portion 282 of floor 242 may suitably be performed using computer numeric control (CNC) milling.
  • CNC computer numeric control
  • fillet 257 and the angled profile of inner surface 253 cannot be formed using conventional machining techniques that are used to flatten the floor 242 of cap 240 , such as a conventional lapping process.
  • modifications may be made to conventional machining techniques to form fillet 257 and the angled profile of inner surface 253 .
  • portion 282 of floor 242 having a thickness of from about 5 mm to about 6 mm, such as 5.5 mm, for example.
  • Floor 242 may suitably have a continuous thickness extending the entire diameter of floor 242 between annular wall 250 .
  • the thickness of the floor 242 may vary across the diameter of the floor 242 between the annular wall 250 .
  • the polishing head assembly 600 includes a polishing head 610 , a cap 640 , and a band 670 .
  • the polishing head 610 and/or cap 640 are suitably made of a metallic material, such as aluminum or steel, or may be made of another suitable structural material.
  • the polishing head 610 and/or cap 640 may be made of cast aluminum (for example, MIC6® Aluminum Cast Plate available from Alcoa.)
  • the cap 640 may be made of a ceramic material, such as alumina, a plastic material, or a stainless steel material with anti-corrosion coating, such as, for example, diamond-like carbon.
  • the polishing head 610 has a top 612 and a bottom 614 that are substantially parallel with each other.
  • the polishing head 610 has a platform 620 and an annular member 630 extending downwardly from the platform 620 .
  • a recessed surface 616 is formed in the bottom 614 of the polishing head 610 by the annular member 630 extending downwardly from the platform 620 .
  • Holes 618 extend from the top 612 through the platform 620 and through the recessed surface 616 .
  • the annular member 630 has an outside surface 632 that is substantially perpendicular to the top 612 and bottom 614 of the polishing head 610 .
  • the outside surface 632 of the annular member 630 forms the circumference of both the polishing head 610 and the polishing head assembly 600 .
  • the annular member 630 has an inside surface 634 that is substantially parallel to the outside surface 632 .
  • the cap 640 has a floor 642 and an upwardly extending annular wall 650 along the perimeter of the floor.
  • the annular wall 650 has an outer surface 652 that mates with and is substantially parallel to the inside surface 634 of the annular member 630 .
  • the outer surface 652 of the annular wall 650 may attached to the inside surface 634 of the annular member 630 of the polishing head 610 with an adhesive (not shown).
  • the adhesive may be an epoxy glue.
  • the annular wall 650 extends upwardly to shoulder 692 .
  • the shoulder 692 has a top edge 694 that mates with the recessed surface 616 of polishing head 610 .
  • Apertures 658 are formed in shoulder 692 at top edge 694 and correspond to holes 618 .
  • the holes 618 and corresponding apertures 658 receive fasteners (not shown), such as, for example, screws, to attach the cap 640 to polishing head 610 by securing the top edge 694 of the shoulder 692 to the recessed surface 616 .
  • the fasteners may suitably be formed of plastic or a metallic material with an anti-corrosion coating.
  • a lid (not shown) may cover at least a portion of top 612 of polishing head 610 to prevent the polishing chemicals or slurry from contacting the fasteners and/or from entering holes 618 during a polishing process.
  • the shoulder 692 may also include o-ring (not shown) which forms a seal when the top edge 694 is secured to the recessed surface 616 .
  • the floor 642 extends across a bottom opening formed by the annular member 630 .
  • the floor 642 has a top surface 644 and a bottom surface 646 .
  • a chamber 602 is formed between the top surface 644 of the floor 642 and the recessed surface 616 of the polishing head 610 .
  • the annular member 630 and the annular wall 650 determine the radial boundaries of the chamber 602 .
  • the platform 620 and the overlapping annular member 630 and annular wall 650 are thicker and are adapted to be more rigid than the floor 642 .
  • Metal used in the polishing head assembly 600 has the potential to contaminate the wafer by being a source of metal ions through the polishing chemicals or slurry.
  • a template including a backing film e.g., backing film 110 shown in FIG. 1
  • retaining ring e.g., retaining ring 120 shown in FIG. 1
  • the backing film 110 is generally a thin soft polymer pad or other suitable material.
  • Backing film 110 suitably includes two or more layers of material (not shown).
  • backing film 110 may have an adhesive layer, a thin plastic film layer, and a thin polyurethane foam, or other non-woven material (e.g., felt), layer.
  • the adhesive layer seals backing film 110 to bottom surface 646 of cap 640 .
  • the thin plastic film layer provides a protective barrier between cap 640 and the slurry and/or wafer W.
  • the layer comprising polyurethane foam or non-woven material e.g., felt
  • the retaining ring 120 extends downwardly from backing film 110 and is generally a plastic material. The wafer is received by retaining ring 120 and is retained against backing film 110 by surface tension. As such, the wafer does not directly contact the cap 640 .
  • the polishing head 610 and cap 640 are circumscribed with band 670 forming a barrier to prevent the slurry from contacting the metal and contaminating the wafer.
  • the annular member 630 has a side recess 638 that extends inwardly from the outside surface 632 and an inner recess 639 that extends inwardly from the inside surface 634 at bottom 614 .
  • a tab 648 extends outwardly from the annular wall 650 of cap 640 opposite floor 642 . Tab 648 , side recess 638 and inner recess 639 each receive band 670 and may be sealed thereto with an adhesive, such as epoxy glue.
  • the band 670 may overlap backing film 110 and/or retaining ring 120 of template to form a seal therebetween to prevent metal contamination of the polishing process from the polishing head 610 .
  • the band 670 is made of plastic, such as polyetherimide (for example, ULTEMTM Resin 1000 available from Saudi Basic Industries Corporation (SABIC)), polyether ether ketone, polyphenylene sulfide, or polyethylene terephthalate.
  • Band 670 may be non-unitary and is made of two or more segments.
  • band 670 may be made of three, four, five, or six segments.
  • band 670 may be sealed together at the segment joints (not shown) and sealed to polishing head 610 and/or cap 640 using an adhesive, such as epoxy glue.
  • band 670 may include an interlocking member to secure band 670 to polishing head assembly 600 .
  • band 670 may include a dovetail 672 which forms a joint with an inner recess 639 formed on the inside surface 634 of annular member 630 and with an upwardly extending member of tab 648 .
  • the dovetail 672 may be used to secure band 670 to polishing head 610 and/or cap 640 in addition to an adhesive or as an alternative.
  • the chamber 602 is pressurized with a pressurized media or fluid.
  • the chamber 602 may be connected with a pressurizing source (not shown) to provide the pressurized media or fluid to the chamber 602 , as described herein for polishing head assembly 200 .
  • the pressurizing source (not shown) connects to a chamber passageway 622 (e.g., via a quick disconnect coupling plug).
  • the chamber passageway 622 extends through the platform 620 to chamber 602 .
  • floor 642 is a semi-rigid “flex plate” that is adapted to be precisely deformed to change the pressure distribution and polishing pressure profile, and still be rigid enough to mount and demount the wafer on the backing film 110 by surface tension.
  • Floor 642 is capable of temporarily deflecting relative to polishing head 610 without permanently deforming. Adjusting pressure in chamber 602 causes deflection of floor 642 .
  • shoulder 692 includes o-ring (not shown)
  • a seal formed at the connection of the top edge 694 and recessed surface 616 may prevent leakage of the pressurized media or fluid from chamber 602 , thereby maintaining a given pressure in chamber 602 .
  • annular wall 650 of cap 640 includes a first portion 654 joined to floor 642 to form a joint 690 about which the floor may temporarily deflect in response to a change in pressure within chamber 602 .
  • First portion 654 is connected to shoulder 692 with a second portion 656 extending between the first portion 654 and the shoulder 692 .
  • the thickness of the annular wall 650 is greatest at the shoulder 692 , as shown in FIG. 6 .
  • First portion 654 is defined by a notch 655 formed in annular wall 650 at joint 690 .
  • Notch 655 may be U-shaped or may be substantially circular in shape.
  • First portion 654 therefore has a thickness that is less than a thickness of the second portion 656 .
  • first portion 654 may be from about 3 mm to about 5 mm, or about 3 mm.
  • Notch 655 also forms a fillet 657 at joint 690 . Reducing the thickness of first portion 654 and/or forming fillet 657 via notch 655 suitably weakens a deformation resistance of a portion of floor 642 proximate joint 690 that is otherwise substantially incapable of deflecting in response to a change in pressure within chamber 602 .
  • This portion of floor may extend a radial distance of up to about 30 mm from joint 690 to a center of floor 642 .
  • notch 655 and/or fillet 657 to weaken the deformation resistance of the portion of floor 642 proximate joint 690 may suitably be performed using computer numeric control (CNC) milling.
  • CNC computer numeric control
  • notch 655 and/or fillet 657 cannot be formed using conventional machining techniques that are used to flatten the floor 642 of cap 640 , such as a conventional lapping process.
  • CNC milling may be used to provide the portion of floor 642 proximate joint 690 having a thickness of from about 5 mm to about 6 mm, such as 5.5 mm, for example.
  • Floor 642 may suitably have a continuous thickness extending the entire diameter of floor 642 between annular wall 650 .
  • the thickness of the floor 642 may vary across the diameter of the floor 642 between the annular wall 650 .
  • the floor 642 may have a thickness that tapers inwardly from a center of floor 642 to joint 690 as described in further detail herein.
  • polishing head assembly 700 includes the elements and components of polishing head assembly 600 shown in FIG. 6 and described above.
  • a portion 659 of annular wall 650 that extends between shoulder 692 and fillet 657 has an inner surface 653 that is angled with respect to outer surface 652 .
  • the thickness of portion 659 of annular wall 650 tapers inwardly from shoulder 692 toward joint 690 , such that annular wall 650 has a smallest thickness at joint 690 .
  • the thickness of annular wall 650 at joint 690 is reduced to a thickness of from about 3 mm to about 5 mm, or about 3 mm.
  • Reducing the thickness of annular wall 650 from shoulder 692 toward joint 690 and/or forming fillet 657 suitably weakens a deformation resistance of the portion of floor 642 proximate joint 690 that is otherwise substantially incapable of deflecting in response to a change in pressure within chamber 602 .
  • This portion of floor may extend a radial distance of up to about 30 mm from joint 690 toward a center of floor 642 .
  • the formation of the angled profile of inner surface 653 to reduce the thickness of annular wall 650 , and the formation of fillet 657 , to weaken the deformation resistance of the portion of floor 642 proximate joint 690 may suitably be performed using computer numeric control (CNC) milling.
  • CNC computer numeric control
  • fillet 657 and the angled profile of inner surface 653 cannot be formed using conventional machining techniques that are used to flatten the floor 642 of cap 640 , such as a conventional lapping process.
  • modifications may be made to conventional machining techniques to form fillet 657 and the angled profile of inner surface 653 .
  • floor 642 may suitably have a continuous thickness extending the entire diameter of floor 642 between annular wall 650 .
  • the thickness of the floor 642 may vary across the diameter of the floor 642 between the annular wall 650 .
  • the floor 642 may have a thickness that tapers inwardly from a center of floor 642 to joint 690 (shown in FIG. 8 ).
  • polishing head assembly 800 includes similar elements and components of polishing head assembly 600 and/or 700 shown in FIGS. 6 and 7 , respectively, and described above.
  • the thickness of floor 642 tapers inwardly from a radial center C of floor 642 toward joint 690 . As such, the thickness of the floor 242 is greatest at the center C and is reduced to a minimum thickness at the joint 690 .
  • the thickness of floor 642 may taper from a thickness of from about 5 mm to 6 mm, or about 5.5 mm, at the center C to a thickness of from about 3 mm to about 4 mm, or about 3 mm, at joint 290 . Tapering the thickness of floor 642 to reduce the thickness of floor 642 proximate joint 690 suitably weakens a deformation resistance of the portion of floor 642 proximate joint 690 that is otherwise substantially incapable of deflecting in response to a change in pressure within chamber 602 . This portion of floor 642 proximate joint 690 may extend a radial distance of up to about 30 mm from joint 690 toward the radial center C of floor 642 .
  • annular wall 650 of polishing head assembly 800 may or may not include additional features to weaken the deformation resistance of the portion of floor 642 proximate joint 690 as described herein.
  • the portion 659 of annular wall 650 that extends between shoulder 692 and corner 696 may have an inner surface 653 that is substantially parallel to outer surface 652 such that the thickness of the portion 659 is substantially constant.
  • the thickness of the portion 659 may be reduced at the joint 690 .
  • the inner surface 653 may be angled with respect to outer surface 652 such that the thickness of portion 659 of annular wall 650 tapers inwardly from shoulder 692 toward joint 690 (as shown in FIG. 7 ).
  • a corner 696 at joint 690 between inner surface 653 of annular wall 650 and top surface 644 of floor 642 may be angular, or may be filleted (i.e., to form fillet 657 shown in FIGS. 6 and 7 ).
  • the thickness of annular wall 650 at joint 690 may be about 8 mm, or may be reduced to a thickness of from about 3 mm to about 5 mm, or about 3 mm.
  • the formation of the tapered profile of floor 642 to weaken the deformation resistance of the portion of floor 642 proximate joint 690 may suitably be performed using computer numeric control (CNC) milling.
  • CNC computer numeric control
  • the tapered profile of floor 642 cannot be formed using conventional machining techniques that are used to flatten the floor 642 of cap 640 , such as a conventional lapping process.
  • modifications may be made to conventional machining techniques to form the tapered profile of floor 642 .
  • the embodiments described reduce deformation resistance of a floor of a cap of a polishing head assembly that is otherwise substantially incapable of deformation in response to a change of pressure with a chamber of the polishing head assembly.
  • the embodiments enable a more uniform removal profile on a polished wafer.
  • the distribution of Von Mises stresses exerted between the wafer and a polishing pad is more uniform during polishing.
  • the Von Mises stresses exerted between the edge of the wafer and the polishing pad can be better controlled to fine-tune the removal profile near the edge of the wafer.
  • the terms “about,” “substantially,” “essentially” and “approximately” when used in conjunction with ranges of dimensions, concentrations, temperatures or other physical or chemical properties or characteristics is meant to cover variations that may exist in the upper and/or lower limits of the ranges of the properties or characteristics, including, for example, variations resulting from rounding, measurement methodology or other statistical variation.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US18/065,855 2021-12-23 2022-12-14 Polishing head assembly having recess and cap Active 2043-12-15 US12420376B2 (en)

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US18/065,855 US12420376B2 (en) 2021-12-23 2022-12-14 Polishing head assembly having recess and cap
TW111149557A TW202344348A (zh) 2021-12-23 2022-12-22 具有凹槽及蓋體之研磨頭組件
EP22216026.9A EP4201591B1 (de) 2021-12-23 2022-12-22 Polierkopfanordnung mit aussparung und kappe
KR1020220183232A KR20230096907A (ko) 2021-12-23 2022-12-23 리세스 및 캡을 갖는 연마 헤드 조립체

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US20230201994A1 (en) 2023-06-29
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TW202344348A (zh) 2023-11-16
EP4201591A1 (de) 2023-06-28

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