US11880319B2 - Memory module having open-drain output for error reporting and for initialization - Google Patents
Memory module having open-drain output for error reporting and for initialization Download PDFInfo
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- US11880319B2 US11880319B2 US17/840,593 US202217840593A US11880319B2 US 11880319 B2 US11880319 B2 US 11880319B2 US 202217840593 A US202217840593 A US 202217840593A US 11880319 B2 US11880319 B2 US 11880319B2
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Definitions
- the present disclosure relates to the operation of memory modules. Specifically, the present disclosure relates to systems and methods for handshaking with a memory module during or upon completion of initialization.
- Memory subsystems such as memory modules are generally involved in the initialization procedure for computer systems, including servers, personal computers, and the like.
- the memory subsystems may undergo internal initialization procedures, or the system memory controller may otherwise interact with the memory subsystems during the initialization procedure.
- the system memory controller may request that the memory subsystem perform one or more requested tasks during system initialization.
- a memory module is coupled to a memory controller of a host computer system via an interface.
- the interface includes data, address and control signal pins and an output pin in addition to the data, address and control signal pins.
- the memory module receives a first command from the memory controller via the address and control signal pins, and enters a first mode in response to the first command.
- the memory module in the first mode responds to at least one initialization sequence, and sends a first output signal via the output pin to indicate a status of the at least one initialization sequence to the memory controller.
- the memory module enters a second mode in which the memory module performs memory operations including memory read/write operations according to an industry standard.
- the memory module communicates data with the memory controller via the data signal pins in response to second memory commands received via the address and control signal pins.
- the memory module may output a second output signal related to the read/write operations via the output pin.
- a memory module is coupled to a memory controller of a host computer system via an interface.
- the interface includes data, address and control signal pins and an output pin in addition to the data, address and control signal pins.
- the memory module performs an internal procedure in a first mode in response to a first command from the memory controller whereby the memory controller hands off control of the internal procedure to the first memory module.
- the memory module sends a first output signal via the output pin to indicate a status of the internal procedure to the memory controller.
- the memory module enters a second mode in which the memory module performs standard operations including one or more of memory read/write, pre-charge, refresh operations according to an industry standard.
- the memory module may output a second output signal related to the standard operations via the output pin.
- a memory module is operable in a first mode and in a second mode.
- the memory module operates according to an industry standard in the second mode by performing standard operations including memory read/write operations in response to address and control signals from a memory controller of a host computer system.
- the memory module comprises a standard interface including data, address and control signal pins and an output pin in addition to the data, address and control signal pins.
- the memory module enters the first mode in response to a first command from the memory controller, in which the memory module responds to at least one initialization sequence.
- the memory module further comprises a notification circuit to output a notification signal indicating a status of the at least one initialization sequence to the memory controller via the output pin.
- FIG. 1 shows an example host computer system including an example memory module configured to perform handshaking with a memory controller of the host computer system according to certain embodiments described herein.
- FIG. 2 shows an example host computer system including example first and second memory modules configured to perform handshaking with a system memory controller of the host computer system according to certain embodiments described herein.
- FIG. 3 shows a host computer system including example first and second memory modules configured to perform handshaking with a memory controller of the host system, where the notification circuits of the first and second memory modules have another example configuration according to certain embodiments described herein.
- FIG. 4 and FIG. 5 show example methods of using at least one memory module according to certain embodiments described herein.
- LR-DIMM Liad Reduced DIMM
- Such an LR-DIMM configuration may have the MCH inserting a waiting period of predetermined length during which the MCH is idle and the memory subsystem controller undergoes initialization.
- one shortcoming of this LR-DIMM configuration would be that it requires the MCH to be in standby (idle, or wait) while the memory subsystem controller completes its task. Under such an arrangement, since the time to complete a task can be dependent on the density, speed and configuration of the memory subsystem, and these parameters may be unknown to the MCH, the MCH may have to insert a single, predetermined standby period.
- the MCH may give control to the local memory controller of a memory subsystem (e.g., memory module) for execution of a training sequence.
- the MCH may wait for a pre-determined period of time and then assume that the local memory controller has completed the training sequence.
- the time for actually completing the training sequence may vary and may be longer or shorter than predetermined period of time.
- handshaking can be implemented in at least two ways; polling and notifying.
- the MCH reads a status register in the memory subsystem controller to find out if the memory subsystem controller has completed the required or requested operation.
- a status register may be read out through a serial interface such as System Management Bus (SMBus).
- SMBs System Management Bus
- a register polling method is generally inefficient because the system memory controller does not know exactly when the memory subsystem will have completed the required or requested operation. Thus, the system memory controller may wait longer than necessary to poll the memory subsystem, thereby delaying the overall initialization process.
- the problem may be compounded because multiple training sequences or other initialization sequences may be run on the memory subsystem during a particular initialization period, resulting in accumulation of such unnecessary delays.
- polling generally involves scheduling polling intervals during which the system memory controller is not performing other operations, resulting in further inefficiency.
- the notifying method is an advantageous handshaking method between the MCH and the memory subsystem controller.
- the memory subsystem controller sends a signal to the MCH when the memory subsystem controller completes the required or requested operation. This method allows the MCH to execute one or more independent commands while it is waiting for a notification signal from the memory subsystem controller.
- Certain embodiments described herein provide a method of establishing a handshake mechanism based on notification signaling.
- this mechanism can be implemented by adding a new interface (notifying) signal between the MCH and the memory subsystem controller, or by adding an additional functionality to an existing, non-timing critical signal without altering the memory subsystem hardware.
- the interface between the MCH and the memory subsystem controller of certain embodiments can be an open drain signaling from the memory subsystem controller to the MCH, although a variety of other configurations are possible.
- the terms MCH, system memory controller, and memory subsystem are used generally interchangeable throughout this disclosure, and the terms memory module, memory subsystem controller, and local memory controller are used generally interchangeably throughout this disclosure.
- FIG. 1 illustrates an example host computer system 16 including an example memory module 10 according to certain embodiments described herein.
- the memory module 10 can comprise at least one output 12 configured to be operatively coupled to a system memory controller 14 of the host computer system 16 .
- the memory module 10 is configured to operate in at least two modes comprising an initialization mode during which the memory module 10 executes at least one initialization sequence, and an operational mode.
- the memory module 10 may further include a controller circuit 18 .
- the controller circuit 18 is configured to cause the memory module 10 to enter the initialization mode.
- the memory module 10 can further include a notification circuit 20 configured to drive the at least one output 12 while the memory module 10 is in the initialization mode to provide at least one notification signal to the memory controller 14 indicating at least one status of the at least one initialization sequence.
- the memory module 10 may comprise a printed-circuit board (PCB) 22 .
- the memory module 10 has a memory capacity of 512-MB, 1-GB, 2-GB, 4-GB, 8-GB, 16-GB, or higher. Other memory capacities are also compatible with certain embodiments described herein.
- memory modules 10 having widths of 4 bytes, 8 bytes, 16 bytes, 32 bytes, or 32 bits, 64 bits, 128 bits, 256 bits, as well as other widths (in bytes or in bits), are compatible with embodiments described herein.
- the PCB 22 can have an industry-standard form factor.
- the PCB 22 can have a low profile (LP) form factor with a height of 30 millimeters and a width of 133.35 millimeters.
- the PCB 20 has a very high profile (VHP) form factor with a height of 50 millimeters or more.
- the PCB 22 has a very low profile (VLP) form factor with a height of 18.3 millimeters.
- SO-DIMM small-outline
- UDIMM unbuffered
- RDIMM registered (RDIMM)
- BFDIMM fully-buffered
- mini-DIMM mini-RDIMM
- VLP mini-DIMM VLP mini-DIMM
- micro-DIMM micro-DIMM
- SRAM DIMM small-outline
- certain non-DIMM form factors are possible such as, for example, single in-line memory module (SIMM), multi-media card (MMC), and small computer system interface (SCSI).
- the memory module 10 is operatively coupled to (e.g., in electrical communication with) the host computer system 16 .
- the memory module 10 may communicate with the host computer system 16 using some other type of communication, such as, for example, optical communication.
- Examples of host computer systems 16 include, but are not limited to, blade servers, 1 U servers, personal computers (PCs), and other applications in which space is constrained or limited.
- the PCB 22 can comprise an interface (not shown) that is configured to be in electrical communication with the host computer system 16 .
- the interface can comprise a plurality of edge connections which fit into a corresponding slot connector of the host system 16 .
- the interface of certain embodiments provides a conduit for power voltage as well as data, address, and control signals between the memory module 10 and the host system 16 .
- the interface can comprise a standard 240-pin DDR2 edge connector.
- the at least one output 12 may be routed over the interface, for example.
- the memory module 10 may also comprise one or more memory elements (not shown), such as dynamic random-access memory (DRAM) elements, for example.
- DRAM dynamic random-access memory
- Types of DRAM elements compatible with certain embodiments described herein include, but are not limited to, DDR, DDR2, DDR3, DDR4, and synchronous DRAM (SDRAM).
- memory elements having bit widths of 4, 8, 16, 32, as well as other bit widths are compatible with certain embodiments described herein.
- Memory elements compatible with certain embodiments described herein have packaging which include, but are not limited to, thin small-outline package (TSOP), ball-grid-array (BGA), fine-pitch BGA (FBGA), micro-BGA ( ⁇ BGA), mini-BGA (mBGA), and chip-scale packaging (CSP).
- TSOP thin small-outline package
- BGA ball-grid-array
- FBGA fine-pitch BGA
- ⁇ BGA micro-BGA
- mini-BGA mini-BGA
- the memory module 10 may also include one or more non-volatile memory elements, such as one or more flash memory elements.
- non-volatile memory elements such as one or more flash memory elements.
- Types of flash memory elements compatible with certain embodiments described herein include, but are not limited to, NOR flash, NAND flash, ONE-NAND flash, and multi-level cell (MLC).
- the controller circuit 18 of certain embodiments generally controls the operation of the memory module 10 .
- the controller circuit 18 may control the memory elements of the memory module 10 and/or communicate with the system memory controller 14 .
- the controller circuit 18 may receive and process address and command signals (e.g., read, write commands) from the system memory controller 14 and transmit appropriate address and commands to the memory elements in response. See, e.g., U.S. Pat. Appl. Publ. Nos. 2006/0062047 A1 and 2006/0262586 A1, each of which is incorporated in its entirety by reference herein.
- the controller circuit 18 comprises a local memory controller.
- the controller circuit 18 may comprise an advanced memory buffer (AMB).
- AMB advanced memory buffer
- the controller circuit 18 can comprise one or more of a field-programmable gate array (FPGA), a programmable-logic device (PLD), an application-specific integrated circuit (ASIC), a custom-designed semiconductor device, and a complex programmable logic device (CPLD), for example.
- FPGA field-programmable gate array
- PLD programmable-logic device
- ASIC application-specific integrated circuit
- CPLD complex programmable logic device
- the controller circuit 18 comprises various discrete electrical elements, while in certain other embodiments, the controller circuit 18 comprises one or more integrated circuits.
- the memory module 10 is configured to operate in at least two modes comprising an initialization mode during which the memory module 10 executes at least one initialization sequence, and an operational mode.
- the at least one initialization sequence may comprise one or more training sequences.
- the initialization sequence (e.g., comprising one or more training sequences) may be initiated by the system memory controller 14 .
- the controller circuit 18 is configured to cause the memory module 10 to enter the initialization mode.
- the controller circuit 18 may be configured to execute a routine implementing the at least one initialization sequence when the appropriate signal or command is received from the memory controller 14 or is otherwise received from the host computer system 16 (e.g., upon receipt of a reset signal).
- the computer system 16 is coupled to a plurality of memory modules 10 , 26 including the memory module 10 and at least a second memory module 26 , and the memory controller 14 (e.g., MCH) trains each module 10 , 26 separately, in series.
- the memory controller 14 issues a first command to the memory module 10 , and, in response, the memory module 10 executes an initialization sequence (e.g., one or more training sequences).
- the first memory module 10 advantageously issues a notification to the memory controller 14 in accordance with embodiments described herein.
- the memory controller 14 issues a second command, this time to the memory module 26 , and, in response, the memory module 26 executes an initialization sequence (e.g., one or more training sequences).
- the second memory module 26 similar to the first memory module 10 , advantageously issues a notification to the memory controller 14 in accordance with embodiments described herein.
- the memory controller 14 issues a third command to a third memory module (not shown), and so forth.
- One example computer system 16 capable of implementing such a scenario is configured to execute an Intel Basic Input/Output System (BIOS), and comprises a plurality of memory modules 10 , 26 having an LRDIMM configuration.
- BIOS causes the system memory controller 14 to initialize the LRDIMM memory modules 10 , 26 serially.
- the operational mode is the normal mode of the memory module 10 .
- the memory module 10 is generally accessed by the system memory controller 14 of the host computer 16 during standard computer operation not associated with initialization.
- the system memory controller 14 may cause the memory module 10 to perform standard operations such as memory read/write, pre-charge, refresh, etc., while in operational mode, although it will be appreciated that one or more of these operations can also be performed by the memory module 10 while in initialization mode in certain embodiments.
- the notification circuit 20 can be configured to drive the at least one output 12 , while the memory module 10 is in the initialization mode or after the memory module 10 completes one or more initialization sequences, to provide the at least one notification signal to the memory controller 14 indicating at least one status of the at least one initialization sequence. While shown in FIGS. 1 - 3 as forming a part of the controller circuit 18 , the notification circuit 20 may be a physically and/or logically separate circuit in certain embodiments. While a variety of configurations are possible, the notification circuit 20 may comprise one or more transistors, one or more logic elements (e.g., AND, OR, NOR, NAND, XOR gates, and the like), or a combination thereof. In some embodiments, the notification circuit 20 may additionally or alternatively comprise one or more of an FPGA, PLD, CPLD, ASIC, custom-designed semiconductor device, discrete electrical elements, and an integrated circuit.
- the at least one status of certain embodiments comprises completion of the at least one initialization sequence, such that the at least one notification signal is indicative of the completion of the at least one initialization sequence.
- the at least one status of certain embodiments comprises execution of the at least one initialization sequence.
- the at least one status may indicate that the at least one initialization sequence is currently being executed.
- the at least one status may provide an indication that a certain task has been completed by the memory module 10 , such as a training task requested by the system memory controller 14 .
- the notification circuit 20 can be configured to drive the at least one output 12 to a first state indicative of execution of the at least one initialization sequence or to a second state indicative of completion of the at least one initialization sequence.
- the first state may be a high or low logic level
- the second state may be a high impedance state.
- the first state is a high or low logic level
- the second state is the inverse logic level of the first state.
- the at least one output 12 of certain embodiments is configured to be operatively coupled to at least one interrupt of the system memory controller 14 , and the system memory controller 14 is responsive to the at least one notification signal indicating completion of the at least one initialization sequence.
- the system memory controller 14 may trigger execution of an interrupt routine upon receipt of the notification signal on the output 12 .
- the interrupt routine generally executes the appropriate operations for the at least one status indicated by the at least one notification signal. For example, if the at least one status indicates that the at least one initialization sequence is complete, execution of the interrupt routine may cause the system memory controller 14 to notify the host computer system 16 that the system initialization, or a portion thereof, is completed.
- the execution of the interrupt routine causes the system memory controller 14 to initiate a subsequent training sequence for the memory module 10 or on another memory module connected to the host system 16 .
- a central processing unit (CPU) of the host system 16 (not shown) enters a “Wait” state after issuing a command to the memory module 10 to enter the initialization mode. Receipt of the at least one notification signal on the output 12 triggers execution of the interrupt routine, which interrupts the CPU, causing the “Wait” state to be aborted and allowing the host system 16 to continue operation.
- the CPU and memory controller 14 of the host system 16 may comprise separate modules, or may alternatively comprise a single integrated module, depending on the architecture of the host system 16 chip-set.
- execution of the interrupt routine causes the system memory controller 14 to cause the memory module 10 to exit the initialization mode and to enter the operational mode.
- the memory module 10 automatically enters the operational mode upon completion of the at least one initialization sequence without intervention from the memory controller 14 .
- the at least one output 12 is operated in conformance with a standard (e.g., an industry standard) when the memory module 10 is in the operational mode, but is not operated in conformance with the standard when the memory module 10 is in the initialization mode.
- a standard e.g., an industry standard
- An example of a standard in accordance with certain embodiments described herein is one or more of the industry standard promulgated by the Joint Electronic Devices Engineering Counsel (JEDEC).
- JEDEC Joint Electronic Devices Engineering Counsel
- the operation and behavior of the at least one output 12 may conform to an industry standard when the memory module 10 is in the operational mode, but the operation and behavior of the at least one output 12 may not conform to the industry standard when the memory module 10 is in the initialization mode.
- an existing (e.g., JEDEC-specified) pin may be utilized to provide the at least one notification signal to the system memory controller 14 from the memory module 10 during the initialization mode.
- the at least one output 12 comprises an error-out pin of the memory module 10 .
- the operation of the error-out pin is undefined by the standard during initialization.
- the error-out pin may be used according a conventional industry standard (e.g., a JEDEC standard) to indicate a parity error has occurred in the memory module 10 .
- the error-out pin can be used to transmit the at least one notification signal to the system memory controller 14 .
- the error-out pin for initialization status notification according to certain embodiments because the error-out pin can be asserted by the memory module 10 independent from system memory controller 14 requests or commands. Also, because the error-out pin is a JEDEC-specified pin, design cost and complexity are reduced because additional pin-outs and interrupt design changes can be avoided (e.g., in cases where such changes in hardware or chipset may not be feasible to provide the at least one status to the system memory controller 14 ). However, in certain other embodiments, providing the at least one status may be implemented by adding one or more pins to the system memory controller 14 (e.g., MCH) and to the controller circuit 18 (e.g., local memory controller), thereby utilizing changes in hardware or the chipset.
- MCH system memory controller 14
- the controller circuit 18 e.g., local memory controller
- the error-out pin may be coupled to an interrupt of the system memory controller 14 (e.g., according to the JEDEC standard).
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory controller
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory controller
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory controller
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory controller
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory controller
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory controller
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory controller
- the notification of completion of the required or requested task from the memory module 10 e.g., by the local memory
- the error-out pin and corresponding signal memory module 10 can be used to support the notifying function and to provide the at least one status generally without changing hardware.
- Certain other such embodiments involve modifying the basic input/output system (BIOS) or other programming change.
- BIOS may be modified to indicate to the system memory controller 14 how to respond to the notification signal (e.g., to the error_out signal or the interrupt corresponding thereto).
- the at least one output 12 may include other existing (e.g., JEDEC specified) pins instead of, or in addition to, the error-out pin.
- at least one additional (e.g., non-JEDEC specified) pin may be employed.
- any pin not otherwise active during the initialization mode may be used (e.g., high-order address pins, read/write pins, data pins, etc.).
- the at least one output 12 can further be configured to be operatively coupled to at least one second output 24 of a second memory module 26 in some embodiments, as schematically illustrated in FIGS. 1 - 3 .
- the second memory module 26 may be generally similar in structure and function to the memory module 10 , and may comprise a controller circuit 28 and a notification circuit 30 , for example.
- the second memory module 26 may be generally identical to the first memory module 10 , or may have a different memory capacity, form factor, etc., than the first memory module 10 . More than two such memory modules may be present in certain embodiments.
- the second memory module 26 can be configured to operate in at least two modes comprising an initialization mode during which the second memory module 26 executes at least one initialization sequence, and an operational mode.
- the initialization and operational modes may be similar to those describe above in relation to the first memory module 10 .
- the second memory module 26 can also be configured to drive the at least one second output 24 to a third state indicative of execution of at least one initialization sequence of the second memory module 26 or to a fourth state indicative of completion of the at least one initialization sequence of the second memory module 26 .
- the at least one first output 12 of the first memory module 10 and the at least one second output 24 of the second memory module 26 are operatively coupled together by a bus 32 which is also operatively coupled to at least one input 34 of the system memory controller 14 .
- the at least one first output 12 and the at least one second output 24 are not coupled together, and are coupled to two separate inputs of the system memory controller 14 .
- FIG. 2 shows an example host computer system 16 including example first and second memory modules 10 , 26 .
- the notification circuits 20 , 30 of the first and second memory modules 10 , 26 each comprise at least one transistor 36 , 38 .
- the at least one transistor 36 , 38 can be in an open-drain configuration, as shown, although other configurations are possible.
- the first state of the at least one first output 12 is a first logic level
- the second state of the at least one first output 12 is a high-impedance state
- the third state of the at least one second output 24 is the first logic level
- the fourth state of the at least one second output 24 is the high-impedance state.
- the first and second memory modules 10 , 26 drive the gates of the respective transistors 36 , 38 high.
- the transistors 36 , 38 are respectively low impedance while the memory modules 10 , 26 are executing each section of the initialization sequence, thereby pulling the first and second outputs 12 , 24 low.
- the first state and the third state are low logic levels (ground) in the example configuration.
- the bus 32 will be pulled to a low logic level.
- each of the two memory modules 10 , 26 can drive the corresponding at least one first and second outputs 12 , 24 respectively to a high impedance state, For example, once the at least one initialization sequence on each of the first and second memory modules 10 , 26 is completed, the first and second memory modules 10 , 26 can drive the gates of the respective transistors 36 , 38 low, resulting in a high-impedance state on the at least one first and second outputs 12 , 24 causing the bus 32 to be pulled high by the system memory controller 14 .
- the bus 32 will be pulled high by the internal pull-up configuration 40 of the system memory controller 14 .
- the second state and the fourth state are therefore high-impedance values in the example embodiment.
- the system memory controller 14 can monitor the value on the bus 32 via the first input 34 to determine when both of the memory modules 10 , 26 have completed the at least one initialization sequence.
- the at least one first and second outputs 12 , 24 may be received on separate inputs of the system memory controller 14 , and the status of the at least one initialization sequence of each memory module 10 , 26 may be monitored independently.
- each memory module 10 , 26 or associated controller circuit 18 causes the corresponding notification circuit 20 , 30 to drive the at least one output 12 , 24 to the high impedance state from the low impedance state when it completes the requested or required operation.
- the system memory controller 14 e.g., MCH
- system memory controller 14 e.g., MCH
- the system memory controller 14 may be able to monitor the progress of multiple memory modules 10 , 26 including a mix of DIMMs or other memory modules having differing characteristics, such as DIMM density, rank configurations, DRAM density, speed, DRAM configuration, etc.
- the at least one output 12 of the first memory module 10 and the at least one second output 24 of the second memory module 26 are configured to be operatively coupled to at least one interrupt of the system memory controller 14 in certain embodiments.
- the system memory controller 14 can be responsive to the second state of the first memory module 10 and the fourth state of the second memory module 26 by triggering execution of an interrupt routine by a processor of the system memory controller 14 .
- the system memory controller 14 triggers execution of the interrupt routine.
- the at least one first output 12 and the at least one second output 24 are operatively coupled to separate inputs of the system memory controller 14
- the at least one first output 12 and the at least out second output 24 may be operatively coupled to two separate interrupts.
- the system memory controller 14 may be responsive to the second state of the first memory module 10 by triggering execution of a first interrupt routine associated with a first interrupt, and may be responsive to the fourth state of the second memory module 26 by triggering execution of a second interrupt routine associated with the second interrupt.
- the separate inputs of the memory controller 14 are internally operatively coupled to the same interrupt, or are operatively coupled to separate interrupts which trigger the same interrupt routine.
- FIG. 3 shows a host computer system 16 including an example memory module 10 where the notification circuit 20 of the memory module 10 has another example configuration in accordance with certain embodiments described herein.
- the at least one first output 12 is operatively coupled to an error-out pin of the memory module 10
- a multiplexor 42 drives the transistor 36 with either of a task_in_progress signal 44 or an error signal 46 (e.g., parity error signal).
- the multiplexor 42 may be configured to drive the transistor 36 with the task_in_progress signal 44 when the memory module 10 is in the initialization mode or is executing the at least one initialization sequence, and with the error signal 46 when the memory module 10 is in the operational mode.
- the memory module 10 can be advantageously configured to both perform the standard (e.g., JEDEC-specified) error reporting functionality via the error-out pin during the operational mode and provide the status notification functionality during the system initialization mode, as described herein.
- a second memory module 26 including a similar configuration can also be operatively coupled to the host computer system 16 .
- the at least one second output 24 of the second memory module 26 can be operatively coupled to the at least one first output 12 by the bus 32 , as described above (e.g., with respect to FIG. 2 ).
- FIG. 4 shows an example method 100 of using the at least one memory module 10 in accordance with certain embodiments described herein. While the description below of the method 100 refers to structure shown in FIGS. 1 - 3 , other structures may also be used in accordance with certain embodiments described herein.
- the method 100 of certain embodiments comprises providing a first memory module 10 comprising at least one first output 12 operatively coupled to a memory controller 14 of a host computer system 16 .
- the first memory module 10 can be configured to operate in at least two modes comprising an initialization mode during which the first memory module 10 executes at least one initialization sequence, and an operational mode.
- the at least one initialization sequence may comprise one or more steps of a series of steps associated with an initialization procedure of the host computer system 16 .
- the method 100 in some embodiments comprises causing the first memory module 10 to enter the initialization mode.
- the method 100 of certain embodiments comprises driving the at least one first output 12 to a first state while the memory module 10 executes the at least one initialization sequence.
- the method of certain embodiments comprises driving the at least one first output 12 to a second state different than the first state.
- the first state is a first logic level and the second state is a high impedance state.
- the at least one first output 12 is operatively coupled to at least one interrupt of the memory controller 14 such that driving the at least one output 12 to the second state triggers the memory controller to execute an interrupt routine.
- the at least one output 12 is operated in conformance with JEDEC standard when the first memory module 10 is in the operational mode, but is not operated in conformance with the JEDEC standard when the first memory module 10 is in the initialization mode.
- the at least one first output 12 of certain embodiments include an error-out pin of the first memory module, for example.
- the method 100 can further include providing a second memory module 26 comprising at least one second output 24 operatively coupled to the memory controller 14 .
- the second memory module 26 can be configured to operate in one of at least two modes comprising an initialization mode, during which the second memory module 26 executes at least one initialization sequence, and an operational mode.
- the method 100 can further include causing the second memory module 26 to enter the initialization mode.
- the method 100 also includes driving the at least one second output 24 of the second memory module 26 to a third state while the second memory module 26 executes the at least one initialization sequence.
- the method 100 can further include driving the at least one second output 24 of the second memory module 26 to a fourth state different from the third state.
- the at least one first output 12 of the first memory module 10 and the at least one second output 24 of the second memory module 26 are operatively coupled together by a bus 32 which is also operatively coupled to at least one input 34 of the memory controller 14 .
- the at least one first output 12 of the first memory module 10 is operatively coupled to a first input 34 of the memory controller 14 and the at least one second output 24 of the second memory module 26 is operatively coupled to a second input (not shown) of the memory controller 14 .
- FIG. 5 shows another example method 200 of using at least one memory module 10 in accordance with certain embodiments described herein.
- the method 200 may include providing a memory module 10 comprising at least one output 12 operatively coupled to a memory controller 14 of a host computer system 16 .
- the memory module 10 may be configured to operate in at least two modes comprising an initialization mode, during which the memory module 10 executes at least one initialization sequence, and an operational mode.
- the method 200 can further include causing the memory module 10 to enter the initialization mode at block 204 .
- the method 200 can include receiving a notification signal from the at least one output 12 of the memory module 10 .
- the notification signal may indicate that the memory module 10 has completed the initialization sequence, for example.
- the method 200 further comprises executing an interrupt routine by the memory controller 14 in response to the notification signal.
- acts, events, or functions of any of the methods described herein can be performed in a different sequence, can be added, merged, or left out all together (e.g., not all described acts or events are necessary for the practice of the method).
- acts or events can be performed concurrently, e.g., through multi-threaded processing, interrupt processing, or multiple processors or processor cores, rather than sequentially.
- DSP digital signal processor
- ASIC application specific integrated circuit
- FPGA field programmable gate array
- a general purpose processor can be a microprocessor, but in the alternative, the processor can be any conventional processor, controller, microcontroller, or state machine.
- a processor can also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
- a software module can reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, a hard disk, a removable disk, a CD-ROM, or any other form of computer-readable storage medium known in the art.
- An exemplary storage medium is coupled to a processor such that the processor can read information from, and write information to, the storage medium.
- the storage medium can be integral to the processor.
- the processor and the storage medium can reside in an ASIC.
- the ASIC can reside in a user terminal.
- the processor and the storage medium can reside as discrete components in a user terminal.
- the memory system of certain embodiments may include various data slice sizes (e.g., two, four, eight, or 16 bit data slices) and corresponding memories (e.g., memories having two, four, eight, or 16 bit data widths).
- various data slice sizes e.g., two, four, eight, or 16 bit data slices
- corresponding memories e.g., memories having two, four, eight, or 16 bit data widths.
Abstract
Description
Claims (20)
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US10474595B2 (en) | 2019-11-12 |
US8489837B1 (en) | 2013-07-16 |
US20220382693A1 (en) | 2022-12-01 |
US9311116B1 (en) | 2016-04-12 |
US20200151123A1 (en) | 2020-05-14 |
US9858218B1 (en) | 2018-01-02 |
US11386024B2 (en) | 2022-07-12 |
US20180293193A1 (en) | 2018-10-11 |
US9535623B1 (en) | 2017-01-03 |
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