US11363680B2 - Plasma reactor and heating apparatus therefor - Google Patents
Plasma reactor and heating apparatus therefor Download PDFInfo
- Publication number
- US11363680B2 US11363680B2 US16/725,912 US201916725912A US11363680B2 US 11363680 B2 US11363680 B2 US 11363680B2 US 201916725912 A US201916725912 A US 201916725912A US 11363680 B2 US11363680 B2 US 11363680B2
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- heating
- heater
- power supply
- current
- heating apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
-
- H10P72/0432—
-
- H10P72/0602—
Definitions
- the present disclosure relates to semiconductor process equipment, and more particularly relates to a plasma reactor and a heating apparatus therefor.
- a semiconductor chip is the main component for an electronic device to implement various functions.
- a considerable amount of micro-processing is involved in fabrication of the semiconductor chip.
- various kinds of through holes or trenches of micro or even nanometer level may be formed on a wafer; in further combination with other processes such as CVD (Chemical Vapor Deposition), various kinds of semiconductor chip products are finally fabricated.
- CVD Chemical Vapor Deposition
- the control precision requirements on wafer or substrate temperature during a plasma treatment process also become higher and higher. Therefore, conventional plasma reactors generally adopt a heating apparatus having a multi-zone temperature control function.
- the heating apparatus is configured such that an electronic switch is provided for each heater unit to thereby achieve a zoned temperature control function, resulting in a complex circuit structure.
- a technical solution of the present disclosure provides a plasma reactor and a heating apparatus therefor, which can implement a zoned temperature control function utilizing a programmable power supply and a bandpass filter, resulting in a simple circuit structure, eliminating the need of switch elements, and offering a simple control manner.
- a heating apparatus comprises:
- a programmable power supply configured for supplying alternating-current AC heating powers
- a heater assembly including a plurality of heater units, the heater assembly being connected to the programmable power supply via a bandpass filter assembly, the bandpass filter assembly including a plurality of bandpass filters;
- the programmable power supply inputs, based on match relationships between outputted AC heating powers and conduction frequencies of the bandpass filters, an AC heating power to a matched heater unit to perform heating.
- an output end of the programmable power supply is connected to a current supply line, and a return end of the programmable power supply is connected to a current return line;
- the current return line is connected to an electrode port of a heater unit via a bandpass filter, and the current supply line is connected to the other electrode end of the heater unit.
- all current supply lines are connected to the output end of the programmable power supply via the 1 st radio frequency filter, and all current return lines are connected to the return end of the programmable power supplies.
- the heater assembly has M rows ⁇ N columns of heater units;
- heater units in the same row are connected to a same current return line via the same bandpass filter; heater units in different rows are connected to different current return lines via different bandpass filters.
- the programmable power supply includes N output ends, wherein heater units in a same column are connected to a same output end via a same current supply line, and heater units in different columns are connected to different output ends via different current supply lines.
- the heater assembly has M rows ⁇ N columns of heater units;
- each heater unit is connected to one current return line via one bandpass filter, respectively; different heater units are connected to different bandpass filters; heater units in a same row are connected to a same current return line.
- heater units in a same column are connected to a same current supply line, and all current supply lines are connected to a same output end of the programmable power supply.
- all current return lines are connected to a same return end of the programmable power supply.
- the programmable power supply can output a plurality of AC heating powers having different central frequencies, wherein bandwidths of all AC heating powers are identical;
- the present disclosure further provides a plasma reactor, comprising: the heating apparatus mentioned above.
- the heater assembly is configured for connecting with the programmable power supply via the bandpass filter assembly, the bandpass filter assembly including a plurality of bandpass filters, the programmable power supply may input, based on match relationships between outputted AC heating powers and conduction frequencies of the bandpass filters BPF, an AC heating power to a matched heater unit to perform heating, thereby achieving zoned temperature control, resulting in a simple circuit structure, eliminating the need of switch elements, and offering a simple control manner.
- FIG. 1 is a structural schematic diagram of a heater apparatus according to an embodiment of the present disclosure
- FIG. 2 is a structural schematic diagram of a heater apparatus switch according to another embodiment of the present disclosure.
- FIG. 3 is a structural schematic diagram of a plasma according to an embodiment of the present disclosure.
- FIG. 1 shows a structural schematic diagram of a heating apparatus according to an embodiment of the present disclosure, wherein the heating apparatus may be applied to a plasma reactor or other equipment which needs to be heated.
- the heating apparatus comprises: a programmable power supply 11 configured for supplying alternating-current AC heating powers; and a heater assembly 12 including a plurality of heater units 121 , the heater assembly 12 being connected to the programmable power supply 11 via a bandpass filter assembly 13 , the bandpass filter assembly 13 including a plurality of bandpass filters BPF.
- the programmable power supply 11 inputs, based on match relationships between outputted AC heating powers and conduction frequencies of the bandpass filters BPF, an AC heating power to a matched heater unit to perform heating.
- An output end of the programmable power supply 11 is connected to a current supply line 21 , and a return end of the programmable power supply 11 is connected to a current return line 22 ; and the current return line 22 is connected to an electrode end of a heater unit 121 via a bandpass filter BPF, and the current supply line 21 is connected to another electrode end of the heater unit 121 .
- the programmable power supply 11 can output a plurality of AC heating powers having different central frequencies, wherein the bandwidths of all AC heating powers are identically B; the frequency ranges of any two AC heating powers do not overlap.
- the frequency of an AC heating power is [fa ⁇ B, fa+B]
- another AC heating power frequency is [fb ⁇ B, fb+B]
- fa and fb denote central frequencies of the two AC heating powers, respectively, fa ⁇ fb
- the difference between the two central frequencies has to be greater than 2B, causing their frequency ranges not to overlap.
- This may avoid frequency overlapping between AC heating powers having different central frequencies, facilitating power supply to a matched heater unit 121 via the corresponding bandpass filter BPF, so as to conduct one or more selected heater units 121 to perform heating, thereby achieving a zoned temperature control function.
- current supply lines 21 are all connected to an output end of the programmable power supply 11 via a 1 st radio frequency filter 31 ; current return lines 22 are all connected to a return end of the programmable power supply 11 via a 2 nd radio frequency filter 32 ; because the radio frequency signals in the circuit are blocked by the radio frequency filters, system security and reliability is guaranteed.
- the heater assembly 12 has M rows ⁇ N columns of heater units 121 , M and N being positive integers, at least one of M and N being greater than 1.
- the values of M and N may be selected based on heating size and heating zones of the heating apparatus, including, but not limited to, the embodiment shown in FIG. 1 .
- Heater units 121 in the same row are connected to a same current return line 22 via a same bandpass filter BPF; heater units 121 in different rows are connected to different current return lines 22 via different bandpass filters BPF.
- the heater units 121 in the 1 st row are all connected to one corresponding current return line 22 via a 1 st bandpass filter BPF 1
- the heater units 121 in the 2 nd row are all connected to one corresponding current return line 22 via a 2 nd bandpass filter BPF 2
- the heater units 121 in the 3 rd row are all connected to one corresponding current return line 22 via a 3 rd bandpass filter BPF 3 .
- the programmable power supply 11 has N input ends. Heater units 121 in the same column are connected to a same output end via a same current supply line 21 , and heater units 121 in different columns are connected to different output ends via different current supply lines 21 . As shown in FIG. 1 , the programmable power supply 11 has N input ends. Heater units 121 in the same column are connected to a same output end via a same current supply line 21 , and heater units 121 in different columns are connected to different output ends via different current supply lines 21 . As shown in FIG.
- the programmable power supply 11 has a 1 st output end 1 , a 2 nd output end 2 , and a 3 rd output end 3 , wherein the heater units 121 in the 1 st column are connected to the 1 st output end 1 via one corresponding current supply line 21 , the heater units 121 in the 2 nd column are connected to the 2 nd output end 2 via one corresponding current supply line 21 , and the heater units 121 in the 3 rd column are connected to the 3 rd output end 3 via one corresponding current supply line 21 .
- Each output end at least may output M number of AC heating powers having different central frequencies.
- the conduction frequency of each bandpass filter BPF is independently matched with one AC heating power with a certain central frequency. In this way, when supplying an AC heating power for the heater units 121 in one column via an output end, only the bandpass filter BPF to which one heater unit 121 in the column is correspondingly connected is conducted, thereby implementing the zoned temperature control function.
- each output end may output M number of AC heating powers having different central frequencies, sequentially the 1 st AC heating power F 1 till the M th AC heating power FM, wherein the central frequency of the i th AC heating power Fi is fi, i being a positive integer not more than M.
- the same output end only outputs one AC heating power at the same time.
- the frequency range of the i th AC heating power is [fi ⁇ B, fi+B], where B denotes the bandwidth, which for example may be 50 Hz.
- the bandpass filter assembly 13 has M number of bandpass filters BPF, sequentially the 1 st bandpass filter BPF 1 till the M th bandpass filter BPFM.
- the i th bandpass filter BPFi may be conducted.
- the central frequency of the 1 st AC heating power is 1000 Hz
- the central frequency of the 2 nd AC heating power is 1150 Hz
- the central frequency of the 3 rd AC heating power is 1350 Hz.
- the heater units 121 may be actuated one by one to perform heating. In this case, at one time there is only one output end outputting an AC heating power; this may control conduction of the bandpass filter BPF to which one heater unit 121 is correspondingly connected, such that only that heater unit 121 performs heating.
- the heater units 121 may be sequentially conducted to perform heating based on a set time sequence of AC heating powers, wherein only one heater unit 121 is in the conducted-to-heat state at one time; namely, at that time, there is only one output end outputting the i th AC heating power, so as to conduct the heater unit 121 in the i th row connected to the output end to perform heating.
- the heater unit 1 - 1 in the 1 st row and the 1 st column needs to be conducted, it is needed to output the 1 st AC heating power F 1 via the 1 st output end 1 , such that only the 1 st bandpass filter BPF 1 is conducted to perform heating; in this way, heating may be performed by conducting the heater unit 1 - 1 in the 1 st row and the 1 st column.
- the heater unit 2 - 2 in the 2 nd row and the 2 nd column needs to be conducted, it is needed to output the 2 nd AC heating power F 2 via the 2 nd output end 2 , such that only the 2 nd bandpass filter BPF 2 is conducted to perform heating.
- the heater units 121 are actuated row by row to perform heating.
- all output ends output a same AC heating power at the same time; in this way, conduction of one bandpass filter BPF may cause all heater units 121 in the same row connected to the bandpass filter BPF to perform heating.
- the heater units 121 in respective rows may be sequentially conducted to perform heating. Only one row of heater units 121 are in the conducted-to-heat state at the same time.
- the heater units 121 in the 3 rd row need to be conducted, it is required that all output ends output the 3 rd AC heating power F 3 , such that only the 3 rd bandpass filter BPF 3 is conducted, causing all heater units 121 in the 3 rd row to obtain the 3 rd AC heating power F 3 via the correspondingly connected output ends, so as to perform heating via all heater units 121 in the 3 rd row.
- the heating apparatus further comprises a controller 14 .
- the controller 14 which is connected to the programmable power supply 11 , is further configured for controlling an output end of the programmable power supply 11 to output a corresponding AC heating power.
- the controller 14 With the controller 14 , the programmable power supply 11 may be controlled to output AC heating powers in a set time sequence, thereby implementing an automatic zoned heating function.
- FIG. 2 shows a structural schematic diagram of a heating apparatus according to another embodiment of the present disclosure.
- the heating apparatus likewise comprises a programmable power supply 11 , a heater assembly 12 , and a bandpass filter assembly 13 .
- the heater assembly 12 has M rows ⁇ N columns of heater units 121 .
- any heater unit 121 may be represented as heater unit p-q in the p th row and the q th column.
- each heater unit 121 is connected to a current return line 22 via a bandpass filter BPF; while different heater units 121 are connected to different bandpass filters BPF, and the heater units 121 in a same row are connected to a same current return line 22 .
- M ⁇ N number of bandpass filters BPF are needed; the bandpass filters BPF being in one-to-one correspondence with the heater units 121 .
- the heater unit p-q in the p th row and the CO column is connected to bandpass filter BPF p-q in the p th row and the q th column.
- the heater units 121 in the same column are connected to a same current supply line 21 , and all current supply lines 21 are connected to a same output end of the programmable power supply 11 .
- the programmable power supply 11 may be provided only with one output end. In other embodiments, a plurality of output ends may be provided, each output end being correspondingly connected to a heater assembly 12 .
- all current return lines 22 are connected to a same return end of the programmable power supply 11 .
- the programmable power supply 11 may alternatively be provided with only one return end.
- a plurality of return ends may be provided, each return end being correspondingly connected to one heater assembly 12 .
- the output end of the programmable power supply 11 may at least output M ⁇ N AC heating powers with central frequencies.
- the conduction frequency of each bandpass filter BPF is independently matched with an AC heating power of one central frequency. In this way, when supplying an AC heating power to heater units 121 in one column via one output end, the bandpass filter BPF connected to each heater unit 121 is conducted under the control of the AC heating power matching its conduction frequency, causing the correspondingly connected heater unit 121 to be conducted to perform heating, thereby implementing a zoned temperature control function.
- M ⁇ N AC heating powers having different central frequencies are outputted, which are sequentially the 1 st AC heating power F 1 till the M ⁇ N th AC heating power, wherein the central frequency of the j th AC heating power is fj, j being a positive integer not greater than M ⁇ N.
- the heater units 121 may be actuated one by one to perform heating.
- an output end only outputs one AC heating power at the same time, which can only conduct one corresponding bandpass filter BPF, causing conduction of the heater unit 121 correspondingly connected to the bandpass filter BPF to perform heating.
- respective heater units 121 may be sequentially conducted to perform heating, and at the same time, there is only one heater unit 121 being in a conducted-to-heat state.
- the heater unit 121 may be conducted one by one to perform heating.
- a plurality of heater units 121 may be simultaneously actuated to perform heating.
- the output ends output a mixing signal at the same time, wherein the mixing signal includes a plurality of AC heating powers having different central frequencies.
- the plurality of AC heating powers may control conduction of respective matched bandpass filters BPF, causing a plurality of corresponding heater units 121 to be conducted to perform heating.
- the heating power of a heater unit 121 may be controlled by controlling the amplitude of the AC heating power, and by controlling the frequency range of the AC heating power, conduction of a matched heater unit 121 is chosen to implement a zoned temperature control.
- Respective heater units 121 may be subjected to fine temperature control to the zones corresponding to respective heater units 121 via the programmable power supply 11 and the bandpass filter BPF, without involvement of any switch device, offering a simple circuit structure and a simple control manner.
- FIG. 3 shows a structural schematic diagram of a plasma reactor according to an embodiment of the present disclosure, the plasma reactor comprising the heating apparatus according to the embodiments above.
- the plasma reactor comprises: a reaction chamber 41 , support means 46 disposed in the reaction chamber 41 , an electrically conductive base plate 47 fixed on the top of the supporting means 46 , and an electrostatic chuck 44 disposed on the electrically conductive base plate 47 , wherein a to-be-processed substrate 45 , e.g., a wafer, is fixedly disposed on the electrostatic chuck 44 .
- a to-be-processed substrate 45 e.g., a wafer
- the electrostatic chuck 44 includes a heater assembly for the heating apparatus.
- a 1 st filter assembly 42 and a 2 nd filter assembly 43 are provided at the bottom of the reaction chamber 41 .
- the 1 st filter assembly 42 includes the radio frequency filters mentioned above.
- the 2 nd filter assembly 43 includes the bandpass filter assemblies mentioned above.
- the programmable power supply 11 and the controller 14 are disposed outside the reaction chamber 41 .
- the plasma reactor according to an embodiment of the present disclosure further has the heating apparatus disclosed above, wherein by controlling the amplitude of an AC heating power, a heating power of a heater unit is controlled; and by controlling the frequency range of the AC heating power, a matched heater unit is conducted, thereby realizing zoned temperature control. Fine temperature control of the zone corresponding to each heater unit may be implemented utilizing the programmable power supply and the bandpass filter, without involving any switch device, thereby offering a simple circuit structure and a simple control manner.
- relational terms such as 1 st and 2 nd are only used for distinguishing one entity or operation from another entity or operation, not compulsorily requiring or implying existence of any such practical relationship or sequences between these entities or operations.
- the terms “include,” “comprise” or any other variables intend for a non-exclusive inclusion, such that a product or an apparatus including a series of elements not only includes those elements, but also includes other elements that are not explicitly specified, or further includes the elements inherent in the product or apparatus. Without more restrictions, an element limited by the phase “including one . . . ” does not exclude a presence of further equivalent elements in the product or apparatus including such an element.
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- Electromagnetism (AREA)
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- Chemical Vapour Deposition (AREA)
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Abstract
Description
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811607800.4 | 2018-12-27 | ||
| CN201811607800.4A CN111385915B (en) | 2018-12-27 | 2018-12-27 | Plasma reactor and heating device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20200214087A1 US20200214087A1 (en) | 2020-07-02 |
| US11363680B2 true US11363680B2 (en) | 2022-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/725,912 Active 2040-06-16 US11363680B2 (en) | 2018-12-27 | 2019-12-23 | Plasma reactor and heating apparatus therefor |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11363680B2 (en) |
| KR (1) | KR102286863B1 (en) |
| CN (1) | CN111385915B (en) |
| TW (1) | TWI780386B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114496692B (en) * | 2020-11-11 | 2024-03-12 | 中微半导体设备(上海)股份有限公司 | Heating component, substrate carrying component and plasma processing device thereof |
| KR20230030684A (en) * | 2021-08-25 | 2023-03-07 | 세메스 주식회사 | Supporting unit and apparatus for treating substreate |
| KR20230031569A (en) * | 2021-08-27 | 2023-03-07 | 세메스 주식회사 | Supporting unit and apparatus for treating substreate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6850728B2 (en) * | 2002-04-17 | 2005-02-01 | Harison Toshiba Lighting Corp. | Induction heating roller apparatus, fixing apparatus and image formation apparatus |
| US20060140691A1 (en) * | 2004-12-28 | 2006-06-29 | Jin-Ha Kim | Image printer with common filter to filter common operating frequency band of fixing module and switch mode power supply module |
| US20150228513A1 (en) * | 2014-02-07 | 2015-08-13 | Applied Materials, Inc. | Pixilated temperature controlled substrate support assembly |
| US20200027706A1 (en) * | 2018-07-20 | 2020-01-23 | Lam Research Corporation | Real-time control of temperature in a plasma chamber |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7777152B2 (en) * | 2006-06-13 | 2010-08-17 | Applied Materials, Inc. | High AC current high RF power AC-RF decoupling filter for plasma reactor heated electrostatic chuck |
| US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
| CN103187943B (en) * | 2011-12-28 | 2017-02-08 | 中微半导体设备(上海)有限公司 | Radio-frequency filter for electrostatic chuck |
| JP2014204030A (en) * | 2013-04-08 | 2014-10-27 | 株式会社日立国際電気 | Substrate processing apparatus and method of manufacturing semiconductor device and program to be executed by computer |
| JP6100672B2 (en) * | 2013-10-25 | 2017-03-22 | 東京エレクトロン株式会社 | Temperature control mechanism, temperature control method, and substrate processing apparatus |
| US10879041B2 (en) * | 2015-09-04 | 2020-12-29 | Applied Materials, Inc. | Method and apparatus of achieving high input impedance without using ferrite materials for RF filter applications in plasma chambers |
| KR20170123830A (en) * | 2016-04-29 | 2017-11-09 | 세메스 주식회사 | Apparatus for controlling temperature of substrate, apparatus for treating substrate comprising the same, and method of controlling the same |
| CN108270412A (en) * | 2016-12-30 | 2018-07-10 | 中微半导体设备(上海)有限公司 | A kind of plasma processing apparatus and its radio frequency filter circuit |
-
2018
- 2018-12-27 CN CN201811607800.4A patent/CN111385915B/en active Active
-
2019
- 2019-12-17 TW TW108146206A patent/TWI780386B/en active
- 2019-12-23 US US16/725,912 patent/US11363680B2/en active Active
- 2019-12-27 KR KR1020190176501A patent/KR102286863B1/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6850728B2 (en) * | 2002-04-17 | 2005-02-01 | Harison Toshiba Lighting Corp. | Induction heating roller apparatus, fixing apparatus and image formation apparatus |
| US20060140691A1 (en) * | 2004-12-28 | 2006-06-29 | Jin-Ha Kim | Image printer with common filter to filter common operating frequency band of fixing module and switch mode power supply module |
| US20150228513A1 (en) * | 2014-02-07 | 2015-08-13 | Applied Materials, Inc. | Pixilated temperature controlled substrate support assembly |
| US20200027706A1 (en) * | 2018-07-20 | 2020-01-23 | Lam Research Corporation | Real-time control of temperature in a plasma chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| US20200214087A1 (en) | 2020-07-02 |
| CN111385915A (en) | 2020-07-07 |
| TWI780386B (en) | 2022-10-11 |
| KR20200083328A (en) | 2020-07-08 |
| CN111385915B (en) | 2022-04-26 |
| TW202042589A (en) | 2020-11-16 |
| KR102286863B1 (en) | 2021-08-10 |
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