US11056672B2 - Display panel and display device - Google Patents

Display panel and display device Download PDF

Info

Publication number
US11056672B2
US11056672B2 US16/098,246 US201816098246A US11056672B2 US 11056672 B2 US11056672 B2 US 11056672B2 US 201816098246 A US201816098246 A US 201816098246A US 11056672 B2 US11056672 B2 US 11056672B2
Authority
US
United States
Prior art keywords
display panel
transparent region
base substrate
transparent
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US16/098,246
Other versions
US20200328373A1 (en
Inventor
Weiyun HUANG
Wen Tan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Assigned to BOE TECHNOLOGY GROUP CO., LTD., CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. reassignment BOE TECHNOLOGY GROUP CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAN, WEN
Assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD. reassignment CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, WEIYUN
Publication of US20200328373A1 publication Critical patent/US20200328373A1/en
Application granted granted Critical
Publication of US11056672B2 publication Critical patent/US11056672B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H01L51/5253—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H01L27/323—
    • H01L27/3234—
    • H01L27/326—
    • H01L51/529—
    • H01L51/5293—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8793—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling

Definitions

  • Embodiments of the present disclosure relate to a display panel and a display device.
  • Embodiments of the present disclosure provide a display panel, comprising: a base substrate, a plurality of pixels located on the base substrate, and an encapsulation layer located on the plurality of pixels, the display panel comprising at least one transparent region and a display region outside the at least one transparent region, the plurality of pixels being located in the display region, and the transparent region of the display panel being configured to allow non-polarized radiation passing therethrough without substantially polarized, wherein, in a direction parallel with the base substrate, a width of the transparent region is substantially larger than a distance between adjacent two of the pixels on a same side of the transparent region; wherein, in a plan view, the transparent region is located in at least one of the base substrate and the encapsulation layer.
  • the base substrate is a transparent substrate.
  • the display region surrounds the at least one transparent region.
  • a material of the transparent substrate comprises one or a combination of the following: glass, polyimide, and plastic.
  • the encapsulation layer comprises a first inorganic layer, a second inorganic layer, and an organic layer between the first inorganic layer and the second inorganic layer.
  • the display panel further comprises a touch screen panel, a polarizer, and a transparent cover which are located on a side of the encapsulation layer opposite to the base substrate.
  • the polarizer comprises an opening in the transparent region.
  • the touch screen panel comprises a touch electrode made of one or a combination of the following: indium tin oxide, and graphene.
  • the display panel further comprises an optical adhesive filled in the opening of the polarizer.
  • the at least one transparent region comprises a plurality of transparent regions of different shapes.
  • the display panel further comprises a heat dissipation film disposed on a side of the base substrate opposite to the plurality of pixels, wherein the heat dissipation film has an opening region corresponding to the transparent region in shape.
  • the width of the transparent region is at least 10 times larger than the distance between the adjacent two of the pixels on the same side of the transparent region.
  • Embodiments of the present disclosure provide a display device, comprising any of the display panel described above, and at least one of a photographing device and a distance sensing device on a side of the display panel, an orthographic projection of the at least one transparent region on a plane completely covers an orthographic projection of the at least one of the photographing device and the distance sensing device on the plane.
  • the distance sensing device comprises an infrared sensor.
  • the photographing device comprises a camera.
  • a portion of at least one selected from the group consisting of the transparent substrate, the encapsulation layer and the touch screen panel is located in the transparent region, and the camera has a color temperature parameter matched with that of a material of at least one selected from the group consisting of the transparent substrate, the encapsulation layer, and the touch screen panel.
  • FIG. 1 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure
  • FIG. 3 is a schematic plan view illustrating a structure of a display panel according to an embodiment of the present disclosure
  • FIG. 4 is a schematic cross-sectional view illustrating a structure of an encapsulation layer in a display panel according to an embodiment of the present disclosure
  • FIG. 5 is a schematic cross-sectional view of edge encapsulation of a display panel according to an embodiment of the present disclosure
  • FIG. 6 is a schematic cross-sectional view illustrating a structure of a display panel in which a reserved region is formed by laser hole-drilling;
  • FIG. 7 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure
  • FIG. 9 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic plan view illustrating a structure of a display panel according to an embodiment of the present disclosure.
  • FIG. 12 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure.
  • FIG. 13 is a schematic cross-sectional view illustrating a structure of a display device according to an embodiment of the present disclosure.
  • Embodiments of the present disclosure provide a display panel and a display device, in order to reduce process difficulty on thin film encapsulation of the display panel and improve reliability of the thin film encapsulation.
  • the display panel 8 includes: an array substrate 1 and a film layer structure 2 on the array substrate 1 .
  • the array substrate 1 and the film layer structure 2 cach have a transparent region 3 , and an orthographic projection of the transparent region of the array substrate is overlapped with an orthographic projection of the transparent region of the film layer structure in a direction perpendicular to the display panel.
  • the display panel includes at least one transparent region T and a display region 9 outside the at least one transparent region T.
  • the plurality of pixels 6 are located in the display region D.
  • a non-polarized radiation passes through the transparent region T of the display panel 8 without substantially polarized.
  • the transparent regions 3 of the array substrate 1 and the film layer structure 2 are both located in the transparent region T of the display panel 8 .
  • the array substrate 1 includes a pixel structural layer 4 and an encapsulation layer 5 located on the pixel structural layer.
  • the pixels 6 in the pixel structural layer are located outside the transparent region.
  • An orthographic projection of the transparent region T on a plane P falls into an orthographic projection of the encapsulation layer on the plane P.
  • the transparent region T has a width at least 10 times larger than a distance between adjacent two pixels on the same side of the transparent region T in a direction parallel with the base substrate.
  • the distance between two adjacent pixels can refer to a distance between their respective center positions.
  • the array substrate and the film layer structure each have a transparent region, and an orthographic projection of the transparent region of the array substrate is overlapped with an orthographic projection of the transparent region of the film layer structure in a direction perpendicular to the display panel. That is the display panel provided by the embodiment of the present disclosure has a transparent region, and the pixels in the pixel structural layer are disposed outside the transparent region.
  • opaque material in the pixel circuit of the pixel structural layer is disposed outside the transparent region, so that the encapsulation layer can completely cover the transparent region; therefore, when a display device includes the display panel provided by the embodiment of the present disclosure, the camera and the infrared sensor can be disposed in a region corresponding to the transparent region if they are needed to be placed under the display panel.
  • Laser hole-drill to the display panel is not needed, thus reducing the difficulty on thin film encapsulation during the preparation of the array substrate, improving the reliability of the thin film encapsulation, and avoiding processing damage such as edge cracks, thermal burns and the like caused by laser hole-drilling on the display panel.
  • the array substrate 1 further includes a transparent substrate 7 , and the pixel structural layer 4 is located on the transparent substrate 7 .
  • the array substrate and the film layer structure further have a display region, and the display region surrounds the transparent region. That is, as illustrated in FIG. 3 , the display panel 8 provided by the embodiment of the present disclosure also has a transparent region T and a display region 9 .
  • FIGS. 1 and 2 can be a cross-sectional view taken along line A-A′ in FIG. 3 .
  • the display panel provided by the embodiment of the present disclosure can be, for example, an OLED display panel.
  • any non-transparent material should avoid presenting in the transparent region, and light-emitting material to be subsequently evaporated is should also avoid presenting in the transparent region, so that the OLED pixels are outside the transparent region and the transparent region is not provided with any non-transparent material.
  • a material of the transparent substrate includes at least one or a combination of the following: glass, polyimide (PI), and plastic.
  • the transparent substrate can also be selected from other transparent materials, and can also be a flexible material or a non-flexible material.
  • the encapsulation layer includes a first inorganic layer 10 , an organic layer 11 located on the first inorganic layer 10 , and a second inorganic layer 12 located on the organic layer 11 .
  • the OLED can be encapsulated by a TFE technology to form an encapsulation layer.
  • the material of the first inorganic layer and the second inorganic layer include at least one or a combination of the following: silicon oxide, and silicon nitride; and the material of the organic layer includes polyacrylate.
  • the TFE technology is formed by alternatively stacking inorganic layers and organic layers, thereby effectively blocking moisture and oxygen from entering the OLED device, and avoiding corrosion of the OLED device by moisture and oxygen.
  • a corresponds to a width of an edge of the organic layer
  • b corresponds to a width of an edge of the inorganic layer
  • c corresponds to a width of an edge of the transparent substrate.
  • the TFE process should ensure that a, b, and c in FIG. 5 have relatively large values.
  • a case that a sum of a, b, and c are in a range from 0.7 mm to 1 mm is satisfied, which allows the encapsulation layer to effectively protect the OLED device, that is, to ensure the reliability of the encapsulation layer.
  • a size of a reserved region 14 for laser-drilling is smaller than that of the transparent region 3 of the display panel provided by the embodiment of the present disclosure (as illustrated in FIG. 2 ).
  • the reserved region 14 for laser-drilling is the same size as the transparent region 3 as illustrated in FIG. 2 , more pixels are needed to be sacrificed for laser hole-drilling. That is, a pixel region of the display panel provided by the embodiment of the present disclosure is larger than a pixel region of the display panel provided by laser-drilling, thereby increasing the pixel density of the display panel.
  • the film layer structure includes a touch screen panel (TSP), a polarizer (POL), and a transparent cover.
  • TSP touch screen panel
  • POL polarizer
  • the film layer structure 2 includes a touch screen panel (TSP) 15 located on the array substrate 1 , a polarizer (POL) 16 located on the TSP 15 , and a transparent cover 17 located on the POL 16 .
  • a display panel provided by an embodiment of the present disclosure includes a POL 16 located on the array substrate 1 , a TSP 15 located on the POL 16 , and a transparent cover 17 located on the TSP 15 .
  • the TSP 15 may also be disposed on the transparent cover 17 .
  • a display panel structure is, for example, as illustrated in FIG. 9 .
  • the film layer structure 2 includes a POL 16 located on the array substrate 1 , a transparent cover 17 located on the POL 16 , and a TSP 15 located on the transparent cover 17 .
  • the polarizer 16 in FIGS. 7 and 8 has an opening 18 , an orthographic projection of the opening 18 is overlapped with an orthographic projection of the transparent region 3 of the film layer structure, in the direction perpendicular to the display panel.
  • a material of the transparent cover plate can be, for example, glass or other transparent materials.
  • the TSP includes a touch electrode, and a material of the touch electrode can be a transparent material or a non-transparent material.
  • the material of the touch electrode is a non-transparent material, it is required to drill a hole in the step of fabricating the TSP, a hole-drilling region corresponds to the transparent region of the display region.
  • the touch screen panel includes a touch electrode, and a material of the touch electrode includes one or a combination of the following materials: indium tin oxide, and graphene.
  • the touch screen panel is a transparent touch screen panel, hole drilling in the touch screen panel is not needed, and avoid presence of circuit in particular region is also not needed, which further simplifies the process of fabricating the display panel.
  • the materials of the touch electrodes are all transparent materials.
  • the film layer structure as illustrated in FIG. 10 further includes an optical adhesive 19 .
  • the optical adhesive 19 is in the same layer as the polarizer and fills in the opening of the polarizer.
  • the optical adhesive can be, for example, optically clear adhesive (OCA), optically clear resin (OCR), or the like.
  • air can be filled in the opening of the POL 16 , or an optical adhesive can be provided in the opening of the POL 16 .
  • the opening of the polarizer 16 filled with the optical adhesive makes transition in refractive index of different media in the light transmitting region more uniform, so that in the case that the camera is disposed under the transparent region of the display panel, the shooting effect of the camera is better.
  • the array substrate and the film layer structure each include a plurality of transparent regions. That is, the display panel also has a plurality of transparent regions. Alternatively, different transparent regions have different shapes. As illustrated in FIG. 11 , the display panel 8 has a circular transparent region 20 and an elliptical transparent region 21 .
  • the circular transparent region 20 may have a diameter of 5 mm
  • the elliptical transparent region 21 may have a minor axis of 5 mm
  • the elliptical transparent region 21 may have a major axis of 7 to 8 mm.
  • the display panel provided by the embodiment of the present disclosure further includes: a heat dissipation film 22 disposed under the array substrate 1 .
  • the heat dissipation film 22 has an opening region corresponding to the transparent region in shape.
  • the heat dissipation film can be, for example, a copper film or a graphite film.
  • a display device includes the display panel provided by the embodiment of the present disclosure, and a photographing device and a distance sensing device which are located under the display panel.
  • An orthographic projection of the transparent region on a plane completely covers orthographic projections of the photographing device and the distance sensing device on the plane.
  • the photographing device includes a camera
  • the distance sensing device includes an infrared sensor
  • the display panel provided by the embodiment of the present disclosure includes a transparent region as illustrated in FIG. 11
  • an orthographic projection of the circular transparent region 20 on an upper surface of the device body 24 completely covers an orthographic projection of the camera on the device body 24 .
  • An orthographic projection of the elliptical transparent region 21 on the upper surface of the device body 24 completely covers an orthographic projection of the infrared sensor on the upper surface of the device body 24 .
  • the display device provided by the embodiment of the present disclosure includes the display panel as illustrated in FIG. 12
  • a structure of the display device is as illustrated in FIG. 13 (infrared sensor is not illustrated)
  • the camera 23 is disposed on the device body 24
  • the display panel is located on the camera 23 .
  • the camera has a color temperature parameter matched with a color temperature parameter of materials of the transparent substrate, the encapsulation layer and the touch screen panel.
  • the transparent region of the display panel is provided with a transparent substrate, an encapsulation layer, a TSP and other film layers, a material of the transparent substrate, the encapsulation layer the TSP and the like in the transparent region have an influence on the color temperature of the light passing through the transparent region; therefore, in order to ensure the photographing effect of the camera, the camera has a color temperature parameter matched with a color temperature parameter of the stacked film layer consisting of the transparent substrate, the encapsulation layer, the TSP and other materials.
  • the camera is needed to be adjusted to increase the color temperature of the camera, so that the camera can still meet the color temperature requirement of 7000K when the color temperature parameter of the stacked film layer is 6000K.
  • the display device provided by the embodiment of the present disclosure further includes an integrated circuit (IC) and a flexible printed circuit (FPC) which are connected to the display panel.
  • IC integrated circuit
  • FPC flexible printed circuit
  • the array substrate and the film layer structure each have a transparent region, and an orthographic projection of the transparent region of the array substrate is overlapped with an orthographic projection of the transparent region of the film layer structure in a direction perpendicular to the display panel.
  • the display panel provided by the embodiments of the present disclosure has a transparent region; because pixels in the pixel structural layer are disposed outside the transparent region, that is, opaque material in the pixel circuit of the pixel structural layer is not provided in the transparent region, so that the encapsulation layer can completely cover the transparent region; therefore, in the case that the display device includes the display panel provided by the embodiment of the present disclosure, the camera and the infrared sensor can be provided in a region corresponding to the transparent region if they are needed to be disposed under the display panel.
  • the touch screen panel is a transparent touch screen panel, and there is no need to drill a hole in the touch screen panel, so no circuit avoidance is needed, which further simplifies the process of manufacturing the display panel.
  • the optical adhesive is filled in the opening of the polarizer, so that the transition in refractive index of different media in the transparent region can be more uniform; therefore, in the case that the camera is disposed under the transparent region of the display panel, the camera has a better shooting effect.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Embodiments of the present disclosure disclose a display panel and a display device. The display panel includes: a base substrate and a plurality of pixels located on the base substrate, and an encapsulation layer located on the plurality of pixels. The display panel includes at least one transparent region and a display region outside the at least one transparent region. The plurality of pixels is located in the display region. The transparent region of the display panel is configured to allow non-polarized radiation passing therethrough without substantially polarized. In a direction parallel with the base substrate, a width of the transparent region is substantially greater than a distance between adjacent two of the pixels on the same side of the transparent region. In a plan view, the transparent region is completely located within at least one of the base substrate and the encapsulation layer.

Description

The present application claims priority to the Chinese patent application No. 201710625395.8, filed on Jul. 27, 2017, the entire disclosure of which is incorporated herein by reference as part of the present application.
TECHNICAL FIELD
Embodiments of the present disclosure relate to a display panel and a display device.
BACKGROUND
Currently, for full-screen frameless products, in order to reserve space for the camera and the infrared sensor, it is necessary to perform laser hole-drilling treatment on the organic light-emitting diode (OLED) display panel. The laser hole-drilling treatment is a complicated process, and is a process which would cause damage to a display substrate. Laser hole-drilling can cause undesirable effects such as edge cracks and thermal burns, resulting in reduced product reliability and reduced yield. Moreover, for the edge of the display panel hole-drilled with laser, design on thin film encapsulation is difficult and the encapsulation reliability is poor. Laser hole-drilling on panels with irregular shape has caused problems on OLED backplane circuit and thin film encapsulation (TFE). In summary, the laser hole-drilling in existing art to reserve space for the camera and the infrared sensor in the display product brought disadvantages such as great difficulty on thin film encapsulation, poor encapsulation reliability, and processing damage on the display panel.
SUMMARY
Embodiments of the present disclosure provide a display panel, comprising: a base substrate, a plurality of pixels located on the base substrate, and an encapsulation layer located on the plurality of pixels, the display panel comprising at least one transparent region and a display region outside the at least one transparent region, the plurality of pixels being located in the display region, and the transparent region of the display panel being configured to allow non-polarized radiation passing therethrough without substantially polarized, wherein, in a direction parallel with the base substrate, a width of the transparent region is substantially larger than a distance between adjacent two of the pixels on a same side of the transparent region; wherein, in a plan view, the transparent region is located in at least one of the base substrate and the encapsulation layer.
In an example, the base substrate is a transparent substrate.
In an example, the display region surrounds the at least one transparent region.
In an example, a material of the transparent substrate comprises one or a combination of the following: glass, polyimide, and plastic.
In an example, the encapsulation layer comprises a first inorganic layer, a second inorganic layer, and an organic layer between the first inorganic layer and the second inorganic layer.
In an example, the display panel further comprises a touch screen panel, a polarizer, and a transparent cover which are located on a side of the encapsulation layer opposite to the base substrate.
In an example, the polarizer comprises an opening in the transparent region.
In an example, the touch screen panel comprises a touch electrode made of one or a combination of the following: indium tin oxide, and graphene.
In an example, the display panel further comprises an optical adhesive filled in the opening of the polarizer.
In an example, the at least one transparent region comprises a plurality of transparent regions of different shapes.
In an example, the display panel further comprises a heat dissipation film disposed on a side of the base substrate opposite to the plurality of pixels, wherein the heat dissipation film has an opening region corresponding to the transparent region in shape.
In an example, in a direction parallel with the base substrate, the width of the transparent region is at least 10 times larger than the distance between the adjacent two of the pixels on the same side of the transparent region.
Embodiments of the present disclosure provide a display device, comprising any of the display panel described above, and at least one of a photographing device and a distance sensing device on a side of the display panel, an orthographic projection of the at least one transparent region on a plane completely covers an orthographic projection of the at least one of the photographing device and the distance sensing device on the plane.
In an example, the distance sensing device comprises an infrared sensor.
In an example, the photographing device comprises a camera.
In an example, a portion of at least one selected from the group consisting of the transparent substrate, the encapsulation layer and the touch screen panel is located in the transparent region, and the camera has a color temperature parameter matched with that of a material of at least one selected from the group consisting of the transparent substrate, the encapsulation layer, and the touch screen panel.
BRIEF DESCRIPTION OF THE DRAWINGS
In order to clearly illustrate the technical solution of the embodiments of the disclosure, the drawings of the embodiments will be briefly described in the following. It is obvious that the described drawings are only related to some embodiments of the disclosure. Based on the described embodiments herein, those skilled in the art can obtain other embodiment(s), without any inventive work.
FIG. 1 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 3 is a schematic plan view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view illustrating a structure of an encapsulation layer in a display panel according to an embodiment of the present disclosure;
FIG. 5 is a schematic cross-sectional view of edge encapsulation of a display panel according to an embodiment of the present disclosure;
FIG. 6 is a schematic cross-sectional view illustrating a structure of a display panel in which a reserved region is formed by laser hole-drilling;
FIG. 7 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 8 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 9 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 10 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 11 is a schematic plan view illustrating a structure of a display panel according to an embodiment of the present disclosure;
FIG. 12 is a schematic cross-sectional view illustrating a structure of a display panel according to an embodiment of the present disclosure; and
FIG. 13 is a schematic cross-sectional view illustrating a structure of a display device according to an embodiment of the present disclosure.
 DETAILED DESCRIPTION
In order to make objects, technical details and advantages of the embodiments of the disclosure apparent, the technical solutions of the embodiments will be described in a clearly and fully understandable way in connection with the drawings related to the embodiments of the disclosure. Apparently, the described embodiments are just a part but not all of the embodiments of the disclosure. Based on the described embodiments herein, those skilled in the art can obtain other embodiment(s), without any inventive work, which should be within the scope of the present disclosure.
Embodiments of the present disclosure provide a display panel and a display device, in order to reduce process difficulty on thin film encapsulation of the display panel and improve reliability of the thin film encapsulation.
As illustrated in FIGS. 1 and 2, a display panel is provided by an embodiment of the present disclosure. The display panel 8 includes: an array substrate 1 and a film layer structure 2 on the array substrate 1. The array substrate 1 and the film layer structure 2 cach have a transparent region 3, and an orthographic projection of the transparent region of the array substrate is overlapped with an orthographic projection of the transparent region of the film layer structure in a direction perpendicular to the display panel.
The display panel includes at least one transparent region T and a display region 9 outside the at least one transparent region T. The plurality of pixels 6 are located in the display region D. A non-polarized radiation passes through the transparent region T of the display panel 8 without substantially polarized. The transparent regions 3 of the array substrate 1 and the film layer structure 2 are both located in the transparent region T of the display panel 8.
The array substrate 1 includes a pixel structural layer 4 and an encapsulation layer 5 located on the pixel structural layer. The pixels 6 in the pixel structural layer are located outside the transparent region. An orthographic projection of the transparent region T on a plane P falls into an orthographic projection of the encapsulation layer on the plane P.
The transparent region T has a width at least 10 times larger than a distance between adjacent two pixels on the same side of the transparent region T in a direction parallel with the base substrate. Herein, the distance between two adjacent pixels can refer to a distance between their respective center positions.
In the display panel provided by the embodiment of the present disclosure, the array substrate and the film layer structure each have a transparent region, and an orthographic projection of the transparent region of the array substrate is overlapped with an orthographic projection of the transparent region of the film layer structure in a direction perpendicular to the display panel. That is the display panel provided by the embodiment of the present disclosure has a transparent region, and the pixels in the pixel structural layer are disposed outside the transparent region. That is, opaque material in the pixel circuit of the pixel structural layer is disposed outside the transparent region, so that the encapsulation layer can completely cover the transparent region; therefore, when a display device includes the display panel provided by the embodiment of the present disclosure, the camera and the infrared sensor can be disposed in a region corresponding to the transparent region if they are needed to be placed under the display panel. Laser hole-drill to the display panel is not needed, thus reducing the difficulty on thin film encapsulation during the preparation of the array substrate, improving the reliability of the thin film encapsulation, and avoiding processing damage such as edge cracks, thermal burns and the like caused by laser hole-drilling on the display panel.
Optionally, as illustrated in FIG. 2, in the display panel provided by the embodiment of the present disclosure, the array substrate 1 further includes a transparent substrate 7, and the pixel structural layer 4 is located on the transparent substrate 7.
Optionally, the array substrate and the film layer structure further have a display region, and the display region surrounds the transparent region. That is, as illustrated in FIG. 3, the display panel 8 provided by the embodiment of the present disclosure also has a transparent region T and a display region 9. FIGS. 1 and 2, for example, can be a cross-sectional view taken along line A-A′ in FIG. 3.
The display panel provided by the embodiment of the present disclosure can be, for example, an OLED display panel. When a pixel circuit in the pixel structural layer is fabricated onto the transparent substrate, any non-transparent material should avoid presenting in the transparent region, and light-emitting material to be subsequently evaporated is should also avoid presenting in the transparent region, so that the OLED pixels are outside the transparent region and the transparent region is not provided with any non-transparent material.
Optionally, a material of the transparent substrate includes at least one or a combination of the following: glass, polyimide (PI), and plastic. Of course, the transparent substrate can also be selected from other transparent materials, and can also be a flexible material or a non-flexible material.
Optionally, as illustrated in FIG. 4, in the display panel provided by the embodiment of the present disclosure, the encapsulation layer includes a first inorganic layer 10, an organic layer 11 located on the first inorganic layer 10, and a second inorganic layer 12 located on the organic layer 11. For example, the OLED can be encapsulated by a TFE technology to form an encapsulation layer. The material of the first inorganic layer and the second inorganic layer include at least one or a combination of the following: silicon oxide, and silicon nitride; and the material of the organic layer includes polyacrylate.
It should be understood that the TFE technology is formed by alternatively stacking inorganic layers and organic layers, thereby effectively blocking moisture and oxygen from entering the OLED device, and avoiding corrosion of the OLED device by moisture and oxygen. In the encapsulation process, as illustrated in FIG. 5, a corresponds to a width of an edge of the organic layer, b corresponds to a width of an edge of the inorganic layer, and c corresponds to a width of an edge of the transparent substrate. For the edge region of the display panel, the TFE process should ensure that a, b, and c in FIG. 5 have relatively large values. For example, a case that a sum of a, b, and c are in a range from 0.7 mm to 1 mm is satisfied, which allows the encapsulation layer to effectively protect the OLED device, that is, to ensure the reliability of the encapsulation layer.
If a laser-drilling process is performed on the display panel, as illustrated in FIG. 6, that is, in FIG. 6, an edge encapsulation condition needs to be satisfied in an edge region 13; therefore, in the case that the pixel density is the same, a size of a reserved region 14 for laser-drilling is smaller than that of the transparent region 3 of the display panel provided by the embodiment of the present disclosure (as illustrated in FIG. 2). In the case that the reserved region 14 for laser-drilling is the same size as the transparent region 3 as illustrated in FIG. 2, more pixels are needed to be sacrificed for laser hole-drilling. That is, a pixel region of the display panel provided by the embodiment of the present disclosure is larger than a pixel region of the display panel provided by laser-drilling, thereby increasing the pixel density of the display panel.
Optionally, in the display panel provided by the embodiment of the present disclosure, the film layer structure includes a touch screen panel (TSP), a polarizer (POL), and a transparent cover. As illustrated in FIG. 7, in the display panel provided by the embodiment of the present disclosure, the film layer structure 2 includes a touch screen panel (TSP) 15 located on the array substrate 1, a polarizer (POL) 16 located on the TSP 15, and a transparent cover 17 located on the POL 16.
Alternatively, the positions of the POL and TSP in FIG. 7 can be interchanged. As illustrated in FIG. 8, a display panel provided by an embodiment of the present disclosure includes a POL 16 located on the array substrate 1, a TSP 15 located on the POL 16, and a transparent cover 17 located on the TSP 15.
Alternatively, the TSP 15 may also be disposed on the transparent cover 17. A display panel structure is, for example, as illustrated in FIG. 9. The film layer structure 2 includes a POL 16 located on the array substrate 1, a transparent cover 17 located on the POL 16, and a TSP 15 located on the transparent cover 17.
The polarizer 16 in FIGS. 7 and 8 has an opening 18, an orthographic projection of the opening 18 is overlapped with an orthographic projection of the transparent region 3 of the film layer structure, in the direction perpendicular to the display panel.
In the display panel provided by the embodiment of the present disclosure, a material of the transparent cover plate can be, for example, glass or other transparent materials.
It should be understood that, in the display panel provided by the embodiment of the present disclosure, the TSP includes a touch electrode, and a material of the touch electrode can be a transparent material or a non-transparent material. In the case that the material of the touch electrode is a non-transparent material, it is required to drill a hole in the step of fabricating the TSP, a hole-drilling region corresponds to the transparent region of the display region. Preferably, in the display panel provided by the embodiment of the present disclosure, the touch screen panel includes a touch electrode, and a material of the touch electrode includes one or a combination of the following materials: indium tin oxide, and graphene. In this way, the touch screen panel is a transparent touch screen panel, hole drilling in the touch screen panel is not needed, and avoid presence of circuit in particular region is also not needed, which further simplifies the process of fabricating the display panel. In the TSPs in FIGS. 7 to 9 provided by the embodiments of the present disclosure, the materials of the touch electrodes are all transparent materials.
Optionally, the film layer structure as illustrated in FIG. 10 further includes an optical adhesive 19. The optical adhesive 19 is in the same layer as the polarizer and fills in the opening of the polarizer. The optical adhesive can be, for example, optically clear adhesive (OCA), optically clear resin (OCR), or the like.
It should be understood that air can be filled in the opening of the POL 16, or an optical adhesive can be provided in the opening of the POL 16. Compared with the opening region filled with air, the opening of the polarizer 16 filled with the optical adhesive makes transition in refractive index of different media in the light transmitting region more uniform, so that in the case that the camera is disposed under the transparent region of the display panel, the shooting effect of the camera is better.
Optionally, the array substrate and the film layer structure each include a plurality of transparent regions. That is, the display panel also has a plurality of transparent regions. Alternatively, different transparent regions have different shapes. As illustrated in FIG. 11, the display panel 8 has a circular transparent region 20 and an elliptical transparent region 21. The circular transparent region 20 may have a diameter of 5 mm, the elliptical transparent region 21 may have a minor axis of 5 mm, and the elliptical transparent region 21 may have a major axis of 7 to 8 mm.
Optionally, as illustrated in FIG. 12, the display panel provided by the embodiment of the present disclosure further includes: a heat dissipation film 22 disposed under the array substrate 1. The heat dissipation film 22 has an opening region corresponding to the transparent region in shape. The heat dissipation film can be, for example, a copper film or a graphite film.
A display device, according to an embodiment of the present disclosure, includes the display panel provided by the embodiment of the present disclosure, and a photographing device and a distance sensing device which are located under the display panel. An orthographic projection of the transparent region on a plane completely covers orthographic projections of the photographing device and the distance sensing device on the plane.
Optionally, the photographing device includes a camera, and the distance sensing device includes an infrared sensor.
For example, in the case that the display panel provided by the embodiment of the present disclosure includes a transparent region as illustrated in FIG. 11, an orthographic projection of the circular transparent region 20 on an upper surface of the device body 24 completely covers an orthographic projection of the camera on the device body 24. An orthographic projection of the elliptical transparent region 21 on the upper surface of the device body 24 completely covers an orthographic projection of the infrared sensor on the upper surface of the device body 24. In the case that the display device provided by the embodiment of the present disclosure includes the display panel as illustrated in FIG. 12, a structure of the display device is as illustrated in FIG. 13 (infrared sensor is not illustrated), the camera 23 is disposed on the device body 24, and the display panel is located on the camera 23.
Optionally, in the case that the transparent region is provided with a transparent substrate, an encapsulation layer and a touch screen panel, the camera has a color temperature parameter matched with a color temperature parameter of materials of the transparent substrate, the encapsulation layer and the touch screen panel. In the case that the transparent region of the display panel is provided with a transparent substrate, an encapsulation layer, a TSP and other film layers, a material of the transparent substrate, the encapsulation layer the TSP and the like in the transparent region have an influence on the color temperature of the light passing through the transparent region; therefore, in order to ensure the photographing effect of the camera, the camera has a color temperature parameter matched with a color temperature parameter of the stacked film layer consisting of the transparent substrate, the encapsulation layer, the TSP and other materials. For example, in the case that the camera has a color temperature parameter of 7000 Kelvin (K) and the stacked film layer has a color temperature parameter of 6000 K, the camera is needed to be adjusted to increase the color temperature of the camera, so that the camera can still meet the color temperature requirement of 7000K when the color temperature parameter of the stacked film layer is 6000K.
Optionally, the display device provided by the embodiment of the present disclosure further includes an integrated circuit (IC) and a flexible printed circuit (FPC) which are connected to the display panel.
In summary, in the display panel and the display device provided by the embodiments of the present disclosure, the array substrate and the film layer structure each have a transparent region, and an orthographic projection of the transparent region of the array substrate is overlapped with an orthographic projection of the transparent region of the film layer structure in a direction perpendicular to the display panel. That is, the display panel provided by the embodiments of the present disclosure has a transparent region; because pixels in the pixel structural layer are disposed outside the transparent region, that is, opaque material in the pixel circuit of the pixel structural layer is not provided in the transparent region, so that the encapsulation layer can completely cover the transparent region; therefore, in the case that the display device includes the display panel provided by the embodiment of the present disclosure, the camera and the infrared sensor can be provided in a region corresponding to the transparent region if they are needed to be disposed under the display panel. Laser hole-drilling to the display panel is not needed, thus reducing the difficulty of thin film encapsulation during the manufacturing of the array substrate, improving the reliability of the thin film encapsulation, and avoiding processing damage such as edge cracks and thermal burn-out caused by laser hole-drilling on the display panel. In the display panel provided by the embodiment of the present disclosure, the touch screen panel is a transparent touch screen panel, and there is no need to drill a hole in the touch screen panel, so no circuit avoidance is needed, which further simplifies the process of manufacturing the display panel. In the display panel provided by the embodiment of the present disclosure, the optical adhesive is filled in the opening of the polarizer, so that the transition in refractive index of different media in the transparent region can be more uniform; therefore, in the case that the camera is disposed under the transparent region of the display panel, the camera has a better shooting effect.
It is apparent that those skilled in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, the present disclosure is intended to cover such modifications and variations as the modifications and variations of the embodiments of the present disclosure are within the scope of the appended claims.

Claims (17)

What is claimed is:
1. A display panel, comprising: a base substrate, a plurality or pixels located on the base substrate, an encapsulation layer located on the plurality of pixels, a touch screen panel, a polarizer, and a transparent cover which are located on a side of the encapsulation layer opposite to the base substrate,
the display panel comprising at least one transparent region and a display region outside the at least one transparent region, the plurality of pixels being located in the display region,
wherein, in a direction parallel with the base substrate, a width of the transparent region is larger than a distance between adjacent two of the pixels on a same side of the transparent region;
wherein, in a plan view, the transparent region is located within at least one selected from the group consisting of the base substrate and the encapsulation layer.
2. The display panel according to claim 1, wherein the base substrate is a transparent substrate.
3. The display panel according to claim 1, wherein the display region surrounds the at least one transparent region.
4. The display panel according to claim 3, wherein a material of the transparent substrate comprises one or a combination of the following: glass, polyimide, and plastic.
5. The display panel according to claim 2, wherein the encapsulation layer comprises a first inorganic layer, a second inorganic layer, and an organic layer between the first inorganic layer and the second inorganic layer.
6. The display panel according to claim 1, wherein the polarizer defines an opening in the transparent region.
7. The display panel according to claim 1, wherein the touch screen panel comprises a touch electrode made of one or a combination of the following: indium tin oxide, and graphene.
8. The display panel according to claim 6, further comprising an optical adhesive filled in the opening of the polarizer.
9. The display panel according to claim 1, wherein the at least one transparent region comprises a plurality of transparent regions of different shapes.
10. The display panel according to claim 1, further comprising a heat dissipation film disposed on a side of the base substrate opposite to the plurality of pixels, wherein the heat dissipation film has an opening region corresponding to the transparent region in shape.
11. The display panel according to claim 1, wherein, in a direction parallel with the base substrate, the width of the transparent region is at least 10 times larger than the distance between the adjacent two of the pixels on the same side of the transparent region.
12. A display device, comprising the display panel according to claim 1, and at least one selected from the group consisting of a photographing device and a distance sensing device on a side of the display panel, an orthographic projection of the at least one transparent region on a plane completely covers an orthographic projection of the at least one elected from the group consisting of the photographing device and the distance sensing device on the plane.
13. A display device according to claim 12, wherein the distance sensing device comprises an infrared sensor.
14. A display device according to claim 12, wherein the photographing device comprises a camera.
15. The display device according to claim 14, wherein a portion of at least one selected from the group consisting of the transparent substrate, the encapsulation layer and the touch screen panel is located in the transparent region, and the camera has a color temperature parameter matched with that of a material of the at least one selected from the group consisting of the transparent substrate, the encapsulation layer, and the touch screen panel.
16. A display panel, comprising: a base substrate, a plurality of pixels located on the base substrate, an encapsulation layer located on the plurality of pixels, a touch screen panel, a polarizer, and a transparent cover which are located on a side of the encapsulation layer opposite to the base substrate,
the display panel comprising at least one transparent region and a display region outside the at least one transparent region, the plurality of pixels being located in the display region,
wherein, in a direction parallel with the base substrate, a width of the transparent region is larger than a distance between adjacent two of the pixels on a same side of the transparent region;
wherein, an orthographic projection of the transparent region on a plane in a direction perpendicular to the base substrate falls into an orthographic projection of the encapsulation layer on the plane in the direction perpendicular to the base substrate, the plane is paralleled with the base substrate.
17. A display panel, comprising: a base substrate, a plurality of pixels located on the base substrate, and an encapsulation layer located on the plurality of pixels,
the display panel comprising at least one transparent region and a display region outside the at least one transparent region, the plurality of pixels being located in the display region,
wherein, in a direction parallel with the base substrate, a width of the transparent region is at least 10 times larger than a distance between adjacent two of the pixels on a same side of the transparent region;
wherein, an orthographic projection of the transparent region on a plane in a direction perpendicular to the base substrate falls into an orthographic projection of the encapsulation layer on the plane in the direction perpendicular to the base substrate, the Dane is paralleled with the base substrate.
US16/098,246 2017-07-27 2018-03-12 Display panel and display device Active 2039-02-04 US11056672B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201710625395.8A CN107359185B (en) 2017-07-27 2017-07-27 A display panel and display device
CN201710625395.8 2017-07-27
PCT/CN2018/078732 WO2019019656A1 (en) 2017-07-27 2018-03-12 Display panel and display device

Publications (2)

Publication Number Publication Date
US20200328373A1 US20200328373A1 (en) 2020-10-15
US11056672B2 true US11056672B2 (en) 2021-07-06

Family

ID=60285790

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/098,246 Active 2039-02-04 US11056672B2 (en) 2017-07-27 2018-03-12 Display panel and display device

Country Status (4)

Country Link
US (1) US11056672B2 (en)
EP (3) EP4235282B1 (en)
CN (1) CN107359185B (en)
WO (1) WO2019019656A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11755139B2 (en) 2020-03-19 2023-09-12 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US11874987B2 (en) 2020-03-19 2024-01-16 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US11907467B2 (en) 2020-03-19 2024-02-20 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US11914827B2 (en) 2020-03-19 2024-02-27 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US12557471B2 (en) * 2021-11-11 2026-02-17 Samsung Display Co., Ltd. Display device including protective layer including portions respectively having different thicknesses and manufacturing method thereof

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107359185B (en) * 2017-07-27 2021-05-14 京东方科技集团股份有限公司 A display panel and display device
WO2019047126A1 (en) 2017-09-07 2019-03-14 华为技术有限公司 Organic light-emitting display (oled) screen and terminal
CN108008855B (en) * 2017-11-28 2020-12-04 武汉天马微电子有限公司 Display panel and display device
CN108417737A (en) * 2018-03-07 2018-08-17 京东方科技集团股份有限公司 Production method, display panel and the display device of display panel
US11289677B2 (en) 2018-04-25 2022-03-29 Yungu (Gu'an) Technology Co., Ltd. Display panel and display device having a protective pattern
CN110504126B (en) * 2018-05-16 2021-07-27 无锡小天鹅电器有限公司 Control panel, household appliance and control method of household appliance
CN110596928B (en) * 2018-06-13 2022-03-22 夏普株式会社 Display device
CN108932024A (en) * 2018-06-26 2018-12-04 维沃移动通信有限公司 A kind of mobile terminal
CN109001933A (en) * 2018-08-10 2018-12-14 厦门天马微电子有限公司 A kind of display panel, its production method and display device
CN109300948A (en) * 2018-09-28 2019-02-01 昆山国显光电有限公司 A display device and flexible OLED panel thereof
CN109494241B (en) * 2018-10-08 2020-11-24 武汉华星光电半导体显示技术有限公司 Flexible OLED display panel and preparation method thereof
CN109560114B (en) 2018-12-06 2021-01-26 京东方科技集团股份有限公司 Display panel manufacturing method, display panel and display device
KR102680693B1 (en) * 2018-12-18 2024-07-01 엘지디스플레이 주식회사 Display device
CN110782776B (en) * 2019-01-10 2022-02-18 云谷（固安）科技有限公司 Display panel, manufacturing method thereof and display device
CN209461464U (en) * 2019-01-28 2019-10-01 昆山国显光电有限公司 Display panel and display terminal
CN109817678A (en) * 2019-01-30 2019-05-28 武汉华星光电半导体显示技术有限公司 Display panel and display device
CN111508337A (en) * 2019-01-31 2020-08-07 北京小米移动软件有限公司 Display panel, method of making the same, and display device
CN111508349B (en) * 2019-01-31 2022-03-08 武汉华星光电半导体显示技术有限公司 Display panel, manufacturing method of display panel and electronic equipment
CN111509136B (en) 2019-01-31 2021-12-28 武汉华星光电半导体显示技术有限公司 OLED display panel
CN109920331B (en) * 2019-02-23 2020-05-05 昆山工研院新型平板显示技术中心有限公司 Display panel and display device
CN109887976B (en) * 2019-03-07 2021-08-27 合肥鑫晟光电科技有限公司 Array substrate, preparation method thereof, display panel and display device
WO2020185446A1 (en) * 2019-03-08 2020-09-17 Array Photonics, Inc. Electronic devices having displays with infrared components behind the displays
CN110021644B (en) * 2019-03-26 2020-12-08 武汉华星光电半导体显示技术有限公司 OLED display panels and electronic equipment
CN110010665A (en) * 2019-03-27 2019-07-12 武汉华星光电半导体显示技术有限公司 OLED display panel
CN110034128B (en) * 2019-03-27 2021-07-23 武汉华星光电半导体显示技术有限公司 Display device and driving method thereof
CN110783370B (en) 2019-03-29 2021-02-26 昆山国显光电有限公司 Display device and OLED display panel thereof
CN110034151A (en) * 2019-03-29 2019-07-19 武汉华星光电半导体显示技术有限公司 Display panel and display device
CN110767159A (en) * 2019-04-04 2020-02-07 昆山国显光电有限公司 Display panel driving method, device and display device
CN110212107A (en) * 2019-05-16 2019-09-06 武汉华星光电半导体显示技术有限公司 A kind of display screen and electronic device
CN110350001B (en) * 2019-06-20 2021-04-27 武汉华星光电半导体显示技术有限公司 Display panel and display device
CN110197846B (en) * 2019-06-27 2021-07-06 武汉华星光电半导体显示技术有限公司 Display panel and display device
CN110335890A (en) 2019-07-11 2019-10-15 京东方科技集团股份有限公司 A kind of display panel and preparation method thereof, display device
CN110391254A (en) * 2019-07-16 2019-10-29 武汉华星光电半导体显示技术有限公司 Display panel, manufacturing method thereof, and display device
CN210167360U (en) * 2019-07-24 2020-03-20 昆山国显光电有限公司 Array substrate, display panel and display device
CN110610965B (en) * 2019-08-23 2021-11-02 武汉华星光电半导体显示技术有限公司 display device
CN110649070A (en) * 2019-09-03 2020-01-03 武汉华星光电半导体显示技术有限公司 Flexible substrate, flexible display panel and manufacturing method of flexible substrate
KR20210060186A (en) * 2019-11-18 2021-05-26 삼성전자주식회사 Electronic device including camera device and display
CN111292616B (en) * 2020-02-17 2021-06-01 武汉华星光电半导体显示技术有限公司 Display device
CN113692566B (en) * 2020-03-19 2024-06-18 京东方科技集团股份有限公司 Touch sensor and display device
CN111370594B (en) 2020-03-19 2023-04-07 重庆京东方显示技术有限公司 Display panel and display device
CN111211156B (en) 2020-03-23 2022-08-05 武汉华星光电半导体显示技术有限公司 OLED display panel, preparation method thereof and OLED display device
CN211743161U (en) * 2020-04-24 2020-10-23 京东方科技集团股份有限公司 Display substrate and display device
CN113628550A (en) * 2020-05-07 2021-11-09 群创光电股份有限公司 Display device
CN111650768B (en) * 2020-06-09 2022-04-26 武汉华星光电半导体显示技术有限公司 Method for manufacturing display device
US11342542B2 (en) 2020-06-09 2022-05-24 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Manufacturing method of display device
KR20220001800A (en) * 2020-06-30 2022-01-06 엘지디스플레이 주식회사 Display device
CN111833752B (en) * 2020-08-04 2022-05-17 Oppo广东移动通信有限公司 Display panels and electronic equipment
CN111897159B (en) * 2020-08-11 2022-07-26 联想(北京)有限公司 Display device and display equipment
CN112490274B (en) * 2020-11-30 2022-08-09 武汉天马微电子有限公司 Display panel and display device
KR20220125898A (en) * 2021-03-05 2022-09-15 삼성디스플레이 주식회사 Display device and methood of manufacturing the same
CN114089557B (en) * 2021-11-29 2023-12-08 武汉华星光电技术有限公司 Display device
CN114400242B (en) * 2021-12-31 2025-09-05 湖北长江新型显示产业创新中心有限公司 Display panel and display device
WO2024000318A1 (en) * 2022-06-29 2024-01-04 京东方科技集团股份有限公司 Display module and terminal device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447766A1 (en) 2010-10-29 2012-05-02 Apple Inc. Displays with polarizer windows and opaque masking layers for electronic devices
US20140118826A1 (en) 2012-10-30 2014-05-01 Apple Inc. Displays With Polarizer Layers for Electronic Devices
CN104536179A (en) 2014-11-28 2015-04-22 深圳市华星光电技术有限公司 Flat panel display
CN104885140A (en) 2012-12-28 2015-09-02 乐金显示有限公司 Flexible display device and method of manufacturing the same
CN105334994A (en) 2014-08-06 2016-02-17 上海和辉光电有限公司 OLED touch display panel
CN106445261A (en) 2015-08-07 2017-02-22 群创光电股份有限公司 Touch display device
US20170070679A1 (en) 2015-09-04 2017-03-09 Samsung Display Co., Ltd. Display device
CN106654037A (en) 2017-02-27 2017-05-10 京东方科技集团股份有限公司 Display panel, electroluminescent device and preparation method thereof
US20170133444A1 (en) 2015-11-11 2017-05-11 Samsung Display Co., Ltd. Organic light emitting display device
CN107359185A (en) 2017-07-27 2017-11-17 京东方科技集团股份有限公司 A kind of display panel and display device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4240276B2 (en) * 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 Light emitting device
JP4207982B2 (en) * 2006-06-15 2009-01-14 エプソンイメージングデバイス株式会社 LCD panel
KR102010789B1 (en) * 2012-12-27 2019-10-21 엘지디스플레이 주식회사 Transparent organic light emitting display device and method for manufacturing the same
CN106816455A (en) * 2016-12-12 2017-06-09 上海天马微电子有限公司 Organic light-emitting diode display panel and display device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447766A1 (en) 2010-10-29 2012-05-02 Apple Inc. Displays with polarizer windows and opaque masking layers for electronic devices
US20140118826A1 (en) 2012-10-30 2014-05-01 Apple Inc. Displays With Polarizer Layers for Electronic Devices
CN104885140A (en) 2012-12-28 2015-09-02 乐金显示有限公司 Flexible display device and method of manufacturing the same
CN105334994A (en) 2014-08-06 2016-02-17 上海和辉光电有限公司 OLED touch display panel
CN104536179A (en) 2014-11-28 2015-04-22 深圳市华星光电技术有限公司 Flat panel display
CN106445261A (en) 2015-08-07 2017-02-22 群创光电股份有限公司 Touch display device
US20170070679A1 (en) 2015-09-04 2017-03-09 Samsung Display Co., Ltd. Display device
CN106505086A (en) 2015-09-04 2017-03-15 三星显示有限公司 display device
US20170133444A1 (en) 2015-11-11 2017-05-11 Samsung Display Co., Ltd. Organic light emitting display device
CN106654037A (en) 2017-02-27 2017-05-10 京东方科技集团股份有限公司 Display panel, electroluminescent device and preparation method thereof
CN107359185A (en) 2017-07-27 2017-11-17 京东方科技集团股份有限公司 A kind of display panel and display device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Extended European Search Report dated Mar. 12, 2021; Appln. No. 18788992.8.
International Search Report and Written Opinion dated Jun. 13, 2018; PCT/CN2018/078732.
The First Chinese Office Action dated Jun. 11, 2019; Appln. No. 201710625395.8.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11755139B2 (en) 2020-03-19 2023-09-12 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US11874987B2 (en) 2020-03-19 2024-01-16 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US11907467B2 (en) 2020-03-19 2024-02-20 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US11914827B2 (en) 2020-03-19 2024-02-27 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US12449930B2 (en) 2020-03-19 2025-10-21 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch sensor and display apparatus
US12557471B2 (en) * 2021-11-11 2026-02-17 Samsung Display Co., Ltd. Display device including protective layer including portions respectively having different thicknesses and manufacturing method thereof

Also Published As

Publication number Publication date
EP3660905A4 (en) 2021-04-14
US20200328373A1 (en) 2020-10-15
EP4235282A2 (en) 2023-08-30
WO2019019656A1 (en) 2019-01-31
EP3660905A1 (en) 2020-06-03
EP4036984A1 (en) 2022-08-03
CN107359185A (en) 2017-11-17
EP4235282B1 (en) 2024-11-20
EP3660905B1 (en) 2022-05-04
EP4235282A3 (en) 2023-11-08
EP4036984B1 (en) 2023-08-16
CN107359185B (en) 2021-05-14

Similar Documents

Publication Publication Date Title
US11056672B2 (en) Display panel and display device
US11469279B2 (en) Display device
KR102031648B1 (en) Organic light emitting display apparatus
KR20250031166A (en) Display device
KR102750040B1 (en) Organic light emitting display device and manufacturing method thereof
KR102623057B1 (en) Display panel and display device including thereof
KR102601723B1 (en) Polarizing layer, display device with the same, and fabricating method for the display device
KR102648626B1 (en) Display device comprisng bending sensor
KR102784245B1 (en) Display device
US20180074358A1 (en) Display device
KR102899873B1 (en) Display device, method for fabricating the device and laser processing apparatus for fabricating the device
TWI691110B (en) Flexible display panel
US20190121475A1 (en) Touch sensor integrated color filter and manufacturing method for the same
CN219146072U (en) display screen
WO2019200695A1 (en) Flexible panel, manufacturing method therefor, and display device
KR102814719B1 (en) Display device
CN115835691A (en) Substrate, display panel and display device comprising same
CN111403617A (en) Display panels and display devices
US12069894B2 (en) Display apparatus comprising irradiated regions and dams and method of manufacturing the same
CN111796704B (en) Electronic equipment
KR102674786B1 (en) Multi screen display apparatus and method of manufacturing the same
CN111386614A (en) Light emitting diode and its manufacturing method, array substrate and display panel
KR20240054475A (en) Display panel and electric apparatus including the same
US20210027672A1 (en) Display panel
CN116456750A (en) Display apparatus

Legal Events

Date Code Title Description
AS Assignment

Owner name: BOE TECHNOLOGY GROUP CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUANG, WEIYUN;REEL/FRAME:047384/0169

Effective date: 20180823

Owner name: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUANG, WEIYUN;REEL/FRAME:047384/0169

Effective date: 20180823

Owner name: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TAN, WEN;REEL/FRAME:047384/0282

Effective date: 20180823

Owner name: BOE TECHNOLOGY GROUP CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TAN, WEN;REEL/FRAME:047384/0282

Effective date: 20180823

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: AWAITING TC RESP., ISSUE FEE NOT PAID

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: AWAITING TC RESP., ISSUE FEE NOT PAID

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT RECEIVED

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE

CC Certificate of correction
MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4