KR102648626B1 - Display device comprisng bending sensor - Google Patents

Abstract

A display device including a bending sensor is provided. A display device including a bending sensor according to an embodiment of the present invention includes a flexible substrate having a display area and a bezel area surrounding the display area; and a bending sensor disposed in the bezel area and including a bending part that generates an electrical change when the flexible substrate is bent, and a detection part that detects bending information by detecting the electrical change.

Description

Display device including a bending sensor {DISPLAY DEVICE COMPRISNG BENDING SENSOR}

The present invention relates to a display device including a bending sensor, and more specifically, to a bending sensor including a bending portion that generates an electrical change when a flexible substrate is bent, and a detection portion that detects bending information by detecting the electrical change. It relates to a display device including a.

Recently, flexible display devices, which are manufactured by forming a display portion and wiring on a substrate made of a flexible material such as plastic and capable of displaying images even when bent like paper, are attracting attention as next-generation display devices. The scope of application of flexible display devices is becoming more diverse, ranging from computer monitors and TVs to personal portable devices. Additionally, research is being conducted on flexible display devices that have a large display area and reduced volume and weight.

Meanwhile, there is a demand for sensing the degree to which a user bends or folds a flexible display device. Since the image of the flexible display device may be distorted as the user bends or folds the flexible display device, it is very difficult to sense the degree to which the flexible display device is bent or folded and correct the image displayed on the flexible display device accordingly. It is important. Accordingly, research is being conducted on manufacturing a flexible display device by attaching a separately manufactured bending sensor to the flexible display device. However, as the bending sensor is manufactured separately from the flexible display device, the total manufacturing cost may increase. In addition, since the thickness of the flexible display device increases in the process of attaching a separate bending sensor to the flexible display device, the technology for attaching such a separate bending sensor to the flexible display device is a recent research direction aimed at providing a slimmed down display device. It is a retrograde technology.

[Related technical literature]

1. Electronic devices and control methods of electronic devices (Korean Patent Application No. 10-2011-0077585)

The purpose of this specification is to provide a display device with a new structure including a bending sensor in which the bending sensor is manufactured together during the display device manufacturing process to solve problems that occur when the bending sensor is manufactured separately from the flexible display device. .

This specification provides a display device including a bending sensor that can be formed together with the thin film transistor or display device during the process of manufacturing the thin film transistor or display device of the display device.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

In order to solve the above-described problem, a display device according to an embodiment of the present invention is disposed on a flexible substrate having a display area and a bezel area surrounding the display area, and an electrical change occurs when the flexible substrate is bent. It includes a bending sensor having a bending part that detects electrical changes and a detection part that detects bending information.

According to another feature of the present invention, the bent portion includes wires extending in different directions to distribute the force applied during bending.

According to another feature of the present invention, the bent portion includes two or more wires connected in a row in a plurality of diamond shapes, and the two or more wires are parallel to each other.

According to another feature of the present invention, two or more wires are arranged so that the diamond shape crosses each other in a zigzag manner.

According to another feature of the present invention, the bent portion includes two or more wires in a plurality of circular shapes connected in a row, and the two or more wires are parallel to each other.

According to another feature of the present invention, the bent portion has a first bent portion disposed on one side of a neutral plane that does not receive stress because the force is offset during bending, and a bent portion that is different from the first bent portion based on the neutral plane. It includes a second bent portion disposed on the side, and when the bent portion is bent, one of the first bent portion and the second bent portion is configured to receive a tensile force and the other is configured to receive a compressive force.

According to another feature of the present invention, it further includes a first insulating layer disposed between the first bent portion and the second bent portion and a second insulating layer disposed on the second bent portion, and the neutral plane is the first insulating layer. It is characterized by being in .

According to another feature of the present invention, it further includes a first insulating layer disposed on the first bent portion and a second insulating layer disposed on the second bent portion and having a thickness different from the thickness of the first insulating layer, The first bent portion is disposed on one side of the flexible substrate, the second bent portion is disposed on the other side opposite to one side, and the first bent portion and the second bent portion are located on the same layer.

According to another feature of the present invention, a first insulating layer disposed on one side of the flexible substrate and the other side opposite the one side, disposed on the first bent portion and below the second bent portion, and a second layer disposed on the second bent portion. It further includes an insulating layer, the first bent portion is disposed on one side of the flexible substrate, the second bent portion is disposed on the other side opposite to the one side, and the first bent portion and the second bent portion are located on different layers. It is characterized by

According to another feature of the present invention, the bending sensor further includes a wiring portion connecting the bending portion and the detection portion, the bending portion and the wiring portion being located on at least one side of the flexible substrate, and the wiring portion being located in a non-bending area. It is located and the bent portion is located in a bending area.

According to another feature of the present invention, the bending area includes both a part of the bezel area and a part of the display area, or includes a part of the bezel area and does not include the display area.

According to another feature of the present invention, the detector detects the electrical change that occurs in the bent portion during bending and compares it with the values of the electrical change for the bending direction and bending angle stored in the memory to calculate the bending direction and bending angle of the display device. It is characterized by

Specific details of other embodiments are included in the detailed description and drawings.

According to an embodiment of the present invention, the bending direction and bending angle can be calculated using a bending sensor including a bending portion in which electrical change occurs and a detection portion that detects bending information by detecting the electrical change.

In addition, according to an embodiment of the present invention, a bending sensor can be manufactured without adding cost by including a bending sensor that can be formed simultaneously during the process of forming a thin film transistor or a display element.

The effects according to the present invention are not limited to those exemplified above, and further various effects are included in the present specification.

1 is a plan view for explaining a display device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line II-II′ of FIG. 1 to explain a display device according to an embodiment of the present invention.
Figure 3 is a circuit diagram for explaining the sensing principle of a bending sensor according to an embodiment of the present invention.
Figure 4 is a plan view for explaining a display device according to another embodiment of the present invention.
Figure 5 is a plan view for explaining a display device according to another embodiment of the present invention.
6 is a plan view for explaining a display device according to another embodiment of the present invention.
Figure 7 is a plan view for explaining a display device according to another embodiment of the present invention.
Figure 8 is a plan view for explaining a display device according to another embodiment of the present invention.
FIG. 9 is a cross-sectional view taken along line V-V' of FIG. 8 to explain a display device according to another embodiment of the present invention.
FIG. 10 is a table explaining the operating principle of a bending sensor of a display device according to another embodiment of the present invention.
FIG. 11 is a cross-sectional view illustrating a display device according to another embodiment of the present invention.
Figure 12 is a plan view for explaining a display device according to another embodiment of the present invention.
FIG. 13 is a cross-sectional view taken along line IX-IX′ of FIG. 12 to explain a display device according to another embodiment of the present invention.
Figure 14 is a cross-sectional view for explaining a display device according to another embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

When an element or layer is referred to as “on” another element or layer, it includes all cases where another layer or other element is interposed directly on or in the middle of another element.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

Each feature of the various embodiments of the present invention can be partially or fully combined or combined with each other, and as can be fully understood by those skilled in the art, various technical interconnections and operations are possible, and each embodiment may be implemented independently of each other. It may be possible to conduct them together due to a related relationship.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

1 is a plan view for explaining a display device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II′ of FIG. 1 to explain a display device according to an embodiment of the present invention.

As shown in FIGS. 1 and 2 , the display device 100 includes a flexible substrate 110, a thin film transistor 130, a display element 140, and a bending sensor 120. In FIG. 2 , only one thin film transistor 130 and one display element 140 are shown for convenience of explanation.

The flexible substrate 110 is a substrate for supporting and protecting various components of the display device 100. The flexible substrate 110 may be made of an insulating material with flexibility. For example, the flexible substrate 110 may be made of plastic such as polyimide, but is not limited thereto.

The flexible substrate 110 has a display area DA, a bezel area ZA surrounding the display area DA, and a pad area PA extending from one side of the bezel area ZA.

The display area DA is an area where an image is displayed in the display device 100. Accordingly, the display element 140 and various driving elements for driving the display element 140 are disposed in the display area DA. In FIG. 2, for convenience of explanation, only the driving thin film transistor 130 is shown among various driving elements, but the present invention is not limited thereto.

The bezel area ZA is an area in the display device 100 where no image is displayed and is an area where wiring or circuitry is formed.

The pad area PA is an area where a plurality of pad electrodes 139 are formed without displaying an image. At this time, the pad area PA is an area where the pad electrode 139 and an external module, for example, a flexible printed circuit board (FPCB), a chip on film (COF), etc. are bonded. External modules such as FPCB will be described in detail later with reference to FIG. 11. The pad area PA may be located on one side of the bezel area ZA, as shown in FIG. 1 .

The flexible substrate 110 has a bending area (BA) and a non-bending area (NBA).

The bending area BA may be defined in the center of the display device 100. A non-bending area (NBA) may be defined on both sides of the bending area (BA). Accordingly, the flexible substrate 110 may have two non-bending areas (NBA). At this time, the bending area BA overlaps a portion of the display area DA and a portion of the bezel area ZA. The non-bending area NBA overlaps a portion of the display area DA, a portion of the bezel area ZA, and the pad area PA.

The display device 100 is configured to be bent in the bending area BA. That is, the display device 100 may be configured such that the non-bending area (NBA) of the flexible substrate 110 may be maintained in a flat state without being bent, and the bending area (BA) of the flexible substrate 110 may be bent. . Accordingly, the display device 100 may be bent so that the two non-bending areas (NBA) of the flexible substrate 110 face each other.

The thin film transistor 130 is disposed in the display area DA on the flexible substrate 110. The thin film transistor 130 includes an active layer 131, a gate electrode 132, a source electrode 133, and a drain electrode 134.

The buffer layer 111 is disposed on the flexible substrate 110. The buffer layer 111 is made of an inorganic material such as, for example, silicon nitride (SiNx) or silicon oxide (SiOx), and may be made of a single layer or multiple layers.

The active layer 131 is disposed on the buffer layer 111. A channel for the thin film transistor 130 is formed in the active layer 131. The active layer 131 may be formed on the buffer layer 111, or may be formed directly on the flexible substrate 110 when the buffer layer 111 is not used.

The gate insulating layer 112 is disposed on the active layer 131. The gate insulating layer 112 is formed to insulate the active layer 131 and the gate electrode 132. For example, the gate insulating layer 112 is made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be made of a single layer or multiple layers.

The gate electrode 132 is disposed on the gate insulating layer 112. An interlayer insulating layer 113 is disposed on the gate electrode 132. The interlayer insulating layer 113 may be formed in the display area DA. The interlayer insulating layer 113 has a contact hole. The active layer 131 is electrically connected to the source electrode 113 and the drain electrode 134 through a contact hole. For example, the interlayer insulating layer 113 is made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be made of a single layer or multiple layers.

The source electrode 133 and the drain electrode 134 are disposed on the interlayer insulating layer 113. Each of the source electrode 133 and the drain electrode 134 is electrically connected to the active layer 131 through a contact hole. In FIG. 2 , for convenience of explanation, the thin film transistor 130 is shown as having a coplanar structure, but the structure is not limited thereto.

The overcoating layer 114 is disposed on the thin film transistor 130. The overcoating layer 114 is an insulating layer for flattening the upper part of the thin film transistor 130. The overcoating layer 114 may be formed in the display area DA.

The display element 140 is disposed on the overcoating layer 114. The display element 140 is disposed in the display area DA and is electrically connected to the thin film transistor 130. The display element 140 is disposed in the bending area BA and the non-bending area NBA. At this time, when the display device 100 is bent, a portion of the display element 140 disposed in the bending area BA is also bent. Therefore, the display element 140 may be made of a flexible material. The display device 140 may be, for example, an organic light emitting display device. Hereinafter, the display device 140 will be described assuming that it is an organic light emitting display device, but is not limited thereto.

The display device 140, which is an organic light emitting display device, includes an anode 141, an organic light emitting layer 142, and a cathode 143.

The anode 141 is electrically connected to the thin film transistor 130. Since the anode 141 must supply holes to the organic light emitting layer 142, it may be made of a conductive material with a high work function. When the display device 100 is a top emission type organic light emitting display device, the anode 141 is a reflective layer made of a metal material with excellent reflectivity and a transparent conductive material disposed on the reflective layer and made of a conductive material with a high work function. It may be composed of layers. If the display device 100 is a bottom emission organic light emitting display device, the anode 141 may be composed of only a transparent conductive layer.

The organic emission layer 142 may be any one of a red organic emission layer, a green organic emission layer, a blue organic emission layer, and a white organic emission layer. Additionally, when the organic emission layer 142 is a white organic emission layer, a color filter may be included in the display device 100.

The cathode 143 is disposed on the organic light emitting layer 142. Since the cathode 143 must supply electrons to the organic light-emitting layer 142, it may be formed of a conductive material with a low work function. The cathode 143 may be formed of, for example, a transparent conductive oxide. At this time, the organic emission layer 142 may further include a metal doping layer.

The encapsulation layer 116 is disposed on the display element 140. The encapsulation layer 116 protects the display element 140 from external shock, moisture, oxygen, etc. For example, the encapsulation layer 116 is made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be made of a single layer or multiple layers.

The first inorganic layer 181 is disposed on the flexible substrate 110. At this time, the first inorganic layer 181 is disposed in the bezel area ZA on the flexible substrate 110. The first inorganic layer 181 may be formed of the same material as any one of the various inorganic layers formed in the display area DA. The first inorganic layer 181 may be formed, for example, by forming a buffer layer material on the flexible substrate 110 and then patterning the buffer layer material. Accordingly, the first inorganic layer 181 may be formed simultaneously with the buffer layer 111 of the same material. The first inorganic layer 181 is not limited to this, and the first inorganic layer 181 may be formed simultaneously with the same material as the gate insulating layer 112 or the interlayer insulating layer 113. The first inorganic layer 181 may be omitted.

Referring to FIGS. 1 and 2 , the display device 100 includes a bending sensor 120 .

The bending sensor 120 may include a bending part 121, a wiring part 122, and a detection part.

The bent portion 121 and the wiring portion 122 of the bending sensor 120 are formed in the form of wiring. The wiring portion 122 of the bending sensor 120 may be connected to the pad electrode 139.

The bent portion 121 and the wiring portion 122 of the bending sensor 120 are located on the flexible substrate 110, and the detection portion of the bending sensor 120 is an external module or flexible substrate 110 connected to the pad electrode 139. It can be located on the top. The external module will be described in detail later with reference to FIG. 11.

The bent portion 121 and the wiring portion 122 of the bending sensor 120 are formed on the first inorganic layer 181 in the bezel area ZA. The bent portion 121 and the wiring portion 122 of the bending sensor 120 may be made of a conductive material. The bent portion 121 and the wiring portion 122 of the bending sensor 120 may be made of the same material as the conductive material constituting the thin film transistor 130 or the material constituting the display element 140. For example, the bent portion 121 and the wiring portion 122 of the bending sensor 120 may be made of the same material as the source electrode 133 and the drain electrode 134 of the thin film transistor 130. At this time, a conductive material for forming the source electrode 133 and the drain electrode 134 is disposed on the flexible substrate 110. Accordingly, the bent portion 121 and the wiring portion 122 of the bending sensor 120 can be formed simultaneously with the source electrode 133 and the drain electrode 134 by patterning the disposed conductive material. However, it is not limited to this, and the bent portion 121 and the wiring portion 122 of the bending sensor 120 include the gate electrode 132 of the thin film transistor 130, the anode 141 of the display element 140, and the cathode ( 143) can be formed simultaneously with any one of the same materials. Hereinafter, for convenience of explanation, it is assumed that the bending sensor 120 is made of the same material as the source electrode 133 and the drain electrode 134 of the thin film transistor 130.

When the flexible substrate 110 is bent, an electrical change occurs in the bent portion 121. The wiring unit 122 connects the bending unit 121 and the detection unit. Accordingly, the electrical change occurring in the bent part 121 can be transmitted to the detection unit through the wiring part 122. Accordingly, the detector detects bending information by detecting electrical changes occurring in the bent portion 121. At this time, the bent portion 121 may be located in the bending area (BA) of the flexible substrate, and the wiring portion 122 may be located in the non-bending area (NBA) of the flexible substrate. When the display device 100 is bent, the bending area BA of the flexible substrate 110 is bent, and the non-bending area NBA is maintained in a flat state. Accordingly, the wiring portion 122 disposed in the non-bending area NBA receives little stress due to bending of the display device 100, and most of the stress occurs in the bent portion disposed in the bending area BA. It is concentrated on (121). Therefore, there is a possibility that the bent portion 121 may crack as the bending area BA is bent. Accordingly, in the display device 100 according to an embodiment of the present invention, the bent portion 121 may have a shape (eg, a diamond shape) that can prevent cracks caused by external force. As an example, the bent portion includes two or more wires in which a plurality of diamond shapes are connected in a row, and the two or more wires may be positioned parallel to each other. Additionally, the bent portion 121 may be made of wires extending in different directions. Accordingly, when the bending area BA is bent, a portion of the bent portion 121 extends in a direction different from the direction in which the bent portion 121 extends. Accordingly, the force applied during bending is distributed and the stress experienced by the bent portion 121 is reduced. Accordingly, the probability that the bent portion 121 will crack can be reduced. The bent portion 121 may be formed in various shapes other than a diamond shape.

The second inorganic layer 182 is disposed to cover the bent portion 121 and the wiring portion 122 of the bending sensor 120. The second inorganic layer 182 is formed in the bezel area ZA on the flexible substrate 110. The second inorganic layer 182 may be formed of the same material as one of the various inorganic layers formed in the display area DA. For example, an encapsulation layer material is formed on the flexible substrate 110 on which the display element 140 is formed. The second inorganic layer 182 may be formed simultaneously with the same material as the encapsulation layer 116 by patterning the encapsulation layer material. In some embodiments, the second inorganic layer 182 may be omitted.

In the display device 100 according to an embodiment of the present invention, the bent portion 121 and the wiring portion 122 of the bending sensor 120 made of a conductive material are formed of a first inorganic layer 181 and a second inorganic layer made of an inorganic material. It may be sealed by layer 182. Accordingly, damage to the bent portion 121 and the wiring portion 122 of the bending sensor 120 by moisture, oxygen, etc. can be minimized.

Hereinafter, FIG. 3 will be referred to to explain in more detail the principle of sensing the bending angle of the display device 100 using the bending sensor 120.

Figure 3 is a circuit diagram for explaining the sensing principle of a bending sensor according to an embodiment of the present invention. In Figure 3, the bent portion 121 of the bending sensor 120 is schematically represented as a variable resistor.

In order to detect the bending angle of the display device through the bending sensor 120, the bending sensor 120 is connected to a voltage source. Voltage (V) can be applied to the bending sensor 120 by connecting both ends of the bending sensor 120 to a voltage source. Therefore, the current (I) flows through the bending sensor 120. At this time, the detection unit of the bending sensor 120 measures the current (I) value applied to the bent part 121 of the bending sensor 120, and the resistance value of the bent part 121 of the bending sensor 120 can be calculated. .

The bent portion 121 of the bending sensor 120 is a variable resistance. Accordingly, the resistance value of the bent portion 121 of the bending sensor 120 may change depending on the bending angle of the display device. For example, when the display device is bent inward, that is, when the display device is bent so that both ends of the upper surface of the display device face each other, the bent portion 121 of the bending sensor 120 exerts compressive force. You will receive Accordingly, the resistance value of the bent portion 121 of the bending sensor 120 decreases. Accordingly, the current value applied to the bent portion 121 of the bending sensor 120 increases. The detection unit of the bending sensor 120 detects an increase in the current value occurring in the bent portion 121 of the bending sensor 120. Accordingly, the detection unit of the bending sensor 120 may calculate the reduced resistance value of the bent portion 121 of the bending sensor 120. The detection unit of the bending sensor 120 calculates the bending direction and bending angle of the display device by comparing the reduced resistance value with the resistance value for the bending direction and bending angle stored in the memory of the detection unit. In addition, for example, when the display device is bent outward, that is, when the display device is bent so that both ends of the lower surface of the display device face each other, the bent portion 121 of the bending sensor 120 exerts a tensile force. force). Accordingly, the resistance value of the bent portion 121 of the bending sensor 120 increases. Accordingly, the current value applied to the bent portion 121 of the bending sensor 120 decreases.

The detection unit of the bending sensor 120 detects a decrease in the current value occurring in the bent portion 121 of the bending sensor 120. Accordingly, the detection unit of the bending sensor 120 may calculate the increased resistance value of the bent portion 121 of the bending sensor 120. The detection unit of the bending sensor 120 calculates the bending direction and bending angle of the display device by comparing the increased resistance value with the resistance value for the bending direction and bending angle stored in the memory of the detection unit. At this time, the resistance value of the bent portion 121 of the bending sensor 120 according to the bending direction and bending angle of the display device may be stored in the memory. For example, the memory includes the resistance value of the bent portion 121 of the bending sensor 120 for each bending direction and bending angle when the display device is bent inward, and the bending angle when the display device is bent outward. The resistance value of the bent portion 121 of the bending sensor 120 may be stored. That is, the detector detects the electrical change that occurs in the bent portion 121 of the bending sensor 120 when the display device is bent and compares it with the electrical change in the bending direction and bending angle stored in the memory. Therefore, the detector can calculate the bending direction and bending angle of the display device. At this time, the electrical change may be not only a resistance value but also other electrical change values such as a current value or a voltage value. The detection unit may be placed on a flexible substrate, or may be placed in the form of an FPCB or COF.

In the display device 100 according to an embodiment of the present invention, the bent portion 121 and the wiring portion 122 of the bending sensor 120 constitute a conductive material constituting the thin film transistor 130 or the display element 140. It is made of a conductive material that Additionally, the bent portion 121 and the wiring portion 122 of the bending sensor 120 may be formed simultaneously with components of the thin film transistor 130 or components of the display element 140 made of the same conductive material. Therefore, no additional process is required to form the bent portion 121 and the wiring portion 122 of the bending sensor 120. Therefore, the bent portion 121 and the wiring portion 122 of the bending sensor 120 can be manufactured during the thin film transistor 130 manufacturing process or the display element 140 manufacturing process, so that additional process costs are not incurred and manufacturing time is reduced. does not increase

Additionally, the bent portion 121 and the wiring portion 122 of the bending sensor 120 are formed integrally with the display device 100. Therefore, as the bending sensor 120 is added, the thickness of the display device 100 does not increase. That is, since the bent portion 121 and the wiring portion 122 of the bending sensor 120 can be manufactured in the form of wiring in the bezel area ZA, even if the bending sensor 120 is integrated into the display device 100, the display device 100 can be slimmed. It is possible to manufacture the display device 100.

In some embodiments, the flexible substrate 110 may have at least two non-bending areas (NBA) and a bending area (BA) between the non-bending areas (NBA). That is, as shown in FIG. 1, there may be two non-bending areas (NBA), but the number of non-bending areas (NBA) is three, and the bending areas (BA) are arranged between the non-bending areas (NBA), making 2 It could be a dog. Additionally, the number of non-bending areas (NBA) may be four or more.

A temperature sensor for detecting the temperature of the bending sensor 120 may be disposed on the flexible substrate 110. When the bent portion 121 of the bending sensor 120 is made of a conductive material such as a metal material, the resistance value of the bent portion 121 of the bending sensor 120 may change as the temperature changes. When the temperature rises, the resistance value of the bent portion 121 of the bending sensor 120 increases, and when the temperature decreases, the resistance value of the bent portion 121 of the bending sensor 120 decreases. Accordingly, even though the display device 100 is not actually bent, the resistance value of the bent portion 121 of the bending sensor 120 changes as the temperature changes, so that the processor determines whether the display device 100 is bent. It may be misjudged. Therefore, a temperature sensor is disposed on the flexible substrate 110, and the resistance value of the bent portion 121 of the bending sensor 120 according to the bending direction and bending angle for each temperature of the bending sensor 120 can be stored in the memory of the detection unit. there is. Therefore, the detector can detect the bending angle of the display device 100 based on the temperature value measured by the temperature sensor and the resistance value of the bent portion 121 of the bending sensor 120 according to the bending direction and bending angle stored in the memory. there is.

Figure 4 is a plan view for explaining a display device according to another embodiment of the present invention.

Compared to the display device 100 shown in FIGS. 1 and 2, the display device 200 shown in FIG. 4 only has a changed structure of the bent portion 221 of the bending sensor 220, and other components are substantially changed. Since they are the same, duplicate descriptions are omitted.

The bending sensor 220 has a bent portion 221 disposed in the bending area BA and a wiring portion 222 disposed in the non-bending area NBA. At this time, when the display device 200 is bent, only the bending area BA is bent, and the non-bending area NBA is maintained in a flat state. Accordingly, the wiring portion 222 disposed in the non-bending area (NBA) receives little stress due to bending of the display device 200, and most of the stress occurs in the bent portion disposed in the bending area (BA). It is focused on (221). Therefore, there is a possibility that the bent portion 221 may crack as the bending area BA is bent. Accordingly, in the display device 200 according to another embodiment of the present invention,

The bent portion 221 may have a shape (e.g., diamond shape) that can prevent cracks caused by external force. As an example, the bent portion includes two or more wires (wires) connected in a row in a plurality of diamond shapes, and the two or more wires (wires) may be positioned parallel to each other. Additionally, the diamond shape of one wiring may be staggered with the diamond shape in an adjacent row. That is, the sawtooth-shaped portions of the diamond shape may be crossed with each other. Additionally, the bent portion 221 is made of wires extending in different directions. Accordingly, when the bending area BA is bent, a portion of the bent portion 221 extends in a direction different from the direction in which the bent portion 221 extends. Accordingly, the force applied during bending is distributed and the stress experienced by the bent portion 221 is reduced. Accordingly, the probability that the bent portion 221 will crack can be reduced. In addition, since the diamond-shaped bent portions 221 are formed to cross each other in a zigzag manner, the bent portions 221 and the wiring portion 222 of the bending sensor 220 are located in a different position than if the bent portions were formed symmetrically and parallelly. The width of the bezel area (ZA) can be reduced. As shown in FIG. 4, the bent portion 221 may be formed in various shapes other than a diamond shape.

Figure 5 is a plan view for explaining a display device according to another embodiment of the present invention.

Compared to the display device 100 shown in FIGS. 1 and 2, the display device 300 shown in FIG. 5 only has a changed structure of the bent portion 321 of the bending sensor 320, and other components are substantially the same. Since it is the same, duplicate description is omitted.

The bending sensor 220 has a bent portion 221 disposed in the bending area BA and a wiring portion 222 disposed in the non-bending area NBA. At this time, when the display device 200 is bent, only the bending area BA is bent, and the non-bending area NBA is maintained in a flat state. Accordingly, the wiring portion 222 disposed in the non-bending area (NBA) receives little stress due to bending of the display device 200, and most of the stress occurs in the bent portion disposed in the bending area (BA). It is focused on (221). Therefore, there is a possibility that the bent portion 221 may crack as the bending area BA is bent. Accordingly, in the display device 300 according to another embodiment of the present invention, the bent portion 321 may have a shape (e.g., a circular shape) that can prevent cracks caused by external force. As an example, the bent portion 321 includes two or more wires in a plurality of circular shapes connected in a row, and the two or more wires may be positioned parallel to each other. Additionally, the bent portion 321 is oriented in different directions. It may be made up of extending wires. Accordingly, when the bending area BA is bent, a portion of the bent portion 321 extends in a direction different from the direction in which the bent portion 321 extends. Accordingly, the force applied during bending is distributed and the stress experienced by the bent portion 321 is reduced. Therefore, the probability that the bent portion 321 will crack can be reduced. Additionally, when the bending area BA is bent, the wiring 321 of the bent portion is curved rather than a straight line, so it is easy to extend the bent portion 321. Accordingly, the stress experienced by the bent portion 321 is reduced, and the probability of the bent portion 321 cracking can be further reduced compared to a straight line.

The bent portion 321 may be formed in various shapes other than the circular shape as shown in FIG. 5 .

6 is a plan view for explaining a display device according to another embodiment of the present invention.

The display device 400 shown in FIG. 6 has changed sizes of the bending area (BA) and non-bending area (NBA) compared to the display device 100 shown in FIGS. 1 and 2, and the bending sensor 420 Only the structure of the bent portion 421 has been changed, and other components are substantially the same, so redundant description will be omitted.

The flexible substrate 110 has a bending area (BA) and a non-bending area (NBA). Additionally, the flexible substrate 110 has a display area DA where a thin film transistor and a display element are disposed, and the bezel area ZA is defined to surround the display area DA. The display area DA of the flexible substrate 110 is defined within the bending area BA. That is, the display area DA does not overlap with the non-bending area NBA, but only overlaps with the bending area BA. Accordingly, since the display element 340 is also disposed in the bending area BA, the display element 140 needs to be made of a flexible material. Accordingly, the display device 140 may be an organic light emitting display device.

In the display device 400 according to another embodiment of the present invention, the display area DA is disposed only in the bending area BA and not in the non-bending area NBA. That is, the display area DA overlaps the entire bending area BA. Accordingly, the bending area BA in the display device 400 according to another embodiment of the present invention is wider than when the bending area BA overlaps a portion of the display area DA. Accordingly, more of the bent portions 421 of the bending sensor 420 disposed in the bending area BA may be disposed in the bending area BA. Therefore, since the change in resistance value of the bent portion 421 occurs over a wider area, the bending sensor 420 can detect a more accurate bending angle.

Figure 7 is a plan view for explaining a display device according to another embodiment of the present invention. The display device 500 shown in FIG. 7 has a changed shape and size of the display area DA compared to the display device 100 shown in FIGS. 1 and 2, and includes a thin film transistor 530 and a display element 540. ) has changed, but other components are substantially the same, so redundant description will be omitted.

As shown in FIG. 7, the flexible substrate 110 has a bending area (BA) and two non-bending areas (NBA). Additionally, the flexible substrate 110 has two display areas DA where the thin film transistor 530 and the display element 540 are disposed, and the bezel area ZA is defined to surround the display area DA. Each display area (DA) of the flexible substrate 110 is defined within each non-bending area (NBA). Accordingly, the bending area BA includes a portion of the bezel area ZA but does not include the display area DA. That is, the display area DA does not overlap the bending area BA, but only partially overlaps the non-bending area NBA. Accordingly, since the display element 540 is not disposed in the bending area BA, the display element 540 may not be made of a flexible material. Accordingly, the display device 540 may be one of other display devices such as a liquid crystal display device as well as an organic light emitting display device.

In the display device 500 according to another embodiment of the present invention, the display area DA is disposed in the non-bending area NBA and not in the bending area BA. Accordingly, the display element 540 may not be made of a flexible material. Therefore, various display devices, such as a liquid crystal display device as well as an organic light emitting display device, may be applied to the display device 500 according to another embodiment of the present invention. Additionally, in the display device 500 according to another embodiment of the present invention, a plurality of display elements 540 are disposed on the flexible substrate 110 as a plurality of display areas DA are defined, so that a plurality of display screens are provided. It may be provided to the user.

Figure 8 is a plan view for explaining a display device according to another embodiment of the present invention. FIG. 9 is a cross-sectional view taken along line V-V' of FIG. 8 to explain a display device according to another embodiment of the present invention. The display device 600 shown in FIGS. 8 and 9 has a changed configuration of the bending sensor 620 compared to the display device 100 shown in FIGS. 1 and 2, and includes a first insulating layer 671 and a first insulating layer 671. 2 The only difference is the addition of the insulating layer 672, and other components are substantially the same, so redundant description will be omitted.

As shown in FIGS. 8 and 9, the bending sensor 620 includes a first bent portion 621, a second bent portion 6310, a first wiring portion 622, and a second wiring portion 632. do. The first bent portion 621 and the first wiring portion 622 are formed on the first inorganic layer 181. The second inorganic layer 182 is disposed to cover the first bent portion 621 and the first wiring portion 622. Since the first bent portion 621 and the first wiring portion 622 are substantially the same as the bent portion 121 and the wiring portion 122 of the bending sensor 120 of FIGS. 1 and 2, duplicate descriptions will be omitted.

A first insulating layer 671 is disposed on the first bent portion 621. For example, the first insulating layer 671 may be made of a resin capable of heat curing or UV curing, and specifically, may be made of an acrylic resin, an epoxy resin, or the like. The thickness of the first insulating layer 671 is determined so that the first bent portion 621 and the second bent portion 631 are located on different sides of the neutral plane (NP).

The second bent portion 631 is disposed on the first insulating layer 671. That is, the first insulating layer 671 is disposed between the first bent portion 621 and the second bent portion 631. In FIG. 8 , for convenience of illustration, the first bent portion 621 is shown not overlapping with the second bent portion 631. However, as shown in FIG. 9, the second bent portion 631 is the first insulating portion. It is arranged to overlap the first bent portion 621 on the layer 671. The second bent portion 631 may be made of the same material as the conductive material constituting the thin film transistor 130 or the conductive material constituting the display element 140. The second bent portion 631 is disposed in the bending area BA and may be formed in the shape of the bent portion 121 as shown in FIG. 1 .

A second insulating layer 672 is disposed on the second bent portion 631. The second insulating layer 672 may be made of, for example, a resin that can be heat-cured or UV-cured, and specifically, may be made of an acrylic-based resin or an epoxy-based resin. Additionally, the second insulating layer 672 may be made of the same material as the first insulating layer 671. The thickness of the second insulating layer 672 is determined so that the first bent portion 621 and the second bent portion 631 are located on different sides of the neutral plane NP.

As shown in FIG. 9, the first bent portion 621 is disposed below the neutral plane (NP), and the second bent portion 631 is disposed above the neutral plane (NP). At this time, the neutral surface (NP) refers to a virtual surface that does not receive stress because the compressive force and tensile force cancel each other out when the display device 600 is bent in the inward or outward direction. The neutral plane NP is determined by considering the thickness, Young's modulus, materials, etc. of the components of the display device 600 disposed in the bezel area ZA. Additionally, the position of the neutral surface (NP) may change depending on other components present above or below the part where the neutral surface (NP) is located. Therefore, in order to control the position of the neutral surface (NP), other components that exist above or below the part where the neutral surface (NP) is to be located must use materials and structures that can minimize their influence on the neutral surface (NP). You can. Alternatively, the position of the neutral surface (NP) may be adjusted to a desired position by changing the thickness and structure of other components present above or below the portion where the neutral surface (NP) is to be located. The display device 600 according to another embodiment of the present invention uses a first insulating layer 671 and a second insulating layer 672. Accordingly, the bent portion 621 and the second bent portion 631 are located on opposite sides of the neutral plane NP.

As shown in FIG. 9, the first bent portion 621 is disposed below the neutral plane (NP), and the second bent portion 631 is disposed above the neutral plane (NP). Accordingly, when the display device 600 is bent, one of the first bent portion 621 and the second bent portion 631 may receive a tensile force, and the other may receive a compressive force. Therefore, the display device 600 according to another embodiment of the present invention uses a plurality of bent parts 620 and 631, so that one bent part receives a compressive force and the other bent part receives a tensile force, so that the display is more accurate. The bending angle of device 600 may be detected.

The bending sensor 620 may include three or more bending parts. That is, the bending sensor 620 may include not only the first bent part 621 and the second bent part 631, but also a third bent part formed on the second bent part 631. Additionally, the bending sensor 620 may include more bent parts. Accordingly, detection accuracy of the bending angle of the display device 600 may be improved.

For a more detailed description of the stress experienced by the first bent portion 621 and the second bent portion 631, please refer to FIG. 10 as well.

FIG. 10 is a table explaining the operating principle of a bending sensor of a display device according to another embodiment of the present invention. In FIG. 10 , for convenience of explanation, an arbitrary support member is shown disposed between the first bent portion 621 and the second bent portion 631. Inner bending refers to a case where the support member is bent in a shape in which both ends of the support member are raised and the central portion of the support member is lowered. Outward bending refers to a case where the support member is bent in a shape in which both ends of the support member are lowered and the central portion of the support member is raised.

As shown in FIG. 10, when the support member is bent inward, the first bent portion 621 placed below the support member is stretched. Therefore, the first bent portion 621 receives a tensile force. Additionally, when the support member is bent inward, the second bent portion 631 disposed on the support member is compressed. Therefore, the second bent portion 631 receives compressive force. Accordingly, during inner bending, the first bent part 621 receives a tensile force and the resistance increases, and the second bent part 631 receives a compressive force and the resistance decreases.

Additionally, as shown in FIG. 10, when the support member is bent outward, the first bent portion 621 placed below the support member is compressed. Therefore, the first bent portion 621 receives compressive force. Additionally, when the support member is bent outward, the second bent portion 631 disposed on the support member is stretched. Therefore, the second bent portion 631 receives a tensile force. Accordingly, during outer bending, the first bent portion 621 receives a compressive force and the resistance decreases, and the second bent portion 631 receives a tensile force and the resistance increases.

Depending on the bending direction, one of the first bent portion 621 and the second bent portion 631 receives a tensile force and the resistance increases, and the other one receives a compressive force and the resistance decreases. Accordingly, the bending angle of the display device 600 can be detected. Specifically, the resistance value of the first bent part 621 and the resistance value of the second bent part 631 according to the bending direction and bending angle of the display device 600 may be stored in the memory of the detector. The detector may calculate the resistance value of the first bent portion 621 using the voltage value applied to the first bent portion 621 and the current value applied to the first bent portion 621. Additionally, the detector may calculate the resistance value of the second bent portion 631460 using the voltage value applied to the second bent portion 631 and the current value applied to the second bent portion 631. The detector calculates the resistance value of the first bent portion 621 and the resistance value of the second bent portion 631, and calculates the resistance value of the first bent portion 621 and the second bending portion for each bending direction and bending angle stored in the memory of the detector. The bending angle of the display device 600 can be detected by comparing the resistance value of the bent portion 631.

FIG. 11 is a cross-sectional view illustrating a display device according to another embodiment of the present invention. The display device 700 shown in FIG. 11 only has an FPCB 790 and a resin layer 717 added compared to the display device 600 shown in FIGS. 8 and 9, and other components are substantially the same. , redundant explanation is omitted.

As shown in FIG. 11, FPCB 790 is a flexible printed circuit board. The FPCB 790 may be equipped with a control unit such as an IC chip or circuit unit. Additionally, the detection unit as described above may be mounted on the FPCB (790). The FPCB 790 is configured to transmit a signal for driving the display device 140 from the control unit to the display device 140 and to mount a detection unit for detecting the bending angle of the display device 700.

The FPCB 790 is bonded to the pad electrode 139 in the pad area PA. Specifically, the FPCB 790 is bonded to the pad electrode 139 so that the connection electrode 791 of the FPCB 790 is electrically connected to the pad electrode 139.

The resin layer 717 is disposed on the flexible substrate 110 to cover the end of the FPCB 790. The resin layer 717 protects and secures the FPCB (790).

The resin layer 717 may be made of an insulating material. The resin layer 717 may be made of, for example, a resin capable of heat curing or UV curing. Specifically, it may be made of an acrylic resin, an epoxy resin, or the like.

The first insulating layer 671 may be made of the same material as the resin layer 717. That is, the first insulating layer 671 and the resin layer 717 can be formed simultaneously using the same material. For example, acrylic resin or epoxy resin is applied simultaneously to the bezel area (ZA) and pad area (PA), and the resin is cured using heat or UV. Accordingly, the first insulating layer 671 and the resin layer 717 can be formed simultaneously. At this time, the thickness of the first insulating layer 671 and the thickness of the resin layer 717 may also be the same.

Additionally, the second insulating layer 672 instead of the first insulating layer 671 may be formed simultaneously with the same material as the resin layer 717. Additionally, both the first insulating layer 671 and the second insulating layer 672 may be formed of the same material as the resin layer 717. At this time, one of the first insulating layer 671 and the second insulating layer 672 may be formed simultaneously with the resin layer 717.

Figure 12 is a plan view for explaining a display device according to another embodiment of the present invention. FIG. 13 is a cross-sectional view taken along line IX-IX′ of FIG. 12 to explain a display device according to another embodiment of the present invention. Compared to the display device 600 shown in FIGS. 8 and 9, the display device 800 shown in FIGS. 12 and 13 has a flexible substrate 810, a second bending sensor 860, and a first insulating layer ( Only 871) and the second insulating layer 872 are changed, and other components are substantially the same, so redundant description is omitted. In FIG. 13 , for convenience of illustration, only one thin film transistor 130 and one display element 140 are shown in the display area DA.

As shown in FIGS. 12 and 13 , the bezel area ZA of the flexible substrate 810 has a first sensing area SA1 and a second sensing area SA2. The first sensing area SA1 is an area where the bent portion 621 and the wiring portion 622 of the first bending sensor 62 are disposed and is located on one side of the display area DA. The second sensing area SA2 is an area where the bent portion 821 and the wiring portion 822 of the second bending sensor 820 are disposed, and is located on the other side opposite to one side of the display area DA. For example, the first sensing area SA1 is an area adjacent to the left side of the display area DA, and the second sensing area SA2 is an area adjacent to the right side of the display area DA.

The first bent portion 621 of the first bending sensor 620 is disposed in the first sensing area SA1. The first insulating layer 871 is disposed on the first bent portion 621 in the first sensing area SA1. The thickness D1 of the first insulating layer 871 is determined so that the first bent portion 621 is disposed on the first neutral plane NP1 in the first sensing area SA1. In addition, if it is difficult to place the bent portion 621 of the first bending sensor 620 on the first neutral plane NP1 just by adjusting the thickness D1 of the first insulating layer 871, the flexible substrate ( 810) can also be adjusted.

The second bent portion 821 of the second bending sensor 820 is disposed in the second sensing area SA2. The second insulating layer 872 is disposed on the second bent portion 821 in the second sensing area SA2. The first bent portion 621 and the second bent portion 821 are disposed on the flexible substrate 810. At this time, the thickness of the first inorganic layer 181 disposed on the flexible substrate 810 and below the first bent portion 621 and the thickness of the first inorganic layer 181 disposed on the flexible substrate 810 and below the second bent portion 821 The thickness of the first inorganic layer 181 may be the same. Accordingly, the first bent portion 621 and the second bent portion 821 may be located at the same height. Additionally, the first bent portion 621 and the second bent portion 821 may be located on the same layer. The thickness D2 of the second insulating layer 872 is determined so that the second bent portion 821 is disposed below the second neutral plane NP2 in the second sensing area SA2. That is, in order for the first bent portion 621 to be disposed above the first neutral plane NP1 and the second bending portion 821 to be disposed below the second neutral plane NP2, the second insulating layer 872 The thickness D2 may be thicker than the thickness D1 of the first insulating layer 871. Additionally, the first bending sensor 620 and the second bending sensor 820 may be formed simultaneously of the same conductive material.

In the display device 800 according to another embodiment of the present invention, the first bending sensor 620 and the second bending sensor 820 may be disposed on the same layer and made of the same material. In addition, the first bending sensor 620 and the second bending sensor 820 are made of the same conductive material as the conductive material constituting the thin film transistor 130 disposed in the display area DA or the conductive material constituting the display element 140. It can be formed as Accordingly, an additional process for forming the first bending sensor 620 and the second bending sensor 820 is not necessary. Additionally, the first bending sensor 620 is disposed above the first neutral plane NP1 and the second bending sensor 820 is disposed below the second neutral plane NP2. Therefore, in the process of bending the display device 800, one of the first bending sensor 620 and the second bending sensor 820 is configured to receive a compressive force and the other is configured to receive a tensile force, thereby more accurately bending the display device 800. The angle can be detected.

Additionally, the thickness D1 of the first insulating layer 871 may be thicker than the thickness D2 of the second insulating layer 872. At this time, the first bending sensor 62 is disposed below the first neutral surface (NP1) in the first sensing area (SA1), and the second bending sensor 820 is disposed under the second neutral surface (NP1) in the second sensing area (SA2). It can be placed on the face (NP2).

Figure 14 is a cross-sectional view for explaining a display device according to another embodiment of the present invention. Compared to the display device 600 shown in FIGS. 8 and 9, the display device shown in FIG. 14 has the positions of the second bending sensor 921, the first insulating layer 971, and the second insulating layer 972. Only the changes have been made, but other components are substantially the same, so redundant description will be omitted. In FIG. 14 , for convenience of illustration, only one thin film transistor 130 and one display element 140 are shown in the display area DA.

As shown in FIG. 14, the flexible substrate 110 has a first sensing area (SA1) and a second sensing area (SA2). The first sensing area (SA1) is an area where the first bent part 651 of the first bending sensor is placed and is located on one side of the display area (DA). The second sensing area (SA2) is an area where the first bent part 651 of the first bending sensor is placed. This is an area where the second bent portion 921 is disposed, and is located on the other side opposite to one side of the display area DA. For example, the first sensing area SA1 is an area adjacent to the left side of the display area DA, and the second sensing area SA2 is an area adjacent to the right side of the display area DA.

The first bent portion 621 and the first insulating layer 971 are disposed in the first sensing area SA1. A first bent portion 621 is disposed on the flexible substrate 110 in the first sensing area SA1. A first insulating layer 9971 is disposed in the first sensing area SA1 to cover the first bent portion 621. The thickness of the first insulating layer 971 is determined so that the first bent portion 621 is disposed below the first neutral plane NP1 in the first sensing area SA1.

A first insulating layer 971, a second bent portion 921, and a second insulating layer 972 are disposed in the second sensing area SA2. A first insulating layer 971 is disposed on the flexible substrate 110 in the second sensing area SA2. The second bent portion 921 is disposed on the first insulating layer 971. The second insulating layer 972 is disposed on the first insulating layer 971 to cover the second bending sensor 1060. The thickness of the second insulating layer 972 is determined so that the second bent portion 921 is disposed on the second neutral plane NP2 in the second sensing area SA2.

In the display device 900 according to another embodiment of the present invention, the first bent portion 621 is disposed below the first neutral plane NP1 and the second bent portion 921 is disposed above the second neutral plane NP2. do. Therefore, in the process of bending the display device 900, one of the first bent portions 621 and the second bent portions 921 is configured to receive a compressive force and the other is configured to receive a tensile force, so that the bending angle of the display device 900 can be more accurately determined. can be detected.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

110, 810: Flexible substrate
111: buffer layer
112: Gate insulating layer
113: Interlayer insulation layer
114: Overcoating layer
115: Bank layer
116: Encapsulation layer
717: Resin layer
120, 420, 820, 920: bending sensor
121: bending part
122: Wiring unit
130, 330: thin film transistor
131: active layer
132: Gate electrode
133: source electrode
134: drain electrode
139: pad electrode
140, 340: display element
141: anode
142: Organic light-emitting layer
143: cathode
120, 620: bending sensor
671, 871, 971: first insulating layer
672, 872, 972: second insulating layer
181: first inorganic layer
182: second inorganic layer
790: FPCB
791: Connecting electrode
100, 200, 300, 400, 500, 600, 700, 800, 900: Display device
DA: display area
ZA: Bezel area
BA: bending area
NBA: Non-bending area
PA: Pad area
SA1: first sensing area
SA2: second sensing area
NP: neutral plane
NP1: first neutral plane
NP2: second neutral plane

Claims (18)

A flexible substrate having a bending area and a non-bending area;
a display area defined on the flexible substrate;
a non-display area on the flexible substrate surrounding the display area and including a bezel area and a pad area;
a plurality of thin film transistors disposed in the display area on the flexible substrate;
an overcoating layer disposed on the plurality of thin film transistors in the display area;
a plurality of display elements disposed on the overcoating layer in the display area and each including a plurality of anodes connected to the plurality of thin film transistors;
an encapsulation layer disposed on the plurality of display elements;
Sensor wiring disposed in the bezel area on the flexible substrate;
Comprising an insulating layer disposed to cover the sensor wire,
A flexible display device, wherein the insulating layer is formed of the same material as the encapsulation layer. According to paragraph 1,
The bending area is disposed in the center of the display area. According to paragraph 1,
A flexible display device, wherein the flexible substrate has two or more non-bending areas. According to paragraph 3,
A flexible display device wherein the two or more non-bending areas are configured to face each other. According to paragraph 1,
The thin film transistor includes an active layer, a gate electrode, a source electrode, and a drain electrode. According to clause 5,
The flexible display device further includes an interlayer insulating layer disposed between the active layer and the source electrode and the drain electrode. According to paragraph 1,
The flexible display device further includes a buffer layer disposed between the flexible substrate and the thin film transistor. According to paragraph 1,
A flexible display device, wherein the encapsulation layer consists of one or more layers. According to paragraph 1,
A flexible display device, wherein the sensor wiring is formed of the same material as a conductive material constituting the thin film transistor. According to paragraph 1,
Further comprising a plurality of pad electrodes disposed in the pad area,
The sensor wire is electrically connected to the plurality of pad electrodes. According to paragraph 1,
A flexible display device further comprising a first inorganic layer disposed between the flexible substrate and the sensor wire. According to clause 11,
The first inorganic layer is formed of the same material as the insulating layer disposed in the display area. According to clause 12,
Further comprising a buffer layer disposed between the flexible substrate and the thin film transistor,
A flexible display device, wherein the first inorganic layer is formed of the same material as the buffer layer. According to paragraph 1,
The bezel area includes a first sensing area adjacent to one side of the display area and a second sensing area adjacent to the other side opposite to the one side of the display area,
The sensor wire includes a first sensor wire disposed in the first sensing area and a second sensor wire disposed in the second sensing area. According to clause 14,
Further comprising a first inorganic layer disposed between the flexible substrate and the sensor wire,
The sensor wiring includes a wiring portion and a bent portion,
In the second sensing area, a bent portion of the second sensor wire is disposed on the first inorganic layer,
In the first sensing area, a bent portion of the first sensor wire is disposed on the flexible substrate, and the first inorganic layer is disposed to cover the bent portion of the first sensor wire. According to paragraph 1,
A flexible display device further comprising a detection unit that detects electrical changes occurring in the sensor wiring. According to clause 16,
The flexible display device wherein the detection unit measures a current value applied to the sensor wire and calculates a resistance value of the sensor wire. According to paragraph 1,
The sensor wiring is,
a first section arranged along the outer edge of the display area;
a second section spaced apart from the first section and arranged to be parallel to the first section; and
A flexible display device including a third section connecting the first section and the second section.